JPH08124658A - Linear heating element and its manufacture - Google Patents
Linear heating element and its manufactureInfo
- Publication number
- JPH08124658A JPH08124658A JP26251594A JP26251594A JPH08124658A JP H08124658 A JPH08124658 A JP H08124658A JP 26251594 A JP26251594 A JP 26251594A JP 26251594 A JP26251594 A JP 26251594A JP H08124658 A JPH08124658 A JP H08124658A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- temperature
- insulating substrate
- line
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、絶縁基板の表面に発熱
抵抗体をライン状に形成してなるライン型加熱体に関
し、特に発熱抵抗体の温度を検出するための温度検出体
を有するライン型加熱体及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a line type heating element in which a heating resistor is formed in a line on the surface of an insulating substrate, and more particularly to a line having a temperature detecting element for detecting the temperature of the heating resistor. The present invention relates to a mold heating body and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、ライン型加熱体の温度検出には、
金属酸化物を主成分とするセラミックを焼結してなるサ
ーミスタチップ片を使用し、このサーミスタチップ片を
前記ライン型加熱体における絶縁基板の裏面に、当該サ
ーミスタチップ片の両端が絶縁基板の裏面に予め形成さ
れている一対の電極パターンに電気的に導通するように
してダイボンディングして成っている。このサーミスタ
チップ片の抵抗値が温度によって変化することを検出
し、発熱抵抗体に供給する電力量を増減することによ
り、発熱抵抗体の発熱温度が所定値になるように制御す
るという構成であった。2. Description of the Related Art Conventionally, to detect the temperature of a line type heating element,
A thermistor chip piece obtained by sintering a ceramic containing a metal oxide as a main component is used, and the thermistor chip piece is on the back surface of the insulating substrate in the line type heating element, and both ends of the thermistor chip piece are the back surface of the insulating substrate. It is formed by die bonding so as to be electrically connected to a pair of electrode patterns formed in advance. By detecting that the resistance value of the thermistor chip changes with temperature and increasing or decreasing the amount of power supplied to the heating resistor, the heating temperature of the heating resistor is controlled to reach a predetermined value. It was
【０００３】しかし、このようにライン型加熱体におけ
る絶縁基板の裏面にサーミスタチップ片を絶縁基板の裏
面に予め形成されている一対の電極パターン表面を橋絡
するようにダイボンディングするという構成では、サー
ミスタチップ片が絶縁基板の裏面から電極パターンの厚
さの分だけ浮き上がっていることにより応答性が低いの
であり、しかも前記サーミスタチップ片と絶縁基板との
間における熱膨張差によって、サーミスタチップ片にお
ける温度抵抗値が微妙に変化するために温度制御の精度
が低いという問題があった。However, in such a structure in which the thermistor chip pieces are die-bonded to the back surface of the insulating substrate in the line-type heating element so as to bridge the pair of electrode pattern surfaces previously formed on the back surface of the insulating substrate, Since the thermistor chip piece is lifted from the back surface of the insulating substrate by the thickness of the electrode pattern, the responsiveness is low, and due to the difference in thermal expansion between the thermistor chip piece and the insulating substrate, the thermistor chip piece There is a problem that the accuracy of temperature control is low because the temperature resistance value changes subtly.
【０００４】そこで、先行技術しての特開平５−２６５
３５０号公報は、前記のサーミスタチップ片を使用する
ことの不具合を解決するために、ライン型加熱体におけ
る絶縁基板の裏面に、タングステン、モリブデンを含有
することによって正の高い抵抗温度係数（温度上昇に従
い抵抗値が増大）を有する抵抗体ペーストをスクリーン
印刷にて膜状に塗着したのち焼成することによって、膜
状の抵抗体を形成し、この膜状の抵抗体を温度検出体と
して使用することを提案している。Therefore, as a prior art, Japanese Patent Laid-Open No. 5-265
In order to solve the problem of using the above-mentioned thermistor chip, JP-A No. 350-350 has a positive high temperature coefficient of resistance (temperature rise) by containing tungsten and molybdenum on the back surface of the insulating substrate in the line type heating element. A resistor paste having an increased resistance value) is applied in a film form by screen printing and then fired to form a film resistor, and the film resistor is used as a temperature detector. Is proposing that.
