JPH08181246A - Bga fixing and mounting structure - Google Patents
Bga fixing and mounting structureInfo
- Publication number
- JPH08181246A JPH08181246A JP32195394A JP32195394A JPH08181246A JP H08181246 A JPH08181246 A JP H08181246A JP 32195394 A JP32195394 A JP 32195394A JP 32195394 A JP32195394 A JP 32195394A JP H08181246 A JPH08181246 A JP H08181246A
- Authority
- JP
- Japan
- Prior art keywords
- bga
- motherboard
- mounting structure
- positioning hole
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表面実装部品であるボ
ールグリッドアレイ（以下ＢＧＡ）の固定搭載構造に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fixed mounting structure of a ball grid array (hereinafter referred to as BGA) which is a surface mount component.
【０００２】[0002]
【従来の技術】図６はこの種の固定搭載構造の従来例を
示す平面図、図７は同側面図、図８は同底面図であり、
ＢＧＡと呼ばれる半導体のパッケージング外観形状が示
されている。図９は図６のＡ−Ａ断面図、図１０は図９
のＬ部詳細断面図であり、これら図９および図１０によ
りＢＧＡの内部構造が示されている。2. Description of the Related Art FIG. 6 is a plan view showing a conventional example of this type of fixed mounting structure, FIG. 7 is a side view of the same, and FIG. 8 is a bottom view of the same.
The appearance of a semiconductor packaging called BGA is shown. 9 is a sectional view taken along line AA of FIG. 6, and FIG.
11 is a detailed cross-sectional view of the L portion of FIG. 9, and the internal structure of the BGA is shown in FIGS. 9 and 10.
【０００３】まず、ＢＧＡの構成を説明する。図６〜図
８において、基板１上には半導体チップが封止剤９によ
り封止され、基板１下部にはＢＧＡの外部電極であるボ
ールはんだ４が正方格子もしくは千鳥格子に配列，具備
された構造を有する。前記基板１上部内側には、図９，
１０に示す如く、半導体チップ６がダイボンディング７
により固定されかつ該半導体チップ６が基板１上のパタ
ーン２とワイヤーボード８により接続配線されている。
そしてパターン２は基板１に設けられたスルーホール３
を介して、個々の外部電極である対応するボールはんだ
４に電気的に接続されている。なお、外部電極であるボ
ールはんだ４の相互間には一般にソルダレジスト５がリ
フローはんだ付け時のはんだブリッジ防止や、パターン
２へのはんだ付着防止・腐食防止を目的に設けられてい
る。First, the structure of the BGA will be described. 6 to 8, a semiconductor chip is sealed on a substrate 1 with a sealant 9, and ball solders 4 which are external electrodes of a BGA are arranged and arranged in a square lattice or a zigzag lattice below the substrate 1. It has a different structure. As shown in FIG.
As shown in FIG. 10, the semiconductor chip 6 is die bonded 7
And the semiconductor chip 6 is connected and wired to the pattern 2 on the substrate 1 by the wire board 8.
The pattern 2 is a through hole 3 provided in the substrate 1.
Through the corresponding ball solder 4 which is an individual external electrode. A solder resist 5 is generally provided between the ball solders 4 which are external electrodes for the purpose of preventing solder bridges during reflow soldering and preventing solder adhesion and corrosion on the pattern 2.
【０００４】図１１は上記構成のＢＧＡのマザーボード
１０に対する固定搭載状態を示す側面図であり、従来
は、上記ＢＧＡをＢＧＡのボールはんだ４の位置に対応
するマザーボード１０上のフットプリント１１上に配置
した後、リフローはんだ付け、すなわちリフロー加熱し
てボールはんだ４を溶融しその後固化させることで、Ｂ
ＧＡをマザーボード１０へ固定搭載していた。FIG. 11 is a side view showing a fixed mounting state of the BGA having the above-mentioned configuration on the mother board 10. Conventionally, the BGA is arranged on the footprint 11 on the mother board 10 corresponding to the position of the ball solder 4 of the BGA. After that, reflow soldering, that is, reflow heating to melt the ball solder 4 and then solidify
The GA was fixedly mounted on the motherboard 10.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述し
た構成の従来技術によれば、部品外部電極であるボール
はんだ４はＢＧＡ本体下部に設けられており、対応する
マザーボード１０上のフットプリント１１に配置する
際、正しい位置に配置されたか確認することができな
い。そのため、対応位置の出ないままリフローはんだ付
けを行うと、図１１に示すようにリフロー加熱により溶
けたボールはんだが対応フットプリントと機械的かつ電
気的に未接続（図１１のａ部），もしくは接続不足（図
１１のｂ部）状態で搭載され、接続・固定不良を生じる
という問題があった。However, according to the prior art having the above-mentioned structure, the ball solder 4 which is the external electrode of the component is provided on the lower portion of the BGA main body and is arranged in the footprint 11 on the corresponding motherboard 10. When doing, it is not possible to confirm that it was placed in the correct position. Therefore, if the reflow soldering is performed without the corresponding position appearing, as shown in FIG. 11, the ball solder melted by the reflow heating is not mechanically and electrically connected to the corresponding footprint (a portion in FIG. 11), or There is a problem in that the device is mounted in a state of insufficient connection (part b in FIG. 11), resulting in defective connection / fixing.
【０００６】また、ＢＧＡはマザーボードへの配置後に
おいて、リフローはんだ付け前の微小振動・衝撃，ＢＧ
Ａボールはんだのフットプリントとの接触する面のばら
つき若しくはフットプリント平坦度のばらつきなどによ
り位置ずれが非常に生じやすい。しかし、上述した如く
ボールはんだ４とフットプリント１１の接触箇所が視覚
的に確認できないため、位置修正もできないという問題
もあった。In addition, after the BGA is placed on the mother board, it is subjected to minute vibrations / impacts before reflow soldering, BG
Positional deviation is very likely to occur due to variations in the surface of the A ball solder that contacts the footprint or variations in the flatness of the footprint. However, as described above, there is a problem that the position cannot be corrected because the contact portion between the ball solder 4 and the footprint 11 cannot be visually confirmed.
【０００７】さらに、ＢＧＡ位置ずれ防止のために、Ｂ
ＧＡ上から荷重を加えてリフローはんだ付けすると、リ
フローはんだ溶融時にボールはんだがつぶされ、ボール
はんだ相互間のブリッジ，はんだ付け高さの減少，セル
フアライメント効果の消滅という障害・問題が発生す
る。本発明は、以上の問題点に鑑み、マザーボードのフ
ットプリントとＢＧＡの外部電極であるボールはんだと
の対向状態が直接確認できなくても正しい位置にＢＧＡ
を配置できる構成を得て、マザーボードへのＢＧＡの良
好な接続・固定を実現することを目的とする。Further, in order to prevent the BGA position shift, B
When reflow soldering is performed by applying a load from above the GA, the ball solder is crushed when the reflow solder is melted, which causes problems such as bridges between the ball solders, reduction of soldering height, and disappearance of self-alignment effect. In view of the above problems, the present invention provides a BGA at the correct position even if the facing state of the footprint of the motherboard and the ball solder that is the external electrode of the BGA cannot be directly confirmed.
The purpose is to obtain a configuration in which the BGA can be arranged and to achieve good connection and fixing of the BGA to the motherboard.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、第１の発明は、マザーボードへのＢＧＡの配置時に
正確な位置をガイドし、配置後のＢＧＡの移動を位置ず
れ許容範囲内に制限するようにする。すなわち、第１の
発明は、ＢＧＡの本体下部に部品外部電極であるボール
はんだを配し、該ＢＧＡをマザーボード上に配置してリ
フローはんだ付けして固定搭載するＢＧＡ固定搭載構造
において、ＢＧＡの四隅もしくは四隅のうちの数カ所に
貫通してなる位置決め穴を設けるとともに、マザーボー
ドには、ＢＧＡを正しい位置に配置したときに前記位置
決め穴の真下に相当する位置に断熱性でできた剛性のガ
イドピンを設け、該ガイドピンは、位置決め穴形状との
大きさの差が許容搭載位置ずれ量以内の範囲で小さい断
面形状であることを特徴とする。In order to achieve the above object, the first aspect of the present invention guides an accurate position when arranging a BGA on a mother board, and limits the movement of the BGA after the arranging within a positional deviation allowable range. To do so. That is, the first invention is a BGA fixed mounting structure in which ball solder, which is a component external electrode, is arranged under the main body of the BGA, and the BGA is arranged on a motherboard and fixedly mounted by reflow soldering. Alternatively, a positioning hole that penetrates through at some of the four corners is provided, and a rigid guide pin made of heat insulating material is provided on the motherboard at a position that is directly below the positioning hole when the BGA is placed in the correct position. The guide pin is characterized in that the guide pin has a small cross-sectional shape within a range in which the size difference from the positioning hole shape is within the allowable mounting position displacement amount.
【０００９】上記目的を達成するため、第２の発明は、
マザーボードへのＢＧＡの配置時に正確な位置を視覚的
に認識させ、配置後も視覚的にＢＧＡの位置修正ができ
るようにする。すなわち、第２の発明は、ＢＧＡの本体
下部に部品外部電極であるボールはんだを配し、該ＢＧ
Ａをマザーボード上に配置してリフローはんだ付けして
固定搭載するＢＧＡ固定搭載構造において、ＢＧＡの四
隅もしくは四隅のうちの数カ所に貫通してなる認識穴を
設けるとともに、マザーボードには、ＢＧＡを正しい位
置に配置したときに前記認識穴の真下に相当する位置に
認識マークを設け、該認識マークは、位置決め穴形状と
の大きさの差が許容搭載位置ずれ量以内の範囲で小さい
形状であることを特徴とする。In order to achieve the above object, the second invention is
The correct position is visually recognized when the BGA is placed on the motherboard, and the BGA position can be visually corrected even after the placement. That is, the second aspect of the present invention is to dispose ball solder, which is an external electrode of a component, under the main body of the BGA,
In the BGA fixed mounting structure in which A is placed on the motherboard and fixedly mounted by reflow soldering, recognition holes are formed at the four corners of the BGA or at some of the four corners, and the BGA is correctly positioned on the motherboard. When it is arranged, a recognition mark is provided at a position just below the recognition hole, and the recognition mark has a small difference in size from the positioning hole shape within a range within an allowable mounting position deviation amount. Characterize.
【００１０】[0010]
【作用】上記構成の第１の発明によれば、ＢＧＡの位置
決め穴各々にマザーボード上の対応する各々のガイドピ
ンが貫通するようにＢＧＡを配置すると、これによりＢ
ＧＡは指定位置に正しく配置され、その後リフローはん
だ付けすることにより良好なＢＧＡのはんだ接続ができ
る。このとき、位置ずれが生じても、ガイドピンと位置
決め穴の相互の大きさの差はＢＧＡをマザーボードへ搭
載する時の許容位置ずれの値以内であるので、位置ずれ
による接続不良は生じない。According to the first aspect of the present invention, when the BGA is arranged such that the corresponding guide pins on the motherboard penetrate through the positioning holes of the BGA, the BGA is
The GA is properly placed at the specified position, and then reflow soldering is performed, so that good BGA solder connection can be achieved. At this time, even if the position shift occurs, the size difference between the guide pin and the positioning hole is within the allowable position shift value when the BGA is mounted on the mother board, and therefore connection failure due to the position shift does not occur.
【００１１】また、上記構成の第２の発明によれば、Ｂ
ＧＡの認識穴各々がマザーボード上の対応する各々の認
識マークの真上に重なり合い、ＢＧＡ上部より認識穴を
通して認識マーク各々を視覚的に認識できる位置にＢＧ
Ａを配置すると、これによりＢＧＡは指定位置に正しく
配置され、その後リフローはんだ付けすることにより良
好なはんだ接続ができる。このとき、リフローはんだ付
け前のＢＧＡ位置ずれ修正においては、再度認識穴と対
応する認識マークが合致するのを確認できる位置にＢＧ
Ａを移動することで修正することができる。According to the second invention of the above construction, B
Each of the recognition holes of the GA overlaps directly above the corresponding recognition mark on the motherboard, and each of the recognition marks can be visually recognized from the upper part of the BGA through the recognition holes.
When A is placed, this ensures that the BGA is correctly placed in the specified position, and then reflow soldering is performed to make a good solder connection. At this time, in the BGA position shift correction before reflow soldering, the BG is again positioned so that it can be confirmed that the recognition holes and the corresponding recognition marks match.
It can be corrected by moving A.
【００１２】[0012]
【実施例】以下、図面に従って実施例を説明する。図１
は第１の発明の一実施例を示す側面図、図２は同実施例
のＢＧＡの構造を示す平面図、図３は同側面図、図４は
同底面図である。ＢＧＡの機能的構成は図９，１０で示
した従来のものと同様であるので、説明は省略する。Embodiments Embodiments will be described below with reference to the drawings. FIG.
Is a side view showing an embodiment of the first invention, FIG. 2 is a plan view showing the structure of the BGA of the embodiment, FIG. 3 is a side view of the same, and FIG. 4 is a bottom view of the same. The functional structure of the BGA is the same as that of the conventional one shown in FIGS.
【００１３】本実施例のＢＧＡには、半導体チップの電
極と外部端子電極であるボールはんだ４を電気的に接続
配線するパターンが設けられている基板１のデッドスペ
ースとなる四隅、場合によっては四隅のうちの数カ所に
貫通してなる位置決め穴１２が設けられている。一方、
マザーボード１０上にはＢＧＡを指定するマザーボード
位置に配置した場合に、位置決め穴１２の真下となる位
置にガイドピン１３が設けられている。１１はフットプ
リントである。In the BGA of the present embodiment, four corners, which are dead corners of the substrate 1 provided with a pattern for electrically connecting and wiring the electrodes of the semiconductor chip and the ball solder 4 which is an external terminal electrode, and in some cases four corners. Positioning holes 12 are provided at some of the positions. on the other hand,
A guide pin 13 is provided on the mother board 10 at a position directly below the positioning hole 12 when the BGA is arranged at the mother board position. 11 is a footprint.
【００１４】ガイドピン１３は、位置決め穴１２の形状
との大きさの差がＢＧＡをマザーボード１０へ搭載する
時の許容搭載位置ずれ量以内の範囲で小さい断面形状と
なっている。また、ガイドピン１３はリフローはんだ付
け時の加熱に耐えうる材料でマザーボード１０に固定搭
載してある。以上の構成の本実施例の作用を以下に説明
する。The guide pin 13 has a small cross-sectional shape within a range in which the size difference from the shape of the positioning hole 12 is within the allowable mounting position displacement amount when the BGA is mounted on the mother board 10. The guide pin 13 is fixedly mounted on the mother board 10 with a material that can withstand the heating during reflow soldering. The operation of this embodiment having the above configuration will be described below.
【００１５】まず、基板１の四隅もしくは四隅の数カ所
に設けられたＢＧＡの位置決め穴１２各々をマザーボー
ド１０上の対応する各々のガイドピン１３が貫通するよ
うにしてＢＧＡを配置する。これにより、ＢＧＡを指定
位置に正しく配置でき、その後リフローはんだ付けする
ことにより良好なＢＧＡのはんだ接続が可能となる。こ
のとき、位置ずれが生じても、ガイドピン１３と位置決
め穴１２の相互の大きさの差はＢＧＡをマザーボード１
０へ搭載する時の許容位置ずれの値以内であるので、位
置ずれによる接続不良は生じない。First, the BGA is arranged so that the corresponding guide pins 13 on the motherboard 10 penetrate through the BGA positioning holes 12 provided at the four corners of the board 1 or at several places of the four corners. As a result, the BGA can be correctly placed at the designated position, and then good reflow soldering enables BGA solder connection. At this time, even if misalignment occurs, the difference in size between the guide pin 13 and the positioning hole 12 may cause the BGA
Since it is within the value of the permissible positional displacement when mounted on 0, no connection failure due to the positional displacement occurs.
【００１６】なお、本実施例での位置合わせは、自動搭
載機における視覚センサーを用いた場合にも適用でき
る。図５は第２の発明の一実施例を示す側面図である。
本発明のＢＧＡは、導体チップの電極と外部端子電極で
あるボールはんだを電気的に接続配線するパターンが設
けられている基板のデッドスペースとなる四隅、場合に
よっては四隅のうちの数カ所に貫通してなる認識穴が設
けられている。本実施例では、ＢＧＡの構造は第１の実
施例のものと同一であり、図２〜４に示す位置決め穴１
２が前記認識穴に相当する。したがって、以下の説明で
は認識穴を位置決め穴１２の称呼で説明する。The alignment in this embodiment can also be applied to the case where a visual sensor in an automatic mounting machine is used. FIG. 5 is a side view showing an embodiment of the second invention.
The BGA of the present invention penetrates into four corners, which are dead spaces of a board provided with a pattern for electrically connecting and wiring the electrodes of a conductor chip and ball solder which is an external terminal electrode, and in some cases, among the four corners. There is a recognition hole. In this embodiment, the structure of the BGA is the same as that of the first embodiment, and the positioning hole 1 shown in FIGS.
2 corresponds to the recognition hole. Therefore, in the following description, the recognition hole will be referred to as the positioning hole 12.
【００１７】一方、マザーボード１０上にはＢＧＡを指
定するマザーボード位置に配置した場合に、位置決め穴
１２の真下となる認識マーク１４が設けられている。１
１はフットプリントである。識別マーク１４は、位置決
め穴１２の形状との大きさの差がＢＧＡをマザーボード
１０へ搭載する時の許容搭載位置ずれ量以内の範囲で小
さい形状となっている。 以上の構成の本実施例の作用
を以下に説明する。On the other hand, a recognition mark 14 is provided on the mother board 10 just below the positioning hole 12 when the BGA is arranged at the mother board position. 1
1 is a footprint. The identification mark 14 has a small size difference from the shape of the positioning hole 12 within a range within the allowable mounting position displacement amount when the BGA is mounted on the motherboard 10. The operation of this embodiment having the above configuration will be described below.
【００１８】まず、基板１の四隅もしくは四隅の数カ所
に設けられたＢＧＡの位置決め穴１２各々がマザーボー
ド１０上の対応する各々の認識マーク１４の真上に重な
り合い、ＢＧＡ上部より位置決め穴１２を通して認識マ
ーク１４各々を視覚的に認識できる位置にＢＧＡを配置
する。これにより、ＢＧＡを指定位置に正しく配置で
き、その後リフローはんだ付けすることにより良好なは
んだ接続が可能となる。このとき、リフローはんだ付け
前のＢＧＡ位置ずれ修正においては、再度位置決め穴１
２と対応する認識マーク１４が合致するのを確認できる
位置にＢＧＡを移動し修正する。First, the BGA positioning holes 12 provided at the four corners of the substrate 1 or at several positions of the four corners are directly overlapped with the corresponding recognition marks 14 on the motherboard 10, and the recognition marks are passed through the positioning holes 12 from the upper part of the BGA. 14 BGAs are arranged at positions where each can be visually recognized. As a result, the BGA can be correctly placed at the specified position, and good solder connection can be achieved by reflow soldering thereafter. At this time, when correcting the BGA displacement before reflow soldering, the positioning hole 1
The BGA is moved and corrected to a position where it can be confirmed that the recognition marks 14 corresponding to 2 match.
