JPH08148873A - Case body for electronic equipment - Google Patents
Case body for electronic equipmentInfo
- Publication number
- JPH08148873A JPH08148873A JP30543994A JP30543994A JPH08148873A JP H08148873 A JPH08148873 A JP H08148873A JP 30543994 A JP30543994 A JP 30543994A JP 30543994 A JP30543994 A JP 30543994A JP H08148873 A JPH08148873 A JP H08148873A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- resin layer
- core material
- thickness
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、軽量で、意匠性に優
れ、筐体内部の回路基板と接地をなし得る電子機器用筐
体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a casing for electronic equipment which is lightweight, has an excellent design, and can be grounded to a circuit board inside the casing.
【０００２】[0002]
【従来の技術】従来から、電子機器を収納する筐体は、
熱可塑性樹脂の射出成形により成形され、意匠的な外観
と電子回路基板等を実装する内部機構部とを合わせ備え
る成形体が使用されている。ところが近年電子機器にお
いては高密度化が著しく進んでおり、これらの電子機器
を収納する筐体に対しても、肉厚が薄く小型軽量である
ことが要求されている。また、種々の電子機器が多用さ
れるようになってきたため、電子機器から放出される電
磁波が周囲の、例えばＴＶ等の他の電子機器に妨害を及
ぼしたり、逆に周囲の他の電子機器の発生する電磁波に
より妨害を受け、誤動作するおそれが出てきた。2. Description of the Related Art Conventionally, a housing for housing electronic equipment has been
A molded body that is molded by injection molding of a thermoplastic resin and has a design appearance and an internal mechanism portion that mounts an electronic circuit board or the like is used. However, in recent years, the density of electronic devices has been remarkably increased, and it is required that the housings for these electronic devices are thin, small and lightweight. In addition, since various electronic devices have been widely used, electromagnetic waves emitted from the electronic devices may interfere with other electronic devices in the vicinity, such as a TV, or conversely, may interfere with other electronic devices in the vicinity. There is a risk of malfunction due to interference from the electromagnetic waves that are generated.
【０００３】このような電子機器の小型軽量化や、電磁
波による他の電子機器に対する妨害、他の電子機器の電
磁波による誤動作を防止するために、樹脂より機械的強
度が大きく、電磁波シールド性のある接着性樹脂層を有
する金属板が筐体として使用されはじめている。即ち、
図１に示すように、金属板１の片面に接着剤層２を設け
たラミネート板を、プレス加工により接着剤層２が内側
になるように所定の筐体外殻形状に成形した後、その外
殻成形体を射出成形用金型内に装着し、スペーサ３a 、
突出台３b 等の内部機構部３を一体に形成し、回路基板
４に回路部品５を実装し、回路基板４をネジ７で突出台
３b に取り付け、さらに分割片結合用ネジ６で一体にし
た電子機器用筐体である。In order to reduce the size and weight of such electronic equipment, prevent interference with other electronic equipment due to electromagnetic waves, and prevent malfunction of other electronic equipment due to electromagnetic waves, it has greater mechanical strength than resin and electromagnetic wave shielding properties. A metal plate having an adhesive resin layer has begun to be used as a housing. That is,
As shown in FIG. 1, a laminated plate having an adhesive layer 2 provided on one surface of a metal plate 1 is formed into a predetermined casing outer shell shape by press working so that the adhesive layer 2 is on the inside, The shell molded body is mounted in the injection molding die, and the spacer 3a,
The internal mechanism portion 3 such as the protruding table 3b is integrally formed, the circuit component 5 is mounted on the circuit board 4, the circuit board 4 is attached to the protruding table 3b with the screw 7, and further integrated with the split piece connecting screw 6. It is a housing for electronic devices.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、前記の
筐体の場合には、電子機器のノイズを低減させるため
に、電子回路基板４のシールド層を金属外殻１に接地し
ようとすれば、内部機構部３と金属外殻１との間には絶
縁物である接着剤層２が介在しており、この接着剤層２
を削りとり金属外殻１の内表面を露出させる等の作業が
必要となる。この作業をしないためには、図２に示すよ
うに金属外殻１の外面に電子回路基板４の接地リード線
８を接続することが考えられるが、このような接地リー
ド線８が金属外殻１の外面まで延長されることは外観上
好ましくない。また、図３に示すように筐体の 2分割構
成の分割面において、各分割片の開口縁部に内フランジ
９を設け、この内フランジ９において金属外殻を上面に
位置させ、この上面に接地リード線８を接続すれば上記
の外観上の問題は解決される。しかし、この場合には内
フランジ部９が成形体としてアンダーカット状となるた
め、加工が面倒でありコスト高となる欠点があった。However, in the case of the above-mentioned housing, if the shield layer of the electronic circuit board 4 is grounded to the metal outer shell 1 in order to reduce the noise of the electronic equipment, the internal An adhesive layer 2 which is an insulator is interposed between the mechanism section 3 and the metal outer shell 1.