【０００５】[0005]
【発明が解決しようとする課題】しかし、この先行技術
のように、温度検出体として使用する膜状の抵抗体は、
タングステン、モリブデンを含むことにより、図８の温
度に対する抵抗値特性を示す破線Ｂで示すように正の高
い温度係数を有するものであって、高い温度域では抵抗
値が急激に高くなり、従って電流値が小さくなることに
より、ノイズの影響を受け易いことに加えて、高い温度
域での抵抗値の変化量が大きいので、発熱抵抗体に対す
る温度制御の精度がかなり低いという問題点があった。However, as in this prior art, the film-like resistor used as the temperature detector is
By containing tungsten and molybdenum, as shown by a broken line B showing the resistance value characteristic with respect to the temperature in FIG. 8, the temperature coefficient is positive and has a high value, and the resistance value rapidly increases in the high temperature region. Since the value becomes small, the resistance value is easily affected by noise, and the change amount of the resistance value in a high temperature range is large, so that there is a problem that the accuracy of temperature control for the heating resistor is considerably low.
【０００６】さらに、ライン型加熱体は通常コピー、Ｆ
ＡＸ等の電子機器に搭載されて使用される場合、印刷が
行われている間は常時約２００℃前後になるため、連続
して使用する場合、抵抗体自体が加熱によるトリミング
をされている状態になってしまう。この時、抵抗体を覆
っている保護層に硼硅酸鉛ガラスや、ポリアミド系樹
脂、フェノール系樹脂等を用いても、図９に発熱抵抗体
の加熱時間と抵抗体の抵抗値変化をそれぞれ点線Ｂ、一
点鎖線Ｃ、二点鎖線Ｄに示すように加熱時間の経過とと
もに抵抗体が大幅に抵抗値変化をおこし、発熱抵抗体に
対する温度制御の精度が使用時間に比例して低下してし
まうという問題点があった。Further, the line type heating element is usually a copy, F
When mounted on an electronic device such as an AX and used, the temperature is constantly around 200 ° C during printing, so when used continuously, the resistor itself is trimmed by heating. Become. At this time, even if lead borosilicate glass, polyamide resin, phenol resin, or the like is used for the protective layer covering the resistor, the heating time of the heating resistor and the resistance value change of the resistor are shown in FIG. As indicated by the dotted line B, the alternate long and short dash line C, and the alternate long and two short dashes line D, the resistance value of the resistor changes drastically as the heating time elapses, and the accuracy of temperature control for the heating resistor decreases in proportion to the operating time. There was a problem.
【０００７】本発明は、高温度域における温度制御の精
度を向上させたライン型加熱体とその製造方法を提供す
ることを目的とする。An object of the present invention is to provide a line-type heating element with improved temperature control accuracy in a high temperature range and a method for manufacturing the same.
【０００８】[0008]
【課題を解決するための手段】従来の課題を解決するた
めに、本願の請求項１に記載した発明は、絶縁基板の表
面に発熱抵抗体を形成してなるライン型加熱体におい
て、前記絶縁基板の裏面に膜状に形成され少なくともコ
バルト及びマンガンのいずれか一方を含む前記発熱抵抗
体の温度を検出するための温度検出体と、前記温度検出
体を覆いカドミウムを含む非晶質ガラスよりなる層と、
を有することを特徴としている。In order to solve the conventional problems, the invention described in claim 1 of the present application is a line-type heating body in which a heating resistor is formed on the surface of an insulating substrate. A temperature detector for detecting the temperature of the heating resistor formed on the back surface of the substrate in the form of a film and containing at least one of cobalt and manganese; and an amorphous glass containing cadmium and covering the temperature detector. Layers and
It is characterized by having.
【０００９】一方、本願の請求項２に記載した発明は、
絶縁基板の表面に発熱抵抗体を形成してなるライン型加
熱体の製造方法において、前記絶縁基板の裏面に、少な
くともコバルト及びマンガンのいずれか一方を含む抵抗
ペーストを印刷したのち焼成して前記発熱抵抗体の温度
検出用の温度検出体を膜状に形成し、次いで前記温度検
出体の両端に対する電極パターンを当該電極パターンが
前記温度検出体の両端に対して重なるように形成し、そ
の後カドミウムを含む非晶質ガラスよりなる層を少なく
とも前記温度検出体を覆うように形成したことを特徴と
している。On the other hand, the invention described in claim 2 of the present application is
In a method for manufacturing a line-type heating element, which comprises forming a heating resistor on the surface of an insulating substrate, a resistor paste containing at least one of cobalt and manganese is printed on the back surface of the insulating substrate and then fired to generate the heat. A temperature detection body for detecting the temperature of the resistor is formed in a film shape, and then electrode patterns for both ends of the temperature detection body are formed so that the electrode pattern overlaps both ends of the temperature detection body, and then cadmium is formed. It is characterized in that a layer made of amorphous glass containing therein is formed so as to cover at least the temperature detecting body.
【００１０】[0010]
【発明の作用及び効果】絶縁基板の表面に発熱抵抗体を
形成してなるライン型加熱体において、前記発熱抵抗体
の温度検出体がコバルト及びマンガンのうちいずれか一
方又は両方を含む抵抗体であることにより、図８に温度
に対する抵抗値特性を示す実線Ａで示すように、負の高
い抵抗温度係数を有する。それにより、高い温度域での
温度検出体の抵抗値が低くなって電流値を高くすること
ができ、ノイズの影響を低減することができると共に、
高い温度域での抵抗値の変化量を小さくできるので、ラ
イン型加熱体の発熱抵抗体の温度制御の精度を大幅に向
上できるという効果を有する。According to the present invention, in a line type heating element having a heating resistor formed on the surface of an insulating substrate, the temperature detecting element of the heating resistor is a resistor containing one or both of cobalt and manganese. Due to this, as shown by the solid line A showing the resistance value characteristic with respect to temperature in FIG. 8, it has a high negative resistance temperature coefficient. As a result, the resistance value of the temperature detector in the high temperature range becomes low, and the current value can be increased, and the influence of noise can be reduced, and
Since the amount of change in the resistance value in the high temperature range can be reduced, there is an effect that the temperature control accuracy of the heating resistor of the line-type heating element can be significantly improved.
【００１１】そして、絶縁基板の表面に発熱抵抗体を形
成してなるライン型加熱体において、前記発熱抵抗体の
温度検出体がコバルト及びマンガンのうちいずれか一方
又は両方を含む抵抗体を前記絶縁基板の裏面に膜状に形
成された抵抗体で、且つ前記抵抗体がカドミウムを含む
非晶質ガラスよりなる層で被覆されていることにより、
図９に発熱抵抗体の加熱時間と抵抗体の抵抗値変化を実
線Ａで示すように、ライン型加熱体の熱によるライン型
加熱体の使用時間に比例して抵抗体が抵抗値変化をおこ
すのを防止することができ、さらにライン型加熱体の発
熱抵抗体の温度制御の精度を向上できるという効果を有
する。In a line type heating element having a heating resistor formed on the surface of an insulating substrate, the temperature detecting element of the heating resistor is insulated from the resistor containing one or both of cobalt and manganese. By a resistor formed in a film shape on the back surface of the substrate, and the resistor is covered with a layer made of amorphous glass containing cadmium,
As shown by the solid line A in FIG. 9 for the heating time of the heating resistor and the resistance value change of the resistor, the resistor changes the resistance value in proportion to the usage time of the line heating element due to the heat of the line heating element. It is possible to prevent this, and further, it is possible to improve the accuracy of temperature control of the heating resistor of the line-type heating body.
【００１２】一方、絶縁基板の表面に発熱抵抗体を形成
してなるライン型加熱体の製造方法において、前記絶縁
基板の裏面に、コバルト及びマンガンのうちいずれか一
方又は両方を含む抵抗ペーストを印刷したのち焼成して
前記発熱抵抗体の温度検出用の温度検出体を膜状に形成
し、次いで前記抵抗体の両端に対する電極パターンを当
該電極パターンが前記抵抗体の両端に対して重なるよう
に形成し、その後カドミウムを含む非晶質ガラスよりな
る層を少なくとも前記抵抗体を覆うように形成したこと
により、前記絶縁基板に対して温度検出体用ペーストを
印刷する場合に、印刷に使用するスクリーンを絶縁基板
に密接することができるので、抵抗体における膜厚を薄
くすることができると共に、その膜厚のバラツキを小さ
くすることができる測定精度の高い抵抗体を形成できる
という効果を有するだけでなく、抵抗体をカドミウムを
含む非晶質ガラスよりなる層で覆うことにより、ライン
型加熱体の使用時の熱による抵抗値の経時変化の少ない
抵抗体を形成できるという効果を有する。On the other hand, in a method for manufacturing a line-type heating body in which a heating resistor is formed on the surface of an insulating substrate, a resistive paste containing one or both of cobalt and manganese is printed on the back surface of the insulating substrate. Then, it is fired to form a temperature detecting body for detecting the temperature of the heating resistor in a film shape, and then electrode patterns for both ends of the resistor are formed so that the electrode pattern overlaps both ends of the resistor. Then, by forming a layer made of amorphous glass containing cadmium so as to cover at least the resistor, when printing the temperature detecting paste to the insulating substrate, the screen used for printing Since it can be in close contact with the insulating substrate, the film thickness of the resistor can be reduced and the variation in the film thickness can be reduced. Not only does it have the effect of forming a resistor with high measurement accuracy, but by covering the resistor with a layer made of amorphous glass containing cadmium, the resistance changes over time due to the heat when the line type heating element is used. This has the effect of forming a resistor with less charge.
【００１３】[0013]
【実施例】以下本発明の実施例を図１乃至図７に基づい
て説明する。図１は、セラミックよりなる絶縁基板２の
表面に、酸化ルテニウムよりなる発熱抵抗体３をライン
状に形成したライン型加熱体１を示す。このライン型加
熱体１を、図２に示すように裏返した状態で、その絶縁
基板２の裏面に対して抵抗体形成用の抜き窓４ａを穿設
したスクリーン４を重ね、このスクリーン４の抜き窓４
ａ内に、コバルト及びマンガンのうちいずれか一方又は
両方を含む抵抗体用ペーストをスクリーン印刷によって
充填した後これを焼成することにより、図３に示すよう
に膜状の抵抗体５を形成する。次いで、前記絶縁基板２
の裏面に対して、図４に示すように２本の電極パターン
形成用の抜き窓６ａ、６ｂを穿設したスクリーン６を重
ね、このスクリーン６の抜き窓６ａ、６ｂ内に、銀ペー
スト等の導電性ペーストをスクリーン印刷によって充填
した後これを焼成することにより、図５に示すように一
対の電極パターン７、８を当該電極パターン７、８が前
記膜状の抵抗体５の両端に対して一部重なるようにして
形成する。そして、前記抵抗体の抵抗値を所望の値にな
るように前記電極パターン７、８より電圧パルスを印加
することによりトリミングする。次いで、少なくとも膜
状の抵抗体５を覆うように、熱印字ヘッドの発熱抵抗体
の保護層に従来より用いられている周知のガラスペース
トを印刷した後これを焼成することにより、図６に示す
ように結晶化ガラスの保護層９を形成し、さらに前記保
護層９を覆うようにカドミウムを含むガラスペーストを
印刷した後これを焼成することにより非晶質ガラスのオ
ーバーコート層１０を形成する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows a line-type heating body 1 in which a heating resistor 3 made of ruthenium oxide is formed in a line on a surface of an insulating substrate 2 made of ceramic. As shown in FIG. 2, the line-type heating body 1 is turned upside down, and a screen 4 having a punched window 4a for resistor formation is laid on the back surface of the insulating substrate 2 and the screen 4 is removed. Window 4
A resistor paste containing one or both of cobalt and manganese is filled in a by screen printing and then fired to form a film-shaped resistor 5, as shown in FIG. Then, the insulating substrate 2
