JPH08130356A - Part mounting structure - Google Patents

Part mounting structure

Info

Publication number
JPH08130356A
JPH08130356A JP29072794A JP29072794A JPH08130356A JP H08130356 A JPH08130356 A JP H08130356A JP 29072794 A JP29072794 A JP 29072794A JP 29072794 A JP29072794 A JP 29072794A JP H08130356 A JPH08130356 A JP H08130356A
Authority
JP
Japan
Prior art keywords
substrate
recess
type component
smd
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29072794A
Other languages
Japanese (ja)
Inventor
Yoshihisa Okuda
芳久 奥田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Crystal Device Corp
Original Assignee
Kyocera Crystal Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Crystal Device Corp filed Critical Kyocera Crystal Device Corp
Priority to JP29072794A priority Critical patent/JPH08130356A/en
Publication of JPH08130356A publication Critical patent/JPH08130356A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE: To enable an SMD part to be mounted on a board which is small in size and height. CONSTITUTION: A recess 5 capable of housing an SMD part 1 is provided to a board 4 at a position where the SMD type part 1 is arranged, a conductor 2 is provided to the side wall of the recess 5 correspondent to the terminal of the SMD part 1, the terminals of the part 1 are connected to the inner side face conductors 2 of the recess 5 with solders 3, and the SMD part 1 is flush with the board 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】基板にＳＭＤタイプの部品を搭載
する構造に関する。TECHNICAL FIELD The present invention relates to a structure for mounting SMD type components on a substrate.

【０００２】[0002]

【従来の技術】図２に従来技術の部品搭載構造を示す。
従来技術では、単に基板の上にＳＭＤタイプ部品を搭載
するのが一般的である。2. Description of the Related Art FIG. 2 shows a conventional component mounting structure.
In the prior art, it is common to simply mount the SMD type component on the substrate.

【０００３】[0003]

【発明が解決しようとする課題】従来技術では、基板の
上にＳＭＤタイプ部品が搭載されているので、部品搭載
状態の基板の厚みは基板とＳＭＤタイプ部品の厚みの和
より薄くできないという課題があった。In the prior art, since the SMD type component is mounted on the substrate, there is a problem that the thickness of the substrate in the component mounted state cannot be thinner than the sum of the thickness of the substrate and the SMD type component. there were.

【０００４】[0004]

【課題を解決するための手段】図１に本発明の部品搭載
構造を示す。基板４のＳＭＤタイプ部品１が配置される
位置に、基板４にＳＭＤタイプ部品１の落とし込める凹
部５を設け、その凹部５の側壁の部分のＳＭＤタイプ部
品１の端子部に対応する部分に導体２を設置して、ＳＭ
Ｄタイプ部品１の端子部と基板４の凹部５の内部側面導
体２をはんだ３にて接続して、基板４の厚みの中にＳＭ
Ｄタイプ部品１を包含することで課題が解決できた。FIG. 1 shows a component mounting structure of the present invention. A recess 5 into which the SMD type component 1 can be dropped is provided in the substrate 4 at a position where the SMD type component 1 is arranged, and a conductor is provided on a portion of a sidewall of the recess 5 corresponding to a terminal portion of the SMD type component 1. 2 installed, SM
The terminal portion of the D-type component 1 and the inner side surface conductor 2 of the concave portion 5 of the substrate 4 are connected by the solder 3, and the SM is inserted in the thickness of the substrate 4.
The problem could be solved by including the D-type component 1.

【実施例】【Example】

【０００５】図１（ａ）に、基板４の凹部５にＳＭＤタ
イプ部品１を落とし込んだ実施例の斜視断面図を示す。
図１（ｂ）に、図１（ａ）のはんだ３にて固着した状態
の断面図を示す。基板４の凹部５は、ＳＭＤタイプ部品
１のはんだ付け端子を有する端面側は凹部５の底面の延
長線との間に４５〜７５度の角度αを持っている。この
角度は単に部品搭載の便のみではなく、図１（ｂ）に示
すはんだ付けの際のはんだ溜まりとしての重要な目的が
ある。なお基板４の凹部５の、ＳＭＤタイプ部品１のは
んだ付け端子を有していない端面側は凹５部の底面との
間の角度は特に重要ではないが部品搭載の便を考慮して
４５〜９０度の角度を持っていても差し支え無い。凹部
５の側壁のはんだ付けの為の導体２は、ＳＭＤタイプ部
品１のはんだ付け端子を有する端面側のみとし、他の側
壁及び底面には導体を施さない。これはＳＭＤタイプ部
品１がはんだ付けの際溶融はんだに浮き上がり、ＳＭＤ
タイプ部品１の上面が基板４の上面から必要以上はみ出
さないための配慮である。なお、凹部５の深さはＳＭＤ
タイプ部品１が１／２以上没する深さにすることによ
り、基板搭載による部品の飛び出し部が少なくなる。FIG. 1A shows a perspective sectional view of an embodiment in which the SMD type component 1 is dropped in the recess 5 of the substrate 4.
FIG. 1B shows a cross-sectional view of the state in which the solder 3 of FIG. The concave portion 5 of the substrate 4 has an angle α of 45 to 75 degrees with the extension line of the bottom surface of the concave portion 5 on the end face side having the soldering terminals of the SMD type component 1. This angle has an important purpose as a solder pool at the time of soldering shown in FIG. The angle between the concave portion 5 of the board 4 and the bottom surface of the concave portion 5 is not particularly important on the end surface side of the SMD type component 1 that does not have the soldering terminals, but in consideration of the convenience of component mounting, You can have a 90 degree angle. The conductor 2 for soldering the side wall of the recess 5 is only on the end face side of the SMD type component 1 having the soldering terminal, and no conductor is provided on the other side wall and bottom face. This is because SMD type component 1 floats on the molten solder during soldering,
This is to prevent the upper surface of the type component 1 from protruding more than necessary from the upper surface of the substrate 4. The depth of the recess 5 is SMD.
By setting the depth of the type component 1 to be 1/2 or more, the protruding portion of the component mounted on the board is reduced.

【０００６】基板４の凹部５の作り方は、基板４をモー
ルド成形で作る際に凹部５を作り込む方法、既製の基板
４を加工して凹部５を作る方法、平板の上に凹部に対応
する位置に穴をあけた板を重ねて固着して作る方法等が
あり，どの方法を用いてもよい。The method of forming the recess 5 of the substrate 4 corresponds to a method of forming the recess 5 when the substrate 4 is molded, a method of processing the ready-made substrate 4 to form the recess 5, and a method of forming the recess 5 on a flat plate. There is a method of stacking and fixing plates with holes at positions, and any method may be used.

【０００７】または、基板４の上の導体２の形成方法
は、基板４の全面に導体２を鍍金、張り付け、蒸着、焼
き付け等の方法で固着して、導体パターンとして必要な
部分を残して不要な部分を除去する方法の他、必要な導
体のみを鍍金、張り付け、蒸着、焼き付け等の方法で形
成する方法を用いてもよい。Alternatively, the method of forming the conductor 2 on the substrate 4 is unnecessary by fixing the conductor 2 on the entire surface of the substrate 4 by a method such as plating, pasting, vapor deposition, baking, etc. and leaving a necessary portion as a conductor pattern. In addition to the method of removing the unnecessary portion, a method of forming only the necessary conductor by plating, pasting, vapor deposition, baking, or the like may be used.

【０００８】さらに、使用できるＳＭＤタイプ部品は角
型だけとは限らない円筒型のものでも使用できる。基板
の材質は、樹脂、セラミック等が使用でき、基板の用途
は発振器等小型化、薄型化を必要とする電気回路基板全
般に適用できる。Furthermore, the SMD type parts that can be used are not limited to the square type but can be the cylindrical type. The material of the substrate can be resin, ceramics, etc., and the application of the substrate can be applied to all electric circuit substrates that require downsizing and thinning such as oscillators.

【０００９】[0009]

【発明の効果】本発明により、基板の中にＳＭＤタイプ
部品を埋め込む形で実装するので、部品実装状態での厚
みを薄くできた。このことにより、製品の小形化特に低
背化が実現できたばかりでなく、基板実装時にＳＭＤタ
イプ部品を埋め込む凹部の中に入れてあるので、はんだ
付け等に際しても、また基板がリフロー炉を通されては
んだが溶融しても部品の位置が安定しているで、実装基
板の品質が良くなり、その結果製品の信頼性が著しく向
上した。According to the present invention, since the SMD type component is embedded in the substrate and mounted, the thickness of the component mounted state can be reduced. As a result, not only has the product been made smaller and the height of the product has been reduced, but since it is placed in the recess where the SMD type component is embedded when the board is mounted, the board is also passed through a reflow furnace during soldering. Even if the solder melts, the position of the parts is stable, and the quality of the mounting board is improved, resulting in a marked improvement in product reliability.

【図面の簡単な説明】[Brief description of drawings]

【図１】図１（ａ）は、本発明の部品搭載の実施例の斜
視断面図である。図１（ｂ）は、本発明の部品搭載の実
施例の断面図である。FIG. 1 (a) is a perspective sectional view of an example of component mounting according to the present invention. FIG. 1 (b) is a sectional view of an embodiment of mounting components according to the present invention.

【図２】図２（ａ）は，従来技術の基板の片面にＳＭＤ
タイプ部品を搭載し他の面に大型部品を搭載した例の側
面図を示す。図２（ｂ）は，従来技術の基板の片面にＳ
ＭＤタイプ部品と大型部品を搭載した例の側面図を示
す。FIG. 2 (a) is an SMD on one side of a prior art substrate.
The side view of the example which mounted the type component and mounted the large-sized component on the other surface is shown. FIG. 2 (b) shows that S is formed on one side of a conventional substrate.
The side view of the example which mounts MD type parts and large-sized parts is shown.

