JPH0810204Y2 - Semiconductor component mounting structure - Google Patents
Semiconductor component mounting structureInfo
- Publication number
- JPH0810204Y2 JPH0810204Y2 JP13816089U JP13816089U JPH0810204Y2 JP H0810204 Y2 JPH0810204 Y2 JP H0810204Y2 JP 13816089 U JP13816089 U JP 13816089U JP 13816089 U JP13816089 U JP 13816089U JP H0810204 Y2 JPH0810204 Y2 JP H0810204Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor component
- electrode
- radiator
- mounting plate
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 ［産業上の利用分野］ 本考案は半導体部品取付構造に関し、特に半導体部品
の側面にモールド部から面状に露出した電極を放熱体電
極に電気的に接続して放熱体に半導体部品を取付ける半
導体部品取付構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a semiconductor component mounting structure, and in particular, an electrode that is exposed on the side surface of the semiconductor component from a mold portion in a planar shape is electrically connected to a radiator electrode to radiate heat. The present invention relates to a semiconductor component mounting structure for mounting a semiconductor component on a body.
［従来の技術］ 一般にパッケージ封入形半導体部品は樹脂でモールド
されており、種類によっては半導体部品の側面にモール
ド部から面状に露出した電極を有している。このような
半導体部品は放熱板の電極に前記面状電極を接触させた
状態で放熱板に半導体部品を取付けることにより放熱板
を介して半導体部品の冷却と電気的接続を行うようにし
ている。この例を第７図に示す。同図において、１は放
熱板電極、２は半導体部品（内部構造を省略して図示し
ている）、３は半導体部品２の樹脂モールド部、４は半
導体部品２の側面に露出した面状電極、５は半導体部品
２の外部接続用端子、６はねじ、７はワッシャ、８は半
導体部品２の孔、９は放熱板電極１のねじ孔であり、放
熱板電極１に面状電極４を接触させた状態でねじ６によ
って半導体部品２を放熱板電極１に締結するものであ
る。この場合半導体部品２の面状電極４と樹脂モールド
部３とが面一に形成されているものはあまり問題を生じ
ないが半導体部品２の製造上のバラツキによって半導体
部品２の面状電極４が樹脂モールド部３より内方に凹状
に形成されているものにおいては半導体部品２と放熱板
電極１との間に導通不良を発生しやすい。[Prior Art] Generally, a packaged semiconductor component is molded with a resin, and depending on the type, it has an electrode exposed on the side surface of the semiconductor component in a planar manner from the molding portion. In such a semiconductor component, the semiconductor component is attached to the radiator plate in a state where the planar electrode is in contact with the electrode of the radiator plate, so that the semiconductor component is cooled and electrically connected through the radiator plate. An example of this is shown in FIG. In the figure, 1 is a heat sink electrode, 2 is a semiconductor component (internal structure is omitted in the drawing), 3 is a resin mold portion of the semiconductor component 2, and 4 is a planar electrode exposed on the side surface of the semiconductor component 2. Reference numeral 5 denotes an external connection terminal of the semiconductor component 2, 6 is a screw, 7 is a washer, 8 is a hole of the semiconductor component 2, 9 is a screw hole of the heat sink electrode 1, and the planar electrode 4 is attached to the heat sink electrode 1. The semiconductor component 2 is fastened to the heat sink plate electrode 1 by the screw 6 in the state of being in contact with the heat sink plate 1. In this case, if the planar electrode 4 of the semiconductor component 2 and the resin mold part 3 are formed flush with each other, there is not much problem, but the planar electrode 4 of the semiconductor component 2 may be changed due to the manufacturing variation of the semiconductor component 2. In the case where the resin mold portion 3 is formed in a concave shape inward of the resin mold portion 3, conduction failure is likely to occur between the semiconductor component 2 and the heat dissipation plate electrode 1.
［考案が解決しようとする課題］ 上記従来技術においては放熱板電極１と半導体部品２
の面状電極４とを直接的に接触させるようにしてねじ６
により半導体部品２を取付けていたため、半導体部品２
の製造上のバラツキによって面状電極４が樹脂モールド
部３より凹状に形成されている場合、第７図に示すよう
に放熱板電極１と面状電極４との間にクリアランスを生
じてしまい導通不良を発生するという問題を有してい
た。[Problems to be Solved by the Invention] In the above conventional technique, the heat dissipation plate electrode 1 and the semiconductor component 2 are provided.
Screw 6 so as to make direct contact with the planar electrode 4 of
Because the semiconductor component 2 was attached by
When the planar electrode 4 is formed in a concave shape from the resin mold portion 3 due to manufacturing variation, a clearance is generated between the radiator plate electrode 1 and the planar electrode 4 as shown in FIG. It had a problem of generating defects.
そこで本考案は半導体部品の面状電極と放熱体電極と
の電気的接続を確実に行うことのできる半導体部品取付
構造を提供することを目的とする。SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a semiconductor component mounting structure capable of surely making electrical connection between a planar electrode of a semiconductor component and a radiator electrode.
［課題を解決するための手段］ 本考案は半導体部品の側面にモールド部から面状に露
出した電極を放熱体電極に電気的に接続して放熱体に半
導体部品を取付ける半導体部品取付構造において、前記
半導体部品の面状電極と放熱体電極との間に導電材から
なる取付板を介装し、この取付板の少なくとも一部を前
記半導体部品の電極より小幅に形成してなるものであ
る。[Means for Solving the Problems] The present invention provides a semiconductor component mounting structure for mounting a semiconductor component on a heat radiator by electrically connecting a surface-exposed electrode from a mold portion on a side surface of the semiconductor component to a radiator electrode. A mounting plate made of a conductive material is interposed between the planar electrode of the semiconductor component and the radiator electrode, and at least a part of the mounting plate is formed with a width smaller than that of the electrode of the semiconductor component.
［作用］ 本考案は半導体部品の面状電極がモールド部より凹状
に形成されている場合においても、半導体部品の面状電
極と放熱体電極との間が導電性を有する取付板によって
電気的に接続され安定した導通状態が得られる。[Effect] Even when the planar electrode of the semiconductor component is formed in a concave shape from the mold portion, the present invention electrically connects the planar electrode of the semiconductor component and the radiator electrode with a conductive mounting plate. It is connected and stable conduction is obtained.
［実施例］ 以下、本考案の実施例を添付図面を参照して説明す
る。尚、第７図と同一部分に同一符号を付し同一箇所の
詳細な説明は省略する。Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The same parts as those in FIG. 7 are designated by the same reference numerals, and detailed description of the same parts will be omitted.
第１図および第２図は本考案の第１実施例を示し、同
図に示すように導電材からなり半導体部品２の面状電極
４より小さく形成された取付板10を面状電極４と放熱板
電極１との間に介装したものである。そして半導体部品
２の取付けにおいては、放熱板電極１に導電材からなる
取付板10を接触させ、この取付板10に半導体部品２の面
状電極４を接触させた状態でねじ６をワッシャ７を介し
て半導体部品２の孔８と取付板10の孔11に挿通しかつ放
熱板電極１のねじ孔９に螺着して三者を一体的に固定し
たものである。1 and 2 show a first embodiment of the present invention. As shown in FIG. 1, a mounting plate 10 made of a conductive material and formed smaller than the planar electrode 4 of the semiconductor component 2 is used as the planar electrode 4. It is interposed between the radiator plate electrode 1 and the radiator plate electrode 1. When mounting the semiconductor component 2, a mounting plate 10 made of a conductive material is brought into contact with the heat dissipation plate electrode 1, and the flat electrode 4 of the semiconductor component 2 is brought into contact with the mounting plate 10 and the screw 6 and the washer 7 are attached. The three parts are inserted through the hole 8 of the semiconductor component 2 and the hole 11 of the mounting plate 10 and screwed into the screw hole 9 of the heat dissipation plate electrode 1 to integrally fix the three members.
このように本実施例においては放熱板電極１と半導体
部品２の面状電極４との間に面状電極４より小さな導電
性の取付板10を介装しているため、製造上のバラツキに
よって面状電極４が樹脂モールド部３より凹状に形成さ
れていたとしても面状電極４と放熱板電極１とは取付板
10によって確実に導通し安定した導通状態を得ることが
できる。As described above, in this embodiment, since the conductive mounting plate 10 smaller than the planar electrode 4 is interposed between the heat sink plate electrode 1 and the planar electrode 4 of the semiconductor component 2, there are variations in manufacturing. Even if the planar electrode 4 is formed in a concave shape from the resin mold portion 3, the planar electrode 4 and the heat dissipation plate electrode 1 are attached to the mounting plate.
10 makes it possible to surely conduct electricity and obtain a stable conduction state.
第３図および第４図は本考案の第２実施例を示し、上
記実施例と同一部分に同一符号を付し同一箇所の説明を
省略して詳述すると、この例では１個の放熱板電極１に
対し複数の半導体部品２を並べて取付ける場合を示して
おり、放熱板電極１と各半導体部品２の面状電極４との
間にそれぞれ介装される複数の取付板10はその上部が導
電性の連設部10Aによって連設されている。そして、各
半導体部品２は第１実施例と同様にねじ６によって取付
板10を介して放熱板電極１に取付けられており、第１実
施例と同様に面状電極４が樹脂モールド部３より凹状に
形成されていたとしても各半導体部品２の面状電極４と
放熱板電極１とは取付板10によって確実に導通し、安定
した導通状態を図ることができる。FIG. 3 and FIG. 4 show a second embodiment of the present invention. The same parts as those of the above embodiment are designated by the same reference numerals and the description of the same parts will be omitted. The case where a plurality of semiconductor components 2 are mounted side by side with respect to the electrode 1 is shown, and the plurality of mounting plates 10 respectively interposed between the heat dissipation plate electrode 1 and the planar electrodes 4 of each semiconductor component 2 have their upper parts They are connected by a conductive connecting portion 10A. Each semiconductor component 2 is attached to the radiator plate electrode 1 via the attachment plate 10 by the screw 6 as in the first embodiment, and the planar electrode 4 is formed from the resin mold portion 3 as in the first embodiment. Even if it is formed in a concave shape, the planar electrode 4 of each semiconductor component 2 and the heat dissipation plate electrode 1 are surely electrically connected by the mounting plate 10, and a stable electrically conductive state can be achieved.
なお本考案は上記実施例に限定されるものではなく本
考案の要旨の範囲内において種々の変形実施が可能であ
る。例えば取付板の形状、寸法は本考案の要旨の範囲内
において適宜選定すればよい。また固定部材としてねじ
に代えて放熱板電極に突設したピンを用いこのピンを取
付板と半導体部品に挿通しこの挿通端を加締るようにし
てもよい。また、第２実施例では取付板10の一部が樹脂
モールド部３と重なり合うものを示しているが、第５
図，第６図に示すように取付板10が完全に樹脂モールド
部３を避けて取付けられるようにしてもよい。The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention. For example, the shape and size of the mounting plate may be appropriately selected within the scope of the present invention. Alternatively, a pin protruding from the heat dissipation plate electrode may be used as the fixing member instead of the screw, and the pin may be inserted into the mounting plate and the semiconductor component to crimp the insertion end. In addition, in the second embodiment, a part of the mounting plate 10 overlaps with the resin mold portion 3, but the fifth embodiment
As shown in FIGS. 6 and 6, the mounting plate 10 may be mounted so as to completely avoid the resin mold portion 3.
［考案の効果］ 本考案は半導体部品の側面にモールド部から面状に露
出した電極を放熱体電極に電気的に接続して放熱体に半
導体部品を取付ける半導体部品取付構造において、前記
半導体部品の面状電極と放熱体電極との間に導電材から
なる取付板を介装し、この取付板の少なくとも一部を前
記半導体部品の電極より小幅に形成してなり、半導体部
品の面状電極と放熱体電極との電気的接続を確実に行う
ことのできる半導体部品取付構造を提供できる。[Advantages of the Invention] The present invention relates to a semiconductor component mounting structure for electrically connecting a semiconductor component to a radiator by electrically connecting an electrode exposed on a side surface of the semiconductor component from a mold portion to a radiator electrode. A mounting plate made of a conductive material is interposed between the planar electrode and the radiator electrode, and at least a part of the mounting plate is formed to have a width smaller than that of the electrode of the semiconductor component. It is possible to provide a semiconductor component mounting structure capable of surely making an electrical connection with a radiator electrode.
第１図および第２図は本考案の第１実施例を示し、第１
図は断面図、第２図は分解斜視図、第３図および第４図
は本考案の第２実施例を示し、第３図は断面図、第４図
は分解斜視図、第５図および第６図は本考案の他の実施
例を示し、第５図は断面図、第６図は分解斜視図、第７
図は従来例を示す断面図である。 １……放熱板電極（放熱体電極） ２……半導体部品 ３……樹脂モールド部（モールド部） ４……面状電極 10……取付板1 and 2 show a first embodiment of the present invention.
FIG. 2 is a sectional view, FIG. 2 is an exploded perspective view, FIGS. 3 and 4 show a second embodiment of the present invention, FIG. 3 is a sectional view, FIG. 4 is an exploded perspective view, FIG. FIG. 6 shows another embodiment of the present invention, FIG. 5 is a sectional view, FIG. 6 is an exploded perspective view, and FIG.
The figure is a cross-sectional view showing a conventional example. 1 ... Heat sink electrode (heat sink electrode) 2 ... Semiconductor component 3 ... Resin mold part (mold part) 4 ... Sheet electrode 10 ... Mounting plate
Claims (1)
露出した電極を放熱体電極に電気的に接続して放熱体に
半導体部品を取付ける半導体部品取付構造において、前
記半導体部品の面状電極と放熱体電極との間に導電材か
らなる取付板を介装し、この取付板の少なくとも一部を
前記半導体部品の電極より小幅に形成してなることを特
徴とする半導体部品取付構造。1. In a semiconductor component mounting structure for mounting a semiconductor component on a radiator by electrically connecting an electrode exposed on the side surface of the semiconductor component from a mold portion to the radiator, the planar electrode of the semiconductor component. A mounting structure for a semiconductor component, wherein a mounting plate made of a conductive material is interposed between the heat dissipation electrode and the heat dissipating electrode, and at least a part of the mounting plate is formed with a width smaller than that of the electrode of the semiconductor component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13816089U JPH0810204Y2 (en) | 1989-11-29 | 1989-11-29 | Semiconductor component mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13816089U JPH0810204Y2 (en) | 1989-11-29 | 1989-11-29 | Semiconductor component mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377453U JPH0377453U (en) | 1991-08-05 |
| JPH0810204Y2 true JPH0810204Y2 (en) | 1996-03-27 |
Family
ID=31685281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13816089U Expired - Lifetime JPH0810204Y2 (en) | 1989-11-29 | 1989-11-29 | Semiconductor component mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810204Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4525273B2 (en) * | 2004-09-27 | 2010-08-18 | パナソニック電工株式会社 | Pressure wave generator |
| DE102009024814A1 (en) * | 2009-06-09 | 2010-12-16 | Leinemann Gmbh & Co. Kg | Flame arrester arrangement |
-
1989
- 1989-11-29 JP JP13816089U patent/JPH0810204Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0377453U (en) | 1991-08-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0713191Y2 (en) | connector | |
| JP3540471B2 (en) | Semiconductor module | |
| JPS6217837B2 (en) | ||
| JPH073674Y2 (en) | Electronic device | |
| JPH0810204Y2 (en) | Semiconductor component mounting structure | |
| JP4329961B2 (en) | Composite semiconductor device | |
| JP2023527027A (en) | electric inverter system | |
| JP2536470Y2 (en) | Printed board fixing structure | |
| JPS6228768Y2 (en) | ||
| JP2002344177A (en) | Electronic device | |
| JPH0622995Y2 (en) | Fixed structure of semiconductor element | |
| JP2517954Y2 (en) | Resin mold type semiconductor device | |
| JP2529174Y2 (en) | Noise filter | |
| JPH0729670Y2 (en) | Power supply | |
| JPH0628786Y2 (en) | Electronic parts | |
| JPH0747915Y2 (en) | Electronic component mounting structure | |
| JP3809051B2 (en) | Electronic component mounting structure | |
| JPH0617353Y2 (en) | Electronic device housing structure | |
| JPH0729873U (en) | Heat dissipation structure for electronic components | |
| JP4307104B2 (en) | Electrical unit | |
| JPH0810230Y2 (en) | Mounting structure for electrical parts and radiator | |
| JPH0451490Y2 (en) | ||
| JPH0351978Y2 (en) | ||
| JPH0222956Y2 (en) | ||
| JP2563680Y2 (en) | Power unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |