JPH0728117B2 - Method for manufacturing molded article having printed circuit - Google Patents
Method for manufacturing molded article having printed circuitInfo
- Publication number
- JPH0728117B2 JPH0728117B2 JP3347686A JP3347686A JPH0728117B2 JP H0728117 B2 JPH0728117 B2 JP H0728117B2 JP 3347686 A JP3347686 A JP 3347686A JP 3347686 A JP3347686 A JP 3347686A JP H0728117 B2 JPH0728117 B2 JP H0728117B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- transfer sheet
- molded article
- circuit
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
発明の目的 Purpose of the invention
本発明は、表面に三次元形状の印刷回路を有する成形品
の製造方法に関する。The present invention relates to a method for producing a molded product having a printed circuit having a three-dimensional shape on its surface.
合成樹脂の成形品の表面に、電気または電子回路(以
下、単に「回路」という)を形成したい場合がある。 回路を形成する方法として、基板に貼りつけた銅箔の必
要な部分を残してエッチングを行なう、いわゆるプリン
ト基板の製造方法が広く実施されている。これはウェッ
トプロセスであり、時間がかかるという問題があるし、
カサ高な成形品に適用するのは困難である。 エッチングに代えて、導電性のペーストをスクリーン印
刷などの方法で印刷して回路を形成する方法があり、メ
ンブレンスイッチなどの製造に利用されている。この技
術は成形品にも適用可能ではあるが、平らな面でなけれ
ば印刷できないし、形状によっては実施困難である。さ
らに、印刷後の乾燥固定を要するというわずらわしさが
ある。 あらかじめ回路を基材フィルム上に印刷した転写シート
を用いて成形品に転写する方法をとれば、たとえば箱の
ような立体的な形状のものに対しても適用できるし、曲
面を対象にすることも不可能ではない。とはいえ、この
方法は、プロセスとしては成形品の成形と回路の転写の
2工程となると、とくに曲面への転写を行なおうとする
場合は、成形型のほかに転写用の押し型が必要である。There are cases where it is desired to form an electric or electronic circuit (hereinafter simply referred to as “circuit”) on the surface of a synthetic resin molded product. As a method of forming a circuit, a so-called printed circuit board manufacturing method has been widely practiced in which etching is performed by leaving a necessary portion of a copper foil attached to a board. This is a wet process, and it has the problem of being time consuming,
It is difficult to apply to bulky molded products. In place of etching, there is a method of forming a circuit by printing a conductive paste by a method such as screen printing, which is used for manufacturing a membrane switch or the like. Although this technique can be applied to a molded product, it can be printed only on a flat surface and is difficult to implement depending on the shape. In addition, there is the troublesomeness of requiring drying and fixing after printing. If a circuit is used to transfer the circuit to a molded product using a transfer sheet that has been printed on the base material film in advance, it can be applied to three-dimensional shapes such as boxes, and it can be used for curved surfaces. Is not impossible. However, in this method, when the process consists of two steps, molding of the molded product and transfer of the circuit, especially when trying to transfer to a curved surface, a pressing die for transfer is required in addition to the forming die. Is.
