JPH08222860A - Electric apparatus - Google Patents
Electric apparatusInfo
- Publication number
- JPH08222860A JPH08222860A JP2515695A JP2515695A JPH08222860A JP H08222860 A JPH08222860 A JP H08222860A JP 2515695 A JP2515695 A JP 2515695A JP 2515695 A JP2515695 A JP 2515695A JP H08222860 A JPH08222860 A JP H08222860A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- heat dissipation
- attached
- lid
- electric device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電子部品を実装した
回路基板をケースに収納した電気装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric device in which a circuit board on which electronic parts are mounted is housed in a case.
【０００２】[0002]
【従来の技術】第１の従来例を図１５および図１６に示
す。すなわち、この電気装置は、開口５０を有するケー
ス本体５１に回路基板５２を収納し、放熱を要するスイ
ッチング素子類等の電子部品５３をケース本体５１と固
定し、蓋体５４で覆う構造である。2. Description of the Related Art A first conventional example is shown in FIGS. That is, this electric device has a structure in which the circuit board 52 is housed in the case main body 51 having the opening 50, the electronic components 53 such as switching elements that require heat radiation are fixed to the case main body 51, and are covered with the lid 54.
【０００３】第２の従来例を図１７および図１８に示
す。すなわち、この電気装置は、回路基板５２を取付け
るケース本体５１を枠状に形成し、ケース本体５１の両
面開口を蓋体５４，５４′で被覆する構成である。A second conventional example is shown in FIGS. 17 and 18. That is, in this electric device, the case main body 51 to which the circuit board 52 is attached is formed in a frame shape, and both side openings of the case main body 51 are covered with the lids 54 and 54 '.
【０００４】[0004]
【発明が解決しようとする課題】しかし、第１の従来例
は、回路基板５２の配線パターン面がケース本体５１の
底面に覆われているため半田付部のストレス除去が困難
であり、放熱を要する電子部品５３をケース本体５１に
取付ける際の半田付部のストレスを除去できないという
欠点がある。However, in the first conventional example, since the wiring pattern surface of the circuit board 52 is covered by the bottom surface of the case main body 51, it is difficult to remove stress in the soldered portion, and heat dissipation is eliminated. There is a drawback in that the stress of the soldered portion when mounting the required electronic component 53 on the case body 51 cannot be removed.
【０００５】第２の従来例は、ケース本体５１が枠状で
あるため、配線パターン面が露出しているため追いはん
だできるので、第１の従来例の問題は解消されるが、構
成する部品点数が増加し、ケースの小形化に適さないと
いう新たな問題がある。したがって、この発明の目的
は、回路基板の半田付部のストレスを除去することがで
きるとともに部品点数の増加や大型化を避けることがで
きる電気装置を提供することである。In the second conventional example, since the case main body 51 has a frame shape and the wiring pattern surface is exposed, additional soldering can be performed, so that the problem of the first conventional example is solved, but the constituent parts There is a new problem that the number of points increases and it is not suitable for downsizing the case. Therefore, an object of the present invention is to provide an electric device capable of removing stress in a soldered portion of a circuit board and avoiding an increase in the number of parts and an increase in size.
【０００６】[0006]
【課題を解決するための手段】請求項１の電気装置は、
一面に開口を有する略箱状のケース本体と、このケース
本体に取付けられて前記開口を閉塞する略板状の蓋体
と、この蓋体の裏面に取付けられて部品実装面を前記裏
面に向けた回路基板とを備えたものである。請求項２の
電気装置は、請求項１において、前記蓋体の前記裏面に
放熱部材を設け、前記回路基板の放熱を要する電子部品
を前記放熱部材に取付けたものである。An electric device according to claim 1 comprises:
A substantially box-shaped case main body having an opening on one surface, a substantially plate-shaped lid body attached to the case main body to close the opening, and a component mounting surface directed to the rear surface attached to the rear surface of the lid body And a circuit board. An electric device according to a second aspect of the present invention is the electric device according to the first aspect, wherein a heat dissipation member is provided on the back surface of the lid, and an electronic component that requires heat dissipation of the circuit board is attached to the heat dissipation member.
【０００７】請求項３の電気装置は、請求項２におい
て、前記放熱部材が前記蓋体に一体に形成されているも
のである。According to a third aspect of the present invention, in the second aspect, the heat radiating member is integrally formed with the lid.
【０００８】[0008]
【作用】請求項１の電気装置によれば、回路基板を蓋体
に取付けた状態で回路基板の配線パターン面が露出して
いるため、ケース本体に収納する前に半田付部へ加わる
ストレス等を除去する作業を容易に行なうことができ
る。また蓋体の端部をガイドにして回路基板を半田でき
るため、回路基板の反りが少なく半田が安定するととも
に、半田付部へのストレスを回避することができる。し
かも部品点数が増加せず、大型化を避けることができ
る。According to the electric device of the present invention, since the wiring pattern surface of the circuit board is exposed in the state where the circuit board is attached to the lid, the stress applied to the soldered portion before the housing is housed in the case body. Can be easily removed. Further, since the circuit board can be soldered by using the end portion of the lid as a guide, the circuit board is less warped, the solder is stable, and stress on the soldered portion can be avoided. Moreover, the number of parts does not increase, and it is possible to avoid an increase in size.
【０００９】請求項２の電気装置によれば、請求項１に
おいて、前記蓋体の前記裏面に放熱部材を設け、前記回
路基板の放熱を要する電子部品を前記放熱部材に取付け
たため、請求項１の作用のほか、蓋体と回路基板との間
の側方より電子部品の取付け作業が容易に行なえる。請
求項３の電気装置によれば、請求項２において、前記放
熱部材が前記蓋体に一体に形成されているため、請求項
２の作用のほか部品点数を少なくできる。According to the electric device of claim 2, in claim 1, a heat dissipation member is provided on the back surface of the lid, and an electronic component that requires heat dissipation of the circuit board is attached to the heat dissipation member. In addition to the above function, electronic parts can be easily attached from the side between the lid and the circuit board. According to the electric device of the third aspect, in the second aspect, since the heat dissipation member is formed integrally with the lid body, the number of parts can be reduced in addition to the function of the second aspect.
【００１０】[0010]
【実施例】この発明の第１の実施例を図１および図２に
より説明する。すなわち、この電気装置は、ケース本体
１と、蓋体２と、回路基板３とを有する。ケース本体１
は、略箱状であって、一面に開口４を有する。実施例で
は回路基板３を収納することができるように回路基板３
の厚さを考慮した深さにケース本体１の深さを設定して
いる。５は開口４の縁部の四隅に形成されたねじ孔等の
取付孔である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. That is, this electric device includes the case body 1, the lid body 2, and the circuit board 3. Case body 1
Is substantially box-shaped and has an opening 4 on one surface. In the embodiment, the circuit board 3 is provided so that the circuit board 3 can be housed.
The depth of the case body 1 is set in consideration of the thickness of the case body 1. Reference numerals 5 are attachment holes such as screw holes formed at the four corners of the edge of the opening 4.
【００１１】蓋体２は、略板状であって、ケース本体１
に取付けられて開口４を閉塞する。この蓋体２は裏面よ
り複数の回路基板取付部６を一体または取付けにより垂
下している。７は取付孔５に整合する連結孔であり、ケ
ース本体１の開口４を塞いだ状態で連結孔７および取付
孔５を通してねじ等の取付具８により固定する。回路基
板３は、蓋体２の裏面に取付けられて部品実装面３ａを
裏面に向けている。実施例の回路基板３の四隅の取付孔
９にねじ等の取付具１０を通して回路基板取付部６に回
路基板３を取付けている。３ｂは配線パターン面、１１
は電子部品である。The lid body 2 is substantially plate-shaped and has a case body 1
To close the opening 4. The lid 2 has a plurality of circuit board mounting portions 6 hung from the back surface thereof integrally or by mounting. Reference numeral 7 denotes a connecting hole which is aligned with the mounting hole 5, and is fixed by a mounting tool 8 such as a screw through the connecting hole 7 and the mounting hole 5 in a state where the opening 4 of the case body 1 is closed. The circuit board 3 is attached to the back surface of the lid body 2 with the component mounting surface 3a facing the back surface. The circuit board 3 is attached to the circuit board attachment portion 6 through attachment tools 10 such as screws in the attachment holes 9 at the four corners of the circuit board 3 of the embodiment. 3b is a wiring pattern surface, 11
Is an electronic component.
【００１２】この電気装置の組み立て順序は、半田付け
した回路基板３を蓋体２の回路基板取付部６に取付け、
電子部品１１の半田付部のストレス除去の実施のため、
取付け後に問題が起こりそうな箇所のはんだを溶かし
（追いはんだ）、つぎにケース本体１への組み付けを行
なう。この実施例によれば、回路基板３を蓋体２に取付
けた状態で回路基板３の配線パターン面３ｂが露出して
いるため、ケース本体１に収納する前に半田付部へ加わ
るストレス等を除去する作業を容易に行なうことができ
る。しかも部品点数が増加せず、大型化を避けることが
できる。The order of assembling this electric device is as follows: the soldered circuit board 3 is attached to the circuit board attaching portion 6 of the lid 2.
In order to remove the stress on the soldered part of the electronic component 11,
After mounting, the solder is melted at a place where a problem is likely to occur (additional soldering), and then assembled to the case body 1. According to this embodiment, since the wiring pattern surface 3b of the circuit board 3 is exposed in the state where the circuit board 3 is attached to the lid body 2, stress applied to the soldering portion before being housed in the case body 1 is prevented. The removal work can be easily performed. Moreover, the number of parts does not increase, and it is possible to avoid an increase in size.
【００１３】なお、組み立て工程として、半田付けを行
なう前の電子部品１１を仮止めしただけの回路基板３を
蓋体２に取付け、蓋体２の端部をガイドにして半田槽に
漬け、その後にケース本体１への組み立てを行なうよう
にしてもよい。この工程によれば、蓋体２の端部をガイ
ドにして回路基板３を半田槽上に移送し半田付けできる
ため、回路基板３の反りが少なく半田が安定するととも
に、半田付部へのストレスを回避することができる。ま
た基板ダミーをガイドにして半田付けした場合よりも回
路基板３の反りが低減でき、半田付けが安定する。In the assembly process, the circuit board 3 to which the electronic components 11 before soldering are temporarily fixed is attached to the lid body 2, and the end portion of the lid body 2 is used as a guide to be dipped in a solder bath. Alternatively, the case body 1 may be assembled. According to this step, since the circuit board 3 can be transferred onto the solder bath and soldered using the end portion of the lid body 2 as a guide, the warp of the circuit board 3 is small and the solder is stable, and stress on the soldered portion is high. Can be avoided. Further, the warp of the circuit board 3 can be reduced as compared with the case of soldering using the board dummy as a guide, and the soldering becomes stable.
【００１４】この発明の第２の実施例を図３および図４
に示す。すなわち、この電気装置は、第１の実施例にお
いて、蓋体２の裏面に板を実施例とする放熱部材１２を
ねじ等の取付具１３により取付け、この放熱部材１２に
回路基板３の放熱を要するたとえばパワートランジスタ
等の電子部品１４をねじ等の取付具１５により取付けた
ものである。１４ａは電子部品１４の取付孔、１６は蓋
体２の連結孔、１７は放熱部材１２のねじ孔等の取付
孔、１８はねじ孔等の電子部品取付孔である。A second embodiment of the present invention is shown in FIGS. 3 and 4.
Shown in That is, in this electric device, in the first embodiment, the heat dissipation member 12 whose plate is the embodiment is attached to the back surface of the lid body 2 by a mounting tool 13 such as a screw, and the heat dissipation member 12 dissipates heat from the circuit board 3. That is, for example, an electronic component 14 such as a power transistor is attached by a fixture 15 such as a screw. Reference numeral 14a is a mounting hole of the electronic component 14, 16 is a connecting hole of the lid body 2, 17 is a mounting hole such as a screw hole of the heat dissipation member 12, and 18 is an electronic component mounting hole such as a screw hole.
【００１５】この組み立て工程は、放熱部材１２を蓋体
２に取付け、回路基板３を蓋体２に取付け、放熱を要す
る電子部品１４を側方より放熱部材１２に固定する。つ
ぎに半田付部のストレス除去を行い、ケース本体１への
組み立てを行なう。この実施例によれば、蓋体２の裏面
に放熱部材１２を設け、回路基板３の放熱を要する電子
部品１４を放熱部材１２に取付けたため、蓋体２と回路
基板３との間の側方より電子部品１４の取付け作業が容
易に行なえる。その他は、第１の実施例と同様である。In this assembling process, the heat dissipation member 12 is attached to the lid body 2, the circuit board 3 is attached to the lid body 2, and the electronic component 14 that requires heat dissipation is fixed to the heat dissipation member 12 from the side. Next, stress on the soldered portion is removed, and the case main body 1 is assembled. According to this embodiment, since the heat dissipation member 12 is provided on the back surface of the lid body 2 and the electronic component 14 that requires the heat dissipation of the circuit board 3 is attached to the heat dissipation member 12, a lateral side between the lid body 2 and the circuit board 3 is provided. Further, the mounting work of the electronic component 14 can be easily performed. Others are the same as those in the first embodiment.
【００１６】この発明の第３の実施例を図５および図６
に示す。すなわち、この電気装置は、第２の実施例にお
いて、放熱部材１２を断面Ｌ字形に形成し、その上片の
上端面を蓋体２に取付け、下片の下面に放熱を要する電
子部品１４を取付けたものである。この実施例によれ
ば、ケース本体１を薄形化することができる。その他は
第２の実施例と同様である。A third embodiment of the present invention is shown in FIGS.
Shown in That is, in this electric device, in the second embodiment, the heat dissipation member 12 is formed in an L-shaped cross section, the upper end surface of its upper piece is attached to the lid body 2, and the electronic component 14 requiring heat dissipation is attached to the lower surface of the lower piece. It is installed. According to this embodiment, the case body 1 can be made thin. Others are the same as those in the second embodiment.
【００１７】この発明の第４の実施例を図７および図８
に示す。すなわち、この電気装置は、第３の実施例にお
いて、取付具１５に代えて、略Ω形の挾みばね１９を用
い、電子部品１４と放熱部材１２とを挟持したものであ
る。この実施例によれば、電子部品１４と放熱部材１２
との連結がワンタッチで簡単に行なえる。その他は第３
の実施例と同様である。A fourth embodiment of the present invention is shown in FIGS. 7 and 8.
Shown in That is, in this electric device, in the third embodiment, a clamp spring 19 having a substantially Ω shape is used in place of the fixture 15, and the electronic component 14 and the heat dissipation member 12 are sandwiched. According to this embodiment, the electronic component 14 and the heat dissipation member 12 are
Can be easily connected with one-touch. Others are third
This is the same as the embodiment.
【００１８】この発明の第５の実施例を図９および図１
０に示す。すなわち、この電気装置は、第２の実施例に
おいて、放熱部材１２を３枚の放熱板により構成し、各
上端部を蓋体２の裏面に取付具１３により取付けるとと
もに、略Ω形の挾みばね１９により、電子部品１４と放
熱部材１２とを挟持したものである。この実施例によれ
ば、第４の実施例と同様に電子部品１４と放熱部材１２
との連結がワンタッチで簡単に行なえる。その他は第２
の実施例と同様である。A fifth embodiment of the present invention is shown in FIGS. 9 and 1.
0 is shown. That is, in this electric device, in the second embodiment, the heat dissipation member 12 is composed of three heat dissipation plates, each upper end portion is attached to the back surface of the lid body 2 by the fixture 13, and a substantially Ω-shaped grip is provided. The electronic component 14 and the heat dissipation member 12 are sandwiched by the spring 19. According to this embodiment, similar to the fourth embodiment, the electronic component 14 and the heat dissipation member 12 are
Can be easily connected with one-touch. Others are second
This is the same as the embodiment.
【００１９】この発明の第６の実施例を図１１および図
１２に示す。すなわち、この電気装置は、第２の実施例
において、放熱部材１２をＬ字形板により形成し、その
側縁を蓋体２の裏面に取付けた状態に放熱部材１２を蓋
体２に一体に形成し、この放熱板１２に電子部品１４を
取付けたものである。実施例では回路基板３のボリュー
ム抵抗２１のつまみ２２を外側方に向けている。回路基
板３の側方が開放しているため、調整作業が容易にな
る。A sixth embodiment of the present invention is shown in FIGS. That is, in this electric device, in the second embodiment, the heat dissipation member 12 is formed by an L-shaped plate, and the heat dissipation member 12 is integrally formed on the lid body 2 with its side edge attached to the back surface of the lid body 2. The electronic component 14 is attached to the heat dissipation plate 12. In the embodiment, the knob 22 of the volume resistor 21 on the circuit board 3 is directed outward. Since the side of the circuit board 3 is open, adjustment work becomes easy.
【００２０】この実施例によれば、部品点数が少なくな
り組み立て容易になるとともに、蓋体２の強度が放熱部
材１２により増大し蓋体２の剛性が高まるので、防水形
ケースの場合ケースの内圧変化に対して強固になるの
で、防水形に適する。その他は第２の実施例と同様であ
る。この発明の第７の実施例を図１３および図１４に示
す。すなわち、この電気装置は、第６の実施例におい
て、放熱部材１２を断面略三角柱体により形成し、その
一側面を蓋体２の裏面に取付けた状態に放熱部材１２を
蓋体２の裏面に一体に形成し、放熱部材１２の斜面２５
に電子部品１４を取付けたものである。According to this embodiment, the number of parts is reduced, the assembly is facilitated, and the strength of the lid 2 is increased by the heat radiating member 12 to increase the rigidity of the lid 2. Therefore, in the case of the waterproof case, the internal pressure of the case is increased. Suitable for waterproof type as it is strong against changes. Others are the same as those in the second embodiment. A seventh embodiment of the present invention is shown in FIGS. 13 and 14. That is, in this electric device, in the sixth embodiment, the heat dissipation member 12 is formed on the rear surface of the lid body 2 in a state where the heat dissipation member 12 is formed by a substantially triangular prism-shaped cross section and one side surface thereof is attached to the back surface of the lid body 2. The slope 25 of the heat dissipation member 12 formed integrally
The electronic component 14 is attached to the.
【００２１】この実施例によれば、ケース本体１の薄型
化が実現できる。その他は第６の実施例と同様である。According to this embodiment, the case body 1 can be made thin. Others are the same as those in the sixth embodiment.
【００２２】[0022]
【発明の効果】請求項１の電気装置によれば、回路基板
を蓋体に取付けた状態で回路基板の配線パターン面が露
出しているため、ケース本体に収納する前に半田付部へ
加わるストレス等を除去する作業を容易に行なうことが
できる。また蓋体の端部をガイドにして回路基板を半田
できるため、回路基板の反りが少なく半田が安定すると
ともに、半田付部へのストレスを回避することができ
る。しかも部品点数が増加せず、大型化を避けることが
できるという効果がある。According to the electric device of the present invention, since the wiring pattern surface of the circuit board is exposed in the state where the circuit board is attached to the lid, it is added to the soldering portion before being housed in the case body. The work of removing stress and the like can be easily performed. Further, since the circuit board can be soldered by using the end portion of the lid as a guide, the circuit board is less warped, the solder is stable, and stress on the soldered portion can be avoided. Moreover, there is an effect that the number of parts does not increase and the increase in size can be avoided.
【００２３】請求項２の電気装置によれば、請求項１に
おいて、前記蓋体の前記裏面に放熱部材を設け、前記回
路基板の放熱を要する電子部品を前記放熱部材に取付け
たため、請求項１の効果のほか、蓋体と回路基板との間
の側方より電子部品の取付け作業が容易に行なえる。請
求項３の電気装置によれば、請求項２において、前記放
熱部材が前記蓋体に一体に形成されているため、請求項
２の効果のほか部品点数を少なくできる。According to a second aspect of the present invention, in the first aspect, the heat dissipation member is provided on the back surface of the lid body, and the electronic component that requires heat dissipation of the circuit board is attached to the heat dissipation member. In addition to the above effect, electronic parts can be easily attached from the side between the lid and the circuit board. According to the electric device of the third aspect, in the second aspect, since the heat dissipation member is formed integrally with the lid, the effect of the second aspect and the number of parts can be reduced.
