JPH0729585Y2 - EMI countermeasure circuit board connection structure - Google Patents
EMI countermeasure circuit board connection structureInfo
- Publication number
- JPH0729585Y2 JPH0729585Y2 JP1989021879U JP2187989U JPH0729585Y2 JP H0729585 Y2 JPH0729585 Y2 JP H0729585Y2 JP 1989021879 U JP1989021879 U JP 1989021879U JP 2187989 U JP2187989 U JP 2187989U JP H0729585 Y2 JPH0729585 Y2 JP H0729585Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- emi countermeasure
- conductive pattern
- countermeasure circuit
- emi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 この考案はEMI対策用回路基板の接続構造に関し、特
に、面方向に間隔を隔てて配置されるEMI対策用回路基
板をコネクタで接続する、EMI対策用回路基板の接続構
造に関する。[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a connection structure for an EMI countermeasure circuit board, and in particular, connects EMI countermeasure circuit boards arranged at intervals in the plane direction with a connector. EMI countermeasure circuit board connection structure
本件出願人は、特開昭62-213192号等において、新規な
発想に基づく新規な構造のEMI対策用回路基板を提案し
た。このEMI対策用回路基板は、絶縁基板上の導電パタ
ーンを被うように絶縁樹脂層を形成し、その上に別の導
電層をたとえば銅性インクの印刷等によって形成し、別
の導電層を導電パターンに含まれるアースパターンに接
続したものである。The applicant of the present application has proposed a circuit board for EMI countermeasures having a new structure based on a new idea in Japanese Patent Laid-Open No. 62-213192. In this circuit board for EMI measures, an insulating resin layer is formed so as to cover the conductive pattern on the insulating substrate, and another conductive layer is formed thereon by, for example, printing copper ink, and the other conductive layer is formed. It is connected to the ground pattern included in the conductive pattern.
上述のEMI対策用回路基板を用いれば、その基板自体で
発生するEMIノイズ成分をかなり抑制できるものの、そ
の基板どうしをコネクタで接続する場合、雄型コネクタ
と雌型コネクタのそれぞれの金属カバーのEMI対策用回
路基板の導電層に対する接続が不完全であればそこから
EMI成分が漏れることがあった。すなわち、2つのコネ
クタの金属カバーが完全にそれぞれのEMI対策用回路基
板の導電層に接続されていなければ、それぞれのEMI対
策用回路基板の導電層すなわちアース電位が異なり、そ
の電位差に従って電流が流れ、それによってEMI成分が
そのコネクタ部分で輻射される。したがって、この場合
には、接続される2枚の基板がEMI対策用回路基板であ
っても、なお、EMIが十分低減され得なかった。If you use the above-mentioned circuit board for EMI countermeasures, you can considerably suppress the EMI noise components generated in the board itself, but when connecting the boards with connectors, the EMI of the metal covers of the male connector and the female connector If the connection to the conductive layer of the countermeasure circuit board is incomplete, start from there.
The EMI component sometimes leaked. That is, unless the metal covers of the two connectors are completely connected to the conductive layers of the respective EMI countermeasure circuit boards, the conductive layers of the respective EMI countermeasure circuit boards, that is, the ground potentials are different, and current flows according to the potential difference. , So that the EMI component is radiated at the connector part. Therefore, in this case, even if the two boards to be connected are EMI countermeasure circuit boards, EMI could not be sufficiently reduced.
それゆえに、この考案の主たる目的は、コネクタで接続
した場合でもEMIを十分低減できる、EMI対策用回路基板
の接続構造を提供することである。Therefore, a main object of the present invention is to provide a connection structure of an EMI countermeasure circuit board which can sufficiently reduce EMI even when connected by a connector.
この考案は、簡単にいえば、少なくともその一方主面上
に形成される第1の導電パターン,第1の導電パターン
の上に形成される第1の絶縁層および第1の絶縁層の上
に形成されかつ第1の導電パターンに含まれるアース部
分に接続される第1の導電層を含む第1のEMI対策用回
路基板、少なくともその一方主面上に形成される第2の
導電パターン,第2の導電パターンの上に形成される第
2の絶縁層および第2の絶縁層の上に形成されかつ第2
の導電パターンに含まれるアース部分に接続される第2
の導電層を含む第2のEMI対策用回路基板、第1のEMI対
策用回路基板の一方主面上に固着されかつ適宜の第1の
導電パターンに接続されるコネクタピンを有する雄型コ
ネクタ、基端が第1の導電層に接続されかつ解放端が雄
型コネクタの側面を覆うように形成される第1の金属カ
バー、第2のEMI対策用回路基板の一方主面上に固着さ
れて適宜の第2の導電パターンに接続されるかつ雄型コ
ネクタのピンを受け入れるコネクタ端子を有する雌型コ
ネクタ、雌型コネクタの側面を覆いかつその側面に第1
の金属カバーの解放端が被せられて接続される第2の金
属カバー、および第2の金属カバーの下部に形成されか
つ第2のEMI対策用回路基板に形成された第2の導電層
にバネ圧接するための複数の櫛型端子を備える、EMI対
策用回路基板の接続構造である。Briefly, the present invention provides a first conductive pattern formed on at least one main surface thereof, a first insulating layer formed on the first conductive pattern, and a first insulating layer formed on the first insulating pattern. A first EMI countermeasure circuit board including a first conductive layer formed and connected to a ground portion included in the first conductive pattern; a second conductive pattern formed on at least one main surface thereof; A second insulating layer formed on the second conductive pattern and a second insulating layer formed on the second insulating layer;
Second connected to the ground part included in the conductive pattern of
A second EMI countermeasure circuit board including a conductive layer, a male connector having connector pins fixed to one main surface of the first EMI countermeasure circuit board and connected to an appropriate first conductive pattern, A first metal cover whose base end is connected to the first conductive layer and whose open end is formed so as to cover the side surface of the male connector, and which is fixed on one main surface of the second EMI countermeasure circuit board. A female connector having connector terminals connected to an appropriate second conductive pattern and receiving pins of the male connector, covering a side surface of the female connector and forming a first surface on the side surface.
A second metal cover to which the open end of the metal cover is covered and connected, and a spring on the second conductive layer formed under the second metal cover and formed on the second circuit board for EMI countermeasures. It is a connection structure of an EMI countermeasure circuit board including a plurality of comb-shaped terminals for pressure contact.
櫛型端子は他方のEMI対策用回路基板の導電層にそれ自
身のばね性によって圧接されるので、雌型コネクタの金
属カバーとその導電層との電気的接続が安定になる。し
たがって、雄型コネクタの第1の金属カバーおよび雌型
コネクタの第2の金属カバーを通して2つのEMI対策用
回路基板の導電層が確実に接続される。そのために、両
方のEMI対策用回路基板の導電層すなわちアースが同電
位になる。したがって、2つのEMI対策用回路基板のア
ース電位が異なることに起因するEMI成分の輻射が防止
される。Since the comb-shaped terminal is pressed against the conductive layer of the other circuit board for EMI countermeasures by its own spring property, the electrical connection between the metal cover of the female connector and the conductive layer becomes stable. Therefore, the conductive layers of the two EMI countermeasure circuit boards are reliably connected through the first metal cover of the male connector and the second metal cover of the female connector. Therefore, the conductive layers of both EMI countermeasure circuit boards, that is, the ground, have the same potential. Therefore, the radiation of the EMI component due to the different ground potentials of the two EMI countermeasure circuit boards is prevented.
この考案によれば、コネクタの金属カバーとアースとの
接続が安定かつ確実に行われるので、それぞれのEMI対
策用回路基板の導電層すなわちアース電位を同電位にす
ることができるため、EMI対策用回路基板で生じたEMI成
分がコネクタ部分を通して輻射されるのが防止できる。According to this invention, since the connection between the metal cover of the connector and the ground is stable and reliable, the conductive layer of each EMI-preventing circuit board, that is, the ground potential can be made the same potential. It is possible to prevent the EMI component generated on the circuit board from being radiated through the connector portion.
この考案の上述の目的,その他の目的,特徴および利点
は、図面を参照して行う以下の実施例の詳細な説明から
一層明らかとなろう。The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the detailed description of the embodiments below with reference to the drawings.
2枚のEMI対策用回路基板(以下、単に「基板」とい
う)12および14は、第1図に示すように、その面方向に
一定の間隔を隔てて配置される。なお、この実施例で
は、基板12および14として先に引用した特開昭62-21319
2号に開示したEMI対策用回路基板を用いる。したがっ
て、基板自体の構造の詳細な説明は省略するが、それぞ
れの基板12および14の両面には、回路パターンを構成す
る第1の導電層16,その第1の導電層16上に適宜の形状
で形成される絶縁樹脂層18,および絶縁樹脂層18の上に
ほぼ前面に形成される、たとえば銅性インク等からなる
第2の導電層20を含む。As shown in FIG. 1, the two EMI countermeasure circuit boards (hereinafter, simply referred to as “boards”) 12 and 14 are arranged at regular intervals in the plane direction. It should be noted that in this embodiment, the substrates 12 and 14 described above are disclosed in Japanese Patent Laid-Open No.
Uses the circuit board for EMI measures disclosed in No. 2. Therefore, although the detailed description of the structure of the substrate itself is omitted, the first conductive layer 16 constituting the circuit pattern is formed on both sides of each of the substrates 12 and 14, and an appropriate shape is formed on the first conductive layer 16. And an insulating resin layer 18 formed on the insulating resin layer 18, and a second conductive layer 20 formed on the insulating resin layer 18 substantially on the front surface and made of, for example, copper ink.
一方の基板12には、雄型コネクタ22が固着され、そのコ
ネクタピン22aは図示しないが第1の導電層16に含まれ
る適宜の回路パターンに接続される。この雄型コネクタ
22のコネクタピン22aは金属カバー24で被われる。この
金属カバー24の上端は“L"字状に折り曲げられ、その一
部が第2の導電層20すなわちアースに接続される。金属
カバー24の下部の湾曲部24aは、後述する雌型コネクタ2
6の金属カバー30の上部に接するように延び、金属カバ
ー30の側面に圧接されるように弾性が付与されている。A male connector 22 is fixed to one substrate 12, and its connector pin 22a is connected to an appropriate circuit pattern included in the first conductive layer 16 although not shown. This male connector
The connector pin 22a of 22 is covered with a metal cover 24. The upper end of the metal cover 24 is bent into an "L" shape, and a part thereof is connected to the second conductive layer 20, that is, the ground. The curved portion 24a at the bottom of the metal cover 24 is a female connector 2 described later.
6 extends so as to be in contact with the upper portion of the metal cover 30 and is provided with elasticity so as to be pressed against the side surface of the metal cover 30.
他方の基板14には、雌型コネクタ26が固着され、そのコ
ネクタ端子26aは、それぞれ、第1の導電層16に含まれ
る図示しない適宜の回路パターンに接続される。基板14
の基板12と対向する面上の第2の導電層20の上の雌型コ
ネクタ26の近傍にははんだ層28が形成される。A female connector 26 is fixed to the other substrate 14, and its connector terminals 26a are connected to appropriate circuit patterns (not shown) included in the first conductive layer 16. Board 14
A solder layer 28 is formed in the vicinity of the female connector 26 on the second conductive layer 20 on the surface facing the substrate 12.
雌型コネクタ26は上述のコネクタ端子26aを囲む金属カ
バー30を含み、その金属カバー30の下部には、第2図か
らよくわかるような櫛型端子30a,30a,・・・が形成され
る。それぞれの櫛型端子30aは第1図に示すように外方
に湾曲され、それによってそれ自体がばね性を有するよ
うにされる。そして、櫛型端子30aの先端は上述のはん
だ層28上にそのばね力によって圧接される。したがっ
て、櫛型端子30aとはんだ層28とが確実に接続される。
すなわち、はんだ層28は比較的軟らかいはんだからなる
ため弾力性を有し、櫛型端子30aのばね性と相俟って、
櫛型端子30aとはんだ層28すなわち第2の導電層20との
接続が安定する。したがって、基板12の第2の導電層20
すなわちアースと基板14のアースとが金属カバー24およ
び30ならびにはんだ層28を介して完全に接続される。そ
のため、両方の基板12および14のアース電位が同電位と
なり、したがって、アース間の電位差に起因するEMI成
分の輻射が抑制される。The female connector 26 includes a metal cover 30 that surrounds the above-mentioned connector terminals 26a, and comb-shaped terminals 30a, 30a, ... As shown in FIG. Each comb-shaped terminal 30a is curved outward as shown in FIG. 1 so that it has spring properties. The tip of the comb-shaped terminal 30a is pressed onto the solder layer 28 by the spring force. Therefore, the comb-shaped terminal 30a and the solder layer 28 are reliably connected.
That is, the solder layer 28 has elasticity because it is made of a relatively soft solder, and in combination with the spring property of the comb-shaped terminal 30a,
The connection between the comb-shaped terminal 30a and the solder layer 28, that is, the second conductive layer 20 is stable. Therefore, the second conductive layer 20 of the substrate 12
That is, the ground and the ground of the substrate 14 are completely connected through the metal covers 24 and 30 and the solder layer 28. Therefore, the ground potentials of both substrates 12 and 14 become the same potential, and therefore the radiation of the EMI component due to the potential difference between the grounds is suppressed.
なお、櫛型端子28aの間隔をあまり大きくするとその部
分からEMI成分が漏れることがあるので、周波数によっ
て適当な間隔を設定しなければならない。It should be noted that if the spacing between the comb-shaped terminals 28a is too large, the EMI component may leak from that portion, so an appropriate spacing must be set depending on the frequency.
第1図はこの考案の一実施例を示す断面図解図である。 第2図は櫛型端子を示す図解図である。 図において、12および14は基板、16は第1の導電層、18
は絶縁樹脂層、20は第2の導電層、22は雄型コネクタ、
24は雄型コネクタの金属カバー、26は雌型コネクタ、28
ははんだ層、30は雌型コネクタの金属カバー、30aは櫛
型端子を示す。FIG. 1 is a schematic sectional view showing an embodiment of the present invention. FIG. 2 is an illustrative view showing a comb-shaped terminal. In the figure, 12 and 14 are substrates, 16 is a first conductive layer, 18
Is an insulating resin layer, 20 is a second conductive layer, 22 is a male connector,
24 is the metal cover of the male connector, 26 is the female connector, 28
Is a solder layer, 30 is a metal cover of a female connector, and 30a is a comb terminal.