【図３】図３（ａ）は，本発明の基板の片面にＳＭＤタ
イプ部品を基板の中に埋め込み、その上に大型部品を搭
載した実施例の側面図を示す。図３（ｂ）は，本発明の
基板の片面にＳＭＤタイプ部品を基板の中に埋め込み、
その上に大型部品を搭載した実施例の平面図を示す。FIG. 3 (a) shows a side view of an embodiment in which an SMD type component is embedded in the substrate on one surface of the substrate of the present invention, and a large component is mounted thereon. FIG. 3B shows that the SMD type component is embedded in the substrate on one side of the substrate of the present invention,
The top view of the Example which mounted the large component on it is shown.

【符号の説明】 １ ＳＭＤタイプ部品 ２ 導体 ３ はんだ ４ 基板 ５ 凹部 α 凹部の側壁と、凹部の底面の延長線となす角度[Explanation of Codes] 1 SMD type component 2 Conductor 3 Solder 4 Substrate 5 Recess α The angle between the side wall of the recess and the extension of the bottom of the recess

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 基板にＳＭＤタイプ部品を搭載する構造
において、 該基板の該ＳＭＤタイプ部品を搭載する位置に該ＳＭＤ
タイプ部品が没する深さの凹部を設けていることを特徴
とする部品の搭載構造。1. A structure in which an SMD type component is mounted on a substrate, wherein the SMD is mounted on the substrate at a position where the SMD type component is mounted.
A component mounting structure, characterized in that a recess having a depth that allows the type component to be submerged is provided. 【請求項２】 該基板の該ＳＭＤタイプ部品を落とし込
む該凹部の側壁の部分の該ＳＭＤタイプ部品の端子部に
対応する部分に導体を設置して、該ＳＭＤタイプ部品の
該端子部と該基板の該凹部の内部側面導体をはんだ付け
にて接続することを特徴とする特許請求の範囲第１項記
載の部品搭載構造。2. A conductor is installed on a portion of the side wall portion of the recess into which the SMD type component of the substrate is dropped, the conductor corresponding to the terminal portion of the SMD type component, and the terminal portion of the SMD type component and the substrate. The component mounting structure according to claim 1, wherein the inner side surface conductor of the recess is connected by soldering. 【請求項３】 該基板の該ＳＭＤタイプ部品を落とし込
む該凹部の側壁の部分の該ＳＭＤタイプ部品の端子部に
対応する部分と、該凹部の底面の延長線となす角度が、
４５〜７５度の範囲であることを特徴とする特許請求の
範囲第１項及び第２項記載の部品搭載構造。3. An angle formed between a portion of a side wall portion of the recess into which the SMD type component of the substrate is dropped and which corresponds to a terminal portion of the SMD type component and an extension line of a bottom surface of the recess,
The component mounting structure according to claim 1 or 2, wherein the component mounting structure is in the range of 45 to 75 degrees. 【請求項４】 基板にＳＭＤタイプ部品を搭載する構造
において、 該基板の該ＳＭＤタイプ部品を搭載する位置に該ＳＭＤ
タイプ部品が没する深さの凹部を設け、該凹部の深さが
該ＳＭＤタイプ部品の１／２以上を没する深さとしたこ
とを特徴とする部品搭載構造。4. A structure in which an SMD type component is mounted on a substrate, wherein the SMD is mounted on the substrate at a position where the SMD type component is mounted.
A component mounting structure characterized in that a recess having a depth into which a type component is submerged is provided, and the depth of the recess is such that the depth of the recessed portion is 1/2 or more of the SMD type component.
JP29072794A 1994-10-31 1994-10-31 Part mounting structure Pending JPH08130356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29072794A JPH08130356A (en) 1994-10-31 1994-10-31 Part mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29072794A JPH08130356A (en) 1994-10-31 1994-10-31 Part mounting structure

Publications (1)

Publication Number Publication Date
JPH08130356A true JPH08130356A (en) 1996-05-21

Family

ID=17759748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29072794A Pending JPH08130356A (en) 1994-10-31 1994-10-31 Part mounting structure

Country Status (1)

Country Link
JP (1) JPH08130356A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19701163A1 (en) * 1997-01-15 1998-07-16 Siemens Ag Electrical circuit with contact track layer especially for chip card
JP2016201521A (en) * 2015-04-14 2016-12-01 オムロン株式会社 Circuit structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19701163A1 (en) * 1997-01-15 1998-07-16 Siemens Ag Electrical circuit with contact track layer especially for chip card
DE19701163C2 (en) * 1997-01-15 2001-12-06 Siemens Ag Electrical circuit especially for a chip card
JP2016201521A (en) * 2015-04-14 2016-12-01 オムロン株式会社 Circuit structure
US10334733B2 (en) 2015-04-14 2019-06-25 Omron Corporation Circuit structure

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