JPH07297237A - Manufacture of tape carrier for tab - Google Patents
Manufacture of tape carrier for tabInfo
- Publication number
- JPH07297237A JPH07297237A JP10894394A JP10894394A JPH07297237A JP H07297237 A JPH07297237 A JP H07297237A JP 10894394 A JP10894394 A JP 10894394A JP 10894394 A JP10894394 A JP 10894394A JP H07297237 A JPH07297237 A JP H07297237A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- treatment
- tin
- tape
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はＴＡＢ用テープキャリア
の製造方法に関し、特に、めっき処理中に発生する錫ヒ
ゲによるリード間のショート不良の懸念をなくして、信
頼性を向上させたＴＡＢ用テープキャリアの製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a TAB tape carrier, and more particularly, to a TAB tape having improved reliability by eliminating the possibility of short-circuiting between leads due to tin whiskers generated during plating. The present invention relates to a method for manufacturing a carrier.
【０００２】[0002]
【従来の技術】一般的なＴＡＢ用テープキャリアとし
て、例えば、図１に示すような構造のものがある。この
ＴＡＢ用テープキャリアは、接着剤付ポリイミドテープ
１と、その接着剤を介してポリイミドテープ１の表面に
貼着された配線パターン５より構成されている。2. Description of the Related Art A typical TAB tape carrier has, for example, a structure as shown in FIG. This TAB tape carrier is composed of an adhesive-attached polyimide tape 1 and a wiring pattern 5 attached to the surface of the polyimide tape 1 via the adhesive.
【０００３】接着剤付ポリイミドテープ１は、搬送時に
位置決めを行うスプロケットホール２と、半導体素子
（図示せず）が搭載されるデバイスホール３と、後述す
る入力側アウターリードをプリント基盤に接続するため
のアウターリードスリット４を有して構成されている。The adhesive-attached polyimide tape 1 is for connecting a sprocket hole 2 for positioning during transportation, a device hole 3 for mounting a semiconductor element (not shown), and an input side outer lead described later to a print substrate. The outer lead slit 4 of FIG.
【０００４】配線パターン５は、インナーリード５ａ，
入力側アウターリード５ｂ，及び出力側アウターリード
５ｃを有した所定のパターン形状に形成された構成を有
している。The wiring pattern 5 includes inner leads 5a,
It has a configuration formed in a predetermined pattern having an input outer lead 5b and an output outer lead 5c.
【０００５】従来、上記のＴＡＢ用テープキャリアは、
以下のように製造されている。まず、接着剤付ポリイミ
ドテープ１に、金型成形加工によってスプロケットホー
ル２，デバイスホール３，及びアウターリードスリット
４を形成し、その後、圧延または電解により得た銅箔
（厚さ３５μｍ）をポリイミドテープ１上にラミネート
接着し、接着した銅箔に対して金属エッチングを行い、
所定のパターン形状の配線パターン５を形成する。この
配線パターン５の例としては、２００ピンテープではイ
ンナーリード５ａのピッチは１００μｍ，線幅は５０μ
ｍとなる。次いで、配線パターン５が形成されたポリイ
ミドテープ１（以下、パターン付テープという）を脱
脂，水洗，酸洗，水洗する洗浄工程（前処理）を行い、
パターン付テープの表面を洗浄した後、配線パターン５
にめっき（錫、半田または金）処理を行う。Conventionally, the above-mentioned TAB tape carrier is
It is manufactured as follows. First, a sprocket hole 2, a device hole 3, and an outer lead slit 4 are formed on a polyimide tape 1 with an adhesive by a mold forming process, and then a copper foil (thickness 35 μm) obtained by rolling or electrolysis is formed on the polyimide tape. 1 is laminated and adhered, and the adhered copper foil is subjected to metal etching,
The wiring pattern 5 having a predetermined pattern shape is formed. As an example of the wiring pattern 5, in the 200-pin tape, the inner leads 5a have a pitch of 100 μm and a line width of 50 μm.
m. Next, a cleaning step (pretreatment) of degreasing, washing with water, pickling, and washing with water is performed on the polyimide tape 1 (hereinafter referred to as a patterned tape) on which the wiring pattern 5 is formed,
Wiring pattern 5 after cleaning the surface of the patterned tape
Plating (tin, solder or gold) on.
【０００６】上記した製造方法において、半田および金
めっきは電気めっき方式で行われるのに対して、錫めっ
きは主に無電解めっき方式で行われる。このため、錫め
っきの場合、所定のめっき厚（０．３〜０．６μｍ）を
得るためにパターン付テープを長時間（５〜１０分）、
高温（５０〜７０℃）のめっき浴に浸漬している。ま
た、錫めっきではリード間のショート不良の要因となる
錫ホイスカの発生を防止するために、めっき処理後に熱
処理を行っている。In the above-mentioned manufacturing method, the solder and gold plating are performed by the electroplating method, while the tin plating is mainly performed by the electroless plating method. Therefore, in the case of tin plating, in order to obtain a predetermined plating thickness (0.3 to 0.6 μm), the patterned tape is used for a long time (5 to 10 minutes).
It is immersed in a high temperature (50 to 70 ° C.) plating bath. Further, in the tin plating, heat treatment is performed after the plating treatment in order to prevent the generation of tin whiskers that cause a short circuit between leads.
【０００７】[0007]
【発明が解決しようとする課題】しかし、従来のＴＡＢ
用テープキャリアの製造方法によると、配線パターンに
錫めっきを施す場合、めっき処理中に錫の微小なヒゲが
発生する。これはめっきの析出過程において、不均一に
異常析出点が生じ、それを起点に錫がヒゲ状に体積して
いったものと考えられる。このヒゲはホイスカの成長に
比べて非常に小さいが、長さは大きなもので２０〜３０
μｍのものがあり、リード間のショート不良の要因とし
ては、錫ホイスカと同様に大きな因子となり、ＴＡＢ用
テープキャリアの信頼性を低下させている。However, the conventional TAB
According to the manufacturing method of the tape carrier for use, when tin plating is applied to the wiring pattern, minute whiskers of tin are generated during the plating process. It is considered that this is because abnormal deposition points were unevenly generated in the plating deposition process, and tin was accumulated in the form of whiskers starting from the abnormal deposition points. This beard is much smaller than the growth of whiskers, but the length is 20-30
Some of them have a thickness of μm, and cause a short circuit between leads to be a major factor, like tin whiskers, and reduce the reliability of the TAB tape carrier.
【０００８】従って、本発明の目的はめっき処理中に発
生する錫ヒゲによるリード間のショート不良の懸念をな
くして、信頼性を向上させることができるＴＡＢ用テー
プキャリアの製造方法を提供することである。Therefore, an object of the present invention is to provide a method of manufacturing a TAB tape carrier which can improve reliability by eliminating the possibility of short-circuiting between leads due to tin whiskers occurring during plating. is there.
【０００９】[0009]
【課題を解決するための手段】本発明は上記問題点に鑑
み、めっき処理中に発生する錫ヒゲによるリード間のシ
ョート不良の懸念をなくして、信頼性を向上させるた
め、めっき処理を行った後、熱処理前にパターン付テー
プの表面を超音波洗浄するようにしたＴＡＢ用テープキ
ャリアの製造方法を提供するものである。SUMMARY OF THE INVENTION In view of the above problems, the present invention performs a plating process in order to eliminate the possibility of a short defect between leads due to tin whiskers occurring during the plating process and improve reliability. After that, the present invention provides a method for producing a TAB tape carrier in which the surface of the patterned tape is ultrasonically cleaned before heat treatment.