【００１９】なお、本実施例での位置合わせも、自動搭
載機における視覚センサーを用いた場合にも適用でき
る。The alignment in this embodiment can also be applied to the case where the visual sensor in the automatic mounting machine is used.
【００２０】[0020]
【発明の効果】上述した構成の第１の発明によれば、Ｂ
ＧＡの本体下部に部品外部電極であるボールはんだを配
し、該ＢＧＡをマザーボード上に配置してリフローはん
だ付けして固定搭載するＢＧＡ固定搭載構造において、
ＢＧＡの四隅もしくは四隅のうちの数カ所に貫通してな
る位置決め穴を設けるとともに、マザーボードには、Ｂ
ＧＡを正しい位置に配置したときに前記位置決め穴の真
下に相当する位置に断熱性でできた剛性のガイドピンを
設け、該ガイドピンは、位置決め穴形状との大きさの差
が許容搭載位置ずれ量以内の範囲で小さい断面形状であ
るので、マザーボードへのＢＧＡの配置時に正確な位置
をガイドし、配置後のＢＧＡの移動を位置ずれ許容範囲
内に制限することができる。According to the first aspect of the invention described above, B
In a BGA fixed mounting structure in which ball solder, which is a component external electrode, is arranged on the lower part of the body of the GA, and the BGA is arranged on the motherboard and fixedly mounted by reflow soldering,
The BGA has four corners or positioning holes penetrating at several of the four corners.
When the GA is placed in the correct position, a rigid guide pin made of a heat insulating material is provided at a position corresponding to the position directly below the positioning hole, and the guide pin has a difference in size from the positioning hole that allows the mounting position to be displaced. Since the cross-sectional shape is small in the range within the amount, it is possible to guide the accurate position when the BGA is arranged on the mother board and limit the movement of the BGA after the arrangement within the positional deviation allowable range.
【００２１】これにより、マザーボードのフットプリン
トとＢＧＡの外部電極であるボールはんだとの対向状態
が直接確認できなくても正しい位置にＢＧＡを配置する
ことが可能となり、マザーボードへのＢＧＡの良好な接
続・固定を実現するという効果がある。さらに、第１の
発明によれば、リフローはんだ付け時のＢＧＡを上部か
らの荷重なしに位置ずれ許容範囲内での移動に制限でき
るため、ＢＧＡのセルフアライメント効果が十分期待で
き、良好なＢＧＡのマザーボードへのリフローはんだ付
け固定が実現できる。As a result, the BGA can be placed in the correct position even if the facing state of the footprint of the motherboard and the ball solder, which is the external electrode of the BGA, cannot be directly confirmed, and the BGA is well connected to the motherboard. -It has the effect of realizing fixation. Further, according to the first invention, since the BGA at the time of reflow soldering can be limited to the movement within the positional deviation permissible range without a load from above, a self-alignment effect of the BGA can be expected sufficiently, and a good BGA Reflow soldering and fixing to the motherboard can be realized.
【００２２】また、第１の発明によれば、ＢＧＡの位置
決め穴とマザーボード上のガイドピンを備えるだけの安
価な構成で上記の各効果を得ることができる。また、上
述した構成の第２の発明によれば、ＢＧＡの本体下部に
部品外部電極であるボールはんだを配し、該ＢＧＡをマ
ザーボード上に配置してリフローはんだ付けして固定搭
載するＢＧＡ固定搭載構造において、ＢＧＡの四隅もし
くは四隅のうちの数カ所に貫通してなる認識穴を設ける
とともに、マザーボードには、ＢＧＡを正しい位置に配
置したときに前記認識穴の真下に相当する位置に認識マ
ークを設け、該認識マークは、位置決め穴形状との大き
さの差が許容搭載位置ずれ量以内の範囲で小さい形状で
あるので、マザーボードへのＢＧＡの配置時に正確な位
置を視覚的に認識させ、配置後も視覚的にＢＧＡの位置
修正ができる。Further, according to the first aspect of the present invention, each of the above effects can be obtained with an inexpensive structure in which only the BGA positioning holes and the guide pins on the motherboard are provided. Further, according to the second aspect of the invention described above, a BGA fixed mount in which ball solder, which is a component external electrode, is arranged under the main body of the BGA, and the BGA is arranged on the motherboard and fixedly mounted by reflow soldering. In the structure, recognition holes are formed at four corners of the BGA or at several positions of the four corners, and a recognition mark is provided on the motherboard at a position corresponding to a position directly below the recognition hole when the BGA is arranged at a correct position. Since the recognition mark has a small size difference with the shape of the positioning hole within the range of the allowable mounting position deviation amount, the accurate position can be visually recognized when the BGA is arranged on the motherboard, and Can visually correct the position of BGA.
【００２３】これにより、第１の発明と同様に、マザー
ボードのフットプリントとＢＧＡの外部電極であるボー
ルはんだとの対向状態が直接確認できなくても正しい位
置にＢＧＡを配置することが可能となり、マザーボード
へのＢＧＡの良好な接続・固定を実現するという効果が
ある。さらに、第２の発明によれば、上述した如くマザ
ーボードへのＢＧＡの配置後も視覚的にＢＧＡの位置修
正ができるので、位置すれが生じやすいＢＧＡのリフロ
ーはんだ付け前の位置修正が容易に可能であるという効
果がある。As a result, similarly to the first aspect of the invention, it becomes possible to dispose the BGA in the correct position without directly confirming the facing state of the footprint of the motherboard and the ball solder which is the external electrode of the BGA. This has the effect of achieving good connection and fixing of the BGA to the motherboard. Further, according to the second invention, since the position of the BGA can be visually corrected even after the BGA is arranged on the mother board as described above, it is possible to easily correct the position of the BGA before reflow soldering, which is likely to cause positional deviation. There is an effect that.
【００２４】また、第２の発明によれば、ＢＧＡの認識
穴とマザーボード上の搭載マークを備えるだけの安価な
構造で上記の各効果を得ることができる。Further, according to the second aspect of the invention, each of the above effects can be obtained with an inexpensive structure having only the BGA recognition hole and the mounting mark on the motherboard.
【図１】第１の発明の一実施例を示す側面図である。FIG. 1 is a side view showing an embodiment of the first invention.
【図２】第１の発明の一実施例のＢＧＡの構造を示す平
面図である。FIG. 2 is a plan view showing the structure of a BGA according to an embodiment of the first invention.
【図３】第１の発明の一実施例のＢＧＡの構造を示す側
面図である。FIG. 3 is a side view showing the structure of a BGA according to an embodiment of the first invention.
【図４】第１の発明の一実施例のＢＧＡの構造を示す底
面図である。FIG. 4 is a bottom view showing the structure of the BGA according to the first embodiment of the invention.
【図５】第２の発明の一実施例を示す側面図である。FIG. 5 is a side view showing an embodiment of the second invention.
【図６】従来例を示す平面図である。FIG. 6 is a plan view showing a conventional example.
【図７】従来例の側面図である。FIG. 7 is a side view of a conventional example.
【図８】従来例の底面図である。FIG. 8 is a bottom view of a conventional example.
【図９】図６のＡ−Ａ断面図である。9 is a cross-sectional view taken along the line AA of FIG.
【図１０】図９のＬ部詳細断面図である。10 is a detailed cross-sectional view of the L portion of FIG.
【図１１】従来例の固定状態を示す側面図である。FIG. 11 is a side view showing a fixed state of a conventional example.
１ 基板 ４ ボールはんだ １０ マザーボード １１ フットプリント １２ 位置決め穴 １３ ガイドピン １４ 認識マーク 1 Board 4 Ball Solder 10 Motherboard 11 Footprint 12 Positioning Hole 13 Guide Pin 14 Recognition Mark
Claims (2)
ボールはんだを配し、該ＢＧＡをマザーボード上に配置
してリフローはんだ付けして固定搭載するＢＧＡ固定搭
載構造において、 ＢＧＡの四隅もしくは四隅のうちの数カ所に貫通してな
る位置決め穴を設けるとともに、 マザーボードには、ＢＧＡを正しい位置に配置したとき
に前記位置決め穴の真下に相当する位置に断熱性ででき
た剛性のガイドピンを設け、 該ガイドピンは、位置決め穴形状との大きさの差が許容
搭載位置ずれ量以内の範囲で小さい断面形状であること
を特徴とするＢＧＡ固定搭載構造。1. A BGA fixed mounting structure in which ball solder, which is a component external electrode, is arranged on the lower part of the main body of the BGA, and the BGA is arranged on a motherboard and fixedly mounted by reflow soldering. A positioning hole is formed at a few of the positions, and a rigid guide pin made of heat insulating material is provided on the motherboard at a position corresponding to a position directly below the positioning hole when the BGA is arranged at a correct position. The BGA fixed mounting structure, wherein the guide pin has a cross-sectional shape with a small size difference from the positioning hole shape within a range of an allowable mounting position deviation amount.
ボールはんだを配し、該ＢＧＡをマザーボード上に配置
してリフローはんだ付けして固定搭載するＢＧＡ固定搭
載構造において、 ＢＧＡの四隅もしくは四隅のうちの数カ所に貫通してな
る認識穴を設けるとともに、 マザーボードには、ＢＧＡを正しい位置に配置したとき
に前記認識穴の真下に相当する位置に認識マークを設
け、 該認識マークは、位置決め穴形状との大きさの差が許容
搭載位置ずれ量以内の範囲で小さい形状であることを特
徴とするＢＧＡ固定搭載構造。2. A BGA fixed mounting structure in which ball solder, which is a component external electrode, is arranged on the lower part of the main body of the BGA, and the BGA is arranged on a motherboard and fixedly mounted by reflow soldering. A recognition hole is formed at a few of them, and a recognition mark is provided on the motherboard at a position corresponding to the position just below the recognition hole when the BGA is arranged at the correct position. The BGA fixed mounting structure is characterized in that the size difference between and is small within a range of the allowable mounting position deviation amount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32195394A JPH08181246A (en) | 1994-12-26 | 1994-12-26 | Bga fixing and mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32195394A JPH08181246A (en) | 1994-12-26 | 1994-12-26 | Bga fixing and mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08181246A true JPH08181246A (en) | 1996-07-12 |
Family
ID=18138278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32195394A Pending JPH08181246A (en) | 1994-12-26 | 1994-12-26 | Bga fixing and mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08181246A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253580A (en) * | 2005-03-14 | 2006-09-21 | Alps Electric Co Ltd | Electronic function component packaging body and electronic apparatus |
| JP2009130048A (en) * | 2007-11-21 | 2009-06-11 | Elpida Memory Inc | Semiconductor device, and electronic device |
| JP2014216618A (en) * | 2013-04-30 | 2014-11-17 | 富士通株式会社 | Semiconductor device and manufacturing method of the same |
| US10834839B1 (en) | 2019-08-27 | 2020-11-10 | International Business Machines Corporation | Barrier for hybrid socket movement reduction |
-
1994
- 1994-12-26 JP JP32195394A patent/JPH08181246A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253580A (en) * | 2005-03-14 | 2006-09-21 | Alps Electric Co Ltd | Electronic function component packaging body and electronic apparatus |
| JP2009130048A (en) * | 2007-11-21 | 2009-06-11 | Elpida Memory Inc | Semiconductor device, and electronic device |
| JP2014216618A (en) * | 2013-04-30 | 2014-11-17 | 富士通株式会社 | Semiconductor device and manufacturing method of the same |
| US10834839B1 (en) | 2019-08-27 | 2020-11-10 | International Business Machines Corporation | Barrier for hybrid socket movement reduction |
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