JPH08181427A - Reflow soldering device - Google Patents
Reflow soldering deviceInfo
- Publication number
- JPH08181427A JPH08181427A JP33572594A JP33572594A JPH08181427A JP H08181427 A JPH08181427 A JP H08181427A JP 33572594 A JP33572594 A JP 33572594A JP 33572594 A JP33572594 A JP 33572594A JP H08181427 A JPH08181427 A JP H08181427A
- Authority
- JP
- Japan
- Prior art keywords
- reflow
- reflow soldering
- printed circuit
- circuit board
- local heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、リフロー半田付け装
置、特に、熱容量の大きい部品を実装した高密度実装基
板の半田付けに好適なリフロー半田付け装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow soldering apparatus, and more particularly to a reflow soldering apparatus suitable for soldering a high-density mounting board on which a component having a large heat capacity is mounted.
【０００２】[0002]
【従来の技術】情報処理能力の高度化、製品の小型化の
要求から、薄いプリント基板に部品を実装しようとする
傾向が強くなっている。これに伴い、プリント基板に大
型表面実装部品が搭載されたり、裏表に重なって部品が
配置されるため、各部品の熱容量差の拡大が著しくな
り、結果的に基板面の熱容量分布がばらついてしまう。2. Description of the Related Art Due to demands for higher information processing capability and smaller products, there is an increasing tendency to mount components on a thin printed circuit board. Along with this, large-scale surface mount components are mounted on the printed circuit board, or the components are arranged so that they overlap with each other on the front and back sides, so the difference in heat capacity between each component becomes significant and, as a result, the heat capacity distribution on the board surface varies. .
【０００３】このような基板を最も一般的な熱風式のリ
フロー半田付け装置で半田付けすると、部品面温度分布
が不均一となり、大型部品の温度は温度下限以下、薄い
基板部分は上限以上になってしまい、時間的な温度勾配
もまちまちで、加熱条件を設定しにくくなっている。こ
のため、急速に温度上昇し易い金属表面部品、例えばア
ルミ電解コンデンサなどは、半田リフロー中に劣化し易
いなどの問題が発生する。When such a board is soldered by the most common hot air type reflow soldering apparatus, the temperature distribution of the component surface becomes non-uniform, the temperature of the large component becomes lower than the lower limit of the temperature, and the temperature of the thin substrate becomes higher than the upper limit. The temperature gradient varies with time, making it difficult to set heating conditions. Therefore, a metal surface component whose temperature is likely to rise rapidly, such as an aluminum electrolytic capacitor, is likely to deteriorate during solder reflow.
【０００４】そこで、赤外線加熱を併用し、アルミ電解
コンデンサ以外への加熱速度を上げ、熱風加熱を減らし
て、アルミ電解コンデンサへの加熱を抑える試みもある
が、その条件設定が困難で得策とはいえない。Therefore, there is an attempt to suppress the heating to the aluminum electrolytic capacitor by using infrared heating together with increasing the heating rate to the parts other than the aluminum electrolytic capacitor to reduce the hot air heating, but it is difficult to set the condition and it is a good idea. I can't say.
【０００５】これに対し、熱伝達速度を大きくして、部
品の熱容量に関係なく設定された雰囲気温度に短時間に
順応させ、目的の温度カーブが得られるようにする原理
のＶＳＰ（Vapor Phase Soidering 蒸気相加熱）も試み
られている。このＶＳＰは気化した不活性気体の凝縮潜
熱を利用しているため、加熱速度が非常に速くて大きな
加熱力で熱容量の大きな基板を均一な到達温度でリフロ
ー半田付けを行うことができる装置である。しかし、Ｖ
ＳＰもコスト的に不利であり、熱容量の大きな部分を所
定温度にまで加熱するために、他の部分は必要以上の時
間高温にさらされ、部品を劣化させる問題がある。On the other hand, the VSP (Vapor Phase Soidering) of the principle of increasing the heat transfer rate to adapt to the set ambient temperature for a short time regardless of the heat capacity of the parts and obtain the desired temperature curve Steam phase heating) has also been tried. Since this VSP utilizes the latent heat of condensation of vaporized inert gas, it is a device that can perform reflow soldering on a substrate having a very high heating rate and a large heating capacity and a uniform ultimate temperature with a large heating power. . But V
The SP is also disadvantageous in terms of cost, and in order to heat a part having a large heat capacity to a predetermined temperature, the other part is exposed to a high temperature for a longer time than necessary, which causes a problem of deteriorating parts.
【０００６】[0006]
【発明が解決しようとする課題】本発明は前記問題点に
鑑み、熱容量の大きな部品を搭載したプリント基板をリ
フロー半田付けする際、プリント基板全体を均一に加熱
できるリフロー半田付け装置を提供する点にある。In view of the above problems, the present invention provides a reflow soldering apparatus capable of uniformly heating the entire printed circuit board when reflow soldering a printed circuit board on which a component having a large heat capacity is mounted. It is in.
【０００７】[0007]
【課題を解決するための手段】本発明リフロー半田付け
装置は、予熱部又はリフロー部に補助加熱するための局
部加熱部を備えたことを特徴とする。そして、プリント
基板を搬送するコンベアを設け、該コンベアで搬送され
て来たプリント基板を局部加熱部で一時停止させて、特
にプリント基板の熱容量の大きい部分を局部加熱する。
局部加熱部の局部加熱手段として光熱源を用い、この光
熱源からのビームを照射して局部加熱を行う。The reflow soldering device of the present invention is characterized in that the preheating part or the reflow part is provided with a local heating part for auxiliary heating. Then, a conveyer for conveying the printed circuit board is provided, the printed circuit board conveyed by the conveyer is temporarily stopped by the local heating unit, and the portion having a large heat capacity of the printed circuit board is locally heated.
A photothermal source is used as a local heating unit of the local heating unit, and a beam from the photothermal source is irradiated to perform local heating.
【０００８】[0008]
【実施例】図１は、本発明によるリフロー半田付け装置
の進行方向断面を示している。図１において、１は基板
搬送用コンベア、２は予熱部、３はリフロー部、４は冷
却部、５は部品が搭載されたプリント基板、６は局部加
熱部、６ａは局部加熱部の熱源である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a cross section in the traveling direction of a reflow soldering device according to the present invention. In FIG. 1, reference numeral 1 is a board conveying conveyor, 2 is a preheating unit, 3 is a reflow unit, 4 is a cooling unit, 5 is a printed circuit board on which components are mounted, 6 is a local heating unit, and 6a is a heat source for the local heating unit. is there.
【０００９】前記構成を備えるリフロー半田付け装置に
おいて、コンベア１がプリント基板５を搬送し、予熱部
２において加熱空気、赤外線等にて半田が溶けない１５
０℃程度の温度でプリント基板５を予熱する。その後、
リフロー部３にて２５０℃程度の温度で半田が溶解し
て、プリント基板５に搭載された部品を半田付けして、
冷却部４にて冷却する。これらの機能は従来のリフロー
半田付け装置と変わるところはない。本発明は、前記機
能に加えて、リフロー部３にてリフロー半田付けを行う
前に、プリント基板５の熱容量の大きい部分を局部的に
補助加熱するための局部加熱部６を設けた点に特徴があ
る。In the reflow soldering apparatus having the above structure, the conveyor 1 conveys the printed circuit board 5 and the solder is not melted in the preheating section 2 by heated air, infrared rays or the like 15.
The printed circuit board 5 is preheated at a temperature of about 0 ° C. afterwards,
In the reflow part 3, the solder is melted at a temperature of about 250 ° C., and the components mounted on the printed board 5 are soldered,
Cooling is performed by the cooling unit 4. These functions are no different from the conventional reflow soldering device. The present invention is characterized in that, in addition to the functions described above, a local heating unit 6 is provided for locally auxiliary heating a portion having a large heat capacity of the printed circuit board 5 before performing reflow soldering in the reflow unit 3. There is.
【００１０】前記リフロー半田付け装置において、予熱
部２、リフロー部３の各セクション内での加熱速度は場
所によらず均一であるようにする。また、後述する局部
加熱時の一時停止の瞬間には、コンベア１上のプリント
基板５ｂ、５ｃは、リフローブ３、冷却部４等単独の区
間にあって、例えばリフロー部３にある時、その隣接部
である冷却部４や予熱部２に、コンベア１上のプリント
基板５ｂ、５ｃが跨がらないように、プリント基板セッ
ト間隔ｐを決める。この間隔ｐは、リフロー半田付け装
置固有の値として設定される。In the reflow soldering apparatus, the heating rate in each section of the preheating section 2 and the reflow section 3 is made uniform regardless of location. Further, at the moment of a temporary stop at the time of local heating, which will be described later, the printed circuit boards 5b, 5c on the conveyor 1 are in a single section such as the reflow unit 3 and the cooling unit 4. The printed circuit board set interval p is determined so that the printed circuit boards 5b and 5c on the conveyor 1 do not straddle the cooling unit 4 and the preheating unit 2. This interval p is set as a value unique to the reflow soldering device.
【００１１】前記局部加熱部６にてプリント基板５ａ上
の必要部分のみを局部的に限定して加熱する。例えば、
高密度実装基板において大型の部品が搭載されて熱容量
が極めて大きく半田を溶かしにくい部分等の局部加熱対
象部分の加熱に用いられる。この局部加熱部６は、後述
するように近赤外線熱源６ａを備え、該近赤外線熱源が
放射する近赤外線をスポットライトのようにレンズ、絞
り等で加熱範囲を限定してプリント基板５ａを加熱す
る。また、局部加熱する際、加熱範囲を厳密に限定する
必要がない場合は、ノズルから加熱空気を吹き付ける方
式を採用しても良い。The local heating unit 6 locally limits and heats only a necessary portion on the printed circuit board 5a. For example,
It is used to heat a portion to be locally heated such as a portion where a large-scale component is mounted on a high-density mounting board and has an extremely large heat capacity and solder is difficult to melt. The local heating unit 6 includes a near infrared heat source 6a as described below, and heats the printed circuit board 5a by limiting the heating range of the near infrared rays emitted by the near infrared heat source with a lens, a diaphragm or the like like a spotlight. . Further, when locally heating, if it is not necessary to strictly limit the heating range, a method of blowing heated air from a nozzle may be adopted.
【００１２】前記本発明のリフロー半田付け装置におい
て、プリント基板５がコンベアで搬送されて来て、プリ
ント基板５ａの局部加熱対象部分が前記局部加熱部６に
位置に来たとき、必要時間コンベア１を停止する。この
コンベア停止時間は局部加熱時間よりも長く設定するの
が好適である。また、コンベア１を運転している期間中
のコンベア速度は、停止時間を含めたプリント基板のコ
ンベア通過所要総時間が、通常の場合（従来）と同じ時
間になるように設定する。In the reflow soldering apparatus of the present invention, when the printed circuit board 5 is conveyed by the conveyor and the local heating target portion of the printed circuit board 5a reaches the local heating section 6, the conveyor 1 is required for a necessary time. To stop. This conveyor stop time is preferably set longer than the local heating time. Further, the conveyor speed during the period in which the conveyor 1 is operating is set so that the total time required for the printed board to pass through the conveyor including the stop time is the same as the normal time (conventional).
【００１３】このようにすると、通常加熱部、すなわち
予熱部、リフロー部は従来通りの時間経過を辿ることに
なり、また、局部加熱対象部分だけが更に所定の局部加
熱されることになる。すると、プリント基板が局部加熱
部に到達する前に、予熱部において基板全体が暖まった
状態になっており、暖まった状態で連続して追加加熱す
るため、均一な予熱温度に短時間で到達できる。By doing so, the normal heating section, that is, the preheating section and the reflow section, follow the conventional time course, and only the portion to be locally heated is further locally heated to a predetermined level. Then, before the printed circuit board reaches the local heating section, the entire board is in a warmed state in the preheating section, and additional heating is continuously performed in the warmed state, so that a uniform preheating temperature can be reached in a short time. .
【００１４】前記局部加熱部６の熱源６ａは、図１のよ
うに予熱部２の予熱室内部に固定して配置しても良い
が、ガラス等の光透過性の窓８を通して、リフロー半田
付け装置の外部から加熱するようにしても良い。The heat source 6a of the local heating unit 6 may be fixedly arranged in the preheating chamber of the preheating unit 2 as shown in FIG. 1, but may be reflow soldered through a light-transmissive window 8 such as glass. You may make it heat from the exterior of an apparatus.
【００１５】図２は、熱源を外部に設けた場合のリフロ
ー半田付け装置の幅方向の断面を示している。図２の
（Ａ）は、局部加熱用の熱源６ｂを装置の炉体７の上部
に設けた例で、装置上部から直進ビームを照射して局部
加熱する。図２の（Ｂ）は、装置炉体７の側面に熱源６
ｃを設けた例で、横方向から装置内部に設けた反射ミラ
ー９を介してビームを曲折して照射し局部加熱する。FIG. 2 shows a cross section in the width direction of the reflow soldering device when the heat source is provided outside. 2A shows an example in which the heat source 6b for local heating is provided on the upper part of the furnace body 7 of the apparatus, and a straight beam is irradiated from the upper part of the apparatus to locally heat the apparatus. FIG. 2B shows a heat source 6 on the side surface of the furnace body 7 of the apparatus.
In the example in which c is provided, the beam is bent from the lateral direction through a reflection mirror 9 provided inside the apparatus to irradiate the beam to locally heat the beam.
【００１６】前記熱源６ｂ、６ｃは、装置の上部又は側
面にのみに設けても良いが、装置上部及び側面の複数箇
所に設けることにより加熱範囲や加熱位置の変更を容易
に行うことができ、均一に局部加熱を行うことができ
る。The heat sources 6b and 6c may be provided only on the upper portion or the side surface of the apparatus, but by providing them at a plurality of locations on the upper and side surfaces of the apparatus, the heating range and the heating position can be easily changed. Local heating can be performed uniformly.
【００１７】前記局部加熱部６における熱源として、近
赤外線の波長を３μｍ以下に選ぶと、レンズや光透過窓
のガラス８に特殊なものが必要なく、熱源としてハロゲ
ン球などを使用でき、点光源に近くなり、エネルギー密
度も大きく、本発明の実施にあたり好適な熱源となる。When the wavelength of near infrared rays is selected to be 3 μm or less as a heat source in the local heating section 6, a lens or a glass 8 of a light transmitting window need not be special and a halogen bulb or the like can be used as a heat source. And has a large energy density, which is a suitable heat source for implementing the present invention.
【００１８】ここで、前記局部加熱部６におけるコンベ
ア１の一時停止時間として、予想される最大時間Ｔを定
め、これを前提にしてコンベア搬送速度を決める。コン
ベア搬送速度が決まると、最初に局部加熱部分以外の部
分について条件を設定した後、局部加熱対象部分の加熱
条件を設定する。ここで、温度上昇率は熱源温度で、到
達温度は前記最大時間Ｔ以内で熱源のオンオフ、シャッ
ター開閉などで行うようにすると、局部加熱条件設定手
順が簡単になる。Here, the expected maximum time T is set as the temporary stop time of the conveyor 1 in the local heating section 6, and the conveyor transport speed is determined on the basis of this. When the conveyor conveyance speed is determined, the conditions are first set for parts other than the local heating part, and then the heating conditions for the local heating target part are set. Here, if the temperature rise rate is the heat source temperature and the ultimate temperature is performed by turning on / off the heat source, opening / closing the shutter, etc. within the maximum time T, the local heating condition setting procedure becomes simple.
【００１９】次に、図３には他の実施例を示している。
この実施例は、リフロー部３での加熱速度がプリント基
板搬送方向における位置によって変化することを前提と
した場合の実施例である。図３において、プリント基板
５ａが予熱部２にあって局部加熱部６で加熱されている
時、直前先行するプリント基板５ｃはリフロー部３を通
過して冷却部４にあるようにする。Next, FIG. 3 shows another embodiment.
This example is an example on the assumption that the heating rate in the reflow unit 3 changes depending on the position in the printed circuit board transport direction. In FIG. 3, when the printed circuit board 5a is in the preheating section 2 and is being heated by the local heating section 6, the immediately preceding printed circuit board 5c passes through the reflow section 3 and is in the cooling section 4.
【００２０】前記実施例の場合は、リフロー部３におけ
る加熱速度は場所によらず一定になるように温度条件が
設定されているため、リフロー部３にプリント基板があ
って、コンベアが一時停止しても基板は一定温度に保持
できるが、図３の実施例の場合は、リフロー部３は進行
方向位置よって温度勾配を有するため、コンベアの一時
停止位置により加熱速度が異なることになるから、温度
上昇が規定値よりはずれてしまうことがある。In the case of the above-mentioned embodiment, the temperature condition is set so that the heating rate in the reflow section 3 is constant irrespective of the place. Therefore, there is a printed circuit board in the reflow section 3 and the conveyor is temporarily stopped. Even though the substrate can be kept at a constant temperature, in the case of the embodiment shown in FIG. 3, since the reflow unit 3 has a temperature gradient depending on the position in the traveling direction, the heating rate varies depending on the temporary stop position of the conveyor. The rise may deviate from the specified value.
【００２１】そこで、コンベア１が一時停止する際、リ
フロー部３において、直前先行するプリント基板５ｃが
リフロー部３を通過して冷却部４又は冷却部４よりも先
行する位置にあるようにプリント基板間のピッチを設定
する。この実施例では、基本となるリフロー装置は従来
のものと変わるところはなく、局部加熱部を設けるだけ
で良い。また、基板搬送速度は第１実施例と同様に決定
する。Therefore, when the conveyor 1 is temporarily stopped, in the reflow section 3, the printed circuit board 5c immediately preceding the printed circuit board 5c passes through the reflow section 3 and is located at the cooling section 4 or at a position preceding the cooling section 4. Set the pitch between. In this embodiment, the basic reflow apparatus is the same as the conventional one, and only the local heating section is required. Further, the substrate transfer speed is determined similarly to the first embodiment.
【００２２】前記２つの実施例では、補助加熱のための
局部加熱部を予熱部に設けた例で説明したが、局部加熱
部をリフロー部に設けても実施することができ、必要に
応じて局部加熱部を設けるゾーンを変更することができ
る。In the above-mentioned two embodiments, the local heating part for auxiliary heating is provided in the preheating part. However, the local heating part may be provided in the reflow part. The zone in which the local heating section is provided can be changed.
【００２３】[0023]
【発明の効果】本発明によれば、プリント基板面上に局
部的に熱容量の大きな部分があっても、範囲を限定した
局部加熱ができるので、高密度実装基板におけるリフロ
ー半田付けにおいて、半田付けの信頼性を向上させるこ
とができる。また、局部加熱用の熱源を従来使用のリフ
ロー半田付け装置に単に取り付けるだけなので、大幅な
設計変更を伴うことなく実施することが可能となる。さ
らに、半田の溶けない部分を後工程で再加熱により補修
する工程がなくなり、半田付け時間の短縮を図ることが
できる。According to the present invention, even if there is a portion having a large heat capacity locally on the printed circuit board surface, local heating can be performed in a limited range, so that soldering can be performed during reflow soldering on a high-density mounting board. The reliability of can be improved. Further, since the heat source for local heating is simply attached to the reflow soldering device which has been used conventionally, it is possible to carry out the process without making a large design change. Furthermore, the step of repairing the unmelted portion of the solder by reheating in the subsequent step is eliminated, and the soldering time can be shortened.
【図１】本発明の第１実施例の説明図である。FIG. 1 is an explanatory diagram of a first embodiment of the present invention.
【図２】本発明において、局部加熱に使用する熱源の説
明図である。FIG. 2 is an explanatory diagram of a heat source used for local heating in the present invention.
【図３】本発明の第２実施例の説明図である。FIG. 3 is an explanatory diagram of a second embodiment of the present invention.
２ 予熱部 ３ リフロー部 ４ 冷却部 ５ プリント基板 ６ 局部加熱部 2 Preheating part 3 Reflow part 4 Cooling part 5 Printed circuit board 6 Local heating part
Claims (9)
半田付け装置において、予熱部又はリフロー部に局部加
熱部を設けたことを特徴とするリフロー半田付け装置。1. A reflow soldering device comprising a preheating part and a reflow part, wherein a local heating part is provided in the preheating part or the reflow part.
おいて、リフロー部の後段に冷却部を備えることを特徴
とするリフロー半田付け装置。2. The reflow soldering device according to claim 1, further comprising a cooling unit at a stage subsequent to the reflow unit.
装置において、プリント基板を搬送するコンベアを設
け、該コンベアで搬送されて来たプリント基板を局部加
熱部で一時停止させて局部加熱することを特徴とするリ
フロー半田付け装置。3. The reflow soldering apparatus according to claim 1, further comprising a conveyor for conveying the printed circuit board, and the printed circuit board conveyed by the conveyor is temporarily stopped by a local heating section to locally heat the printed circuit board. Reflow soldering device.
付け装置において、プリント基板の熱容量の大きい部分
を局部加熱部にて局部加熱することを特徴とするリフロ
ー半田付け装置。4. The reflow soldering device according to claim 1, 2 or 3, wherein a portion having a large heat capacity of the printed circuit board is locally heated by a local heating unit.
おいて、、局部加熱部でのコンベア停止時間を局部加熱
時間よりも長くしたことを特徴とするリフロー半田付け
装置。5. The reflow soldering device according to claim 3, wherein the conveyor stop time in the local heating unit is longer than the local heating time.
あることを特徴とする請求項１、２、３、４又は５記載
のリフロー半田付け装置。6. The reflow soldering device according to claim 1, wherein the local heating means of the local heating section is a photothermal source.
て、リフロー炉炉体に設けた光透過窓を通して光熱源に
て局部加熱することを特徴とするリフロー半田付け装
置。7. The reflow soldering apparatus according to claim 6, wherein the reflow soldering apparatus locally heats with a light heat source through a light transmission window provided in the furnace body of the reflow furnace.
おいて、プリント基板の局部加熱時に、局部加熱される
プリント基板に先行して搬送されるプリント基板が、予
熱部とリフロー部相互間又はリフロー部と冷却部相互間
に跨がらないようにしたことを特徴とするリフロー半田
付け装置。8. The reflow soldering device according to claim 3, wherein when the printed circuit board is locally heated, the printed circuit board conveyed prior to the locally heated printed circuit board is between the preheating section and the reflow section or between the reflow section. A reflow soldering device characterized in that it does not straddle between the cooling section and the cooling section.
おいて、プリント基板の局部加熱時に、局部加熱される
プリント基板に先行して搬送されるプリント基板が、冷
却部又は冷却部より先行する位置にあることを特徴とす
るリフロー半田付け装置。9. The reflow soldering device according to claim 3, wherein when the printed circuit board is locally heated, the printed circuit board conveyed prior to the locally heated printed circuit board is located at a position preceding the cooling unit or the cooling unit. A reflow soldering device characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33572594A JPH08181427A (en) | 1994-12-21 | 1994-12-21 | Reflow soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33572594A JPH08181427A (en) | 1994-12-21 | 1994-12-21 | Reflow soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08181427A true JPH08181427A (en) | 1996-07-12 |
Family
ID=18291777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33572594A Pending JPH08181427A (en) | 1994-12-21 | 1994-12-21 | Reflow soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08181427A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107980014A (en) * | 2015-04-24 | 2018-05-01 | 赛米控电子股份有限公司 | For the device, method and system anisotropically cooled down to planar object |
-
1994
- 1994-12-21 JP JP33572594A patent/JPH08181427A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107980014A (en) * | 2015-04-24 | 2018-05-01 | 赛米控电子股份有限公司 | For the device, method and system anisotropically cooled down to planar object |
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