JPH07237267A - Structure for bonding resin case - Google Patents

Structure for bonding resin case

Info

Publication number
JPH07237267A
JPH07237267A JP6030450A JP3045094A JPH07237267A JP H07237267 A JPH07237267 A JP H07237267A JP 6030450 A JP6030450 A JP 6030450A JP 3045094 A JP3045094 A JP 3045094A JP H07237267 A JPH07237267 A JP H07237267A
Authority
JP
Japan
Prior art keywords
groove
side wall
resin adhesive
opening
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6030450A
Other languages
Japanese (ja)
Other versions
JP3355761B2 (en
Inventor
Minoru Tokuhara
実 徳原
Norio Matsuda
典朗 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP03045094A priority Critical patent/JP3355761B2/en
Publication of JPH07237267A publication Critical patent/JPH07237267A/en
Application granted granted Critical
Publication of JP3355761B2 publication Critical patent/JP3355761B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B29C66/1142—Single butt to butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124—Tongue and groove joints
    • B29C66/1244—Tongue and groove joints characterised by the male part, i.e. the part comprising the tongue
    • B29C66/12443—Tongue and groove joints characterised by the male part, i.e. the part comprising the tongue having the tongue substantially in the middle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124—Tongue and groove joints
    • B29C66/1246—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
    • B29C66/12461—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being rounded, i.e. U-shaped or C-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124—Tongue and groove joints
    • B29C66/1246—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
    • B29C66/12463—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being tapered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B29C66/53462—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies joining substantially flat covers and substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/543—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining more than two hollow-preforms to form said hollow articles
    • B29C66/5432—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining more than two hollow-preforms to form said hollow articles joining hollow covers and hollow bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/545—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles one hollow-preform being placed inside the other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To prevent a resin adhesive from squeezing out to obtain an ideally bonded state. CONSTITUTION:A width W1 between side walls 6a of a groove 6 is increased toward an opening. A width W2 between side walls 7a of a protuberance 7 is the same dimension. In the state that the protuberance 7 is set in the groove 6, an interval W3 between the side wall 6a of the groove 6 and the side wall 7a of the protuberance 7 is increased toward the opening of the groove 6. Therefore, when the protuberance 7 is set in the groove 6 with a resin adhesive of a predetermined amount injected into the groove 6, a force to suck up the resin adhesive by a capillary phenomenon is reduced toward the opening of the groove 6. As a result, there is no possibility that the resin adhesive may be sucked up to the opening of the groove 6, and the resin adhesive is prevented from squeezing outside. In addition, the protuberance 7 is guided into the groove 6 along the side walls 6a of the groove 6 to be disposed in nearly the center of the groove 6.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は、樹脂ケースの接着構
造に係り、詳しくは、例えば電子回路を外部環境から保
護するための樹脂ケースの接着構造に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin case bonding structure, and more particularly to a resin case bonding structure for protecting, for example, an electronic circuit from an external environment.

【０００２】[0002]

【従来の技術】従来、エポキシ樹脂等の熱硬化性樹脂を
接着剤として使用する接着構造が一般的に知られてお
り、このような接着構造は、例えば電子回路を外部環境
から保護するための樹脂ケースの接着に用いられてい
る。具体的には、図１０（ａ）において、一方の被接着
部材２１には凹部２２が形成され、他方の被接着部材２
３には凸部２４が形成されている。そして、これらの被
接着部材２１，２３を接着させるには、樹脂接着剤２５
を凹部２２内に注入した状態で同凹部２２に凸部２４を
配置し、樹脂接着剤２５を硬化させる。2. Description of the Related Art Conventionally, an adhesive structure using a thermosetting resin such as an epoxy resin as an adhesive has been generally known, and such an adhesive structure is used for protecting an electronic circuit from an external environment. Used for bonding resin cases. Specifically, in FIG. 10A, a concave portion 22 is formed in one adherend member 21 and the other adherend member 2 is formed.
A convex portion 24 is formed at 3. Then, in order to adhere these adhered members 21, 23, the resin adhesive 25
The resin adhesive 25 is cured by disposing the convex portion 24 in the concave portion 22 in a state of being injected into the concave portion 22.