【００１０】上記めっき処理は、配線パターンに対して
錫の無電解めっきである。また、配線パターンを形成し
た後、めっき処理前にパターン付テープの表面を洗浄す
る所定の洗浄処理工程を行っても良く、更に、超音波洗
浄を行った後、熱処理前にパターン付テープの表面を洗
浄する所定の洗浄処理工程を行っても良い。The above plating treatment is electroless plating of tin on the wiring pattern. In addition, after the wiring pattern is formed, a predetermined cleaning treatment step of cleaning the surface of the patterned tape may be performed before the plating treatment, and after the ultrasonic cleaning, the surface of the patterned tape is treated before the heat treatment. You may perform the predetermined washing process process which wash | cleans.
【００１１】[0011]
【実施例】以下、本発明のＴＡＢ用テープキャリアの製
造方法について詳細に説明する。EXAMPLES The method for manufacturing the TAB tape carrier of the present invention will be described in detail below.
【００１２】絶縁性フィルムテープに所定の配線パター
ンを形成してパターン付テープを得た後、このパターン
付テープに前処理，無電解錫めっき処理，超音波洗浄処
理，後処理，乾燥処理，及び熱処理の各工程を行った。After a predetermined wiring pattern is formed on the insulating film tape to obtain a patterned tape, the patterned tape is subjected to pretreatment, electroless tin plating treatment, ultrasonic cleaning treatment, post-treatment, drying treatment, and Each step of heat treatment was performed.
【００１３】まず、前処理として、パターン付テープを
４０〜５０℃のアルカリ溶液に３０秒〜１分浸漬し、こ
れを室温のイオン水で３０〜１分洗浄した後、室温の過
硫酸カリウム系溶液に３０秒〜１分浸漬し、再度室温の
イオン水で３０秒〜１分水洗した。First, as a pretreatment, the patterned tape is dipped in an alkaline solution at 40 to 50 ° C. for 30 seconds to 1 minute, washed with ionic water at room temperature for 30 to 1 minute, and then potassium persulfate-based at room temperature. It was immersed in the solution for 30 seconds to 1 minute, and washed again with room temperature ion water for 30 seconds to 1 minute.
【００１４】次いで、無電解錫めっき処理としてリール
ＴＯリール方式のめっき装置を使用し、前処理を経たパ
ターン付テープを５０〜７０℃の錫を溶解した有機酸浴
に５〜１０分浸漬して錫めっきを行った。得られた錫め
っきの組成は１００％錫で、厚さは０．３〜０．６μｍ
であった。Next, as the electroless tin plating treatment, a reel TO reel type plating apparatus is used, and the pretreated patterned tape is dipped in an organic acid bath in which tin is dissolved at 50 to 70 ° C. for 5 to 10 minutes. Tin plating was performed. The composition of the obtained tin plating is 100% tin and the thickness is 0.3 to 0.6 μm.
Met.
【００１５】この後、超音波洗浄処理として室温のイオ
ン水を用い、発振周波数４２ｋＨｚで４０〜５０秒、パ
ターン付テープに超音波洗浄を行った。After that, as the ultrasonic cleaning treatment, ion water at room temperature was used, and the patterned tape was ultrasonically cleaned at an oscillation frequency of 42 kHz for 40 to 50 seconds.
【００１６】続いて、後処理として錫めっきが施された
パターン付テープを室温のイオン水で３０秒〜１分水洗
した後、６０〜８０℃の水で３０秒〜３分洗い、再度室
温のイオン水で３０秒〜１分水洗した。Subsequently, as a post-treatment, the tin-plated patterned tape was rinsed with ionized water at room temperature for 30 seconds to 1 minute, then washed with water at 60 to 80 ° C. for 30 seconds to 3 minutes, and again at room temperature. It was washed with ionized water for 30 seconds to 1 minute.
【００１７】更に、乾燥処理として、後処理を経たパタ
ーン付テープに５〜２０リットル／分の流量で１００〜
２００℃の熱風を通しながら３０秒〜１分乾燥した。Further, as a drying treatment, the patterned tape which has been subjected to the post-treatment is treated with 100 to 100 liters at a flow rate of 5 to 20 liters / minute.
