JP2808840B2 - Substrate positioning device - Google Patents
Substrate positioning deviceInfo
- Publication number
- JP2808840B2 JP2808840B2 JP2180036A JP18003690A JP2808840B2 JP 2808840 B2 JP2808840 B2 JP 2808840B2 JP 2180036 A JP2180036 A JP 2180036A JP 18003690 A JP18003690 A JP 18003690A JP 2808840 B2 JP2808840 B2 JP 2808840B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- push
- clamper
- positioning device
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は基板の位置決め装置に関し、詳しくは、基板
の撓みを矯正して、基板を位置決めするための装置に関
する。Description: TECHNICAL FIELD The present invention relates to an apparatus for positioning a substrate, and more particularly, to an apparatus for correcting the deflection of a substrate and positioning the substrate.
(従来の技術) 基板に電子部品を実装する場合や、回路パターンなど
を印刷する場合、基板は位置決めや装置に位置決めされ
る。(Prior Art) When electronic components are mounted on a substrate, or when a circuit pattern or the like is printed, the substrate is positioned or positioned by an apparatus.
第5図は従来の位置決め装置を示すものであって、10
1は基板であり、若干の撓みを有している。102は固体ク
ランパー、103は可動クランパー、104はシリンダ、105
は多数本のピン106が立設されたプレート、107は基板10
1の搬送用ベルトコンベヤである。次にその動作を説明
する。FIG. 5 shows a conventional positioning device.
Reference numeral 1 denotes a substrate, which has a slight bending. 102 is a solid clamper, 103 is a movable clamper, 104 is a cylinder, 105
Is a plate on which a number of pins 106 are erected, and 107 is a substrate 10
This is the conveyor belt conveyor No. 1. Next, the operation will be described.
コンベヤ107により、基板101がプレート105上へ搬送
されてくると、シリンダ(図外)に駆動されてプレート
105は上昇し、ピン106により基板101を持ち上げる。次
いでシリンダ104が作動して、可動クランパー103は右方
へ移動し、基板101は両クランパー102,103により挟み付
けられて位置決めされる。次いでこの基板101上に、移
載ヘッド108により電子部品109が実装される。When the substrate 101 is conveyed onto the plate 105 by the conveyor 107, it is driven by a cylinder (not shown) to
105 rises and lifts substrate 101 by pins 106. Next, the cylinder 104 operates, the movable clamper 103 moves to the right, and the substrate 101 is sandwiched and positioned by the two clampers 102, 103. Next, the electronic component 109 is mounted on the substrate 101 by the transfer head.
(発明が解決しようとする課題) ところが上記従来手段は、ピン106は基板101を持ち上
げるだけで、基板101の撓みは矯正されず、基板101の両
側部はピン106の上端部から小間隔t浮き上っているこ
とから、この両側部に電子部品109を着地させて実装す
る場合、着地時の荷重により基板101ががたつきやすい
問題があった。(Problems to be Solved by the Invention) However, in the above-described conventional means, the pins 106 only lift the substrate 101, the bending of the substrate 101 is not corrected, and the both sides of the substrate 101 float at a small interval t from the upper end of the pins 106. When the electronic component 109 is landed and mounted on both sides, the substrate 101 is liable to rattle due to the load at the time of landing.
また基板101の品種が変更される場合には、新たな基
板に適合するプレート105やピン106と交換せねばなら
ず、殊に基板101の上下両面に電子部品109を実装する両
面実装の場合には、ピン106が基板下面に実装された電
子部品109に当たらないように、ピン106の配設位置を変
更しなければならず、更には基板の厚さが変る場合に
は、プレート105の高さ調整やピン106の長さ調整をしな
ければならないなど、基板の品種変更にともなう段取替
に多大な手間と時間を要する問題があった。Also, when the type of the board 101 is changed, it is necessary to replace the plate 105 or the pin 106 with the new board, especially in the case of a double-sided mounting in which the electronic components 109 are mounted on the upper and lower surfaces of the substrate 101. In order to prevent the pins 106 from hitting the electronic components 109 mounted on the lower surface of the substrate, the positions of the pins 106 must be changed. Further, when the thickness of the substrate changes, the height of the plate 105 must be changed. There is a problem that a great deal of labor and time is required for the setup change accompanying the change of the board type, such as the need to adjust the length and the length of the pins 106.