【０００３】[0003]

【発明が解決しようとする課題】ところが、従来の接着
構造では、以下に示す問題があった。即ち、図１０
（ｂ）に示すように、凸部２４が凹部２２の一方の側壁
に偏って配置された場合、凹部２２の側壁と凸部２４の
側壁との間隔が小さくなり、毛細管現象によって凹部２
２の開口部まで樹脂接着剤２５が吸い上げられる。その
結果、樹脂接着剤２５が凹部２２の開口部から外部へは
み出てしまい、樹脂ケースの外観が著しく悪化するとい
う問題が生じる。ここで、毛細管現象による樹脂接着剤
の吸い上げは凹部２２の側壁と凸部２４の側壁との間隔
が小さくなる程、生じ易くなる。又、樹脂接着剤２５の
吸い上げにより部分的な接着剤不足が生じ、非接着面が
できたり空孔ができたりする等の接着不良が発生する。However, the conventional bonding structure has the following problems. That is, FIG.
As shown in (b), when the convex portion 24 is arranged so as to be biased to one side wall of the concave portion 22, the gap between the side wall of the concave portion 22 and the side wall of the convex portion 24 becomes small, and the concave portion 2 is caused by the capillary phenomenon.
The resin adhesive 25 is sucked up to the second opening. As a result, the resin adhesive 25 protrudes from the opening of the recess 22 to the outside, which causes a problem that the appearance of the resin case is significantly deteriorated. Here, the suction of the resin adhesive due to the capillary phenomenon is more likely to occur as the distance between the side wall of the concave portion 22 and the side wall of the convex portion 24 becomes smaller. Further, the resin adhesive 25 is sucked up to cause a partial lack of the adhesive, resulting in a defective adhesion such as a non-bonded surface or a hole.

【０００４】この発明は、上記問題に着目してなされた
ものであって、その目的とするところは、樹脂接着剤の
はみ出しを防止して、良好な接着状態を得ることができ
る樹脂ケースの接着構造を提供することにある。The present invention has been made in view of the above problems, and an object of the invention is to bond a resin case which can prevent a resin adhesive from squeezing out and obtain a good bonding state. To provide the structure.

【０００５】[0005]

【課題を解決するための手段】請求項１に記載した発明
は、一方の被接着部材に形成した凹部に、他方の被接着
部材に形成した凸部と樹脂接着剤とを配置し、該樹脂接
着剤の硬化により前記両被接着部材を接着させた樹脂ケ
ースの接着構造において、前記凹部の開口部における前
記凹部の側壁と前記凸部の側壁との間隔を、前記凹部の
内方部よりも大きくしたことを要旨としている。According to a first aspect of the present invention, a convex portion formed on another member to be adhered and a resin adhesive are arranged in a concave portion formed on one member to be adhered, and the resin is formed. In a resin case bonding structure in which both the members to be bonded are bonded by curing an adhesive, the distance between the side wall of the recess and the side wall of the protrusion in the opening of the recess is more than that of the inner part of the recess. The main idea is to make it larger.

【０００６】請求項１を引用する請求項２の発明では、
前記凹部の開口部に近い程、前記凹部の側壁と前記凸部
の側壁との間隔を大きくしている。請求項１を引用する
請求項３の発明では、前記凹部の開口部付近には、前記
凹部の側壁と前記凸部の側壁との間隔を局部的に大きく
する接着剤流入室を設けている。According to the invention of claim 2 which cites claim 1,
The distance between the side wall of the concave portion and the side wall of the convex portion is increased as the opening portion of the concave portion is closer. According to the invention of claim 3 which cites claim 1, an adhesive inflow chamber for locally increasing the distance between the side wall of the recess and the side wall of the projection is provided near the opening of the recess.

【０００７】請求項１〜３のいずれかを引用する請求項
４の発明では、前記凹部には、前記凸部を凹部の所定位
置に案内するための案内部を設けている。In the invention of claim 4 which cites any one of claims 1 to 3, the recess is provided with a guide portion for guiding the projection to a predetermined position of the recess.