Claims (2)
1の導電パターン,前記第1の導電パターンの上に形成
される第1の絶縁層および前記第1の絶縁層の上に形成
されかつ前記第1の導電パターンに含まれるアース部分
に接続される第1の導電層を含む第1のEMI対策用回路
基板、 少なくともその一方主面上に形成される第2の導電パタ
ーン,前記第2の導電パターンの上に形成される第2の
絶縁層および前記第2の絶縁層の上に形成されかつ前記
第2の導電パターンに含まれるアース部分に接続される
第2の導電層を含む第2のEMI対策用回路基板、 前記第1のEMI対策用回路基板の前記一方主面上に固着
されかつ適宜の前記第1の導電パターンに接続されるコ
ネクタピンを有する雄型コネクタ、 基端が前記第1の導電層に接続されかつ解放端が前記雄
型コネクタの側面を覆うように形成される第1の金属カ
バー、 前記第2のEMI対策用回路基板の一方主面上に固着され
て適宜の前記第2の導電パターンに接続されるかつ前記
雄型コネクタのピンを受け入れるコネクタ端子を有する
雌型コネクタ、 前記雌型コネクタの側面を覆いかつその側面に前記第1
の金属カバーの解放端を被せられて接続される第2の金
属カバー、および 前記第2の金属カバーの下部に形成されかつ前記第2の
EMI対策用回路基板に形成された前記第2の導電層にバ
ネ圧接するための複数の櫛型端子を備える、EMI対策用
回路基板の接続構造。1. A first conductive pattern formed on at least one main surface thereof, a first insulating layer formed on the first conductive pattern, and formed on the first insulating layer. A first EMI countermeasure circuit board including a first conductive layer connected to a ground portion included in the first conductive pattern; a second conductive pattern formed on at least one main surface thereof; A second insulating layer formed on the second conductive pattern and a second conductive layer formed on the second insulating layer and connected to a ground portion included in the second conductive pattern. A second EMI countermeasure circuit board; a male connector having connector pins fixed to the one main surface of the first EMI countermeasure circuit board and connected to an appropriate first conductive pattern; Connected to the first conductive layer and A first metal cover whose end is formed to cover a side surface of the male connector, fixed to one main surface of the second EMI countermeasure circuit board and connected to an appropriate second conductive pattern A female connector having connector terminals for receiving the pins of the male connector; covering a side surface of the female connector;
A second metal cover, which is connected to cover the open end of the metal cover, and a second metal cover formed under the second metal cover.
A connection structure for an EMI countermeasure circuit board, comprising a plurality of comb-shaped terminals for spring-pressure contact with the second conductive layer formed on the EMI countermeasure circuit board.
層が形成され、 前記複数の櫛型端子は前記はんだ層上にバネ圧接され
る、請求項1記載のEMI対策用回路基板の接続構造。2. The circuit board for EMI countermeasure according to claim 1, wherein a solder layer is further formed on the second conductive layer, and the plurality of comb-shaped terminals are pressed against the solder layer by spring pressure. Connection structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989021879U JPH0729585Y2 (en) | 1989-02-27 | 1989-02-27 | EMI countermeasure circuit board connection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989021879U JPH0729585Y2 (en) | 1989-02-27 | 1989-02-27 | EMI countermeasure circuit board connection structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02113281U JPH02113281U (en) | 1990-09-11 |
JPH0729585Y2 true JPH0729585Y2 (en) | 1995-07-05 |
Family
ID=31239498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989021879U Expired - Lifetime JPH0729585Y2 (en) | 1989-02-27 | 1989-02-27 | EMI countermeasure circuit board connection structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0729585Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW349320B (en) * | 1993-12-09 | 1999-01-01 | Methode Electronics Inc | Printed plastic circuits and contracts and method for making same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60181872U (en) * | 1984-05-15 | 1985-12-03 | 三菱電線工業株式会社 | Shielded connector plug |
JPS61141787U (en) * | 1985-02-25 | 1986-09-02 | ||
JPS6248678U (en) * | 1985-09-13 | 1987-03-25 | ||
JPS62124773U (en) * | 1986-01-31 | 1987-08-07 | ||
JPH0682890B2 (en) * | 1986-03-13 | 1994-10-19 | 任天堂株式会社 | EMI countermeasure circuit board and method of manufacturing the same |
JPH043432Y2 (en) * | 1987-03-18 | 1992-02-03 |
-
1989
- 1989-02-27 JP JP1989021879U patent/JPH0729585Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02113281U (en) | 1990-09-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |