JPH07274291A - Ultrasonic probe and its manufacture - Google Patents
Ultrasonic probe and its manufactureInfo
- Publication number
- JPH07274291A JPH07274291A JP8755994A JP8755994A JPH07274291A JP H07274291 A JPH07274291 A JP H07274291A JP 8755994 A JP8755994 A JP 8755994A JP 8755994 A JP8755994 A JP 8755994A JP H07274291 A JPH07274291 A JP H07274291A
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic probe
- vibration damping
- piezoelectric element
- synthetic
- characteristic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は超音波探触子を利用分野
とし、特に高周波化に適して広帯域を得られる超音波探
触子の構造及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field of application of an ultrasonic probe, and more particularly to a structure of an ultrasonic probe capable of obtaining a wide band suitable for high frequency and a manufacturing method thereof.
【０００２】[0002]
【発明の背景】超音波探触子は、医用等の超音波診断装
置に超音波の送受波部として有用されている。このよう
なものの中には、圧電素子１個のもの（シングル型とす
る）や、例えば圧電素子を矩形状としてその幅方向に並
べ、電子的にセクタあるいはリニア駆動される配列型の
ものがある。そして、いずれのものでも、近年では、超
音波の放射方向に対する距離分解能を高めて、しかも情
報量を増大し、診断精度を向上する超音波の高周波化
（例えば３０ＭＨｚ以上）が望まれている。BACKGROUND OF THE INVENTION An ultrasonic probe is useful as an ultrasonic wave transmitting / receiving unit in an ultrasonic diagnostic apparatus for medical use. Among these, there are one piezoelectric element (single type) and, for example, an array type in which piezoelectric elements are formed in a rectangular shape and are arranged in the width direction and are electronically sector-driven or linearly driven. . In any of these cases, in recent years, it has been desired to increase the frequency of ultrasonic waves (for example, 30 MHz or higher) to improve the distance resolution in the radiation direction of ultrasonic waves, increase the amount of information, and improve the diagnostic accuracy.
【０００３】[0003]
【従来技術】第７図は従来例を説明するシングル型の超
音波探触子の断面図である。超音波探触子は、ＰＺＴ
（ジルコン酸チタン酸鉛）等の圧電素子１を超音波Ｕの
発生源として構成される。圧電素子１は両主面に図示し
ない電極を有し、後面をバッキング材２上に固着され
る。そして、超音波の送受波面となる前面に一層以上の
音響整合層３を設けてなる。通常では、一枚の圧電板を
バッキング材上に固着して音響整合層を形成する。そし
て、音響整合層上から複数個に切断分割し、それぞれを
基台４上に固着してシングル型の超音波探触子を製作す
る。バッキング材２は、通常、金属粉末等を混入したゴ
ム系樹脂からなり、圧電素子１の後面から放射される超
音波を吸収して、前面から放射される超音波へ干渉しな
いようにする。音響整合層３はガラスあるいはセラミッ
ク等の貼着後に、樹脂をコーティングした２層構造とす
る。そして、圧電素子１と被検出体（生体）５の音響イ
ンピーダンス（密度と超音波の伝搬速度の積）Ｚ0、ＺM
の差による超音波の伝搬損失を防止する。通常では、音
響整合層３の厚みは各層ともに超音波の波長のλ／４あ
るいはその整数倍とし、その音響インピーダンスは、序
々に被検出体に近づくようにする。そして、バッキング
材２及び音響整合層３はいずれも圧電素子１の共振特性
をを抑圧して、その帯域を広げる制動作用を有する。例
えば、第８図の送受波利得特性に示したように、頂点を
やや平坦とした単峰特性とする。但し、図中のｆ0は中
心周波数、ｆwは６ｄＢ減衰域での帯域幅である。2. Description of the Related Art FIG. 7 is a sectional view of a single type ultrasonic probe for explaining a conventional example. The ultrasonic probe is PZT
The piezoelectric element 1 such as (lead zirconate titanate) is configured as a source of the ultrasonic waves U. The piezoelectric element 1 has electrodes (not shown) on both main surfaces, and the rear surface is fixed onto the backing material 2. Further, one or more acoustic matching layers 3 are provided on the front surface which is the ultrasonic wave transmitting / receiving surface. Usually, one piezoelectric plate is fixed on a backing material to form an acoustic matching layer. Then, the acoustic matching layer is cut and divided into a plurality of pieces, each of which is fixed on the base 4 to manufacture a single-type ultrasonic probe. The backing material 2 is usually made of rubber resin mixed with metal powder or the like, and absorbs ultrasonic waves emitted from the rear surface of the piezoelectric element 1 so as not to interfere with ultrasonic waves emitted from the front surface. The acoustic matching layer 3 has a two-layer structure in which glass or ceramic or the like is attached and then resin is coated. The acoustic impedance (product of density and ultrasonic wave propagation velocity) Z 0 , Z M between the piezoelectric element 1 and the detected body (living body) 5
To prevent the propagation loss of ultrasonic waves due to the difference. Normally, the thickness of the acoustic matching layer 3 is set to λ / 4 or an integral multiple of the wavelength of the ultrasonic waves in each layer, and the acoustic impedance of the acoustic matching layer 3 gradually approaches the object to be detected. The backing material 2 and the acoustic matching layer 3 both suppress the resonance characteristic of the piezoelectric element 1 and have a braking action to widen the band. For example, as shown in the transmission / reception gain characteristic of FIG. However, in the figure, f 0 is the center frequency, and f w is the bandwidth in the 6 dB attenuation range.
【０００４】[0004]
【従来技術の問題点】しかしながら、上記構成の超音波
探触子では、超音波周波数が高周波化するほど、圧電板
の厚みは小さくなる。したがって、その取扱を困難と
し、作業中に破損等を引き起こす。特に、バッキング材
２は、上述のようにゴム系の樹脂が用いられる。このた
め、圧電板をバッキング材に固着して音響整合層を設け
る際、あるいは、マルチソウにより複数個に切断分割す
る際には、外力によるゴム系樹脂の弾性等により、圧電
板にたわみ等を生じてヒビ、欠け、割れ等の破損を招く
ことになる。そして、このような場合には、特性の劣化
を招き、製品として採用できず、生産性を悪化させる。
また、製品後においても、生体へ押圧して診断する際に
は、外力によって同様に圧電素子１にたわみを生じ、破
損するおそれもあってその品質を損なう問題もあった。However, in the ultrasonic probe having the above structure, the thickness of the piezoelectric plate becomes smaller as the ultrasonic frequency becomes higher. Therefore, it is difficult to handle, and it causes damage during the work. In particular, the backing material 2 is made of rubber-based resin as described above. Therefore, when the piezoelectric plate is fixed to the backing material and the acoustic matching layer is provided, or when the piezoelectric plate is cut and divided into a plurality of pieces by a multi-saw, the piezoelectric plate is bent due to the elasticity of the rubber resin due to an external force. It may cause damage such as cracks, chips and cracks. In such a case, the characteristics are deteriorated, the product cannot be used as a product, and the productivity is deteriorated.
Further, even after the product is manufactured, when the piezoelectric element 1 is pressed against a living body for diagnosis, the piezoelectric element 1 is similarly bent due to an external force and may be damaged, resulting in a problem of impairing its quality.
【０００５】[0005]
【発明の目的】本発明は、上記事情に鑑み、特に製作を
容易として、高周波化及び高帯域化に適した超音波探触
子及びその製造方法を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to provide an ultrasonic probe suitable for high frequency and high band, and a method of manufacturing the ultrasonic probe, which is particularly easy to manufacture.