そこで本発明は、上記従来手段の問題点を解消できる
基板の位置決め装置を提供することを目的とする。Therefore, an object of the present invention is to provide a substrate positioning device which can solve the problems of the conventional means.
(課題を解決するための手段) 本発明は、基板の両側端部に当接するクランパーと、
基板の両側部の下方に設けられた押上体と、基板をこの
押上体に対して相対的に昇降させる昇降手段とを備え、
上記クランパーの内側面を上り勾配の傾斜面とし、基板
の両側端部の上縁部をこの傾斜面に下方から当接させ、
この当接部の内方に上記押上体の上端部を押し付けて、
基板の撓みを矯正するようにしている。(Means for Solving the Problems) The present invention provides a clamper which abuts both side edges of a substrate,
A push-up body provided below both sides of the substrate, and an elevating means for raising and lowering the substrate relative to the push-up body,
The inner surface of the clamper is an uphill slope, and the upper edges of both side edges of the substrate are brought into contact with the slope from below,
Press the upper end of the push-up body inside this abutment,
The deflection of the substrate is corrected.
また本発明は、基板の両側端部の上面に当接するクラ
ンパーと、基板の両側部の下方に設けられた押上体と、
基板をこの押上体に対して相対的に昇降させる昇降手段
と、クランパーおよび押上体を横方向へ移動させる移動
手段とを備え、クランパーと押上体で基板の両側端部を
上下から挟持した状態で、移動手段によりクランパーと
押上体を側方へ移動させて基板を側方へ引っ張ることに
より、基板の撓みを矯正するようにしている。Further, the present invention, a clamper abutting on the upper surface of both ends of the substrate, a lifting body provided below the both sides of the substrate,
Elevating means for moving the substrate up and down relative to the push-up body, and moving means for moving the clamper and the push-up body in the horizontal direction, with both ends of the substrate held between the clamper and the push-up body from above and below. The deflection of the substrate is corrected by moving the clamper and the push-up body to the side by the moving means and pulling the substrate to the side.
(作用) 上記構成において、クランパーの傾斜面に基板の両側
端部の上縁部が当接している状態で、押上体が基板の両
側部を下方から押し上げることにより、基板の撓みを矯
正し、基板を位置決めする。(Operation) In the above configuration, in a state where the upper edges of both side ends of the substrate are in contact with the inclined surface of the clamper, the lifting body pushes up both sides of the substrate from below, thereby correcting the deflection of the substrate, Position the substrate.
また基板の両側端部をクランパーと押上体で上下から
挟持した状態で、クランパーと押上体を側方へ移動させ
て基板を側方へ引っ張ることにより、基板の撓みを矯正
する。In addition, while the both ends of the substrate are sandwiched between the clamper and the push-up body from above and below, the clamper and the push-up body are moved to the side and the substrate is pulled to the side, thereby correcting the deflection of the board.
(実施例1) 次に、図面を参照しながら本発明の実施例の説明を行
う。Embodiment 1 Next, an embodiment of the present invention will be described with reference to the drawings.
第1図は基板の位置決め装置の正面図である。1は基
板であり、下凸状に若干の撓みを有している。2,3は、
基板1の両側部に設けられた固定クランパーと可動クラ
ンパーである。クランパー2,3の内側面は、上り勾配の
傾斜面4,5となっており、基板1の両側端部の上縁部に
上方から押当する(第2図も参照)。6はシリンダであ
り、そのロッド7はクランパー3に結合されている。こ
のシリンダ6が作動すると、クランパー3は横方向に移
動し、基板1をクランプする。なお固定クランパー2
も、可動クランパーにしてもよい。FIG. 1 is a front view of a substrate positioning device. Reference numeral 1 denotes a substrate, which has a slight downward bending. 2,3 is
A fixed clamper and a movable clamper provided on both sides of the substrate 1. The inner surfaces of the clampers 2 and 3 are slopes 4 and 5 having upward slopes, and press the upper edges of both side edges of the substrate 1 from above (see also FIG. 2). Reference numeral 6 denotes a cylinder whose rod 7 is connected to the clamper 3. When the cylinder 6 operates, the clamper 3 moves in the lateral direction and clamps the substrate 1. Fixed clamper 2
Alternatively, a movable clamper may be used.
8,9はクランパー2,3の下部に設けられた本体ブロック
であり、基板1を搬送するコンベヤベルト10,11が設け
られている。本体ブロック8,9は、支持ブロック12,13に
支持されている。基板1の上下にはガイドレール15が配
設されており、支持ブロック12,13は、スライダ16,17を
介してこのガイドレール15に載置されている。Reference numerals 8 and 9 denote main body blocks provided below the clampers 2 and 3, on which conveyor belts 10 and 11 for transporting the substrate 1 are provided. The main body blocks 8, 9 are supported by support blocks 12, 13. Guide rails 15 are disposed above and below the substrate 1, and the support blocks 12 and 13 are mounted on the guide rails 15 via sliders 16 and 17.
一方の支持ブロック12は、ビス18によりガイドレール
15に固定されている。他方のスライダ17は、シリンダ19
のロッド20に結合されている。このロッド20が突没する
と、スライダ17は横方向に摺動し、基板1の横巾に対応
して、クランパー2とクランパー3の間隔を巾調整す
る。One support block 12 is guided by screws 18
Fixed to 15. The other slider 17 has a cylinder 19
The rod 20 is connected to the When the rod 20 protrudes and retracts, the slider 17 slides laterally, and adjusts the width of the gap between the clamper 2 and the clamper 3 according to the width of the substrate 1.
支持ブロック12,13上には、押上体22,23が設けられて
いる。この押上体22,23は基板1の両側部の下方にあっ
て、その上端部は基板1とクランパー2,3の当接部eよ
りも小距離l内方に位置している。また支持ブロック1
2,13には、接地棒24,25が挿着されている。24a,25aはそ
の下端の接地部、27はベアリング部、28は弾接用コイル
ばねである。また接地部24a,25aの下方には、接地板26
が設けられている。上記押上体22,23は、この接地棒24,
25の上端部に取り付けられている。On the support blocks 12, 13, push-up bodies 22, 23 are provided. The push-up bodies 22 and 23 are located below both sides of the substrate 1, and the upper ends thereof are located within a small distance 1 from the contact portions e between the substrate 1 and the clampers 2 and 3. Also support block 1
Ground rods 24, 25 are inserted into 2, 13, respectively. Reference numerals 24a and 25a denote grounding portions at the lower ends, 27 denotes a bearing portion, and 28 denotes a coil spring for elastic contact. In addition, below the grounding portions 24a and 25a, a grounding plate 26 is provided.
Is provided. The push-up bodies 22, 23 are connected to the ground rods 24,
It is attached to the upper end of 25.
接地板26の下方には、昇降手段としてのシリンダ30,3
2が配設されている。シリンダ30,32のロッド31,33は、
上記ガイドレール15に垂設されたロッド34,35に結合さ
れている。このロッド34,35は、接地板26を貫通するガ
イド管36,37に昇降自在に挿入されている。シリンダ30,
32のロッド31,33が下降すると、接地部24a,25aは接地板
26に着地し、ばね28を圧縮しながら下降する。これとと
もに基板1も下降し、基板1の両側部には押当体22,23
の上端部が押し付けられるが、このとき、基板1の両側
端部の上縁部はクランパー2,3の傾斜面4,5に下方から当
接しているので、基板1の両側部が押当体22,23で下方
から押し上げられることにより、基板1の撓みは矯正さ
れる(第2図鎖線参照)。Below the ground plate 26, cylinders 30, 3 as elevating means are provided.
Two are arranged. The rods 31, 33 of the cylinders 30, 32 are
It is connected to rods 34 and 35 suspended from the guide rail 15. The rods 34 and 35 are inserted into guide tubes 36 and 37 penetrating the ground plate 26 so as to be able to move up and down. Cylinder 30,
When the rods 31 and 33 of 32 are lowered, the grounding portions 24a and 25a
It lands on 26 and descends while compressing the spring 28. At the same time, the substrate 1 also descends, and the pressing members 22 and 23
At this time, the upper edges of both side edges of the substrate 1 are in contact with the inclined surfaces 4, 5 of the clampers 2, 3 from below. By being pushed up from below at 22, 23, the deflection of the substrate 1 is corrected (see the chain line in FIG. 2).
この状態で、基板1はクランパー2,3と押上体22,23に
よりしっかりと固定されており、しかも撓みは矯正され
て良好な平面性を有するので、移載ヘッド40を昇降させ
て、そのノズル41に吸着された電子部品42を基板1に着
地させても、着地時の荷重により基板1ががたつくこと
はない。またスクリーン印刷機により基板1の上面にク
リーム半田や回路パターンを印刷する場合も、基板1の
平面性は確保されていることから、良好に印刷できる。In this state, the substrate 1 is firmly fixed by the clampers 2 and 3 and the push-up bodies 22 and 23, and the deflection is corrected, and the substrate 1 has good flatness. Even if the electronic component 42 adsorbed by the 41 lands on the substrate 1, the substrate 1 does not rattle due to the load at the time of landing. Also, when a cream solder or a circuit pattern is printed on the upper surface of the substrate 1 by a screen printer, good printing can be performed because the flatness of the substrate 1 is ensured.
(実施例2) 第3図及び第4図において、クランパー51,52は基板
1の上方へ延出する延出部51a,52aを有しており、この
延出部51a,52aは基板1の両側端部の上面に当接する。
またこのものも、押当体22,23は、基板1の両側部の下
方にあって、当接部eよりも小距離l内方に当接する。(Embodiment 2) In FIGS. 3 and 4, the clampers 51, 52 have extending portions 51a, 52a extending above the substrate 1, and the extending portions 51a, 52a It contacts the upper surface of both ends.
Also in this case, the pressing bodies 22 and 23 are located below the both side portions of the substrate 1 and are in contact with the inside of the contact portion e by a small distance l.
上記シリンダ30,32のロッド31,33が下降して、基板1
が下降すると、基板1の両側端部は延出部51a,52aと押
上体22,23により上下から挟持される。53は挟持用パッ
ドである。その状態で上記シリンダ19のロッド20を退去
させて、スライダ13を左方へ移動させると、基板1は両
側方へ引っ張られ、基板1の撓みは矯正される(第4図
鎖線参照)。すなわち、シリンダ19はクランパー52と押
上体23を横方向へ移動させる移動手段となっている。本
手段によれば、基板1が上凸状あるいは下凸状の何れの
方向に撓んでいても、その撓みを矯正できる利点があ
る。The rods 31 and 33 of the cylinders 30 and 32 are lowered and the substrate 1
Is lowered, both end portions of the substrate 1 are sandwiched from above and below by the extension portions 51a, 52a and the push-up bodies 22, 23. 53 is a pad for holding. In this state, when the rod 20 of the cylinder 19 is retracted and the slider 13 is moved to the left, the substrate 1 is pulled to both sides, and the deflection of the substrate 1 is corrected (see a chain line in FIG. 4). That is, the cylinder 19 serves as moving means for moving the clamper 52 and the push-up body 23 in the lateral direction. According to this means, even if the substrate 1 is bent in any of the upwardly convex and downwardly convex directions, there is an advantage that the bending can be corrected.
(発明の効果) 以上説明したように本発明によれば、基板の撓みを矯
正し、基板をしっかり位置決めできる。殊にこのもの
は、押上体は基板の両側部に押当するので、基板の上下
両面に電子部品が両面実装される場合も、基板の下面に
実装された電子部品に当らないので、押上体の配置調整
を行う必要がなく、またこの押上体は基板の品種変更に
応じて交換する必要がないなど、基板の品種変更にとも
なう段取替に有利に対応できる。また基板の両側端部を
クランパーと押上体で上下から挟持して基板を側方へ引
っ張ることにより、基板が上凸状あるいは下凸状のいず
れの方向に撓んでいても、基板の撓みを矯正することが
できる。(Effects of the Invention) As described above, according to the present invention, the deflection of the substrate can be corrected, and the substrate can be firmly positioned. In particular, in this case, since the push-up body presses against both side portions of the board, even when electronic components are mounted on both upper and lower surfaces of the board, the push-up body does not hit the electronic components mounted on the lower surface of the board. It is not necessary to adjust the arrangement of the substrates, and it is not necessary to replace the lifting body according to the change in the type of the board. In addition, by clamping both sides of the substrate from above and below with a clamper and a push-up body, and pulling the substrate to the side, even if the substrate is bent in either the upwardly convex or downwardly convex direction, the deflection of the substrate is corrected. can do.
図は本発明の実施例を示すものであって、第1図は基板
の位置決め装置の正面図、第2図は部分正面図、第3図
は他の実施例の正面図、第4図は部分正面図、第5図は
従来手段の正面図である。 1……基板 2,3,51,52……クランパー 22,23……押上体 30,32……昇降手段1 shows an embodiment of the present invention. FIG. 1 is a front view of a substrate positioning apparatus, FIG. 2 is a partial front view, FIG. 3 is a front view of another embodiment, and FIG. FIG. 5 is a partial front view of the conventional means. 1 ... board 2,3,51,52 ... clamper 22,23 ... push-up body 30,32 ... lifting means
Claims (2)
基板の両側部の下方に設けられた押上体と、基板をこの
押上体に対して相対的に昇降させる昇降手段とを備え、
上記クランパーの内側面を上り勾配の傾斜面とし、基板
の両側端部の上縁部をこの傾斜面に下方から当接させ、
この当接部の内方に上記押上体の上端部を押し付けて、
基板の撓みを矯正することを特徴とする基板の位置決め
装置。1. A clamper contacting both side edges of a substrate;
A push-up body provided below both sides of the substrate, and an elevating means for raising and lowering the substrate relative to the push-up body,
The inner surface of the clamper is an uphill slope, and the upper edges of both side edges of the substrate are brought into contact with the slope from below,
Press the upper end of the push-up body inside this abutment,
A substrate positioning device for correcting deflection of a substrate.
ーと、基板の両側部の下方に設けられた押上体と、基板
をこの押上体に対して相対的に昇降させる昇降手段と、
クランパーおよび押上体を横方向へ移動させる移動手段
とを備え、クランパーと押上体で基板の両側端部を上下
から挟持した状態で、移動手段によりクランパーと押上
体を側方へ移動させて基板を側方へ引っ張ることによ
り、基板の撓みを矯正することを特徴とする基板の位置
決め装置。2. A clamper in contact with the upper surfaces of both side edges of the substrate, a push-up body provided below both sides of the substrate, and lifting means for lifting and lowering the substrate relative to the push-up body.
Moving means for moving the clamper and the push-up body in the lateral direction, and in a state in which both ends of the substrate are sandwiched by the clamper and the push-up body from above and below, the moving means moves the clamper and the push-up body to the side to move the substrate. A substrate positioning device for correcting deflection of a substrate by pulling the substrate laterally.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2180036A JP2808840B2 (en) | 1990-07-06 | 1990-07-06 | Substrate positioning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2180036A JP2808840B2 (en) | 1990-07-06 | 1990-07-06 | Substrate positioning device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0465900A JPH0465900A (en) | 1992-03-02 |
JP2808840B2 true JP2808840B2 (en) | 1998-10-08 |
Family
ID=16076359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2180036A Expired - Fee Related JP2808840B2 (en) | 1990-07-06 | 1990-07-06 | Substrate positioning device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2808840B2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05276326A (en) * | 1992-03-25 | 1993-10-22 | Canon Inc | Photographing device |
JP3483063B2 (en) * | 1995-03-20 | 2004-01-06 | ソニー株式会社 | Net-shaped object holding device |
KR20000001325A (en) * | 1998-06-10 | 2000-01-15 | 유무성 | Device for fixing printed circuit board of chip mounter |
GB9813393D0 (en) * | 1998-06-23 | 1998-08-19 | Starturn Ltd | Fireworks |
CN101850650A (en) * | 2009-03-31 | 2010-10-06 | 松下电器产业株式会社 | Substrate fixing device and substrate fixing method |
JP5635466B2 (en) * | 2011-08-31 | 2014-12-03 | 日本特殊陶業株式会社 | Wiring board manufacturing method |
JP6796878B2 (en) * | 2016-09-16 | 2020-12-09 | 株式会社Fuji | Board straightening method, board straightening system |
JP6990990B2 (en) * | 2017-05-17 | 2022-01-12 | 株式会社Fuji | Board transfer holding device and board transfer holding method |
-
1990
- 1990-07-06 JP JP2180036A patent/JP2808840B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0465900A (en) | 1992-03-02 |
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