JPH07122902A - Connection structure between microwave integrated circuit boards - Google Patents
Connection structure between microwave integrated circuit boardsInfo
- Publication number
- JPH07122902A JPH07122902A JP5270142A JP27014293A JPH07122902A JP H07122902 A JPH07122902 A JP H07122902A JP 5270142 A JP5270142 A JP 5270142A JP 27014293 A JP27014293 A JP 27014293A JP H07122902 A JPH07122902 A JP H07122902A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- microwave integrated
- circuit boards
- dielectric
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
Landscapes
- Waveguides (AREA)
- Waveguide Connection Structure (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はマイクロ波集積回路基板
間接続構造に関し、特に複数のマイクロ波集積回路基板
が互いに間隙をもって配設されたマイクロ波装置におけ
るマイクロ波集積回路基板間接続構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for connecting microwave integrated circuit boards, and more particularly to a structure for connecting microwave integrated circuit boards in a microwave device in which a plurality of microwave integrated circuit boards are arranged with a gap therebetween.
【０００２】[0002]
【従来の技術】従来、複数のマイクロ波集積回路基板を
並べて接続する場合、マイクロ波集積回路基板の誘電体
の温度による熱膨張係数の違いや、マイクロ波集積回路
基板を筐体にねじ止めするときの製作精度のばらつき等
からマイクロ波集積回路基板相互間に間隙が必要であ
る。2. Description of the Related Art Conventionally, when a plurality of microwave integrated circuit boards are connected side by side, the difference in the coefficient of thermal expansion due to the temperature of the dielectric of the microwave integrated circuit boards or the microwave integrated circuit boards are screwed to the housing. At this time, a gap is required between the microwave integrated circuit boards due to variations in manufacturing accuracy.
【０００３】このマイクロ波集積回路基板間接続構造に
おいては、図７及び図８に示すように、導電性ベースプ
レート１上のマイクロ波集積回路基板２，３のマイクロ
ストリップ線路４，５を接続導体１２で接続したとき、
接続導体１２上に誘電体片１３を乗せて接着している。In this microwave integrated circuit board connection structure, as shown in FIGS. 7 and 8, the microstrip lines 4 and 5 of the microwave integrated circuit boards 2 and 3 on the conductive base plate 1 are connected to the connecting conductor 12. When connecting with
A dielectric piece 13 is placed on and bonded to the connection conductor 12.
【０００４】すなわち、間隙６における誘電率はマイク
ロ波集積回路基板２，３の誘電率よりも低いため、間隙
６の部分でマイクロ波特性インピーダンスが不連続とな
る。これを補償するために、間隙６の部分において誘電
体片１３を接続導体１２上に接着している。That is, since the dielectric constant in the gap 6 is lower than that of the microwave integrated circuit boards 2 and 3, the microwave characteristic impedance is discontinuous in the gap 6. In order to compensate for this, the dielectric piece 13 is bonded onto the connecting conductor 12 in the gap 6.
【０００５】この場合、間隙６の大きさが周囲温度の変
化によって変化し、接続導体１２がその変化に対応する
ことができずに、接続導体１２が破断したり、あるいは
亀裂が生じたりすることがある。In this case, the size of the gap 6 changes due to a change in ambient temperature, the connecting conductor 12 cannot cope with the change, and the connecting conductor 12 breaks or cracks. There is.
【０００６】この問題を解決するために、図９及び図１
０に示すように、マイクロ波集積回路基板２，３のマイ
クロストリップ線路４，５に容量性スタブ１４，１５を
設けるとともに、容量性スタブ１４，１５間をたるみの
ある接続導体１６で接続している。In order to solve this problem, FIG. 9 and FIG.
As shown in 0, the capacitive stubs 14 and 15 are provided on the microstrip lines 4 and 5 of the microwave integrated circuit boards 2 and 3, and the capacitive stubs 14 and 15 are connected by the slack connecting conductor 16. There is.
【０００７】これによって、周囲温度が変化しても接続
部分が破断したり、あるいは亀裂が生じたりしないよう
にするとともに、マイクロ波特性インピーダンスの不連
続の補償を容易にしている。This prevents the connection portion from breaking or cracking even when the ambient temperature changes, and facilitates compensation of discontinuity in the microwave characteristic impedance.
【０００８】上記のマイクロ波集積回路基板間接続構造
については、特開平１−２５６８０１号公報に詳述され
ている。The connection structure between microwave integrated circuit boards is described in detail in Japanese Patent Laid-Open No. 1-256801.
【０００９】[0009]
【発明が解決しようとする課題】上述した従来のマイク
ロ波集積回路基板間接続構造では、複数のマイクロ波集
積回路基板を並べて接続する際に、それらマイクロ波集
積回路基板相互間に間隙が必要である。In the above-mentioned conventional microwave integrated circuit board connection structure, a gap is required between the microwave integrated circuit boards when connecting the plurality of microwave integrated circuit boards side by side. is there.
【００１０】しかしながら、筐体及びマイクロ波集積回
路基板各々の熱膨張係数が異なるため、周囲温度の変化
によって間隙の大きさが変化するので、マイクロ波集積
回路基板間を接続する接続導体をたるませて実装しなけ
ればならない。そのため、高周波的にインピーダンスが
不連続となり、高い周波数ほど、また接続する箇所が多
いほど通過周波数特性が劣化するという問題がある。However, since the housing and the microwave integrated circuit board have different thermal expansion coefficients, the size of the gap changes due to the change of the ambient temperature. Therefore, the connecting conductor connecting the microwave integrated circuit boards is slackened. Must be implemented. Therefore, there is a problem that the impedance becomes discontinuous in the high frequency, and the pass frequency characteristic deteriorates as the frequency becomes higher and the number of connecting points becomes larger.
【００１１】また、容量性スタブを設けてマイクロ波特
性インピーダンスの不連続を補償する構成が提案されて
いるが、この場合にはマイクロ波角周波数ω＝１／（Ｌ
Ｃ）1/2 にて周波数が決定されてしまい、広帯域にわた
って良好な特性が得られないという問題がある。Further, a structure has been proposed in which a capacitive stub is provided to compensate for the discontinuity of the microwave characteristic impedance. In this case, the microwave angular frequency ω = 1 / (L
C) The frequency is determined by 1/2 , and there is a problem that good characteristics cannot be obtained over a wide band.
【００１２】そこで、本発明の目的は上記問題点を解消
し、マイクロ波特性インピーダンスの不連続を低減する
ことができ、広帯域にわたって良好な特性を得ることが
できるマイクロ波集積回路基板間接続構造を提供するこ
とにある。Therefore, an object of the present invention is to solve the above problems, reduce the discontinuity of microwave characteristic impedance, and obtain good characteristics over a wide band. To provide.
【００１３】[0013]
【課題を解決するための手段】本発明によるマイクロ波
集積回路基板間接続構造は、表面にマイクロストリップ
線路を備えかつ裏面が導電性ベースプレートに固定され
た誘電体基板からなる複数のマイクロ波集積回路基板が
互いに間隙をもって配設されたマイクロ波装置における
マイクロ波集積回路基板間接続構造であって、前記間隙
に配設されかつ下面が前記導電性ベースプレートに固定
された誘電体と、互いに隣合うマイクロ波集積回路基板
間に前記誘電体を介して架設されかつ当該マイクロ波集
積回路基板各々の前記マイクロストリップ線路を接続す
る接続用導体リボンとを具備している。A microwave integrated circuit board connection structure according to the present invention comprises a plurality of microwave integrated circuits comprising a dielectric substrate having a microstrip line on the front surface and a back surface fixed to a conductive base plate. A microwave integrated circuit inter-substrate connecting structure in a microwave device in which substrates are arranged with a gap between each other, and a microwave is provided adjacent to each other with a dielectric substance disposed in the gap and having a lower surface fixed to the conductive base plate. And a connecting conductor ribbon that is provided between the wave integrated circuit boards via the dielectric and connects the microstrip lines of each of the microwave integrated circuit boards.
【００１４】[0014]
【実施例】次に、本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【００１５】図１は本発明の一実施例の斜視図であり、
図２は図１のＡＡ線に沿う矢視方向の断面図であり、図
３は図１のＢＢ線に沿う矢視方向の断面図である。これ
らの図において、導電性ベースプレート１上にはマイク
ロ波集積回路基板２，３が配置されている。FIG. 1 is a perspective view of an embodiment of the present invention.
2 is a sectional view taken along the line AA of FIG. 1 in the direction of the arrow, and FIG. 3 is a sectional view taken along the line BB of FIG. In these figures, the microwave integrated circuit boards 2 and 3 are arranged on the conductive base plate 1.
【００１６】マイクロ波集積回路基板２，３は裏面に面
導体が設けられ、表面に金属体のマイクロストリップ線
路４，５が設けられた誘電体基板からなっている。ま
た、マイクロ波集積回路基板２，３は導電性ベースプレ
ート１上に配置されるときに、相互間に間隙６が設けら
れている。The microwave integrated circuit boards 2 and 3 are made of a dielectric substrate having a surface conductor on the back surface and metal microstrip lines 4 and 5 on the surface. Further, when the microwave integrated circuit boards 2 and 3 are arranged on the conductive base plate 1, a gap 6 is provided between them.
【００１７】この間隙６においては誘電体７が導電性ベ
ースプレート１上に導電性接着によって固定されてお
り、この誘電体７の上を通って接続用導体リボン８がマ
イクロ波集積回路基板２，３各々のマイクロストリップ
線路４，５間に架設されている。この場合、誘電体７の
上面と接続用導体リボン８の下面とは互いに接着されて
いる。In this gap 6, a dielectric 7 is fixed on the conductive base plate 1 by conductive adhesion, and a conductor ribbon 8 for connection passes over the dielectric 7 and a microwave integrated circuit substrate 2, 3 is formed. It is installed between the respective microstrip lines 4 and 5. In this case, the upper surface of the dielectric 7 and the lower surface of the connecting conductor ribbon 8 are adhered to each other.
【００１８】これら誘電体７及び接続用導体リボン８に
よって、不平衡形マイクロ波ストリップ線路が形成され
る。この不平衡形マイクロ波ストリップ線路の特性イン
ピーダンスをＺ0 とすると、 Ｚ0 ＝３０ｌｎ｛［１＋４ｈ／ｗ0 ｛８ｈ／ｗ0 ＋［（８ｈ／ｗ0 ）2 ＋π2 ］ 1/2 ｝｝／（εw ）1/2 で近似することができるのは公知の事実である。ここ
で、ｈは誘電体７の厚み、ｗ0 はストリップ線路の厚さ
を０としたときの等価的な幅、εw は実効誘電率であ
る。The dielectric 7 and the connecting conductor ribbon 8 form an unbalanced microwave strip line. When the characteristic impedance of the unbalanced type microwave strip line and Z0, Z0 = 30ln {[1 + 4h / w0 {8h / w0 + [(8h / w0) 2 + π 2] 1/2}} / (εw) 1 / It is a known fact that it can be approximated by 2 . Here, h is the thickness of the dielectric 7, w0 is an equivalent width when the thickness of the strip line is 0, and εw is the effective dielectric constant.
【００１９】ストリップ線路の幅をｗとすると、実効誘
電率εw は、 εw ＝（εr ＋１）／２＋（εr −１）（１＋１０ｈ／ｗ）-1/2 である。ここで、εr は実効比誘電率である。When the width of the strip line is w, the effective permittivity εw is εw = (εr + 1) / 2 + (εr-1) (1 + 10h / w) -1/2 . Here, εr is the effective relative permittivity.
【００２０】この不平衡形マイクロ波ストリップ線路の
特性インピーダンスＺ0 がマイクロ波集積回路の特性イ
ンピーダンスと一致するような適当な誘電体７を選択
し、誘電体７の厚みと接続用導体リボン８の幅とを最適
化することによって、特性インピーダンスの不連続を減
少させることができる。An appropriate dielectric 7 is selected such that the characteristic impedance Z0 of this unbalanced microwave strip line matches the characteristic impedance of the microwave integrated circuit, and the thickness of the dielectric 7 and the width of the connecting conductor ribbon 8 are selected. By optimizing and, the discontinuity of the characteristic impedance can be reduced.
【００２１】例えば、誘電体７としてεr ＝２．５のテ
フロンを使用した場合、マイクロ波集積回路の特性イン
ピーダンスを５０Ωとすると、ｗ／ｈを２．５に近似、
すなわち誘電体７の厚みを１ｍｍとし、接続用導体リボ
ン８の幅を約２．５ｍｍとすることによって、５０Ωの
特性インピーダンスＺ0 を実現することができる。For example, when Teflon with ε r = 2.5 is used as the dielectric 7, and the characteristic impedance of the microwave integrated circuit is 50Ω, w / h is approximated to 2.5,
That is, by setting the thickness of the dielectric 7 to 1 mm and the width of the connecting conductor ribbon 8 to about 2.5 mm, the characteristic impedance Z0 of 50Ω can be realized.
【００２２】図４は本発明の他の実施例の斜視図であ
り、図５は図４のＣＣ線に沿う矢視方向の断面図であ
り、図６は図４のＤＤ線に沿う矢視方向の断面図であ
る。これらの図において、導電性ベースプレート１上に
はマイクロ波集積回路基板２，３が配置されている。FIG. 4 is a perspective view of another embodiment of the present invention, FIG. 5 is a sectional view taken along the line CC of FIG. 4, and FIG. 6 is a view taken along the line DD of FIG. It is sectional drawing of a direction. In these figures, the microwave integrated circuit boards 2 and 3 are arranged on the conductive base plate 1.
【００２３】マイクロ波集積回路基板２，３は裏面に面
導体が設けられ、表面に金属体のマイクロストリップ線
路４，５が設けられた誘電体基板からなっている。ま
た、マイクロ波集積回路基板２，３は導電性ベースプレ
ート１上に配置されるときに、相互間に間隙６が設けら
れている。The microwave integrated circuit boards 2 and 3 are made of a dielectric substrate having a surface conductor provided on the back surface and metal microstrip lines 4 and 5 provided on the surface. Further, when the microwave integrated circuit boards 2 and 3 are arranged on the conductive base plate 1, a gap 6 is provided between them.
【００２４】この間隙６においては誘電体７が導電性ベ
ースプレート１上に導電性接着によって固定され、この
誘電体７とその上に配置される誘電体９とによって接続
用導体リボン８が挟まれている。接続用導体リボン８は
マイクロ波集積回路基板２，３各々のマイクロストリッ
プ線路４，５間に架設されている。In the gap 6, the dielectric 7 is fixed on the conductive base plate 1 by conductive bonding, and the connecting conductor ribbon 8 is sandwiched between the dielectric 7 and the dielectric 9 arranged thereon. There is. The connecting conductor ribbon 8 is provided between the microstrip lines 4 and 5 of each of the microwave integrated circuit boards 2 and 3.
【００２５】この状態で、誘電体７，９と接続用導体リ
ボン８とは導電性ベースプレート１と同電位のクランプ
プレート１０によって互いに密着固定されている。クラ
ンププレート１０はネジ１１ａ，１１ｂによって導電性
ベースプレート１に固定されている。In this state, the dielectrics 7 and 9 and the connecting conductor ribbon 8 are closely fixed to each other by the clamp plate 10 having the same potential as the conductive base plate 1. The clamp plate 10 is fixed to the conductive base plate 1 with screws 11a and 11b.
【００２６】これら誘電体７，９と接続用導体リボン８
とクランププレート１０とによって、平衡形マイクロ波
ストリップ線路が形成される。この平衡形マイクロ波ス
トリップ線路の特性インピーダンスＺ0 は誘電体７，９
の厚さをｈとし、接続用導体リボン８の幅をｗとする
と、 ０＜ｗ／ｈ＜０．５６の場合、 Ｚ0 ＝６０／（εr ）1/2 ｛ｌｎ［２×ｃｏｔｈ（πｗ／２ｈ）］｝ で近似することができる。These dielectrics 7 and 9 and connecting conductor ribbon 8
The clamp plate 10 and the clamp plate 10 form a balanced microwave strip line. The characteristic impedance Z0 of this balanced microwave stripline is determined by the dielectrics 7, 9
And the width of the connecting conductor ribbon 8 is w, in the case of 0 <w / h <0.56, Z0 = 60 / (εr) 1/2 {ln [2 × coth (πw / 2h)]} can be approximated.
【００２７】また、０．５６≦ｗ／ｈの場合、 Ｚ0 ＝１４８／（εr ）1/2 ｛ｌｎ［２×ｅｘｐ（πｗ／２ｈ）］｝ で近似することができるのは公知の事実である。In the case of 0.56≤w / h, it is a known fact that the approximation can be made by Z0 = 148 / (εr) 1/2 {ln [2 × exp (πw / 2h)]}. is there.
【００２８】この平衡形マイクロ波ストリップ線路の特
性インピーダンスＺ0 がマイクロ波集積回路の特性イン
ピーダンスと一致するような適当な誘電体７，９を選択
し、誘電体７，９の厚さｈと接続用導体リボン８の幅ｗ
とを最適化することによって、特性インピーダンスの不
連続を減少させることができる。Suitable dielectrics 7 and 9 are selected so that the characteristic impedance Z0 of the balanced microwave strip line matches the characteristic impedance of the microwave integrated circuit, and the thickness h of the dielectrics 7 and 9 is used for connection. Width w of conductor ribbon 8
By optimizing and, the discontinuity of the characteristic impedance can be reduced.
【００２９】このように、マイクロ波集積回路基板２，
３の相互間に間隙６を設けて互いに接続する際に間隙６
に誘電体７，９を配置し、マイクロ波集積回路基板２，
３上のマイクロストリップ線路４，５を互いに接続する
接続用導体リボン８を誘電体７，９を介して架設するこ
とによって、マイクロ波集積回路基板２，３の相互間の
間隙６にマイクロストリップ線路を形成することができ
る。In this way, the microwave integrated circuit board 2,
When the gap 6 is provided between the three, and the gap 6 is connected to each other,
The dielectrics 7 and 9 are arranged on the microwave integrated circuit board 2,
The connecting conductor ribbons 8 for connecting the microstrip lines 4 and 5 on the microstrip line 3 to each other are provided via the dielectrics 7 and 9 so that the microstrip lines are provided in the gap 6 between the microwave integrated circuit boards 2 and 3. Can be formed.
【００３０】したがって、マイクロ波特性インピーダン
スの不連続を低減することができ、広帯域にわたって良
好な特性を得ることができる。これによって、従来のよ
うな等価Ｌ、等価Ｃによるマッチングの調整が不要とな
るので、マイクロ波集積回路基板２，３相互間の接続作
業を効率化することができる。Therefore, the discontinuity of the microwave characteristic impedance can be reduced, and good characteristics can be obtained over a wide band. This eliminates the need for the conventional adjustment of matching by the equivalent L and the equivalent C, so that the connection work between the microwave integrated circuit boards 2 and 3 can be made efficient.
【００３１】[0031]
【発明の効果】以上説明したように本発明によれば、複
数のマイクロ波集積回路基板相互の間隙に下面が導電性
ベースプレートに固定された誘電体を配設し、互いに隣
合うマイクロ波集積回路基板各々のマイクロストリップ
線路を接続する接続用導体リボンを当該マイクロ波集積
回路基板間に誘電体を介して架設することによって、マ
イクロ波特性インピーダンスの不連続を低減することが
でき、広帯域にわたって良好な特性を得ることができる
という効果がある。As described above, according to the present invention, a dielectric material whose lower surface is fixed to a conductive base plate is provided in a gap between a plurality of microwave integrated circuit substrates, and the microwave integrated circuits are adjacent to each other. By disposing the connecting conductor ribbon for connecting the microstrip lines of the respective boards through the microwave integrated circuit boards through the dielectric, it is possible to reduce the discontinuity of the microwave characteristic impedance, and it is good over a wide band. There is an effect that various characteristics can be obtained.
【図１】本発明の一実施例の斜視図である。FIG. 1 is a perspective view of an embodiment of the present invention.
【図２】図１のＡＡ線に沿う矢視方向の断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】図１のＢＢ線に沿う矢視方向の断面図である。3 is a cross-sectional view taken along the line BB of FIG. 1 and seen in the direction of the arrow.
【図４】本発明の他の実施例の斜視図である。FIG. 4 is a perspective view of another embodiment of the present invention.
【図５】図４のＣＣ線に沿う矢視方向の断面図である。5 is a cross-sectional view taken along the line CC of FIG. 4 in the direction of the arrow.
【図６】図４のＤＤ線に沿う矢視方向の断面図である。FIG. 6 is a cross-sectional view taken along the line DD in FIG.
【図７】従来例の斜視図である。FIG. 7 is a perspective view of a conventional example.
【図８】図７のＥＥ線に沿う矢視方向の断面図である。FIG. 8 is a cross-sectional view taken along the line EE of FIG.
【図９】従来例の斜視図である。FIG. 9 is a perspective view of a conventional example.
【図１０】図９のＦＦ線に沿う矢視方向の断面図であ
る。10 is a cross-sectional view taken along the line FF in FIG. 9 and seen in the direction of the arrow.
１ 導電性ベースプレート ２，３ マイクロ波集積回路基板 ４，５ マイクロストリップ線路 ６ 間隙 ７，９ 誘電体 ８ 接続用導体リボン １０ クランププレート 1 Conductive Base Plate 2, 3 Microwave Integrated Circuit Board 4, 5 Microstrip Line 6 Gap 7, 9 Dielectric 8 Connection Conductor Ribbon 10 Clamp Plate
Claims (4)
つ裏面が導電性ベースプレートに固定された誘電体基板
からなる複数のマイクロ波集積回路基板が互いに間隙を
もって配設されたマイクロ波装置におけるマイクロ波集
積回路基板間接続構造であって、前記間隙に配設されか
つ下面が前記導電性ベースプレートに固定された誘電体
と、互いに隣合うマイクロ波集積回路基板間に前記誘電
体を介して架設されかつ当該マイクロ波集積回路基板各
々の前記マイクロストリップ線路を接続する接続用導体
リボンとを含むことを特徴とするマイクロ波集積回路基
板間接続構造。1. A microwave integrated circuit in a microwave device in which a plurality of microwave integrated circuit boards each having a microstrip line on a front surface and a back surface fixed to a conductive base plate are arranged with a gap therebetween. In the inter-substrate connection structure, a dielectric body having a lower surface fixed to the conductive base plate and a microwave integrated circuit substrate adjacent to each other is installed via the dielectric body, and And a connecting conductor ribbon for connecting the microstrip lines of each of the microwave integrated circuit boards.
上面に当接して架設されたことを特徴とする請求項１記
載のマイクロ波集積回路基板間接続構造。2. The connection structure between microwave integrated circuit boards according to claim 1, wherein the conductor ribbon for connection is provided so as to abut on an upper surface of the dielectric.
貫通して架設されたことを特徴とする請求項１記載のマ
イクロ波集積回路基板間接続構造。3. The connection structure between microwave integrated circuit boards according to claim 1, wherein the connecting conductor ribbon is provided so as to extend through the dielectric.
各々に挟まれて架設されたことを特徴とする請求項１記
載のマイクロ波集積回路基板間接続構造。4. The connection structure between microwave integrated circuit boards according to claim 1, wherein the conductor ribbon for connection is provided so as to be sandwiched between a plurality of dielectrics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5270142A JPH07122902A (en) | 1993-10-28 | 1993-10-28 | Connection structure between microwave integrated circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5270142A JPH07122902A (en) | 1993-10-28 | 1993-10-28 | Connection structure between microwave integrated circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07122902A true JPH07122902A (en) | 1995-05-12 |
Family
ID=17482135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5270142A Pending JPH07122902A (en) | 1993-10-28 | 1993-10-28 | Connection structure between microwave integrated circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07122902A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295393A (en) * | 2005-04-07 | 2006-10-26 | Mitsubishi Electric Corp | High frequency circuit |
| KR100734332B1 (en) * | 2006-03-23 | 2007-07-02 | 이해영 | High-frequency transmission line device having slow-wave structure |
| WO2009016408A1 (en) * | 2007-07-31 | 2009-02-05 | Bae Systems Plc | Flexible joint |
| JP2012089935A (en) * | 2010-10-15 | 2012-05-10 | Nec Engineering Ltd | High frequency module connection structure |
| EP2471351B1 (en) * | 2009-12-31 | 2016-05-04 | Huawei Technologies Co., Ltd. | A microwave unit and method therefore |
-
1993
- 1993-10-28 JP JP5270142A patent/JPH07122902A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295393A (en) * | 2005-04-07 | 2006-10-26 | Mitsubishi Electric Corp | High frequency circuit |
| KR100734332B1 (en) * | 2006-03-23 | 2007-07-02 | 이해영 | High-frequency transmission line device having slow-wave structure |
| WO2009016408A1 (en) * | 2007-07-31 | 2009-02-05 | Bae Systems Plc | Flexible joint |
| EP2471351B1 (en) * | 2009-12-31 | 2016-05-04 | Huawei Technologies Co., Ltd. | A microwave unit and method therefore |
| JP2012089935A (en) * | 2010-10-15 | 2012-05-10 | Nec Engineering Ltd | High frequency module connection structure |
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