JPH075485A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JPH075485A JPH075485A JP5146293A JP14629393A JPH075485A JP H075485 A JPH075485 A JP H075485A JP 5146293 A JP5146293 A JP 5146293A JP 14629393 A JP14629393 A JP 14629393A JP H075485 A JPH075485 A JP H075485A
- Authority
- JP
- Japan
- Prior art keywords
- metal wiring
- liquid crystal
- wire
- crystal display
- metallic wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は液晶表示装置に関し、更
に詳しく言えば、駆動用ＩＣを搭載した基板が一体化さ
れたＬＣＤモジュールの改善に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to improvement of an LCD module in which a substrate on which a driving IC is mounted is integrated.
【０００２】[0002]
【従来の技術】最初に一般的なＣＯＧ（Chip on Glass
）構造を有する液晶表示装置について説明する。一般
的なＣＯＧ構造の液晶表示装置は図３に示すように、背
面に第２の偏光板（１０）が形成され、その上面にＩＴ
Ｏ膜からなる第２の透明電極（８），第２の配向膜
（７）が順次形成されてなる第２の透明基板（９）と、
背面に第１の偏光板（１）が形成され、その上面にＩＴ
Ｏ膜からなる第１の透明電極（３），第１の配向膜
（４）が順次形成されてなる第１の透明基板（２）とが
対向され、その間に液晶（５）がメインシール（６）に
よって封入されており、第２の透明基板（９）の一端に
は、駆動用ＬＳＩ（１２）が載置され、第２の透明電極
（８）の上に金属配線（１１）が形成され、駆動用ＬＳ
Ｉ（１２）と金属配線（１１）とがワイヤ（１３）を介
して接続されている。2. Description of the Related Art First, a general COG (Chip on Glass)
) A liquid crystal display device having a structure will be described. As shown in FIG. 3, a liquid crystal display device having a general COG structure has a second polarizing plate (10) formed on the back surface thereof and an IT on the upper surface thereof.
A second transparent substrate (9) in which a second transparent electrode (8) made of an O film and a second alignment film (7) are sequentially formed;
The first polarizing plate (1) is formed on the back surface, and the IT is formed on the upper surface.
A first transparent electrode (3) made of an O film and a first transparent substrate (2) formed by sequentially forming a first alignment film (4) are opposed to each other, and a liquid crystal (5) is interposed between the liquid crystal (5) and a main seal ( 6), the driving LSI (12) is mounted on one end of the second transparent substrate (9), and the metal wiring (11) is formed on the second transparent electrode (8). And drive LS
I (12) and the metal wiring (11) are connected via a wire (13).
【０００３】上記液晶表示装置の駆動用ＬＳＩ（１２）
と金属配線（１１）との接続関係について図４，図５を
参照しながら説明する。なお図４は、図５のＢ−Ｂ線断
面図である。従来例に係る液晶表示装置は、図５に示す
ように、駆動用ＬＳＩ（１２）のパッド（１２Ａ）と金
属配線（１１）とがワイヤ（１３）で接続されている。A driving LSI (12) for the above liquid crystal display device
The connection relationship between the metal wiring (11) and the metal wiring (11) will be described with reference to FIGS. Note that FIG. 4 is a cross-sectional view taken along the line BB of FIG. In the liquid crystal display device according to the conventional example, as shown in FIG. 5, a pad (12A) of a driving LSI (12) and a metal wiring (11) are connected by a wire (13).
【０００４】この金属配線（１１）とワイヤ（１３）と
を接続するには、まずAuなどからなり、パッド（１２
Ａ）に接続されたワイヤ（１３）の一端を、その表面が
鏡面状になっている金属配線（１１）上に超音波をかけ
ながら擦り付け、金属配線（１１）とワイヤ（１３）と
の摩擦熱によってワイヤを溶着させることにより接続す
る。In order to connect the metal wiring (11) and the wire (13), first, Au or the like is used, and the pad (12) is used.
The one end of the wire (13) connected to (A) is rubbed on the metal wiring (11) whose surface is a mirror surface while applying ultrasonic waves, so that the metal wiring (11) and the wire (13) are rubbed. Connection is made by welding wires by heat.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来例
に係る液晶表示装置によると、金属配線（１１）の表面
が鏡面状で滑りやすくなっているので、ワイヤ（１３）
と金属配線（１１）とを擦り付ける際にワイヤ（１３）
と金属配線（１１）との間に発生する摩擦熱が少なく、
接続に要する溶着エネルギーが十分でないので、接合し
にくいという問題が生じていた。However, according to the liquid crystal display device according to the conventional example, since the surface of the metal wiring (11) is mirror-like and slippery, the wire (13) is
When rubbing the metal wiring (11) with the wire (13)
The frictional heat generated between the metal wiring (11) and
Since the welding energy required for connection is not sufficient, there has been a problem that it is difficult to join.
【０００６】[0006]
【課題を解決するための手段】本発明は上記従来の欠点
に鑑み成されたもので、図１に示すように、微細な凹凸
が表面に形成された金属配線（２１）を具備することに
より、ワイヤ（１３）と金属配線（１１）とを接合する
際に、その接合強度が従来に比して強くなる液晶表示装
置の提供を目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional drawbacks, and as shown in FIG. 1, it is provided with a metal wiring (21) having fine irregularities formed on the surface thereof. An object of the present invention is to provide a liquid crystal display device in which the bonding strength between the wire (13) and the metal wiring (11) is stronger than in the conventional case.
【０００７】[0007]
【作 用】本発明に係る液晶表示装置によれば、図１に
示すように、微細な凹凸が表面に形成された金属配線
（２１）を有するので、ワイヤ（１３）と金属配線（１
１）とを擦り付ける際に、ワイヤ（１３）と金属配線
（１１）との摩擦が従来に比して増大し、その摩擦熱が
増大するので、より多くの溶着エネルギーが得られ、ワ
イヤ（１３）と金属配線（１１）との接合強度を増大ま
たは接合時間を短くすることが可能になる。[Operation] According to the liquid crystal display device of the present invention, as shown in FIG. 1, since it has a metal wiring (21) having fine irregularities formed on its surface, the wire (13) and the metal wiring (1) are
When rubbing with (1), the friction between the wire (13) and the metal wiring (11) is increased as compared with the conventional case, and the friction heat is increased, so that more welding energy is obtained and the wire (13 ) And the metal wiring (11), it is possible to increase the bonding strength or shorten the bonding time.
【０００８】[0008]
【実施例】以下に本発明の実施例に係る液晶表示装置に
ついて図面を参照しながら説明する。本発明の実施例に
係る液晶表示装置は、図３に示すようなＣＯＧ構造の液
晶表示装置である。なお、図１は図２のＡ−Ａ線断面図
であって、本実施例に係る液晶表示装置の要部を説明す
る図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Liquid crystal display devices according to embodiments of the present invention will be described below with reference to the drawings. The liquid crystal display device according to the embodiment of the present invention is a liquid crystal display device having a COG structure as shown in FIG. Note that FIG. 1 is a cross-sectional view taken along the line AA of FIG. 2 and is a diagram illustrating a main part of the liquid crystal display device according to the present embodiment.
【０００９】本発明の実施例に係る液晶表示装置は、図
１に示すように、透明基板（１９）の上に駆動用ＬＳＩ
（２２），ＩＴＯ膜からなる透明電極（１８）が形成さ
れ、透明電極（１８）の上に金メッキされたニッケルか
らなる金属配線（２１）が形成されており、駆動用ＬＳ
Ｉ（２２）の電極であるパッド（２２Ａ）と金属配線
（２１）とが、ワイヤ（２３）によって接続されてな
る。The liquid crystal display device according to the embodiment of the present invention is, as shown in FIG. 1, a driving LSI on a transparent substrate (19).
(22), a transparent electrode (18) made of an ITO film is formed, and a metal wiring (21) made of nickel plated with gold is formed on the transparent electrode (18).
A pad (22A) which is an electrode of I (22) and a metal wiring (21) are connected by a wire (23).
【００１０】なお、当該装置において、金属配線（２
１）は、ニッケルからなり、その表面が金メッキされて
いるが、そのニッケルを、酸性フッ化アンモンなどの液
に金属配線（２１）を浸して表面を荒らし、微細な凹凸
を形成したのちに表面を金メッキして、金属配線（２
１）表面に図１に示すような微細な凹凸を形成してい
る。上記装置において金属配線（２１）とワイヤ（２
３）とを接続するには、まずパッド（２２Ａ）に接続さ
れたワイヤ（２３）の一端を、微細な凹凸が形成された
金属配線（２１）上に超音波をかけながら擦り付け、金
属配線（２１）とワイヤ（２３）との摩擦熱によってワ
イヤ（２３）を溶着させることにより接続する。In the device, metal wiring (2
1) is made of nickel and its surface is gold-plated. The nickel is dipped in a liquid such as ammonium acid fluoride to soak the metal wiring (21) to roughen the surface and form fine irregularities on the surface. Gold plating the metal wiring (2
1) Fine irregularities as shown in FIG. 1 are formed on the surface. In the above device, the metal wiring (21) and the wire (2)
3), the wire (23) connected to the pad (22A) is first rubbed on the metal wiring (21) having fine irregularities while applying ultrasonic waves to the metal wiring (23). The wire (23) is connected by welding by frictional heat between the wire (23) and the wire (23).
【００１１】このとき、本実施例の液晶表示装置によれ
ば、金属配線（１１）の表面が鏡面状で滑りやすかった
従来と異なり、金属配線（２１）の表面に微細な凹凸が
形成されているので、ワイヤ（２３）と金属配線（２
１）とを擦り付ける際に、ワイヤ（２３）と金属配線
（２１）との摩擦が従来に比して増大し、その摩擦熱が
増大する。At this time, according to the liquid crystal display device of this embodiment, fine irregularities are formed on the surface of the metal wiring (21), unlike the conventional case where the surface of the metal wiring (11) is mirror-like and slippery. Wire (23) and metal wiring (2
When rubbing with 1), the friction between the wire (23) and the metal wiring (21) is increased as compared with the conventional case, and the frictional heat is increased.
【００１２】このため、ワイヤ（２３）と金属配線（２
１）との溶着エネルギーが増大し、その接合強度が従来
に比して強くなる。Therefore, the wire (23) and the metal wiring (2)
The welding energy with 1) is increased, and the bonding strength is stronger than in the past.
【００１３】[0013]
【発明の効果】以上説明したように、本発明に係る液晶
表示装置によれば、微細な凹凸が表面に形成された金属
配線（２１）を有するので、従来に比してワイヤ（１
３）と金属配線（１１）との溶着エネルギーが増大し、
その接合強度を増大または接合時間を短くすることが可
能になる。As described above, the liquid crystal display device according to the present invention has the metal wiring (21) having fine irregularities formed on the surface thereof.
3) and the metal wiring (11) welding energy increases,
It is possible to increase the bonding strength or shorten the bonding time.
【図１】本発明の実施例に係る液晶表示装置の構成を示
す断面図である。FIG. 1 is a sectional view showing a configuration of a liquid crystal display device according to an embodiment of the present invention.
【図２】本発明の実施例に係る液晶表示装置の構成を示
す上面図である。FIG. 2 is a top view showing a configuration of a liquid crystal display device according to an embodiment of the present invention.
【図３】一般の液晶表示装置を説明する断面図である。FIG. 3 is a cross-sectional view illustrating a general liquid crystal display device.
【図４】従来例に係る液晶表示装置の構成を示す断面図
である。FIG. 4 is a cross-sectional view showing a configuration of a liquid crystal display device according to a conventional example.
【図５】従来例に係る液晶表示装置の構成を示す上面図
である。FIG. 5 is a top view showing a configuration of a liquid crystal display device according to a conventional example.
Claims (2)
に係る半導体集積回路装置（２２）が載置され、前記透
明基板（１９）上に形成された金属配線（２１）と前記
半導体集積回路装置（２２）がワイヤで接続された液晶
表示装置において、前記金属配線（２１）の表面は微細
な凹凸が形成されたことを特徴とする液晶表示装置。1. A semiconductor integrated circuit device (22) for driving the device is mounted on a transparent substrate (19), and metal wiring (21) and the semiconductor formed on the transparent substrate (19). A liquid crystal display device in which an integrated circuit device (22) is connected by a wire, wherein fine irregularities are formed on the surface of the metal wiring (21).
に係る半導体集積回路装置（２２）が載置され、前記透
明基板（１９）上に金属配線（２１）が形成され、前記
半導体集積回路装置（２２）と前記金属配線（２１）が
ワイヤを用いて超音波ボンデイングされる液晶表示装置
において、前記ワイヤと接続される少なくとも前記金属
配線（２１）の表面は微細な凹凸が形成されたことを特
徴とする液晶表示装置。2. A semiconductor integrated circuit device (22) for driving the device is mounted on a transparent substrate (19), and a metal wiring (21) is formed on the transparent substrate (19). In a liquid crystal display device in which an integrated circuit device (22) and the metal wiring (21) are ultrasonically bonded using a wire, at least the surface of the metal wiring (21) connected to the wire is formed with fine irregularities. A liquid crystal display device characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5146293A JPH075485A (en) | 1993-06-17 | 1993-06-17 | Liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5146293A JPH075485A (en) | 1993-06-17 | 1993-06-17 | Liquid crystal display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH075485A true JPH075485A (en) | 1995-01-10 |
Family
ID=15404410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5146293A Pending JPH075485A (en) | 1993-06-17 | 1993-06-17 | Liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075485A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093852A (en) * | 2000-09-18 | 2002-03-29 | Matsushita Electric Ind Co Ltd | Manufacturing method of semiconductor device, and the semiconductor device |
-
1993
- 1993-06-17 JP JP5146293A patent/JPH075485A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093852A (en) * | 2000-09-18 | 2002-03-29 | Matsushita Electric Ind Co Ltd | Manufacturing method of semiconductor device, and the semiconductor device |
| JP4601141B2 (en) * | 2000-09-18 | 2010-12-22 | パナソニック株式会社 | Semiconductor device manufacturing method and semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |