JPH08153997A - Device and method for observing electronic parts - Google Patents
Device and method for observing electronic partsInfo
- Publication number
- JPH08153997A JPH08153997A JP6292939A JP29293994A JPH08153997A JP H08153997 A JPH08153997 A JP H08153997A JP 6292939 A JP6292939 A JP 6292939A JP 29293994 A JP29293994 A JP 29293994A JP H08153997 A JPH08153997 A JP H08153997A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- bumps
- light source
- bump
- observing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、バンプ付電子部品の観
察を行う電子部品観察装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component observing apparatus for observing electronic components with bumps.
【０００２】[0002]
【従来の技術】近年、ＢＧＡ（ボールグリッドアレイ）
などのバンプ付電子部品が出現し、このバンプ付電子部
品を回路基板に自動実装する実装装置が実用化されてい
る。ところで、ＱＦＰなどの在来の電子部品と同様に、
バンプ付電子部品を回路基板に実装する前に、バンプ付
電子部品の位置ずれ量などを検出して位置補正をする必
要がある。このとき、電子部品観察装置が用いられる。2. Description of the Related Art In recent years, BGA (ball grid array)
Electronic components with bumps have appeared, and mounting devices for automatically mounting the electronic components with bumps on a circuit board have been put into practical use. By the way, like conventional electronic parts such as QFP,
Before mounting the electronic component with bumps on the circuit board, it is necessary to detect the amount of displacement of the electronic component with bumps and correct the position. At this time, the electronic component observation device is used.
【０００３】次に図６（従来の電子部品観察装置の側面
図）を参照しながら、従来の電子部品観察装置について
説明する。図６中、１はバンプ付電子部品であり、バン
プ付電子部品１は、モールド体からなる本体部２と、本
体部２の下面に設けられる基板部３と、基板部３の下面
に多数マトリックス状に配置され、個々のものが略球体
状をなすバンプ４を有する。バンプ４は、回路基板の回
路パターンに接続される端子としての役割を持つもので
あり、半田を溶融して形成されるものであるから、表面
は鏡面状となる凸面となっている。Next, a conventional electronic component observing apparatus will be described with reference to FIG. 6 (side view of the conventional electronic component observing apparatus). In FIG. 6, reference numeral 1 denotes an electronic component with bumps. The electronic component 1 with bumps includes a main body 2 made of a molded body, a substrate portion 3 provided on the lower surface of the main body portion 2, and a large number of matrixes on the lower surface of the substrate portion 3. Each of the bumps 4 has a substantially spherical shape. The bump 4 serves as a terminal connected to the circuit pattern of the circuit board, and is formed by melting the solder. Therefore, the surface of the bump 4 has a mirror-like convex surface.
【０００４】６は下部に本体部２を吸着するノズル５を
有し、バンプ付電子部品１を移送する移載ヘッド、８は
バンプ付電子部品１を観察するカメラ、９は観察用の光
源である。Reference numeral 6 denotes a transfer head having a nozzle 5 for adsorbing the main body 2 at a lower portion thereof, for transferring the electronic component 1 with bumps, 8 a camera for observing the electronic component 1 with bumps, and 9 a light source for observation. is there.
【０００５】ところで、以上述べた電子部品観察装置
は、ＱＦＰなど在来の電子部品に用いる電子部品観察装
置をそのまま流用したものであり、光源は一系統のみ設
けられていた。ここで在来の電子部品では、通常リード
など位置検出に重要な部分（回路基板の回路パターンに
電気的に接続される部分）は、本体よりも外側に延出し
ており、この延出する部分もしくは本体の輪郭線のみに
注目して観察を行えば十分であった。By the way, the electronic component observing apparatus described above is an electronic component observing apparatus used for conventional electronic components such as QFP, and is used as it is, and only one system of light source is provided. Here, in conventional electronic components, the parts such as leads that are important for position detection (the parts that are electrically connected to the circuit pattern of the circuit board) usually extend outside the main body. Alternatively, it was sufficient to observe only the outline of the body.
【０００６】[0006]
【発明が解決しようとする課題】しかしながらバンプ付
電子部品では次のような特殊事情があり、図６のような
電子部品観察装置では位置観察を十分に行えないという
問題点があった。即ち、図６のような電子部品観察装置
では、一系統の光源しかないので、基本的には１通りの
明暗しか判別できない。ここで、バンプ付電子部品で
は、暗色の基板部３の内側（ＱＦＰのように外部に延出
しない）に、明るく輝くバンプ４が位置している。図７
（従来の電子部品観察装置による像の例示図）を用いて
説明すると、図７中、Ｖはカメラ８の視野、１０はバン
プ付電子部品１が理想位置（位置ずれなし）の状態にお
ける基板部３の輪郭線である。しかし、この基板部３の
輪郭線は、基板部３自体が暗いので、その外部との区別
が付かず、視野Ｖ内の画像からは直ちに把握できない。
一方で、バンプ４の像１２の位置を特定するために理想
位置におけるバンプ４を含むようなサーチエリア１３が
設定される。However, the electronic component with bumps has the following special circumstances, and the electronic component observing apparatus as shown in FIG. 6 has a problem that the position observation cannot be sufficiently performed. That is, in the electronic component observing apparatus as shown in FIG. 6, since there is only one system of light source, basically only one kind of light and dark can be discriminated. Here, in the electronic component with bumps, the bright and bright bumps 4 are located inside the dark-colored substrate portion 3 (not extending to the outside like QFP). Figure 7
This will be described with reference to (an exemplary view of an image obtained by a conventional electronic component observing device). In FIG. 7, V is the field of view of the camera 8, and 10 is the substrate portion in a state where the bumped electronic component 1 is in an ideal position (no positional deviation). 3 is a contour line. However, since the contour of the substrate portion 3 is dark in the substrate portion 3 itself, it cannot be distinguished from the outside thereof and cannot be immediately grasped from the image in the visual field V.
On the other hand, in order to specify the position of the image 12 of the bump 4, the search area 13 including the bump 4 at the ideal position is set.
【０００７】ところが図７の破線で示すように、基板部
７の実際の輪郭線１１が理想位置の輪郭線１０から位置
ずれを生じていることが多く、このときバンプ４の像１
２が、サーチエリア１３外に位置して認識が全く行えな
くなることがある。また、サーチエリア１３内に本来の
バンプでないバンプの像１２が入って意味のない認識が
行われることがある。このように従来の電子部品観察装
置では、認識結果の信頼性が低いという問題点があっ
た。なおこのように基板部７の実際の輪郭線１１が位置
ずれを生じていても、上述のようにこの輪郭線１１自体
を観察することができないので、基板部７の位置ずれの
有無すら不明なのである。However, as shown by the broken line in FIG. 7, the actual contour line 11 of the substrate portion 7 often deviates from the contour line 10 at the ideal position. At this time, the image 1 of the bump 4 is formed.
2 may be located outside the search area 13 and cannot be recognized at all. In addition, the image 12 of the bump that is not the original bump may be included in the search area 13 to perform meaningless recognition. As described above, the conventional electronic component observing device has a problem that the reliability of the recognition result is low. Even if the actual contour line 11 of the substrate portion 7 is displaced in this way, it is not possible to observe the contour line 11 itself as described above, and therefore it is unknown whether or not the substrate portion 7 is displaced. is there.
【０００８】そこで本発明は、バンプ付電子部品につい
て正確な観察を行える電子部品観察装置を提供すること
を目的とする。[0008] Therefore, an object of the present invention is to provide an electronic component observing apparatus capable of accurately observing a bumped electronic component.
【０００９】[0009]
【課題を解決するための手段】本発明の電子部品観察装
置は、バンプ付電子部品を観察するカメラと、背景板を
明るく照らす第１の光源と、バンプを明るく照らす第２
の光源とを有する。An electronic component observing apparatus of the present invention is a camera for observing electronic components with bumps, a first light source for illuminating a background plate brightly, and a second light source for illuminating bumps brightly.
And a light source.
