JPH07297562A - Junction box and its substrate assembly - Google Patents

Junction box and its substrate assembly

Info

Publication number
JPH07297562A
JPH07297562A JP6102049A JP10204994A JPH07297562A JP H07297562 A JPH07297562 A JP H07297562A JP 6102049 A JP6102049 A JP 6102049A JP 10204994 A JP10204994 A JP 10204994A JP H07297562 A JPH07297562 A JP H07297562A
Authority
JP
Japan
Prior art keywords
pcbs
junction box
insulating separator
substrate assembly
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6102049A
Other languages
Japanese (ja)
Other versions
JP3606471B2 (en
Inventor
Chel Sab Lee
リー・チェル・サブ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Priority to JP10204994A priority Critical patent/JP3606471B2/en
Priority to TW084100197A priority patent/TW254008B/en
Priority to CN95104206A priority patent/CN1112354A/en
Priority to KR1019950008739A priority patent/KR100264849B1/en
Priority to MYPI95000968A priority patent/MY114673A/en
Publication of JPH07297562A publication Critical patent/JPH07297562A/en
Application granted granted Critical
Publication of JP3606471B2 publication Critical patent/JP3606471B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connection Or Junction Boxes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

PURPOSE: To provide a junction box and a board assembly thereof, which allow simplified construction, low cost and easy assembling. CONSTITUTION: A junction box 10 comprises a housing 20 and a board assembly 30 held in the housing 20. The board assembly 30 has at least two PCBs 31 and 32 with same dimensional shape, and an intermediate insulating separator 50 and a connecting pin 40. Many through holes 34 and 35 are formed along at least one edge of PCBs 31 and 32 and the connecting pin 40 is inserted, so that, for example, they are integrated electrically and mechanically by soldering. A gap between PCBs 31 and 32 is determined by height of a rib 52 formed on an edge of the insulating separator 50.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は電気配線装置、特に自動
車等の電気的配線部に使用されるジャンクションボック
ス及びその基板組立体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric wiring device, and more particularly to a junction box used in an electric wiring portion of an automobile or the like and a board assembly thereof.

【０００２】[0002]

【従来の技術】エレクトロニクス（電子技術）は各種機
器及びシステムに益々広範囲に使用されている。その典
型例は自動車である。半導体技術の著しい進歩の結果、
マイクロプロセッサが自動車に応用され、エンジン、サ
イドミラー、窓、安全装置及びオーディオ機器等の制御
を行っている。この為に、自動車には電源や信号用の多
くの配線がなされ、組立、保守サービス及び安全性の便
宜又は改善の為に種々のコネクタやヒューズ等の各種電
気及び機構部品を必要とする。2. Description of the Related Art Electronics are being used more and more widely in various devices and systems. A typical example is an automobile. As a result of significant advances in semiconductor technology,
Microprocessors are applied to automobiles to control engines, side mirrors, windows, safety devices and audio equipment. For this reason, many wirings for electric power and signals are provided in an automobile, and various electric and mechanical parts such as various connectors and fuses are required for convenience or improvement of assembly, maintenance service and safety.

【０００３】従来のジャンクションボックスでは、10Ａ
以上の大電流容量を必要とする配線もあるので、十分な
電流容量を得る為に絶縁板上に十分な厚さを有する所望
形状の銅板を直接被着したものが一般的であった。In the conventional junction box, 10A
Since some wirings require a large current capacity as described above, it is common to directly deposit a copper plate of a desired shape having a sufficient thickness on an insulating plate in order to obtain a sufficient current capacity.