【０００８】[0008]

【作用】請求項１に記載した第１の発明によれば、一方
の被接着部材の凹部に他方の被接着部材の凸部を配置す
る際において、凹部の開口部から外部への樹脂接着剤の
はみ出しが防止される。そして、樹脂接着剤の硬化によ
って、良好な接着状態が得られる。According to the first aspect of the present invention, when the convex portion of the other member to be adhered is arranged in the concave portion of the one member to be adhered, the resin adhesive from the opening of the concave portion to the outside is disposed. It is possible to prevent the sticking out. Then, by curing the resin adhesive, a good adhesive state can be obtained.

【０００９】即ち、従来の接着構造では、凸部が凹部の
一方の側壁に偏って配置されると、凹部の側壁と凸部の
側壁との間隔が小さくなり、その結果、毛細管現象によ
って樹脂接着剤が開口部まで吸い上げられ、外部へのは
み出しや接着不良等を招くおそれがあった。これに対し
て、本構成では、凹部の開口部における凹部の側壁と凸
部の側壁との間隔を凹部の内方部よりも大きくして、開
口部での毛細管現象による樹脂接着剤の吸い上げが起き
にくくなるようにしている。そのため、凸部が凹部の一
方の側壁に偏って配置される場合であっても、樹脂接着
剤が凹部の開口部まで吸い上げられることはなく、上記
従来の不具合が解消される。That is, in the conventional bonding structure, when the convex portion is arranged on one side wall of the concave portion, the distance between the side wall of the concave portion and the side wall of the convex portion becomes small, and as a result, the resin bonding is caused by the capillary phenomenon. The agent may be sucked up to the opening, which may result in protrusion to the outside or defective adhesion. On the other hand, in this configuration, the gap between the side wall of the concave portion and the side wall of the convex portion in the opening portion of the concave portion is made larger than that in the inner portion of the concave portion, so that the resin adhesive is sucked up by the capillary phenomenon in the opening portion. I try not to get up easily. Therefore, even when the convex portion is arranged on one side wall of the concave portion in a biased manner, the resin adhesive is not sucked up to the opening portion of the concave portion, and the above-mentioned conventional problems are eliminated.

【００１０】請求項２の構成によれば、凹部の開口部に
近い程、毛細管現象が及ぼす影響が徐々に軽減される。
この場合、凹部の底部付近では樹脂接着剤の吸い上げが
生じても、開口部に向かう程、樹脂接着剤の吸い上げが
弱められ、結果的に樹脂接着剤が凹部の開口部まで吸い
上げられるのが防止される。According to the structure of claim 2, the closer to the opening of the concave portion, the effect of the capillary phenomenon is gradually reduced.
In this case, even if the resin adhesive is sucked up near the bottom of the recess, it is prevented that the resin adhesive is sucked up toward the opening and consequently the resin adhesive is not sucked up to the opening of the recess. To be done.

【００１１】請求項３の構成によれば、仮に凹部の側壁
と凸部の側壁との間から樹脂接着剤が吸い上げられる場
合であっても、吸い上げられた樹脂接着剤は凹部の開口
部付近で接着剤流入室に流入する。その結果、樹脂接着
剤が凹部の開口部まで吸い上げられるのが防止される。According to the third aspect of the present invention, even if the resin adhesive is sucked up between the side wall of the concave portion and the side wall of the convex portion, the sucked resin adhesive is near the opening of the concave portion. It flows into the adhesive inflow chamber. As a result, the resin adhesive is prevented from being sucked up to the opening of the recess.

【００１２】請求項４の構成によれば、凸部は凹部の案
内部により凹部の所定位置に案内される。その結果、凸
部と凹部との位置ずれが確実に防止され、凸部と凹部と
は常に所望の接着箇所にて接着される。According to the structure of claim 4, the convex portion is guided to the predetermined position of the concave portion by the guide portion of the concave portion. As a result, the positional deviation between the convex portion and the concave portion is surely prevented, and the convex portion and the concave portion are always bonded at desired bonding points.

