JPH08128893A - Infrared sensor and its manufacture - Google Patents
Infrared sensor and its manufactureInfo
- Publication number
- JPH08128893A JPH08128893A JP26954194A JP26954194A JPH08128893A JP H08128893 A JPH08128893 A JP H08128893A JP 26954194 A JP26954194 A JP 26954194A JP 26954194 A JP26954194 A JP 26954194A JP H08128893 A JPH08128893 A JP H08128893A
- Authority
- JP
- Japan
- Prior art keywords
- optical filter
- infrared
- resin
- infrared sensor
- protective body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 48
- 230000003287 optical effect Effects 0.000 claims abstract description 41
- 238000001514 detection method Methods 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000013459 approach Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000005669 field effect Effects 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、人体検知に用いられる
赤外線サンセおよびその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared ray sensor used for human body detection and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】近年、非常に手軽にマイクロプロセッサ
が使用されるようになってきたのにともなって、これと
センサとを組み合わせて自動制御を行うことが多くの機
器や装置で採用されている。このようなセンサの一つと
して赤外線センサも計測器、防犯防災監視装置、空調機
器、照明機器等の機械も科学分野で広く利用されてい
る。この赤外線センサには大きく分けて量子効果型と熱
効果型の２種類がある。量子効果型センサは光と物質の
相互作用によって、直接電気信号が得られるものでその
代表例として、Ｓｉ，Ｇｅ，ＧａＡｓ材料等からなるも
のがある。これらは検出特性にあって速い応答速度、高
感度な特性を持つが、駆動時に冷却器が必要なため高価
となる。これに対して熱効果型センサは光が素子物質に
吸収されて熱に変換され、熱電現象（温度上昇によって
内部抵抗、分極素子の電気抵抗が変化する現象）を介し
て電気信号を得られるものでその代表例として、サーモ
パイル、サーミスターボロメーター、焦電素子材料等が
ある。これらは応答速度、感度の点で量子効果型センサ
に劣るものの、多くの利点が有る。例えば広範囲の波長
領域において感度が一定であり、室温で使用でき、取り
扱いが容易である。これら熱効果型がもっている特徴を
いかすことにより、安価で使い易い人体検知の監視装
置、赤外線画像装置、また照明機器、空調機器等の機械
制御装置等が提供できるものと期待されている。これら
のセンサの中でもとくに焦電素子材料を用いた赤外線セ
ンサの応用に関する研究は目をみはるものがある。2. Description of the Related Art In recent years, as microprocessors have come to be used very easily, it has been adopted in many devices and apparatuses to perform automatic control by combining them with sensors. . As one of such sensors, an infrared sensor, a measuring instrument, a crime prevention and disaster monitoring device, an air conditioner, a lighting device, and other machines are widely used in the scientific field. This infrared sensor is roughly classified into two types, a quantum effect type and a thermal effect type. The quantum effect type sensor directly obtains an electric signal by the interaction between light and a substance, and representative examples thereof include those made of Si, Ge, GaAs materials and the like. These have high detection speed, high response speed, and high sensitivity, but are expensive because they require a cooler during driving. On the other hand, in the thermal effect sensor, light is absorbed by the element material and converted into heat, and an electric signal is obtained through a thermoelectric phenomenon (a phenomenon in which the internal resistance and the electric resistance of the polarization element change due to temperature rise). As typical examples, there are thermopiles, thermistor bolometers, pyroelectric element materials and the like. Although these are inferior to the quantum effect type sensor in terms of response speed and sensitivity, they have many advantages. For example, it has a constant sensitivity in a wide wavelength range, can be used at room temperature, and is easy to handle. It is expected that by utilizing these characteristics of the thermal effect type, it is possible to provide an inexpensive and easy-to-use human body detection monitoring device, an infrared imaging device, and a machine control device such as lighting equipment and air conditioning equipment. Among these sensors, research on the application of infrared sensors using pyroelectric material is particularly remarkable.
【０００３】そこで焦電素子材料を用いた従来の赤外線
センサについて説明する。図６は従来の赤外線センサの
側断面図であって、回路基板１に電界効果型トランジス
タ２、抵抗３、および赤外線検知素子４を装着し、その
回路基板１を外部導出端子５，６，７に取り付けてい
る。そして、赤外線を入れる孔８を有する金属ケース９
をハーメチックベース１０にシール１１している。金属
ケース９の孔８には赤外線を透過する光学フィルタ１２
が設けられている。この従来の焦電型の赤外線センサ
は、金属ハーメチックシール構造を用いたパッケージを
有しておりケースが金属であるため電気的シールド効果
が得られ、また構造的にも強固であり優れた気密性を有
するという特徴を有している。またこのほかの従来技術
として、絶縁性樹脂材料を用いてケースを作る技術（実
開昭５５−４２１９６号公報）も提案されている。Therefore, a conventional infrared sensor using a pyroelectric element material will be described. FIG. 6 is a side sectional view of a conventional infrared sensor, in which a field effect transistor 2, a resistor 3 and an infrared detecting element 4 are mounted on a circuit board 1, and the circuit board 1 is connected to external lead terminals 5, 6, 7 Is attached to. And a metal case 9 having a hole 8 for receiving infrared rays
The hermetic base 10 is sealed with 11. An optical filter 12 that transmits infrared rays is provided in the hole 8 of the metal case 9.
Is provided. This conventional pyroelectric infrared sensor has a package that uses a metal hermetic seal structure, and the case is metal, so an electrical shield effect is obtained, and it is also structurally strong and has excellent airtightness. It has the feature of having. In addition, as another conventional technique, a technique of making a case using an insulating resin material (Japanese Utility Model Publication No. 55-42196) has been proposed.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
金属ハーメチックシール構造を用いたパッケージでは金
属部に光学フィルタ１２を接着剤で固定するため接着面
からの水分の進入が問題であり、かつ進入を防ぐために
進入経路を長くするには光学フィルタ１２を大きくし接
着面を大きくする必要があるので、光学フィルタ１２が
大きくなりコスト的に割高になるという問題点を有して
いた。また、絶縁性樹脂材料を用いたケースにおいても
上記の金属ハーメチックシール構造と同様に接着面を大
きくとる必要性があるが、絶縁性樹脂と光学フィルタの
接着では絶縁性樹脂部と光学フィルタ部間の導通がとれ
ないためノイズが大きくなるという問題点もあった。さ
らに光学フィルタ１２を接着する時に赤外線を受け入れ
る孔８との位置合わせが必要となり製造上にも問題点が
あった。However, in the package using the conventional metal hermetic seal structure, since the optical filter 12 is fixed to the metal portion with an adhesive, the ingress of moisture from the adhesive surface is a problem, and the ingress of moisture is a problem. In order to lengthen the approach path to prevent it, it is necessary to make the optical filter 12 large and the adhesion surface large, so that there is a problem that the optical filter 12 becomes large and the cost is high. In addition, even in the case of using an insulating resin material, it is necessary to make a large bonding surface as in the case of the above-mentioned metal hermetic seal structure. However, when bonding the insulating resin and the optical filter, the space between the insulating resin part and the optical filter part There is also a problem that noise is increased due to the lack of continuity. Further, when the optical filter 12 is bonded, it is necessary to align the position with the hole 8 for receiving infrared rays, which is a problem in manufacturing.
【０００５】本発明は前記従来の問題点を解決するもの
で、光学フィルタ部を大きくすることなく水分の進入経
路を長くし信頼性を向上でき、光学フィルタ部を導電性
樹脂に直接接続することで導通をとりノイズを抑制する
ことができ簡単に光学フィルタを組み込める赤外線セン
サを提供することを目的とする。また本発明は、量産性
に優れ歩留りが高い赤外線センサの製造方法を提供する
ことを目的とする。The present invention solves the above-mentioned problems of the prior art. It is possible to lengthen the water entry path and improve reliability without enlarging the optical filter portion, and connect the optical filter portion directly to the conductive resin. It is an object of the present invention to provide an infrared sensor that can be electrically connected to suppress noise and can easily incorporate an optical filter. Another object of the present invention is to provide a method of manufacturing an infrared sensor which has excellent mass productivity and high yield.
【０００６】[0006]
【課題を解決するための手段】このために本発明の赤外
線センサは、赤外線検知素子と、絶縁性保護体で樹脂モ
ールドした前記赤外線検知素子の検出信号をセンサ出力
に変換するセンサ回路部と、前記絶縁性保護体の周囲に
設けた導電性保護体と、赤外線を透過させる光学フィル
タとを備え、前記導電性保護体に溝部を設け前記光学フ
ィルタと導電性保護体を接続したものである。To this end, an infrared sensor according to the present invention comprises an infrared detecting element and a sensor circuit section for converting a detection signal of the infrared detecting element resin-molded with an insulating protective body into a sensor output. A conductive protective body provided around the insulating protective body and an optical filter for transmitting infrared rays are provided, and a groove is provided in the conductive protective body to connect the optical filter and the conductive protective body.
【０００７】またリードフレームにセンサ回路部と赤外
線検知素子用接続端子を形成し、前記センサ回路部用の
電子部品を前記リードフレームに搭載した後、前記リー
ドフレームの不要部分を切除し、アース端子と前記赤外
線検知素子用接続端子を突出させた状態で樹脂モールド
し、導電性保護体部に溝部を設けて光学フィルタを前記
溝部に挿入して、赤外線センサ用の光学フィルタ部を組
み立てるようにしたものである。Further, a sensor circuit section and an infrared detecting element connection terminal are formed on the lead frame, electronic parts for the sensor circuit section are mounted on the lead frame, and then unnecessary portions of the lead frame are cut off to form a ground terminal. And the infrared detection element connection terminal is projected in a resin molded state, a groove is formed in the conductive protective body portion, the optical filter is inserted into the groove portion, and the optical filter portion for the infrared sensor is assembled. It is a thing.
【０００８】[0008]
【作用】上記構成において、光学フィルタの接着部とし
て導電性樹脂部に溝を設けることにより接着面積を大き
くし水分の進入経路を長くすることで水分の悪影響によ
り電子部品の劣化を防ぐことができる。さらに導電性樹
脂部に設けた溝部により光学フィルタとの導通を導電性
接着剤を使用して接着することで導通を確実にとること
ができ外的な電磁波によるノイズを抑えることができ
る。さらに導電性樹脂部に溝部を設けることにより確実
に光学フィルタを機械的に固定することができる。In the above structure, by providing a groove in the conductive resin portion as the adhesive portion of the optical filter to increase the adhesive area and lengthen the moisture entry path, it is possible to prevent the deterioration of electronic parts due to the adverse effect of moisture. . Further, by electrically connecting the optical filter with the optical filter by means of the groove provided in the electrically conductive resin portion, it is possible to surely establish electrical connection and suppress noise due to external electromagnetic waves. Further, by providing the groove portion in the conductive resin portion, the optical filter can be reliably fixed mechanically.
【０００９】また導電性樹脂部に溝を設けることで光学
フィルタの位置決めが容易でかつ簡単に接着が可能とな
り導電性樹脂との導通も簡単にとれ安定した位置に安定
した導通抵抗を有した赤外線センサの量産をすることが
できコストの低減になる。Further, by providing a groove in the conductive resin portion, the optical filter can be easily positioned and easily adhered, the conduction with the conductive resin can be easily obtained, and the infrared ray having a stable conduction resistance at a stable position. The sensor can be mass-produced and the cost can be reduced.
【００１０】[0010]
【実施例】以下、本発明の赤外線センサおよびその製造
方法の一実施例について説明する。図１は本発明の一実
施例における赤外線センサの回路図である。図１におい
て２１は赤外線検知素子、２２は赤外線検知素子２１に
並列に設けられた抵抗である。抵抗２２は電流安定化の
ために設けられる。２３は電界効果型トランジスタであ
り、赤外線検知素子２１の検出した検出信号部側とのイ
ンピーダンス整合や電流電圧変換等をする作用を持つも
のである。赤外線検知素子２１としては焦電素子が適当
であるが、サーモパイル、サーミスタボロメータでもか
まわない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the infrared sensor of the present invention and its manufacturing method will be described below. FIG. 1 is a circuit diagram of an infrared sensor according to an embodiment of the present invention. In FIG. 1, reference numeral 21 is an infrared detecting element, and 22 is a resistor provided in parallel with the infrared detecting element 21. The resistor 22 is provided to stabilize the current. Reference numeral 23 is a field effect transistor, which has an action of impedance matching with the detection signal portion side detected by the infrared detection element 21 and current-voltage conversion. A pyroelectric element is suitable as the infrared detection element 21, but a thermopile or a thermistor bolometer may be used.
【００１１】図２は本発明の一実施例における赤外線セ
ンサを製造する際のリードフレームに電子部品を搭載し
た状態の分解斜視図である。図３は、同赤外線センサの
分解斜視図である。図２において、２４はリードフレー
ムで、一対の基体２４ａにわたって設けられた連結部２
４ｂ’、２４ｃと、一対の基体２４ａからそれぞれ延設
された延設部２４ｄ’、２４ｅ’を備えている。これら
は後述するセンサ回路部に電子部品を載せるセンサ回路
を構成する。連結部２４ｂ’と連結部２４ｃにはそれぞ
れ互いに向き合う方向に突き出した接続端子部２４ｆ、
２４ｇが設けられており、さらに接続端子部２４ｆ、２
４ｇにはそれぞれ同一方向に屈曲して接続端子２４ｈ、
２４ｉが延設されている。抵抗２２は接続端子部２４ｇ
と連結部２４ｂ’の双方に半田等で接合されている。ま
た電界効果型トランジスタ２３は、接続端子部２４ｇと
延設部２４ｄ’、２４ｅ’のそれぞれに半田等で接合さ
れている。FIG. 2 is an exploded perspective view showing a state in which electronic parts are mounted on a lead frame when manufacturing an infrared sensor according to an embodiment of the present invention. FIG. 3 is an exploded perspective view of the infrared sensor. In FIG. 2, reference numeral 24 denotes a lead frame, which is a connecting portion 2 provided over a pair of bases 24a.
4b ', 24c, and extended portions 24d', 24e 'extended from a pair of bases 24a, respectively. These form a sensor circuit that mounts electronic components on a sensor circuit unit described later. The connecting portion 24b ′ and the connecting portion 24c respectively have connecting terminal portions 24f protruding in directions facing each other,
24g is provided, and the connection terminal portions 24f, 2
4g are bent in the same direction, and connection terminals 24h,
24i is extended. The resistor 22 is a connection terminal portion 24g.
To the connecting portion 24b '. The field effect transistor 23 is joined to the connection terminal portion 24g and the extended portions 24d 'and 24e' by soldering or the like.
【００１２】このように電界効果型トランジスタ２３と
抵抗２２を搭載した後、図２に示す点線に沿ってリード
フレーム２４の不要部分を切除する。すなわち、連結部
２４ｂ’の両端部を切断し、さらに連結部２４ｃはその
中央部のみを残すように切除し、さらに延設部２４
ｄ’、２４ｅ’のそれぞれの両端部を切除する。このよ
うに不要部分を切除した後のリードフレーム２４には、
電界効果型トランジスタ２３と抵抗２２が搭載されてお
り、これらで赤外線検知素子２１の検出信号をセンサ出
力に変換するセンサ回路部を構成している。After mounting the field effect transistor 23 and the resistor 22 in this manner, unnecessary portions of the lead frame 24 are cut off along the dotted line shown in FIG. That is, both ends of the connecting portion 24b 'are cut, the connecting portion 24c is cut off so that only the central portion thereof is left, and the extending portion 24 is further cut.
Both ends of d'and 24e 'are cut off. After the unnecessary portion is cut off in this way, the lead frame 24 has
A field effect transistor 23 and a resistor 22 are mounted, and these constitute a sensor circuit unit that converts a detection signal of the infrared detection element 21 into a sensor output.
【００１３】図３のようにこのセンサ回路部を耐候性等
を有する材料により覆って樹脂モールドして絶縁性樹脂
２５を形成する。この作業はトランスファー成型機によ
り行われる。このときリードフレーム２４の一部である
外部導出端子２４ｂ、２４ｅ、２４ｄ、および赤外線検
知素子２１に接続される一対の延設された接続端子２４
ｈ、２４ｉ、さらに延設されたアース端子２４ｊ（図
４）は絶縁性樹脂２５の外に突出された状態で樹脂モー
ルドされる。外部導出端子２４ｂは図２に示す基体２４
ａを切除した際に形成され、外部導出端子２４ｂ、２４
ｅもそれぞれ基体２４ａを切除した際に形成されたもの
である。外部導出端子２４ｄ、２４ｅ、２４ｂのうち電
界効果型トランジスタ２３のドレイン端子となる外部導
出端子２４ｅおよびソース端子となる外部導出端子２４
ｄには、それぞれ根元に成形段２６が設けられている。
成形段２６は絶縁性樹脂２５の一部であり、絶縁性樹脂
２５の外部を覆う、以下で説明する導電性樹脂２７と外
部導出端子２４ｅ、２４ｄが電気的に接触しないことを
目的として設けられる。As shown in FIG. 3, the sensor circuit portion is covered with a material having weather resistance and is resin-molded to form an insulating resin 25. This work is performed by a transfer molding machine. At this time, a pair of extended connection terminals 24 connected to the external lead-out terminals 24b, 24e, 24d, which are a part of the lead frame 24, and the infrared detection element 21.
The h and 24i and the extended ground terminal 24j (FIG. 4) are resin-molded in a state of protruding outside the insulating resin 25. The external lead-out terminal 24b is the base 24 shown in FIG.
The external lead-out terminals 24b, 24 are formed when a is cut off.
Each of e is also formed when the base body 24a is cut off. Of the external lead-out terminals 24d, 24e, and 24b, the external lead-out terminal 24e serving as the drain terminal of the field-effect transistor 23 and the external lead-out terminal 24 serving as the source terminal.
A molding step 26 is provided at the root of each d.
The molding step 26 is a part of the insulating resin 25 and is provided for the purpose of covering the outside of the insulating resin 25 so that the conductive resin 27 and external lead-out terminals 24e and 24d described below do not make electrical contact. .
【００１４】ところで絶縁性樹脂２５を形成する樹脂と
してはアクリロニトリル−ブタジエン−スチレン樹脂、
ポリエチレンテレフタレート樹脂、ポリカーボネート樹
脂、エポキシ樹脂等の絶縁性樹脂を使用することが適切
である。しかしエポキシ樹脂を用いるのがもっとも好ま
しい。樹脂の耐久性が高く、熱膨脹係数が金属に近いた
め、温度の変動に原因する気密性破壊を防ぐことができ
る。また耐熱性も高く、外部に射出成形による樹脂層を
形成することが可能である。次に絶縁性樹脂２５の周囲
に射出成型機を用いて導電性樹脂２７を形成する。導電
性樹脂としてはポリカーボネート樹脂を主成分とし、こ
れに導電性を有するカーボン繊維を含有するとともに比
抵抗が１０-1Ωｃｍの導電性樹脂２７を使用するのが適
当である。By the way, as the resin forming the insulating resin 25, acrylonitrile-butadiene-styrene resin,
It is suitable to use an insulating resin such as polyethylene terephthalate resin, polycarbonate resin, or epoxy resin. However, it is most preferable to use an epoxy resin. Since the durability of the resin is high and the coefficient of thermal expansion is close to that of metal, it is possible to prevent airtightness destruction due to temperature fluctuation. Further, it has high heat resistance, and it is possible to form a resin layer on the outside by injection molding. Next, a conductive resin 27 is formed around the insulating resin 25 using an injection molding machine. As the conductive resin, it is suitable to use a conductive resin 27 which contains a polycarbonate resin as a main component, contains conductive carbon fibers, and has a specific resistance of 10 -1 Ωcm.
【００１５】図４は本発明の一実施例における赤外線セ
ンサの分解斜視図で、図５は本発明の一実施例における
赤外線センサの側断面図である。この際、導電性樹脂２
７に外部導出端子２４ｅ、２４ｄを接触させると出力が
得られないので既述した通り成形段２６を設けて導電性
樹脂２７が外部導出端子２４ｅ、２４ｄに接触しないよ
うにしなければならない。また導電性樹脂２７に溝部２
８を成形時に形成する。光学フィルタ２９の表裏面２９
ｂは導電性がないため既述したように光学フィルタ２９
の端面部２９ａと溝部２８の接触が重要である。また導
電性樹脂２７は、絶縁性樹脂２５の周囲を覆うものであ
るが、接続端子２４ｈ、２４ｉが配置されている側面に
は覆うようには成形されておらず、これらを開放して取
り囲むように設けられている。すなわち導電性樹脂２７
の内側には凹部３０が形成され、その凹部３０の内部に
接続端子２４ｈ、２４ｉが突出され周囲を凹部で包囲さ
れた状態にある。続いて赤外線検知素子２１を凹部３０
内に載置し、接続端子２４ｈ、２４ｉに赤外線検知素子
２１を導電性接着剤を用いて電気的、機械的に接続し、
最後に導電性を有し赤外線を選択的に透過するシリコン
性の光学フィルタ２９を溝部２８に光学フィルタ２９を
スライドするように挿入することで光学フィルタ２９の
位置決めが容易にできる。かつ溝部２８に少なくとも一
ヵ所に導電性接着剤を塗布し他の部分には絶縁性接着剤
を塗布しておけば導電性樹脂２７と光学フィルタ２９を
容易に固定した状態で接着が可能となる。さらに溝部２
８を形成しているため水分の進入経路は２倍以上となり
信頼性の向上となる。そして導電性樹脂２７と光学フィ
ルタ２９が完全に導通がとれるため光学フィルタ２９の
部分の高インピーダンスによる外部からのノイズの影響
も軽減することが可能となる。FIG. 4 is an exploded perspective view of the infrared sensor according to the embodiment of the present invention, and FIG. 5 is a side sectional view of the infrared sensor according to the embodiment of the present invention. At this time, the conductive resin 2
Since the output cannot be obtained when the external lead terminals 24e and 24d are brought into contact with 7, it is necessary to provide the molding step 26 as described above to prevent the conductive resin 27 from coming into contact with the external lead terminals 24e and 24d. Further, the groove 2 is formed in the conductive resin 27.
8 is formed at the time of molding. Front and back surfaces 29 of the optical filter 29
Since b is not conductive, as described above, the optical filter 29
It is important that the end face portion 29a of the groove and the groove portion 28 contact each other. Further, the conductive resin 27 covers the periphery of the insulating resin 25, but is not formed so as to cover the side surfaces on which the connection terminals 24h and 24i are arranged. It is provided in. That is, the conductive resin 27
A concave portion 30 is formed inside of the concave portion 30, and the connection terminals 24h and 24i are projected inside the concave portion 30 and are surrounded by the concave portion. Then, the infrared detecting element 21 is provided with the recess 30.
Placed inside, and the infrared detection element 21 is electrically and mechanically connected to the connection terminals 24h and 24i by using a conductive adhesive,
Finally, a silicon optical filter 29 having conductivity and selectively transmitting infrared rays is inserted into the groove 28 so as to slide the optical filter 29, so that the optical filter 29 can be easily positioned. In addition, if a conductive adhesive is applied to at least one portion of the groove 28 and an insulating adhesive is applied to the other portions, the conductive resin 27 and the optical filter 29 can be easily fixed and bonded together. . Further groove 2
Since No. 8 is formed, the moisture entry route is more than doubled, and the reliability is improved. Further, since the conductive resin 27 and the optical filter 29 are completely electrically connected, it is possible to reduce the influence of noise from the outside due to the high impedance of the portion of the optical filter 29.
【００１６】なお、本発明実施例では溝部２８を導電性
樹脂２７に設けたが、導電性樹脂２７と絶縁性樹脂２５
の境界に構成してもかまわない。ただしこのときには光
学フィルタ２９の端面部２９ａが導電性樹脂２７と必ず
接触する必要がある。Although the groove 28 is provided in the conductive resin 27 in the embodiment of the present invention, the conductive resin 27 and the insulating resin 25 are used.
It may be configured at the boundary of. However, at this time, the end surface portion 29a of the optical filter 29 must be in contact with the conductive resin 27 without fail.
【００１７】[0017]
【発明の効果】本発明は、赤外線受け入れ孔に使用され
る光学フィルタをのぞく赤外線検知素子、回路部品を樹
脂で一体モールドし接続しかつ光学フィルタを導電性樹
脂に溝部を形成することでスライド挿入し導電性接着
剤、絶縁性接着剤で固定する構造となるため、外部から
の水分の進入経路を長くして水分に対する電子部品の劣
化を防ぐことができ、高信頼性の赤外線センサを提供す
ることが可能となる。また導電性樹脂と光学フィルタが
導電性接着剤と絶縁性接着剤で電気的、機械的に接続さ
れているため光学フィルタの高いインピーダンスによる
外部からのノイズの影響を低減することができる。INDUSTRIAL APPLICABILITY According to the present invention, the infrared detecting element except for the optical filter used for the infrared receiving hole and the circuit component are integrally molded with resin to be connected, and the optical filter is formed into a groove in the conductive resin so as to be slid. Since the structure is fixed with a conductive adhesive or an insulating adhesive, it is possible to prevent the deterioration of electronic parts due to moisture by lengthening the path of moisture entering from the outside, and to provide a highly reliable infrared sensor. It becomes possible. Further, since the conductive resin and the optical filter are electrically and mechanically connected by the conductive adhesive and the insulating adhesive, it is possible to reduce the influence of external noise due to the high impedance of the optical filter.
【００１８】また光学フィルタを溝部にスライドして挿
入し接着することが可能であるため、光学フィルタの位
置決めが容易で接着の際の固定も容易に行うことができ
量産が容易で信頼性の高い赤外線センサを実現できる。Further, since the optical filter can be slid into the groove and inserted and adhered, the optical filter can be easily positioned and easily fixed at the time of adhesion, and mass production is easy and highly reliable. An infrared sensor can be realized.
【図１】本発明の一実施例における赤外線センサの回路
図FIG. 1 is a circuit diagram of an infrared sensor according to an embodiment of the present invention.
【図２】本発明の一実施例における赤外線センサを製造
する際のリードフレームに電子部品を搭載した状態の分
解斜視図FIG. 2 is an exploded perspective view showing a state in which electronic parts are mounted on a lead frame when manufacturing an infrared sensor according to an embodiment of the present invention.
【図３】本発明の一実施例における赤外線センサの分解
斜視図FIG. 3 is an exploded perspective view of an infrared sensor according to an embodiment of the present invention.
【図４】本発明の一実施例における赤外線センサの分解
斜視図FIG. 4 is an exploded perspective view of an infrared sensor according to an embodiment of the present invention.
【図５】本発明の一実施例における赤外線センサの側断
面図FIG. 5 is a side sectional view of an infrared sensor according to an embodiment of the present invention.
【図６】従来の赤外線センサの側断面図FIG. 6 is a side sectional view of a conventional infrared sensor.
２１ 赤外線検知素子 ２２ 抵抗 ２３ 電界効果型トランジスタ ２４ リードフレーム ２５ 絶縁性樹脂 ２７ 導電性樹脂 ２８ 溝部 ２９ 光学フィルタ ３０ 凹部 21 Infrared Detector 22 Resistor 23 Field Effect Transistor 24 Lead Frame 25 Insulating Resin 27 Conductive Resin 28 Groove 29 Optical Filter 30 Recess
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｇ０１Ｖ 8/12 Ｈ０１Ｌ 37/02 (72)発明者 渡辺 浩一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Internal reference number FI Technical display location G01V 8/12 H01L 37/02 (72) Inventor Koichi Watanabe 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd.
Claims (2)
ールドした前記赤外線検知素子の検出信号をセンサ出力
に変換するセンサ回路部と、前記絶縁性保護体の周囲に
設けた導電性保護体と、赤外線を透過させる光学フィル
タとを備え、前記導電性保護体に溝部を設け前記光学フ
ィルタと導電性保護体を接続したことを特徴とする赤外
線センサ。1. An infrared sensing element, a sensor circuit section for converting a detection signal of the infrared sensing element resin-molded with an insulating protective body into a sensor output, and a conductive protective body provided around the insulating protective body. And an optical filter for transmitting infrared rays, wherein a groove is provided in the conductive protective body, and the optical filter and the conductive protective body are connected to each other.
知素子用接続端子を形成し、前記センサ回路部用の電子
部品を前記リードフレームに搭載した後、前記リードフ
レームの不要部分を切除し、アース端子と前記赤外線検
知素子用接続端子を突出させた状態で樹脂モールドし、
導電性保護体部に溝部を設けて光学フィルタを前記溝部
に挿入して、赤外線センサ用の光学フィルタ部を組み立
てることを特徴とする赤外線センサの製造方法。2. A lead frame is provided with a sensor circuit section and a connection terminal for an infrared detecting element, and after mounting an electronic component for the sensor circuit section on the lead frame, an unnecessary portion of the lead frame is cut off and grounded. Resin molding with the terminal and the infrared detection element connection terminal protruding,
A method for manufacturing an infrared sensor, characterized in that a groove portion is provided in a conductive protective body portion, an optical filter is inserted into the groove portion, and an optical filter portion for an infrared sensor is assembled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26954194A JPH08128893A (en) | 1994-11-02 | 1994-11-02 | Infrared sensor and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26954194A JPH08128893A (en) | 1994-11-02 | 1994-11-02 | Infrared sensor and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08128893A true JPH08128893A (en) | 1996-05-21 |
Family
ID=17473822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26954194A Pending JPH08128893A (en) | 1994-11-02 | 1994-11-02 | Infrared sensor and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08128893A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011021519A1 (en) * | 2009-08-17 | 2011-02-24 | パナソニック電工株式会社 | Infrared sensor |
-
1994
- 1994-11-02 JP JP26954194A patent/JPH08128893A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011021519A1 (en) * | 2009-08-17 | 2011-02-24 | パナソニック電工株式会社 | Infrared sensor |
| US9074935B2 (en) | 2009-08-17 | 2015-07-07 | Panasonic Intellectual Property Management Co., Ltd. | Infrared sensor |
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