It was dried for 30 seconds to 1 minute while passing hot air of 200 ° C.
【００１８】最後に、熱処理として、乾燥したパターン
付テープを大気恒温槽で熱処理温度１００〜１５０℃で
１〜２時間加熱した。Finally, as the heat treatment, the dried patterned tape was heated at a heat treatment temperature of 100 to 150 ° C. for 1 to 2 hours in an atmospheric thermostat.
【００１９】上記した製造工程において、使用したパタ
ーン付テープの仕様は、テープ幅が３５ｍｍ，配線パタ
ーンのピン数２００，絶縁フィルムが１２５μｍ厚のポ
リイミドフィルム，接着剤が２０μｍ厚のエポキシ系接
着剤，銅箔厚が３５μｍであった。The specifications of the patterned tape used in the above manufacturing process are as follows: tape width 35 mm, wiring pattern pin number 200, insulating film 125 μm thick polyimide film, adhesive 20 μm thick epoxy adhesive, The copper foil thickness was 35 μm.
【００２０】次に、本実施例により得られた無電解錫め
っきＴＡＢ用テープキャリアに対して錫ヒゲの発生状況
とめっき特性（めっき外観，はんだ濡れ性，ピール強
度，インナーリードボンディング性）ついても評価し
た。また、比較例として超音波洗浄処理を施さなかった
無電解錫めっきＴＡＢ用テープキャリアについても同様
な評価試験を行った。なお、錫ヒゲは２０μｍ以上の長
さのものを発生として計算した。Next, with respect to the electroless tin-plated TAB tape carrier obtained in this example, the tin beard generation state and plating characteristics (plating appearance, solder wettability, peel strength, inner lead bonding property) were also examined. evaluated. Further, as a comparative example, a similar evaluation test was performed on an electroless tin-plated TAB tape carrier that was not subjected to ultrasonic cleaning. Note that tin beards having a length of 20 μm or more were generated and calculated.
【表１】 [Table 1]
【００２１】表１の評価結果から判るように、本実施例
のＴＡＢ用テープキャリアは錫ヒゲの発生数が大幅に低
減している。また、その他のめっき特性に対しては悪影
響を及ぼすことがなかった。As can be seen from the evaluation results in Table 1, the number of tin whiskers generated in the TAB tape carrier of this example is greatly reduced. Further, it did not adversely affect other plating characteristics.
【００２２】以上説明した実施例では、パターン付テー
プへの超音波洗浄を発振周波数４２ｋＨｚ，処理時間４
０〜５０秒間としたが、発振周波数３７〜４７ｋＨｚ，
処理時間３０秒〜１分の範囲であれば良い。また、無電
解錫めっき液として、有機酸浴を用いたが、その他にホ
ウフッ化浴でも良い。In the embodiment described above, ultrasonic cleaning of the patterned tape is performed at an oscillation frequency of 42 kHz and a processing time of 4
The oscillation frequency is 37 to 47 kHz,
The processing time may be in the range of 30 seconds to 1 minute. Although an organic acid bath was used as the electroless tin plating solution, a borofluoride bath may be used instead.
【００２３】[0023]
【発明の効果】以上説明したように、本発明のＴＡＢ用
テープキャリアの製造方法によると、めっき処理を行っ
た後、熱処理前にパターン付テープの表面を超音波洗浄
するようにしたため、めっき処理中に発生する錫ヒゲに
よるリード間のショート不良の懸念をなくして、信頼性
を向上させることができる。As described above, according to the method of manufacturing a tape carrier for TAB of the present invention, the surface of the patterned tape is ultrasonically cleaned after the plating treatment and before the heat treatment. It is possible to improve reliability by eliminating the risk of short-circuiting between leads due to tin whiskers generated inside.
【図１】一般的なＴＡＢ用テープキャリアの構造を示す
平面図。FIG. 1 is a plan view showing the structure of a general TAB tape carrier.
１ 接着剤付ポリイミドテープ ２ スプロケットホール ３ デバイスホール ４ アウターリードスリット ５ 配線パターン ５ａ インナーリード ５ｂ 入力側アウターリード ５ｃ 出力側アウターリード 1 Polyimide tape with adhesive 2 Sprocket hole 3 Device hole 4 Outer lead slit 5 Wiring pattern 5a Inner lead 5b Input side outer lead 5c Output side outer lead
Claims (4)
ターン形状の配線パターンを形成した後、めっき処理と
このめっき処理に続いて熱処理を施すＴＡＢ用テープキ
ャリアの製造方法において、 前記めっき処理を行った後、前記熱処理前に前記絶縁性
フィルムテープの表面を超音波洗浄することを特徴とす
るＴＡＢ用テープキャリアの製造方法。1. A method of manufacturing a TAB tape carrier, comprising: forming a wiring pattern having a predetermined pattern shape on the surface of an insulating film tape; and performing a plating treatment and a heat treatment subsequent to the plating treatment. And then ultrasonically cleaning the surface of the insulating film tape before the heat treatment.
対して錫の無電解めっきを施して行われる請求項１のＴ
ＡＢ用テープキャリアの製造方法。2. The T according to claim 1, wherein the plating treatment is performed by performing electroless plating of tin on the wiring pattern.
Manufacturing method of AB tape carrier.
っき処理前に前記絶縁性フィルムテープの表面を洗浄す
る所定の洗浄処理工程を行う請求項１のＴＡＢ用テープ
キャリアの製造方法。3. The method for producing a TAB tape carrier according to claim 1, wherein after the wiring pattern is formed, a predetermined cleaning treatment step of cleaning the surface of the insulating film tape is performed before the plating treatment.
前に前記絶縁性フィルムテープの表面を洗浄する所定の
洗浄処理工程を行う請求項１のＴＡＢ用テープキャリア
の製造方法。4. The method of manufacturing a TAB tape carrier according to claim 1, wherein after the ultrasonic cleaning, a predetermined cleaning treatment step of cleaning the surface of the insulating film tape is performed before the heat treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10894394A JPH07297237A (en) | 1994-04-25 | 1994-04-25 | Manufacture of tape carrier for tab |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10894394A JPH07297237A (en) | 1994-04-25 | 1994-04-25 | Manufacture of tape carrier for tab |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07297237A true JPH07297237A (en) | 1995-11-10 |
Family
ID=14497587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10894394A Pending JPH07297237A (en) | 1994-04-25 | 1994-04-25 | Manufacture of tape carrier for tab |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07297237A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005256103A (en) * | 2004-03-12 | 2005-09-22 | Matsushita Electric Ind Co Ltd | Method of testing whisker in tinning film |
| KR100748444B1 (en) * | 2006-02-23 | 2007-08-10 | 한국기계연구원 | Method and apparatus of forming stabilizer for superconducting wire using electroless plating |
| KR100915277B1 (en) * | 2005-10-03 | 2009-09-03 | 닛토덴코 가부시키가이샤 | Process for producing wiring circuit board |
-
1994
- 1994-04-25 JP JP10894394A patent/JPH07297237A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005256103A (en) * | 2004-03-12 | 2005-09-22 | Matsushita Electric Ind Co Ltd | Method of testing whisker in tinning film |
| JP4552468B2 (en) * | 2004-03-12 | 2010-09-29 | パナソニック株式会社 | Whisker inspection method for tin plating film |
| KR100915277B1 (en) * | 2005-10-03 | 2009-09-03 | 닛토덴코 가부시키가이샤 | Process for producing wiring circuit board |
| KR100748444B1 (en) * | 2006-02-23 | 2007-08-10 | 한국기계연구원 | Method and apparatus of forming stabilizer for superconducting wire using electroless plating |
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