JPH08102479A - Wafer inspection equipment - Google Patents
Wafer inspection equipmentInfo
- Publication number
- JPH08102479A JPH08102479A JP6237206A JP23720694A JPH08102479A JP H08102479 A JPH08102479 A JP H08102479A JP 6237206 A JP6237206 A JP 6237206A JP 23720694 A JP23720694 A JP 23720694A JP H08102479 A JPH08102479 A JP H08102479A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- inspection
- holder
- microscope
- macro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、所定のパターンが形
成されたウエハを複数保有したウエハ保持体から所望の
ウエハを取り出し、ウエハのマクロ検査が行われた後に
ウエハ保持体中の所望の位置にマクロ検査済のウエハを
返却するウエハ検査装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention takes out a desired wafer from a wafer holder having a plurality of wafers on which a predetermined pattern is formed, and after a macro inspection of the wafer is performed, a desired position in the wafer holder is obtained. The present invention relates to a wafer inspection device for returning a macro-inspected wafer.
【０００２】[0002]
【従来の技術】このようなウエハ検査装置は、例えば特
開平１−２０７９４２号公報から既に知られている。上
記公報でウエハ検査装置はミクロ検査のための顕微鏡と
共に組み合わされて使用されており、ウエハ検査装置か
ら顕微鏡の走査台へと選択的にウエハを搬送する搬送手
段を有している。2. Description of the Related Art Such a wafer inspection apparatus is already known, for example, from Japanese Patent Laid-Open No. 1-207942. In the above publication, the wafer inspection apparatus is used in combination with a microscope for microinspection, and has a transfer means for selectively transferring the wafer from the wafer inspection apparatus to the scanning table of the microscope.
【０００３】ウエハ検査装置はウエハの一面に形成され
ている所定のパターンを検査することを目的として使用
されているが、最近ウエハの裏面の検査も重要視されて
きている。これは裏面にゴミや水分が付着していると、
ダイシングの際に断面に割れが生じたり、ダイシングの
後のチップを基板に接着する際に接着不良が生じ、製品
の不良率が大きくなるからである。The wafer inspection apparatus is used for the purpose of inspecting a predetermined pattern formed on one surface of the wafer, but recently, the inspection of the back surface of the wafer has also been emphasized. If there is dust or water on the back,
This is because cracks occur in the cross section during dicing, and defective adhesion occurs when the chips after dicing are bonded to the substrate, increasing the defective rate of the product.
【０００４】従来では、ウエハの裏面の検査は、ウエハ
検査装置においてウエハの一面の所定のパターンのマク
ロ検査が終了した後、また必要に応じた顕微鏡でのミク
ロ検査が終了した後に、検査者がピンセット等の挟持器
具を使用してウエハを挟持しウエハを裏返すことにより
行われている。Conventionally, the backside of a wafer is inspected by an inspector after the macroinspection of a predetermined pattern on one surface of the wafer is completed in a wafer inspection apparatus and after the microinspection with a microscope as necessary. It is performed by holding a wafer by using a holding tool such as tweezers and turning the wafer over.
【０００５】[0005]
【発明が解決しようとする課題】このような検査者の手
によるウエハ裏面の検査作業は面倒なため、ウエハの全
数について行われておらず、所定の規定に従った抜き取
り検査や検査者の判断により任意に行われている。この
発明はこのような事情の下でなされ、この発明の目的
は、容易且つ迅速にウエハの検査を行うことができるウ
エハ検査装置を提供することである。Since the inspection work of the backside of the wafer by the hand of the inspector is troublesome, it is not performed for all the wafers, and the sampling inspection and the judgment of the inspector are performed according to a predetermined rule. It is done arbitrarily by. The present invention has been made under such circumstances, and an object of the present invention is to provide a wafer inspection apparatus capable of easily and quickly inspecting a wafer.
【０００６】[0006]
【課題を解決するための手段】請求項１の発明は、複数
のウエハを載置し、ウエハ出し入れ用の開口を一方に有
するウエハ保持体と、ウエハ保持体から所望のウエハを
取り出し、所望の検査終了後にウエハをウエハ保持体中
の所望の位置に返却するウエハ搬送手段と、ウエハ搬送
手段により取り出されたウエハのマクロ検査をするため
にウエハを載置するウエハ載置手段と、ウエハの裏面を
マクロ検査するためのウエハ裏返し手段とを備えてお
り、上記ウエハ保持体のウエハ取り出し方向とウエハ載
置手段とを長手方向に配置したものである。According to a first aspect of the present invention, a plurality of wafers are placed and a wafer holder having an opening for taking in and out a wafer, and a desired wafer is taken out from the wafer holder, and a desired wafer is taken out. Wafer transfer means for returning the wafer to a desired position in the wafer holder after completion of the inspection, wafer mounting means for mounting the wafer for macro inspection of the wafer taken out by the wafer transfer means, and back surface of the wafer And a wafer upside-down means for performing a macro inspection of the wafer holder, and the wafer pick-up direction of the wafer holder and the wafer placing means are arranged in the longitudinal direction.
【０００７】請求項２の発明は、複数のウエハを載置
し、ウエハ出し入れ用の開口を一方に有するウエハ保持
体と、ウエハ保持体を載置する上下動可能な台と、ウエ
ハ保持体から所望のウエハを取り出し、所望の検査終了
後にウエハをウエハ保持体中の所望の位置に返却するウ
エハ搬送手段と、ウエハ搬送手段により取り出されたウ
エハのマクロ検査をするためにウエハを載置するウエハ
載置手段と、ウエハ載置手段上に載置したウエハのオリ
フラ（オリエンテーションフラット）を検知するオリフ
ラ検知器と、ウエハの裏面をマクロ検査するためのウエ
ハ裏返し手段と、ウエハをミクロ検査するための顕微鏡
と、顕微鏡にウエハ載置手段上のウエハを選択的に送
り、所望の検査終了後にウエハを顕微鏡からウエハ載置
手段上に戻すウエハ顕微鏡搬送手段とを備えており、ウ
エハ保持体のウエハ取り出し方向とウエハ載置手段とを
顕微鏡との長手方向に配置したものである。According to a second aspect of the present invention, a plurality of wafers are mounted and a wafer holder having an opening for loading and unloading wafers on one side, a vertically movable base for mounting the wafer holder, and a wafer holder. Wafer transfer means for taking out a desired wafer and returning the wafer to a desired position in a wafer holder after completion of a desired inspection, and a wafer for mounting the wafer for macro inspection of the wafer taken out by the wafer transfer means A mounting means, an orientation flat detector for detecting an orientation flat (orientation flat) of a wafer placed on the wafer mounting means, a wafer inverting means for macro-inspecting the back surface of the wafer, and a micro inspection for the wafer. A microscope and a wafer microscope that selectively sends the wafer on the wafer mounting means to the microscope and returns the wafer from the microscope to the wafer mounting means after the desired inspection is completed. And a mirror conveying means, and a wafer pickup direction and the wafer mounting means of the wafer holder in which is arranged in the longitudinal direction of a microscope.
【０００８】請求項３の発明は、上記ウエハ搬送手段
は、ウエハを取り出し／返却をするための水平移動とウ
エハ載置手段上方での上下移動とを行うために、水平移
動する駆動手段を備えたものである。請求項４の発明
は、上記ウエハ裏返し手段は、ウエハの直径よりも大径
なウエハ保持部と、ウエハ保持部に設けたウエハの直径
よりも小径なウエハ接触部と、ウエハを吸着させるため
にウエハ接触部に設けたウエハ吸着部とからなるもので
ある。According to a third aspect of the present invention, the wafer transfer means is provided with a driving means for moving horizontally in order to perform horizontal movement for taking out / returning the wafer and vertical movement above the wafer placing means. It is a thing. According to a fourth aspect of the present invention, the wafer inverting means holds the wafer holding portion having a diameter larger than the diameter of the wafer, a wafer contact portion provided in the wafer holding portion and having a diameter smaller than the diameter of the wafer, and adsorbing the wafer. And a wafer suction portion provided in the wafer contact portion.
【０００９】[0009]
【作用】請求項１の発明では、ウエハ取り出し方向を、
ウエハ載置手段と長手方向に配置したウエハ保持体の開
口から、所望のウエハをウエハ搬送手段で取り出し、取
り出されたウエハをウエハ載置手段に載置してマクロ検
査を行い、次にウエハ裏返し手段でウエハを裏返して、
ウエハ裏面のマクロ検査を行った後、ウエハ搬送手段で
ウエハをウエハ保持体に返却する。According to the invention of claim 1, the wafer take-out direction is set to
A desired wafer is taken out by the wafer carrying means from the opening of the wafer holding means and the wafer holder arranged in the longitudinal direction, and the taken-out wafer is placed on the wafer placing means for macro inspection, and then the wafer is turned inside out. Flip the wafer over by means,
After performing a macro inspection on the back surface of the wafer, the wafer is returned to the wafer holder by the wafer transfer means.
【００１０】請求項２の発明では、ウエハ取り出し方向
を、ウエハ載置手段と顕微鏡との長手方向の上下動可能
な台に載置したウエハ保持体の開口から、所望のウエハ
をウエハ搬送手段で取り出し、取り出されたウエハをウ
エハ載置手段に載置してマクロ検査を行い、次にウエハ
裏返し手段でウエハを裏返して、ウエハ裏面のマクロ検
査を行い、さらにオリフラ検知器でウエハのオリフラを
検知して、ウエハ顕微鏡搬送手段によってウエハを顕微
鏡に搬送し、ミクロ検査を行った後、ウエハ搬送手段で
ウエハをウエハ保持体に返却する。According to the second aspect of the present invention, the desired wafer is transferred by the wafer transfer means from the opening of the wafer holder mounted on the table which is vertically movable in the longitudinal direction of the wafer mounting means and the microscope. Take out the wafer, place the wafer on the wafer placing device for macro inspection, then flip the wafer over with the wafer flipping device, perform macro inspection for the back surface of the wafer, and detect the orientation flat of the wafer with the orientation flat detector. Then, the wafer is carried to the microscope by the wafer microscope carrying means, and after performing micro inspection, the wafer is returned to the wafer holder by the wafer carrying means.
【００１１】請求項３の発明では、水平移動する駆動手
段により、ウエハ保持体からウエハの取り出し／返却を
行い、さらにウエハ載置手段上にウエハの載置を行う。
請求項４の発明では、ウエハ保持部のウエハ接触部に設
けたウエハ吸着部でウエハを吸着し、マクロ検査のため
にウエハを裏返すことができる。According to the third aspect of the present invention, the horizontally moving driving means removes / returns the wafer from the wafer holder, and further mounts the wafer on the wafer mounting means.
In the invention of claim 4, the wafer can be sucked by the wafer suction portion provided in the wafer contact portion of the wafer holding portion, and the wafer can be turned over for macro inspection.
【００１２】[0012]
【実施例】以下、この発明の一実施例であるウエハ検査
装置を図面を参照しながら詳細に説明する。図１には顕
微鏡と組み合わされたウエハ検査装置の正面図が示され
ており、図２（Ａ）には図１のウエハ検査装置の平面図
が示されており、図２（Ｂ）には図１のウエハ検査装置
の右側面図が示されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A wafer inspection apparatus according to an embodiment of the present invention will be described in detail below with reference to the drawings. 1 shows a front view of a wafer inspection apparatus combined with a microscope, FIG. 2 (A) shows a plan view of the wafer inspection apparatus of FIG. 1, and FIG. 2 (B) shows it. The right side view of the wafer inspection apparatus of FIG. 1 is shown.
【００１３】また、図３にはウエハ移送手段の機構の正
面図が示されており、図４（Ａ）には図３の左側面図，
図４（Ｂ）には図３の右側面図が示されている。図５に
はウエハの芯出し手段の機構とオリフラ検知器の平面図
が示されており、図６には図５の左側面図，図７には図
５の正面図が示されている。図８にはウエハ裏返し手段
の機構の平面図が示されている。FIG. 3 shows a front view of the mechanism of the wafer transfer means, and FIG. 4 (A) shows a left side view of FIG.
FIG. 4B shows a right side view of FIG. FIG. 5 shows a plan view of the mechanism of the wafer centering means and the orientation flat detector, FIG. 6 shows a left side view of FIG. 5, and FIG. 7 shows a front view of FIG. FIG. 8 shows a plan view of the mechanism of the wafer inverting means.
【００１４】図１に示すウエハ検査装置１の長手方向に
設置された顕微鏡２は、手動によりＸ軸方向及びＹ軸方
向に移動自在なＸＹテーブル３と、ＸＹテーブル３の上
方でレボルバ４に保持された複数の対物レンズ群５と、
対物レンズ群５のさらに上方に位置した一対の接眼レン
ズ６とを備えている。ＸＹテーブル３の上部に位置する
Ｘテーブル３ａは、対物レンズ群５の下方位置からウエ
ハ検査装置１の外装ハウジング７上面の前端部右側領域
まで進出することができる。このＸテーブル３ａには、
ウエハのミクロ検査の際に搬送されたウエハを受け取
り、対物レンズの下方位置に搬送するための図示しない
真空チャックが設けられている。The microscope 2 installed in the longitudinal direction of the wafer inspection apparatus 1 shown in FIG. 1 is manually held by the revolver 4 above the XY table 3 which is movable in the X-axis direction and the Y-axis direction. The plurality of objective lens groups 5
The objective lens group 5 is provided with a pair of eyepiece lenses 6. The X table 3a, which is located above the XY table 3, can advance from the lower position of the objective lens group 5 to the front end right side region of the upper surface of the exterior housing 7 of the wafer inspection apparatus 1. In this X table 3a,
A vacuum chuck (not shown) is provided for receiving the transferred wafer during the micro inspection of the wafer and transferring it to the position below the objective lens.
【００１５】真空チャックには、ウエハを吸着させる吸
着孔が開口されており、基端部は前記吸着孔から吸引を
行うための図示しない真空源に接続されている。図２
（Ａ）はウエハ受け取りの際のＸテーブル３ａの待機位
置を二点鎖線で示したものである。Ｘテーブル３ａの左
端には細長い係合突起８が形成されており、この係合突
起８はウエハ検査装置１の外装ハウジング７上面の前端
部右側領域に設置されたＸテーブル受け９に係合するよ
うに構成されており、Ｘテーブル受け９には、Ｘテーブ
ル３ａの左端の係合突起８の係合の有無を感知する図示
しない光学センサが設けられている。A suction hole for sucking a wafer is opened in the vacuum chuck, and a base end portion thereof is connected to a vacuum source (not shown) for suctioning from the suction hole. Figure 2
(A) shows the standby position of the X table 3a at the time of receiving the wafer by a chain double-dashed line. A slender engagement protrusion 8 is formed on the left end of the X table 3a, and the engagement protrusion 8 engages with an X table receiver 9 installed in the front end right side region of the upper surface of the exterior housing 7 of the wafer inspection apparatus 1. The X-table receiver 9 is provided with an optical sensor (not shown) that detects whether or not the engagement protrusion 8 at the left end of the X-table 3a is engaged.
【００１６】ウエハ検査装置１本体の外装ハウジング７
上面の左端部には、エレベータ１０が設置されている。
エレベータ１０はウエハ検査装置１の長手方向に設けら
れ、上下方向に延在する図示しない案内ガイド及び送り
ネジに支持されており、送りネジを図示しないモータに
より回転させ、エレベータ１０を上下方向に所望の距離
だけ移動可能にする。エレベータ１０の上面に、所定の
直径のウエハを複数枚載置したウエハ保持体１１を所定
位置に載置させるために、エレベータ１０の上面の右端
部には、位置決め部材１２を設置する。Exterior housing 7 of the main body of wafer inspection apparatus 1
The elevator 10 is installed at the left end of the upper surface.
The elevator 10 is provided in the longitudinal direction of the wafer inspection apparatus 1 and is supported by a guide guide and a feed screw (not shown) extending in the up-down direction. The feed screw is rotated by a motor (not shown) so that the elevator 10 can be moved vertically. It can be moved by the distance. A positioning member 12 is installed at the right end of the upper surface of the elevator 10 in order to place the wafer holder 11 having a plurality of wafers of a predetermined diameter mounted on the upper surface of the elevator 10 at a predetermined position.
【００１７】エレベータ１０の上面に載置したウエハ保
持体１１は、上下方向に所定の間隔で配置された図示し
ない複数の水平棚を有し、棚上には所定のパターンが形
成されたウエハが載置される。この棚の前端部にはウエ
ハを取り出すのに都合がよいように切り欠きが形成され
ている。次に、図２（Ａ）中に示す外装ハウジング７内
でエレベータ１０の右側前面には、図３に示す如く、ウ
エハ搬送手段のＸ軸方向案内台１３が配置されている。
このウエハ搬送手段の駆動機構を、以下に説明する。The wafer holder 11 placed on the upper surface of the elevator 10 has a plurality of horizontal shelves (not shown) arranged at predetermined intervals in the vertical direction, and wafers having a predetermined pattern are formed on the shelves. Placed. A notch is formed at the front end of the shelf so that the wafer can be taken out conveniently. Next, in the exterior housing 7 shown in FIG. 2 (A), on the right front surface of the elevator 10, as shown in FIG.
The drive mechanism of the wafer transfer means will be described below.
【００１８】Ｘ軸方向案内１３台の側面部にはガイド板
１４がネジ１５で取り付けられており、さらに、Ｘ軸方
向案内台１３上面の中央部には、レール１６がＸ軸方向
（左右方向）に延在するように取り付けられている。
（図４（Ａ）参照）レール１６には移動部材１７が、Ｘ
軸方向で摺動可能に嵌合されており、この移動部材１７
上に、断面形状が逆Ｔ字形状をなすＸ軸方向移動台１８
が載置され、Ｘ軸方向でのＸ軸方向移動台１８の移動を
自在にさせる。A guide plate 14 is attached to the side surface of the X-axis direction guide 13 with a screw 15, and a rail 16 is attached to the center of the upper surface of the X-axis direction guide 13 in the X-axis direction (left-right direction). ) Is attached to extend.