【０００４】或は、１枚以上の基板（プリント基板，即
ちＰＣＢ）をジャンクションボックスの主要部品として
使用することも提案されている。斯る別のジャンクショ
ンボックスの典型例は特公昭60-7448 号公報に開示され
ている。例えば２枚のＰＣＢが平行関係でハウジング内
に収められ、その１端縁を受けるフォーク状コンタクト
を有する一連の端子により相互接続されると共に、ハウ
ジング外へ突出する接触又は接続部を具えている。この
フォーク状コンタクトはＰＣＢの端縁に形成されている
トレースと接触して電気的な相互接続を行う。Alternatively, it has been proposed to use one or more substrates (printed circuit boards, or PCBs) as main components of the junction box. A typical example of such another junction box is disclosed in Japanese Patent Publication No. 60-7448. For example, two PCBs are housed in a parallel relationship within a housing, interconnected by a series of terminals having forked contacts that receive one edge of the PCB, and have contacts or connections protruding outside the housing. The fork-shaped contacts make contact with the traces formed on the edges of the PCB for electrical interconnection.

【０００５】[0005]

【発明の解決課題】上述した前者の従来例にあっては、
それを流れる電流の大きさに最適の銅（又は導電性金
属）板の厚さ及び幅（即ち断面積）が選定できるので、
発生するジュール熱（Ｉ2 Ｒ）が過度となり異常温度上
昇を避けることができる。しかし、電流の大きさに応じ
て異なる厚さや幅の銅板を所望形状（パターン）に形成
した多数の導体路を絶縁板上に被着するのは複雑且つ高
価であるという欠点があった。In the former conventional example described above,
Since the thickness and width (that is, the cross-sectional area) of the copper (or conductive metal) plate that is optimal for the magnitude of the current flowing through it can be selected,
The generated Joule heat (I 2 R) becomes excessive and an abnormal temperature rise can be avoided. However, there is a drawback in that it is complicated and expensive to deposit a large number of conductor paths in which copper plates having different thicknesses and widths are formed in a desired shape (pattern) according to the magnitude of current on the insulating plate.

【０００６】他方、上述した後者の従来例にあっては、
十分に確立したプリント回路基板技術を使用するので、
比較的安価であり、しかも必要に応じて導体パターンの
変更も容易である。しかし、ＰＣＢの銅箔は極めて薄
く、十分大きな電流容量を得ることは困難であり、或い
は大電流の為に大きな表面積を必要とするので、多数の
導電路の形成と発熱の抑制が困難であるという問題があ
った。その為に複数のＰＣＢを重ねて使用するが、それ
を電気的且つ機械的に一体化するのは困難であった。On the other hand, in the latter conventional example described above,
Using well established printed circuit board technology,
It is relatively inexpensive, and the conductor pattern can be easily changed if necessary. However, the copper foil of PCB is extremely thin and it is difficult to obtain a sufficiently large current capacity, or a large surface area is required for a large current, so it is difficult to form a large number of conductive paths and suppress heat generation. There was a problem. Therefore, a plurality of PCBs are used in a stacked manner, but it is difficult to integrate them electrically and mechanically.

【０００７】従って、本発明の目的は、一定間隔で平行
関係に電気的且つ機械的に一体化した複数のＰＣＢを使
用し、安価且つ製造が容易であるジャンクションボック
スを提供することである。[0007] Therefore, an object of the present invention is to provide a junction box which uses a plurality of PCBs which are electrically and mechanically integrated in parallel relation at regular intervals and which is inexpensive and easy to manufacture.

【０００８】本発明の他の目的は、絶縁セパレータを介
して電気的且つ機械的に一体化した複数のＰＣＢより成
る基板組立体を提供することである。Another object of the present invention is to provide a substrate assembly comprising a plurality of PCBs that are electrically and mechanically integrated via an insulating separator.

【０００９】[0009]

