JPH0799400A - Board holding and fixing apparatus - Google Patents
Board holding and fixing apparatusInfo
- Publication number
- JPH0799400A JPH0799400A JP5242386A JP24238693A JPH0799400A JP H0799400 A JPH0799400 A JP H0799400A JP 5242386 A JP5242386 A JP 5242386A JP 24238693 A JP24238693 A JP 24238693A JP H0799400 A JPH0799400 A JP H0799400A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- backup
- electromagnet
- substrate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Automatic Assembly (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント基板の保持固定
に関し特に支持面に部品が搭載されているものに適用し
て有効な技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to holding and fixing of a printed circuit board, and more particularly to a technique effective when applied to a device having parts mounted on a supporting surface.
【０００２】[0002]
【従来の技術】従来の基板保持固定方法としては特開平
４−６４２９７号記載の様に基板にバックアップピンを
押し当てた後、基板又は部品に接触した位置に固定する
方法が良く知られる。2. Description of the Related Art As a conventional method for holding and fixing a substrate, there is well known a method in which a backup pin is pressed against a substrate and then fixed at a position in contact with a substrate or a component as described in JP-A-4-64297.
【０００３】[0003]
【発明が解決しようとする課題】従来の方法では基板に
バックアップピンを押し当てその位置で固定するため、
基板支持面に部品が搭載されている場合、部品上にバッ
クアップピンがあると部品搭載やはんだペースト印刷等
の作業において部品に応力が加わるため信頼性が低いと
いう問題があった。In the conventional method, the backup pin is pressed against the substrate and fixed at that position.
When a component is mounted on the board supporting surface, if there is a backup pin on the component, stress is applied to the component during work such as component mounting or solder paste printing, resulting in low reliability.
【０００４】本発明では一括動作による短時間動作を活
かしつつ上記問題を解決することを目的とする。It is an object of the present invention to solve the above problems while making the best use of a short-time operation by collective operation.
【０００５】[0005]
【課題を解決するための手段】上記問題を解決するため
に本発明では、支持面に部品の搭載された基板が搬送さ
れてくると電磁石によりバックアップピンを上端に仮固
定したバックアップ台を上昇させ、バックアップピン上
端を基板支持面に接触させる。In order to solve the above problems, according to the present invention, when a substrate on which a component is mounted is conveyed on a supporting surface, a backup base having backup pins temporarily fixed to the upper end is raised by an electromagnet. , The upper end of the backup pin is brought into contact with the substrate supporting surface.
【０００６】このとき搭載された部品によりバックアッ
プピンが押し下げられると、電磁石の電気回路が遮断さ
れるため、該位置のバックアップピンは落下する。At this time, when the backup pin is pushed down by the mounted component, the electric circuit of the electromagnet is cut off, and the backup pin at that position drops.
【０００７】その後電磁石に印加している電圧を上げる
ことにより本固定を行なう。Thereafter, the main fixing is performed by increasing the voltage applied to the electromagnet.
【０００８】[0008]
【作用】基板に直接バックアップピンを当て、不要バッ
クアップピンを排除することにより種類ごとのバックア
ップピンデータを用意する必要が無い。[Function] It is not necessary to prepare backup pin data for each type by directly applying the backup pin to the substrate and eliminating the unnecessary backup pin.
【０００９】また上記動作を一括で行うことにより短時
間でバックアップピンの配置が完了する。Further, by collectively performing the above operation, the arrangement of the backup pins is completed in a short time.
【００１０】[0010]
【実施例】以下本発明の実施例を図を用い説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１１】図１はバックアップ機構詳細図でありバッ
クアップピン２は非導電性のピンＡと導電性を有し、か
つ保持力の小さい磁性体であるストッパーＢで構成され
上下にスライドすることができる。FIG. 1 is a detailed view of the backup mechanism. The backup pin 2 is composed of a non-conductive pin A and a stopper B which is a conductive material and has a small holding force, and can be slid up and down. .
【００１２】またＢには電磁石９の電気回路となる電線
が配線されており電磁石９によりバックアップピン２が
吸着された状態でのみ回路が閉じる構造となっている。An electric wire serving as an electric circuit of the electromagnet 9 is wired in B, and the circuit is closed only when the backup pin 2 is attracted by the electromagnet 9.