【０００６】[0006]
【着目点】本発明は、ゴム系のバッキング材に代え、金
属であれば圧電板にはたわみ等による破損を生じない
点、及び特公平３−８１３５９号に記載の技術すなわち
音響整合層の音響インピーダンスＺ1は圧電素子及び被
検出体のそれＺ0、ＺMに対して、Ｚ1＞（Ｚ0・ＺM）1/2
「（１）式」とする」とすれば、送受波特性が双方特性
となるとともにその山谷の差はＺ1に制御されるとの
点、双峰特性の山谷の差が大きくなると中心周波数に対
する帯域は広がる点に着目し、本発明では、振動制動材
を金属の溶着により圧電素子に接合して合成振動体を形
成し、該合成振動体の送受波特性を双峰特性とするとと
もに、該双峰特性の山谷の差を６ｄＢ以内としたことを
基本的な解決手段とし、より具体的には、振動抑制材の
音響インピーダンスＺBは、（Ｚ0・ＺM）1/2＜ＺB＜Ｚ0
を満足するようにし、さらには合成振動体には圧電素子
の共振周波数に対して約λ／４となる調整膜を付加した
ことを解決手段とする。また、その製造方法としては、
一枚の圧電板に振動制動材としての金属を溶着して合成
振動体を形成した後、個々に切断分離して形成したこと
を解決手段とする。以下、本発明の一実施例をその作用
とともに説明する。[Points of interest] The present invention is that the piezoelectric plate is not damaged by bending or the like if it is made of metal instead of the rubber-based backing material, and that the technology of Japanese Patent Publication No. 3-81359, that is, the acoustic matching layer acoustic The impedance Z 1 is Z 1 > (Z 0 · Z M ) 1/2 with respect to Z 0 and Z M of the piezoelectric element and the object to be detected.
If "(1)" to "the point of the wave transceiver characteristic is the difference between the peaks and troughs with the both properties are controlled to Z 1, the center frequency if the difference between peaks and valleys of the bimodal characteristic increases Paying attention to the fact that the band for the is widened, in the present invention, the vibration damping material is bonded to the piezoelectric element by welding of the metal to form a synthetic vibrating body, and the transmission / reception characteristics of the synthetic vibrating body are made bimodal. The basic solution is to set the difference between the peaks and valleys of the bimodal characteristics within 6 dB, and more specifically, the acoustic impedance Z B of the vibration suppressing material is (Z 0 · Z M ) 1/2 < Z B <Z 0
The solution means is to satisfy the condition (1) and further to add an adjusting film to the resonance frequency of the piezoelectric element to the synthetic vibrating body to be about λ / 4. In addition, as its manufacturing method,
A solution is to form a composite vibrating body by welding a metal as a vibration damping material to a single piezoelectric plate and then cutting and separating the composite vibrating body. Hereinafter, one embodiment of the present invention will be described together with its operation.
【０００７】[0007]
【実施例】第１図は本発明の一実施例を説明する超音波
探触子の断面図である。なお、前従来例図と同一部分に
は同番号を付与して説明する。超音波探触子は、振動制
動材６を半田とし、圧電素子１の一方の主面に接合した
合成振動体７から構成される。具体的には、クリーム半
田を圧電板上に塗布してその厚みがλ／４となるように
溶融して固化させる。そして、振動制動材６側を図示し
ないガラス上に固着し、圧電板上から複数個に切断分割
する。そして、ガラスを分離した後、振動制動材６及び
圧電素子１の送受波面側の電極にリード線（未図示）を
接続し、振動制動材６側を基台４上に固着して形成され
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view of an ultrasonic probe for explaining one embodiment of the present invention. It should be noted that the same parts as those of the previous conventional example will be described by giving the same numbers. The ultrasonic probe is composed of a synthetic vibrating body 7 in which the vibration damping material 6 is soldered and is bonded to one main surface of the piezoelectric element 1. Specifically, cream solder is applied onto a piezoelectric plate and melted and solidified so that its thickness becomes λ / 4. Then, the vibration damping material 6 side is fixed on a glass (not shown), and the piezoelectric plate is cut and divided into a plurality of pieces. Then, after the glass is separated, a lead wire (not shown) is connected to the vibration damping material 6 and the electrode on the wave transmission / reception surface side of the piezoelectric element 1, and the vibration damping material 6 side is fixed on the base 4. .
【０００８】第２図は、本実施例による概略の送受波利
得特性図である。但し、曲線（イ、ロ）は本実施例、同
（ハ）は従来例である。また、送受波面側に音響整合層
を設けることなく、圧電素子１側を被検出体５に直接当
接させた場合で、超音波の中心周波数は３０ＭＨｚであ
る。図から明らかなように、送受波利得特性は、従来の
単峰特性に対し、上述のように双峰特性とる。そして、
双方特性の山谷の差にはバラツキがあり、山谷の差が実
用上の６ｄＢを越えないもの「曲線（イ）」、あるいは
これを越えるもの「同図（ロ）」があった。そして、い
ずれの場合でも超音波の中心周波数（概ね圧電素子の共
振周波数）ｆ0に対する帯域ｆw1、ｆw2は、従来のｆw3
より広がり、山谷の差が大きくなるほどその同帯域は大
きくなる結果となった。また、これらの例では、ほとん
どが、尖頭値（ｆ1時）における送受波利得は、従来例
と比較して遜色なく、実用上の感度を得た。FIG. 2 is a schematic transmission / reception gain characteristic diagram according to this embodiment. However, the curves (a, b) are the present example, and the curves (c) are the conventional example. The center frequency of ultrasonic waves is 30 MHz when the piezoelectric element 1 side is directly brought into contact with the detected body 5 without providing an acoustic matching layer on the transmitting / receiving surface side. As is clear from the figure, the transmission / reception gain characteristic has a bimodal characteristic as described above, in contrast to the conventional single-peak characteristic. And
There was variation in the difference between the peaks and valleys of both characteristics, and there was "curve (a)" in which the difference in peaks and valleys did not exceed 6 dB in practical use, or "Fig. (B)" in which it exceeded this. The band f w1, f w2 for f 0 (resonance frequency of approximately piezoelectric element) in any case ultrasound center frequency, conventional f w3
The wider the band, the larger the difference between the peaks and valleys. Further, in most of these examples, the transmission / reception gain at the peak value (f 1 o'clock) was comparable to that of the conventional example, and practical sensitivity was obtained.
【０００９】 すなわち、本実施例で
は、半田の溶融により圧電素子１に接合したので、その
固着強度がきわめて大きい。したがって、圧電素子１と
半田とが一体化され、見かけ上、一つの合成振動体７と
して動作する。そして、振動制動材（半田）の音響イン
ピーダンスＺB（２４×１０6Ｋｇ／ｍ2・ｓｅｃ）が、
前述の（１）式で示される値（Ｚ0・ＺM）1/2よりも大
きいので、送受波利得特性は上述のように双峰特性とな
る。なお、基本的には、合成振動体７、圧電素子１自体
及び振動制動材６は、その厚み（３λ／４、λ／２、λ
／４）等に応じた固有の共振周波数ｆ1、ｆ0、ｆ2（但
し、ｆ1＜ｆ0＜ｆ2）を有する。そして、振動制動材６
の音響インピーダンスＺMに比例した質量により、圧電
素子１自体の共振「第３図（ａ）」が抑圧される結果、
その両側に合成振動体７及び振動制動材６による固有の
共振が顕在化する「同図（ｂ）」。したがって、送受波
利得特性は、双方特性になる「同図（ｃ）」と推察され
る。また、合成振動体７の音響インピーダンスＺXは、
見かけ上、圧電素子Ｚ0（３４×Ｋｇ／ｍ2・ｓｅｃ）と
振動制動材ＺB（ＺB＜Ｚ0）の中間の値となって、少な
くとも圧電素子自体のそれよりは小さくなる。そして、
被検出体５の音響インピーダンスＺM（１．５×Ｋｇ／
ｍ2・ｓｅｃ）に近ずく。その結果、不整合度を小さく
して、音響整合層を用いなくとも伝搬損失を少なくす
る。したがって、実用上の感度を得ることができる。That is, in this embodiment, since the piezoelectric element 1 is joined by melting the solder, the fixing strength is extremely high. Therefore, the piezoelectric element 1 and the solder are integrated and apparently operate as one combined vibrating body 7. The acoustic impedance Z B (24 × 10 6 Kg / m 2 · sec) of the vibration damping material (solder) is
Since it is larger than the value (Z 0 · Z M ) 1/2 shown by the above-mentioned equation (1), the transmission / reception gain characteristic becomes the bimodal characteristic as described above. Basically, the synthetic vibrating body 7, the piezoelectric element 1 itself, and the vibration damping material 6 have thicknesses (3λ / 4, λ / 2, λ).
/ 4) and the like, which have unique resonance frequencies f 1 , f 0 , f 2 (provided that f 1 <f 0 <f 2 ). Then, the vibration damping material 6
As a result of suppressing the resonance “FIG. 3 (a)” of the piezoelectric element 1 itself by the mass proportional to the acoustic impedance Z M of
"(B)" in the figure in which the inherent resonance due to the synthetic vibrating body 7 and the vibration damping material 6 becomes apparent on both sides thereof. Therefore, the transmission / reception gain characteristic is presumed to be "(c) in the same figure", which is both characteristics. The acoustic impedance Z X of the synthetic vibrating body 7 is
Apparently, the value becomes an intermediate value between the piezoelectric element Z 0 (34 × Kg / m 2 · sec) and the vibration damping material Z B (Z B <Z 0 ), which is at least smaller than that of the piezoelectric element itself. And
Acoustic impedance Z M (1.5 × Kg /
m 2 · sec). As a result, the degree of mismatch is reduced, and the propagation loss is reduced without using the acoustic matching layer. Therefore, practical sensitivity can be obtained.
【００１０】このような構成であれば、振動制動材２を
半田として、これを圧電板に溶着して合成振動体とした
ので、圧電素子自体の場合よりもその強度を高めて、取
扱を容易にする。特に、マルチソウにより複数個に切断
分割する際には、圧電板にたわみ等を生ずることなく、
ヒビ、欠け、割れ等の破損を防止する。したがって、そ
の製作を容易にする。そして、この例では、前面の音響
整合層をも不要とするので作業工程を省略できる。ま
た、製品後の使用時においてもその破損のおそれをなく
し、品質を良好に維持する。そして、振動制動材６の音
響インピーダンスＺBが（Ｚ0・ＺM）1/2よりも大きくし
かも圧電素子１（Ｚ0）よりも小さな値としたので、音
響整合層を不要として実用上の感度を得るとともに、山
谷の差が６ｄ以下の双峰特性のものを選択することによ
り従来よりも高帯域化を計ることができる。したがっ
て、高周化及び高帯域化に適した超音波探触子の製作を
容易にする。With such a structure, the vibration damping material 2 is used as solder, and this is welded to the piezoelectric plate to form a synthetic vibrating body, so that the strength thereof is increased as compared with the case of the piezoelectric element itself, and the handling is easy. To In particular, when cutting and dividing into multiple pieces with multi-saw, without causing bending etc. to the piezoelectric plate,
Prevents damage such as cracks, chips, and cracks. Therefore, its manufacture is facilitated. Further, in this example, the acoustic matching layer on the front surface is also unnecessary, so that the working process can be omitted. Further, even when the product is used after being manufactured, there is no fear of damage, and good quality is maintained. Since the acoustic impedance Z B of the vibration damping material 6 is set to a value larger than (Z 0 · Z M ) 1/2 and smaller than that of the piezoelectric element 1 (Z 0 ), the acoustic matching layer is unnecessary and is practically used. By obtaining the sensitivity and selecting the bimodal characteristic in which the difference between the peaks and valleys is 6d or less, it is possible to achieve a higher band than ever. Therefore, it is easy to manufacture an ultrasonic probe suitable for increasing the frequency and increasing the band.
【００１１】[0011]
【他の事項】上記実施例における実験では、双峰特性の
山谷の差が６ｄＢ以上のものもみられたが、このような
場合は、例えば第４図に示したように合成振動体７の前
面に超音波の中心周波数のλ／４となる樹脂等の調整膜
（所謂音響整合層）８を付加することにより、６ｄＢ以
下にすることができる。すなわち、合成振動体７によ送
受波利得特性が６ｄＢ以上の山谷の差があったとしても
「（第５図（ａ）」、調整膜８の伝搬特性は、同図
（ｂ）に示したように中心周波数ｆ0を頂点（０ｄＢ）
とした単峰特性となる。したがって、結果的にはこれら
の両特性が合算されるため、双峰特性の山谷の差を減少
して６ｄＢ以内にできる。なお、調整膜８の伝搬特性は
圧電素子自体の共振周波数成分が主として伝搬されるた
め、中心周波数ｆ0を頂点（０ｄＢ）とした単峰特性と
なる。また、圧電素子１側を超音波の送受波面として説
明したが、実験によれば、第６図に示したように振動制
動材側６を送受波面としても、ほぼ同様な結果を得た。
但し、この場合の方が送受波利得は実施例のものより若
干の向上が見られた。この理由は、音響インピーダンス
の小さい方が被検出体５側に位置したことによると考え
られる。このように、実施例では、振動制動材２を基台
４側に設けて説明したが、いずれであってもよく、要は
圧電素子１の共振が抑圧されて両側に共振周波数を有す
る合成振動体７として機能すればよい。また、いずれの
場合でも、超音波は基台４側へ放射されるが、高周波数
であるため、例えば基台あるいは基台上の接着剤等によ
り乱反射あるいは吸収されて、その影響は殆どない。ま
た、極端には基台あるいは接着剤はなくとも、背面側か
らの超音波空気中にて散乱吸収される。また、振動制動
材６は半田としてその溶融による接合としたが、例えば
Ａｌの熱圧着も含み、要は金属を熱により接合して合成
振動体とし、基本的にはその音響インピーダンスが（Ｚ
0・ＺM）1/2＜ＺB＜Ｚ0の関係を満たしていればよい。
また、超音波探触子はシングル型としたが、リニアある
いはセクタ駆動される配列型その他の場合であっても同
様に製作できることはいうまでもない。そして、切断時
に固着したガラス等をそのまま基台４として使用しても
よい。[Other Matters] In the experiment in the above-mentioned embodiment, the difference between the peaks and valleys of the bimodal characteristics was found to be 6 dB or more. In such a case, for example, as shown in FIG. By adding an adjustment film (so-called acoustic matching layer) 8 made of resin or the like having a center frequency of ultrasonic waves of λ / 4 to 6 dB or less can be achieved. That is, even if there is a difference in peaks and troughs of 6 dB or more in the transmission / reception gain characteristic of the synthetic vibrating body 7, “(FIG. 5 (a)”) shows the propagation characteristic of the adjustment film 8 as shown in FIG. Center frequency f 0 at the apex (0 dB)
It has a single peak characteristic. Therefore, as a result, these two characteristics are added together, and the difference between the peaks and valleys of the bimodal characteristics can be reduced to 6 dB or less. Since the resonance frequency component of the piezoelectric element itself is mainly propagated, the propagation characteristic of the adjustment film 8 has a single-peak characteristic with the center frequency f 0 at the apex (0 dB). Further, the piezoelectric element 1 side has been described as the ultrasonic wave transmitting / receiving surface, but according to the experiment, substantially the same result was obtained even when the vibration damping material side 6 was used as the ultrasonic wave transmitting / receiving surface as shown in FIG.
