JPH08150487A - Deposition device - Google Patents
Deposition deviceInfo
- Publication number
- JPH08150487A JPH08150487A JP6316074A JP31607494A JPH08150487A JP H08150487 A JPH08150487 A JP H08150487A JP 6316074 A JP6316074 A JP 6316074A JP 31607494 A JP31607494 A JP 31607494A JP H08150487 A JPH08150487 A JP H08150487A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- repaired
- deposit material
- laser
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はデポジション装置、詳
しくは各種電子部品や素子における導体部分あるいは絶
縁体部分に生じた欠落箇所を補修する装置であるデポジ
ション装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a deposition device, and more particularly to a deposition device which is a device for repairing a missing portion formed in a conductor portion or an insulator portion of various electronic parts and elements.
【０００２】[0002]
【従来の技術】半導体、半導体用フォトマスク、液晶表
示パネル（ＬＣＤ）、ＬＣＤカラーフィルター、ハイブ
リットＩＣ等各種電子素子や部品の製造においては、こ
れら素子や部品の表面に形成されている導体部分や絶縁
体部分に欠落箇所が発生することがあり、そのままでは
不良品となってしまう為、補修する必要が生じる。な
お、図１は導体部分１４に欠落箇所１５が生じている半
導体素子の回路部分の拡大平面図、図４は欠落箇所１５
を更に拡大した拡大平面図である。この欠落箇所１５の
補修は単純に、導電材料や塗料、マスキング材料等各種
デポジット材料（修復材）を欠落箇所１５に塗布した
り、スプレーして行う場合もあるが、微細な加工処理を
要する精密な素子や部品においては、フォーカスイオン
ビーム法、スパツター法、レーザーケミカルベーパーデ
ポジション（ＬＣＶＤ）法等が用いられている。2. Description of the Related Art In the manufacture of various electronic elements and parts such as semiconductors, photomasks for semiconductors, liquid crystal display panels (LCD), LCD color filters, and hybrid ICs, conductor parts formed on the surfaces of these elements and parts In some cases, a missing part may occur in the insulator part, and it will be a defective product as it is, so it will be necessary to repair it. 1 is an enlarged plan view of the circuit portion of the semiconductor element in which the conductor portion 14 has a missing portion 15, and FIG.
It is the expansion top view which further expanded. The repair of the missing portion 15 may be performed by simply coating or spraying various deposit materials (restorative material) such as a conductive material, a paint, and a masking material on the missing portion 15, but it is necessary to perform fine processing treatments. For such elements and parts, a focus ion beam method, a sputter method, a laser chemical vapor deposition (LCVD) method and the like are used.
【０００３】[0003]
【発明が解決しようとする課題】これら、いずれの方法
も真空環境下で行われなければならない為、真空チャン
バーと真空ポンプを必要とし、装置自体も複雑、大型に
ならざろう得ず、実際の補修作業に先立って、真空引き
などかなり長い立ち上げの時間を必要とし、作業能率も
良くなかった。Since any of these methods must be performed in a vacuum environment, a vacuum chamber and a vacuum pump are required, and the apparatus itself cannot be complicated or large. Prior to the repair work, it took a considerably long time to start up such as vacuuming, and the work efficiency was not good.
【０００４】この発明は、各種電子素子や部品における
導体部分あるいは絶縁体部分の欠落箇所１５の補修作業
における上記問題点を解決し、真空チャンバーを必要と
せず、極めて簡単かつ短時間で、欠落箇所１５のデンポ
ジション（補修）を行うことができる新規なデンポジシ
ョン装置を提供せんとするものである。The present invention solves the above problems in the repair work of the missing portion 15 of the conductor portion or the insulator portion in various electronic elements and parts, does not require a vacuum chamber, and is extremely simple and in a short time. It is intended to provide a new denposition device capable of performing 15 denpositions (repairs).
【０００５】[0005]
【課題を解決するための手段】この発明は、パルス波レ
ーザービームを発生させるレーザーユニット１の光軸線
上にレーザービーム幅を可変調整する絞り装置２、前記
絞り装置２を通過したレーザービームを集束させる対物
レンズ５をそれぞれ直列に位置させると共に、前記対物
レンズ５から空間を隔てて、直交するＸ軸方向、Ｙ軸方
向にそれぞれ移動可能な架台６を位置させ、該架台６上
には被補修物品１２の補修すべき欠落箇所をレーザーユ
ニット１側に向けて載置できる様にし、更に、前記対物
レンズ５の焦点位置付近にレーザービーム透過性の板状
あるいはテープ状をなしたデポジット材料保持部材１０
を位置させ、該デポジット材料保持部材１０の裏面側に
被膜状をしたデポジット材料１１を付着せしめ、前記架
台６をＸ軸方向、Ｙ軸方向に移動させることにより補修
すべき欠落箇所をレーザービームの照射位置に一致さ
せ、パルス状レーザービームを照射することにより、デ
ポジット材料１１を被補修物品の欠落箇所に転写融着で
きる様にして、上記課題を解決せんとするものである。According to the present invention, a diaphragm device 2 for variably adjusting a laser beam width on an optical axis of a laser unit 1 for generating a pulse wave laser beam, and a laser beam passing through the diaphragm device 2 are focused. The objective lenses 5 to be arranged are respectively arranged in series, and a pedestal 6 which is movable in the X-axis direction and the Y-axis direction orthogonal to each other is arranged with a space from the objective lens 5, and the pedestal 6 is to be repaired. A deposit material holding member in the form of a plate or tape permeable to a laser beam is provided in the vicinity of the focal position of the objective lens 5 so that the missing portion of the article 12 to be repaired can be placed toward the laser unit 1 side. 10
Position, the deposit material 11 in the form of a film is attached to the back surface side of the deposit material holding member 10, and the pedestal 6 is moved in the X-axis direction and the Y-axis direction to detect the missing portion of the laser beam. The above problem is solved by making it possible to transfer and fuse the deposit material 11 to the missing portion of the article to be repaired by aligning the irradiation position with the irradiation of the pulsed laser beam.
【０００７】[0007]
【作用】補修すべき欠落箇所１５の存在する被補修物品
１２を架台６の被補修物品載置部９に固定し、その補修
すべき欠落箇所１５をレーザービーム１３の照射位置に
一致させた後、レーザーユニット１を駆動してパルス波
レーザーを発生させると、レーザービーム１３は絞り装
置２によって所望の幅に絞り込まれ、露光範囲が調整さ
れ、更に対物レンズ５で屈折せしめられて、デポジット
材料保持部材１０を透過してデポジット材料１１に到達
する。デポジット材料１１にパルス状のレーザービーム
１３が到達すると、デポジット材料１１はレーザービー
ム１３のエネルギーにより瞬間的に蒸発、拡散し、被補
修物品１２の欠落箇所１５に衝突した後、再び固化し、
図５に示す様に欠落箇所１５を埋めることになり、補修
作業は完了する。After the repaired article 12 having the missing portion 15 to be repaired is fixed to the repaired article placement portion 9 of the pedestal 6 and the missing portion 15 to be repaired is aligned with the irradiation position of the laser beam 13. When the laser unit 1 is driven to generate a pulse wave laser, the laser beam 13 is narrowed down to a desired width by the diaphragm device 2, the exposure range is adjusted, and further refracted by the objective lens 5 to hold the deposit material. It passes through the member 10 and reaches the deposit material 11. When the pulsed laser beam 13 reaches the deposit material 11, the deposit material 11 instantaneously evaporates and diffuses due to the energy of the laser beam 13, collides with the missing portion 15 of the article 12 to be repaired, and then solidifies again.
As shown in FIG. 5, the missing portion 15 is filled, and the repair work is completed.
【０００８】[0008]
【実施例】図２はこの発明に係るデポジション装置の一
実施例の斜視図、図３はこれを模式的に描いた側面図で
ある。図中１はパルス波レーザービームを発生させるレ
ーザーユニットであり、該レーザーユニット１の発生す
るレーザービームの光軸線上にはレーザービーム幅を可
変調節し、その露光範囲を任意に調整する絞り装置２が
位置せしめられている。この絞り装置２は直交するＸ軸
方向、Ｙ軸方向へモーター駆動によりスライドするスリ
ット３ａ、３ｂ及び４ａ、４ｂから構成されている。更
に、その下方の光軸線上にはレーザービームを集束さ
せ、下記するデポジット材料１１の位置付近に焦点を合
せる対物レンズ５が位置せしめられている。レーザービ
ームとしては波長１，０７０〜１，０５０ナノメータ
ー、パルス巾７〜１０ナノ秒の赤外線レーザー、波長４
８０〜５５０ナノメーター、パルス巾５〜６ナノ秒のグ
リーンレーザー、波長３０８〜３６０ナノメーター、パ
ルス巾３〜５ナノ秒のＵＶ／ＹＡＧレーザー等が好適に
使用される。又、この対物レンズ５は使用するレーザー
に応じ、その波長に対し透過率の良いものを使用する。FIG. 2 is a perspective view of an embodiment of the deposition apparatus according to the present invention, and FIG. 3 is a side view schematically showing the same. In the figure, reference numeral 1 denotes a laser unit for generating a pulse wave laser beam, and a diaphragm device 2 for variably adjusting the laser beam width on the optical axis of the laser beam generated by the laser unit 1 and arbitrarily adjusting its exposure range. Is located. The diaphragm device 2 is composed of slits 3a, 3b and 4a, 4b which are slid by a motor in the X-axis direction and the Y-axis direction which are orthogonal to each other. Further, an objective lens 5 for focusing a laser beam and focusing it near the position of the deposit material 11 described below is positioned on the optical axis below the optical axis. As a laser beam, an infrared laser having a wavelength of 1,070 to 1,050 nanometers, a pulse width of 7 to 10 nanoseconds, and a wavelength of 4
A green laser having a pulse width of 80 to 550 nanometers and a pulse width of 5 to 6 nanoseconds, a UV / YAG laser having a wavelength of 308 to 360 nanometers and a pulse width of 3 to 5 nanoseconds are preferably used. Further, the objective lens 5 has a high transmittance for the wavelength depending on the laser used.
【０００９】一方、６は前記対物レンズ５から空間を隔
てて設置されている架台であり、直交するＸ軸方向、Ｙ
軸方向にスライド可能なモーター駆動のＸ軸ステージ７
及びＹ軸ステージ８を具備し、その上面には被補修物品
載置部９が設けられている。又、１０は前記対物レンズ
５の焦点位置に位置せしめられたデポジット材料保持部
材であり、この実施例においては、使用するレーザーの
波長の透過率の良いガラス板を用いたが、透過率が良好
であればフィルムやテープ状をなしたものを用いても良
い。このテポジット材料保持部材１０の裏面、即ち架台
６側にはデポジット材料１１が付着せしめられている。
デポジット材料１１は被補正物品１２の欠落箇所１５が
導電部分の場合にはアルミニューム、クローム、銅など
の導電材料、欠落箇所が絶縁部分の場合にはエポキシ系
有機溶剤、アクリル系有機溶剤などが好適に用いられ
る。On the other hand, 6 is a pedestal which is installed with a space from the objective lens 5, and which is orthogonal to the X-axis direction, Y.
Motor driven X-axis stage 7 that can slide axially
And a Y-axis stage 8, and an article mounting portion 9 to be repaired is provided on the upper surface thereof. Further, 10 is a deposit material holding member positioned at the focal position of the objective lens 5. In this embodiment, a glass plate having a good transmittance of the wavelength of the laser used is used, but the transmittance is good. In that case, a film or tape may be used. A deposit material 11 is attached to the back surface of the deposit material holding member 10, that is, the gantry 6 side.
The deposit material 11 is made of a conductive material such as aluminum, chrome or copper when the missing portion 15 of the article to be corrected 12 is a conductive portion, and an epoxy organic solvent or an acrylic organic solvent when the missing portion 15 is an insulating portion. It is preferably used.
【００１０】このデポジット材料１１のデポジット材料
保持部材１０への付着は、塗布、印刷、現像定着等、公
知の手段で行われる。１２は被補修物品であり、補修す
べき欠落箇所１５を上方即ちデポジット材料１１側を向
けて被補修物品載置部９上に位置せしめられており、Ｘ
軸ステージ７、Ｙ軸ステージ８を調整することにより、
その欠落箇所を正確にレーザービーム照射位置に合致さ
せることができる様になっている。The deposit material 11 is attached to the deposit material holding member 10 by a known means such as coating, printing, developing and fixing. Reference numeral 12 denotes an article to be repaired, which is located on the article mounting portion 9 to be repaired with the missing portion 15 to be repaired facing upward, that is, the deposit material 11 side.
By adjusting the axis stage 7 and the Y-axis stage 8,
The missing portion can be accurately matched to the laser beam irradiation position.
【００１１】なお、この実施例においてはデポジット材
料１１の下面と被補修物品１２の上面との間には１０〜
１００ミクロン程度の空隙Ｇを設けているが、使用条件
によっては密着させても良い。In this embodiment, 10 to 10 are provided between the lower surface of the deposit material 11 and the upper surface of the article 12 to be repaired.
Although the gap G of about 100 μm is provided, it may be closely attached depending on the usage conditions.
【００１２】次に、このデンポジション装置の動作を説
明する。補修すべき欠落箇所１５の存在する被補修物品
１２を架台６の被補修物品載置部９に固定し、その補修
すべき欠落箇所１５をレーザービーム１３の照射位置に
一致させた後、レーザーユニット１を駆動してパルス波
レーザーを発生させると、レーザービーム１３は絞り装
置２によって所望の幅に絞り込まれ、更に対物レンズ５
で屈折せしめられて、デポジット材料保持部材１０を透
過してデポジット材料１１に到達する。デポジット材料
１１にパルス状のレーザービーム１３が到達すると、デ
ポジット材料１１はレーザービーム１３のエネルギーに
より瞬間的に蒸発、拡散し、被補修物品１２の欠落箇所
１５に衝突した後、再び固化し、図５に示す様に、欠落
箇所１５を埋めることになり、補修作業は完了する。Next, the operation of this denposition device will be described. After fixing the article to be repaired 12 having the missing portion 15 to be repaired to the article mounting part 9 to be repaired of the gantry 6 and aligning the missing portion 15 to be repaired with the irradiation position of the laser beam 13, the laser unit When 1 is driven to generate a pulse wave laser, the laser beam 13 is narrowed down to a desired width by the diaphragm device 2, and the objective lens 5
It is refracted by and is transmitted through the deposit material holding member 10 to reach the deposit material 11. When the pulsed laser beam 13 reaches the deposit material 11, the deposit material 11 instantaneously evaporates and diffuses due to the energy of the laser beam 13, collides with the missing portion 15 of the article 12 to be repaired, and then solidifies again. As shown in FIG. 5, the missing portion 15 is filled, and the repair work is completed.
【００１３】なお、このデポジット装置においては絞り
装置２が設けられているので、使用レーザーの波長、出
力、パルス幅、デポジット材料等に応じてレーザービー
ムの幅を調節し、露光範囲、即ちデポジションできる面
積を変えることができる。Since the depositing device is provided with the diaphragm device 2, the width of the laser beam is adjusted according to the wavelength of the laser used, the output, the pulse width, the deposit material, etc. You can change the available area.
【００１４】[0014]
【発明の効果】この発明は上述の通りの構成を有するも
のであり、従来のものの様に真空チャンバー等を全く必
要とせず、大気中で簡単、迅速にデポジションが可能で
あり、極めて実用的なものである。EFFECTS OF THE INVENTION The present invention has the above-described structure, does not require a vacuum chamber or the like unlike the conventional one, and allows simple and quick deposition in the atmosphere, which is extremely practical. It is something.
【００１５】[0015]
【図１】補修すべき欠落箇所１５を有する半導体素子の
回路部分基板の一例の拡大平面図。FIG. 1 is an enlarged plan view of an example of a circuit partial substrate of a semiconductor element having a missing portion 15 to be repaired.
【図２】この発明に係るデポジション装置の一実施例の
斜視図。FIG. 2 is a perspective view of an embodiment of the deposition apparatus according to the present invention.
【図３】模式的に描いた一実施例の側面図。FIG. 3 is a side view of an example schematically drawn.
