JPH08124435A - Manufacture of anisotropic conductive film - Google Patents
Manufacture of anisotropic conductive filmInfo
- Publication number
- JPH08124435A JPH08124435A JP26050894A JP26050894A JPH08124435A JP H08124435 A JPH08124435 A JP H08124435A JP 26050894 A JP26050894 A JP 26050894A JP 26050894 A JP26050894 A JP 26050894A JP H08124435 A JPH08124435 A JP H08124435A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- insulating film
- anisotropic conductive
- exposed
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、フィルムの厚さ方向に
のみ導電性をもつ異方導電性フィルムの製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an anisotropic conductive film having conductivity only in the thickness direction of the film.
【０００２】[0002]
【従来の技術】従来、異方導電フィルムとしては、絶縁
性フィルムの厚さ方向に金属線を埋め込んで厚さ方向の
み導電性としたものや、絶縁性のフィルム中に導電性の
金属粒子やカーボン等を分散したものがある。また、微
細な穴があけられたメタルマスクを、絶縁性フィルムに
重ね、レーザを照射して絶縁性フィルムに貫通穴をあ
け、その部分にめっきを行って異方導電性フィルムを製
造する方法がある。2. Description of the Related Art Conventionally, an anisotropic conductive film is one in which a metal wire is embedded in the thickness direction of an insulating film to make it conductive only in the thickness direction, or conductive metal particles in the insulating film. Some include dispersed carbon. In addition, a method for producing an anisotropic conductive film by stacking a metal mask with fine holes on an insulating film, irradiating a laser to open a through hole in the insulating film, and plating the portion is there.
【０００３】[0003]
【発明が解決しようとする課題】従来の方法のうち、絶
縁性のフィルムの厚さ方向に金属線を埋め込んで厚さ方
向のみ導電性としたものや、絶縁性のフィルム中に導電
性の金属粒子やカーボン等を分散したものでは、比較的
粗な密度の導電性フィルムしか得られない。その理由
は、金属線を密に埋め込むことが困難で有り、また、絶
縁性フィルム中に導電性粒子を分散する方法では、これ
らの粒子を多量に入れた場合には粒子同士が凝集すると
いう課題や、粒子同士が接触することによる面方向の絶
縁性の確保が不十分になるという課題があるためであ
る。また、微細な穴があけられたメタルマスクを、絶縁
性フィルムに重ね、レーザを照射して絶縁性フィルムに
貫通穴をあけ、その穴の部分にめっきを行って異方導電
性フィルムを製造する方法では、特別なメタルマスクの
作製やレーザ照射装置が必要であり、微細なものが得ら
れる反面、高価であるという課題がある。Among the conventional methods, one in which a metal wire is embedded in the thickness direction of an insulating film to make it conductive only in the thickness direction, or a conductive metal in the insulating film is used. A dispersion of particles, carbon, or the like can provide only a conductive film having a relatively coarse density. The reason is that it is difficult to densely embed the metal wire, and in the method of dispersing the conductive particles in the insulating film, when a large amount of these particles are put, the particles are aggregated. This is also because there is a problem that it becomes insufficient to secure the insulating property in the surface direction due to the contact between the particles. In addition, a metal mask with fine holes is overlaid on the insulating film, a laser is irradiated to form a through hole in the insulating film, and the hole portion is plated to produce an anisotropic conductive film. The method requires the production of a special metal mask and a laser irradiating device, and although a fine one can be obtained, there is a problem that it is expensive.
【０００４】本発明は、特別なフォトマスクやレーザ照
射装置を用いずに高密度の異方導電性フィルムを製造す
る方法及びこれによって得られる高密度な異方導電性フ
ィルムを提供することである。The present invention provides a method for producing a high-density anisotropic conductive film without using a special photomask or a laser irradiation device, and a high-density anisotropic conductive film obtained thereby. .