However, in this case, the transmission / reception gain was slightly improved as compared with the example. It is considered that the reason for this is that the one with the smaller acoustic impedance was located on the detected body 5 side. As described above, in the embodiment, the vibration damping material 2 is provided on the side of the base 4, but any vibration damping material may be used. In short, the resonance of the piezoelectric element 1 is suppressed and the synthetic vibration having the resonance frequency on both sides is provided. It only has to function as the body 7. In any case, the ultrasonic waves are radiated to the base 4 side, but since they have a high frequency, they are diffusely reflected or absorbed by, for example, the base or an adhesive on the base, and there is almost no effect. Further, even if there is no base or adhesive in the extreme, it is scattered and absorbed in the ultrasonic air from the back side. Further, although the vibration damping material 6 is joined by melting as a solder, for example, thermocompression bonding of Al is also included. In short, a metal is joined by heat to form a synthetic vibrating body, and its acoustic impedance is basically (Z
It is sufficient that the relationship of 0 · Z M ) 1/2 <Z B <Z 0 is satisfied.
Further, although the ultrasonic probe is a single type, it goes without saying that the ultrasonic type probe can be similarly manufactured even in the case of a linear type or an array type driven by a sector. Then, the glass or the like fixed at the time of cutting may be directly used as the base 4.
【００１２】[0012]
【発明の効果】本発明は、振動制動材を金属の溶着によ
り圧電素子に接合して合成振動体を形成し、該合成振動
体の送受波特性を双峰特性とするとともに、該双峰特性
の山谷の差を６ｄＢ以内としたので、特に製作を容易と
して、高周波化及び高帯域化に適した超音波探触子を提
供できる。According to the present invention, a vibration damping material is bonded to a piezoelectric element by welding a metal to form a composite vibrating body, and the transmission / reception characteristic of the composite vibrating body is made to be a bimodal characteristic. Since the difference between the peaks and valleys of the characteristics is within 6 dB, it is possible to provide an ultrasonic probe which is particularly easy to manufacture and suitable for high frequency and high band.
【第１図】本発明の一実施例を説明する超音波探触子の
断面図である。FIG. 1 is a sectional view of an ultrasonic probe for explaining an embodiment of the present invention.
【第２図】本発明の一実施例の作用効果を説明する送受
波利得特性図である。FIG. 2 is a transmission / reception gain characteristic diagram for explaining an operation effect of one embodiment of the present invention.
【第３図】本発明の一実施例の作用を説明する図で、同
図（ａ）（ｂ）はいずれもアドミッタンス特性図、同図
（ｃ）は送受波利得特性図である。FIG. 3 is a diagram for explaining the operation of one embodiment of the present invention, where FIGS. 3A and 3B are admittance characteristic diagrams, and FIG. 3C is a transmission / reception gain characteristic diagram.
【第４図】本発明の他の実施例を説明する超音波探触子
の断面図である。FIG. 4 is a sectional view of an ultrasonic probe for explaining another embodiment of the present invention.
【第５図】本発明の他の実施例の作用を説明する図で、
同図（ａ）は送受波利得特性図、同図（ｂ）は伝搬損失
特性図、同図（ｃ）は送受波利得特性図である。FIG. 5 is a view for explaining the operation of another embodiment of the present invention,
7A is a transmission / reception gain characteristic diagram, FIG. 7B is a propagation loss characteristic diagram, and FIG. 7C is a transmission / reception gain characteristic diagram.
【第６図】本発明の他の実施例を説明する超音波探触子
の断面図である。FIG. 6 is a sectional view of an ultrasonic probe for explaining another embodiment of the present invention.
【第７図】従来例を説明する超音波探触子の断面図であ
る。FIG. 7 is a sectional view of an ultrasonic probe for explaining a conventional example.
【第８図】従来例を説明する送受波利得特性図である。FIG. 8 is a transmission / reception gain characteristic diagram for explaining a conventional example.
１ 圧電素子、２ バッキング材、３ 音響整合層、４
基台、５ 被検出体、６ 振動制動材、７ 合成振動
体、８ 調整膜．1 piezoelectric element, 2 backing material, 3 acoustic matching layer, 4
Base, 5 objects to be detected, 6 vibration damping materials, 7 synthetic vibrators, 8 adjustment film.
Claims (4)
た超音波探触子において、前記振動制動材を金属の溶着
により接合して合成振動体を形成し、該合成振動体の送
受波特性を双峰特性とするとともに、該双峰特性の山谷
の差を６ｄＢ以内としたことを特徴とする超音波探触
子。1. An ultrasonic probe formed by adding a vibration damping material to a piezoelectric element, wherein the vibration damping material is joined by welding of a metal to form a synthetic vibration body, and the synthetic vibration body is transmitted and received. An ultrasonic probe characterized in that a wave characteristic is a bimodal characteristic and a difference between peaks and valleys of the bimodal characteristic is within 6 dB.
は、（Ｚ0・ＺM）1/2＜ＺB＜Ｚ0を満足する第１項記載
の超音波探触子（但し、Ｚ0は圧電素子、ＺMは被検出体
の音響インピーダンスで、Ｚ０＞ＺM）。2. An acoustic impedance Z B of the vibration suppressing material.
Is the ultrasonic probe according to the first item that satisfies (Z 0 · Z M ) 1/2 <Z B <Z 0 (where Z 0 is a piezoelectric element, and Z M is the acoustic impedance of the object to be detected. , Z0> Z M ).
対して約λ／４となる調整膜を付加した第１項記載の超
音波探触子。3. The ultrasonic probe according to claim 1, wherein an adjusting film for adjusting the resonance frequency of the ultrasonic wave to about λ / 4 is added to the synthetic vibrator.
溶着して合成振動体を形成し、該合成振動体を個々に切
断分離して形成したことを特徴とする超音波探触子の製
造方法。4. An ultrasonic probe characterized in that a synthetic vibrating body is formed by welding a metal as a vibration damping material to one piezoelectric plate, and the synthetic vibrating body is individually cut and separated. Child manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08755994A JP3281719B2 (en) | 1994-03-31 | 1994-03-31 | Ultrasonic probe and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08755994A JP3281719B2 (en) | 1994-03-31 | 1994-03-31 | Ultrasonic probe and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07274291A true JPH07274291A (en) | 1995-10-20 |
| JP3281719B2 JP3281719B2 (en) | 2002-05-13 |
Family
ID=13918355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08755994A Expired - Fee Related JP3281719B2 (en) | 1994-03-31 | 1994-03-31 | Ultrasonic probe and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3281719B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004043618A1 (en) * | 2002-11-14 | 2004-05-27 | Kimberly-Clark Worldwide, Inc. | Ultrasonic horn assembly with fused stack components |
| WO2011033666A1 (en) * | 2009-09-18 | 2011-03-24 | 株式会社 東芝 | Medical array ultrasonic probe and medical ultrasonic diagnostic device |
-
1994
- 1994-03-31 JP JP08755994A patent/JP3281719B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004043618A1 (en) * | 2002-11-14 | 2004-05-27 | Kimberly-Clark Worldwide, Inc. | Ultrasonic horn assembly with fused stack components |
| US6786383B2 (en) | 2002-11-14 | 2004-09-07 | Kimberly-Clark Worldwide, Inc. | Ultrasonic horn assembly with fused stack components |
| WO2011033666A1 (en) * | 2009-09-18 | 2011-03-24 | 株式会社 東芝 | Medical array ultrasonic probe and medical ultrasonic diagnostic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3281719B2 (en) | 2002-05-13 |
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