【図４】半導体素子における欠落箇所の拡大平面図。FIG. 4 is an enlarged plan view of a missing portion in a semiconductor element.
【図５】デポジションを行った状態の半導体素子の拡大
平面図。FIG. 5 is an enlarged plan view of the semiconductor element in a state where deposition is performed.
１ レーザーユニット ２ 絞り装置 ３ａ，３ｂ スリット ４ａ，４ｂ スリット ５ 対物レンズ ６ 架台 ７ Ｘ軸ステージ ８ Ｙ軸ステージ ９ 被補修物品載置部 １０ デポジット材料保持部材 １１ デポジット材料 １２ 被補修物品 １３ レーザービーム １４ 導体部分 １５ 欠落箇所 1 Laser Unit 2 Aperture Device 3a, 3b Slits 4a, 4b Slit 5 Objective Lens 6 Frame 7 X-axis Stage 8 Y-axis Stage 9 Repaired Article Placement Part 10 Deposit Material Holding Member 11 Deposit Material 12 Repaired Article 13 Laser Beam 14 Conductor part 15 Missing part
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/3205 Ｈ０１Ｓ 3/00 Ｂ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01L 21/3205 H01S 3/00 B
Claims (7)
ーザーユニット１の光軸線上にレーザービーム幅を可変
調整する絞り装置２、前記絞り装置２を通過したレーザ
ービームを集束させる対物レンズ５をそれぞれ直列に位
置させると共に、前記対物レンズ５から空間を隔てて、
直交するＸ軸方向、Ｙ軸方向にそれぞれ移動可能な架台
６を位置させ、該架台６上には被補修物品１２の補修す
べき欠落箇所をレーザーユニット１側に向けて載置でき
る様にし、更に、前記対物レンズ５の焦点位置付近にレ
ーザービーム透過性の板状あるいはテープ状をなしたデ
ポジット材料保持部材１０を位置させ、該デポジット材
料保持部材１０の裏面側に被膜状をしたデポジット材料
１１を付着せしめ、前記架台６をＸ軸方向、Ｙ軸方向に
移動させることにより補修すべき欠落箇所をレーザービ
ームの照射位置に一致させ、パルス状レーザービームを
照射することにより、デポジット材料１１を被補修物品
の欠落箇所に転写融着せしめる様にしたことを特徴とす
るデポジション装置。1. A diaphragm device 2 for variably adjusting a laser beam width on an optical axis of a laser unit 1 for generating a pulse wave laser beam, and an objective lens 5 for converging a laser beam passing through the diaphragm device 2 in series. While being positioned, with a space from the objective lens 5,
Positioning is a gantry 6 that is movable in the X-axis direction and the Y-axis direction that are orthogonal to each other, and a missing portion to be repaired of the article 12 to be repaired can be placed on the gantry 6 toward the laser unit 1 side. Further, a laser beam transparent plate-shaped or tape-shaped deposit material holding member 10 is positioned near the focal position of the objective lens 5, and a film-shaped deposit material 11 is provided on the back surface side of the deposit material holding member 10. Are adhered, the pedestal 6 is moved in the X-axis direction and the Y-axis direction to align the missing portion to be repaired with the irradiation position of the laser beam, and the pulsed laser beam is irradiated to cover the deposit material 11. A deposition device characterized in that it is designed to be fused by transfer onto a missing portion of a repaired article.
０５０ナノメーター、パルス巾が７〜１０ナノ秒の赤外
線レーザーであることを特徴とする請求項（１）記載の
デポジション装置。2. A laser beam having a wavelength of 1,070 to 1,
The deposition apparatus according to claim 1, which is an infrared laser having a pulse width of 7 to 10 nanoseconds and a wavelength of 050 nanometers.
ノメーター、パルス巾が５〜６ナノ秒のグリーンレーザ
ーであることを特徴とする請求項（１）記載のデポジシ
ョン装置。3. The deposition apparatus according to claim 1, wherein the laser beam is a green laser having a wavelength of 480 to 550 nanometers and a pulse width of 5 to 6 nanoseconds.
ノメーター、パルス巾が３〜５ナノ秒のＵＶ／ＹＡＧレ
ーザーであることを特徴とする請求項（１）記載のデポ
ジション装置。4. The deposition apparatus according to claim 1, wherein the laser beam is a UV / YAG laser having a wavelength of 308 to 360 nanometers and a pulse width of 3 to 5 nanoseconds.
あることを特徴とする請求項（１）記載のデポション装
置。5. The deposition device according to claim 1, wherein the deposit material 11 is aluminum.
１２の上面との間に１０〜１００ミクロン程度の空隙Ｇ
が設けられていることを特徴とする請求項（１）記載の
デポジション装置。6. A gap G of about 10 to 100 μm between the lower surface of the deposit material 11 and the upper surface of the article to be repaired 12.
The deposition apparatus according to claim 1, further comprising:
品１２の上面とが密着していることを特徴とする請求項
（１）記載のデポジション装置。7. The deposition apparatus according to claim 1, wherein the lower surface of the deposition material 11 and the upper surface of the article to be repaired 12 are in close contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6316074A JPH08150487A (en) | 1994-11-28 | 1994-11-28 | Deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6316074A JPH08150487A (en) | 1994-11-28 | 1994-11-28 | Deposition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08150487A true JPH08150487A (en) | 1996-06-11 |
Family
ID=18072972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6316074A Pending JPH08150487A (en) | 1994-11-28 | 1994-11-28 | Deposition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08150487A (en) |
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|---|---|---|---|---|
| JP2001023982A (en) * | 1999-06-30 | 2001-01-26 | Internatl Business Mach Corp <Ibm> | Electronic component and method of restoring defects of the same |
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| JP2008284559A (en) * | 2007-05-15 | 2008-11-27 | Toyota Motor Corp | Welding method |
| JP2011040765A (en) * | 2010-09-14 | 2011-02-24 | Au Optronics Corp | Defect repairing device for electronic component |
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| WO2020255497A1 (en) * | 2019-06-17 | 2020-12-24 | 東レエンジニアリング株式会社 | Laser processing device and method, and chip transferring device and method |
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-
1994
- 1994-11-28 JP JP6316074A patent/JPH08150487A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4653867B2 (en) * | 1999-06-30 | 2011-03-16 | エーユー オプトロニクス コーポレイション | Defect repair method for electronic components |
| US6436602B1 (en) | 1999-06-30 | 2002-08-20 | International Business Machines Corporation | Method of repairing a defective portion in an electronic device |
| US6809332B2 (en) | 1999-06-30 | 2004-10-26 | International Business Machines Corporation | Electronic device and defect repair method thereof |
| US7126232B2 (en) | 1999-06-30 | 2006-10-24 | Au Optronics Corporation | Defect repair apparatus for an electronic device |
| JP2001023982A (en) * | 1999-06-30 | 2001-01-26 | Internatl Business Mach Corp <Ibm> | Electronic component and method of restoring defects of the same |
| JP2008221237A (en) * | 2007-03-08 | 2008-09-25 | Olympus Corp | Laser beam machining apparatus |
| JP2008284559A (en) * | 2007-05-15 | 2008-11-27 | Toyota Motor Corp | Welding method |
| JP2011040765A (en) * | 2010-09-14 | 2011-02-24 | Au Optronics Corp | Defect repairing device for electronic component |
| CN109682985A (en) * | 2019-01-30 | 2019-04-26 | 南京迈塔光电科技有限公司 | A kind of micro Nano material transfer device and method |
| CN109682985B (en) * | 2019-01-30 | 2024-05-10 | 南京迈塔光电科技有限公司 | Micro-nano material transferring device and method |
| WO2020255497A1 (en) * | 2019-06-17 | 2020-12-24 | 東レエンジニアリング株式会社 | Laser processing device and method, and chip transferring device and method |
| CN114007803A (en) * | 2019-06-17 | 2022-02-01 | 东丽工程株式会社 | Laser processing device and method, chip transfer device and method |
| KR20220018980A (en) * | 2019-06-17 | 2022-02-15 | 토레이 엔지니어링 컴퍼니, 리미티드 | Laser processing apparatus and method, chip transfer apparatus and method |
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