本発明の目的は、立体的な形状の合成樹脂成形品の表面
において、それが平面の交叉によって形成されるものか
曲面であるかを問わず、その表面に、所望の三次元形状
の回路を形成することができ、しかもそれを簡易な設備
と工程で実施する方法を提供することにある。 発明の構成The object of the present invention is to provide a circuit of a desired three-dimensional shape on the surface of a three-dimensionally shaped synthetic resin molded product, regardless of whether it is formed by the intersection of flat surfaces or a curved surface. It is to provide a method that can be formed and that can be performed with simple equipment and steps. Structure of the invention
本発明の印刷回路を有する成形品の製造方法は、第1図
に示すように、基材フィルム11上に導電性インキで形成
した印刷回路12を有する転写シート1を、第2図に示す
ように予備成形し、この転写シート予備成形体を、第3
図に示すように射出成形金型2Aおよび2B内に配置し、溶
融した合成樹脂を金型内に射出して、成形品3を得ると
同時に表面に三次元形状の印刷回路12を形成し、第4図
に例示するような製品を得ることを特徴とする。 転写シートの基本的構成は、基材フィルム上に印刷回路
があれば足りるが、必要に応じて基材フィルムと回路の
間に剥離層を、そして印刷回路上に接着剤層を設ける。 基材フィルムの材料は、ポリ塩化ビニル、ポリアミド、
ポリ塩化ビニリデン、ポリプロピレン、ポリウレタン、
ポリカーボネート、ポリスチレン、ポリサルフォン、ポ
リアリレート、ポリエーテルサルフォンなどの比較的耐
熱性がよく成形適性のあるプラスチックのフィルムの単
体または積層体がよい。絞りの少ない形状であれば、ポ
リエステルも使える。 剥離層の材料は、ポリ塩化ビニル、アクリル、ポリアミ
ド、ニトロセルロース、ポリウレタン、ポリ酢酸ビニル
などの熱可塑性樹脂またはメラミン、フェノール、ポリ
ウレタンなどの熱硬化性樹脂がよい。剥離層を形成する
には、ロールコート法、グラビア印刷法、シルクスクリ
ーン印刷法その他の任意の方法を使用すればよい。剥離
層は、転写後、基材フィルム側に残るタイプのものと、
印刷回路側に移るタイプのものとあり、成形品の用途に
応じて選択する。印刷回路側に移せば、回路の保護層と
して役立たせることもできる。その際に必要があれば、
ターミナルや部品をとりつける個所には剥離層を印刷し
ないでおく。 印刷回路の形成は、導電性インキをスクリーン印刷、グ
ラビア印刷またはオフセット印刷などの方法で、基材フ
ィルム上または剥離層上に印刷することによって行な
う。印刷回路の形成と同時に印刷低抗体や保護層の形成
を行ってもよい。 導電性のインキは、Au、Pd、Ag、Ni、Cuなどの金属の粉
末またはCの粉末を、バインダーと混練して調整する。
バインダーは合成樹脂を主成分とするものであつて、デ
ポキシ、フェノールなどの熱硬化性樹脂や、ポリオレフ
ィン、ポリウレタン、ポリエステル、ポリアミドなどの
熱可塑性樹脂から、適当なものをえらんで使用する。転
写フィルムの予備成形による伸びが大きい場合には、熱
可塑性樹脂のバインダーを用いる方がよい。熱硬化性樹
脂のバインダーは大きな伸びに追従できず、一見均一に
伸びているように見えても、導電性インキの導電度が低
下していることが少なくないからである。 印刷回路と成形品との接着を確実にしたい場合は、印刷
回路の上に接着剤層を設けておけばよい。このようにす
ると、導電性インキと成形樹脂の組み合わせの自由度が
増す。 成形品の材料は、射出成形可能な任意の熱可塑性樹脂お
よび熱硬化性樹脂が使用できる。 転写シートの予備成形は、真空成形、圧空成形、真空圧
空成形およびマッチドダイモールド成形から選んだ成形
方法により実施する。真空および(または)圧空成形の
金型として、射出成形の金型を利用すれば、設備が簡略
となる。 転写シートの予備成形体を射出成形金型内に置いて射出
成形すること自体は、いわゆる「絵付成形」として知ら
れており、本発明もその技術に従って実施すればよい。As shown in FIG. 1, the method for producing a molded article having a printed circuit according to the present invention includes a transfer sheet 1 having a printed circuit 12 formed of a conductive ink on a base film 11 as shown in FIG. And preform the transfer sheet preform into a third
As shown in the figure, it is placed in the injection molding dies 2A and 2B, and the molten synthetic resin is injected into the dies to obtain the molded article 3 and at the same time form the three-dimensional printed circuit 12 on the surface, It is characterized by obtaining a product as illustrated in FIG. The basic constitution of the transfer sheet is sufficient if a printed circuit is provided on the base film, but if necessary, a release layer is provided between the base film and the circuit, and an adhesive layer is provided on the printed circuit. The material of the base film is polyvinyl chloride, polyamide,
Polyvinylidene chloride, polypropylene, polyurethane,
A single or laminated film of a plastic film such as polycarbonate, polystyrene, polysulfone, polyarylate, and polyethersulfone having relatively high heat resistance and good moldability is preferable. Polyester can be used as long as it has a small aperture. The material of the release layer is preferably a thermoplastic resin such as polyvinyl chloride, acrylic, polyamide, nitrocellulose, polyurethane, polyvinyl acetate or the like, or a thermosetting resin such as melamine, phenol or polyurethane. To form the release layer, a roll coating method, a gravure printing method, a silk screen printing method or any other method may be used. The release layer is of a type that remains on the base film side after transfer,
There is a type that moves to the printed circuit side, and it is selected according to the application of the molded product. If it is transferred to the printed circuit side, it can also serve as a protective layer of the circuit. If necessary in that case,
Do not print the release layer on the terminal or the place where parts are mounted. The printed circuit is formed by printing a conductive ink on the substrate film or the release layer by a method such as screen printing, gravure printing or offset printing. The printed antibody and the protective layer may be formed simultaneously with the formation of the printed circuit. The conductive ink is prepared by kneading a powder of a metal such as Au, Pd, Ag, Ni, or Cu or a powder of C with a binder.
The binder is mainly composed of a synthetic resin, and a suitable one is selected from thermosetting resins such as depoxy and phenol, and thermoplastic resins such as polyolefin, polyurethane, polyester and polyamide. If the transfer film has a large elongation due to preforming, it is better to use a binder of a thermoplastic resin. This is because the binder of the thermosetting resin cannot follow a large elongation, and even if it seems that the binder uniformly expands, the conductivity of the conductive ink is often lowered. When it is desired to ensure the adhesion between the printed circuit and the molded product, an adhesive layer may be provided on the printed circuit. This increases the degree of freedom in combining the conductive ink and the molding resin. As the material of the molded product, any thermoplastic resin and thermosetting resin that can be injection-molded can be used. The pre-molding of the transfer sheet is carried out by a molding method selected from vacuum molding, pressure molding, vacuum pressure molding and matched die molding. If an injection mold is used as a vacuum and / or compressed air mold, the equipment is simplified. Placing a preformed body of a transfer sheet in an injection molding die and performing injection molding is known as so-called "painting molding", and the present invention may be carried out according to the technique.
本発明の製造方法によれば、合成樹脂成形品の成形と回
路の印刷とが一工程で行なえ、任意の立体形状の成形品
の、任意の表面に三次元形状の回路を有する製品が得ら
れる。 転写フィルムの予備成形を行なわずに射出成形金型内に
置き、射出樹脂の熱と圧力で立体形状を出す方法もある
が、つぎのような限界がある。 * 転写フィルムに十分な熱を与えずに伸ばすため、印
刷回路の導電性の維持と安定性に困難がある。 * 均一な熱を与えられないから、パターンの再現性が
低く、複雑な形状を出すには適しない。 従って、転写フィルムの予備成形は電気回路としての性
能および信頼性の高い印刷回路を、複雑な三次元形状の
成形品表面に形成する上で不可欠である。According to the manufacturing method of the present invention, molding of a synthetic resin molded product and printing of a circuit can be performed in one step, and a product having a three-dimensional circuit on any surface of a molded product of any three-dimensional shape can be obtained. . There is also a method in which the transfer film is placed in an injection molding die without being preformed and a three-dimensional shape is produced by the heat and pressure of the injection resin, but there are the following limitations. * Since the transfer film is stretched without giving sufficient heat, it is difficult to maintain the conductivity and stability of the printed circuit. * Because uniform heat cannot be applied, pattern reproducibility is low and it is not suitable for producing complicated shapes. Therefore, preforming of the transfer film is indispensable for forming a printed circuit having high performance as an electric circuit and high reliability on the surface of a molded product having a complicated three-dimensional shape.
