JPH0812949B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0812949B2 JPH0812949B2 JP3008004A JP800491A JPH0812949B2 JP H0812949 B2 JPH0812949 B2 JP H0812949B2 JP 3008004 A JP3008004 A JP 3008004A JP 800491 A JP800491 A JP 800491A JP H0812949 B2 JPH0812949 B2 JP H0812949B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- printed wiring
- wiring board
- linear conductor
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、プリント配線板に関
するものである。さらに詳しくは、この発明は、ビアス
ペースを減少させ、スルホール信頼性を向上させること
のできるプリント配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board. More specifically, the present invention relates to a printed wiring board capable of reducing via space and improving through hole reliability.
【０００２】[0002]
【従来の技術】片面、両面、あるいは多層等の各種の構
造からなるプリント配線板は、電気・電子機器、通信機
器、計算機器等の多様な分野において広く用いられてお
り、高密度実装、高微細化、高集積化等の要請が高まる
につれて、様々な工夫と改良がなされてきている。2. Description of the Related Art Printed wiring boards having various structures such as single-sided, double-sided, or multi-layered are widely used in various fields such as electric / electronic devices, communication devices, and computer devices, and have high-density mounting and high-density mounting. As demands for miniaturization and high integration increase, various innovations and improvements have been made.
【０００３】このような高密度実装化等の要請に対応す
るために、多層化をはじめ、表面配線密度の向上、配線
面積の減少等が必須となり、また同時に配線、その導通
性の確保による信頼性の向上が大きな課題になってい
る。特にこの導通性の確保は、スルホールにおいて重要
となっている。このような信頼性の向上を図るために、
プリント配線板の設計、製造においては、たとえば図５
に示したように、従来は、表面実装用パッド（ア）から
配線を出してビア（イ）を形成し、このビア（イ）によ
ってスルホールを介して両面板、あるいは多層板の他層
との導通をとっていた。In order to meet such demands for high-density mounting and the like, it is indispensable to increase the surface wiring density, reduce the wiring area, etc., in addition to multilayering, and at the same time, secure reliability by securing the wiring and its continuity. Improving sex has become a major issue. In particular, ensuring this conductivity is important in through holes. In order to improve such reliability,
In designing and manufacturing a printed wiring board, for example, as shown in FIG.
As shown in FIG. 1, conventionally, the wiring is taken out from the surface mounting pad (a) to form a via (a), and the via (a) is used to connect the double-sided plate or the other layer of the multilayer plate through the through hole. There was continuity.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな従来のパッド（ア）およびビア（イ）の構造の場合
には、ビア（イ）の形成のためのスペースが欠かせない
ものとなっており、このビア（イ）の存在は、高密度配
線のための大きな障害となっていた。また、このビア
（イ）でのスルホールの導通性の確保による信頼性の向
上には限界があり、どうしても導通不良の発生が避けら
れなかった。However, in such a conventional structure of pad (A) and via (A), a space for forming via (A) is indispensable. However, the existence of the via (a) has been a major obstacle to high-density wiring. Further, there is a limit to the improvement of reliability by ensuring the conductivity of the through hole in the via (a), and the occurrence of the conduction failure cannot be avoided.
【０００５】この発明は、以上の通りの事情に鑑みてな
されたものであり、従来の表面実装用パッドの欠点を改
善し、ビアスペースを減少させ、しかもスルホール信頼
性を向上することのできる新しいプリント配線板を提供
することを目的としている。The present invention has been made in view of the above circumstances, and is a new one that can improve the drawbacks of the conventional surface mounting pads, reduce the via space, and improve the reliability of through holes. It is intended to provide a printed wiring board.
【０００６】[0006]
【課題を解決するための手段】この発明は、上記の課題
を解決するものとして、厚さ方向に導通のための接続孔
を有し、この接続孔から線状導体幅と略同等寸法の切り
欠き部を有する表面実装用パッドを厚さ方向の両側面に
配設し、接続孔に線状導体を挿着し、かつ、両側面にお
いて前記パッドの切り欠き部に線状導体を折り曲げ押着
してパッド部厚みｔと導体径ｄとの関係をｔ＞ｄとし、
パッドと接続処理してなることを特徴とするプリント配
線板を提供する。In order to solve the above-mentioned problems, the present invention has a connection hole for conduction in the thickness direction, and cuts from this connection hole with a dimension substantially equal to the linear conductor width. Surface mounting pads with notches are arranged on both sides in the thickness direction, linear conductors are inserted into the connection holes, and linear conductors are bent and pressed onto the notches of the pads on both sides. Then, the relationship between the pad thickness t and the conductor diameter d is set as t > d,
Provided is a printed wiring board characterized by being connected to a pad.
【０００７】[0007]
【作用】この発明のプリント配線板においては、接続孔
と、導体幅と略同等寸法の切り欠き部を有する実装用パ
ッドを用い、スルホールに挿着した線状導体の両側部を
折り曲げてこの切り欠き部に押着して接続するため、従
来のようにビアの形成は必要でなく、ビアスペースを著
しく減少させることができる。In the printed wiring board of the present invention, a mounting pad having a connection hole and a cutout portion having substantially the same size as the conductor width is used, and both side portions of the linear conductor inserted in the through hole are bent and cut. Since the connection is made by pressing onto the notch, it is not necessary to form a via as in the conventional case, and the via space can be significantly reduced.
【０００８】しかも、この発明のプリント配線板におい
ては、上記の構成とすることによりスルホールの導通信
頼性を大きく向上させる。Moreover, in the printed wiring board of the present invention, by adopting the above configuration, the conduction reliability of the through hole is greatly improved.
【０００９】[0009]
【実施例】以下、添付した図面に沿って実施例を示し、
さらに詳しくこの発明のプリント配線板について説明す
る。添付した図面の図１は、この発明のプリント配線板
を例示した縦断面図であり、また図２は、この例におい
て用いる表面実装用パッドを示した平面図および断面図
である。EXAMPLES Examples will be shown below with reference to the accompanying drawings.
The printed wiring board of the present invention will be described in more detail. FIG. 1 of the accompanying drawings is a longitudinal sectional view illustrating a printed wiring board of the present invention, and FIG. 2 is a plan view and a sectional view showing a surface mounting pad used in this example.
【００１０】たとえばこの図１および図２に例示したよ
うに、この発明のプリント配線板においては、樹脂含浸
ガラス基材、樹脂シート、あるいは多層板における内層
材等からなる基材層（１）の厚さ方向の両側面に、この
発明のパッド（２）を配設する。そしてこのパッド
（２）は、厚さ方向に導通のための接続孔（３）を有
し、この接続孔（３）から線状導体幅と略同等寸法の切
り欠き部（４）とを有している。パッド（２）の素材と
しては、その種類に特に限定はなく、銅、アルミニウ
ム、ステンレス等の金属、合金を薄層として形成するこ
とができる。その形状は一般的には長方形とすることが
好ましいが、もちろんこれに限定されることはない。For example, as illustrated in FIGS. 1 and 2, in the printed wiring board of the present invention, a base material layer (1) made of a resin-impregnated glass base material, a resin sheet, or an inner layer material in a multilayer board is used. The pads (2) of the present invention are arranged on both sides in the thickness direction. The pad (2) has a connection hole (3) for conduction in the thickness direction, and a cutout portion (4) having a size substantially equal to the linear conductor width from the connection hole (3). are doing. The material of the pad (2) is not particularly limited in its type, and a metal or alloy such as copper, aluminum or stainless can be formed as a thin layer. It is generally preferable that the shape is rectangular, but it is not limited to this.
【００１１】このパッド（２）を配設したプリント配線
板には、次いでその接続孔（３）に対応したスルホール
に線状導体（５）を挿着し、かつ、パッド（２）の切り
欠き部（４）にこの線状導体（５）を折り曲げ押着す
る。この時の線状導体（５）の径（ｄ）、または厚み
は、パッド（２）の厚み（ｔ）よりも小さいか、略同等
とするのが好ましい。すなわち、ｔ＞ｄの関係になるよ
うにする。これによって、押着はしっかりしたものとな
り、かつ、表面に線状導体（５）による突条も生じな
い。In the printed wiring board provided with the pad (2), the linear conductor (5) is then inserted into the through hole corresponding to the connection hole (3) and the notch of the pad (2). The linear conductor (5) is bent and pressed onto the portion (4). The diameter (d) or thickness of the linear conductor (5) at this time is preferably smaller than or substantially equal to the thickness (t) of the pad (2). That is, the relationship of t > d is established. As a result, the press-fitting becomes firm and no ridges due to the linear conductor (5) are formed on the surface.
【００１２】この線状導体（５）の折り曲げ押着によ
り、線状導体（５）は、パッド（２）の切り欠き部
（４）にぴったりと密着される。そしてこの押着後に
は、パッド（２）と線状導体（５）とを接続処理する。
半田ペースト処理あるいはレーザー処理等を行う。これ
により接続導通はしっかりと確保されることになる。線
状導体（５）としては、銅、アルミニウム、その他の金
属、合金からなる素材とし、また、その形状は、丸線、
平角線、さらには複数線材によるものでもよい。接続処
理についても、半田、あるいはレーザー処理に限られる
ことはない。By bending and pressing the linear conductor (5), the linear conductor (5) is closely attached to the notch (4) of the pad (2). After the pressing, the pad (2) and the linear conductor (5) are connected.
Solder paste processing or laser processing is performed. As a result, the connection continuity is firmly secured. The linear conductor (5) is made of a material made of copper, aluminum, other metal or alloy, and its shape is round wire,
The wire may be a flat wire or a plurality of wires. The connection processing is not limited to soldering or laser processing.
【００１３】なお、スルホールの孔については、このよ
うな線状導体（５）の径、あるいは大きさと略同一とす
る。また、線状導体（５）のスルホールへの挿着、パッ
ド（２）切り欠き部（４）への折り曲げ押着は機械的に
適宜な手段によって行うことができる。このような構造
のプリント配線板に使用するこの発明の表面実装用パッ
ド（２）の切り欠き部（４）については、適宜なエッチ
ング等の手段によって形成することができ、その配置
は、図１および図２に例示したように、パッド（２）内
への形成によるものでもよいし、あるいは、図３に例示
したように、パッド（２）の端部（６）までの配置とし
てもよい。また、その方向についても、図１、図２およ
び図３に例示したように、パッド（２）の長手方向でも
よいし、あるいは図４に示したように短手方向等であっ
てもよい。The diameter of the through hole is approximately the same as the diameter or size of such a linear conductor (5). Further, the insertion of the linear conductor (5) in the through hole and the bending and pressing of the pad (2) in the cutout portion (4) can be performed mechanically by an appropriate means. The notch (4) of the surface-mounting pad (2) of the present invention used in the printed wiring board having such a structure can be formed by an appropriate means such as etching, and its arrangement is shown in FIG. And as illustrated in FIG. 2, it may be formed in the pad (2), or may be arranged up to the end (6) of the pad (2) as illustrated in FIG. Further, the direction thereof may be the longitudinal direction of the pad (2) as illustrated in FIGS. 1, 2 and 3, or may be the lateral direction as shown in FIG. 4.