【００１０】[0010]
【作用】上記構成において、第１の光源による光によっ
て明るい背景板の像と暗い基板部の像とにコントラスト
を付けることにより、基板部の位置ずれを確認できる。
また、暗い基板部の中に明るいバンプを浮かび上がらせ
ることによって、基板部に対するバンプの位置関係を明
確にすることができる。In the above structure, the positional deviation of the substrate can be confirmed by contrasting the image of the bright background plate and the image of the dark substrate with the light from the first light source.
Further, by making the bright bumps stand out in the dark substrate portion, the positional relationship of the bumps with respect to the substrate portion can be clarified.
【００１１】[0011]
【実施例】次に図面を参照しながら本発明の実施例を説
明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１２】図１は本発明の第１の実施例における電子
部品観察装置の全体構成図、図２は本発明の第１の実施
例における電子部品観察装置の要部側面図である。なお
図中、従来の構成を示す図６、図７と同様の構成要素に
ついては同一符号を付すことにより説明を省略する。FIG. 1 is an overall configuration diagram of an electronic component observing apparatus according to a first embodiment of the present invention, and FIG. 2 is a side view of essential parts of the electronic component observing apparatus according to the first embodiment of the present invention. In the figure, the same components as those in FIGS. 6 and 7 showing the conventional configuration are denoted by the same reference numerals and the description thereof will be omitted.
【００１３】図１中、１４はバンプ付電子部品１を収納
し、移載ヘッド６のノズル５のピックアップ動作に備え
るトレイ、１５はバンプ付電子部品１が搭載される回路
基板であり、主制御部２３にコントロールされる移載ヘ
ッド駆動部２４により駆動される移載ヘッド６が、トレ
イ１４からピックアップ動作をして矢印Ｎ１方向に移動
し、後に詳述する光源ユニット１７の上方を通過して、
矢印Ｎ２方向に移動することにより、バンプ付電子部品
１が回路基板１５上に移載されるようになっている。In FIG. 1, reference numeral 14 is a tray for accommodating the electronic component 1 with bumps and preparing for picking up of the nozzle 5 of the transfer head 6, and 15 is a circuit board on which the electronic component 1 with bumps is mounted. The transfer head 6 driven by the transfer head drive unit 24 controlled by the unit 23 moves in the direction of arrow N1 by picking up from the tray 14 and passes above the light source unit 17 described in detail later. ,
By moving in the direction of arrow N2, the bumped electronic component 1 is transferred onto the circuit board 15.
【００１４】また１８は、カメラ８が取込んだ画像に基
いて図３に示すフローチャートに沿った認識処理を行う
認識部である。このうち、２１はカメラ８のアナログ出
力をデジタル化するＡ／Ｄ変換器、２２はデジタル化さ
れた画像が格納される画像メモリ、１９はメモリ２０内
のデータ及び制御プログラムに従って画像メモリ２２内
の画像に対し、上述した認識処理を行い、結果をメモリ
２０に格納するＣＰＵである。Reference numeral 18 is a recognition unit for performing recognition processing according to the flowchart shown in FIG. 3 based on the image captured by the camera 8. Of these, 21 is an A / D converter for digitizing the analog output of the camera 8, 22 is an image memory in which the digitized image is stored, 19 is data in the memory 20 and image memory 22 in the image memory 22 according to a control program. It is a CPU that performs the above-described recognition processing on an image and stores the result in the memory 20.
