JPH07240601A - Connection method for high frequency circuit board - Google Patents
Connection method for high frequency circuit boardInfo
- Publication number
- JPH07240601A JPH07240601A JP6032134A JP3213494A JPH07240601A JP H07240601 A JPH07240601 A JP H07240601A JP 6032134 A JP6032134 A JP 6032134A JP 3213494 A JP3213494 A JP 3213494A JP H07240601 A JPH07240601 A JP H07240601A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- conductor
- high frequency
- metallic base
- frequency circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Waveguide Connection Structure (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Waveguides (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高周波回路基板の接続
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting high frequency circuit boards.
【０００２】[0002]
【従来の技術】図２に従来の高周波回路基板の接続方法
を示す。誘電体である基板１、基板上に形成される高周
波信号の導体パタン２、金属ベース３、接続用の導体４
により構成されている。基板は金属ベースと電気的に導
通させるために、基板を金属ベース上に半田付けあるい
はネジ等により固定される。接続用の導体は、基板上の
導体パタンに両端を半田付けあるいは導電性の接着材等
により固定される。2. Description of the Related Art FIG. 2 shows a conventional method of connecting a high frequency circuit board. Substrate 1 which is a dielectric, high frequency signal conductor pattern 2 formed on the substrate, metal base 3, and connecting conductor 4
It is composed by. The board is fixed to the metal base by soldering or screws so that the board electrically connects with the metal base. Both ends of the connecting conductor are fixed to a conductor pattern on the substrate by soldering or a conductive adhesive material.
【０００３】このような従来の実装方法において、基
板、金属ベース、接続用の導体の熱膨張係数を合わせる
ことにより、温度変動により発生する接続部のストレス
を低減している。In such a conventional mounting method, by matching the thermal expansion coefficients of the substrate, the metal base, and the connecting conductor, the stress of the connecting portion caused by the temperature fluctuation is reduced.
【０００４】[0004]
【発明が解決しようとする課題】上記従来技術では、基
板、金属ベース、接続用の導体の熱膨張係数を合わせる
必要がある。高周波回路に使用される基板は、高周波領
域において伝播損失が小さい必要があり、テフロン、ア
ルミナセラミックス等がその要求を満たし使用されてい
る。加工の容易さ、量産に適していることからアルミナ
セラミックスが高周波回路基板に使用されることが多
い。このアルミナセラミックスの熱膨張係数は７×１０
~4Ｋ~1であり、同じ熱膨張係数をもつ金属としてコバー
ルがある。しかし、コバールは成分比により熱膨張係数
は５〜１１×１０~4Ｋ~1とばらつきが存在するため、成
分比を調整する必要があった。したがって、そのような
材料は高価になり、さらに、加工が困難であるという問
題があった。In the above conventional technique, it is necessary to match the thermal expansion coefficients of the substrate, the metal base, and the connecting conductor. Substrates used for high-frequency circuits are required to have small propagation loss in the high-frequency region, and Teflon, alumina ceramics, etc. are used to meet the demand. Alumina ceramics are often used for high-frequency circuit boards because they are easy to process and suitable for mass production. The coefficient of thermal expansion of this alumina ceramics is 7 × 10
~ A 4 K-1, there is Kovar metal having the same thermal expansion coefficient. However, since the coefficient of thermal expansion of Kovar varies from 5 to 11 × 10 4 K to 1 depending on the composition ratio, it is necessary to adjust the composition ratio. Therefore, there is a problem that such a material becomes expensive and is difficult to process.
【０００５】本発明の目的は、高周波回路基板の接続に
おいて、基板、金属ベース、接続用の導体の熱膨張係数
によらず、温度変動に対して安定な接続方法を提供する
ことにある。An object of the present invention is to provide a connection method which is stable with respect to temperature fluctuations in the connection of a high frequency circuit board regardless of the thermal expansion coefficients of the board, the metal base and the connecting conductor.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、接続用の導体を金属ベース側に凸状に成形したもの
を採用することにより基板間を接続する。In order to achieve the above object, substrates are connected by using a conductor for connection which is formed in a convex shape on the metal base side.
【０００７】[0007]
【作用】本発明では、基板、金属ベース、接続用の導体
の熱膨張係数の差により発生する基板間の距離の変動を
接続用の導体の一部に成形した凸部において吸収するこ
とにより、基板と接続用の導体の固定部に加わるストレ
スを低減し、温度変動に対して安定な接続を実現するこ
とができる。In the present invention, the variation in the distance between the substrates, which is caused by the difference in the thermal expansion coefficient between the substrate, the metal base, and the connecting conductor, is absorbed by the convex portion formed in a part of the connecting conductor. It is possible to reduce stress applied to the fixed portion of the board and the conductor for connection, and to realize stable connection with respect to temperature fluctuations.
【０００８】従来例として、接続用の導体の凸部を図１
のように金属ベース側にする場合とその逆に接続するこ
とも可能である。これを示したのが図３である。しか
し、高周波回路で重要となる基板の接続箇所におけるイ
ンピーダンスの不整合の点から考えると、接続用の導体
の凸部を金属ベース側にする方が有利である。図４に、
１０ＧＨｚにおいてグランド面の上に平行に厚さ０．１
ｍｍ、幅０．６ｍｍ、長さ１．０ｍｍの接続用の導体を
設けた場合、その高さを変化させてＶＳＷＲを計算した
結果を示す。図から、接続用の導体とグランド面との距
離が近い程、ＶＳＷＲが小さくなっていることから、イ
ンピーダンスの不整合は小さくできることがわかる。し
たがって、接続用の導体４の凸部を金属ベース側にする
方がインピーダンスの不整合は小さくなり、高周波回路
基板の接続に適している。As a conventional example, the projection of the connecting conductor is shown in FIG.
It is also possible to connect to the metal base side as shown in FIG. This is shown in FIG. However, from the viewpoint of impedance mismatch at the connection portion of the substrate, which is important in the high frequency circuit, it is advantageous to make the convex portion of the connecting conductor on the metal base side. In Figure 4,
A thickness of 0.1 parallel to the ground plane at 10 GHz.
When a conductor for connection having a size of mm, a width of 0.6 mm, and a length of 1.0 mm is provided, the height of the conductor is varied to calculate the VSWR. From the figure, it is understood that the closer the distance between the connecting conductor and the ground plane is, the smaller the VSWR becomes, and hence the impedance mismatch can be reduced. Therefore, when the convex portion of the connecting conductor 4 is on the metal base side, the impedance mismatch is smaller, and it is suitable for connecting the high frequency circuit board.
【０００９】[0009]
【実施例】図１に本発明の一実施例を示す。誘電体１
０、厚さ０．６３５ｍｍのセラミックスからなる基板１
の上に形成した幅０．６ｍｍのマイクロストリップライ
ン２から構成される高周波回路基板を金属ベース３の上
に実装する構成において、マイクロストリップラインと
同じ幅０．６ｍｍの板状の接続用の導体４の一部を半円
状に成形したものにより基板間を接続する方法である。
本実施例では、温度変動による基板、金属ベースの熱膨
張係数の差による接続箇所に加わるストレスは、接続用
の導体４の半円状の部分において吸収できる。また、接
続部のインピーダンス不整合を小さくするために、接続
用の導体４は板状にし、幅をマイクロストリップライン
の幅に合わせている。さらに、接続用の導体をグランド
に近くなるように、凸部を金属ベース側にして実装して
いる。FIG. 1 shows an embodiment of the present invention. Dielectric 1
0, a substrate 1 made of ceramics having a thickness of 0.635 mm
In a configuration in which a high-frequency circuit board formed of a microstrip line 2 having a width of 0.6 mm formed on the metal base 3 is mounted on the metal base 3, a plate-shaped connecting conductor having a width of 0.6 mm, which is the same as the microstrip line This is a method of connecting the substrates by forming a part of 4 into a semicircular shape.
In this embodiment, the stress applied to the connecting portion due to the difference in the thermal expansion coefficient between the substrate and the metal base due to the temperature fluctuation can be absorbed by the semicircular portion of the connecting conductor 4. Further, in order to reduce the impedance mismatch of the connecting portion, the connecting conductor 4 is formed in a plate shape and its width is adjusted to the width of the microstrip line. Further, the convex portion is mounted on the metal base side so that the connecting conductor is close to the ground.
【００１０】また、この実施例では、接続用の導体４の
凸部の形状を半円としているが、基板の熱による伸縮を
吸収できるような形状であれば問題は無い。Further, in this embodiment, the shape of the convex portion of the connecting conductor 4 is a semi-circle, but there is no problem as long as it can absorb the expansion and contraction of the substrate due to heat.
【００１１】[0011]
【発明の効果】本発明によれば、温度変動による基板間
の接続箇所における信頼性は十分確保することができ、
さらに、基板間の接続箇所におけるインピーダンスの不
整合を小さく抑えることができるという効果がある。According to the present invention, it is possible to sufficiently secure the reliability of the connection portion between the substrates due to the temperature fluctuation.
Further, there is an effect that it is possible to suppress the impedance mismatch at the connection portion between the substrates to be small.
【図１】本発明の一実施例を示す図である。FIG. 1 is a diagram showing an embodiment of the present invention.
【図２】第１の従来の高周波回路基板の接続方法を示す
図である。FIG. 2 is a diagram showing a method of connecting a first conventional high-frequency circuit board.
【図３】第２の従来の高周波回路基板の接続方法を示す
図である。FIG. 3 is a diagram showing a second conventional high-frequency circuit board connection method.
【図４】接続用の導体をグランド面の上に設けた場合の
ＶＳＷＲを計算した結果を示す図である。FIG. 4 is a diagram showing a result of calculation of VSWR when a connecting conductor is provided on a ground surface.
１…高周波回路基板、 ２…マイクロストリップライン、 ３…金属ベース、 ４…接続用の導体。 DESCRIPTION OF SYMBOLS 1 ... High frequency circuit board, 2 ... Microstrip line, 3 ... Metal base, 4 ... Conductor for connection.
Claims (1)
なくとも１個以上の高周波信号接続のための導体パタン
が形成された少なくとも１個以上の誘電体基板と、該誘
電体基板間を接続するための少なくとも１個以上の接続
導体から構成される高周波回路において、金属ベ−ス側
に凸状に成形した接続導体により接続することを特徴と
する高周波回路基板の接続方法。1. A metal base serving as a circuit common ground, at least one dielectric substrate having at least one conductor pattern for high-frequency signal connection, and for connecting between the dielectric substrates. In a high-frequency circuit composed of at least one or more connecting conductors, the connecting method is performed by using a connecting conductor formed in a convex shape on the metal base side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6032134A JPH07240601A (en) | 1994-03-02 | 1994-03-02 | Connection method for high frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6032134A JPH07240601A (en) | 1994-03-02 | 1994-03-02 | Connection method for high frequency circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07240601A true JPH07240601A (en) | 1995-09-12 |
Family
ID=12350431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6032134A Pending JPH07240601A (en) | 1994-03-02 | 1994-03-02 | Connection method for high frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07240601A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6791439B2 (en) | 2002-10-29 | 2004-09-14 | Mitsubishi Denki Kabushiki Kaisha | Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device |
| JP2006295393A (en) * | 2005-04-07 | 2006-10-26 | Mitsubishi Electric Corp | High frequency circuit |
| WO2014156683A1 (en) * | 2013-03-28 | 2014-10-02 | 株式会社日立国際電気 | High-frequency circuit device |
-
1994
- 1994-03-02 JP JP6032134A patent/JPH07240601A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6791439B2 (en) | 2002-10-29 | 2004-09-14 | Mitsubishi Denki Kabushiki Kaisha | Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device |
| JP2006295393A (en) * | 2005-04-07 | 2006-10-26 | Mitsubishi Electric Corp | High frequency circuit |
| WO2014156683A1 (en) * | 2013-03-28 | 2014-10-02 | 株式会社日立国際電気 | High-frequency circuit device |
| JP5844005B2 (en) * | 2013-03-28 | 2016-01-13 | 株式会社日立国際電気 | High frequency circuit equipment |
| US9467194B2 (en) | 2013-03-28 | 2016-10-11 | Hitachi Kokusai Electric, Inc. | High frequency circuit device |
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