【００１３】図２および図３はバックアップ機構全体図
を表し図２はバックアップピン２設定前の状態、図３は
設定時の状態を示す。2 and 3 show an overall view of the backup mechanism. FIG. 2 shows a state before setting the backup pin 2, and FIG. 3 shows a state at the time of setting.
【００１４】次に上記構成による本発明実施例の動作を
説明する。Next, the operation of the embodiment of the present invention having the above configuration will be described.
【００１５】まず最初の基板が搬送レール１により所定
位置に搬送されると図２に示すようにバックアップピン
押し上げプレート５がプレート駆動部６により上昇し、
バックアップピン２は上端に押し上げられる。First, when the first substrate is transferred to a predetermined position by the transfer rail 1, the backup pin push-up plate 5 is lifted by the plate drive unit 6 as shown in FIG.
The backup pin 2 is pushed up to the upper end.
【００１６】このときバックアップピン２は、電磁石制
御部７によりバックアップピン押し上げプレート５が除
去されても落ちない最低限の力で上端に保持される。At this time, the backup pin 2 is held at the upper end by the electromagnet control section 7 with a minimum force that does not drop even if the backup pin pushing plate 5 is removed.
【００１７】次にバックアップ台駆動部４によりバック
アップピン２上端が基板支持面と同一レベルとなるよう
バックアップ台３を上昇させる。Next, the backup table drive unit 4 raises the backup table 3 so that the upper ends of the backup pins 2 are at the same level as the substrate supporting surface.
【００１８】このとき図３に示すように基板支持面に搭
載部品が存在すると、上昇したバックアップピン２に部
品が当たりバックアップピン２は押し下げられる。At this time, if there is a mounted component on the substrate supporting surface as shown in FIG. 3, the component hits the raised backup pin 2 and the backup pin 2 is pushed down.
【００１９】これにより、そのピンを保持していた電磁
石の電気回路が開きバックアップピン２はバックアップ
ピン押し上げプレート５の位置まで下降する。As a result, the electric circuit of the electromagnet holding the pin is opened and the backup pin 2 is lowered to the position of the backup pin pushing plate 5.
【００２０】その後、電磁石制御部７により電磁石の保
持力を「強」としてバックアップピン２を本固定とす
る。After that, the holding force of the electromagnet is set to "strong" by the electromagnet control unit 7 and the backup pin 2 is permanently fixed.
【００２１】なお、継続して同一基板の作業を行なう場
合はバックアップ台駆動部４によりバックアップ台３の
みを上下させて作業を行ない基板の種類が変わる場合
は、バックアップ台３を下降させた後、バックアップピ
ン押し上げプレート５を再度上昇させて、図２の状態へ
戻し再度上記動作を行なう。When the same substrate is continuously worked, the backup table driving unit 4 moves only the backup table 3 up and down to change the type of the board. After the backup table 3 is lowered, The backup pin push-up plate 5 is raised again to return to the state of FIG. 2 and the above operation is performed again.
【００２２】[0022]
【図１】本発明の実施例による基板保持機構のバックア
ップ機構詳細図。FIG. 1 is a detailed view of a backup mechanism of a substrate holding mechanism according to an embodiment of the present invention.
【図２】本発明の実施例による基板保持機構の準備段階
を示す側面図。FIG. 2 is a side view showing a preparatory stage of the substrate holding mechanism according to the embodiment of the present invention.
【図３】本発明の実施例による基板保持機構の保持固定
状態を示す側面図。FIG. 3 is a side view showing a holding and fixing state of the substrate holding mechanism according to the embodiment of the present invention.
１…搬送レール、 ２…バックアップピン、 ３…バックアップ台、 ４…バックアップ台駆動部、 ５…バックアップピン押し上げプレート、 ６…プレート駆動部、 ７…電磁石制御部、 ８…スライドベアリング、 ９…電磁石。 DESCRIPTION OF SYMBOLS 1 ... Conveying rail, 2 ... Backup pin, 3 ... Backup stand, 4 ... Backup stand drive part, 5 ... Backup pin pushing plate, 6 ... Plate drive part, 7 ... Electromagnet control part, 8 ... Slide bearing, 9 ... Electromagnet.