(See FIG. 4 (A)) The rail 16 has a moving member 17
The moving member 17 is fitted so as to be slidable in the axial direction.
An X-axis direction moving base 18 having an inverted T-shaped cross section
Is placed, and the X-axis direction moving table 18 can be freely moved in the X-axis direction.
【００１９】また、Ｘ軸方向移動台１８の逆Ｔ字部の右
下側面上１８ａにも、レール１９が取り付けられてお
り、このレール１９にもＸ軸方向移動台１８上の所定の
範囲で移動可能にさせるための移動部材２０が摺動可能
に嵌合される。嵌合された移動部材２０には、ネジ２１
でカム２２が固定され、Ｘ軸方向移動台１８上でのカム
２２の移動を自在にさせる。A rail 19 is also mounted on the lower right side surface 18a of the inverted T-shaped portion of the X-axis direction moving table 18, and this rail 19 also has a predetermined range on the X-axis direction moving table 18. A moving member 20 for allowing movement is slidably fitted. A screw 21 is attached to the fitted moving member 20.
The cam 22 is fixed by and allows the cam 22 to move freely on the X-axis direction moving table 18.
【００２０】Ｘ軸方向案内台１３の底面の左右端部に
は、図３に示す如く、動力伝達用の伝達ベルト２３を掛
け渡すための一対の回転プーリ２４ａ，２４ｂが回転自
在に軸支されており、伝達ベルト２３にカム２２の一端
をＬ字形状の固定板２５とネジ２６とで挟み込み固定す
る。また、一対のプーリの一方は、伝達ベルト２３に動
力を伝達させるために同軸上にモータ２７を連結する。As shown in FIG. 3, a pair of rotary pulleys 24a, 24b for spanning a transmission belt 23 for power transmission are rotatably supported on the left and right ends of the bottom surface of the X-axis direction guide 13. The cam 22 is fixed to the transmission belt 23 by sandwiching one end of the cam 22 with an L-shaped fixing plate 25 and a screw 26. Further, one of the pair of pulleys coaxially connects the motor 27 to transmit power to the transmission belt 23.
【００２１】また、Ｘ軸方向移動台１８には、ウエハ取
り出し／返却腕２８をＺ軸方向（上下方向）に移動させ
るために、図４（Ａ）に示す如く、Ｘ軸方向移動台１８
の逆Ｔ部の右上側面部１８ｂには、レール２９がＺ軸方
向に延在するように取り付けられている。レール２９に
は移動部材３０が、Ｘ軸方向移動台１８上のＺ軸方向
で、所定の範囲で移動可能にさせるための移動部材３０
が摺動可能に嵌合されており、この移動部材３０上に、
Ｚ軸方向移動台３１が載置され、Ｘ軸方向移動台１８上
のＺ軸方向でのＺ軸方向移動台３１の移動を自在にさせ
る。Further, as shown in FIG. 4A, the X-axis direction moving table 18 is provided on the X-axis direction moving table 18 in order to move the wafer take-out / returning arm 28 in the Z-axis direction (vertical direction).
A rail 29 is attached to the upper right side surface portion 18b of the inverted T portion so as to extend in the Z-axis direction. A moving member 30 for moving the moving member 30 on the rail 29 within a predetermined range in the Z-axis direction on the X-axis direction moving table 18.
Is slidably fitted, and on this moving member 30,
The Z-axis direction moving table 31 is placed, and the Z-axis direction moving table 31 is freely movable in the Z-axis direction on the X-axis direction moving table 18.
【００２２】よって、ウエハ取り出し／返却腕２８は、
Ｚ軸方向移動台３１を介して上記移動部材３０と連結さ
れる。上記伝達ベルト２３からの動力をＺ軸方向移動台
３１にカム２２で伝えるために、Ｚ軸方向移動台３１に
は二つのローラー３２，３３が、カム２２を挟むように
取り付けられる（図３参照）。二つのローラー３２，３
３のうち右側のローラー３２は同軸上に、図４（Ａ）に
示す如く、もう一つのローラー３２ａが取り付けられて
おり、このローラー３２ａは前述したガイド板１４上を
当接した状態で転がり、Ｘ軸方向にＺ軸方向移動台３１
を案内させるように構成する。Therefore, the wafer take-out / return arm 28 is
It is connected to the moving member 30 via a Z-axis direction moving base 31. In order to transmit the power from the transmission belt 23 to the Z-axis direction moving base 31 by the cam 22, two rollers 32 and 33 are attached to the Z-axis direction moving base 31 so as to sandwich the cam 22 (see FIG. 3). ). Two rollers 32,3
The roller 32 on the right side of 3 is coaxially provided with another roller 32a as shown in FIG. 4 (A), and this roller 32a rolls in a state of abutting on the above-mentioned guide plate 14, Z axis direction moving table 31 in the X axis direction
Is configured to guide.
【００２３】Ｘ軸方向移動台１８は、上記カム２２等を
介して伝達ベルト２３の駆動に連動させており、モータ
２７により伝達ベルト２３の回転方向を一方向または他
方向にさせることで、Ｘ軸方向案内台１３の右左端部に
軸支したプーリ２４ａ，２４ｂ間を選択的に往復移動で
きるようにする。なお、図３に示す如く、レール１６の
右端部の位置にＸ軸方向移動台１８が位置する時が初期
位置を示している。The X-axis direction moving table 18 is interlocked with the driving of the transmission belt 23 via the cam 22 and the like, and the rotation direction of the transmission belt 23 is set to one direction or the other direction by the motor 27, thereby The pulleys 24a and 24b axially supported on the right and left ends of the axial guide 13 are selectively reciprocated. Note that, as shown in FIG. 3, the initial position is when the X-axis direction movable table 18 is located at the right end portion of the rail 16.
【００２４】また、Ｚ軸方向移動台３１の初期位置は、
図３に示す如く、上下移動範囲の下の点線で示した位置
である。上記ウエハ搬送手段の駆動機構の動作を、以下
に説明する。この初期位置にあるＸ軸方向移動台１８の
Ｘ軸方向での移動は、Ｚ軸方向移動台３１に取り付けた
ローラー３２ａがガイド板１４に当接していることによ
り規制されているにもかかわらず、モータ２７の回転に
よる回転力によりレール１９間をＸ軸方向移動台１８に
取り付けられたカム２２のみが左方向に移動する。この
カム２２のレール１９間での移動により、Ｚ軸方向移動
台３１に取り付けたローラー３２ａはガイド板１４に沿
い、カム２２の斜面に当接するＺ軸方向移動台３１に取
り付けたローラー３２ａは押し上げられるため、レール
２９上でＺ軸方向にＺ軸方向移動台３１を押し上げる。Further, the initial position of the Z-axis direction moving table 31 is
As shown in FIG. 3, the position is shown by a dotted line below the vertical movement range. The operation of the drive mechanism of the wafer transfer means will be described below. The movement of the X-axis direction moving table 18 in the initial position in the X-axis direction is restricted by the roller 32a attached to the Z-axis direction moving table 31 being in contact with the guide plate 14. Only the cam 22 attached to the X-axis direction moving table 18 moves leftward between the rails 19 due to the rotational force generated by the rotation of the motor 27. By the movement of the cam 22 between the rails 19, the roller 32a attached to the Z-axis direction moving base 31 follows the guide plate 14, and the roller 32a attached to the Z-axis direction moving base 31 that abuts the slope of the cam 22 is pushed up. Therefore, the Z-axis direction moving base 31 is pushed up in the Z-axis direction on the rail 29.
【００２５】Ｚ軸方向移動台３１は初期位置で、ローラ
ー３２ａがガイド板１４による規制のなくなる位置ま
で、レール２９上をＺ軸方向に移動し、停止した位置が
Ｚ軸方向移動台３１の上端位置となる。次に、Ｚ軸方向
移動台３１は、ガイド板１４によるＺ軸方向での移動が
規制された状態で、Ｚ軸方向移動台３１のローラー３２
ａが当接するガイド板により、Ｚ軸方向移動台３１は上
端位置を保ったままＸ方向をレール１６間を左方向に水
平移動することができる。At the initial position of the Z-axis direction moving base 31, the roller 32a moves in the Z-axis direction on the rail 29 to a position where the regulation by the guide plate 14 disappears, and the stopped position is the upper end of the Z-axis direction moving base 31. The position. Next, the Z-axis direction moving base 31 is in a state in which the movement in the Z-axis direction by the guide plate 14 is restricted, and the rollers 32 of the Z-axis direction moving base 31.
By the guide plate with which a is in contact, the Z-axis direction moving base 31 can horizontally move in the X direction to the left between the rails 16 while maintaining the upper end position.
【００２６】ウエハ取り出し／返却腕２８の先端部３４
は平面形状で、ほぼＵ字形状をなしている。このウエハ
取り出し／返却腕２８の内部には、図示しない通気孔が
形成されていて、上記先端部３４の上面には図２（Ａ）
に示すウエハ保持体１１からのウエハを吸着する吸着孔
３４ａが通気孔に連通しており、通気孔は図示しない真
空源に接続されている。Wafer take-out / return arm 28 tip portion 34
Is a plane shape, and is substantially U-shaped. A vent hole (not shown) is formed inside the wafer take-out / return arm 28, and the upper surface of the tip portion 34 is shown in FIG.
An adsorption hole 34a for adsorbing the wafer from the wafer holder 11 shown in FIG. 2 is connected to the ventilation hole, and the ventilation hole is connected to a vacuum source (not shown).
【００２７】上記位置にあるウエハ取り出し／返却腕２
８の先端部３４は、上端位置にあるエレベータ１０上に
載置されたウエハ保持体１１の最下段のウエハの位置よ
り、僅かに下方の高さ位置にくるように設定する。図１
に示すウエハ検査装置１の外装ハウジング７前面に設け
られているスタートボタン３５をオンすると、Ｘ軸方向
移動台１８が初期位置であるエレベータ１０の右端に配
置され、下端位置にあるウエハ取り出し／返却腕２８の
先端部３４は、後述する手段により上端位置にあるエレ
ベータ１０上に載置されたウエハ保持体１１の最下段の
水平棚の位置より、僅かに下方に挿入される。Wafer take-out / return arm 2 in the above position
The tip portion 34 of 8 is set so as to come to a height position slightly below the position of the lowermost wafer of the wafer holder 11 placed on the elevator 10 at the upper end position. FIG.
When the start button 35 provided on the front surface of the exterior housing 7 of the wafer inspection apparatus 1 shown in FIG. 1 is turned on, the X-axis direction moving base 18 is arranged at the right end of the elevator 10 which is the initial position and the wafer takeout / return at the lower end position is performed. The tip end portion 34 of the arm 28 is inserted slightly below the position of the lowermost horizontal shelf of the wafer holder 11 placed on the elevator 10 at the upper end position by means described later.
【００２８】次いで、エレベータ１０を水平棚の間隔だ
け下降させると、最下段の水平棚の上のウエハがウエハ
取り出し／返却腕２８の先端部３４上にすくい上げられ
る。先端部上のウエハは、この後に、図２（Ａ）に示す
吸着孔３４ａを介して、図示しない真空源による負圧に
より先端部３４の上面に吸着され、図３に示すレール１
６上を右端まで移動して、ウエハ保持体１１の最下段の
水平棚からウエハを取り出すことができる。Next, when the elevator 10 is lowered by the distance between the horizontal shelves, the wafers on the lowermost horizontal shelves are picked up on the tips 34 of the wafer take-out / return arms 28. After that, the wafer on the tip portion is attracted to the upper surface of the tip portion 34 by negative pressure from a vacuum source (not shown) through the adsorption holes 34a shown in FIG. 2A, and the rail 1 shown in FIG.
6 can be moved to the right end and the wafer can be taken out from the lowermost horizontal shelf of the wafer holder 11.
【００２９】ウエハ載置手段であるマクロテーブル３６
は、ウエハ保持体１１の長手方向に設けられている。円
形の平面形状を有したマクロテーブル３６は、Ｘ軸方向
移動台１８が初期位置にあり、Ｚ軸方向移動台３１の最
上位置にある時に、ウエハ取り出し／返却腕２８のほぼ
Ｕ字形状の先端部３４の下方にあり、且つＺ軸方向移動
台３１の最下位置より上方の位置に設置される。A macro table 36 as a wafer mounting means
Are provided in the longitudinal direction of the wafer holder 11. The macro table 36 having a circular planar shape has a substantially U-shaped tip of the wafer take-out / return arm 28 when the X-axis direction moving table 18 is at the initial position and the Z-axis direction moving table 31 is at the uppermost position. It is installed below the portion 34 and above the lowermost position of the Z-axis direction moving table 31.
【００３０】マクロテーブル３６は上下方向に所定の範
囲内で移動自在であるが、通常は下端位置に配置させ
る。マクロテーブル３６の上面には、前述したものと同
様の吸着孔３６ａが形成されており、その吸着孔３６ａ
は図示しない真空源に接続する。ウエハ取り出し／返却
腕２８の先端部３４は、ウエハ取り出し／返却腕２８を
取り付けたＸ軸方向移動台１８により、ウエハを吸着状
態でレール１６上を右方向に移動する。右端位置にＸ軸
方向移動台１８が到着後、ウエハ取り出し／返却腕２８
は、レール２９上をＺ軸方向移動台３１により上端位置
から下端位置へと降下する。The macro table 36 is movable in the vertical direction within a predetermined range, but is usually placed at the lower end position. On the upper surface of the macro table 36, the same suction holes 36a as those described above are formed.
Is connected to a vacuum source (not shown). The tip portion 34 of the wafer take-out / return arm 28 is moved to the right on the rail 16 in a state where the wafer is sucked by the X-axis direction moving table 18 to which the wafer take-out / return arm 28 is attached. After the X-axis direction movable table 18 arrives at the right end position, the wafer take-out / return arm 28
Moves down on the rail 29 from the upper end position to the lower end position by the Z-axis direction moving base 31.
【００３１】降下したウエハ取り出し／返却腕２８は、
先端部３４にウエハを吸着しているので、下端位置にお
いてウエハ取り出し／返却腕２８の先端部３４は下端位
置に配置されているマクロテーブル３６の上面よりも下
方に移動することにより、先端部３４上のウエハはマク
ロテーブル３６の上面に載置される。次に、図５に示さ
れる如く、ウエハ検査装置１の後述するウエハ裏返し手
段のウエハ保持腕上方に、ポリアセタール樹脂からなる
合成樹脂製の一対の芯出し部材３７をマクロテーブル３
６と同心上に配置させる。The lowered wafer retrieval / return arm 28 is
Since the wafer is adsorbed to the tip end portion 34, the tip end portion 34 of the wafer take-out / return arm 28 at the lower end position moves below the upper surface of the macro table 36 arranged at the lower end position, thereby causing the tip end portion 34 to move. The upper wafer is placed on the upper surface of the macro table 36. Next, as shown in FIG. 5, a pair of centering members 37 made of a synthetic resin made of polyacetal resin is provided on the macro table 3 above the wafer holding arm of the wafer inverting means, which will be described later, of the wafer inspection apparatus 1.
Place it concentrically with 6.
【００３２】一対の芯出し部材３７は、図５乃至図７に
示される如く、芯出し部材取付板３８に連結されてい
る。この芯出し部材取付板３８は、芯出し部材支持台座
３９の両端に一本づつ植設された小径の位置決めピン４
０によって、芯出し部材支持台座３９上に位置決めさ
れ、さらに、芯出し部材取付板３８は、一対の芯出し部
材支持台座３９にツマミネジ４１によって固定される。The pair of centering members 37 are connected to a centering member mounting plate 38, as shown in FIGS. The centering member mounting plate 38 has a small diameter positioning pin 4 which is planted at both ends of the centering member support base 39.
0, the centering member support pedestal 39 is positioned, and the centering member attachment plate 38 is fixed to the pair of centering member support pedestals 39 by a knob screw 41.
【００３３】芯出し部材支持台座３９は、マクロテーブ
ル３６を中心にして摺動できるように、基板４２上に一
対のレール４３を設置し、そのレール４３に摺動可能な
移動部材４４を挟持させて、その移動部材４４上に上記
芯出し部材支持台座３９を対称にネジ４５で固定する。
一対の芯出し部材支持台座３９は基板４２上にマクロテ
ーブル３６の中心に対して半径方向で相互に接近及び離
間自在に保持させるために、図５に良く示されている如
く、基板４２の下面側でリンク機構４６により相互に同
じ速度で同じ距離で接近及び離間するように連結してお
り、その駆動を行わせるために基板４２の下面側には、
モータの回転軸４９を偏芯機構４７を介して連結する。
モータの回転軸４９に支持部材５０を介して、回転自在
なローラー４８が取り付けられて、偏芯機構４７は構成
される。The centering member supporting pedestal 39 is provided with a pair of rails 43 on a substrate 42 so that the centering member supporting pedestal 39 can slide around the macro table 36, and the slidable moving member 44 is held by the rails 43. Then, the centering member support pedestal 39 is symmetrically fixed on the moving member 44 with screws 45.
The pair of centering member support pedestals 39 are held on the substrate 42 so that they can be moved toward and away from each other in the radial direction with respect to the center of the macro table 36, as shown in FIG. On the lower side of the substrate 42 in order to drive them, they are connected to each other by a link mechanism 46 so as to approach and separate from each other at the same speed and at the same distance.
The rotating shaft 49 of the motor is connected via the eccentric mechanism 47.
An eccentric mechanism 47 is configured by attaching a rotatable roller 48 to a rotary shaft 49 of the motor via a support member 50.
【００３４】すなわち、モータの回転により、ローラー
４８がレバー４６ａを押圧すると、リンク機構４６によ
り一対の芯出し部材支持台座３９は一対の芯出し部材３
７とともに、レール４３上をマクロテーブル３６の中心
に向かい相互に同じ速度で同じ距離接近する。次に、ロ
ーラー４８による付勢がなくなると、図示しないバネに
よりレバー４６ａは引っ張られて、一対の芯出し部材支
持台座３９は一対の芯出し部材３７とともに、レール４
３上をマクロテーブル３６の中心から相互に同じ速度で
同じ距離遠ざけられる。That is, when the roller 48 presses the lever 46a by the rotation of the motor, the link mechanism 46 causes the pair of centering member support pedestals 39 to move to the pair of centering members 3.