【課題解決の為の手段】従来のジャンクションボックス
の上述した問題を解決すると共に、上述の目的を達成す
る為に、本発明のジャンクションボックスは少なくとも
２枚のＰＣＢを含む基板組立体と、この基板組立体を収
容する絶縁ハウジングとより成る。この基板組立体は少
なくとも１縁に沿って多数のスルーホールが形成された
実質的に同一寸法形状の複数のＰＣＢと、これらＰＣＢ
間に間挿される絶縁セパレータと、これらのＰＣＢのス
ルーホールに挿通され例えば半田付される多数の接続ピ
ンとを具え、複数のＰＣＢを所定間隔で平行関係に維持
して電気的且つ機械的に一体化する。絶縁セパレータは
実質的にＰＣＢと同じ寸法形状（但し、幅が僅かに狭
い）であり、薄い平板状の本体部と、少なくともその長
手方向の側縁に形成された一定高さのリブとを有する。
このリブの高さが重ね合わされるＰＣＢ間の間隔を決定
する。In order to solve the above-mentioned problems of the conventional junction box and to achieve the above-mentioned object, the junction box of the present invention includes a board assembly including at least two PCBs and the board assembly. And an insulating housing that houses the assembly. The board assembly includes a plurality of substantially identically sized PCBs having a number of through holes formed along at least one edge thereof.
It is equipped with an insulating separator interposed between them and a large number of connecting pins that are inserted into the through holes of these PCBs and soldered, for example, to maintain a plurality of PCBs in parallel relationship at a predetermined interval and to integrate them electrically and mechanically. Turn into. The insulating separator has substantially the same size and shape as the PCB (however, the width is slightly narrow), and has a thin flat plate-shaped main body and ribs having a constant height formed at least on the longitudinal side edges thereof. .
The height of this rib determines the spacing between the stacked PCBs.

【００１０】[0010]

【実施例】次に、本発明のジャンクションボックス及び
その基板組立体の好適実施例を添付図を参照して詳細に
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the junction box and its substrate assembly of the present invention will now be described in detail with reference to the accompanying drawings.

【００１１】図１は本発明によるジャンクションボック
スの好適実施例の簡略斜視図である。このジャンクショ
ンボックス10は絶縁ハウジング20と、この内部に収容さ
れる基板組立体30とより成る。絶縁ハウジング20は適当
な耐熱性プラスチック材料をモールドすることにより形
成される下側ハウジング部20a と上側ハウジング部20b
とより成る。図示せずも、両ハウジング部20a 、20b は
好ましくは周知の複数のラッチ部材（例えば凹凸ラッチ
係合部）により相互に取外し可能に結合される。FIG. 1 is a simplified perspective view of a preferred embodiment of a junction box according to the present invention. The junction box 10 includes an insulating housing 20 and a board assembly 30 housed inside the insulating housing 20. Insulation housing 20 is formed by molding a suitable heat resistant plastic material into a lower housing portion 20a and an upper housing portion 20b.
Consists of Although not shown, the two housing parts 20a, 20b are preferably releasably coupled to each other by a plurality of known latch members (eg, concave and convex latch engagement parts).

【００１２】図１に示す特定実施例の基板組立体30は、
１対の同一寸法形状のＰＣＢ31、32及びこれらＰＣＢ3
1、32を一定間隔に重ね合わせる絶縁セパレータ（又は
スペーサ）50を含んでいる。各ＰＣＢ31、32は少なくと
も１主面に複数の所望パターンのトレース（図示せず）
が形成され、且つ少なくとも１縁（この特定実施例では
長手方向の１側縁）に沿って多数のスルーホール34、35
が形成される。ＰＣＢ31、32は、この特定実施例では略
矩形である。The particular embodiment substrate assembly 30 shown in FIG.
A pair of PCBs 31 and 32 having the same size and shape and these PCBs 3
It includes an insulating separator (or spacer) 50 in which 1, 32 are superposed at regular intervals. Each PCB 31, 32 has a plurality of desired pattern traces (not shown) on at least one major surface
And a number of through holes 34, 35 along at least one edge (one longitudinal edge in this particular embodiment).
Is formed. The PCBs 31, 32 are generally rectangular in this particular embodiment.

【００１３】絶縁セパレータ50は好ましくは耐熱性プラ
スチック材料をモールドして製造される。この絶縁セパ
レータ50はＰＣＢ31、32と実質的に同一寸法形状である
が、僅かに狭い。この絶縁セパレータ50は薄い平板状の
中心部51と長手方向の両側縁に沿うリブ52とを有する。
このリブ52は均一の高さを有し、重ね合わされるＰＣＢ
31、32間の間隔を決定する。The insulating separator 50 is preferably manufactured by molding a heat resistant plastic material. The insulating separator 50 is substantially the same size and shape as the PCBs 31, 32, but is slightly narrower. This insulating separator 50 has a thin flat plate-shaped central portion 51 and ribs 52 along both side edges in the longitudinal direction.
The ribs 52 have a uniform height and are stacked on the PCB
Determine the spacing between 31 and 32.

【００１４】複数の接続ピン40が両ＰＣＢ31、32のアラ
イメント（位置合わせ）されたスルーホール34、35に挿
入され、この特定実施例では従来方法、例えばフローソ
ルダ技法によりスルーホール34、35の周囲のパッド（図
示せず）に半田付けされＰＣＢ31、32を一定間隔で平行
状態に維持して一体化する。このＰＣＢ31、32を絶縁セ
パレータ50を介して接続ピン40により半田付けして重ね
合わせした基板組立体30は絶縁ハウジング20内に収容さ
れる。A plurality of connection pins 40 are inserted into the aligned through holes 34, 35 of both PCBs 31, 32, and in this particular embodiment, the perimeter of the through holes 34, 35 is made by conventional methods, eg, flow soldering techniques. Soldered to a pad (not shown), the PCBs 31 and 32 are integrated at a constant interval while maintaining a parallel state. The board assembly 30 in which the PCBs 31 and 32 are soldered together by the connecting pins 40 via the insulating separator 50 and overlapped with each other is housed in the insulating housing 20.

【００１５】尚、図１には図示しないが、複数のタブ
（雄型）コンタクト又はリセプタクル（雌型）コンタク
トがＰＣＢ31、32の外面に植立され、ＰＣＢ31、32の表
面の回路トレースに半田付され、上側又は下側ハウジン
グ20a 、20b の開口を介して電気コネクタ、ブレードヒ
ューズ等と電気的接続される。絶縁ハウジング20a 、20
b の開口のいくつかは、参照符号22で示す。電気コネク
タは絶縁ハウジング20bの凹部23を介して接続可能であ
る。Although not shown in FIG. 1, a plurality of tab (male) contacts or receptacle (female) contacts are planted on the outer surfaces of the PCBs 31, 32 and soldered to the circuit traces on the surfaces of the PCBs 31, 32. And is electrically connected to an electrical connector, a blade fuse or the like through the openings of the upper or lower housings 20a and 20b. Insulation housing 20a, 20
Some of the b openings are designated by the reference numeral 22. The electrical connector can be connected through the recess 23 of the insulating housing 20b.

【００１６】図２は１対のＰＣＢ31、32、絶縁セパレー
タ50及び多数の接続ピン40より成る基板組立体30の一実
施例の分解斜視図を示す。図３（Ａ）及び（Ｂ）は夫々
絶縁セパレータ50の斜視図及び正面図である。図２及び
図３から明らかな如く、絶縁セパレータ50はＰＣＢ31、
32と実質的に同じ寸法形状であるが僅かに幅が狭い。こ
の絶縁セパレータ50は略平坦且つ薄い中央部51と、その
長手方向両側縁に形成された均一な高さのリブ52を具
え、中央平坦部51には所望形状の複数の開口53が形成さ
れてもよい。このリブ52は重ね合わされるＰＣＢ31、32
間の間隔を決定する作用をする。中央平坦部51はリブ52
の中間に結合され、この中央平坦部51の両主面（表面）
からリブ52が上下に等しく延びるように形成するのが好
ましい。FIG. 2 shows an exploded perspective view of one embodiment of a substrate assembly 30 consisting of a pair of PCBs 31, 32, an insulating separator 50 and a number of connecting pins 40. 3A and 3B are a perspective view and a front view of the insulating separator 50, respectively. As is apparent from FIGS. 2 and 3, the insulating separator 50 is a PCB 31,
It has the same size and shape as 32, but is slightly narrower. This insulating separator 50 comprises a substantially flat and thin central portion 51 and ribs 52 of uniform height formed on both side edges in the longitudinal direction thereof. Good. The ribs 52 are the PCBs 31 and 32 to be overlaid.
Acts to determine the spacing between. Central flat part 51 is rib 52
Both main surfaces (front surface) of this central flat portion 51 are joined to the middle of
It is preferable that the ribs 52 are formed so as to extend equally up and down.

【００１７】このように絶縁セパレータ50の寸法形状を
ＰＣＢ31、32の寸法形状と略同じであり僅かに狭くする
ことにより、両ＰＣＢ31、32を一定間隔、即ち平行状態
に積層すると共にリブ52の側縁に沿って接続ピン40を配
置するスペースを得ることが可能である。また、絶縁セ
パレータ50の中央平坦部51は両ＰＣＢ31、32の内面から
離間すると共に、平坦部51の開口53により、両ＰＣＢ3
1、32の発熱を効果的に放熱することが可能になる。By making the size and shape of the insulating separator 50 substantially the same as the size and shape of the PCBs 31 and 32 and slightly narrowing them as described above, both the PCBs 31 and 32 are laminated at a constant interval, that is, in a parallel state, and the side of the rib 52 is formed. It is possible to have space along the edge to place the connecting pin 40. Further, the central flat portion 51 of the insulating separator 50 is separated from the inner surfaces of both the PCBs 31 and 32, and the openings 53 of the flat portion 51 allow the two flat PCBs 3 to be formed.
It becomes possible to effectively dissipate the heat of 1 and 32.

【００１８】接続ピン40は断面が略円形又は四角形であ
る従来設計の棒状ピンであってもよい。斯る接続ピン40
は従来の半田技術によりスルーホール34、35に半田付さ
れる。尚、この変形例として、接続ピンは特公平3-5443
5 号公報に開示する如く、その長手方向に分離する位置
にコンプライアント（弾性）部分41、42を有する従来の
コンプライアント型接続ピン40' であってもよい。斯る
変形接続ピン40' はアライメントされたスルーホール3
4、35内に強制的に圧入して両ＰＣＢ31、32を電気的及
び機械的に一体化することによりＰＣＢ31、32と接続ピ
ン41' 間の半田付接続を排除し、作業性を改善すること
が可能である（図４参照）。コンプライアント型接続ピ
ン40' は圧入作業の便宜上リードイン（導入）部43及び
ノッチ（切り欠き）部44を有し、接続ピン40' をスルー
ホール34、35に圧入後にノッチ部44で切断又は折り取る
ようにするのが好ましい。The connecting pin 40 may be a rod pin of conventional design having a substantially circular or square cross section. Such connection pin 40
Are soldered to the through holes 34, 35 by the conventional soldering technique. As a modified example, the connection pin is Japanese Patent Publication No. 3-5443.
As disclosed in Japanese Patent Laid-Open No. 5 (1994), it may be a conventional compliant connecting pin 40 'having compliant (elastic) portions 41, 42 at positions separated in the longitudinal direction. Such modified connecting pins 40 'are aligned with the through holes 3
By forcibly press-fitting into PCBs 4 and 35 to electrically and mechanically integrate both PCBs 31 and 32, eliminating soldering connection between PCBs 31 and 32 and connecting pin 41 ', and improving workability. Is possible (see FIG. 4). The compliant-type connecting pin 40 'has a lead-in (introduction) part 43 and a notch (notch) part 44 for the convenience of press-fitting work, and after the connecting pin 40' is press-fitted into the through holes 34, 35, it is cut at the notch part 44 or It is preferable to break it off.

【００１９】図５は本発明による基板組立体の別の実施
例であって、３枚のＰＣＢ31、32、33と、２枚の絶縁セ
パレータ50、55より成る。この実施例の基板組立体30'
はＰＣＢ31、32間に第３のＰＣＢ33を間挿することによ
り、別の導電路が形成でき、導電路数を増加すると共に
必要に応じて特定導電路を大きくし或は複数の導電路を
並列接続して電流容量を増加し、抵抗を減少することに
より発熱量を低減することが可能になる。FIG. 5 shows another embodiment of the substrate assembly according to the present invention, which comprises three PCBs 31, 32 and 33 and two insulating separators 50 and 55. The substrate assembly 30 'of this embodiment
By inserting a third PCB 33 between the PCBs 31 and 32, another conductive path can be formed, and the number of conductive paths can be increased and a specific conductive path can be enlarged or a plurality of conductive paths can be arranged in parallel. It is possible to reduce the amount of heat generated by connecting them to increase the current capacity and reduce the resistance.