As shown in FIG. 4, a screen 6 having two punched windows 6a and 6b for electrode pattern formation is laid on the back surface of the screen 6, and silver paste or the like is placed in the punched windows 6a and 6b of the screen 6. By filling the conductive paste by screen printing and baking it, a pair of electrode patterns 7 and 8 are applied to both ends of the film-shaped resistor 5 as shown in FIG. It is formed so as to partially overlap. Then, trimming is performed by applying a voltage pulse from the electrode patterns 7 and 8 so that the resistance value of the resistor becomes a desired value. Next, a well-known glass paste which has been conventionally used is printed on the protective layer of the heating resistor of the thermal print head so as to cover at least the film-shaped resistor 5, and then the glass paste is fired, as shown in FIG. Thus, a protective layer 9 of crystallized glass is formed, and a glass paste containing cadmium is printed so as to cover the protective layer 9 and then baked to form an overcoat layer 10 of amorphous glass.
【００１４】尚、前述のライン型加熱体の実施例では、
熱印字ヘッドで用いられる周知の結晶化ガラス層を形成
した後にカドミウムを含むガラスペーストを焼成した非
晶質ガラスをオーバーコート層を形成する２層構造を示
したが、カドミウムを含むガラスペーストを焼成して保
護層とした１層構造でも良い。前述の実施例のようにラ
イン型発熱体において、発熱抵抗体の温度検出体がコバ
ルト及びマンガンのうちいずれか一方又は両方を含む抵
抗体を前記絶縁基板の裏面に膜状に形成された抵抗体
で、且つ前記抵抗体がカドミウムを含む非晶質ガラスよ
りなる層で被覆されていることにより、高い温度域での
温度検出体の抵抗値が低くなって電流値を高くすること
ができ、ノイズの影響を低減することができると共に、
高い温度域での抵抗値の変化量を小さくできるので、ラ
イン型加熱体の発熱抵抗体の温度制御の精度を大幅に向
上できるだけでなく、ライン型加熱体の熱によるライン
型加熱体の使用時間に比例して抵抗体の抵抗値が経時変
化をおこすのを防止することができる。それにより、ラ
イン型加熱体の温度検出体の抵抗値変化による異常発熱
でライン型加熱体及びそれが使用される電子機器の破壊
を防止できる。In the embodiment of the line type heating element described above,
Although a well-known crystallized glass layer used in a thermal print head is formed and then a glass paste containing cadmium is fired, an amorphous glass is formed into an overcoat layer. A single layer structure may be used as the protective layer. In the line-type heating element as in the above-described embodiment, the temperature detecting element of the heating resistor is a resistor formed in a film shape on the back surface of the insulating substrate, the resistor including one or both of cobalt and manganese. In addition, since the resistor is covered with a layer made of amorphous glass containing cadmium, the resistance value of the temperature detector in the high temperature range can be lowered and the current value can be increased, resulting in noise. Can reduce the effect of
Since the amount of change in resistance value in the high temperature range can be reduced, not only can the accuracy of temperature control of the heating resistor of the line-type heating element be greatly improved, but also the operating time of the line-type heating element due to the heat of the line-type heating element. It is possible to prevent the resistance value of the resistor from changing with time in proportion to. As a result, it is possible to prevent the line type heating body and the electronic equipment using the line type heating body from being destroyed due to abnormal heat generation due to a change in the resistance value of the temperature detecting body of the line type heating body.
【００１５】尚、本発明は前述の実施例に記載の形状、
材料等の構成に特に限定されるものではない。The present invention has the shape described in the above embodiment,
It is not particularly limited to the configuration of materials and the like.
【図１】ライン型加熱体の斜視図FIG. 1 is a perspective view of a line type heating element.
【図２】ライン型加熱体における絶縁基板の裏面に抵抗
体を形成している状態を示す斜視図FIG. 2 is a perspective view showing a state in which a resistor is formed on the back surface of an insulating substrate in a line-type heater.
【図３】ライン型加熱体における絶縁基板の裏面に抵抗
体を形成した状態を示す斜視図FIG. 3 is a perspective view showing a state in which a resistor is formed on the back surface of an insulating substrate in a line-type heater.
【図４】ライン型加熱体における絶縁基板の裏面に電極
パターンを形成している状態を示す斜視図FIG. 4 is a perspective view showing a state where an electrode pattern is formed on the back surface of an insulating substrate in a line-type heating body.
【図５】ライン型加熱体における絶縁基板の裏面に電極
パターンを形成した状態を示す斜視図FIG. 5 is a perspective view showing a state in which an electrode pattern is formed on the back surface of an insulating substrate in a line type heating element.
【図６】ライン型加熱体における絶縁基板の裏面に抵抗
体を覆う層を形成した状態を示す斜視図FIG. 6 is a perspective view showing a state in which a layer covering the resistor is formed on the back surface of the insulating substrate in the line-type heater.
【図７】図６のＡ−Ａ拡大断面図7 is an enlarged cross-sectional view taken along the line AA of FIG.
【図８】膜状の抵抗体における抵抗温度係数を示す図FIG. 8 is a diagram showing a temperature coefficient of resistance of a film resistor.
【図９】保護層の材料別に膜状の抵抗体の抵抗値の経時
変化を示す図FIG. 9 is a diagram showing a change with time of a resistance value of a film-shaped resistor for each material of a protective layer.
１・・・・ライン型加熱体 ２・・・・絶縁基板 ３・・・・発熱抵抗体 ４・・・・スクリーン ５・・・・温度検出体 ６・・・・スクリーン ７・・・・電極パターン ８・・・・電極パターン ９・・・・保護層 １０・・・オーバーコート層 出願人 ローム株式会社 1 ... Line heating element 2 ... Insulating substrate 3 ... Heating resistor 4 ... Screen 5 ... Temperature detector 6 ... Screen 7 ... Electrode Pattern 8 ... Electrode pattern 9 ... Protective layer 10 ... Overcoat layer Applicant ROHM Co., Ltd.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｂ 3/20 ３１１ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display H05B 3/20 311
Claims (2)
なるライン型加熱体において、 前記絶縁基板の裏面に膜状に形成され少なくともコバル
ト及びマンガンのいずれか一方を含む前記発熱抵抗体の
温度を検出するための温度検出体と、 前記温度検出体を覆いカドミウムを含む非晶質ガラスよ
りなる層と、を有することを特徴とするライン型加熱
体。1. A line-type heating body having a heating resistor formed on the surface of an insulating substrate, wherein the heating resistor includes a film-like member formed on the back surface of the insulating substrate and contains at least one of cobalt and manganese. A line-type heating body, comprising: a temperature detecting body for detecting a temperature; and a layer made of amorphous glass containing cadmium and covering the temperature detecting body.
なるライン型加熱体の製造方法において、 前記絶縁基板の裏面に、少なくともコバルト及びマンガ
ンのいずれか一方を含む抵抗ペーストを印刷したのち焼
成して前記発熱抵抗体の温度検出用の温度検出体を膜状
に形成し、次いで前記温度検出体の両端に対する電極パ
ターンを当該電極パターンが前記温度検出体の両端に対
して重なるように形成し、その後カドミウムを含む非晶
質ガラスよりなる層を少なくとも前記温度検出体を覆う
ように形成したことを特徴とするライン型加熱体の製造
方法。2. A method for manufacturing a line-type heating element, comprising a heating resistor formed on the surface of an insulating substrate, wherein a resistance paste containing at least one of cobalt and manganese is printed on the back surface of the insulating substrate. A temperature detecting body for detecting the temperature of the heating resistor is formed into a film by firing, and then electrode patterns for both ends of the temperature detecting body are formed so that the electrode pattern overlaps both ends of the temperature detecting body. Then, a method of manufacturing a line-type heating body, characterized in that a layer made of amorphous glass containing cadmium is formed so as to cover at least the temperature detecting body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26251594A JP3406405B2 (en) | 1994-10-26 | 1994-10-26 | Line type heating element and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26251594A JP3406405B2 (en) | 1994-10-26 | 1994-10-26 | Line type heating element and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08124658A true JPH08124658A (en) | 1996-05-17 |
| JP3406405B2 JP3406405B2 (en) | 2003-05-12 |
Family
ID=17376880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26251594A Expired - Fee Related JP3406405B2 (en) | 1994-10-26 | 1994-10-26 | Line type heating element and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3406405B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002075599A (en) * | 2000-08-25 | 2002-03-15 | Rohm Co Ltd | Heater, fixing device using it and manufacturing method for heater |
| JP2002289328A (en) * | 2001-03-23 | 2002-10-04 | Rohm Co Ltd | Exothermic body, fixing apparatus using the same and manufacturing method of exothermic body |
| JP2006210122A (en) * | 2005-01-27 | 2006-08-10 | Kyocera Corp | Ceramic heater element and detection element using it |
| JP5908150B1 (en) * | 2015-07-27 | 2016-04-26 | 株式会社ヒットデバイス | Fixing apparatus and fixing method |
| JP2019174767A (en) * | 2018-03-29 | 2019-10-10 | キヤノン株式会社 | Heater and fixing device |
| JP2020112701A (en) * | 2019-01-11 | 2020-07-27 | 東芝ライテック株式会社 | Heater and image forming device |
-
1994
- 1994-10-26 JP JP26251594A patent/JP3406405B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002075599A (en) * | 2000-08-25 | 2002-03-15 | Rohm Co Ltd | Heater, fixing device using it and manufacturing method for heater |
| JP2002289328A (en) * | 2001-03-23 | 2002-10-04 | Rohm Co Ltd | Exothermic body, fixing apparatus using the same and manufacturing method of exothermic body |
| JP4593824B2 (en) * | 2001-03-23 | 2010-12-08 | ローム株式会社 | Heating element, fixing device using the same, and method of manufacturing heating element |
| JP2006210122A (en) * | 2005-01-27 | 2006-08-10 | Kyocera Corp | Ceramic heater element and detection element using it |
| JP4583187B2 (en) * | 2005-01-27 | 2010-11-17 | 京セラ株式会社 | Ceramic heater element and detection element using the same |
| JP5908150B1 (en) * | 2015-07-27 | 2016-04-26 | 株式会社ヒットデバイス | Fixing apparatus and fixing method |
| JP2019174767A (en) * | 2018-03-29 | 2019-10-10 | キヤノン株式会社 | Heater and fixing device |
| JP2020112701A (en) * | 2019-01-11 | 2020-07-27 | 東芝ライテック株式会社 | Heater and image forming device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3406405B2 (en) | 2003-05-12 |
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