Agの粉末をアクリル樹脂を主成分とするバインダーと混
練した導電性インキを、ニトロセルロース系樹脂をコー
トして形成した剥離層を有する厚さ100μのポリカーボ
ネートフィルム上に、シルクスクリーン印刷法により所
望の回路のパターンで印刷して転写シートを用意した。 この転写シートを温度170℃の熱盤で加熱し、真空圧空
成形により予備成形した後、射出成形金型内に置き、樹
脂温度220℃でABS樹脂を射出成形した。これを金型から
とり出し、基材フィルムを剥離して、三次元形状の表面
に印刷回路を有する成形品を得た。 成形品の表面において、三次元形状の回路は所定の位置
に強固に形成されていた。 発明の効果 本発明の方法によれば、印刷回路を有する成形品の製造
を、簡略化された、自動化が容易な工程で行なえる。成
形品の形状にも、印刷回路を設ける表面の形状にも何ら
制約がない。曲面を含む三次元形状に印刷回路を形成す
る場合、転写用の押し型など必要としないこともあっ
て、製品コストは低廉になる。また、この方法自体はド
ライプロセスであって、ウェットプロセスは転写シート
の製造工程で実施するだけであり、作業環境を良好に保
つことは容易である。Conductive ink obtained by kneading Ag powder with a binder whose main component is acrylic resin, on a polycarbonate film having a thickness of 100μ having a release layer formed by coating a nitrocellulose resin, by a silk screen printing method. A transfer sheet was prepared by printing with a circuit pattern. This transfer sheet was heated on a hot platen at a temperature of 170 ° C., preformed by vacuum pressure molding, placed in an injection mold, and ABS resin was injection molded at a resin temperature of 220 ° C. This was taken out of the mold and the substrate film was peeled off to obtain a molded product having a printed circuit on the surface of a three-dimensional shape. On the surface of the molded product, the three-dimensional circuit was firmly formed at a predetermined position. EFFECTS OF THE INVENTION According to the method of the present invention, a molded product having a printed circuit can be manufactured in a simplified and easily automated process. There are no restrictions on the shape of the molded product or the shape of the surface on which the printed circuit is provided. When a printed circuit is formed in a three-dimensional shape including a curved surface, a pressing die for transfer is not necessary, and the product cost is low. Moreover, this method itself is a dry process, and the wet process is only performed in the manufacturing process of the transfer sheet, and it is easy to maintain a good working environment.
第1図は、本発明の製造方法に用いる転写シートの基本
的な構成を示す模式的な断面図である。 第2図および第3図は、本発明の製造工程を説明するた
めの断面図であって、第2図は転写シートを予備成形し
たところを、第3図は転写シート予備成形体を射出成形
金型内に置いたところを、それぞれ示す。 第4図は、第2図および第3図の方法で製造した印刷回
路を有する成形品の断面図である。 1…転写シート 11…基材フィルム 12…印刷回路 2A,2B…射出成形金型 3…印刷回路を有する成形品FIG. 1 is a schematic cross-sectional view showing the basic structure of a transfer sheet used in the manufacturing method of the present invention. 2 and 3 are cross-sectional views for explaining the manufacturing process of the present invention. FIG. 2 shows the transfer sheet preformed, and FIG. 3 shows the transfer sheet preformed body by injection molding. The parts placed in the mold are shown. FIG. 4 is a cross-sectional view of a molded product having a printed circuit manufactured by the method of FIGS. 2 and 3. DESCRIPTION OF SYMBOLS 1 ... Transfer sheet 11 ... Base film 12 ... Printed circuit 2A, 2B ... Injection mold 3 ... Molded article having printed circuit
Claims (2)
印刷回路を有する転写シートを予備成形し、この転写シ
ート予備成形体を射出成形金型内に配置し、溶融した合
成樹脂を金型内に射出して、成形品を得ると同時に表面
に三次元形状の印刷回路を形成することを特徴とする印
刷回路を有する成形品の製造方法。1. A transfer sheet having a printed circuit formed of a conductive ink is preformed on a substrate film, the transfer sheet preformed body is placed in an injection molding die, and a molten synthetic resin is placed in the die. A method for producing a molded article having a printed circuit, comprising the steps of: injecting into the interior to obtain a molded article and simultaneously forming a three-dimensionally shaped printed circuit on the surface.
成形、真空圧空成形およびマッチドダイモールド成形か
ら選んだ成形方法により実施する特許請求の範囲第1項
に記載の製造方法。2. The method according to claim 1, wherein the transfer sheet is preformed by a forming method selected from vacuum forming, pressure forming, vacuum pressure forming and matched die molding.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14079185 | 1985-06-27 | ||
JP60-140791 | 1985-06-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6290999A JPS6290999A (en) | 1987-04-25 |
JPH0728117B2 true JPH0728117B2 (en) | 1995-03-29 |
Family
ID=15276824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3347686A Expired - Lifetime JPH0728117B2 (en) | 1985-06-27 | 1986-02-18 | Method for manufacturing molded article having printed circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0728117B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62165993A (en) * | 1986-01-17 | 1987-07-22 | 凸版印刷株式会社 | Anufacture of molded wiring components of microwave circuit |
JPH04206992A (en) * | 1990-11-30 | 1992-07-28 | Nitto Boseki Co Ltd | Printed wiring board and fabrication thereof |
-
1986
- 1986-02-18 JP JP3347686A patent/JPH0728117B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6290999A (en) | 1987-04-25 |
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