【図１】この発明の第１の実施例の分解斜視図である。FIG. 1 is an exploded perspective view of a first embodiment of the present invention.
【図２】その組み立て状態の断面図である。FIG. 2 is a sectional view of the assembled state.
【図３】第２の実施例の分解斜視図である。FIG. 3 is an exploded perspective view of a second embodiment.
【図４】その組み立て状態の断面図である。FIG. 4 is a sectional view of the assembled state.
【図５】第３の実施例の分解斜視図である。FIG. 5 is an exploded perspective view of a third embodiment.
【図６】その組み立て状態の断面図である。FIG. 6 is a sectional view of the assembled state.
【図７】第４の実施例の分解斜視図である。FIG. 7 is an exploded perspective view of a fourth embodiment.
【図８】その組み立て状態の断面図である。FIG. 8 is a sectional view of the assembled state.
【図９】第５の実施例の分解斜視図である。FIG. 9 is an exploded perspective view of a fifth embodiment.
【図１０】その組み立て状態の断面図である。FIG. 10 is a sectional view of the assembled state.
【図１１】第６の実施例の分解斜視図である。FIG. 11 is an exploded perspective view of a sixth embodiment.
【図１２】その組み立て状態の断面図である。FIG. 12 is a sectional view of the assembled state.
【図１３】第７の実施例の分解斜視図である。FIG. 13 is an exploded perspective view of a seventh embodiment.
【図１４】その組み立て状態の断面図である。FIG. 14 is a sectional view of the assembled state.
【図１５】第１の従来例の分解斜視図である。FIG. 15 is an exploded perspective view of a first conventional example.
【図１６】その部分断面図である。FIG. 16 is a partial cross-sectional view thereof.
【図１７】第２の従来例の分解斜視図である。FIG. 17 is an exploded perspective view of a second conventional example.
【図１８】その部分断面図である。FIG. 18 is a partial cross-sectional view thereof.
１ ケース本体 ２ 蓋体 ３ 回路基板 ３ａ 部品実装面 ４ 開口 1 case body 2 lid 3 circuit board 3a component mounting surface 4 opening
Claims (3)
と、このケース本体に取付けられて前記開口を閉塞する
略板状の蓋体と、この蓋体の裏面に取付けられて部品実
装面を前記裏面に向けた回路基板とを備えた電気装置。1. A substantially box-shaped case body having an opening on one surface, a substantially plate-like lid body attached to the case body to close the opening, and a component mounting surface attached to the back surface of the lid body. And an electric device having a circuit board facing the back surface.
前記回路基板の放熱を要する電子部品を前記放熱部材に
取付けた請求項１記載の電気装置。2. The heat dissipating member is provided on the back surface of the lid,
The electric device according to claim 1, wherein an electronic component that requires heat dissipation of the circuit board is attached to the heat dissipation member.
れている請求項２記載の電気装置。3. The electric device according to claim 2, wherein the heat dissipation member is formed integrally with the lid body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2515695A JPH08222860A (en) | 1995-02-14 | 1995-02-14 | Electric apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2515695A JPH08222860A (en) | 1995-02-14 | 1995-02-14 | Electric apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08222860A true JPH08222860A (en) | 1996-08-30 |
Family
ID=12158167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2515695A Pending JPH08222860A (en) | 1995-02-14 | 1995-02-14 | Electric apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08222860A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009113526A (en) * | 2007-11-01 | 2009-05-28 | Nsk Ltd | Control unit |
| JP2009232540A (en) * | 2008-03-21 | 2009-10-08 | Taiyo Ltd | Electric rotary actuator |
-
1995
- 1995-02-14 JP JP2515695A patent/JPH08222860A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009113526A (en) * | 2007-11-01 | 2009-05-28 | Nsk Ltd | Control unit |
| JP2009232540A (en) * | 2008-03-21 | 2009-10-08 | Taiyo Ltd | Electric rotary actuator |
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