It is necessary to perform work such as scraping off the metal to expose the inner surface of the metal outer shell 1. In order to avoid this work, it is conceivable to connect the ground lead wire 8 of the electronic circuit board 4 to the outer surface of the metal outer shell 1 as shown in FIG. Extending to the outer surface of No. 1 is not preferable in appearance. In addition, as shown in FIG. 3, an inner flange 9 is provided at the opening edge of each divided piece on the split surface of the two-part configuration of the housing, and the metal outer shell is positioned on the upper surface of this inner flange 9, If the ground lead wire 8 is connected, the above-mentioned appearance problem is solved. However, in this case, since the inner flange portion 9 has an undercut shape as a molded body, there is a drawback that the processing is troublesome and the cost is high.
【０００５】本発明は、上記の欠点を解消するためにな
されたもので、金属外殻と合成樹脂製の内部機構部とを
接着剤層を介して一体化させてなる筐体において、薄く
軽量、かつ強度が大きく、特別な加工を施すことなく、
また意匠性に優れ、筐体内に実装した回路基板の接地を
なし得る電子機器用筐体を提供しようとするものであ
る。The present invention has been made in order to solve the above-mentioned drawbacks, and is a thin and lightweight housing in which a metal outer shell and an internal mechanical portion made of synthetic resin are integrated through an adhesive layer. , And has high strength, without any special processing,
Another object of the present invention is to provide a housing for electronic equipment which is excellent in design and can ground the circuit board mounted in the housing.
【０００６】[0006]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、接着性合成樹脂
層を芯材を含まない特定厚さとし、内部機構部を一体に
成形する熱可塑性樹脂中に導電性充填材を含有させるこ
とによって、上記の目的が達成できることを見いだし、
本発明を完成したものである。As a result of intensive studies to achieve the above-mentioned object, the present inventor has made an adhesive synthetic resin layer a specific thickness not including a core material, and integrally molding an internal mechanism portion. By including a conductive filler in the thermoplastic resin to be found, it is found that the above objects can be achieved,
The present invention has been completed.
【０００７】即ち、本発明は、金属板の片面に接着性合
成樹脂層を設けたラミネート板が、接着性合成樹脂層を
内側にするように筐体外殻形状に成形され、前記合成樹
脂層上に熱可塑性樹脂で内部機構部を一体に形成されて
いる電子機器用筐体であって、前記接着性合成樹脂層が
厚さ 100μm 以下で芯材を含まないものからなり、ま
た、前記熱可塑性樹脂が導電性充填材を含有したもので
あることを特徴とする電子機器用筐体である。That is, according to the present invention, a laminate plate in which an adhesive synthetic resin layer is provided on one surface of a metal plate is formed in a casing outer shell shape so that the adhesive synthetic resin layer is inside, and on the synthetic resin layer. A housing for an electronic device in which an internal mechanical part is integrally formed of a thermoplastic resin, wherein the adhesive synthetic resin layer has a thickness of 100 μm or less and does not include a core material. A housing for an electronic device, wherein the resin contains a conductive filler.
【０００８】以下、本発明について説明する。The present invention will be described below.
【０００９】本発明の筐体を使用する電子機器として
は、ワープロ、パソコン等のＯＡ機器、小型テレビ、ポ
ケベル等の携帯用情報機器、さらにはＩＣカード、ＰＣ
カード、電卓等のカード状機器など、広く半導体装置を
含む機器を指している。The electronic equipment using the housing of the present invention includes office automation equipment such as word processors and personal computers, portable information equipment such as small televisions and pagers, and IC cards and PCs.
It generally refers to devices including semiconductor devices, such as card-shaped devices such as cards and calculators.
【００１０】本発明における外殻成形体を構成するラミ
ネート板は、金属板の片面に接着性合成樹脂層を設けた
ものである。金属板としては、軽量で加工性の優れたス
テンレス鋼、アルミニウムや亜鉛合金、マグネシウム合
金等からなる厚さ 0.1〜 2.0mmの板状体を使用すること
ができる。The laminated plate constituting the outer shell molded body in the present invention is a metal plate provided with an adhesive synthetic resin layer on one surface. As the metal plate, a plate-like body having a thickness of 0.1 to 2.0 mm and made of stainless steel, aluminum, zinc alloy, magnesium alloy or the like which is lightweight and has excellent workability can be used.
【００１１】接着性合成樹脂層の合成樹脂としては、前
記の金属板との接着性に優れ、かつ内部機構部を構成す
る熱可塑性樹脂とも良好な接着を有するポリオレフィン
系、アクリル系、エポキシ系、酢酸ビニル系の樹脂を使
用することができる。例えば、内部機構部を構成する熱
可塑性樹脂がポリスチレン樹脂、ＡＢＳ樹脂を用いる場
合は、ポリオレフィン系、アクリル系、エポキシ系の合
成樹脂を、また、内部機構部を構成する熱可塑性樹脂が
ポリプロピレン樹脂を用いる場合には、アクリル系、酢
酸ビニル系の合成樹脂を使用することができる。この接
着性合成樹脂層の厚さは、100 μm 以下であることが望
ましい。100 μm を超えると熱可塑性樹脂に含有された
導電性充填材が、接着性合成樹脂層を突き破れず金属板
との導通が得られず好ましくない。接着性合成樹脂層
は、不織布等の芯材を含まないものであることが望まし
い。芯材を含むと導電性充填材が接着性合成樹脂層を突
き破れず金属板との導通が得られず好ましくない。この
接着性合成樹脂層は、金属板の片面に形成させる方法に
ついて特に限定するものでなく、100 μm 以下の厚さが
得られるものであればいかなる方法でもよい。例えば、
押出しラミネート法、熱プレスや熱ロール等で貼着する
等の方法があげられる。As the synthetic resin of the adhesive synthetic resin layer, a polyolefin-based resin, an acrylic resin, an epoxy resin, which has excellent adhesiveness to the above-mentioned metal plate and also has good adhesiveness to the thermoplastic resin constituting the internal mechanism portion, A vinyl acetate resin can be used. For example, when the thermoplastic resin forming the internal mechanism section is polystyrene resin or ABS resin, a polyolefin-based, acrylic-based, or epoxy-based synthetic resin is used, and the thermoplastic resin forming the internal mechanism section is a polypropylene resin. When used, an acrylic or vinyl acetate synthetic resin can be used. The thickness of the adhesive synthetic resin layer is preferably 100 μm or less. If the thickness exceeds 100 μm, the conductive filler contained in the thermoplastic resin does not break through the adhesive synthetic resin layer and electrical continuity with the metal plate cannot be obtained, which is not preferable. It is desirable that the adhesive synthetic resin layer does not include a core material such as a nonwoven fabric. When the core material is included, the conductive filler does not break through the adhesive synthetic resin layer and electrical continuity with the metal plate cannot be obtained, which is not preferable. The method of forming the adhesive synthetic resin layer on one surface of the metal plate is not particularly limited, and any method can be used as long as a thickness of 100 μm or less can be obtained. For example,
Examples thereof include an extrusion laminating method and a method of sticking with a hot press or a hot roll.
【００１２】内部機構部を構成する熱可塑性樹脂として
は、熱可塑性エラストマー、ポリスチレン、ＡＢＳ樹
脂、ポリプロピレン樹脂、変性ポリフェニレンオキサイ
ド樹脂等が挙げられる。この熱可塑性樹脂に配合する導
電性充填材としては、繊維状、粉末状、或いはフレーク
状のカーボン、鉄、銅、銅合金、アルミニウム、ニッケ
ル等が挙げられる。Examples of the thermoplastic resin forming the internal mechanism section include thermoplastic elastomer, polystyrene, ABS resin, polypropylene resin, modified polyphenylene oxide resin and the like. Examples of the conductive filler to be added to this thermoplastic resin include fibrous, powdery or flake carbon, iron, copper, copper alloys, aluminum and nickel.
【００１３】筐体の製造方法としては、前記のラミネー
ト板をプレス加工等によって、接着性合成樹脂層が内側
になるように筐体外殻状に成形する。次に筐体外殻体を
射出成形金型内に装着し、接着性合成樹脂層上に導電性
充填材を含有した熱可塑性樹脂を射出成形し、内部機構
部を一体に形成した電子機器用筐体を製造することがで
きる。こうして得られた筐体は、同様にして製造した他
方の側の筐体と組にして使用される。即ち、回路基板の
両面にそれそれぞれ回路部品が実装された部品実装回路
基板を中央に配置し、その上下両面に筐体をかぶせ、回
路基板を内部機構部のボスに金属製のネジで止めること
により、筐体が組立て固定されるとともに回路基板の接
地が行われる。As a method of manufacturing the casing, the laminate plate is formed into a casing outer shell shape by pressing or the like so that the adhesive synthetic resin layer is inside. Next, the outer shell of the housing is mounted in an injection molding die, a thermoplastic resin containing a conductive filler is injection-molded on the adhesive synthetic resin layer, and the internal mechanism is integrally formed. The body can be manufactured. The housing thus obtained is used in combination with the housing on the other side manufactured in the same manner. That is, place the component mounting circuit boards on the both sides of the circuit board in the center, cover the upper and lower surfaces with the case, and fix the circuit board to the boss of the internal mechanism with metal screws. Thus, the housing is assembled and fixed, and the circuit board is grounded.
【００１４】[0014]
【作用】本発明の電子機器用筐体は、接着性合成樹脂層
を、芯材を含まずかつ、厚さを100μm 以下としたこと
および熱可塑性樹脂に導電性充填材を配合させることに
よって、特別な加工を施すことなく、筐体内に実装した
回路基板の接地をなし得ることに成功したものである。
すなわち、内部機構部を熱可塑性樹脂で一体に形成する
場合の射出成形圧で、導電性充填材が厚さを 100μm 以
下の芯材を含まない接着性合成樹脂層を突き破らせて、
回路基板の接地をなし得たものである。The electronic device casing of the present invention has an adhesive synthetic resin layer which does not include a core material and has a thickness of 100 μm or less, and by blending a thermoplastic resin with a conductive filler. It succeeded in grounding the circuit board mounted in the housing without special processing.
That is, the injection molding pressure when integrally forming the internal mechanism part with a thermoplastic resin causes the conductive filler to break through the adhesive synthetic resin layer not including the core material having a thickness of 100 μm or less,
The circuit board can be grounded.
【００１５】[0015]
【実施例】次に、本発明の実施例を説明する。EXAMPLES Next, examples of the present invention will be described.
【００１６】厚さ 0.6mmのアルミニウム板に、芯材が入
っていないポリスチレン系感熱型接着剤、ＮＰ６０８
（ソニーケミカル社製商品名、厚さ70μm ）を重ね合わ
せて熱プレスを用いて仮接着しラミネート板を得た。こ
れを接着剤層が内側となるようにプレス型に入れて、プ
レス加工を行い外殻成形体とした。この成形体を形成す
べき内部機構部と同一形状のキャビティを有する射出成
形用金型に入れた後、銅繊維を配合したＡＢＳ樹脂、Ｅ
Ｃ−２３００（東芝ケミカル社製、商品名）を射出成形
でキャビティ内に充填して、内部機構部を形成して電子
機器用筐体を製造した。NP608, a polystyrene-based heat-sensitive adhesive containing no core material on an aluminum plate having a thickness of 0.6 mm.
(Sony Chemical Co., Ltd. product name, thickness 70 μm) were overlapped and temporarily bonded using a heat press to obtain a laminated plate. This was put into a press mold so that the adhesive layer was on the inner side, and pressed to obtain an outer shell molded body. This molded body is put into an injection molding die having a cavity having the same shape as the internal mechanism portion to be formed, and then ABS resin mixed with copper fiber, E
C-2300 (manufactured by Toshiba Chemical Co., Ltd., trade name) was filled in the cavity by injection molding to form an internal mechanism portion, thereby manufacturing a housing for electronic equipment.
【００１７】比較例１ 実施例において、銅繊維を配合したＡＢＳ樹脂を用いる
替わりに、銅繊維を配合しないＡＢＳ樹脂を用いた以外
は実施例と同様にして電子機器用筐体を製造した。Comparative Example 1 A casing for electronic equipment was manufactured in the same manner as in Example except that an ABS resin containing no copper fiber was used instead of the ABS resin containing copper fiber.
【００１８】比較例２ 実施例において、芯材が入っていないポリスチレン系感
熱型接着剤をもちいた替わりに不織布に含浸させたポリ
スチレン系感熱型接着剤ＮＰ−６０５（ソニーケミカル
社製、商品名）を用いた以外は実施例と同様にして電子
機器用筐体を製造した。Comparative Example 2 In Example, a polystyrene-based heat-sensitive adhesive NP-605 (manufactured by Sony Chemical Co., Ltd.) impregnated with a nonwoven fabric was used instead of the polystyrene-based heat-sensitive adhesive containing no core material. A housing for an electronic device was manufactured in the same manner as in the example except that was used.
【００１９】実施例および比較例１〜２で製造した電子
機器用筐体のボスに金属製のネジを立て、そのネジと外
殻のアルミニウム板と抵抗値を測定したところ表１のよ
うであった。本発明の電子機器用筐体は導通しており、
本発明の効果を確認することができた。Table 1 shows metal screws set on the bosses of the electronic device casings manufactured in Examples and Comparative Examples 1 and 2, and the aluminum plate of the screw, the outer shell, and the resistance value were measured. It was The electronic device casing of the present invention is conductive,
The effect of the present invention could be confirmed.
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明の電子機器用筐体は、薄く軽量で強度が大き
く、特別な加工を施すことなく、また意匠性に優れ、筐
体内に実装した回路基板の接地をなし得るものである。As is clear from the above description and Table 1, the electronic device casing of the present invention is thin, lightweight, has high strength, does not require any special processing, and is excellent in design, The circuit board mounted in can be grounded.
【図面の簡単な説明】[Brief description of drawings]
【図１】図１は、本発明に関連する電子機器用筐体を説
明する断面図である。FIG. 1 is a cross-sectional view illustrating an electronic device casing related to the present invention.
【図２】図２は、従来の回路基板接地態様の一例を説明
するための断面図である。FIG. 2 is a cross-sectional view for explaining an example of a conventional circuit board grounding mode.
【図３】図３は、従来の回路基板接地態様の他の例を説
明するための説明断面図を示す。FIG. 3 is an explanatory sectional view for explaining another example of the conventional circuit board grounding mode.
１ 金属板 ２ 接着性合成樹脂層（接着剤層） ３ 内部機構部 ３a スペーサ ３b 突出台 ４ 回路基板 ５ 回路部品 ６ 分割片結合用ネジ ７ ネジ ８ 接地リード線 ９ 内フランジ DESCRIPTION OF SYMBOLS 1 Metal plate 2 Adhesive synthetic resin layer (adhesive layer) 3 Internal mechanism part 3a Spacer 3b Projection stand 4 Circuit board 5 Circuit component 6 Divided piece connecting screw 7 Screw 8 Ground lead wire 9 Inner flange
Claims (1)
たラミネート板が、接着性合成樹脂層を内側にするよう
に筐体外殻形状に成形され、前記合成樹脂層上に熱可塑
性樹脂で内部機構部を一体に形成されている電子機器用
筐体であって、前記接着性合成樹脂層が厚さ 100μm 以
下で芯材を含まないものからなり、また、前記熱可塑性
樹脂が導電性充填材を含有したものであることを特徴と
する電子機器用筐体。1. A laminate plate in which an adhesive synthetic resin layer is provided on one surface of a metal plate is formed into a casing outer shell shape with the adhesive synthetic resin layer inside, and a thermoplastic resin is formed on the synthetic resin layer. The housing for electronic equipment integrally formed with the above, wherein the adhesive synthetic resin layer is 100 μm or less in thickness and does not include a core material, and the thermoplastic resin is conductive. A housing for an electronic device, characterized by containing a filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30543994A JPH08148873A (en) | 1994-11-15 | 1994-11-15 | Case body for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30543994A JPH08148873A (en) | 1994-11-15 | 1994-11-15 | Case body for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08148873A true JPH08148873A (en) | 1996-06-07 |
Family
ID=17945158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30543994A Pending JPH08148873A (en) | 1994-11-15 | 1994-11-15 | Case body for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08148873A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6446262A (en) * | 1987-08-12 | 1989-02-20 | Victor Company Of Japan | System for recording disk inspection signal and inspection signal recording disk |
| WO2007116801A1 (en) * | 2006-04-03 | 2007-10-18 | Mitsubishi Electric Corporation | Electronic device case |
| JP2016087836A (en) * | 2014-10-30 | 2016-05-23 | 株式会社神戸製鋼所 | Metal-resin composite material |
-
1994
- 1994-11-15 JP JP30543994A patent/JPH08148873A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6446262A (en) * | 1987-08-12 | 1989-02-20 | Victor Company Of Japan | System for recording disk inspection signal and inspection signal recording disk |
| WO2007116801A1 (en) * | 2006-04-03 | 2007-10-18 | Mitsubishi Electric Corporation | Electronic device case |
| JPWO2007116801A1 (en) * | 2006-04-03 | 2009-08-20 | 三菱電機株式会社 | Electronic equipment housing |
| JP4656234B2 (en) * | 2006-04-03 | 2011-03-23 | 三菱電機株式会社 | Encoder |
| US7939796B2 (en) | 2006-04-03 | 2011-05-10 | Mitsubishi Electric Corporation | Electronic device housing |
| JP2016087836A (en) * | 2014-10-30 | 2016-05-23 | 株式会社神戸製鋼所 | Metal-resin composite material |
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