JPH07508555A - 表面実装導電性接着剤 - Google Patents
表面実装導電性接着剤Info
- Publication number
- JPH07508555A JPH07508555A JP6524271A JP52427194A JPH07508555A JP H07508555 A JPH07508555 A JP H07508555A JP 6524271 A JP6524271 A JP 6524271A JP 52427194 A JP52427194 A JP 52427194A JP H07508555 A JPH07508555 A JP H07508555A
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- weight
- parts
- free radical
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/06—Sulfur
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/147—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (12)
- 1.(a)アクリル化ウレタン樹脂、アクリル樹脂およびそれらの混合物からな る群から選ばれた結合剤樹脂の約2〜約15重量部、(b)アクリレート単量体 の約2〜約15重量部、(c)遊離基開始剤の約0.0l〜約3重量部、および (d)微粉砕銀粒子の約72〜約95重量部、を特徴とする表面実装導電性接着 剤組成物。
- 2.(e)約0.1〜約10重量部のレオロジー改質剤をさらに含むことを特徴 とする請求の範囲第1項の導電性接着剤。
- 3.前記結合剤樹脂がアクリル樹脂であることを特徴とする請求の範囲第1項の 導電性接着剤。
- 4.前記結合剤樹脂がアクリル化ウレタン樹脂であることを特徴とする請求の範 囲第1項の導電性接着剤。
- 5.前記アクリレート単量体がジアクリレート単量体であることを特徴とする請 求の範囲第1項の導電性接着剤。
- 6.前記ジアクリレート単量体がジアクリル酸トリプロピレングリコールである ことを特徴とする請求の範囲第5項の導電性接着剤。
- 7.前記遊離基開始荊が2,5−ジメチル−2,5−ビス(2−エチルヘキサノ イルベルオキシ)およびその混合物であることを特徴とする請求の範囲第1項の 導電性接着剤。
- 8.前記銀粒子が約0.1〜約10ミクロンの平均粒子直径を有する銀フレーク であることを特徴とする請求の範囲第1項の導電性接着剤。
- 9.未硬化導電性接着剤組成物が25℃で約10,000〜約700,000セ ンチポアズの粘度および約1オームーcmより小さい表面抵抗を有することを特 徴とする請求の範囲第1項の導電性接着剤。
- 10.(a)アクリル化ウレタン樹脂、アクリル樹脂およびそれらの混合物から なる群から選ばれた結合剤樹脂の約4〜約12重量部、(b)ジアクリレート単 量体の約3〜約13重量部、(c)2,5−ジメチル−2,5−ビス(2−エチ ルヘキサノイルペルオキシ)の約0.1〜約1重量部、および (d)約0.1〜約10ミクロンの平均粒子直径を有する銀フレークの約75〜 約88重量部、 を特徴とし、しかも前記未硬化導電性接着剤組成物が25℃で約10,000〜 約700,000の粘度および約1オームーcmより小さい表面抵抗を有するこ とを特徴とする、スクリーンプリント可能な表面実装導電性接着剤。
- 11.さらに(e)約0.1〜約10重量部のレオロジー改質剤を含むことを特 徴とする請求の範囲第10項の導電性接着剤。
- 12.硬化前に、 (a)アクリル化ウレタン樹脂、アクリル樹脂、およびそれらの混合物からなる 群から選ばれた結合剤樹脂の約2〜約15重量部、(b)アクリレート単量体の 約2〜約15重量部、(c)遊離基開始剤の約0.01〜約3重量部、および( d)微粉砕銀粒子の約72〜約95重両部、を特徴とする表面実装導電性接着剤 組成物により基材上に表面実装された電気部
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/047,518 US5395876A (en) | 1993-04-19 | 1993-04-19 | Surface mount conductive adhesives |
US047,518 | 1993-04-19 | ||
PCT/US1994/003631 WO1994025518A1 (en) | 1993-04-19 | 1994-04-01 | Surface mount conductive adhesives |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07508555A true JPH07508555A (ja) | 1995-09-21 |
JP3459012B2 JP3459012B2 (ja) | 2003-10-20 |
Family
ID=21949426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52427194A Expired - Fee Related JP3459012B2 (ja) | 1993-04-19 | 1994-04-01 | 表面実装導電性接着剤 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5395876A (ja) |
EP (1) | EP0647251B1 (ja) |
JP (1) | JP3459012B2 (ja) |
KR (1) | KR100289781B1 (ja) |
AU (1) | AU6529594A (ja) |
SG (1) | SG45204A1 (ja) |
TW (1) | TW313584B (ja) |
WO (1) | WO1994025518A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11323261A (ja) * | 1998-05-11 | 1999-11-26 | Three Bond Co Ltd | ハードディスクドライブの磁気ヘッドの製造用接着剤組成物 |
JP2009074066A (ja) * | 2007-08-29 | 2009-04-09 | Hitachi Chem Co Ltd | 接着剤組成物、フィルム状接着剤、回路接続用接着剤、接続体及び半導体装置 |
JP2009543931A (ja) * | 2006-07-17 | 2009-12-10 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 金属組成物、熱画像形成ドナーおよびそれらから得られたパターン化多層組成物 |
JP2013541611A (ja) * | 2010-09-20 | 2013-11-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 導電性接着剤 |
KR20210006343A (ko) * | 2018-04-26 | 2021-01-18 | 헨켈 아게 운트 코. 카게아아 | 태양 전지들을 부착하기 위한 전기 전도성 접착제 |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5698623A (en) * | 1994-04-28 | 1997-12-16 | Jacobs; Richard L. | Resin precursors having thixotropic properties and fillers stabilized against settling |
JP3019139B2 (ja) * | 1995-03-30 | 2000-03-13 | 株式会社住友金属エレクトロデバイス | 導電性ペースト及びそれを用いたセラミック回路基板 |
JPH0959553A (ja) * | 1995-08-30 | 1997-03-04 | Dainippon Printing Co Ltd | 透明導電性インキ |
US5759737A (en) * | 1996-09-06 | 1998-06-02 | International Business Machines Corporation | Method of making a component carrier |
SE508139C2 (sv) * | 1996-12-20 | 1998-08-31 | Ericsson Telefon Ab L M | Metod och anordning för anslutning av elektrisk komponent till kretskort |
SE508138C2 (sv) | 1996-12-20 | 1998-08-31 | Ericsson Telefon Ab L M | Metod och anordning för anslutning av elektrisk komponent till kretskort |
EP0979854B1 (en) * | 1997-03-31 | 2006-10-04 | Hitachi Chemical Company, Ltd. | Circuit connecting material, and structure and method of connecting circuit terminal |
US7967943B2 (en) * | 1997-03-31 | 2011-06-28 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
US6121358A (en) * | 1997-09-22 | 2000-09-19 | The Dexter Corporation | Hydrophobic vinyl monomers, formulations containing same, and uses therefor |
US6218446B1 (en) * | 1999-01-11 | 2001-04-17 | Dymax Corporation | Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced |
US6290881B1 (en) | 1999-04-14 | 2001-09-18 | Allied Photochemical, Inc. | Ultraviolet curable silver composition and related method |
US7157507B2 (en) * | 1999-04-14 | 2007-01-02 | Allied Photochemical, Inc. | Ultraviolet curable silver composition and related method |
US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
US6767577B1 (en) | 1999-10-06 | 2004-07-27 | Allied Photochemical, Inc. | Uv curable compositions for producing electroluminescent coatings |
DE60020859T2 (de) * | 1999-10-06 | 2006-05-11 | Allied Photochemical, Inc., Kimball | UV-Härtbare Zusammensetzungen zur Herstellung von Elektrolumineszenzbeschichtungen |
US6509389B1 (en) * | 1999-11-05 | 2003-01-21 | Uv Specialties, Inc. | UV curable compositions for producing mar resistant coatings and method for depositing same |
US6500877B1 (en) * | 1999-11-05 | 2002-12-31 | Krohn Industries, Inc. | UV curable paint compositions and method of making and applying same |
US6805917B1 (en) | 1999-12-06 | 2004-10-19 | Roy C. Krohn | UV curable compositions for producing decorative metallic coatings |
US20060100302A1 (en) * | 1999-12-06 | 2006-05-11 | Krohn Roy C | UV curable compositions for producing multilayer paint coatings |
MXPA02005257A (es) * | 1999-12-06 | 2003-09-22 | Slidekote Inc | Composiciones curables por uv. |
MXPA02005287A (es) | 1999-12-06 | 2004-04-21 | Krohn Ind Inc | Composiciones curables por uv para producir revestimientos de pintura de capas multiples. |
EP1263891A1 (en) * | 2000-01-13 | 2002-12-11 | UV Specialties, Inc. | Uv curable ferromagnetic compositions |
AU2001227855A1 (en) * | 2000-01-13 | 2001-07-24 | Uv Specialties, Inc. | Uv curable transparent conductive compositions |
US7323499B2 (en) * | 2000-09-06 | 2008-01-29 | Allied Photochemical, Inc. | UV curable silver chloride compositions for producing silver coatings |
WO2002020872A2 (en) * | 2000-09-06 | 2002-03-14 | Allied Photochemical, Inc. | Uv curable silver chloride compositions for producing silver coatings |
US6815642B2 (en) | 2001-12-19 | 2004-11-09 | Delphi Technologies, Inc. | Apparatus and method for heating a steering wheel |
JP4995403B2 (ja) * | 2002-05-02 | 2012-08-08 | スリーエム イノベイティブ プロパティズ カンパニー | アクリル系熱伝導性組成物形成用組成物、熱伝導性シート並びにその製造方法 |
BR0313157A (pt) * | 2002-07-31 | 2007-07-17 | Ray O Vac Corp | célula eletroquìmica secundária, aparelho de carregamento de célula secundária, sistema de carregamento de célula eletroquìmica secundária, e, método para discriminar entre tipos de células em um carregador de célula secundária |
ATE547494T1 (de) * | 2002-09-04 | 2012-03-15 | Namics Corp | Leitfähiger klebstoff und ihn enthaltender schaltkreis |
TW200508379A (en) * | 2003-05-19 | 2005-03-01 | Nippon Catalytic Chem Ind | Resin composition for thermally conductive material and thermally conductive material |
US6946628B2 (en) * | 2003-09-09 | 2005-09-20 | Klai Enterprises, Inc. | Heating elements deposited on a substrate and related method |
US20050244587A1 (en) * | 2003-09-09 | 2005-11-03 | Shirlin Jack W | Heating elements deposited on a substrate and related method |
US20050101686A1 (en) * | 2003-11-07 | 2005-05-12 | Krohn Roy C. | UV curable composition for forming dielectric coatings and related method |
US20050101685A1 (en) * | 2003-11-07 | 2005-05-12 | Allied Photochemical, Inc. | UV curable composition for forming dielectric coatings and related method |
US20050176841A1 (en) * | 2003-12-30 | 2005-08-11 | Krohn Roy C. | UV curable ink compositions |
DE102005027652A1 (de) * | 2005-06-15 | 2006-12-21 | Robert Bosch Gmbh | Elektrisch leitfähige, mechanisch flexible Verbindung zwischen elektrischen bzw. elektronischen Bauteilen |
JP4650456B2 (ja) * | 2006-08-25 | 2011-03-16 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
KR101398825B1 (ko) * | 2012-09-04 | 2014-05-27 | 삼성유리공업 주식회사 | 납땜이음용 전도성 접착코팅제 |
KR101551758B1 (ko) * | 2012-12-11 | 2015-09-09 | 제일모직주식회사 | 이방 도전성 필름용 조성물 및 이방 도전성 필름 |
CN103928077B (zh) | 2013-01-10 | 2017-06-06 | 杜邦公司 | 含有共混弹性体的导电粘合剂 |
CN103923578A (zh) | 2013-01-10 | 2014-07-16 | 杜邦公司 | 包括含氟弹性体的导电粘合剂 |
KR101492890B1 (ko) | 2013-02-05 | 2015-02-13 | (주) 파루 | 표면실장용 발광소자의 전도성 접착제 |
KR102049322B1 (ko) * | 2013-06-03 | 2019-11-27 | 쇼와 덴코 가부시키가이샤 | 마이크로파 가열용 도전성 수지 조성물 |
CN103497692A (zh) * | 2013-09-29 | 2014-01-08 | 苏州华周胶带有限公司 | 一种强效丙烯酸酯黏合剂 |
JP6398570B2 (ja) * | 2013-10-09 | 2018-10-03 | 日立化成株式会社 | 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法 |
CN103497728B (zh) * | 2013-10-18 | 2015-06-24 | 北京海斯迪克新材料有限公司 | 室温储存型丙烯酸酯底部填充胶及其制备方法 |
US20200095480A1 (en) * | 2018-09-20 | 2020-03-26 | Tektronix, Inc. | Uv curable conductive adhesive |
US11961629B1 (en) * | 2022-12-08 | 2024-04-16 | Geckos Technology Corp. | Antioxidant conductive thermal paste and method of manufacturing the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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GB2111072A (en) * | 1981-12-08 | 1983-06-29 | Johnson Matthey Plc | Ultra violet-curable ink or paint containing electrically conductive metal particles |
US4518524A (en) * | 1983-06-27 | 1985-05-21 | Acheson Industries, Inc. | Silver coating composition for use in electronic applications and the like |
JPS6162558A (ja) * | 1984-09-04 | 1986-03-31 | Muromachi Kagaku Kogyo Kk | 導電性を有する樹脂組成物 |
US4740532A (en) * | 1985-04-30 | 1988-04-26 | Amp Incorporated | Photocurable dielectric composition of acrylated urethane prepolymer |
JPS62177074A (ja) * | 1986-01-30 | 1987-08-03 | Mitsubishi Rayon Co Ltd | 導電性印刷インキ組成物 |
JPH02202959A (ja) * | 1989-02-02 | 1990-08-13 | Showa Highpolymer Co Ltd | 帯電防止用塗料組成物 |
US5043102A (en) * | 1989-11-29 | 1991-08-27 | Advanced Products, Inc. | Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
-
1993
- 1993-04-19 US US08/047,518 patent/US5395876A/en not_active Expired - Lifetime
-
1994
- 1994-04-01 KR KR1019940704635A patent/KR100289781B1/ko not_active IP Right Cessation
- 1994-04-01 EP EP94912936A patent/EP0647251B1/en not_active Expired - Lifetime
- 1994-04-01 JP JP52427194A patent/JP3459012B2/ja not_active Expired - Fee Related
- 1994-04-01 WO PCT/US1994/003631 patent/WO1994025518A1/en active IP Right Grant
- 1994-04-01 SG SG1996001267A patent/SG45204A1/en unknown
- 1994-04-01 AU AU65295/94A patent/AU6529594A/en not_active Abandoned
- 1994-12-07 TW TW083111384A patent/TW313584B/zh active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11323261A (ja) * | 1998-05-11 | 1999-11-26 | Three Bond Co Ltd | ハードディスクドライブの磁気ヘッドの製造用接着剤組成物 |
JP2009543931A (ja) * | 2006-07-17 | 2009-12-10 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 金属組成物、熱画像形成ドナーおよびそれらから得られたパターン化多層組成物 |
US8440383B2 (en) | 2006-07-17 | 2013-05-14 | E I Du Pont De Nemours And Company | Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
JP2009074066A (ja) * | 2007-08-29 | 2009-04-09 | Hitachi Chem Co Ltd | 接着剤組成物、フィルム状接着剤、回路接続用接着剤、接続体及び半導体装置 |
JP2013541611A (ja) * | 2010-09-20 | 2013-11-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 導電性接着剤 |
US9589693B2 (en) | 2010-09-20 | 2017-03-07 | Henkel Ag & Co. Kgaa | Electrically conductive adhesives |
KR20210006343A (ko) * | 2018-04-26 | 2021-01-18 | 헨켈 아게 운트 코. 카게아아 | 태양 전지들을 부착하기 위한 전기 전도성 접착제 |
JP2021529841A (ja) * | 2018-04-26 | 2021-11-04 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA | 太陽電池を接着するための導電性接着剤 |
Also Published As
Publication number | Publication date |
---|---|
SG45204A1 (en) | 1998-01-16 |
WO1994025518A1 (en) | 1994-11-10 |
EP0647251B1 (en) | 1999-07-07 |
US5395876A (en) | 1995-03-07 |
AU6529594A (en) | 1994-11-21 |
JP3459012B2 (ja) | 2003-10-20 |
EP0647251A4 (en) | 1997-04-16 |
TW313584B (ja) | 1997-08-21 |
KR100289781B1 (ko) | 2001-05-15 |
EP0647251A1 (en) | 1995-04-12 |
KR950702220A (ko) | 1995-06-19 |
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