JPH0818327A - Production of small-sized antenna - Google Patents
Production of small-sized antennaInfo
- Publication number
- JPH0818327A JPH0818327A JP14672494A JP14672494A JPH0818327A JP H0818327 A JPH0818327 A JP H0818327A JP 14672494 A JP14672494 A JP 14672494A JP 14672494 A JP14672494 A JP 14672494A JP H0818327 A JPH0818327 A JP H0818327A
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- Prior art keywords
- dielectric ceramic
- ceramic substrate
- conductor
- small
- antennas
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は携帯電話機、ＧＰＳ（衛
星測位システム）装置等の移動体通信に使用して好適な
小型アンテナの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a small antenna suitable for mobile communication such as a mobile phone and a GPS (Satellite Positioning System) device.
【０００２】[0002]
【従来の技術】近年、携帯電話機、ＧＰＳ装置等の移動
体通信機器の小型化に伴いアンテナの小型化を図るため
高い誘導率（εr ≧１０）の誘電体セラミック基板を使
用した図２に示す如き小型アンテナが提案されている。2. Description of the Related Art In recent years, along with downsizing of mobile communication devices such as mobile phones and GPS devices, a dielectric ceramic substrate having a high dielectric constant (ε r ≧ 10) is used in FIG. 2 in order to downsize the antenna. A small antenna as shown has been proposed.
【０００３】この図２につき説明するに、図２におい
て、１は（Ｍｇ1-x Ｃａx ）ＴｉＯ3（Ｘ＝０．０５）
組成の粉末をプレス成形し、１３５０℃で焼成した比誘
電率が２０の誘電体セラミック基板を示し、この誘電体
セラミック基板１の形状は縦ａ×横ｂ×厚さｔが例えば
１３ｍｍ×１３ｍｍ×６ｍｍである。Referring to FIG. 2, in FIG. 2, 1 is (Mg 1-x Ca x ) TiO 3 (X = 0.05)
A dielectric ceramic substrate having a relative dielectric constant of 20 is obtained by press-molding powder having the composition and firing at 1350 ° C. The dielectric ceramic substrate 1 has a shape of vertical a × horizontal b × thickness 13 mm × 13 mm ×, for example. It is 6 mm.
【０００４】この誘電体セラミック基板１の上面及び下
面に例えばＣｕの如き上面導体２ａ及び下面導体２ｂを
形成すると共にこの上面導体２ａ及び下面導体２ｂを短
絡する側面導体３を形成したものである。On the upper surface and the lower surface of the dielectric ceramic substrate 1, an upper surface conductor 2a and a lower surface conductor 2b such as Cu are formed and side surface conductors 3 which short-circuit the upper surface conductor 2a and the lower surface conductor 2b are formed.
【０００５】この小型アンテナを使用するときには図２
に示す如く、この小型アンテナの下面導体２ｂを例えば
携帯電話機の金属シャーシ４上に載置する如くして、受
信専用アンテナとして使用する。この場合、この小型ア
ンテナはマイクロストリップ形の逆Ｆアンテナを構成す
る。When using this small antenna, FIG.
As shown in, the lower surface conductor 2b of the small antenna is placed on the metal chassis 4 of the mobile phone, for example, and is used as a reception-only antenna. In this case, this small antenna constitutes a microstrip inverted F antenna.
【０００６】斯る小型アンテナにおいては、図２に示す
如く、縦の長さをａ、横の長さをｂ、この誘電体セラミ
ック基板１の比誘電率をεr 、受信電波の波長をλとし
たとき の関係が成立し、例えば８００ＭＨｚの電波を１３ｍｍ
×１３ｍｍ×６ｍｍの大きさの小型アンテナで受信する
ことができる。In such a small antenna, as shown in FIG. 2, the vertical length is a, the horizontal length is b, the relative permittivity of this dielectric ceramic substrate 1 is ε r , and the wavelength of the received radio wave is λ. When The relationship is established, for example, a radio wave of 800 MHz is 13 mm
It can be received by a small antenna with a size of × 13 mm × 6 mm.
【０００７】[0007]
【発明が解決しようとする課題】従来、斯る図２に示す
如き小型アンテナを製造するときは誘電体セラミック基
板１を所定形状例えば１３ｍｍ×１３ｍｍ×６ｍｍに成
形・加工した後に、上面導体２ａ、下面導体２ｂ及び側
面導体３を形成するようにしていたが、この従来の製造
方法では、１個ずつ、この上面導体２ａ、下面導体２ｂ
及び側面導体３を形成するので、手間がかかり、量産に
適さない不都合があった。Conventionally, when manufacturing such a small antenna as shown in FIG. 2, the dielectric ceramic substrate 1 is molded and processed into a predetermined shape, for example, 13 mm × 13 mm × 6 mm, and then the upper surface conductor 2a, Although the lower surface conductor 2b and the side surface conductor 3 are formed, in the conventional manufacturing method, the upper surface conductor 2a and the lower surface conductor 2b are formed one by one.
Since the side conductor 3 is formed, it is troublesome and not suitable for mass production.
【０００８】本発明は斯る点に鑑み量産に適した製造方
法を提案せんとするものである。In view of the above point, the present invention proposes a manufacturing method suitable for mass production.
【０００９】[0009]
【課題を解決するための手段】本発明小型アンテナの製
造方法は例えば図１に示す如く、複数個の小型アンテナ
が得られる形状の誘電体セラミック基板１１の表面全体
にメッキにより導体１２を形成し、その後エッチングに
より複数の側面導体３をパターニングし、その後この誘
電体セラミック基板１１を切断して、複数個の小型アン
テナを得るようにしたものである。According to a method of manufacturing a small antenna of the present invention, as shown in FIG. 1, for example, a conductor 12 is formed by plating on the entire surface of a dielectric ceramic substrate 11 having a shape such that a plurality of small antennas can be obtained. After that, a plurality of side surface conductors 3 are patterned by etching, and then the dielectric ceramic substrate 11 is cut to obtain a plurality of small antennas.
【００１０】また本発明小型アンテナの製造方法は例え
ば図３に示す如く、複数個の小型アンテナが得られる形
状の誘電体セラミック基板１１の上面及び下面と複数の
側面導体部とにスクリーン印刷により導体ペースト１４
を被着し、その後焼付けし、その後この誘電体セラミッ
ク基板１１を切断して複数個の小型アンテナを得るよう
にしたものである。Further, as shown in FIG. 3, for example, the method of manufacturing a small antenna of the present invention is such that conductors are formed by screen printing on the upper and lower surfaces of the dielectric ceramic substrate 11 and the plurality of side surface conductors in a shape capable of obtaining a plurality of small antennas. Paste 14
And then baked, and then the dielectric ceramic substrate 11 is cut to obtain a plurality of small antennas.
【００１１】[0011]
【作用】本発明によれば複数個の小型アンテナの得られ
る誘電体セラミック基板１１に上面導体１２及び下面導
体１２と複数の側面導体３を形成した後に切断して複数
個の小型アンテナを得ているので生産性良く小型アンテ
ナを製造できる。According to the present invention, the upper surface conductor 12, the lower surface conductor 12 and the plurality of side surface conductors 3 are formed on the dielectric ceramic substrate 11 from which a plurality of small antennas can be obtained and then cut to obtain a plurality of small antennas. Therefore, a small antenna can be manufactured with high productivity.
【００１２】[0012]
【実施例】以下、図１を参照して本発明小型アンテナの
製造方法の一実施例につき説明しよう。先ず、図１Ａに
示す如く、４個の小型アンテナが得られる形状の誘電体
セラミック基板１１を用意する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for manufacturing a small antenna of the present invention will be described below with reference to FIG. First, as shown in FIG. 1A, a dielectric ceramic substrate 11 having a shape capable of obtaining four small antennas is prepared.
【００１３】この誘電体セラミック基板１１は、誘電体
セラミック材料として例えば（Ｍｇ 1-x Ｃａx ）ＴｉＯ
3 （Ｘ＝０．０５）の組成のものを使用する。これは原
料としてＭｇＯ（酸化マグネシウム）、ＣａＣＯ3 （炭
酸カルシウム）、ＴｉＯ2 （酸化チタン）の粉末を秤量
し、ボールミルで１５時間混合した後、大気中、１００
０℃で仮焼を行い、再度ボールミルで１５時間粉砕し
て、バインダーとして、ＰＶＡ（ポリビニルアルコー
ル）を１重量％加えて造粒し、成形して大気中１３５０
℃で焼成することにより誘電体セラミック基板を作製す
る。この例の誘電体セラミック基板の比誘電率は２０で
ある。This dielectric ceramic substrate 11 is a dielectric
As a ceramic material, for example (Mg 1-xCax) TiO
3The composition of (X = 0.05) is used. This is Hara
MgO (magnesium oxide), CaCO3(Charcoal
Calcium acid), TiO2Weigh powder (titanium oxide)
Then, after mixing with a ball mill for 15 hours, 100 in the air
It is calcined at 0 ° C and crushed again in a ball mill for 15 hours.
As a binder, PVA (polyvinyl alcohol)
1) in an amount of 1350% by weight, and then granulated and molded in air 1350
A dielectric ceramic substrate is prepared by firing at
It The dielectric constant of the dielectric ceramic substrate of this example is 20.
is there.
【００１４】次にこの誘電体セラミック基板を所定の寸
法に例えば小型アンテナが１３ｍｍ×１３ｍｍ×６ｍｍ
のときは例えは４個の大きさの１３ｍｍ×５６ｍｍ×６
ｍｍに研削、加工して図１Ａの誘電体セラミック基板１
１とする。この誘電体セラミック基板１１の形状の寸法
は使用する電波の波長λ、使用する誘電体セラミック基
板の誘電率εr により決定される。Next, this dielectric ceramic substrate is made to have a predetermined size, for example, a small antenna having a size of 13 mm × 13 mm × 6 mm.
In case of, for example, 4 pieces of 13 mm × 56 mm × 6
1 mm by grinding and processing the dielectric ceramic substrate 1 of FIG. 1A.
Set to 1. The size of the shape of the dielectric ceramic substrate 11 is determined by the wavelength λ of the radio wave used and the dielectric constant ε r of the dielectric ceramic substrate used.
【００１５】次にメッキ工程により図１Ｂに示す如くこ
の誘電体セラミック基板１１の表面全体に導体１２を形
成する。この導体１２としてはＣＵ，Ａｇ，Ｎｉ，Ａｕ
等を用いることができる。この場合メッキ膜即ち導体の
厚さは高周波例えば８００ＭＨｚの表皮効果を考慮し
て、２０μｍ程度とする。Next, a conductor 12 is formed on the entire surface of the dielectric ceramic substrate 11 by a plating process as shown in FIG. 1B. As the conductor 12, CU, Ag, Ni, Au
Etc. can be used. In this case, the thickness of the plated film, that is, the conductor is set to about 20 μm in consideration of the skin effect of high frequency, for example, 800 MHz.
【００１６】次にメッキ工程である無電解銅メッキ工程
の例につき説明する。先ず、この誘電体セラミック基板
１１をエースクリーン Ａ−２２０（奥野製薬工業製）
を使用してアルカリ脱脂を行い、その後水洗いをする。Next, an example of an electroless copper plating process which is a plating process will be described. First, this dielectric ceramic substrate 11 was attached to Ascreen A-220 (manufactured by Okuno Chemical Industry Co., Ltd.).
Alkaline degreasing is performed using and then washed with water.
【００１７】次に、密着性を増す目的でこの誘電体セラ
ミック基板１１の表面をでこぼこにするためフッ酸４０
％、硝酸６０％の混合溶液を使用してエッチングし、そ
の後水洗いをする。Next, hydrofluoric acid 40 is used to make the surface of the dielectric ceramic substrate 11 uneven in order to increase the adhesion.
%, 60% nitric acid mixed solution is used for etching, followed by washing with water.
【００１８】次に塩酸３５％の溶液を使用してプリディ
ップし、その後ＯＰＣ８０キャタリスト（奥野製薬工業
製）と塩酸３５％の溶液の混合液を使用し、パラジウム
を表面に付着するキャタライジングを行う。このキャタ
ライジング後、水洗いを行う。Next, a pre-dip was carried out using a solution of hydrochloric acid 35%, and then a mixture of OPC80 Catalyst (manufactured by Okuno Seiyaku Kogyo) and a solution of hydrochloric acid 35% was used to carry out catalyzing to attach palladium to the surface. To do. After this catalyzing, it is washed with water.
【００１９】次に硫酸９７％の溶液にアクセレートＸ
（奥野製薬工業製）を混合した液を使用して触媒を活性
化するためにアクセレーティングを行う。このアクセレ
ーティング後に水洗いを行う。Next, an accelerator X was added to a solution of sulfuric acid 97%.
Acceleration is performed in order to activate the catalyst using a liquid in which (Okuno Pharmaceutical Co., Ltd.) is mixed. After this accelerating, it is washed with water.
【００２０】次に銅の無電解メッキ液として、ＯＰＣカ
ッパーＴ（奥野製薬工業製）を使用して銅の無電解メッ
キを行う。この銅１２を所定厚例えば２０μｍ厚メッキ
した後に水洗いを行う。Next, as an electroless plating solution for copper, OPC copper T (manufactured by Okuno Chemical Industries Co., Ltd.) is used to perform electroless plating of copper. The copper 12 is plated with a predetermined thickness, for example, 20 μm, and then washed with water.
【００２１】次にグリコートを使用して防錆処理を行
い、その後Ｎ2 雰囲気中、３００℃×１時間の条件で熱
処理を行い誘電体セラミック基板１１と導体１２である
銅メッキ膜との密着性を増す如くする。Next, anticorrosion treatment is performed using a glycoat, and then heat treatment is performed in an N 2 atmosphere at 300 ° C. for 1 hour to adhere the dielectric ceramic substrate 11 and the copper plating film, which is the conductor 12, to each other. To increase.
【００２２】次に、図１Ｃに示す如くこの誘電体セラミ
ック基板１１の上面導体１２上及び下面導体１２上と４
つの側面導体３に対応する部分にスクリーン印刷技術を
使用してレジスト１３を塗布し、その後このレジスト１
３を乾燥する。Next, as shown in FIG. 1C, on the upper surface conductor 12 and the lower surface conductor 12 of the dielectric ceramic substrate 11,
A resist 13 is applied to a portion corresponding to the one side conductor 3 using a screen printing technique, and then the resist 1 is applied.
Dry 3.
【００２３】この図１Ｃに示す如く、レジスト１３を塗
布した誘電体セラミック基板１１をエッチング液として
の塩化第２鉄溶液に浸し、このレジスト１３の塗布され
ていない不用部分の導体１２である銅メッキ膜をエッチ
ングにより除去する（図１Ｄ）。このエッチング後に、
十分に水洗いして、このエッチング液を落とす如くす
る。As shown in FIG. 1C, the dielectric ceramic substrate 11 coated with the resist 13 is dipped in a ferric chloride solution as an etching solution, and the conductor 12 of the unused portion of the resist 13 which is not coated is copper-plated. The film is removed by etching (FIG. 1D). After this etching,
Thoroughly wash with water so that the etching solution is dropped.
【００２４】その後、図１Ｄに示す如く、この誘電体セ
ラミック基板１１上の導体１２上に塗布したレジスト１
３をＮａＯＨ１％の水溶液により除去し、図１Ｅに示す
如く、誘電体セラミック基板１１の上面及び下面に導体
１２が形成されると共に４つの短絡導体である側面導体
３が形成されたものとなる。Thereafter, as shown in FIG. 1D, the resist 1 applied on the conductor 12 on the dielectric ceramic substrate 11
As shown in FIG. 1E, the conductors 12 are formed on the upper and lower surfaces of the dielectric ceramic substrate 11 and the side conductors 3 which are four short-circuit conductors are formed.
【００２５】次に斯る図１Ｅに示す如き誘電体セラミッ
ク基板１１をダイヤモンド砥石等により、図１Ｆに示す
如く１３ｍｍ間隔に切断して、４個の小型アンテナを得
る。Next, the dielectric ceramic substrate 11 as shown in FIG. 1E is cut with a diamond grindstone or the like at intervals of 13 mm as shown in FIG. 1F to obtain four small antennas.
【００２６】本例による小型アンテナの製造方法によれ
ば４個の小型アンテナの得られる誘電体セラミック基板
１１にメッキ及びエッチングにより上面導体１２及び下
面導体１２と４個の側面導体３を形成した後に、切断し
て４個の小型アンテナを得ているので、生産性良く小型
アンテナを製造することができる利益がある。According to the method of manufacturing a small antenna according to this example, after the upper surface conductor 12 and the lower surface conductor 12 and the four side surface conductors 3 are formed on the dielectric ceramic substrate 11 from which four small antennas are obtained by plating and etching. Since the four small antennas are obtained by cutting, there is an advantage that the small antennas can be manufactured with high productivity.
【００２７】図３は本発明小型アンテナの製造方法の他
の実施例を示す工程図である。この図３を参照して本発
明小型アンテナの製造方法の他の実施例につき説明す
る。先ず、図３Ａに示す如く、図１Ａと同様にして４個
の小型アンテナが得られる形状例えば１３ｍｍ×５６ｍ
ｍ×６ｍｍの誘電体セラミック基板１１を用意する。FIG. 3 is a process drawing showing another embodiment of the method for manufacturing a small antenna of the present invention. Another embodiment of the method for manufacturing a small antenna of the present invention will be described with reference to FIG. First, as shown in FIG. 3A, a shape in which four small antennas are obtained in the same manner as in FIG. 1A, for example, 13 mm × 56 m
An m × 6 mm dielectric ceramic substrate 11 is prepared.
【００２８】次に図３Ｂに示す如く、この誘電体セラミ
ック基板１１の上面及び下面と４個の側面導体部とにス
クリーン印刷により導体ペースト１４を塗布する。この
場合この導体ペースト１４としては例えば昭栄化学工業
製のＨ−９１５４の銀塗料を使用する。Next, as shown in FIG. 3B, a conductor paste 14 is applied by screen printing to the upper and lower surfaces of this dielectric ceramic substrate 11 and the four side conductor portions. In this case, as the conductor paste 14, for example, H-9154 silver paint manufactured by Shoei Chemical Industry is used.
【００２９】この導体ペースト１４を塗布後に２００℃
で１０分間乾燥する。その後大気雰囲気中、８００℃で
１５分間焼成し、この導体ペースト１４を厚さ例えば２
０μｍの銀導体とし、図３Ｂに示す如く、誘電体セラミ
ック基板１１の上面及び下面に銀導体が形成されると共
に４つの短絡導体である側面導体３が形成されたものと
なる。After applying this conductor paste 14, 200 ° C.
To dry for 10 minutes. After that, the conductor paste 14 is fired in an air atmosphere at 800 ° C. for 15 minutes, and the conductor paste 14 is thickened to, for example, 2
As shown in FIG. 3B, a silver conductor having a thickness of 0 μm is formed on the upper surface and the lower surface of the dielectric ceramic substrate 11, and four side surface conductors 3 which are short-circuit conductors are formed.
【００３０】次に斯る図３Ｂに示す如き誘電体セラミッ
ク基板１１をダイヤモンド砥石等により、図３Ｃに示す
如く１３ｍｍ間隔に切断して、４個の小型アンテナを得
る。Next, the dielectric ceramic substrate 11 as shown in FIG. 3B is cut with a diamond grindstone or the like at intervals of 13 mm as shown in FIG. 3C to obtain four small antennas.
【００３１】本例による小型アンテナの製造方法によれ
ば４個の小型アンテナの得られる誘電体セラミック基板
１１に上面導体及び下面導体と４個の側面導体３を形成
した後に、切断して、４個の小型アンテナを得ているの
で、生産性良く小型アンテナを製造することができる。According to the method of manufacturing a small antenna according to this example, the upper surface conductor and the lower surface conductor and the four side surface conductors 3 are formed on the dielectric ceramic substrate 11 from which four small antennas are obtained, and then cut to form 4 Since the individual small antennas are obtained, the small antennas can be manufactured with high productivity.
【００３２】尚上述実施例においては４個の小型アンテ
ナを同時に製造する例につき述べたが、その他の複数個
を同時に製造するようにしても良く、この場合も上述同
様の作用効果が得られることは容易に理解できよう。ま
た本発明は上述実施例に限ることなく本発明の要旨を逸
脱することなく、その他種々の構成が採り得ることは勿
論である。In the above embodiment, an example in which four small antennas are manufactured at the same time has been described, but other plural antennas may be manufactured at the same time, and in this case, the same effect as the above can be obtained. Is easy to understand. Further, the present invention is not limited to the above-described embodiments, and needless to say, various other configurations can be adopted without departing from the gist of the present invention.
【００３３】[0033]
【発明の効果】本発明によれば生産性良く小型アンテナ
を製造することができる利益がある。According to the present invention, there is an advantage that a small antenna can be manufactured with high productivity.
【図１】本発明小型アンテナの製造方法の一実施例を示
す斜視図である。FIG. 1 is a perspective view showing an embodiment of a method for manufacturing a small antenna of the present invention.
【図２】小型アンテナの例を示す斜視図である。FIG. 2 is a perspective view showing an example of a small antenna.
【図３】本発明の他の実施例を示す斜視図である。FIG. 3 is a perspective view showing another embodiment of the present invention.
１，１１ 誘電体セラミック基板 ２ａ，２ｂ，３，１２ 導体 １３ レジスト １４ 導体ペースト 1, 11 Dielectric ceramic substrate 2a, 2b, 3, 12 Conductor 13 Resist 14 Conductor paste
Claims (2)
誘電体セラミック基板の表面全体にメッキにより導体を
形成し、その後エッチングにより複数の側面導体をパタ
ーニングし、その後上記誘電体セラミック基板を切断し
て、複数個の小型アンテナを得るようにしたことを特徴
とする小型アンテナの製造方法。1. A conductor is formed on the entire surface of a dielectric ceramic substrate having a shape capable of obtaining a plurality of small antennas by plating, and then a plurality of side surface conductors are patterned by etching, and then the dielectric ceramic substrate is cut. And a plurality of small antennas are obtained.
誘電体セラミック基板の上面及び下面と複数の側面導体
部とにスクリーン印刷により導体ペーストを被着し、そ
の後焼付けし、その後前記誘電体セラミック基板を切断
して複数個の小型アンテナを得るようにしたことを特徴
とする小型アンテナの製造方法。2. A conductor paste is applied by screen printing to the upper and lower surfaces of a dielectric ceramic substrate and a plurality of side surface conductors in a shape capable of obtaining a plurality of small antennas, and then baked, and then the dielectric ceramic. A method for manufacturing a small antenna, comprising cutting a substrate to obtain a plurality of small antennas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14672494A JPH0818327A (en) | 1994-06-28 | 1994-06-28 | Production of small-sized antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14672494A JPH0818327A (en) | 1994-06-28 | 1994-06-28 | Production of small-sized antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0818327A true JPH0818327A (en) | 1996-01-19 |
Family
ID=15414135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14672494A Pending JPH0818327A (en) | 1994-06-28 | 1994-06-28 | Production of small-sized antenna |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0818327A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6034636A (en) * | 1996-08-21 | 2000-03-07 | Nec Corporation | Planar antenna achieving a wide frequency range and a radio apparatus used therewith |
| KR100387167B1 (en) * | 2001-05-25 | 2003-06-12 | 한국과학기술연구원 | Method for manufacturing 3D horn antenna using exposure of ultra slow rotation and tilt |
| EP1465290A1 (en) * | 2003-03-31 | 2004-10-06 | Filtronic LK Oy | Method for producing antenna components |
| KR100503844B1 (en) * | 2002-01-24 | 2005-07-27 | 히다치 덴센 가부시끼가이샤 | Method of manufacturing flat antenna |
| WO2007096973A1 (en) | 2006-02-23 | 2007-08-30 | Mitsubishi Materials Corporation | Dresser feeding device |
| KR100841236B1 (en) * | 2007-01-30 | 2008-06-25 | (주)삼우이피씨 | Method for manufacturing smd type chip antenna using ltcc material |
| KR100844584B1 (en) * | 2008-01-29 | 2008-07-09 | 양주동 | Production method of intenna |
| KR101032875B1 (en) * | 2008-10-23 | 2011-05-06 | 주식회사 이엠따블유 | Chip antenna and manufacturing method of the same |
-
1994
- 1994-06-28 JP JP14672494A patent/JPH0818327A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6034636A (en) * | 1996-08-21 | 2000-03-07 | Nec Corporation | Planar antenna achieving a wide frequency range and a radio apparatus used therewith |
| KR100387167B1 (en) * | 2001-05-25 | 2003-06-12 | 한국과학기술연구원 | Method for manufacturing 3D horn antenna using exposure of ultra slow rotation and tilt |
| KR100503844B1 (en) * | 2002-01-24 | 2005-07-27 | 히다치 덴센 가부시끼가이샤 | Method of manufacturing flat antenna |
| EP1465290A1 (en) * | 2003-03-31 | 2004-10-06 | Filtronic LK Oy | Method for producing antenna components |
| WO2007096973A1 (en) | 2006-02-23 | 2007-08-30 | Mitsubishi Materials Corporation | Dresser feeding device |
| KR100841236B1 (en) * | 2007-01-30 | 2008-06-25 | (주)삼우이피씨 | Method for manufacturing smd type chip antenna using ltcc material |
| KR100844584B1 (en) * | 2008-01-29 | 2008-07-09 | 양주동 | Production method of intenna |
| KR101032875B1 (en) * | 2008-10-23 | 2011-05-06 | 주식회사 이엠따블유 | Chip antenna and manufacturing method of the same |
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