Along with rail 7, the rails 43 move toward the center of the macro table 36 and approach each other at the same speed and the same distance. Next, when the bias by the roller 48 is released, the lever 46a is pulled by a spring (not shown), and the pair of centering member support pedestals 39, together with the pair of centering members 37, together with the rail 4a.
3 are separated from the center of the macro table 36 at the same speed and the same distance.
【００３５】芯出し部材取付板３８と連結される一対の
芯出し部材３７は、ウエハ検査装置１において検査され
る大きな直径の方のウエハの外周縁と同じ曲率の内周面
３７ａを有している。一対の芯出し部材支持台座３９の
それぞれの上面の一本の固定孔５１と、その両側に芯出
し部材取付板３８に配置された小径の位置決めピン４０
とに、一つの固定孔５２及びその両側の二つの位置決め
孔５３がそれぞれ嵌合される芯出し部材取付板３８が配
置されている。The pair of centering members 37 connected to the centering member mounting plate 38 has an inner peripheral surface 37a having the same curvature as the outer peripheral edge of the wafer having a larger diameter to be inspected in the wafer inspection apparatus 1. There is. One fixing hole 51 on the upper surface of each of the pair of centering member support pedestals 39 and small-diameter positioning pins 40 arranged on the centering member mounting plate 38 on both sides thereof.
A centering member mounting plate 38 into which one fixing hole 52 and two positioning holes 53 on both sides of the fixing hole 52 are fitted is arranged.
【００３６】よって、一対の芯出し部材３７は一対の芯
出し部材支持台座３９上面の位置に特別な工具を用いる
ことなくツマミネジ４１で、容易に着脱自在に取り付け
ることができる。芯出し部材３７は、小さな直径の方の
ウエハの外周縁と同じ曲率の内側面３７ａ’を有した一
対の芯出し部材３７’と交換することができる。Therefore, the pair of centering members 37 can be easily and removably attached to the positions of the upper surfaces of the pair of centering member support pedestals 39 with the knob screws 41 without using a special tool. The centering member 37 can be replaced with a pair of centering members 37 'having an inner side surface 37a' having the same curvature as the outer peripheral edge of the wafer having a smaller diameter.
【００３７】よって、マクロテーブル３６の中心に接近
した一対の芯出し部材３７は、マクロテーブル３６上の
ウエハの外周縁にウエハと同じ曲率を有した内周面３７
ａを当接させてウエハを挟持する。これにより、ウエハ
の中心をマクロテーブル３６の中心に一致させた後、一
対の芯出し部材３７は基板４２上のリンク機構により、
相互に元の位置まで復帰する。Therefore, the pair of centering members 37 close to the center of the macro table 36 has an inner peripheral surface 37 having the same curvature as the wafer on the outer peripheral edge of the wafer on the macro table 36.
The wafer is clamped by bringing a into contact. As a result, after the center of the wafer is aligned with the center of the macro table 36, the pair of centering members 37 are moved by the link mechanism on the substrate 42.
Mutually return to the original position.
【００３８】その後、真空源から負圧が供給されて、マ
クロテーブル３６の上面の吸着孔３６ａによりウエハは
吸着される。マクロテーブル３６は、図示しない機構に
より上方に移動させ、上端位置において、図１及び図２
に示すジョイスティック（操作レバー）５４の操作によ
り３６０度の任意の周方向位置で、任意の傾斜角度に傾
斜させることができる。Then, a negative pressure is supplied from the vacuum source, and the wafer is sucked by the suction holes 36a on the upper surface of the macro table 36. The macro table 36 is moved upward by a mechanism (not shown), and at the upper end position, the macro table 36 shown in FIGS.
By operating the joystick (operation lever) 54 shown in FIG. 5, the tilt can be made at any tilt angle at any circumferential position of 360 degrees.
【００３９】マクロテーブル３６の上面のウエハは吸着
孔３６ａから供給される負圧により、上面に吸着されて
いるので、ジョイスティック５４の操作によりマクロテ
ーブル３６とともに傾斜する上面からウエハは落下しな
い。そのため、ウエハを傾斜させることにより、種々の
角度から上面のパターンを検査することが容易である。Since the wafer on the upper surface of the macro table 36 is attracted to the upper surface by the negative pressure supplied from the suction holes 36a, the wafer does not drop from the upper surface inclined with the macro table 36 by the operation of the joystick 54. Therefore, by inclining the wafer, it is easy to inspect the pattern on the upper surface from various angles.
【００４０】マクロテーブル３６は、外装ハウジング７
の前面に構成された操作面の停止時間設定スイッチ５５
（図１参照）により、上端位置に停止している時間を予
め設定することができ、設定された停止時間経過後に、
下端位置までマクロテーブル３６を下降させる。ウエハ
保持腕５６は、図２（Ａ）に示すエレベータ１０の近傍
で、ウエハ取り出し／返却腕２８の先端部３４の上方
で、且つ略Ｕ字形状とほぼ同心状に配置されている。The macro table 36 is the exterior housing 7.
Stop time setting switch 55 on the operation surface
(See FIG. 1), it is possible to preset the time of stopping at the upper end position, and after the set stop time has elapsed,
The macro table 36 is lowered to the lower end position. The wafer holding arm 56 is arranged near the elevator 10 shown in FIG. 2A, above the tip portion 34 of the wafer take-out / return arm 28, and substantially concentrically with the U-shape.
【００４１】この実施例ではウエハ保持腕５６及びこれ
らのため駆動機構がウエハ裏返し手段を構成している
（図８参照）。ウエハ保持腕５６の内部には、図示しな
い通気孔が形成されていて、上面にはウエハを吸着させ
るための図８に示すようなウエハを吸着させる吸引孔５
６ａが開口されており、通気孔は図示しない真空源に接
続されている。In this embodiment, the wafer holding arms 56 and the drive mechanism for them constitute the wafer inverting means (see FIG. 8). A vent hole (not shown) is formed inside the wafer holding arm 56, and a suction hole 5 for adsorbing the wafer, as shown in FIG. 8, for adsorbing the wafer is formed on the upper surface.
6a is opened, and the ventilation hole is connected to a vacuum source (not shown).
【００４２】上記ウエハ保持腕５６は、ウエハ裏面の検
査面を広げ、ウエハとウエハ保持腕５６との接触を最小
限に抑えるために、ウエハ直径より大きな保持部とウエ
ハ裏面側に向けて形成された三つの接触部５６ｂとを有
している。ウエハ保持腕５６の後端部は、ウエハ保持腕
台座５６ｃに着脱自在に取り付けられている。The wafer holding arm 56 is formed toward the holding portion larger than the wafer diameter and toward the wafer back surface side in order to widen the inspection surface on the back surface of the wafer and minimize contact between the wafer and the wafer holding arm 56. And three contact portions 56b. The rear end of the wafer holding arm 56 is detachably attached to the wafer holding arm pedestal 56c.
【００４３】また、ウエハの裏面を検査するために、ウ
エハ保持腕５６を傾ける駆動機構は、モータの回転軸に
取り付けたウオ ームと、ウエハ保持腕５６に取り付けた
ギアとで構成することができる。ウエハ保持腕台座５６
ｃの上面には、ウエハ保持腕５６に対応する５６ｃ一対
の位置決め孔５７が形成されており、図８に示す如く、
一対の位置決めピン５８が固定される。Further, in order to inspect the back surface of the wafer, the drive mechanism for inclining the wafer holding arm 56 may be composed of a worm attached to the rotation shaft of the motor and a gear attached to the wafer holding arm 56. it can. Wafer holding arm pedestal 56
A pair of positioning holes 57c corresponding to the wafer holding arm 56 are formed on the upper surface of c, and as shown in FIG.
The pair of positioning pins 58 are fixed.
【００４４】ウエハ保持腕台座５６ｃの上面の一対の位
置決めピン５８は、一対の位置決め孔５７に嵌合され、
さらに、大きなツマミネジ５９により、ウエハ保持腕台
座５６ｃの上面に対してウエハ保持腕５６を容易に着脱
自在に取り付けられる。ウエハ保持腕５６は、慣用手段
からなるラック・ピニオンの上下動機構により、上昇し
てマクロテーブル３６上に載置されているウエハの裏面
に接触しウエハの吸着を行い、さらに、上昇することに
よって、マクロテーブル３６からウエハを離間させる。The pair of positioning pins 58 on the upper surface of the wafer holding arm pedestal 56c are fitted into the pair of positioning holes 57,
Further, the large knob screw 59 allows the wafer holding arm 56 to be easily and detachably attached to the upper surface of the wafer holding arm pedestal 56c. The wafer holding arm 56 is lifted by a rack and pinion vertical movement mechanism, which is a conventional means, comes into contact with the back surface of the wafer placed on the macro table 36, sucks the wafer, and further moves up. The wafer is separated from the macro table 36.
【００４５】ウエハ保持腕５６はウエハを保持したま
ま、裏面駆動機構により所定の回転角度までウエハ保持
腕５６を駆動させ、ウエハ裏面が検査できるように位置
付ける。ウエハ保持腕５６を所定の回転角位置に所定の
時間停止させて、ウエハ裏面の検査を行う。上記所定の
時間は、ウエハ検査装置１の外装ハウジング７の前面の
停止時間設定スイッチ５５（図１参照）により、予め設
定されている。The wafer holding arm 56 is positioned so that the back surface of the wafer can be inspected by driving the wafer holding arm 56 up to a predetermined rotation angle by the back surface driving mechanism while holding the wafer. The wafer holding arm 56 is stopped at a predetermined rotation angle position for a predetermined time, and the back surface of the wafer is inspected. The predetermined time is preset by the stop time setting switch 55 (see FIG. 1) on the front surface of the outer housing 7 of the wafer inspection apparatus 1.
【００４６】所定の時間停止した後、ウエハ保持腕５６
は水平な初期位置へと戻される。マクロテーブル３６よ
り上方にあるウエハ保持腕５６は、上下動機構により、
マクロテーブル３６より下方まで降下し、ウエハはマク
ロテーブル３６に載置される。図５乃至図６に示す如
く、マクロテーブル３６の中心から半径方向に所定距離
離間した位置に、オリフラ検知器６０が設置されてい
る。この実施例ではオリフラ検知器６０に光学センサ６
１を用いており、この光学センサ６１は、マクロテーブ
ル３６上に保持され、直径の異なるウエハのオリフラ
（＝オリエンテーションフラット）を検知できるように
マクロテーブル３６の半径方向に選択的に移動自在に配
置したものである。After stopping for a predetermined time, the wafer holding arm 56
Is returned to its initial horizontal position. The wafer holding arm 56 above the macro table 36 is moved by the vertical movement mechanism.
The wafer descends below the macro table 36, and the wafer is placed on the macro table 36. As shown in FIGS. 5 to 6, an orientation flat detector 60 is installed at a position spaced apart from the center of the macro table 36 by a predetermined distance in the radial direction. In this embodiment, the orientation flat detector 60 has an optical sensor 6
1, the optical sensor 61 is held on the macro table 36 and is selectively movably arranged in the radial direction of the macro table 36 so that the orientation flat (= orientation flat) of wafers having different diameters can be detected. It was done.
【００４７】光学センサ６１は、一端に位置決めピン６
２、中央に固定孔６３を有する支持部材６４の他端に取
り付けられており、この支持部材６４を固定する支持部
材固定台座６５の上面には、位置決め孔６６と固定孔６
７とが形成されている。支持部材６４は、支持部材固定
台座６５上の位置決め孔６６に位置決めピン６２を嵌合
させ、さらに、支持部材固定台座６５上の固定孔６７に
支持部材６４の固定孔６３を介してツマミネジ６８を螺
合させて固定する。The optical sensor 61 has a positioning pin 6 at one end.
2. A positioning hole 66 and a fixing hole 6 are provided on the upper surface of a supporting member fixing pedestal 65 which is attached to the other end of a supporting member 64 having a fixing hole 63 in the center and which fixes the supporting member 64.
7 are formed. The support member 64 fits the positioning pin 62 into the positioning hole 66 on the support member fixing base 65, and further, the knob screw 68 is inserted into the fixing hole 67 on the support member fixing base 65 via the fixing hole 63 of the support member 64. Secure by screwing.
【００４８】さらに、支持部材固定台座６５上には、小
さな直径のウエハの所定距離半径方向に離間した位置で
も支持部材６４を着脱するための位置決め孔６６’と固
定孔６７’とが形成される。マクロテーブル３６ととも
に所定の速度で回転しているウエハのオリフラを上記ウ
エハの回転軌跡に対応した位置に配置されている光学セ
ンサ６１が検知してから、マクロテーブル３６を所定の
回転角度位置で停止させる。次に、ウエハ検査装置１の
外装ハウジング７の前面に配置されているオリフラ位置
設定スイッチ６９（図１参照）により、オリフラの方向
を任意の方向に設定することができる。Further, on the supporting member fixing pedestal 65, there are formed a positioning hole 66 'and a fixing hole 67' for attaching and detaching the supporting member 64 even at a position where a wafer having a small diameter is separated by a predetermined distance in the radial direction. . The macro table 36 is stopped at a predetermined rotation angle position after the optical sensor 61 arranged at a position corresponding to the rotation trajectory of the wafer detects the orientation flat of the wafer rotating at a predetermined speed together with the macro table 36. Let Next, the orientation flat direction can be set to an arbitrary direction by the orientation flat position setting switch 69 (see FIG. 1) arranged on the front surface of the exterior housing 7 of the wafer inspection apparatus 1.
【００４９】なお、オリフラ合わせは、一般にミクロ検
査の時に必要であるため、それ以外のマクロ検査の時に
はオリフラ合わせは行わないようにしたので、時間の短
縮が見込まれる。さらに、図２（Ａ）に示す如く、ウエ
ハ顕微鏡搬送部材７０は、両端部にほぼＣ字形の平面形
状部７０ａが形成されている。このＣ字形の平面形状部
７０ａは、マクロテーブル３６の外形より大きい直径を
有し、同心状に形成されているとともに、マイクロテー
ブル３６より低い位置に配置される。また、図示しない
上下動機構により、ウエハ顕微鏡搬送部材７０は、長手
方向の中央に位置する回転軸７０ｂを中心に回転自在で
あるとともに、下端位置のマクロテーブル３６上端面よ
り下方の下端位置と、上記マクロテーブル３６上端面よ
り上方の上端位置との間で選択的に上下可能である。通
常、ウエハ顕微鏡搬送部材７０は下端位置に配置され
る。なお、Ｃ字形の平面形状部の上には、図２（Ａ）に
示すようなウエハを吸着させる吸引孔７１が設けられて
いる。Since the orientation flat alignment is generally required for the micro inspection, the orientation flat alignment is not performed for the other macro inspections, so that the time is expected to be shortened. Further, as shown in FIG. 2 (A), the wafer microscope carrying member 70 has substantially C-shaped planar portions 70a formed at both ends. The C-shaped flat portion 70 a has a diameter larger than the outer shape of the macro table 36, is formed concentrically, and is arranged at a position lower than the micro table 36. Further, the wafer microscope transfer member 70 is rotatable around a rotation shaft 70b located at the center in the longitudinal direction by an up-and-down moving mechanism (not shown), and at the lower end position below the upper end surface of the macro table 36 at the lower end position. It is possible to selectively move up and down between the upper end position above the upper end surface of the macro table 36. Usually, the wafer microscope carrying member 70 is arranged at the lower end position. A suction hole 71 for sucking the wafer is provided on the C-shaped plane portion as shown in FIG.
【００５０】また、図２（Ａ）に示す如く、ウエハのミ
クロ検査のために、顕微鏡２のＸテーブル３ａの左端に
形成されている細長い係合突起８がウエハ検査装置１の
外装ハウジング７上面の前端部右側領域のＸテーブル受
け９に係合されると、Ｘテーブル受け９の図示しない光
学センサによりＸテーブル受け９の位置を検知するよう
にする。Further, as shown in FIG. 2A, an elongated engaging projection 8 formed at the left end of the X table 3a of the microscope 2 is provided on the upper surface of the exterior housing 7 of the wafer inspection apparatus 1 for microinspection of the wafer. When it is engaged with the X table receiver 9 in the right side region of the front end portion, the position of the X table receiver 9 is detected by an optical sensor (not shown) of the X table receiver 9.
【００５１】マクロテーブル３６は下端位置でウエハを
水平に吸着した状態で、図示しないモータにより所定の
方向に所定の速度で回転を開始する。マクロテーブル３
６の回転が停止され、ウエハのオリフラが所定の方向に
向けられた後に、ウエハ顕微鏡搬送部材７０は、上昇し
てマクロテーブル３６上からウエハをＣ字形の平面形状
部７０ａの一端部ですくい上げ、吸着孔７１の負圧でウ
エハを吸着する。The macro table 36 starts rotating at a predetermined speed in a predetermined direction by a motor (not shown) with the wafer held horizontally at the lower end. Macro table 3
After the rotation of 6 is stopped and the orientation flat of the wafer is directed in a predetermined direction, the wafer microscope transfer member 70 rises and scoops the wafer from above the macro table 36 at one end of the C-shaped planar shape portion 70a. The wafer is sucked by the negative pressure of the suction holes 71.
【００５２】次に、ウエハ顕微鏡搬送部材７０は、所定
の方向に１８０度回転し、ウエハを顕微鏡２のＸテーブ
ル３ａの左端部の上方まで移動させる。さらに、ウエハ
顕微鏡搬送部材７０は、下降してウエハを顕微鏡２のＸ
テーブル３ａの上面に載置させる。この後、Ｘテーブル
３ａ上のウエハを顕微鏡２の対物レンズ群５の下方に移
動させて顕微鏡２によるウエハのミクロ検査を行う。Next, the wafer microscope carrying member 70 rotates 180 degrees in a predetermined direction to move the wafer to a position above the left end of the X table 3a of the microscope 2. Further, the wafer microscope carrying member 70 descends to move the wafer to the X-axis of the microscope 2.
It is placed on the upper surface of the table 3a. After that, the wafer on the X table 3a is moved below the objective lens group 5 of the microscope 2 to perform micro inspection of the wafer by the microscope 2.
【００５３】ミクロ検査の終了後、顕微鏡２のＸテーブ
ル３ａの左端に形成されている細長い係合突起８をウエ
ハ検査装置１の外装ハウジング７の上面の前端部右側領
域のＸテーブル受け９に係合させ、この係合状態をＸテ
ーブル受け９の図示しない光学センサにより検知する。
ミクロ検査終了後、ウエハ顕微鏡搬送手段７０は、前述
した動作と逆の動作を行って、マクロテーブル３６上に
ウエハを戻す。After the micro inspection, the elongated engaging projection 8 formed on the left end of the X table 3a of the microscope 2 is engaged with the X table receiver 9 in the right side region of the front end portion of the upper surface of the exterior housing 7 of the wafer inspection apparatus 1. This engagement state is detected by an optical sensor (not shown) of the X table receiver 9.
After the micro inspection is completed, the wafer microscope carrying means 70 carries out an operation opposite to the above-mentioned operation to return the wafer onto the macro table 36.
【００５４】次に、上述した検査終了後、ウエハをウエ
ハ保持体１１に戻す動作を以下に説明する。ウエハ取り
出し／返却腕２８が下端位置から上端位置まで上昇して
先端部３４によりマクロテーブル３６からウエハをすく
い上げる。ウエハ取り出し／返却腕２８は先端部３４上
にウエハを保持した状態で、Ｘ軸方向移動台１８が左側
のエレベータ１０上のウエハ保持体１１まで水平移動す
る（図１参照）。次いで、ウエハを保持した先端部３４
をウエハ保持体１１の最下段の水平棚の僅かに上方位置
に挿入する。Next, the operation of returning the wafer to the wafer holder 11 after the above-mentioned inspection is completed will be described below. The wafer take-out / return arm 28 rises from the lower end position to the upper end position, and the tip portion 34 picks up the wafer from the macro table 36. With the wafer pick-up / return arm 28 holding the wafer on the tip portion 34, the X-axis direction moving table 18 horizontally moves to the wafer holder 11 on the left elevator 10 (see FIG. 1). Next, the tip portion 34 holding the wafer
Is inserted at a position slightly above the lowermost horizontal shelf of the wafer holder 11.
【００５５】そして、エレベータ１０がウエハ保持体１
１中の水平棚の一段分上昇して最下段の棚で先端部３４
上のウエハをすくい上げた後、ウエハ取り出し／返却腕
２８は図２（Ａ）に実線で示す元の位置に復帰する。以
下、同様に全てのウエハの全てのマクロ検査及び選択的
なミクロ検査が終了し、左側のエレベータ１０上のウエ
ハ保持体１１中の複数の棚上に移送されるまでそれぞれ
のウエハにつき順次行われる。Then, the elevator 10 serves as the wafer holder 1.
The horizontal shelf in 1 rises by one step and the tip of the shelf at the bottom shelf 34
After picking up the upper wafer, the wafer take-out / return arm 28 returns to the original position shown by the solid line in FIG. Hereinafter, similarly, all the macro inspections and the selective micro inspections of all the wafers are completed, and sequentially performed for each wafer until they are transferred to a plurality of shelves in the wafer holder 11 on the left elevator 10. .
【００５６】上述したこの発明の実施例として、従来の
ウエハ検査装置に比べて、モータを主にエアシリンダの
代わりに用いたので、ウエハ検査装置を従来のものに比
べて安価にすることができる。また、ウエハの吸着機構
には、主に負圧による吸着を行わせるようにしたため、
装置内外の埃等を吸引することになり、精度良くウエハ
のミクロ検査等を行うことができる。In the above-described embodiment of the present invention, since the motor is mainly used instead of the air cylinder as compared with the conventional wafer inspection apparatus, the wafer inspection apparatus can be made cheaper than the conventional one. . Also, since the wafer suction mechanism is designed to perform suction mainly by negative pressure,
Since dust and the like inside and outside the apparatus are sucked, it is possible to perform micro inspection of the wafer with high accuracy.
【００５７】さらに、オリフラ位置の設定を、オリフラ
の位置が必要ないマクロ検査前にオリフラ位置を設定す
る機構を有する従来のウエハ検査装置に比べて、ミクロ
検査の時に行うようにしたので、検査時間の短縮につな
がる。他に、ウエハ保持体の載置する位置を、装置後方
にしていた従来のウエハ検査装置に比べて、装置の長手
方向にウエハ保持体を載置できるようにしたので、ウエ
ハ保持体の交換の際、従来のものに比べて交換を容易に
行うことができる。Further, the orientation flat position is set at the time of microinspection as compared with the conventional wafer inspection apparatus having a mechanism for setting the orientation flat position before the macro inspection which does not require the orientation flat position. Leads to shortening of. In addition, the wafer holder can be placed in the longitudinal direction of the apparatus as compared with the conventional wafer inspection apparatus in which the wafer holder is placed on the rear side of the apparatus. In this case, the replacement can be easily performed as compared with the conventional one.
【００５８】また、ウエハ裏返し手段によって、裏返さ
れるウエハの吸着を吸着部を有する突出部で行わせるこ
とで、ウエハ裏面の視認可能な領域が広くできたので、
より視認性を向上させることができる。Further, since the wafer flipping means causes the wafer to be flipped over to be attracted by the protruding portion having the attracting portion, the visible area on the back surface of the wafer can be widened.
The visibility can be further improved.
【００５９】[0059]
【発明の効果】この発明のウエハ検査装置によれば、容
易且つ迅速にウエハの検査を行うことができる。また、
ウエハ検査装置のウエハ保持体の交換を容易にすること
ができる。According to the wafer inspection apparatus of the present invention, the wafer can be inspected easily and quickly. Also,
It is possible to easily replace the wafer holder of the wafer inspection apparatus.
【図１】顕微鏡と組み合わされたウエハ検査装置の正面
図である。FIG. 1 is a front view of a wafer inspection apparatus combined with a microscope.
【図２】（Ａ）は図１のウエハ検査装置の平面図であ
る。（Ｂ）は図１のウエハ検査装置の右側面図である。FIG. 2A is a plan view of the wafer inspection apparatus of FIG. (B) is a right side view of the wafer inspection apparatus of FIG. 1.
【図３】図２のウエハ移送手段の機構の正面図である。3 is a front view of the mechanism of the wafer transfer means of FIG. 2. FIG.
【図４】（Ａ）は図３の左側面図である。（Ｂ）は図３
の右側面図である。FIG. 4A is a left side view of FIG. (B) is FIG.
FIG.
【図５】ウエハの芯出し手段の機構とオリフラ検知器の
平面図である。FIG. 5 is a plan view of a mechanism of wafer centering means and an orientation flat detector.
【図６】図５の左側面図である。FIG. 6 is a left side view of FIG.
【図７】図５の正面図である。FIG. 7 is a front view of FIG.
【図８】ウエハ裏返し手段の機構の平面図である。FIG. 8 is a plan view of the mechanism of the wafer inverting means.
１ ウエハ検査装置 ２ 顕微鏡 ３ ＸＹテーブル ３ａ Ｘテーブル ４ レボルバ ５ 対物レンズ群 ６ 接眼レンズ ７ 外装ハウジング ８ 係合突起 ９ Ｘテーブル受け １０ エレベータ １１ ウエハ保持体 １２ 位置決め部材 １３ Ｘ軸方向案内台 １４ ガイド板 １５，２１，２６，４５ ネジ １６，１９，２９，４３ レール １７，２０，３０，４４ 移動部材 １８ Ｘ軸方向移動台 １８ａ Ｘ軸方向移動台の逆Ｔ字部の右下側面 １８ｂ Ｘ軸方向移動台の逆Ｔ字部の右上側面 ２２ カム ２３ 伝達ベルト ２４ａ，２４ｂ 回転プーリ ２５ 固定板 ２７ モータ ２８ ウエハ取り出し／返却腕 ３１ Ｚ軸方向移動台 ３２，３２ａ，３３，４８ ローラー ３４ 先端部 ３４ａ，３６ａ，５６ａ，７１ 吸着孔 ３５ スタートボタン ３６ マクロテーブル ３７，３７’ 芯出し部材 ３７ａ，３７ａ’ 内周面 ３８ 芯出し部材取付板 ３９ 芯出し部材支持台座 ４０，５８，６２ 位置決めピン ４１，５９，６８ ツマミネジ ４２ 基板 ４６ リンク機構 ４６ａ レバー ４７ 偏芯機構 ４９ 回転軸 ５０，６４ 支持部材 ５１，５２，６３，６７，６７’ 固定孔 ５３，５７，６６，６６’ 位置決め孔 ５４ ジョイスティック（操作レバー） ５５ 停止時間設定スイッチ ５６ ウエハ保持腕 ５６ｂ 接触部 ５６ｃ ウエハ保持腕台座 ６０ オリフラ検知器 ６１ 光学センサ ６５ 支持部材固定台座 ６９ オリフラ位置設定スイッチ ７０ ウエハ顕微鏡搬送部材 ７０ａ Ｃ字形の平面形状部 ７０ｂ 回転軸 1 Wafer Inspection Device 2 Microscope 3 XY Table 3a X Table 4 Revolver 5 Objective Lens Group 6 Eyepiece 7 Outer Housing 8 Engagement Protrusion 9 X Table Receiver 10 Elevator 11 Wafer Holder 12 Positioning Member 13 X-axis Direction Guide 14 Guide Plate 15, 21, 26, 45 Screws 16, 19, 29, 43 Rails 17, 20, 30, 44 Moving member 18 X-axis direction moving table 18a X Right-side lower surface of reverse T-shaped part of the moving table 18b X-axis direction Upper right side surface of the inverted T-shaped portion of the moving table 22 Cam 23 Transmission belt 24a, 24b Rotating pulley 25 Fixing plate 27 Motor 28 Wafer taking out / returning arm 31 Z axis direction moving table 32, 32a, 33, 48 Roller 34 Tip part 34a, 36a, 56a, 71 Adsorption hole 35 Start button 36 Macro table 37, 37 ' Centering member 37a, 37a 'Inner peripheral surface 38 Centering member mounting plate 39 Centering member support pedestal 40, 58, 62 Positioning pin 41, 59, 68 Knob screw 42 Board 46 Link mechanism 46a Lever 47 Eccentric mechanism 49 Rotation shaft 50 , 64 support member 51, 52, 63, 67, 67 'fixing hole 53, 57, 66, 66' positioning hole 54 joystick (operation lever) 55 stop time setting switch 56 wafer holding arm 56b contact portion 56c wafer holding arm pedestal 60 Orientation flat detector 61 Optical sensor 65 Support member fixed pedestal 69 Orientation flat position setting switch 70 Wafer microscope transfer member 70a C-shaped flat portion 70b Rotation axis
───────────────────────────────────────────────────── フロントページの続き (72)発明者 加藤 智生 東京都八王子市大和田町４−29−16 株式 会社オリンパスエンジニアリング内 (72)発明者 秋葉 徹 東京都八王子市大和田町４−29−16 株式 会社オリンパスエンジニアリング内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomio Kato 4-29-16 Owada-cho, Hachioji-shi, Tokyo Olympus Engineering Co., Ltd. (72) Toru Akiba 4-29-16 Owada-cho, Hachioji, Tokyo Within Olympus Engineering
Claims (4)
用の開口を一方に有するウエハ保持体と、 ウエハ保持体から所望のウエハを取り出し、所望の検査
終了後にウエハをウエハ保持体中の所望の位置に返却す
るウエハ搬送手段と、 ウエハ搬送手段により取り出されたウエハのマクロ検査
をするためにウエハを載置するウエハ載置手段と、 ウエハの裏面をマクロ検査するためのウエハ裏返し手段
とを備えており、 上記ウエハ保持体のウエハ取り出し方向とウエハ載置手
段とを長手方向に配置したことを特徴とするウエハ検査
装置。1. A wafer holder on which a plurality of wafers are placed and which has an opening for loading and unloading a wafer on one side, and a desired wafer is taken out from the wafer holder, and after completion of a desired inspection, the desired wafer in the wafer holder is obtained. A wafer transfer means for returning the wafer to the position, a wafer mounting means for mounting a wafer for macro inspection of the wafer taken out by the wafer transfer means, and a wafer upside-down means for macro inspection of the back surface of the wafer. A wafer inspection apparatus, comprising: a wafer holding direction of the wafer holder and a wafer placing means arranged in a longitudinal direction.
用の開口を一方に有するウエハ保持体と、 ウエハ保持体を載置する上下動可能な台と、 ウエハ保持体から所望のウエハを取り出し、所望の検査
終了後にウエハをウエハ保持体中の所望の位置に返却す
るウエハ搬送手段と、 ウエハ搬送手段により取り出されたウエハのマクロ検査
をするためにウエハを載置するウエハ載置手段と、 ウエハ載置手段上に載置したウエハのオリフラ（オリエ
ンテーションフラット）を検知するオリフラ検知器と、 ウエハの裏面をマクロ検査するためのウエハ裏返し手段
と、 ウエハをミクロ検査するための顕微鏡と、 顕微鏡にウエハ載置手段上のウエハを選択的に送り、所
望の検査終了後にウエハを顕微鏡からウエハ載置手段上
に戻すウエハ顕微鏡搬送手段とを備えており、 ウエハ保持体のウエハ取り出し方向とウエハ載置手段と
顕微鏡とを長手方向に配置したことを特徴とするウエハ
検査装置。2. A wafer holder on which a plurality of wafers are placed and which has an opening for loading and unloading wafers on one side, a vertically movable table on which the wafer holder is placed, and a desired wafer taken out from the wafer holder. A wafer transfer means for returning the wafer to a desired position in the wafer holder after the desired inspection is completed, and a wafer mounting means for mounting the wafer for macro inspection of the wafer taken out by the wafer transfer means, An orientation flat detector that detects the orientation flat of a wafer placed on the wafer placement means, a wafer inverting means for macroinspecting the backside of the wafer, a microscope for microinspecting the wafer, and a microscope. Wafer microscope conveying means for selectively sending the wafer on the wafer placing means and returning the wafer from the microscope to the wafer placing means after the desired inspection is completed It includes a wafer inspection apparatus characterized by a wafer of the wafer holder take-out direction and the wafer loading means and the microscope is arranged in the longitudinal direction.
し／返却をするための水平移動とウエハ載置手段上方で
の上下移動とを行うために、水平移動する駆動手段を備
えたことを特徴とする請求項１又は２に記載のウエハ搬
送装置。3. The wafer transfer means is provided with a drive means for moving horizontally in order to perform horizontal movement for taking out / returning the wafer and vertical movement above the wafer placing means. The wafer transfer device according to claim 1 or 2.
よりも大径なウエハ保持部と、 ウエハ保持部に設けたウエハの直径よりも小径なウエハ
接触部と、 ウエハを吸着させるためにウエハ接触部に設けたウエハ
吸着部とからなることを特徴とする請求項１又は２に記
載のウエハ検査装置。4. The wafer inverting means comprises a wafer holding part having a diameter larger than the diameter of the wafer, a wafer contact part provided in the wafer holding part and having a diameter smaller than the diameter of the wafer, and a wafer contact for adsorbing the wafer. 3. The wafer inspection apparatus according to claim 1, further comprising a wafer suction section provided in the section.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23720694A JP3791698B2 (en) | 1994-09-30 | 1994-09-30 | Wafer inspection equipment |
| KR1019950029865A KR0185783B1 (en) | 1994-09-30 | 1995-09-13 | Wafer inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23720694A JP3791698B2 (en) | 1994-09-30 | 1994-09-30 | Wafer inspection equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005301683A Division JP3923988B2 (en) | 2005-10-17 | 2005-10-17 | Wafer inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08102479A true JPH08102479A (en) | 1996-04-16 |
| JP3791698B2 JP3791698B2 (en) | 2006-06-28 |
Family
ID=17011959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23720694A Expired - Lifetime JP3791698B2 (en) | 1994-09-30 | 1994-09-30 | Wafer inspection equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3791698B2 (en) |
| KR (1) | KR0185783B1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000033056A1 (en) * | 1998-11-30 | 2000-06-08 | Olympus Optical Co., Ltd. | Method and apparatus for wafer inspection |
| US7968354B1 (en) | 2002-10-04 | 2011-06-28 | Kla-Tencor Technologies Corp. | Methods for correlating backside and frontside defects detected on a specimen and classification of backside defects |
| JP2014187301A (en) * | 2013-03-25 | 2014-10-02 | Olympus Corp | Substrate inspection device and substrate delivery method |
| JP2014197651A (en) * | 2013-03-29 | 2014-10-16 | オリンパス株式会社 | Substrate inspection apparatus and substrate delivery method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100445457B1 (en) * | 2002-02-25 | 2004-08-21 | 삼성전자주식회사 | Apparatus and method for inspecting wafer backside |
-
1994
- 1994-09-30 JP JP23720694A patent/JP3791698B2/en not_active Expired - Lifetime
-
1995
- 1995-09-13 KR KR1019950029865A patent/KR0185783B1/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000033056A1 (en) * | 1998-11-30 | 2000-06-08 | Olympus Optical Co., Ltd. | Method and apparatus for wafer inspection |
| US6241456B1 (en) | 1998-11-30 | 2001-06-05 | Olympus Optical Co., Ltd. | Wafer inspecting apparatus and method |
| US7968354B1 (en) | 2002-10-04 | 2011-06-28 | Kla-Tencor Technologies Corp. | Methods for correlating backside and frontside defects detected on a specimen and classification of backside defects |
| JP2014187301A (en) * | 2013-03-25 | 2014-10-02 | Olympus Corp | Substrate inspection device and substrate delivery method |
| JP2014197651A (en) * | 2013-03-29 | 2014-10-16 | オリンパス株式会社 | Substrate inspection apparatus and substrate delivery method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR0185783B1 (en) | 1999-04-15 |
| KR960012414A (en) | 1996-04-20 |
| JP3791698B2 (en) | 2006-06-28 |
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