【００１５】次に光源ユニット１７等の構成を図２を参
照しながら説明する。まず、移載ヘッド６の下面には、
幅広で反射性を有する背景板１６が装着されており、２
６はハロゲン光源２５に接続され、この背景板１６に向
かって（矢印Ｎ３〜Ｎ４の範囲）光を照射し、光源ユニ
ット１７の外周部に配設される光ファイバである。これ
により、基板部３（暗）と背景板１６（明）との間に明
瞭なコントラストを付けることができ、カメラ８の画像
中において、基板部３の輪郭線を明確に確認できるよう
になっている。また光源ユニット１７の中央（カメラ８
の光軸と一致）には、カメラ８に光を入射できるように
円筒状の鏡筒１７ａが取り付けられ、それと同軸的に上
方が広がる台形状の断面形状を備えた凹部１７ｂが開設
されている。そして、凹部１７ｂの傾斜面には、内向き
に傾斜するようにＬＥＤ２７が多数埋め込まれている。
この多数でしかも向きが異なるＬＥＤ２７により、バン
プ４は無指向的に照らされ、球面状をなす表面の全エリ
アが明るく照らされるようになっている。なお、バンプ
４を一定方向からのみ照らすと、バンプ４の像がリング
状あるいは三日月状となってしまい、認識を正確に行え
ないので不適当である。ここで、ハロゲン光源２５と光
ファイバ２６とは、第１の光源に対応し、凹部１７ｂに
埋め込まれた多数のＬＥＤ２７は第２の光源に対応す
る。Next, the structure of the light source unit 17 and the like will be described with reference to FIG. First, on the lower surface of the transfer head 6,
A wide and reflective background plate 16 is attached,
An optical fiber 6 is connected to the halogen light source 25, irradiates the background plate 16 with light (in the range of arrows N3 to N4), and is arranged on the outer peripheral portion of the light source unit 17. As a result, a clear contrast can be provided between the substrate unit 3 (dark) and the background plate 16 (light), and the contour line of the substrate unit 3 can be clearly confirmed in the image of the camera 8. ing. In the center of the light source unit 17 (camera 8
(Corresponding to the optical axis of), a cylindrical lens barrel 17a is attached so that light can be incident on the camera 8, and a recess 17b having a trapezoidal cross-sectional shape that spreads upward in the same direction as the lens barrel 17a is provided. . A large number of LEDs 27 are embedded on the inclined surface of the recess 17b so as to incline inward.
The large number of LEDs 27 with different directions illuminate the bump 4 omnidirectionally and brightly illuminate the entire area of the spherical surface. If the bumps 4 are illuminated only from a certain direction, the image of the bumps 4 becomes ring-shaped or crescent-shaped, which is not appropriate because recognition cannot be performed accurately. Here, the halogen light source 25 and the optical fiber 26 correspond to a first light source, and the large number of LEDs 27 embedded in the recess 17b correspond to a second light source.
【００１６】第１の実施例の電子部品観察装置は、上記
のような構成よりなり、次に図３、図４を参照しなが
ら、電子部品観察方法について説明する。The electronic component observing apparatus of the first embodiment is constructed as described above, and an electronic component observing method will be described with reference to FIGS. 3 and 4.
【００１７】まず電子部品観察方法について説明する前
に、既知データについて述べる。移載するバンプ付電子
部品１の設計値は既に判別しており、図４（ａ）におけ
る基板部３の縦寸法Ｗ、横寸法Ｌ、バンプ４間のピッチ
Ｐ１，Ｐ２は既知データに含まれている。なお、バンプ
４の形成時に、基板部３に対してバンプ４がわずかに位
置ずれを生じていることがある。そして、これら既知デ
ータは、メモリ２０内に予め格納されている。Before explaining the electronic component observing method, known data will be described. The design value of the bumped electronic component 1 to be transferred has already been determined, and the vertical dimension W, the horizontal dimension L, and the pitches P1 and P2 between the bumps 4 in FIG. 4A are included in the known data. ing. The bumps 4 may be slightly displaced from the substrate 3 when the bumps 4 are formed. Then, these known data are stored in the memory 20 in advance.
【００１８】さて図３のステップ１において、ハロゲン
光源２５とＬＥＤ２７を点灯させ、バンプ付電子部品１
をピックアップした移載ヘッド６が、図２に示すよう
に、カメラ８の光軸上に至った時点で、カメラ８から画
像を取込む（ステップ２）。すると図４（ｂ）のよう
に、視野Ｖ内において背景板１６（明）、基板部３
（暗）、バンプ４（明）のコントラストを持った画像が
得られる。Now, in step 1 of FIG. 3, the halogen light source 25 and the LED 27 are turned on to turn on the bumped electronic component 1.
As shown in FIG. 2, the transfer head 6 picked up the image picks up an image from the camera 8 when it reaches the optical axis of the camera 8 (step 2). Then, as shown in FIG. 4B, the background plate 16 (bright) and the substrate portion 3 in the field of view V.
An image having a contrast of (dark) and bump 4 (bright) can be obtained.
【００１９】次にＣＰＵ１９は、基板部３の像Ｓ３と背
景板１６の像Ｓ１６の輪郭線を求め、例えばその左上角
点Ｑ１、右上角点Ｑ２を求めることにより、視野Ｖの座
標系における基板部３の位置を特定し、求めた位置をメ
モリ２０に一旦書込む（ステップ３）。この例では、従
来の技術の項で述べたように、基板部３自体が位置ずれ
を生じており、このとき上述のとおりバンプ４の位置を
正しく認識できない。Next, the CPU 19 obtains the contour lines of the image S3 of the substrate portion 3 and the image S16 of the background plate 16 and obtains, for example, the upper left corner point Q1 and the upper right corner point Q2 thereof, so as to obtain the substrate in the coordinate system of the visual field V. The position of the section 3 is specified, and the obtained position is once written in the memory 20 (step 3). In this example, as described in the section of the related art, the substrate portion 3 itself is displaced, and at this time, the position of the bump 4 cannot be correctly recognized as described above.
【００２０】次にＣＰＵ１９は、メモリ２０に格納して
ある上記既知データと、左上角点Ｑ１、右上角点Ｑ２の
座標から、設計上の各バンプ４の位置を計算で求める
（ステップ４）。図４（ｃ）における×印を付した位置
が求めた位置である。そしてこの位置を中心にしてサー
チエリアＳＡを設定し、サーチエリアＳＡ内にてパター
ンマッチングを行うことにより、実際のバンプ４の位置
を特定する（ステップ５）。ここで、バンプ４は必ず×
印を付した位置のすぐ近くに存在するので、サーチエリ
アＳＡは狭目に設定することができ、パターンマッチン
グにおける計算量を非常に少なくすることができ、迅速
に正しいバンプ４の位置を特定できる。Next, the CPU 19 calculates the position of each bump 4 in the design from the known data stored in the memory 20 and the coordinates of the upper left corner Q1 and the upper right corner Q2 (step 4). The position marked with x in FIG. 4C is the obtained position. Then, the search area SA is set around this position, and pattern matching is performed in the search area SA to specify the actual position of the bump 4 (step 5). Here, the bump 4 is always ×
Since the search area SA exists in the immediate vicinity of the marked position, the search area SA can be set narrowly, the amount of calculation in the pattern matching can be extremely reduced, and the correct bump 4 position can be specified quickly. .
【００２１】そしてＣＰＵ１９は、求めた実際のバンプ
４の位置を一旦メモリ２０に格納し、次にこのバンプ４
の位置に基づいてバンプ付電子部品１の位置を計算し
（ステップ６）、主制御部２３に結果を出力する。する
と、主制御部２３は、バンプ４が回路基板１５の回路パ
ターンに合うように移載ヘッド駆動部２４をコントロー
ルし、バンプ付電子部品１が回路基板１５上に正しく移
載される。ここで、回路基板１５の回路パターンと電気
的に接続されるのは、バンプ４であるのでバンプ４を基
準に位置補正を行っている。なおこのとき基板部３のみ
が回路基板１５上において位置ずれを生じていてもそれ
はさして重要でない。Then, the CPU 19 temporarily stores the obtained actual position of the bump 4 in the memory 20, and then the bump 4
The position of the bumped electronic component 1 is calculated based on the position (step 6), and the result is output to the main controller 23. Then, the main control unit 23 controls the transfer head drive unit 24 so that the bumps 4 match the circuit pattern of the circuit board 15, so that the bumped electronic component 1 is correctly transferred onto the circuit board 15. Here, since it is the bumps 4 that are electrically connected to the circuit pattern of the circuit board 15, the position correction is performed based on the bumps 4. At this time, even if only the board portion 3 is displaced on the circuit board 15, it is not so important.
【００２２】またバンプ付電子部品１の位置を計算する
方法としては、全てのバンプ４の位置に基づいて算出す
る方法と、代表的な少数のバンプ４（例えば外周のバン
プ４や角部に位置するバンプ）の位置に基づいて計算す
る方法がある。前者は、全てのバンプ４の位置を特定す
るので処理時間が長くなるが、バンプ４の有無の検査を
同時に行って良品のバンプ付電子部品１のみ基板へ実装
するので、信頼性の高いバンプ付電子部品１の実装が実
現できる。一方後者の方法は、処理時間が短くなるの
で、バンプ付電子部品１の実装タクトを短縮して生産性
を高めることができる。本実施例の電子部品観察装置で
は、２つの方法を選択できるようにするか、どちらか１
つの方法だけを使用するかは自由である。As a method of calculating the position of the bumped electronic component 1, a method of calculating it based on the positions of all the bumps 4 and a representative small number of bumps 4 (for example, the bumps 4 on the outer periphery and the positions at the corners) are used. There is a method of calculating based on the position of the bump). The former requires a long processing time because it specifies the positions of all the bumps 4, but since the inspection for the presence of the bumps 4 is performed at the same time and only the good electronic components with bumps 1 are mounted on the substrate, the bumps with high reliability are provided. Mounting of the electronic component 1 can be realized. On the other hand, in the latter method, since the processing time is shortened, the mounting tact of the electronic component 1 with bumps can be shortened and the productivity can be improved. In the electronic component observation apparatus of this embodiment, either one of two methods can be selected, or one of them can be selected.
You are free to use only one method.
【００２３】図５は本発明の第２の実施例における電子
部品観察装置の要部側面図である。第２の実施例では、
１つの光源３０を用いており、カメラ８の光軸中にハー
フミラー３１を設けることにより光源３０から照射され
た光を背景板１６とバンプ４の両方に照射するようにな
っている。この第２の実施例の場合も第１の実施例の場
合と同様な画像をカメラ８で得ることができる。FIG. 5 is a side view of the essential parts of an electronic component observation apparatus according to the second embodiment of the present invention. In the second embodiment,
One light source 30 is used, and a half mirror 31 is provided in the optical axis of the camera 8 so that the light emitted from the light source 30 is emitted to both the background plate 16 and the bumps 4. Also in the case of the second embodiment, the same image as in the case of the first embodiment can be obtained by the camera 8.
【００２４】[0024]
【発明の効果】本発明の電子部品観察装置は、バンプ付
電子部品を観察するカメラと、背景板を明るく照らす第
１の光源と、バンプを明るく照らす第２の光源とを有す
るので、バンプ付電子部品以外、基板部とバンプそれぞ
れを明瞭に区別することができ、バンプ付電子部品の位
置関係を正確に知ることができる。The electronic component observing apparatus of the present invention has a camera for observing electronic components with bumps, a first light source for brightly illuminating the background plate, and a second light source for brightly illuminating the bumps. Other than the electronic component, the substrate portion and the bump can be clearly distinguished from each other, and the positional relationship of the bumped electronic component can be accurately known.
【図１】本発明の第１の実施例における電子部品観察装
置の全体構成図FIG. 1 is an overall configuration diagram of an electronic component observation device according to a first embodiment of the present invention.
【図２】本発明の第１の実施例における電子部品観察装
置の要部側面図FIG. 2 is a side view of an essential part of the electronic component observation apparatus according to the first embodiment of the present invention.
【図３】本発明の第１の実施例における電子部品観察装
置のフローチャートFIG. 3 is a flowchart of the electronic component observation apparatus in the first embodiment of the present invention.
【図４】（ａ）本発明の第１の実施例における電子部品
観察方法の工程説明図 （ｂ）本発明の第１の実施例における電子部品観察方法
の工程説明図 （ｃ）本発明の第１の実施例における電子部品観察方法
の工程説明図FIG. 4A is a process explanatory diagram of an electronic component observing method according to the first embodiment of the present invention. FIG. 4B is a process explanatory diagram of an electronic component observing method according to the first embodiment of the present invention. Process explanatory drawing of the electronic component observation method in a 1st Example
【図５】本発明の第２の実施例における電子部品観察装
置の要部側面図FIG. 5 is a side view of an essential part of an electronic component observation device according to a second embodiment of the present invention.
【図６】従来の電子部品観察装置の側面図FIG. 6 is a side view of a conventional electronic component observation apparatus.
【図７】従来の電子部品観察装置による像の例示図FIG. 7 is an exemplary view of an image by a conventional electronic component observation apparatus.
１ バンプ付電子部品 ２ 本体部 ３ 基板部 ４ バンプ ８ カメラ １６ 背景板 ２５ ハロゲン光源 ２６ 光ファイバ ２７ ＬＥＤ 1 Electronic Component with Bump 2 Main Body 3 Substrate 4 Bump 8 Camera 16 Background Plate 25 Halogen Light Source 26 Optical Fiber 27 LED
───────────────────────────────────────────────────── フロントページの続き (72)発明者 後藤 峰彦 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Minehiko Goto 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (4)
基板部と、前記基板部の下面に複数設けられた略球体状
のバンプとを備えるバンプ付電子部品を、このバンプ付
電子部品の背後に背景板を位置させた状態で観察する電
子部品観察装置であって、 前記バンプ付電子部品を観察するカメラと、前記背景板
を明るく照らす第１の光源と、前記バンプを明るく照ら
す第２の光源とを有することを特徴とする電子部品観察
装置。1. A bump-equipped electronic component comprising a main body portion, a substrate portion provided on the lower surface of the main body portion, and a plurality of substantially spherical bumps provided on the lower surface of the substrate portion. An electronic component observation device for observing a background plate positioned behind a component, the camera observing the electronic component with bumps, a first light source for brightly illuminating the background plate, and brightly illuminating the bumps. An electronic component observation apparatus having a second light source.
イバを接続してなることを特徴とする請求項１記載の電
子部品観察装置。2. The electronic component observing apparatus according to claim 1, wherein the first light source is formed by connecting an optical fiber to a halogen light source.
に照らすように多数設けられたＬＥＤを含むことを特徴
とする請求項１記載の電子部品観察装置。3. The electronic component observing apparatus according to claim 1, wherein the second light source includes a large number of LEDs provided so as to illuminate the bump non-directionally.
基板部と、前記基板部の下面に複数設けられた略球体状
のバンプとを備えるバンプ付電子部品のバンプを明るく
照らすと共に、このバンプ付電子部品の背後に設けた背
景板を明るく照らした状態で、前記背景板の像も含めて
前記バンプ付電子部品の画像を取込むステップと、 前記背景板の像に対して浮かび上がる前記基板部の位置
を検出するステップと、 検出した前記基板部の位置から前記バンプが存在し得る
位置を含むサーチエリアを決定するステップと、 前記サーチエリア内で前記バンプの位置を特定するステ
ップとを含むことを特徴とする電子部品観察方法。4. A bump of an electronic component with a bump, comprising: a main body portion, a substrate portion provided on the lower surface of the main body portion, and a plurality of substantially spherical bumps provided on the lower surface of the substrate portion. A step of capturing an image of the electronic component with bumps including the image of the background plate in a state where the background plate provided behind the electronic component with bumps is brightly illuminated, and floating on the image of the background plate. Detecting the position of the raised substrate portion, determining a search area including the position where the bump may exist from the detected position of the substrate portion, and specifying the position of the bump within the search area An electronic component observing method comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6292939A JP3006437B2 (en) | 1994-11-28 | 1994-11-28 | Electronic component observation device and electronic component observation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6292939A JP3006437B2 (en) | 1994-11-28 | 1994-11-28 | Electronic component observation device and electronic component observation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08153997A true JPH08153997A (en) | 1996-06-11 |
| JP3006437B2 JP3006437B2 (en) | 2000-02-07 |
Family
ID=17788376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6292939A Expired - Fee Related JP3006437B2 (en) | 1994-11-28 | 1994-11-28 | Electronic component observation device and electronic component observation method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3006437B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7089656B2 (en) | 2002-12-03 | 2006-08-15 | Matsushita Electric Industrial Co., Ltd. | Electric parts mounting apparatus |
-
1994
- 1994-11-28 JP JP6292939A patent/JP3006437B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7089656B2 (en) | 2002-12-03 | 2006-08-15 | Matsushita Electric Industrial Co., Ltd. | Electric parts mounting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3006437B2 (en) | 2000-02-07 |
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