Claims (3)
動案内されてくる基板を持ち上げ基板が上からの圧力に
たいしてソリを生じないようにするための基板保持固定
装置であって、一対の搬送レール下方位置に支持体を設
けこの支持体に上下方向に開口したシリンダー室を複数
形成しておき各シリンダー室内に非磁性体のバックアッ
プピンに導電性を有し、かつ残留磁気のない磁性体を組
み合わせた支持体を配置し、シリンダー室内上部に電磁
石を配置しこの中でバックアップピンは上下に移動でき
る構造としておく。電磁石における電気回路の一端は電
磁石の下方に設置され、該知の導電性支持体が電磁石と
接触している時のみ回路が閉じる構造としておく。上記
構造を特徴とする基板保持固定装置。1. A substrate holding and fixing device for lifting a substrate which is guided in a guide groove formed in a pair of transport rails and preventing the substrate from warping against pressure from above. A support is provided below the transport rail, and a plurality of cylinder chambers that open vertically are formed in this support. A magnetic pin having a non-magnetic backup pin having conductivity and no residual magnetism is formed in each cylinder chamber. A support body combining the above is arranged, and an electromagnet is arranged in the upper part of the cylinder chamber, in which the backup pin can be moved up and down. One end of the electric circuit in the electromagnet is installed below the electromagnet, and the circuit is closed only when the known conductive support is in contact with the electromagnet. A substrate holding and fixing device having the above structure.
共に保持機構全体を上下させ板厚の違う基板へ対応する
亊を特徴とする基板保持装置。2. A substrate holding device for holding a substrate by using the method according to claim 1, and raising and lowering the entire holding mechanism to accommodate substrates having different plate thicknesses.
性体を挾む事により基板の微妙な凹凸を吸収し不用にバ
ックアップピンが落下することを防止する機構を特徴と
する基板保持装置。3. A substrate holding device according to claim 1, further comprising a mechanism for absorbing a subtle unevenness of the substrate by sandwiching a conductive elastic body in the fixing portion to prevent the backup pin from dropping unnecessarily. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5242386A JPH0799400A (en) | 1993-09-29 | 1993-09-29 | Board holding and fixing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5242386A JPH0799400A (en) | 1993-09-29 | 1993-09-29 | Board holding and fixing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0799400A true JPH0799400A (en) | 1995-04-11 |
Family
ID=17088392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5242386A Pending JPH0799400A (en) | 1993-09-29 | 1993-09-29 | Board holding and fixing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0799400A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009016755A (en) * | 2007-07-09 | 2009-01-22 | Panasonic Corp | Member supporting method |
| JP2009064871A (en) * | 2007-09-05 | 2009-03-26 | Yamaha Motor Co Ltd | Surface mounting machine |
| JP2009088231A (en) * | 2007-09-28 | 2009-04-23 | Panasonic Corp | Member supporting method |
| JP2009147027A (en) * | 2007-12-12 | 2009-07-02 | Panasonic Corp | Method and device for supporting member |
| JP2011187997A (en) * | 2011-06-29 | 2011-09-22 | Panasonic Corp | Substrate supporting device, and component mounting machine |
| WO2017187513A1 (en) * | 2016-04-26 | 2017-11-02 | ヤマハ発動機株式会社 | Substrate support device, screen printing device, coating device, surface mounting machine, and backup pin arrangement method |
-
1993
- 1993-09-29 JP JP5242386A patent/JPH0799400A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009016755A (en) * | 2007-07-09 | 2009-01-22 | Panasonic Corp | Member supporting method |
| JP2009064871A (en) * | 2007-09-05 | 2009-03-26 | Yamaha Motor Co Ltd | Surface mounting machine |
| JP2009088231A (en) * | 2007-09-28 | 2009-04-23 | Panasonic Corp | Member supporting method |
| JP2009147027A (en) * | 2007-12-12 | 2009-07-02 | Panasonic Corp | Method and device for supporting member |
| JP2011187997A (en) * | 2011-06-29 | 2011-09-22 | Panasonic Corp | Substrate supporting device, and component mounting machine |
| WO2017187513A1 (en) * | 2016-04-26 | 2017-11-02 | ヤマハ発動機株式会社 | Substrate support device, screen printing device, coating device, surface mounting machine, and backup pin arrangement method |
| JPWO2017187513A1 (en) * | 2016-04-26 | 2019-03-07 | ヤマハ発動機株式会社 | Substrate support device, screen printing device, coating device, surface mounter, and backup pin setup method |
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