JPH0812947B2 - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPH0812947B2 JPH0812947B2 JP1265706A JP26570689A JPH0812947B2 JP H0812947 B2 JPH0812947 B2 JP H0812947B2 JP 1265706 A JP1265706 A JP 1265706A JP 26570689 A JP26570689 A JP 26570689A JP H0812947 B2 JPH0812947 B2 JP H0812947B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- groove
- metal circuit
- bonding
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は、セラミック基板の少なくとも一方の表面に
金属回路板が介在層を介することなく直接接合されてな
る回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to a circuit board in which a metal circuit board is directly bonded to at least one surface of a ceramic board without an intervening layer.
（従来の技術） 近年、パワートランジスタ・モジュール用基板やマイ
クロ波トランジスタ・モジュール用基板あるいはパワー
ハイブリッドIC用基板等の各種半導体用回路基板とし
て、セラミック基板の表面に銅板等からなる金属回路板
を直接接合した回路基板が注目されている。この回路基
板は、たとえばCu−Cu20の共晶液相でセラミック基板を
濡らし、さらに冷却固化して銅回路板とセラミック基板
とを直接に接合するいわゆるDBC（ダイレクト・ボンド
・カッパー法）によって製造される。このようにして形
成された回路基板は、高放熱性と高電気絶縁性を有し、
またすぐれたハンダ付け性、銅接着強度、ボンディング
性を示し、接合した銅回路板の熱膨脹係数がセラミック
基板と同等であるため、シリコンペレットを直接この銅
回路板上にマウントすることができる。また、上述した
回路基板は、銅回路板とセラミック基板とが、他のハン
ダ層等の介在層を介さずに直接接合された単純な構造を
有しているので、熱抵抗を極力小さくすることができ、
さらに小型高実装化の点においても有利である。(Prior Art) In recent years, as a circuit board for various semiconductors such as a power transistor / module board, a microwave transistor / module board or a power hybrid IC board, a metal circuit board made of a copper plate or the like is directly attached to the surface of a ceramic board. Attention has been paid to bonded circuit boards. This circuit board is manufactured, for example, by the so-called DBC (Direct Bond Copper Method) in which the ceramic substrate is wetted with a eutectic liquid phase of Cu-Cu20 and further cooled and solidified to directly bond the copper circuit plate and the ceramic substrate. It The circuit board formed in this way has high heat dissipation and high electrical insulation,
Further, it exhibits excellent solderability, copper adhesion strength, and bondability, and since the coefficient of thermal expansion of the joined copper circuit board is equivalent to that of the ceramic substrate, silicon pellets can be directly mounted on this copper circuit board. Further, since the above-mentioned circuit board has a simple structure in which the copper circuit board and the ceramic board are directly joined without interposing another intervening layer such as a solder layer, the thermal resistance should be minimized. Can
It is also advantageous in terms of miniaturization and high mounting.
（発明が解決しようとする課題） ところで、上述したような従来のセラミックス−金属
回路板直接接合型の回路基板においては、金属回路板上
にシリコンペレットをマウントする場合、あるいは回路
基板自体をヒートシンク・ベース（取付板）に接合する
場合には、ハンダ層を介してその接着が行われる。しか
しながら、従来の回路基板においては、上記のようにハ
ンダ層を介して金属回路板面と他の部品とが接着される
際に、金属回路板へのハンダの濡れが悪かったり、ある
いは良すぎたりすることに起因してハンダが接着指定域
からはみ出したりするという問題があり、このためシリ
コンペレットが正確にマウントできなくなったり、ハン
ダのはみ出しによって耐電圧特性に悪影響が生じたりす
るという問題がある。また、接合の際に、金属回路板の
シリコンペレットやヒートシンク・ベースとの接合界面
に気泡が混入し、これが接合後の部分的脹れ、放熱性の
低下ならびに歩留りの低下の要因ともなっていた。(Problems to be Solved by the Invention) In the conventional ceramic-metal circuit board direct bonding type circuit board as described above, when mounting silicon pellets on the metal circuit board, or when the circuit board itself is a heat sink. When joining to the base (mounting plate), the bonding is performed via the solder layer. However, in the conventional circuit board, when the metal circuit board surface and other components are adhered via the solder layer as described above, the wetness of the solder to the metal circuit board is bad or too good. As a result, there is a problem that the solder may stick out from the designated adhesion area, and therefore, there is a problem that the silicon pellet cannot be mounted accurately and the sticking out of the solder adversely affects the withstand voltage characteristics. In addition, during bonding, air bubbles are mixed in the bonding interface between the silicon pellet of the metal circuit board and the heat sink base, which causes partial expansion after bonding, which lowers heat dissipation and lowers yield.
本発明は上述した従来技術に鑑みてなされたものであ
り、回路基板と他の部品（シリコンペレットやヒートシ
ンク・ベースなど）とを接合する場合に、ハンダのはみ
出しや気泡の混入などの発生を防止し、これに起因する
悪影響の解消が図られた回路基板を提供することを目的
としている。The present invention has been made in view of the above-mentioned conventional technique, and prevents the protrusion of solder and the inclusion of bubbles when the circuit board and other components (silicon pellet, heat sink base, etc.) are joined. However, it is an object of the present invention to provide a circuit board in which adverse effects resulting from this are eliminated.
（課題を解決するための手段） 本発明の回路基板は、セラミック基板の少なくとも一
方の表面に金属回路板が介在層を介することなく直接接
合されてなる回路基板において、前記金属回路板の表面
のうち、少なくとも他の部品との接着面側の表面に溝が
形成されてなることを特徴としている。(Means for Solving the Problems) The circuit board of the present invention is a circuit board in which a metal circuit board is directly bonded to at least one surface of a ceramic board without an intervening layer interposed therebetween. Among them, it is characterized in that a groove is formed on at least a surface of a surface to be bonded to another component.
（作 用） 本発明の回路基板においては、セラミック基板に直接
接合された金属回路板の表面に、たとえばストライプ状
や格子状パターンからなる細かい溝が形成されているの
で、この金属回路板の表面に他の部品をハンダを介して
接着する場合、溝の存在による表面積の増大化とアンカ
ー効果が発揮されるので、接着面でのハンダの濡れ性な
らびに密着性はすぐれたものとなり、正確かつ確実な接
着を行うことができる。また、接着の際に接着界面部分
に混入した気泡は金属回路板表面の溝に沿って速やかに
外部に排出されるので、接合面の脹れや接着不良に伴う
放熱性の低下などの問題も解消される。(Operation) In the circuit board of the present invention, since the fine grooves having, for example, a stripe pattern or a grid pattern are formed on the surface of the metal circuit board directly bonded to the ceramic board, the surface of the metal circuit board is When other components are bonded to each other via solder, the surface area is increased and the anchor effect is exerted due to the presence of the groove, so the solder wettability and adhesion on the bonding surface are excellent and accurate and reliable. Adhesive can be performed. Further, since air bubbles mixed in the bonding interface portion during bonding are quickly discharged to the outside along the groove on the surface of the metal circuit board, there are problems such as swelling of the bonding surface and deterioration of heat dissipation due to defective bonding. Will be resolved.
（実施例） 以下、添附図面を参照しながら、本発明の実施例につ
いて説明する。(Examples) Examples of the present invention will be described below with reference to the accompanying drawings.
第１図は本発明の実施例に係る回路基板の平面図であ
り、第２図は第１図のII−II線に沿った断面図である。
これらの図面に示されているように、本発明の回路基板
１は、AIN、SiCなどの非酸化物系材料あるいはAl2O3、B
eOなどの酸化物系材料からなるセラミック基板２の表面
（この場合は裏側と表側の側面）に銅からなる金属回路
板３が直接接合されている。そして、本発明の特徴は、
この金属回路板３の表面に溝４が形成されていることに
ある。1 is a plan view of a circuit board according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II of FIG.
As shown in these drawings, the circuit board 1 of the present invention is made of a non-oxide material such as AIN, SiC or Al 2 O 3 , B.
A metal circuit board 3 made of copper is directly bonded to the surface of the ceramic substrate 2 made of an oxide material such as eO (in this case, the back side and the front side). And the feature of the present invention is that
The groove 4 is formed on the surface of the metal circuit board 3.
第１図に示す例においては、溝４の平面パターンが一
定の幅からなるストライプ状の溝として形成されている
が、これ以外にも、図示はしないが、たとえば格子状パ
ターンとして形成してもよい。本発明においては、回路
基板自体の規模や用途によって適宜選択され得るが、上
述した作用効果を効果的に発現させるためには、溝４の
深さは１〜100μｍの範囲が好ましく、さらに好ましく
は20〜40μｍである。溝幅は１〜150μｍの範囲が好ま
しく、さらに好ましくは50〜150μｍである。また、上
記のようなストライプパターンの場合の溝ピッチとして
は１〜20mm程度、好ましくは１〜4mmに設定することが
望ましい。また、本発明においては、第１図に示すよう
に、溝を金属回路板の全体に形成することができるが、
他の部品との接着領域のみに部分的に形成することもで
き、このような態様も本発明の範囲に含まれる。In the example shown in FIG. 1, the planar pattern of the groove 4 is formed as a stripe-shaped groove having a constant width, but other than this, although not shown, for example, it may be formed as a grid-shaped pattern. Good. In the present invention, it can be appropriately selected depending on the scale and application of the circuit board itself, but in order to effectively exhibit the above-described effects, the depth of the groove 4 is preferably in the range of 1 to 100 μm, and more preferably 20 to 40 μm. The groove width is preferably in the range of 1 to 150 μm, more preferably 50 to 150 μm. Further, in the case of the stripe pattern as described above, the groove pitch is set to about 1 to 20 mm, preferably 1 to 4 mm. Further, in the present invention, as shown in FIG. 1, the groove can be formed in the entire metal circuit board.
It may be partially formed only in the bonding area with other parts, and such an embodiment is also included in the scope of the present invention.
本発明の回路基板においては、セラミック基板に直接
接合された金属回路板の表面に、溝が形成されているの
で金属回路板の表面に他の部品をハンダを介して接着す
る場合の接着面でのハンダの濡れ性ならびに密着性が向
上し、正確かつ確実な接着を行うことができる点ですぐ
れた効果を有している。また、接着の際に接着界面部分
に混入した気泡は金属回路板表面の溝に沿って速やかに
外部に排出されるので、接合面の脹れや接着不良に伴う
放熱性の低下などの問題も解消され、品質ならびに信頼
性の向上を図る上でもすぐれた効果を有している。In the circuit board of the present invention, since the groove is formed on the surface of the metal circuit board directly bonded to the ceramic board, the surface of the metal circuit board can be bonded with other components through solder. It has an excellent effect in that the wettability and the adhesiveness of the solder are improved, and accurate and reliable adhesion can be performed. Further, since air bubbles mixed in the bonding interface portion during bonding are quickly discharged to the outside along the groove on the surface of the metal circuit board, there are problems such as swelling of the bonding surface and deterioration of heat dissipation due to defective bonding. It has been eliminated and has an excellent effect in improving quality and reliability.
第１図は本発明の実施例に係る回路基板の平面図であ
り、第２図は第１図のII−II線に沿った断面図である。 ２……セラミック基板、３……金属回路板、４……溝。1 is a plan view of a circuit board according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II of FIG. 2 ... Ceramic substrate, 3 ... Metal circuit board, 4 ... Groove.
Claims (6)
金属回路板が介在層を介することなく直接接合されてな
る回路基板において、前記金属回路板の表面のうち、少
なくとも他の部品との接着面側の表面に溝が形成されて
なることを特徴とする回路基板。1. A circuit board in which a metal circuit board is directly bonded to at least one surface of a ceramic board without an intervening layer, and at least a surface of the metal circuit board that is bonded to at least another component. A circuit board having grooves formed on the surface of.
ック基板である請求項１の回路基板。2. The circuit board according to claim 1, wherein the ceramic substrate is a non-oxide ceramic substrate.
ク基板である請求項１の回路基板。3. The circuit board according to claim 1, wherein the ceramic substrate is an oxide ceramic substrate.
路基板。4. The circuit board according to claim 1, wherein the metal circuit board is made of copper.
１の回路基板。5. The circuit board according to claim 1, wherein the groove is a stripe-shaped groove.
路基板。6. The circuit board according to claim 1, wherein the groove is a grid-shaped groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1265706A JPH0812947B2 (en) | 1989-10-12 | 1989-10-12 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1265706A JPH0812947B2 (en) | 1989-10-12 | 1989-10-12 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126287A JPH03126287A (en) | 1991-05-29 |
| JPH0812947B2 true JPH0812947B2 (en) | 1996-02-07 |
Family
ID=17420881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1265706A Expired - Lifetime JPH0812947B2 (en) | 1989-10-12 | 1989-10-12 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0812947B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5328751A (en) * | 1991-07-12 | 1994-07-12 | Kabushiki Kaisha Toshiba | Ceramic circuit board with a curved lead terminal |
| JP2009061417A (en) * | 2007-09-07 | 2009-03-26 | Mitsubishi Electric Corp | Water sterilization device and humidification device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0180939U (en) * | 1987-11-20 | 1989-05-30 | ||
| JPH01161892A (en) * | 1987-12-18 | 1989-06-26 | Toshiba Corp | Ceramics circuit board and its manufacture |
-
1989
- 1989-10-12 JP JP1265706A patent/JPH0812947B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03126287A (en) | 1991-05-29 |
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