JPH07307111A - Conductive paste - Google Patents

Abstract

PURPOSE:To provide a conductive paste which shows a low resistance, high conductivity, high migration resistance and high solder resistance and is very economical by containing composite particles in which a predetermined metal powder is nearly uniformly integrated. CONSTITUTION:A conductive paste is formed by containing composite particles in which silver powder and 7 zirconium powder are nearly uniform integrated at the weight ratio of 100:1 to 20:1 and the aspect ratio is not less than 3 and which particles have a flake-like form and an average particle diameter of 10mum. When it is used for a wiring board and the like which have a through- hole, the resistance of the through-hole is reduced to make a high conductivity paste, and since an alloy of silver and palladium is not used, a conductive paste is made which shows high migration resistance and high solder resistance under the of high temperature and high humidity and is very economical.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は電気回路形成用の導電ペ
ーストに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste for forming an electric circuit.

【０００２】[0002]

【従来の技術】従来、プリント配線板、電子部品等の配
線導体を形成する方法として、導電性に優れた銀粉を含
有するペーストを塗布又は印刷して形成する方法が一般
的に知られている。2. Description of the Related Art Conventionally, as a method for forming a wiring conductor of a printed wiring board, an electronic component or the like, a method of applying or printing a paste containing silver powder having excellent conductivity is generally known. .

【０００３】[0003]

【発明が解決しようとする課題】銀粉を用いた導電ペー
ストは、導電性が良好なことから印刷配線板、電子部品
等の配線導体や電極として使用されているが、これらは
高温多湿の雰囲気下で電界が印加されると、配線導体や
電極にマイグレーションと称する銀の電析が生じ電極間
又は配線間が短絡するという欠点が生じる。このマイグ
レーションを防止するための方策はいくつか行われてお
り、導体の表面に防湿塗料を塗布するか又は導電ペース
トに含窒素化合物などの腐食抑制剤を添加するなどの方
策が検討されているが十分な効果が得られるものではな
かった。Since the conductive paste using silver powder has good conductivity, it is used as a wiring conductor or an electrode of a printed wiring board, an electronic component or the like, but these are used in a hot and humid atmosphere. When an electric field is applied to the wiring conductors and electrodes, silver electrodeposition called migration occurs, which causes a short circuit between electrodes or between wirings. Several measures have been taken to prevent this migration, and measures such as applying a moisture-proof coating to the surface of the conductor or adding a corrosion inhibitor such as a nitrogen-containing compound to the conductive paste have been studied. The effect was not sufficient.

【０００４】銀とパラジウムの合金を使用すればマイグ
レーションを改善できるが、パラジウムが高価なため導
電ペーストも高価となり、また導通抵抗の良好な導体を
得るには銀粉又は銀とパラジウムの合金粉の配合量を多
くしなければならず、これらの原料が高価であることか
ら導電ペーストも高価になるという欠点があった。Migration can be improved by using an alloy of silver and palladium, but since palladium is expensive, the conductive paste is also expensive, and in order to obtain a conductor having good conduction resistance, silver powder or a silver-palladium alloy powder is blended. The amount has to be increased, and since these raw materials are expensive, the conductive paste is also expensive.

【０００５】本発明はかかる欠点のない導電ペーストを
提供するものである。The present invention provides a conductive paste that does not have such drawbacks.

【０００６】[0006]

【課題を解決するための手段】本発明は銀粉とジルコニ
ウム粉とが略均一に一体化された複合粒子を含む導電ペ
ーストに関する。The present invention relates to a conductive paste containing composite particles in which silver powder and zirconium powder are substantially uniformly integrated.

【０００７】本発明における銀粉とジルコニウム粉の複
合粒子はその形状を限定するものではないが、アスペク
ト比は平均で大略３以上あるフレーク状の形状であるこ
とが好ましく、１０以上であるフレーク状の形状であれ
ばさらに好ましい。また、その長径の平均粒径は２０μ
ｍ以下が好ましく、１０μｍ以下であれば印刷性を低下
させないのでさらに好ましい。The shape of the composite particles of silver powder and zirconium powder in the present invention is not limited, but the aspect ratio is preferably a flaky shape having an average of about 3 or more, and a flaky shape of 10 or more. The shape is more preferable. The average diameter of the major axis is 20μ.
m or less is preferable, and if it is 10 μm or less, printability is not deteriorated, and more preferable.

【０００８】複合粒子の作製方法は特に制限はないが、
銀粉とジルコニウム粉を略均一に混合したのち又は略均
一に混合しながら強い衝撃力を粒子に加えて複数の粒子
を一体化させればよい。具体的にはボールミル、連続ビ
ーズミル等の方法で略均一に混合し、次いでこれを振動
ミル、遊星型ボールミル、アトライター等の高剪断力を
印加できる装置で処理して複合一体化させればよい。The method for producing the composite particles is not particularly limited,
After the silver powder and the zirconium powder are mixed almost uniformly, or while being mixed substantially uniformly, a strong impact force may be applied to the particles to integrate the plurality of particles. Specifically, a ball mill, a continuous bead mill, or the like may be used to mix them substantially uniformly, and then this may be treated with a device such as a vibration mill, a planetary ball mill, or an attritor that can apply a high shearing force, to form a composite integral. .

【０００９】複合粒子の銀粉とジルコニウム粉の比率は
導体の抵抗、マイグレーションの防止及び耐はんだ性の
点から重量比で１００：１〜２０：１（銀粉：ジルコニ
ウム粉）であることが好ましい。The ratio of silver powder to zirconium powder in the composite particles is preferably 100: 1 to 20: 1 (silver powder: zirconium powder) in weight ratio from the viewpoint of resistance of conductor, prevention of migration and solder resistance.

【００１０】導電ペーストは上記の材料以外に液状のエ
ポキシ樹脂、フェノール樹脂、不飽和ポリエステル樹脂
等の有機質の接着剤成分、２エチル４メチルイミダゾー
ルなどの有機質の接着剤成分の硬化剤及び必要に応じて
テルピネオール、エチルカルビトール、カルビトールア
セテート、ブチルセロソルブ等の溶媒、ベンゾチアゾー
ル、ベンズイミダゾール等の腐食抑制剤、微小黒鉛粉末
などを含有する。銀粉及びジルコニウム粉の含有量は導
電ペーストの固形分に対して導体の抵抗と経済性から２
０〜６０重量％であることが好ましく、３０〜６０重量
％であることがさらに好ましい。In addition to the above materials, the conductive paste is a curing agent for an organic adhesive component such as liquid epoxy resin, phenol resin, unsaturated polyester resin, and the like, and an organic adhesive component such as 2 ethyl 4-methylimidazole, and if necessary. It contains a solvent such as terpineol, ethyl carbitol, carbitol acetate and butyl cellosolve, a corrosion inhibitor such as benzothiazole and benzimidazole, and fine graphite powder. The content of silver powder and zirconium powder is 2 with respect to the solid content of the conductive paste due to the resistance and economical efficiency of the conductor.
It is preferably 0 to 60% by weight, and more preferably 30 to 60% by weight.

【００１１】[0011]

【実施例】以下本発明の実施例を説明する。 実施例１ ビスフェノールＡ型エポキシ樹脂（油化シェルエポキシ
製、商品名エピコート８３４）６０重量部及びビスフェ
ノールＡ型エポキシ樹脂（油化シェルエポキシ製、商品
名エピコート８２８）４０重量部を予め加温溶解させ、
次いで室温に冷却した後２エチル４メチルイミダゾール
（四国化成製）５重量部、エチルカルビトール（和光純
薬製、試薬）２０重量部、ブチルセロソルブ（和光純薬
製、試薬）２０重量部を加えて均一に混合して樹脂組成
物とした。EXAMPLES Examples of the present invention will be described below. Example 1 60 parts by weight of bisphenol A type epoxy resin (Oilized shell epoxy, trade name Epicoat 834) and 40 parts by weight of bisphenol A type epoxy resin (Oilized shell epoxy, trade name Epicoat 828) were dissolved by heating in advance. ,
Then, after cooling to room temperature, 5 parts by weight of 2 ethyl 4-methyl imidazole (manufactured by Shikoku Kasei), 20 parts by weight of ethyl carbitol (manufactured by Wako Pure Chemicals, reagent), 20 parts by weight of butyl cellosolve (manufactured by Wako Pure Chemicals, reagent) were added. The resin composition was mixed uniformly.

【００１２】一方、フレーク状の銀粉（徳力化学研究所
製、商品名ＴＣＧ−１）１００ｇ及び平均粒径が１μｍ
以下のジルコニウム微粉（高純度化学製）５ｇを粉砕用
ボールと共にボールミルに投入し、１００時間回転し、
均一に分散させた。さらにこれを遊星型ボールミル（高
速回転ボールミル）に移し、１００時間高剪断力を印加
して一体化してアスペクト比が平均で１２及び長径の平
均粒径が６μｍの複合粒子を作製した。この後上記で得
た樹脂組成物１４５ｇに上記の複合粒子１０５ｇを加え
て撹拌らいかい機及び三本ロールで均一に分散して導電
ペーストを得た。On the other hand, 100 g of flake-shaped silver powder (TCG-1 manufactured by Tokuriki Kagaku Kenkyusho) and an average particle size of 1 μm.
5 g of the following zirconium fine powder (manufactured by Kojundo Chemical Co., Ltd.) was put into a ball mill together with a ball for grinding and rotated for 100 hours,
Dispersed evenly. Further, this was transferred to a planetary ball mill (high-speed rotation ball mill) and integrated by applying a high shearing force for 100 hours to prepare composite particles having an average aspect ratio of 12 and an average major axis diameter of 6 μm. Thereafter, 105 g of the above composite particles was added to 145 g of the resin composition obtained above and uniformly dispersed with a stirrer and a triple roll to obtain a conductive paste.

【００１３】次に上記で得た導電ペーストで、厚さが
１．６mmで直径が０．８mm（φ）のスルーホールを形成
した紙フェノール銅張積層板（日立化成工業製、商品名
ＭＣＬ−４３７Ｆ）に図１に示すテストパターンを印刷
すると共にこれをスルーホール１に充てんしたものを大
気中で６０℃３０分さらに１６０℃３０分の条件で加熱
処理して配線板を得た。なお図１において２は紙フェノ
ール銅張積層板である。次に得られた配線板の抵抗を測
定した。その結果、銅箔の抵抗を除いたスルーホール１
の抵抗は２３ｍΩ／穴であり、隣り合うスルーホール間
の絶縁抵抗は１０ ⁸Ω以上であった。該配線板の冷熱衝
撃試験を実施した結果、スルーホール１の抵抗は３０ｍ
Ω／穴であった。また該配線板の湿中負荷試験を実施し
た結果、スルーホール間の絶縁抵抗は１０⁸Ω以上であ
った。なお、冷熱試験条件は１２５℃３０分〜−６５℃
３０分を１００サイクル行い、湿中負荷試験は４０℃９
０％ＲＨ中、隣り合うライン間に５０Ｖの電圧を印加し
て２０００時間保持した。また耐はんだ試験（２６０
℃、１０秒、５回）を行ったが、ランド部分の導電ペー
スト硬化物に、はんだくわれは認められなかった。Next, using the conductive paste obtained above,
Form a through hole with a diameter of 1.6 mm and a diameter of 0.8 mm (φ)
Paper phenol copper clad laminate (Hitachi Chemical Co., Ltd., trade name
MCL-437F) prints the test pattern shown in FIG.
In addition, the one filled with this through hole 1 is
Heating in air at 60 ° C for 30 minutes and 160 ° C for 30 minutes
It processed and the wiring board was obtained. In FIG. 1, 2 is a paper pheno.
It is a copper clad laminate. Next, measure the resistance of the obtained wiring board.
Decided As a result, through hole 1 excluding the resistance of copper foil
Resistance is 23 mΩ / hole, and it is between the adjacent through holes.
Insulation resistance of 10 ⁸It was more than Ω. Thermal shock of the wiring board
As a result of the impact test, the resistance of the through hole 1 is 30 m.
Ω / hole. We also conducted a humidity and load test on the wiring board.
As a result, the insulation resistance between the through holes is 10⁸Ω or more
It was. The cold heat test conditions are 125 ° C. 30 minutes to −65 ° C.
100 cycles of 30 minutes, 40 ° C 9
Apply a voltage of 50V between adjacent lines in 0% RH.
For 2000 hours. Also, solder resistance test (260
℃, 10 seconds, 5 times) was performed, but the conductive page of the land part
No solder nicks were found in the strike cured product.

【００１４】実施例２ 実施例１で用いたフレーク状銀粉を２３５ｇ及びジルコ
ニウム粉を５ｇ配合した以外は実施例１と同様の工程を
経てアスペクト比が平均で１２及び長径の平均粒径が６
μｍの複合粒子を作製した。この後実施例１で得た樹脂
組成物１４５ｇに上記の複合粒子を２４０ｇ加えて実施
例１と同様の方法で均一に混合分散して導電ペーストを
得た。以下実施例１と同様の工程を経て配線板を作製し
てその特性を評価した。その結果、スルーホールの抵抗
は１８ｍΩ／穴であり、スルーホール間の絶縁抵抗は１
０⁸Ω以上であった。また該配線板の冷熱衝撃試験を実
施した結果、スルーホールの抵抗は２０ｍΩ／穴であ
り、湿中負荷試験の結果では、スルーホール間の絶縁抵
抗は１０⁸Ω以上であった。Example 2 The aspect ratio was 12 on average and the average diameter of the major axis was 6 through the same steps as in Example 1 except that 235 g of the flake silver powder and 5 g of zirconium powder used in Example 1 were blended.
Composite particles of μm were prepared. Then, 240 g of the above composite particles was added to 145 g of the resin composition obtained in Example 1 and uniformly mixed and dispersed in the same manner as in Example 1 to obtain a conductive paste. A wiring board was manufactured through the same steps as in Example 1 and the characteristics thereof were evaluated. As a result, the resistance of the through holes is 18 mΩ / hole, and the insulation resistance between the through holes is 1
Was 0 ⁸ Ω or more. As a result of the thermal shock test of the wiring board, the resistance of the through holes was 20 mΩ / hole, and the result of the wet and medium load test showed that the insulation resistance between the through holes was 10 ⁸ Ω or more.

【００１５】実施例３ 実施例１で用いたフレーク状銀粉を４００ｇ及びジルコ
ニウム粉を８ｇ配合した以外は実施例１と同様の工程を
経てアスペクト比が平均で１２及び長径の平均粒径が６
μｍの複合粒子を作製した。この後実施例１で用いた樹
脂組成物１４５ｇに上記の複合粒子を４０８ｇ加えて実
施例１と同様の方法で均一に混合分散して導電ペースト
を得た。以下実施例１と同様の工程を経て配線板を作製
してその特性を評価した。その結果、スルーホールの抵
抗は１６ｍΩ／穴であり、スルーホール間の絶縁抵抗は
１０⁸Ω以上であった。また該配線板の冷熱衝撃試験を
実施した結果、スルーホールの抵抗は１９ｍΩ／穴であ
り、湿中負荷試験の結果では、スルーホール間の絶縁抵
抗は１０⁸Ω以上であった。Example 3 The same aspect ratio as in Example 1 was used except that 400 g of the flake silver powder and 8 g of zirconium powder used in Example 1 were blended, and the aspect ratio was 12 on average and the average diameter of major axis was 6.
Composite particles of μm were prepared. After that, 408 g of the above composite particles were added to 145 g of the resin composition used in Example 1 and uniformly mixed and dispersed in the same manner as in Example 1 to obtain a conductive paste. A wiring board was manufactured through the same steps as in Example 1 and the characteristics thereof were evaluated. As a result, the resistance of the through holes was 16 mΩ / hole, and the insulation resistance between the through holes was 10 ⁸ Ω or more. As a result of the thermal shock test of the wiring board, the resistance of the through holes was 19 mΩ / hole, and the result of the wet and medium load test showed that the insulation resistance between the through holes was 10 ⁸ Ω or more.

【００１６】比較例１ 実施例１で得た樹脂組成物１４５ｇに実施例１で用いた
フレーク状銀粉を４００ｇ加えて実施例１と同様の方法
で均一に混合分散して導電ペーストを得た。以下実施例
１と同様の工程を経て配線板を作製してその特性を評価
した。その結果、スルーホールの抵抗は２１ｍΩ／穴で
あり、スルーホール間の絶縁抵抗は１０⁸Ω以上であっ
た。また該配線板の冷熱衝撃試験を実施した結果、スル
ーホールの抵抗は２６ｍΩ／穴であり、湿中負荷試験の
結果では、スルーホール間の絶縁抵抗は配線板５枚のう
ち３枚が１０⁷Ω台に低下していた。また実施例１と同
様の耐はんだ試験を実施したところ、ランド部分の導電
ペースト硬化物に、はんだくわれが認められた。Comparative Example 1 400 g of the flake silver powder used in Example 1 was added to 145 g of the resin composition obtained in Example 1 and the mixture was uniformly mixed and dispersed in the same manner as in Example 1 to obtain a conductive paste. A wiring board was manufactured through the same steps as in Example 1 and the characteristics thereof were evaluated. As a result, the resistance of the through holes was 21 mΩ / hole, and the insulation resistance between the through holes was 10 ⁸ Ω or more. As a result of the thermal shock test of the wiring board, the resistance of the through hole was 26 mΩ / hole, and the result of the wet and medium load test showed that the insulation resistance between the through holes was 10 ^{7 for} 3 out of 5 wiring boards. It had dropped to the Ω range. Further, when the same soldering resistance test as in Example 1 was carried out, solder nicks were observed in the conductive paste cured product in the land portion.

【００１７】[0017]

【発明の効果】本発明になる導電ペーストは、配線板に
おけるスルーホールの抵抗が低い高導電性のペーストで
あり、また湿中負荷試験後におけるスルーホール間の絶
縁抵抗の低下が小さく、また、高価なパラジウムを使用
することなく耐マイグレーション性及び耐はんだ性を改
善できるなど経済的にも優れた導電ペーストである。EFFECT OF THE INVENTION The conductive paste according to the present invention is a highly conductive paste having a low resistance of through holes in a wiring board, and has a small decrease in insulation resistance between through holes after a wet and medium load test. It is a conductive paste that is economically excellent in that migration resistance and solder resistance can be improved without using expensive palladium.

【図面の簡単な説明】[Brief description of drawings]

【図１】紙フェノール銅張積層板に導電ペーストを印刷
すると共にスルーホールに充てんした状態を示す平面図
である。FIG. 1 is a plan view showing a state in which a conductive paste is printed on a paper phenol copper clad laminate and the through holes are filled.

【符号の説明】[Explanation of symbols]

１ スルーホール ２ 紙フェノール銅張積層板 1 Through hole 2 Paper phenol copper clad laminate

フロントページの続き (72)発明者 和田 弘 茨城県日立市東町四丁目13番１号 日立化 成工業株式会社茨城研究所内 (72)発明者 小野 利一 茨城県日立市鮎川町三丁目３番１号 桜川 産業株式会社内Front Page Continuation (72) Inventor Hiroshi Wada 4-13-1, Higashimachi, Hitachi City, Ibaraki Hitachi Chemical Co., Ltd. Ibaraki Research Institute (72) Inventor Riichi Ono 3-3-1 Ayukawacho, Hitachi City, Ibaraki Prefecture No. Sakuragawa Sangyo Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 銀粉とジルコニウム粉とが略均一に一体
化された複合粒子を含む導電ペースト。1. A conductive paste containing composite particles in which silver powder and zirconium powder are substantially uniformly integrated.