JPH06338218A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH06338218A JPH06338218A JP12709893A JP12709893A JPH06338218A JP H06338218 A JPH06338218 A JP H06338218A JP 12709893 A JP12709893 A JP 12709893A JP 12709893 A JP12709893 A JP 12709893A JP H06338218 A JPH06338218 A JP H06338218A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- powder
- holes
- resistance
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電気回路形成用の導電ペ
ーストに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste for forming an electric circuit.
【０００２】[0002]
【従来の技術】従来、プリント配線板、電子部品等の配
線導体を形成する方法として、導電性に優れた銀粉を含
有するペーストを塗布又は印刷して形成する方法が一般
的に知られている。2. Description of the Related Art Conventionally, as a method for forming a wiring conductor of a printed wiring board, an electronic component or the like, a method of applying or printing a paste containing silver powder having excellent conductivity is generally known. .
【０００３】[0003]
【発明が解決しようとする課題】銀粉を用いた導電ペー
ストは導電性が良好なことから印刷配線板、電子部品等
の配線導体や電極として使用されているが、これらは高
温多湿の雰囲気下で電界が印加されると、配線導体や電
極にマイグレーションと称する銀の電析が生じ電極間又
は配線間が短絡するという欠点が生じる。このマイグレ
ーションを防止するための方策はいくつか行われてお
り、導体の表面に防湿塗料を塗布するか又は導電ペース
トに窒素化合物などの腐食抑制剤を添加するなどの方策
が検討されているが十分な効果が得られるものではなか
った。Since a conductive paste using silver powder has good conductivity, it is used as a wiring conductor or an electrode for printed wiring boards, electronic parts, etc., but these are used under a high temperature and high humidity atmosphere. When an electric field is applied, there is a drawback that a wiring conductor or an electrode is electro-deposited with silver called migration and a short circuit occurs between electrodes or between wirings. Several measures have been taken to prevent this migration, and measures such as applying a moisture-proof coating to the surface of the conductor or adding a corrosion inhibitor such as a nitrogen compound to the conductive paste have been studied, but it is sufficient. It was not possible to obtain such an effect.
【０００４】また、導通抵抗の良好な導体を得るには銀
粉の配合量を多くしなければならず、銀粉が高価である
ことから導電ペーストも高価になるという欠点があっ
た。Further, in order to obtain a conductor having good conduction resistance, it is necessary to increase the amount of silver powder blended, and the silver paste is expensive, so that the conductive paste is also expensive.
【０００５】本発明はかかる欠点のない導電ペーストを
提供するものである。The present invention provides a conductive paste that does not have such drawbacks.
【０００６】[0006]
【課題を解決するための手段】本発明はフレーク状銀
粉、銅粉及びセラミックス粉を含む導電ペーストに関す
る。The present invention relates to a conductive paste containing flaky silver powder, copper powder and ceramic powder.
【０００７】本発明におけるフレーク状銀粉はその形状
を限定するものではないが、アスペクト比は大略３以上
あることが好ましく、１０以上であればさらに好まし
い。また、その粒径は長径が２０μｍ以下であることが
好ましく、１０μｍ以下であれば印刷性を低下させない
のでさらに好ましい。銅粉は粒径が小さいほど好まし
く、例えば２０μｍ以下が好ましく、１０μｍ以下であ
ればフレーク状銀粉の粒間に均一に分散させやすいので
さらに好ましい。The shape of the flake silver powder in the present invention is not limited, but the aspect ratio is preferably about 3 or more, more preferably 10 or more. The major axis of the particle size is preferably 20 μm or less, and more preferably 10 μm or less because printability is not deteriorated. The smaller the particle size of the copper powder is, the more preferable it is, for example, 20 μm or less, and the more preferable particle size is 10 μm or less because it is easy to uniformly disperse between the grains of the flake silver powder.
【０００８】セラミックス粉はその形状を限定するもの
ではないが、その粒径は長径１０μｍ以下が好ましく、
５μｍ以下であればさらに好ましい。またセラミックス
粉の種類については特に制限はないがアルミナ粉を用い
ることが好ましい。さらにフレーク状銀粉、銅粉及びセ
ラミックス粉の使用方法は、それぞれ個々に添加しても
良いが、予め上記の原料をボールミル等で均一に混合し
たのち添加すれば銀粉の分散性が良いので好ましい。The shape of the ceramic powder is not limited, but the particle diameter is preferably 10 μm or less in the major axis,
It is more preferably 5 μm or less. The type of ceramic powder is not particularly limited, but alumina powder is preferably used. Further, the flaky silver powder, the copper powder and the ceramic powder may be added individually, but it is preferable that the above raw materials are uniformly mixed in advance with a ball mill or the like and then added, since the dispersibility of the silver powder is good.
【０００９】フレーク状銀粉と銅粉の比率は導体の抵抗
とマイグレーションの防止から体積比で５：１〜１：５
（フレーク状銀粉：銅粉）であることが好ましい。また
フレーク状銀粉及び銅粉とセラミックス粉の比率はマイ
グレーションの防止と経済性から体積比で５：１〜１：
１（フレーク状銀粉及び銅粉：セラミックス粉）である
ことが好ましい。The flake-shaped silver powder and the copper powder have a volume ratio of 5: 1 to 1: 5 from the viewpoint of resistance of the conductor and prevention of migration.
(Flake silver powder: copper powder) is preferable. Further, the flake-shaped silver powder and the ratio of the copper powder to the ceramic powder are 5: 1 to 1: 1 in volume ratio in order to prevent migration and to be economical.
1 (flake silver powder and copper powder: ceramic powder) is preferable.
【００１０】導電ペーストは上記の材料以外に液状のエ
ポキシ樹脂、フェノール樹脂、不飽和ポリエステル樹脂
などの有機質の接着剤成分及び必要に応じて、テルピネ
オール、エチルカルビトール、カルビトールアセテート
等の溶媒、微小黒鉛粉末、ベンゾチアゾール、ベンズイ
ミダゾール等の腐食抑制剤などを含有する。フレーク状
銀粉、銅粉及びセラミックス粉の含有量は導電ペースト
の固形分に対して導体の抵抗と経済性から２０〜６０重
量％であることが好ましく、３０〜６０重量％であるこ
とがさらに好ましい。In addition to the above materials, the conductive paste is an organic adhesive component such as liquid epoxy resin, phenol resin, unsaturated polyester resin and, if necessary, terpineol, ethyl carbitol, carbitol acetate, etc. It contains a corrosion inhibitor such as graphite powder, benzothiazole and benzimidazole. The content of the flake-shaped silver powder, copper powder and ceramics powder is preferably 20 to 60% by weight, more preferably 30 to 60% by weight, based on the solid content of the conductive paste, from the viewpoint of the resistance and economy of the conductor. .
【００１１】[0011]
【実施例】以下本発明の実施例を説明する。 実施例１ ビスフェノールＡ型エポキシ樹脂（油化シェルエポキシ
製、商品名エピコート８３４）６０重量部及びビスフェ
ノールＡ型エポキシ樹脂（油化シェルエポキシ製、商品
名エピコート８２８）４０重量部を予め加温溶解させ、
次いで室温に冷却した後２エチル４メチルイミダゾール
（四国化成製）５重量部、エチルカルビトール（和光純
薬製、試薬）２０重量部及びブチルセロソルブ（和光純
薬製、試薬）２０重量部を加えて均一に混合して樹脂組
成物とし、この樹脂組成物１４５ｇにフレーク状銀粉
（徳力化学研究所製、商品名ＴＣＧ−１）を１１０ｇ、
銅粉（福田金属箔粉製、商品名ＳＰＣ４−８）４０ｇ及
び平均粒径が０．４μｍのアルミナ粉（住友化学製、商
品名ＡＥＳ−１２）を３５ｇ加えて撹拌らいかい機及び
３本ロールで均一に分散して導電ペーストを得た。EXAMPLES Examples of the present invention will be described below. Example 1 60 parts by weight of bisphenol A type epoxy resin (Oilized shell epoxy, trade name Epicoat 834) and 40 parts by weight of bisphenol A type epoxy resin (Oilized shell epoxy, trade name Epicoat 828) were dissolved by heating in advance. ,
Then, after cooling to room temperature, 5 parts by weight of 2 ethyl 4-methyl imidazole (manufactured by Shikoku Kasei), 20 parts by weight of ethyl carbitol (manufactured by Wako Pure Chemicals, reagent) and 20 parts by weight of butyl cellosolve (manufactured by Wako Pure Chemicals, reagent) were added. A resin composition was prepared by uniformly mixing, and 145 g of this resin composition was added with 110 g of flake-shaped silver powder (manufactured by Tokuriki Kagaku Kenkyusho, trade name TCG-1).
40 g of copper powder (manufactured by Fukuda Metal Foil Powder, trade name SPC4-8) and 35 g of alumina powder having an average particle size of 0.4 μm (manufactured by Sumitomo Chemical Co., Ltd., trade name AES-12) are added, and a stirrer mixer and three rolls are added. Was evenly dispersed to obtain a conductive paste.
【００１２】次に上記で得た導電ペーストで厚さが１．
６ｍｍで直径が０．８ｍｍ（φ）のスルーホールを形成
した紙フェノール銅張積層板（日立化成工業製、商品名
ＭＣＬ−４３７Ｆ）に図１に示すテストパターンを印刷
すると共にこれをスルーホール１に充てんしたものを大
気中で６０℃３０分さらに１６０℃３０分の条件で加熱
処理して配線板を得た。なお図１において２は紙フェノ
ール銅張積層板である。次に得られた配線板の抵抗を測
定した。その結果銅箔の抵抗を除いたスルーホール１の
抵抗は２１ｍΩ／穴であり、隣り合うスルーホール間の
絶縁抵抗は１０8Ω以上であった。該配線板の冷熱衝撃
試験を実施した結果、スルーホール１の抵抗は２５ｍΩ
／穴であった。また該配線板の湿中負荷試験を実施した
結果、スルーホール間の絶縁抵抗は１０8Ω以上であっ
た。なお、冷熱試験条件は１２５℃３０分〜−６５℃３
０分を１００サイクル行い、湿中負荷試験は４０℃９０
％ＲＨ中、隣あうライン間に５０Ｖの電圧を印加して１
０００時間保持した。Next, the conductive paste obtained above has a thickness of 1.
The test pattern shown in FIG. 1 is printed on a paper phenol copper clad laminate (Hitachi Chemical Co., Ltd., trade name MCL-437F) in which a through hole having a diameter of 6 mm and a diameter of 0.8 mm (φ) is formed. The wiring board was obtained by heat-treating the material filled in the above in the atmosphere under the conditions of 60 ° C. for 30 minutes and 160 ° C. for 30 minutes. In FIG. 1, 2 is a paper phenol copper clad laminate. Next, the resistance of the obtained wiring board was measured. As a result, the resistance of the through hole 1 excluding the resistance of the copper foil was 21 mΩ / hole, and the insulation resistance between adjacent through holes was 10 8 Ω or more. As a result of the thermal shock test of the wiring board, the resistance of the through hole 1 is 25 mΩ.
/ It was a hole. Moreover, as a result of performing a wet and medium load test on the wiring board, the insulation resistance between the through holes was 10 8 Ω or more. The cold heat test conditions are 125 ° C. 30 minutes to −65 ° C. 3
100 cycles of 0 minutes, 90 ° C for humidity and medium load test
Apply a voltage of 50V between adjacent lines during% RH to set 1
Hold for 000 hours.
【００１３】実施例２ 実施例１で得た樹脂組成物１４５ｇに実施例１で用いた
フレーク状銀粉を２００ｇ、銅粉を１００ｇ及びアルミ
ナ粉を６０ｇ加えて実施例１と同様の方法で均一に混合
分散して導電ペーストを得た。以下実施例１と同様の工
程を経て配線板を作製してその特性を評価した。その結
果、スルーホールの抵抗は１９ｍΩ／穴であり、スルー
ホール間の絶縁抵抗は１０8Ω以上であった。また該配
線板の冷熱衝撃試験を実施した結果、スルーホールの抵
抗は２３ｍΩ／穴であり、湿中負荷試験の結果では、ス
ルーホール間の絶縁抵抗は１０8Ω以上であった。Example 2 To 145 g of the resin composition obtained in Example 1, 200 g of the flake silver powder used in Example 1, 100 g of copper powder and 60 g of alumina powder were added and homogenized in the same manner as in Example 1. A conductive paste was obtained by mixing and dispersing. A wiring board was manufactured through the same steps as in Example 1 and the characteristics thereof were evaluated. As a result, the resistance of the through holes was 19 mΩ / hole, and the insulation resistance between the through holes was 10 8 Ω or more. As a result of a thermal shock test of the wiring board, the resistance of the through holes was 23 mΩ / hole, and the result of the wet and medium load test showed that the insulation resistance between the through holes was 10 8 Ω or more.
【００１４】実施例３ 実施例１で得た樹脂組成物１４５ｇに実施例１で用いた
フレーク状銀粉を５００ｇ、銅粉を３００ｇ及びアルミ
ナ粉を７０ｇ加えて実施例１と同様の方法で均一に混合
分散して導電ペーストを得た。以下実施例１と同様の工
程を経て配線板を作製してその特性を評価した。その結
果、スルーホールの抵抗は１９ｍΩ／穴であり、スルー
ホール間の絶縁抵抗は１０8Ω以上であった。また該配
線板の冷熱衝撃試験を実施した結果、スルーホールの抵
抗は２２ｍΩ／穴であり、湿中負荷試験の結果では、ス
ルーホール間の絶縁抵抗は１０8Ω以上であった。Example 3 To 145 g of the resin composition obtained in Example 1, 500 g of the flake silver powder used in Example 1, 300 g of copper powder and 70 g of alumina powder were added, and the same procedure as in Example 1 was performed. A conductive paste was obtained by mixing and dispersing. A wiring board was manufactured through the same steps as in Example 1 and the characteristics thereof were evaluated. As a result, the resistance of the through holes was 19 mΩ / hole, and the insulation resistance between the through holes was 10 8 Ω or more. As a result of the thermal shock test of the wiring board, the resistance of the through holes was 22 mΩ / hole, and the result of the wet and medium load test showed that the insulation resistance between the through holes was 10 8 Ω or more.
【００１５】比較例１ 実施例１で得た樹脂組成物１４５ｇに実施例１で用いた
銀粉を１０００ｇ加えて実施例１と同様の方法で均一に
混合分散して導電ペーストを得た。以下実施例１と同様
の工程を経て配線板を作製してその特性を評価した。そ
の結果、スルーホールの抵抗は２２ｍΩ／穴であり、ス
ルーホール間の絶縁抵抗は１０8Ω以上であった。また
該配線板の冷熱衝撃試験を実施した結果、スルーホール
の抵抗は２８ｍΩ／穴であり、湿中負荷試験の結果で
は、スルーホール間の絶縁抵抗は配線板５枚のうち１枚
１０7Ω台に低下しているものがあった。Comparative Example 1 To 145 g of the resin composition obtained in Example 1, 1000 g of the silver powder used in Example 1 was added and uniformly mixed and dispersed in the same manner as in Example 1 to obtain a conductive paste. A wiring board was manufactured through the same steps as in Example 1 and the characteristics thereof were evaluated. As a result, the resistance of the through holes was 22 mΩ / hole, and the insulation resistance between the through holes was 10 8 Ω or more. As a result of a thermal shock test of the wiring board, the resistance of the through hole was 28 mΩ / hole, and the result of the wet and medium load test showed that the insulation resistance between the through holes was 10 7 Ω per one of the five wiring boards. There was something that was falling on the table.
【００１６】[0016]
【発明の効果】本発明になる導電ペーストは銀の含有量
が少なくても配線板におけるスルーホールの抵抗が低い
高導電性のペーストであり、また湿中負荷試験後におけ
るスルーホール間の絶縁抵抗の低下が小さく、さらにフ
レーク状銀粉、銅粉及びセラミックス粉を併用すること
により銀の使用量を少なくできるなど経済的にも優れた
導電ペーストである。EFFECT OF THE INVENTION The conductive paste according to the present invention is a highly conductive paste having a low through-hole resistance in a wiring board even if the content of silver is low, and the insulation resistance between the through-holes after a wet and medium load test. The conductive paste is economically excellent in that the use amount of silver can be reduced by using flake-shaped silver powder, copper powder and ceramics powder together.
【図１】紙フェノール銅張積層板に導電ペーストを印刷
すると共にスルーホールに充てんした状態を示す平面図
である。FIG. 1 is a plan view showing a state in which a conductive paste is printed on a paper phenol copper clad laminate and the through holes are filled.
１ スルーホール ２ 紙フェノール銅張積層板 1 Through hole 2 Paper phenol copper clad laminate
Claims (1)
粉を含む導電ペースト。1. A conductive paste containing flake-shaped silver powder, copper powder and ceramics powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12709893A JPH06338218A (en) | 1993-05-28 | 1993-05-28 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12709893A JPH06338218A (en) | 1993-05-28 | 1993-05-28 | Conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06338218A true JPH06338218A (en) | 1994-12-06 |
Family
ID=14951542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12709893A Pending JPH06338218A (en) | 1993-05-28 | 1993-05-28 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06338218A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6376052B1 (en) | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its production process, resin composition for filling through-hole |
| WO2006129487A1 (en) * | 2005-05-30 | 2006-12-07 | Sumitomo Electric Industries, Ltd. | Conductive paste and multilayer printed wiring board using same |
| CN107274964A (en) * | 2017-06-30 | 2017-10-20 | 江苏瑞德新能源科技有限公司 | A kind of passivation emitter back silver paste of solar cell |
-
1993
- 1993-05-28 JP JP12709893A patent/JPH06338218A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6376052B1 (en) | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its production process, resin composition for filling through-hole |
| US6376049B1 (en) | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| USRE40947E1 (en) | 1997-10-14 | 2009-10-27 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| WO2006129487A1 (en) * | 2005-05-30 | 2006-12-07 | Sumitomo Electric Industries, Ltd. | Conductive paste and multilayer printed wiring board using same |
| JP5141249B2 (en) * | 2005-05-30 | 2013-02-13 | 住友電気工業株式会社 | Conductive paste and multilayer printed wiring board using the same |
| TWI413474B (en) * | 2005-05-30 | 2013-10-21 | Sumitomo Electric Industries | Multilayer printing wiring plate |
| US8617688B2 (en) | 2005-05-30 | 2013-12-31 | Sumitomo Electric Industries, Ltd. | Conductive paste and multilayer printed wiring board using the same |
| CN107274964A (en) * | 2017-06-30 | 2017-10-20 | 江苏瑞德新能源科技有限公司 | A kind of passivation emitter back silver paste of solar cell |
| CN107274964B (en) * | 2017-06-30 | 2018-10-12 | 江苏瑞德新能源科技有限公司 | A kind of passivation emitter back silver paste of solar cell |
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