【０００５】[0005]
【課題を解決するための手段】本発明の異方導電フィル
ムの製造方法は、以下の工程を含むことを特徴とする。 ａ．平均粗さが１μｍ以上であり、粗さの断面曲線の山
頂と山頂の平均距離が、１０〜６０μｍの範囲の粗面を
もつ金属箔１に、これらの山の高さが更に、５μｍ以上
高くなるように突起状のめっき２を行う工程 ｂ．突起状めっき２の先端の一部分が露出する厚さに、
第一の絶縁性皮膜３を形成する工程 ｃ．突起状めっき２の露出部分に、更に突起状のめっき
２１を行う工程 ｄ．突起状めっき２１の先端の一部分が露出する厚さ
に、第二の絶縁性皮膜３１を形成する工程 ｅ．絶縁性皮膜３の金属箔１と接触していた面の金属
が、島状になるまで金属箔１をエッチング液で除去する
工程The method for producing an anisotropic conductive film of the present invention is characterized by including the following steps. a. The average height of these peaks is 5 μm or more in the metal foil 1 having an average roughness of 1 μm or more and an average distance between the peaks of the roughness profile curve in the range of 10 to 60 μm. Process of performing plating 2 in the shape of a protrusion so that b. To the thickness where a part of the tip of the protruding plating 2 is exposed,
Step of forming first insulating film 3 c. Step of further performing protruding plating 21 on the exposed portion of protruding plating 2 d. Step of forming second insulating film 31 to a thickness such that a part of the tip of protruding plating 21 is exposed e. A step of removing the metal foil 1 with an etching solution until the metal on the surface of the insulating film 3 that is in contact with the metal foil 1 becomes island-shaped.
【０００６】本発明に用いる金属箔１は、平均粗さが１
μｍ以上であり、粗さの断面曲線の山頂と山頂の平均距
離が１０〜６０μｍの範囲の粗面をもつものであるが、
このような金属箔は、一般のプリント配線板用銅箔を製
造する時の中間工程で得られるものを用いることができ
る。すなわち、一般のプリント配線板用銅箔は、陰極ド
ラムの表面に厚さ１０〜１５０ミクロンの範囲に銅めっ
きして、この金属箔を陰極ドラムから引き剥がして原箔
が製造されるが、この原箔のめっき析出表面の粗さは、
本発明で使用する金属箔の粗さに適合する。The metal foil 1 used in the present invention has an average roughness of 1
It has a rough surface with a cross-section curve of roughness of more than 1 μm and the average distance between the peaks is in the range of 10 to 60 μm.
As such a metal foil, one obtained in an intermediate step when manufacturing a general copper foil for printed wiring boards can be used. That is, a general copper foil for printed wiring boards is produced by plating copper on the surface of a cathode drum in a thickness range of 10 to 150 microns and peeling this metal foil from the cathode drum to produce an original foil. The roughness of the plating deposition surface of the original foil is
Matches the roughness of the metal foil used in the present invention.
【０００７】この原箔にめっきを行い、山の高さが更に
５μｍ以上高くなるような突起状のめっき２を設ける。
この突起の高さは異方導電フィルムの膜厚に合わせて決
められるものであり、目的のフィルム厚さにぼほ等しい
突起高さにめっきを行うことが望ましい。本発明は、凹
凸表面にめっきを行うと、一般に凸部分に優先的にめっ
きが析出するという原理を利用して突起状めっきを作製
するものである。This original foil is plated to provide a projection-shaped plating 2 which further increases the height of peaks by 5 μm or more.
The height of the protrusions is determined according to the film thickness of the anisotropic conductive film, and it is desirable to plate the protrusion heights approximately equal to the target film thickness. The present invention is to produce a projection-like plating by utilizing the principle that plating is generally preferentially deposited on the convex portion when the uneven surface is plated.
【０００８】本発明において、金属箔１をエッチング除
去するエッチング液で、突起状めっき２１に使用する金
属がエッチング除去される場合には、突起状めっき２１
の先端の一部分が露出する厚さに、絶縁性皮膜３１を形
成した後、露出した突起状めっき２１の先端に金属箔１
のエッチング除去液によって、殆どエッチング除去され
ない金属をめっきすることが望ましい。In the present invention, when the metal used for the projection plating 21 is removed by etching with an etching solution for removing the metal foil 1, the projection plating 21 is removed.
After forming the insulating film 31 to a thickness where a part of the tip of the metal foil 1 is exposed, the metal foil 1 is formed on the exposed tip of the protruding plating 21.
It is desirable to plate a metal that is hardly etched away by the etching remover solution.
【０００９】また、このような耐エッチング性金属めっ
きの代わりに、剥離可能なエッチングレジストを形成し
てもよく、一般のプリント配線板の製造に広く使用され
ているアルカリ現像タイプの液状あるいはドライフィル
ムが使用できる。Further, instead of such etching resistant metal plating, a peelable etching resist may be formed, and it is an alkali development type liquid or dry film which is widely used in the production of general printed wiring boards. Can be used.
【００１０】第一の絶縁性皮膜３及び第二の絶縁性皮膜
３１から露出した突起状めっき２及び２１の表面に、接
触抵抗値を下げる目的及び腐食を抑制するために、貴金
属めっきを行うことが好ましく、例えば、このような貴
金属めっきとしては、金、銀、白金、パラジウム等が使
用できる。Noble metal plating is performed on the surfaces of the protruding platings 2 and 21 exposed from the first insulating film 3 and the second insulating film 31 in order to lower the contact resistance value and suppress corrosion. However, gold, silver, platinum, palladium and the like can be used as such noble metal plating.
【００１１】突起状めっきに使用する金属の種類は金属
箔１と同一の金属でも構わないが、金属箔の選択エッチ
ングが可能になるように、金属箔１が銅の場合には、ニ
ッケル又はニッケル合金が望ましい。The type of metal used for the projection plating may be the same as that of the metal foil 1, but if the metal foil 1 is copper, nickel or nickel is used so that the metal foil can be selectively etched. Alloys are preferred.
【００１２】金属箔１のエッチング液としては、金属箔
が銅である場合には、アンモニウムアルカリエッチング
液、塩化銅／塩酸系エッチング液、塩化鉄／塩酸系エッ
チング液が使用できる。As the etching solution for the metal foil 1, when the metal foil is copper, an ammonium alkali etching solution, a copper chloride / hydrochloric acid type etching solution, or an iron chloride / hydrochloric acid type etching solution can be used.
【００１３】また、上記の方法の内いずれかの方法によ
って得られた異方導電フィルムの少なくとも片面に、必
要に応じて接着剤を設けることができるIf necessary, an adhesive can be provided on at least one surface of the anisotropic conductive film obtained by any one of the above methods.
【００１４】また、本発明で使用する絶縁性皮膜材料に
は、異方導電フィルムの取り扱い性の点からフィルム形
成性成分を含むものである。このような材料として、天
然ゴム、シリコンゴム、スチレン／イソプレン／スチレ
ン系熱可塑性エラストマ等の材料が使用できる。また、
ポリビニルブチラール／メラミン樹脂／エポキシ樹脂
系、ポリビニルブチラール／フェノール樹脂系、変性ア
クリルゴム／エポキシ樹脂系、変性アクリロニトリルブ
タジエンゴム／エポキシ樹脂系等の絶縁材料が用いられ
る。特に、耐熱性が要求される用途には、ポリイミド
系、ポリイミド／エポキシ樹脂系、高分子量エポキシ重
合体／エポキシ樹脂系、等の熱硬化樹脂系の絶縁樹脂材
料が用いられる。また絶縁性を良好にするためには、イ
オン性の不純物を低減するためにイオン吸着物質等を添
加することができる。The insulating film material used in the present invention contains a film-forming component from the viewpoint of handleability of the anisotropic conductive film. As such a material, natural rubber, silicone rubber, styrene / isoprene / styrene-based thermoplastic elastomer, or the like can be used. Also,
Insulating materials such as polyvinyl butyral / melamine resin / epoxy resin system, polyvinyl butyral / phenol resin system, modified acrylic rubber / epoxy resin system, modified acrylonitrile butadiene rubber / epoxy resin system are used. In particular, thermosetting resin type insulating resin materials such as polyimide type, polyimide / epoxy resin type and high molecular weight epoxy polymer / epoxy resin type are used for applications requiring heat resistance. Further, in order to improve the insulating property, an ion adsorbing substance or the like can be added to reduce ionic impurities.
【００１５】[0015]
【作用】本発明の粗面を形成した金属箔１は、その粗面
の山頂部分を、突起状めっきの析出のための核として使
用でき、異方導電フィルムの導電性粒子の間隔は、この
金属箔の粗面の山頂の間隔によって決めることができ、
本発明では、山頂の間隔である１０〜６０μｍの範囲で
選ぶことができる。また、本発明に用いる金属箔１は、
上記したようにプリント配線板用の銅箔及びその製造技
術が使用できるので、広い幅のものが得られる。このよ
うな金属箔１の山頂に突起状めっきを形成した金属箔１
に粗面の山頂部分の一部が露出するように絶縁性皮膜３
を形成した後、金属箔１を除去することによって、導電
粒子の位置を特別な方法を用いなくても高密度に配置す
ることができる。また、第一回目の突起状めっきを行っ
た後、第一の絶縁性皮膜を形成し、更に第二回目の突起
状めっきを行うことで、フィルム厚さの厚い異方導電フ
ィルムを製造できる。In the metal foil 1 having a rough surface according to the present invention, the crests of the rough surface can be used as nuclei for the deposition of the protruding plating, and the distance between the conductive particles of the anisotropic conductive film is It can be determined by the distance between the peaks of the rough surface of the metal foil,
In the present invention, the distance can be selected within the range of 10 to 60 μm, which is the distance between the peaks. The metal foil 1 used in the present invention is
As described above, the copper foil for printed wiring boards and the manufacturing technique therefor can be used, so that a wide width can be obtained. Metal foil 1 in which protrusion-like plating is formed on the peak of such metal foil 1
Insulating film 3 so that a part of the rough peak is exposed
By removing the metal foil 1 after forming, the positions of the conductive particles can be arranged at a high density without using a special method. In addition, an anisotropic conductive film having a large film thickness can be manufactured by forming the first insulating film after performing the first projecting plating, and further performing the second projecting plating.
【００１６】[0016]
実施例１ 図１（ａ）に示すようなプリント配線板用銅箔の原箔
（金属箔１）に、図１（ｂ）に示すように、突起高さが
１５μｍのニッケルめっき粒子（突起状めっき２）を、
電気ニッケルめっきによって形成した。次に、図１
（ｃ）に示すように、分子量が１０万以上の高分子量エ
ポキシ重合体／エポキシ樹脂系の第一の絶縁性皮膜３
を、ニッケルめっき粒子の先端の一部が露出するように
形成した。次に、図１（ｄ）に示すように、突起高さが
約１０μｍのニッケルめっき粒子（突起状めっき２１）
を、電気ニッケルめっきによって形成した。次に、図１
（ｅ）に示すように、分子量が１０万以上の高分子量エ
ポキシ重合体／エポキシ樹脂系の第二の絶縁性皮膜３１
を、ニッケルめっき粒子の先端の一部が露出するように
形成した。次に、アンモニアアルカリエッチング液に浸
漬して、銅の金属箔１をエッチング除去して、図１
（ｆ）に示すように、異方導電フィルムを得た。Example 1 As shown in FIG. 1 (b), nickel plated particles (protrusion shape) having a projection height of 15 μm were added to an original foil (metal foil 1) of a copper foil for printed wiring board as shown in FIG. 1 (a). Plating 2),
It was formed by electro nickel plating. Next, FIG.
As shown in (c), the first insulating film 3 of a high molecular weight epoxy polymer / epoxy resin system having a molecular weight of 100,000 or more.
Was formed so that part of the tips of the nickel-plated particles was exposed. Next, as shown in FIG. 1D, nickel-plated particles (protrusion-shaped plating 21) having a protrusion height of about 10 μm.
Were formed by electro nickel plating. Next, FIG.
As shown in (e), a second insulating film 31 of a high molecular weight epoxy polymer / epoxy resin system having a molecular weight of 100,000 or more.
Was formed so that part of the tips of the nickel-plated particles was exposed. Next, the copper metal foil 1 is removed by etching by immersing it in an ammonia-alkali etching solution.
An anisotropic conductive film was obtained as shown in (f).
【００１７】実施例２ 図２（ａ）に示すようなプリント配線板用銅箔の原箔
（金属箔１）に、図２（ｂ）に示すように、突起高さが
１５μｍのニッケルめっき粒子（突起状めっき２）を、
電気ニッケルめっきによって形成した。次に、図２
（ｃ）に示すように、分子量が１０万以上の高分子量エ
ポキシ重合体／エポキシ樹脂系の第一の絶縁性皮膜３
を、ニッケルめっき粒子の先端の一部が露出するように
形成した。次に、図２（ｄ）に示すように、突起高さが
約１０μｍのニッケルめっき粒子（突起状めっき２１）
を、電気ニッケルめっきによって形成した。次に、図２
（ｅ）に示すように、分子量が１０万以上の高分子量エ
ポキシ重合体／エポキシ樹脂系の第二の絶縁性皮膜３１
を、ニッケルめっき粒子の先端の一部が露出するように
形成した。次に、アンモニアアルカリエッチング液に浸
漬して、銅の金属箔１をエッチング除去した。次に、絶
縁性皮膜３１の表面に島状に露出しているニッケルの表
面に、金を無電解めっきすることによって、図２（ｆ）
に示すように、異方導電フィルムを得た。Example 2 As shown in FIG. 2 (b), nickel plated particles having a projection height of 15 μm were added to the original foil (metal foil 1) of the copper foil for printed wiring board as shown in FIG. 2 (a). (Projection plating 2)
It was formed by electro nickel plating. Next, FIG.
As shown in (c), the first insulating film 3 of a high molecular weight epoxy polymer / epoxy resin system having a molecular weight of 100,000 or more.
Was formed so that part of the tips of the nickel-plated particles was exposed. Next, as shown in FIG. 2D, nickel-plated particles (protrusion-shaped plating 21) having a protrusion height of about 10 μm.
Were formed by electro nickel plating. Next, FIG.
As shown in (e), the second insulating film 31 of a high molecular weight epoxy polymer / epoxy resin system having a molecular weight of 100,000 or more.
Was formed so that part of the tips of the nickel-plated particles was exposed. Next, the copper metal foil 1 was removed by etching by immersing it in an ammonia alkali etching solution. Next, by electrolessly plating gold on the surface of the nickel exposed in the island shape on the surface of the insulating film 31, as shown in FIG.
As shown in, an anisotropic conductive film was obtained.
【００１８】実施例３ 図３（ａ）に示すようなプリント配線板用銅箔の原箔
（金属箔１）に、図３（ｂ）に示すように、突起高さが
１５μｍのニッケルめっき粒子（突起状めっき２）を、
電気ニッケルめっきによって形成した。次に、図３
（ｃ）に示すように、分子量が１０万以上の高分子量エ
ポキシ重合体／エポキシ樹脂系の第一の絶縁性皮膜３
を、ニッケルめっき粒子の先端の一部が露出するように
形成した。次に、図３（ｄ）に示すように、突起高さが
約１０μｍの銅めっき粒子（突起状めっき２１）を、電
気銅めっきによって形成した。次に、図３（ｅ）に示す
ように、分子量が１０万以上の高分子量エポキシ重合体
／エポキシ樹脂系の第二の絶縁性皮膜３１を、ニッケル
めっき粒子の先端の一部が露出するように形成した。次
に、第二の絶縁性皮膜３１の表面に島状に露出している
突起状めっき２１の表面に、金めっきを行った。次に、
アンモニアアルカリエッチング液に浸漬して、銅の金属
箔１をエッチング除去した。次に、第一の絶縁性皮膜３
の表面に島状に露出している銅の表面に、金を無電解め
っきすることによって、図３（ｆ）に示すように、異方
導電フィルムを得た。Example 3 As shown in FIG. 3 (b), a nickel-plated particle having a projection height of 15 μm was added to an original foil (metal foil 1) of a copper foil for printed wiring board as shown in FIG. 3 (a). (Projection plating 2)
It was formed by electro nickel plating. Next, FIG.
As shown in (c), the first insulating film 3 of a high molecular weight epoxy polymer / epoxy resin system having a molecular weight of 100,000 or more.
Was formed so that part of the tips of the nickel-plated particles was exposed. Next, as shown in FIG. 3D, copper-plated particles (protrusion-shaped plating 21) having a protrusion height of about 10 μm were formed by electrolytic copper plating. Next, as shown in FIG. 3E, a second insulating film 31 of high molecular weight epoxy polymer / epoxy resin having a molecular weight of 100,000 or more is exposed so that a part of the tip of the nickel-plated particles is exposed. Formed. Next, gold plating was performed on the surface of the protrusion-shaped plating 21 exposed on the surface of the second insulating film 31 in an island shape. next,
The copper metal foil 1 was removed by etching by immersing it in an ammonia alkali etching solution. Next, the first insulating film 3
By electrolessly plating gold on the surface of the copper exposed in an island shape on the surface of, the anisotropic conductive film was obtained as shown in FIG. 3 (f).
【００１９】実施例４ 図４（ａ）に示すようなプリント配線板用銅箔の原箔
（金属箔１）に、図４（ｂ）に示すように、突起高さが
１５μｍの銅めっき粒子（突起状めっき２）を電気銅め
っきによって形成した。次に、図４（ｃ）に示すよう
に、分子量が１０万以上の高分子量エポキシ重合体／エ
ポキシ樹脂系の第一の絶縁性皮膜３を、銅めっき粒子の
先端の一部が露出するように形成した。次に、図４
（ｄ）に示すように、突起高さが、約１０μｍの銅めっ
き粒子（突起状めっき２１）を、電気銅めっきによって
形成した。次に、図４（ｅ）に示すように、分子量が１
０万以上の高分子量エポキシ重合体／エポキシ樹脂系の
第二の絶縁性皮膜３１を、銅めっき粒子の先端の一部が
露出するように形成した。次に、第二の絶縁性皮膜３１
の表面に島状に露出している突起状めっき２１の表面
に、ニッケルめっき行い、更にその表面に金めっきを行
った。次に、アンモニアアルカリエッチング液に浸漬し
て、銅の金属箔１をエッチング除去した。次に、第一の
絶縁性皮膜３の表面に島状に露出している銅の表面に、
ニッケルと金を順に無電解めっきすることによって、図
４（ｆ）に示すように、異方導電フィルムを得た。Example 4 As shown in FIG. 4 (b), a copper-plated particle having a projection height of 15 μm was added to an original foil (metal foil 1) of a copper foil for printed wiring board as shown in FIG. 4 (a). (Protrusion-shaped plating 2) was formed by electrolytic copper plating. Next, as shown in FIG. 4C, the first insulating film 3 of a high molecular weight epoxy polymer / epoxy resin system having a molecular weight of 100,000 or more is exposed so that a part of the tips of the copper plating particles is exposed. Formed. Next, FIG.
As shown in (d), copper-plated particles (protrusion-shaped plating 21) having a protrusion height of about 10 μm were formed by electrolytic copper plating. Next, as shown in FIG. 4 (e), the molecular weight is 1
A high-molecular-weight epoxy polymer / epoxy resin-based second insulating film 31 of not less than 0,000 was formed such that a part of the tip of the copper-plated particles was exposed. Next, the second insulating film 31
The surface of the protrusion-shaped plating 21 exposed in the form of islands was plated with nickel, and the surface was plated with gold. Next, the copper metal foil 1 was removed by etching by immersing it in an ammonia alkali etching solution. Next, on the surface of the copper exposed in an island shape on the surface of the first insulating film 3,
By electrolessly plating nickel and gold in order, an anisotropic conductive film was obtained as shown in FIG. 4 (f).
【００２０】[0020]
【発明の効果】以上に説明したように、本発明によっ
て、導電性の金属粒子を高密度に埋め込んだ異方導電フ
ィルムを製造することができる。As described above, according to the present invention, it is possible to manufacture an anisotropic conductive film in which conductive metal particles are embedded at a high density.
【図１】本発明の一実施例を示す各工程毎の断面図であ
る。FIG. 1 is a sectional view of each step showing an embodiment of the present invention.
【図２】本発明の他の実施例を示す各工程毎の断面図で
ある。FIG. 2 is a sectional view of each step showing another embodiment of the present invention.
【図３】本発明のさらに他の実施例を示す各工程毎の断
面図である。FIG. 3 is a sectional view of each step showing still another embodiment of the present invention.
【図４】本発明のさらに他の実施例を示す各工程毎の断
面図である。FIG. 4 is a sectional view of each step showing still another embodiment of the present invention.
１．金属箔 ２，２１．突起状めっき ３．第一の絶縁性皮膜 ３１．第二の絶縁性皮膜 1. Metal foil 2, 21. Projection plating 3. First insulating film 31. Second insulating film
Claims (5)
電フィルムの製造方法。 ａ．平均粗さが１μｍ以上であり、粗さの断面曲線の山
頂と山頂の平均距離が、１０〜６０μｍの範囲の粗面を
もつ金属箔１に、これらの山の高さが更に、５μｍ以上
高くなるように突起状のめっき２を行う工程 ｂ．突起状めっき２の先端の一部分が露出する厚さに、
第一の絶縁性皮膜３を形成する工程 ｃ．突起状めっき２の露出部分に、更に突起状のめっき
２１を行う工程 ｄ．突起状めっき２１の先端の一部分が露出する厚さ
に、第二の絶縁性皮膜３１を形成する工程 ｅ．絶縁性皮膜３の金属箔１と接触していた面の金属
が、島状になるまで金属箔１をエッチング液で除去する
工程1. A method for producing an anisotropic conductive film, comprising the following steps. a. The average height of these peaks is 5 μm or more in the metal foil 1 having an average roughness of 1 μm or more and an average distance between the peaks of the roughness profile curve in the range of 10 to 60 μm. Process of performing plating 2 in the shape of a protrusion so that b. To the thickness where a part of the tip of the protruding plating 2 is exposed,
Step of forming first insulating film 3 c. Step of further performing protruding plating 21 on the exposed portion of protruding plating 2 d. Step of forming second insulating film 31 to a thickness such that a part of the tip of protruding plating 21 is exposed e. A step of removing the metal foil 1 with an etching solution until the metal on the surface of the insulating film 3 that is in contact with the metal foil 1 becomes island-shaped.
をエッチング除去するエッチング液によって、突起状め
っき２あるいは２１がエッチング除去されないものを用
いることを特徴とする請求項１に記載の異方導電フィル
ムの製造方法。2. A metal foil 1 is formed on the protrusion-shaped plating 2 or 21.
2. The method for producing an anisotropic conductive film according to claim 1, wherein the projection plating 2 or 21 is not etched and removed by an etching solution for etching away.
３１から露出した突起状めっき２及び２１の表面に、貴
金属めっきを行うことを特徴とする請求項１または２に
記載の異方導電フィルムの製造方法。3. The noble metal plating is performed on the surfaces of the protruding platings 2 and 21 exposed from the first insulating film 3 and the second insulating film 31. Method for producing anisotropic conductive film.
に露出した突起状めっき２１の表面に、その突起状めっ
き２１がエッチング除去されることを防止できる金属を
めっきすることを特徴とする請求項１または２に記載の
異方導電フィルムの製造方法。4. After the second insulating film 31 is formed, the surface of the protruding plating 21 exposed in an island shape is plated with a metal capable of preventing the protruding plating 21 from being removed by etching. The method for producing the anisotropic conductive film according to claim 1, wherein the anisotropic conductive film is manufactured.
いは２１がニッケル又はニッケル合金であることを特徴
とする請求項１〜４のうちいずれかに記載の異方導電フ
ィルムの製造方法。5. The method for producing an anisotropic conductive film according to claim 1, wherein the metal foil 1 is copper and the protruding plating 2 or 21 is nickel or nickel alloy. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26050894A JPH08124435A (en) | 1994-10-25 | 1994-10-25 | Manufacture of anisotropic conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26050894A JPH08124435A (en) | 1994-10-25 | 1994-10-25 | Manufacture of anisotropic conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08124435A true JPH08124435A (en) | 1996-05-17 |
Family
ID=17348941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26050894A Pending JPH08124435A (en) | 1994-10-25 | 1994-10-25 | Manufacture of anisotropic conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08124435A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010029773A (en) * | 2008-07-28 | 2010-02-12 | Sony Chemical & Information Device Corp | Coating device, and method of applying resin liquid for coating |
| WO2018079303A1 (en) * | 2016-10-31 | 2018-05-03 | デクセリアルズ株式会社 | Filler-containing film |
| US10899949B2 (en) | 2016-10-31 | 2021-01-26 | Dexerials Corporation | Filler-containing film |
-
1994
- 1994-10-25 JP JP26050894A patent/JPH08124435A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010029773A (en) * | 2008-07-28 | 2010-02-12 | Sony Chemical & Information Device Corp | Coating device, and method of applying resin liquid for coating |
| WO2018079303A1 (en) * | 2016-10-31 | 2018-05-03 | デクセリアルズ株式会社 | Filler-containing film |
| US10899949B2 (en) | 2016-10-31 | 2021-01-26 | Dexerials Corporation | Filler-containing film |
| CN114907594A (en) * | 2016-10-31 | 2022-08-16 | 迪睿合株式会社 | Filled membranes |
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