【００２０】図６は更に別の基板組立体の例を示す。図
６（Ａ）はＰＣＢ31' を、（Ｂ）は絶縁セパレータ50'
を示す平面図である。これらＰＣＢ31' 及び絶縁セパレ
ータ50' は非矩形状であることを特徴とする。ＰＣＢ3
1' と絶縁セパレータ50' は略同一寸法形状である。Ｐ
ＣＢ31' はその長手方向の１縁に沿って接続ピンが挿入
される一連のスルーホールが例えば約５mm間隔で形成さ
れている。この実施例においても、絶縁セパレータ50'
の長手方向両側縁にリブ52' が形成されている。FIG. 6 shows another example of the substrate assembly. 6A shows a PCB 31 ', and FIG. 6B shows an insulating separator 50'.
FIG. The PCB 31 'and the insulating separator 50' are characterized by having a non-rectangular shape. PCB3
The 1'and the insulating separator 50 'have substantially the same size and shape. P
The CB31 'has a series of through holes formed along one longitudinal edge thereof, into which connection pins are inserted, at intervals of, for example, about 5 mm. Also in this embodiment, the insulating separator 50 '
Ribs 52 'are formed on both side edges in the longitudinal direction.

【００２１】以上、本発明のジャンクションボックス及
び基板組立体の好適実施例を図示し説明したが、本発明
は斯る実施例のみに限定されるものではない。従って、
本発明は用途に応じて種々の変形変更が可能である。例
えば絶縁セパレータのリブは全周に形成してもよく、ま
た必ずしも連続でなく、均一な高さである限り不連続に
形成されてもよい。Although the preferred embodiments of the junction box and substrate assembly of the present invention have been shown and described above, the present invention is not limited to such embodiments. Therefore,
The present invention can be variously modified and changed according to the application. For example, the ribs of the insulating separator may be formed on the entire circumference, and are not necessarily continuous, and may be formed discontinuously as long as they have a uniform height.

【００２２】[0022]

【発明の効果】上述の説明から理解される如く、本発明
のジャンクションボックスは絶縁ハウジング内に収容さ
れる一体化された基板組立体を使用するので、構造が簡
単であり、組立製造が容易であるので安価となる。また
基板組立体は同一寸法形状の複数のＰＣＢをリブ付き絶
縁セパレータを介して重ね合わせて多数の連続ピンによ
り平行関係で電気的且つ機械的に一体化するので取扱が
簡単である。従って、周知のＰＣＢ技術を用いて特定用
途に適合するジャンクションボックスが容易且つ安価に
実現可能である。また、スルーホールに沿って絶縁セパ
レータのリブが配置されるので、半田付作業時に異物が
ＰＣＢ間に侵入するのを阻止することができる等の実用
上の顕著な効果を有する。As can be understood from the above description, since the junction box of the present invention uses the integrated substrate assembly housed in the insulating housing, it has a simple structure and is easy to assemble and manufacture. It is cheap because it is available. Further, the substrate assembly is easy to handle because a plurality of PCBs having the same size and shape are superposed via the ribbed insulating separator and are electrically and mechanically integrated in parallel by a large number of continuous pins. Therefore, it is possible to easily and inexpensively realize a junction box adapted to a specific application by using the well-known PCB technology. Further, since the ribs of the insulating separator are arranged along the through holes, there is a remarkable practical effect that foreign matter can be prevented from entering between the PCBs during the soldering work.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明によるジャンクションボックスの好適実
施例の分解斜視図。FIG. 1 is an exploded perspective view of a preferred embodiment of a junction box according to the present invention.

【図２】本発明の基板組立体の一実施例の分解斜視図。FIG. 2 is an exploded perspective view of an embodiment of the board assembly of the present invention.

【図３】図２の基板組立体に使用される絶縁セパレータ
を示し、（Ａ）は斜視図、（Ｂ）は正面図。3A and 3B show an insulating separator used in the substrate assembly of FIG. 2, FIG. 3A being a perspective view and FIG. 3B being a front view.

【図４】コンプライアント型接続ピンを使用する基板組
立体の変形例の部分断面図。FIG. 4 is a partial cross-sectional view of a modified example of a substrate assembly using a compliant connecting pin.

【図５】基板組立体の更に別の実施例の斜視図。FIG. 5 is a perspective view of still another embodiment of the board assembly.

【図６】他の実施例の基板組立体の図であり、（Ａ）は
ＰＣＢの平面図、（Ｂ）は絶縁セパレータの平面図。6A and 6B are views of a substrate assembly according to another embodiment, FIG. 6A is a plan view of a PCB, and FIG. 6B is a plan view of an insulating separator.

【符号の説明】[Explanation of symbols]

10 ジャクションボックス 20 ハウジング 30、30' 基板組立体 31、31' 、32、33 基板（ＰＣＢ） 40、40' 接続ピン 50、50' 絶縁セパレータ 52 リブ 10 Junction box 20 Housing 30, 30 'Substrate assembly 31, 31', 32, 33 Substrate (PCB) 40, 40 'Connecting pin 50, 50' Insulation separator 52 Rib

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 相互に略平行関係で電気的且つ機械的に
一体化された少なくとも２枚の基板を含む基板組立体
と、 該基板組立体を収容する絶縁ハウジングとを具え、 前記基板組立体は、前記少なくとも２枚の基板を絶縁セ
パレータを介して相互に重ね合わせ、前記基板の少なく
とも１縁に沿って形成された多数のスルーホールに多数
の接続ピンを挿入して形成されることを特徴とするジャ
ンクションボックス。1. A substrate assembly comprising: a substrate assembly including at least two substrates that are electrically and mechanically integrated in a substantially parallel relationship with each other; and an insulating housing that houses the substrate assembly. Is formed by stacking the at least two substrates on each other via an insulating separator and inserting a large number of connection pins into a large number of through holes formed along at least one edge of the substrates. And a junction box. 【請求項２】 相互に同一寸法形状であり且つ少なくと
も１縁に沿って多数のスルーホールが形成されている少
なくとも２枚の基板と、 該基板より僅かに狭く、中央部が薄い平板状であり両側
縁に沿って一定高さのリブが形成され、前記基板間に配
置される絶縁セパレータと、 前記絶縁セパレータを介して重ね合わされた前記基板の
前記スルーホールに挿入される多数の接続ピンとを具
え、 該接続ピンにより前記基板を前記絶縁セパレータの前記
リブの高さで決まる間隔に保持して電気的且つ機械的に
一体化することを特徴とするジャンクションボックス用
基板組立体。2. At least two substrates having the same size and shape as each other and having a large number of through holes formed along at least one edge, and a flat plate shape which is slightly narrower than the substrates and whose central portion is thin. A rib having a constant height is formed along both side edges, and includes an insulating separator disposed between the substrates, and a plurality of connecting pins inserted into the through holes of the substrate that are stacked via the insulating separator. A substrate assembly for a junction box, characterized in that the connection pin holds the substrate at an interval determined by the height of the rib of the insulating separator to electrically and mechanically integrate the substrate.
JP10204994A 1994-04-15 1994-04-15 Junction box Expired - Fee Related JP3606471B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP10204994A JP3606471B2 (en) 1994-04-15 1994-04-15 Junction box
TW084100197A TW254008B (en) 1994-04-15 1995-01-11 Junction box and PCB assembly therefor
CN95104206A CN1112354A (en) 1994-04-15 1995-04-13 Junction box and PCB assembly therefor
KR1019950008739A KR100264849B1 (en) 1994-04-15 1995-04-14 Junction box and pcb assembly therefor
MYPI95000968A MY114673A (en) 1994-04-15 1995-04-14 Electrical junction box and circuit board assembly therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10204994A JP3606471B2 (en) 1994-04-15 1994-04-15 Junction box

Publications (2)

Publication Number Publication Date
JPH07297562A true JPH07297562A (en) 1995-11-10
JP3606471B2 JP3606471B2 (en) 2005-01-05

Family

ID=14316916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10204994A Expired - Fee Related JP3606471B2 (en) 1994-04-15 1994-04-15 Junction box

Country Status (5)

Country Link
JP (1) JP3606471B2 (en)
KR (1) KR100264849B1 (en)
CN (1) CN1112354A (en)
MY (1) MY114673A (en)
TW (1) TW254008B (en)

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US6905348B2 (en) 2003-06-13 2005-06-14 Sumitomo Wiring Systems, Ltd. Circuit-connecting structure including a terminal piece
US7101197B2 (en) 2003-06-13 2006-09-05 Sumitomo Wiring Systems, Ltd. Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box
DE102008030357A1 (en) 2007-07-17 2009-01-22 Sumitomo Wiring Systems, Ltd., Yokkaichi Interconnect structure for boards and connectors
US7549873B2 (en) 2007-07-17 2009-06-23 Sumitomo Wiring Systems, Ltd. Electrical junction box
KR200451959Y1 (en) * 2008-08-13 2011-01-21 영화테크(주) Assembling Structure of Junction Box
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US9078378B2 (en) 2012-07-04 2015-07-07 Hyundai Motor Company Heat emission device for junction box printed circuit board
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KR100458750B1 (en) * 2002-11-14 2004-12-03 히로세코리아 주식회사 Hybrid junction Box
WO2004112210A1 (en) 2003-06-13 2004-12-23 Sumitomo Wiring Systems, Ltd. Electric junction box and its assembling process
US6905348B2 (en) 2003-06-13 2005-06-14 Sumitomo Wiring Systems, Ltd. Circuit-connecting structure including a terminal piece
US7101197B2 (en) 2003-06-13 2006-09-05 Sumitomo Wiring Systems, Ltd. Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box
US7247031B2 (en) 2003-06-13 2007-07-24 Sumitomo Wiring Systems, Ltd. Electric junction box and its assembling process
DE102008030357A1 (en) 2007-07-17 2009-01-22 Sumitomo Wiring Systems, Ltd., Yokkaichi Interconnect structure for boards and connectors
US7549873B2 (en) 2007-07-17 2009-06-23 Sumitomo Wiring Systems, Ltd. Electrical junction box
US7687715B2 (en) 2007-07-17 2010-03-30 Sumitomo Wiring Systems, Ltd. Interconnection structure for circuit boards and terminal members
KR200451959Y1 (en) * 2008-08-13 2011-01-21 영화테크(주) Assembling Structure of Junction Box
JP2012120318A (en) * 2010-11-30 2012-06-21 Sumitomo Wiring Syst Ltd Electric connection box
JP2013102626A (en) * 2011-11-09 2013-05-23 Sumitomo Wiring Syst Ltd Printed board laminate
US9078378B2 (en) 2012-07-04 2015-07-07 Hyundai Motor Company Heat emission device for junction box printed circuit board
EP2757863A2 (en) 2013-01-17 2014-07-23 Sumitomo Wiring Systems, Ltd. Printed circuit board stack
DE102014217048A1 (en) 2013-08-30 2015-03-05 Yazaki Corporation pin header
US9203170B2 (en) 2013-08-30 2015-12-01 Yazaki Corporation Pin header
JP2016092926A (en) * 2014-10-31 2016-05-23 株式会社フジクラ Electric connection box
CN105161879A (en) * 2015-09-24 2015-12-16 上海埃而生电气有限公司 Multilayer PCB (Printed Circuit Board) central distribution box

Also Published As

Publication number Publication date
MY114673A (en) 2002-12-31
TW254008B (en) 1995-08-11
CN1112354A (en) 1995-11-22
KR950035555A (en) 1995-12-30
JP3606471B2 (en) 2005-01-05
KR100264849B1 (en) 2000-09-01

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