【００１４】いずれの場合にも、パッド（２）内に線状
導体が埋め込まれるので、図５に示した従来のようにパ
ッド（ア）とビア（イ）とを形成する必要はなく、パッ
ドとビアを両用した状態とすることができ、ビアスペー
スを大きく減少させる。また、線状導体（５）と、切り
欠き部（４）を有するパッド（２）の使用によって、ス
ルホール導通信頼性は大きく向上する。In any case, since the linear conductor is embedded in the pad (2), it is not necessary to form the pad (a) and the via (a) as in the conventional case shown in FIG. The via space can be greatly reduced by using both the and vias. Further, the use of the linear conductor (5) and the pad (2) having the cutout portion (4) greatly improves the reliability of through-hole conduction.
【００１５】もちろん、この発明は、以上の例によって
限定されることはなく、その細部については様々な態様
が可能である。Of course, the present invention is not limited to the above examples, and various details can be made.
【００１６】[0016]
【発明の効果】この発明により、以上詳しく説明した通
り、従来のビアスペースを減少させ、かつ、スルホール
導通信頼性を向上させることができる。As described in detail above, according to the present invention, the conventional via space can be reduced and the through hole conduction reliability can be improved.
【図１】この発明のプリント配線板を例示した縦断面図
である。FIG. 1 is a vertical cross-sectional view illustrating a printed wiring board of the present invention.
【図２】この発明の実装用パッドを例示した平・断面図
である。FIG. 2 is a plan view and a sectional view illustrating a mounting pad of the present invention.
【図３】この発明のパッドの他の例を示した平面図であ
る。FIG. 3 is a plan view showing another example of the pad of the present invention.
【図４】この発明のパッドのさらに別の例を示した平面
図である。FIG. 4 is a plan view showing still another example of the pad of the present invention.
【図５】従来のパッドとビアの構造を示した平面図であ
る。FIG. 5 is a plan view showing a structure of a conventional pad and via.
１ 基材層 ２ パッド ３ 接続孔 ４ 切り欠き部 ５ 線状導体 ６ 端 部 1 Base Material Layer 2 Pad 3 Connection Hole 4 Notch 5 Linear Conductor 6 End
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−238686（ＪＰ，Ａ) 特開 昭62−62594（ＪＰ，Ａ) 特開 平４−250685（ＪＰ，Ａ) 実開 平３−73476（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-62-238686 (JP, A) JP-A-62-62594 (JP, A) JP-A-4-250685 (JP, A) Jitsukaihei 3- 73476 (JP, U)
Claims (1)
この接続孔から線状導体幅と略同等寸法の切り欠き部を
有する表面実装用パッドを厚さ方向の両側面に配設し、
接続孔に線状導体を挿着し、かつ、両側面において前記
パッドの切り欠き部に線状導体を折り曲げ押着してパッ
ド部厚みｔと導体径ｄとの関係をｔ＞ｄとし、パッドと
接続処理してなることを特徴とするプリント配線板。1. A connection hole for conduction in the thickness direction,
From this connection hole, surface mounting pads having a cutout portion having a dimension substantially equal to the width of the linear conductor are arranged on both side surfaces in the thickness direction,
The linear conductor is inserted into the connection hole, and the linear conductor is bent and pressed into the cutout portions of the pad on both side surfaces so that the relationship between the pad thickness t and the conductor diameter d is t > d. A printed wiring board characterized by being connected to the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3008004A JPH0812949B2 (en) | 1991-01-25 | 1991-01-25 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3008004A JPH0812949B2 (en) | 1991-01-25 | 1991-01-25 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04250686A JPH04250686A (en) | 1992-09-07 |
| JPH0812949B2 true JPH0812949B2 (en) | 1996-02-07 |
Family
ID=11681223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3008004A Expired - Lifetime JPH0812949B2 (en) | 1991-01-25 | 1991-01-25 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0812949B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0812948B2 (en) * | 1991-01-25 | 1996-02-07 | 松下電工株式会社 | Printed wiring board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0812948B2 (en) * | 1991-01-25 | 1996-02-07 | 松下電工株式会社 | Printed wiring board |
-
1991
- 1991-01-25 JP JP3008004A patent/JPH0812949B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04250686A (en) | 1992-09-07 |
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