【００１３】[0013]

【実施例】【Example】

（第１実施例）以下、本発明を半導体圧力センサの樹脂
ケースに具体化した第１実施例について図面に従って説
明する。なお、実施例の半導体圧力センサはその上下方
向が特定されるものではないが、以下の説明では、便宜
上、図面の上下方向を半導体圧力センサの上下方向とす
る。(First Embodiment) A first embodiment in which the present invention is embodied in a resin case of a semiconductor pressure sensor will be described below with reference to the drawings. The vertical direction of the semiconductor pressure sensor of the embodiment is not specified, but in the following description, the vertical direction of the drawing is the vertical direction of the semiconductor pressure sensor for convenience.

【００１４】半導体圧力センサは自動車のエンジンルー
ム内に配置され、エンジンの吸気圧を検出する。図１に
は半導体圧力センサの全体構成を示している。図１にお
いて、半導体圧力センサの樹脂ケース１は底板２と枠体
３と蓋体４とから構成されている。これらの各部材２〜
４はＰＢＴ（ポリブチレンテレフタート）にて成形され
ており、本実施例における被接着部材を構成している。
つまり、略長方形枠状の枠体３を密閉させるべく同枠体
３の上下端に底板２及び蓋体４が樹脂接着剤５で接着固
定され、立方体状の樹脂ケース１が成形されている。樹
脂接着剤５としては熱硬化性樹脂（本実施例では、エポ
キシ樹脂）が用いられている。The semiconductor pressure sensor is arranged in the engine room of the automobile and detects the intake pressure of the engine. FIG. 1 shows the overall configuration of the semiconductor pressure sensor. In FIG. 1, a resin case 1 of a semiconductor pressure sensor is composed of a bottom plate 2, a frame body 3 and a lid body 4. Each of these members 2
Reference numeral 4 is formed of PBT (polybutylene terephthalate) and constitutes the adhered member in this embodiment.
That is, the bottom plate 2 and the lid body 4 are adhered and fixed to the upper and lower ends of the frame body 3 having a substantially rectangular frame shape with the resin adhesive 5 to form a cubic resin case 1. A thermosetting resin (epoxy resin in this embodiment) is used as the resin adhesive 5.

【００１５】各部材の接着構造について詳述する。底板
２の上面縁部及び枠体３の上端には、上方に開口する凹
部としての溝６が形成され、枠体３の下端及び蓋体４の
下面縁部には下方に延びる凸部としての突条７が形成さ
れている。ここで、図２（ａ），には、図１のＡ部（溝
６と突条７との接着部付近）における被接着部材の分解
図を示し、図２（ｂ）には、同じくＡ部における被接着
部材の組付図を示している。The bonding structure of each member will be described in detail. A groove 6 is formed as a concave portion that opens upward at the upper edge of the bottom plate 2 and the upper edge of the frame body 3, and a convex portion that extends downward is formed at the lower edge of the frame body 3 and the lower edge portion of the lid body 4. The ridge 7 is formed. Here, FIG. 2A shows an exploded view of a member to be adhered in a portion A of FIG. 1 (near the bonding portion between the groove 6 and the protrusion 7), and FIG. The assembly drawing of the to-be-bonded member in a part is shown.

【００１６】図２（ａ）において、溝６の側壁６ａは左
右対称に直線状に傾斜しており、その側壁６ａ間の幅Ｗ
1 は開口部に近い程、広くなっている。又、突条７の側
壁７ａは互いに平行であって、その側壁７ａ間の幅Ｗ2
は同一寸法になっている。そして、溝６に突条７が配置
された状態では、図２（ｂ）に示すように、溝６の側壁
６ａと突条７の側壁７ａとの間隔Ｗ3 （≒Ｗ1 ／２−Ｗ
2 ／２）が溝６の開口部に近い程、大きくなっている。In FIG. 2 (a), the side walls 6a of the groove 6 are linearly inclined symmetrically, and the width W between the side walls 6a.
1 is wider as it is closer to the opening. The side walls 7a of the ridges 7 are parallel to each other, and the width W 2 between the side walls 7a is
Have the same dimensions. Then, in the state in which the ridge 7 is arranged in the groove 6, as shown in FIG. 2B, the distance W 3 (≈W 1 / 2-W) between the side wall 6 a of the groove 6 and the side wall 7 a of the ridge 7 is set.
About 2/2) is closer to the opening of the groove 6 is larger.

【００１７】そして、上記の被接着部材（図２では、底
板２及び枠体３）を接着するには、最初に溝６内に所定
量の樹脂接着剤５を注入しておき、その後、突条７の下
面が溝６の底面に当接するまで突条７を溝６内に挿入す
る。ここで、突条７は案内部としての側壁６ａに沿って
溝部６内に案内され、溝部６の略中央に配置される。こ
のとき、突条７の略体積分だけ樹脂接着剤５の表面レベ
ルが上昇するが、溝６の開口部に近い程、間隔Ｗ3 が大
きくなることで、樹脂接着剤５が溝６の開口部まで吸い
上げられることはなく、樹脂接着剤５の外部へのはみ出
しが発生することはない。その後、樹脂接着剤５を加熱
処理することにより、同接着剤５が硬化し接着が完了す
る。In order to bond the members to be adhered (bottom plate 2 and frame body 3 in FIG. 2), a predetermined amount of resin adhesive 5 is first injected into the groove 6 and then the protrusion is applied. The ridge 7 is inserted into the groove 6 until the lower surface of the ridge 7 contacts the bottom surface of the groove 6. Here, the ridge 7 is guided into the groove portion 6 along the side wall 6a as a guide portion, and is arranged in the substantial center of the groove portion 6. At this time, the surface level of the resin adhesive 5 rises by substantially the volume of the ridges 7, but the distance W 3 increases toward the opening of the groove 6, so that the resin adhesive 5 opens in the groove 6. The resin adhesive 5 will not be sucked up to the outside, and the resin adhesive 5 will not be projected to the outside. Then, the resin adhesive 5 is heat-treated to cure the resin adhesive 5 and complete the adhesion.

【００１８】一方で、底板２上には回路基板９が載置さ
れている。同回路基板９上にはダイヤフラムを有する半
導体感圧素子１０が配置されている。半導体感圧素子１
０は歪みゲージと信号増幅部とをワンチップ化したもの
であって、ボンディングワイヤ１１により回路基板９上
の所定の導体パターンに接続されている。又、枠体３に
インサート成形されたピン１２は、ボンディングワイヤ
１１により回路基板９上の所定の導体パターンに接続さ
れている。On the other hand, a circuit board 9 is placed on the bottom plate 2. A semiconductor pressure sensitive element 10 having a diaphragm is arranged on the circuit board 9. Semiconductor pressure sensitive element 1
Reference numeral 0 denotes a strain gauge and a signal amplification unit which are integrated into one chip, and is connected to a predetermined conductor pattern on the circuit board 9 by a bonding wire 11. The pins 12 insert-molded in the frame 3 are connected to a predetermined conductor pattern on the circuit board 9 by the bonding wires 11.

【００１９】又、蓋体４には貫通孔１３が形成されてお
り、この貫通孔１３を介して圧力媒体（エンジン吸気）
からの圧力が底板２、枠体３及び蓋体４にて包囲される
圧力導入室１４に導入されるようになっている。A through hole 13 is formed in the lid 4, and a pressure medium (engine intake air) is passed through this through hole 13.
The pressure from is introduced into the pressure introducing chamber 14 surrounded by the bottom plate 2, the frame 3 and the lid 4.

【００２０】そして、上記のように構成された半導体圧
力センサによれば、圧力媒体（エンジン吸気）からの圧
力が貫通孔１３を介して圧力導入室１４に導入される
と、半導体感圧素子１０のピエゾ抵抗効果によって抵抗
変化が生じる。そして、半導体感圧素子１０の抵抗変化
に伴う信号がボンディングワイヤ１１，ピン１２を介し
てセンサ信号として外部に取り出される。According to the semiconductor pressure sensor configured as described above, when the pressure from the pressure medium (engine intake) is introduced into the pressure introducing chamber 14 through the through hole 13, the semiconductor pressure sensitive element 10 A change in resistance occurs due to the piezoresistive effect of. Then, the signal accompanying the resistance change of the semiconductor pressure sensitive element 10 is taken out to the outside as a sensor signal via the bonding wire 11 and the pin 12.

【００２１】以上のように本実施例の接着構造において
は、溝６の開口部に近い程、溝６の側壁６ａと突条７の
側壁７ａとの間隔Ｗ3 が大きくなるように、溝６の側壁
６ａを連続する傾斜面にて構成した。従って、溝６の開
口部に近い程、徐々に毛細管現象による影響を弱めるこ
とができ、溝６の開口部付近では樹脂接着剤５の吸い上
げを抑制することができる。その結果、溝６の開口部か
ら外部への樹脂接着剤５のはみ出しや接着不良等の不具
合が解消される。又、接着不良が解消されることによ
り、樹脂ケース１内の気密性を保つことができ、エンジ
ンルームでの使用に際してもケース内部の半導体素子等
の保護を図ることができる。As described above, in the adhesive structure of the present embodiment, the groove 6 is formed such that the distance W 3 between the side wall 6a of the groove 6 and the side wall 7a of the ridge 7 becomes larger as it is closer to the opening of the groove 6. The side wall 6a of the above is composed of a continuous inclined surface. Therefore, the closer to the opening of the groove 6, the effect due to the capillary phenomenon can be gradually weakened, and the suction of the resin adhesive 5 can be suppressed near the opening of the groove 6. As a result, problems such as protrusion of the resin adhesive 5 from the opening of the groove 6 to the outside and defective adhesion are eliminated. Further, since the adhesion failure is eliminated, the airtightness inside the resin case 1 can be maintained, and the semiconductor elements inside the case can be protected even when used in the engine room.

【００２２】又、粘度の低い樹脂接着剤や、熱硬化性樹
脂の加熱により一時的に粘度が低下する樹脂接着剤にお
いても、毛細管現象による樹脂接着剤５の吸い上げが大
幅に抑制され、従来のような不具合を解消することがで
きる。Further, even in the case of a resin adhesive having a low viscosity or a resin adhesive whose viscosity is temporarily reduced by heating a thermosetting resin, the uptake of the resin adhesive 5 due to the capillary phenomenon is significantly suppressed, and the conventional Such a problem can be solved.

【００２３】さらに、本実施例では、突条７は溝６の側
壁６ａに沿って溝６の所定位置（溝部６の略中央）に案
内されるようにした。そのため、溝６と突条７との相対
的な位置ずれが確実に防止され、溝６と突条７の接着を
常に所望の接着箇所にて行うことができる。Further, in this embodiment, the ridge 7 is guided along the side wall 6a of the groove 6 to a predetermined position of the groove 6 (approximately the center of the groove portion 6). Therefore, the relative displacement between the groove 6 and the ridge 7 is reliably prevented, and the groove 6 and the ridge 7 can always be bonded at a desired bonding position.

【００２４】なお、上記実施例では、溝６の側壁６ａ
（案内部）により突条７を溝６の略中央に配置する構成
としたが、突条７を溝６の中央に配置しなくとも本実施
例の効果を発揮することができる。即ち、突条７の位置
が溝６の一方の側壁６ａに偏って配置される場合であっ
ても、溝６の開口部に近い程、毛細管現象による樹脂接
着剤５の吸い上げが抑制されることで、樹脂接着剤５の
はみ出し等の不具合を従来に比べて大幅に軽減すること
ができる。In the above embodiment, the side wall 6a of the groove 6 is used.
Although the ridge 7 is arranged substantially at the center of the groove 6 by the (guide portion), the effect of this embodiment can be exhibited without arranging the ridge 7 at the center of the groove 6. That is, even when the positions of the protrusions 7 are arranged in one side wall 6 a of the groove 6, the closer to the opening of the groove 6, the more the suction of the resin adhesive 5 due to the capillary phenomenon is suppressed. Thus, problems such as the protrusion of the resin adhesive 5 can be greatly reduced compared to the conventional case.

【００２５】以下、この第１実施例の変形例としての接
着構造について、図３〜図６を用いて説明する。なお、
図３〜図６は図１のＡ部（底板２と枠体３との接着部）
付近を拡大して示すものである。A bonding structure as a modification of the first embodiment will be described below with reference to FIGS. In addition,
3 to 6 are portions A in FIG. 1 (bonding portion between the bottom plate 2 and the frame body 3).
It is an enlarged view of the vicinity.

【００２６】図３に示す接着構造において、突条７は断
面テーパ状に形成され、その幅Ｗ2は突条７の基端部に
近くなる程広くなるように構成されている。この場合、
溝６の断面と突条７の断面とは共にテーパ状になるが、
溝６の側壁６ａと突条７の側壁７ａとの間隔Ｗ3 が開口
部に近い程大きければ、上記実施例と同様に毛細管現象
による樹脂接着剤５のはみ出しを防止することができ
る。In the adhesive structure shown in FIG. 3, the ridge 7 is formed in a tapered shape in cross section, and the width W 2 thereof becomes wider as it gets closer to the base end of the ridge 7. in this case,
Both the cross section of the groove 6 and the cross section of the ridge 7 are tapered,
If the distance W 3 between the side wall 6a of the groove 6 and the side wall 7a of the ridge 7 is larger as it is closer to the opening, it is possible to prevent the resin adhesive 5 from squeezing out due to the capillary phenomenon as in the above embodiment.

【００２７】図４（ａ），（ｂ）に示す接着構造におい
て、溝６の側壁６ａは曲面にて構成されている。この場
合でも、溝６の側壁６ａと突条７の側壁７ａ（図４には
示さず）との間隔Ｗ3 が開口部に近い程大きくなれば、
上記と同様の作用・効果が得られる。なお、溝６の側壁
６ａと突条７の側壁７ａとの間隔Ｗ3 が開口部に近い程
大きくなるという条件を満たせば、上記の各形状に限定
されるものではなく、突条７の基端部を先端部よりも幅
狭にする等の形状も具体化可能である。In the bonded structure shown in FIGS. 4A and 4B, the side wall 6a of the groove 6 is formed by a curved surface. Even in this case, if the distance W 3 between the side wall 6a of the groove 6 and the side wall 7a of the ridge 7 (not shown in FIG. 4) becomes larger as it gets closer to the opening,
The same action and effect as above can be obtained. If the condition that the distance W 3 between the side wall 6a of the groove 6 and the side wall 7a of the ridge 7 becomes larger as it gets closer to the opening is not limited to the above-mentioned shapes, the base of the ridge 7 is not limited. It is also possible to embody a shape such as making the end portion narrower than the tip end portion.

【００２８】図５に示す接着構造において、枠体３の下
端には突条７と同方向に延びる突起片１５が設けられて
いる。この場合、樹脂接着剤５の注入量が多過ぎても同
接着剤５は突条７と突起片１５との間の空間に導入さ
れ、樹脂ケース１外部への樹脂接着剤５のはみ出しが防
止される。In the adhesive structure shown in FIG. 5, a protruding piece 15 extending in the same direction as the protruding strip 7 is provided at the lower end of the frame body 3. In this case, even if the injection amount of the resin adhesive 5 is too large, the adhesive 5 is introduced into the space between the ridge 7 and the protruding piece 15, and the resin adhesive 5 is prevented from protruding outside the resin case 1. To be done.

【００２９】図６に示す接着構造において、突条７の先
端部は断面半円状に形成され、溝６の底面は突条７の先
端よりも若干大きい曲率の曲面で形成されている。この
場合、突条７の先端及び溝６の底面を平坦に構成する場
合に比べて、両部材の位置決めが容易且つ確実に行われ
る。なお、枠体３は四方の突条７にて保持されるため、
枠体３が底板２に対して不安定になることはない。 （第２実施例）次いで、第２実施例について、上記第１
実施例との相違点を中心に説明する。なお、第２実施例
にて用いる図７〜図９は図１のＡ部（底板２と枠体３と
の接着部）付近を拡大して示すものである。In the bonded structure shown in FIG. 6, the tip of the ridge 7 is formed in a semicircular cross section, and the bottom surface of the groove 6 is formed as a curved surface having a curvature slightly larger than the tip of the ridge 7. In this case, the positioning of both members is performed more easily and reliably than in the case where the tips of the protrusions 7 and the bottom surface of the groove 6 are flat. Since the frame body 3 is held by the ridges 7 on all sides,
The frame 3 does not become unstable with respect to the bottom plate 2. (Second Embodiment) Next, regarding the second embodiment, the first
The difference from the embodiment will be mainly described. 7 to 9 used in the second embodiment are enlarged views of the vicinity of the portion A (bonding portion between the bottom plate 2 and the frame body 3) in FIG.

【００３０】図７に示すように、溝６の開口部には、段
差状の接着剤流入室（以下、単に流入室という）１６が
形成されている。この流入室１６は上下方向に平行に延
びる側壁６ａの一部を切り欠いて形成されるものであっ
て、この流入室１６によって溝６の側壁６ａと突条７の
側壁７ａとの間隔が局部的に大きくなっている。溝６の
側壁６ａの下端には、突条７を所定位置に案内するため
の斜状の案内面（案内部）１７が形成されている。As shown in FIG. 7, a stepped adhesive inflow chamber (hereinafter, simply referred to as inflow chamber) 16 is formed at the opening of the groove 6. The inflow chamber 16 is formed by cutting out a part of a side wall 6a extending parallel to the vertical direction, and the inflow chamber 16 allows the side wall 6a of the groove 6 and the side wall 7a of the ridge 7 to have a local gap. Is getting bigger. An inclined guide surface (guide portion) 17 for guiding the ridge 7 to a predetermined position is formed at the lower end of the side wall 6a of the groove 6.

【００３１】そして、２つの被接着部材を接着する際に
おいて、樹脂接着剤５を注入した溝６に突条７が挿入さ
れると、樹脂接着剤５は溝６の側壁６ａと突条７の側壁
７ａとの間を通って上昇し、流入室１６に流入する。こ
の場合、樹脂接着剤５の上昇動作は流入室１６にて弱め
られ、樹脂接着剤５が溝６の開口部（流入室１６の上端
部）まで上昇することはない。その結果、開口部から外
部への樹脂接着剤５のはみ出しが防止され、良好な接着
状態が得られる。When the two protrusions 7 are inserted into the groove 6 in which the resin adhesive 5 is injected when the two adhered members are adhered to each other, the resin adhesive 5 forms the side wall 6a of the groove 6 and the protrusion 7. It rises through between the side wall 7a and flows into the inflow chamber 16. In this case, the raising operation of the resin adhesive 5 is weakened in the inflow chamber 16, and the resin adhesive 5 does not rise to the opening of the groove 6 (the upper end of the inflow chamber 16). As a result, the resin adhesive 5 is prevented from protruding from the opening to the outside, and a good adhesion state is obtained.

【００３２】なお、図７では、溝６の案内面１７により
突条７を溝６の略中央に配置する構成としたが、突条７
を溝６の中央に配置しなくとも本実施例の効果を発揮す
ることができる。即ち、突条７が溝６の一方の側壁６ａ
に偏って配置される場合であっても、毛細管現象により
吸い上げられた樹脂接着剤５が流入室１６に流入した時
点でそれ以上の上昇が抑えられ、外部への流出が防止さ
れる。In FIG. 7, the guide surface 17 of the groove 6 is used to dispose the ridge 7 substantially at the center of the groove 6.
The effect of this embodiment can be exhibited without arranging at the center of the groove 6. That is, the ridge 7 is one side wall 6 a of the groove 6.
Even when the resin adhesive 5 sucked up by the capillarity flows into the inflow chamber 16, the further rise is suppressed and the outflow to the outside is prevented even when the resin adhesive 5 is unevenly arranged.

【００３３】以下には、第２実施例の接着構造を変形し
た他の実施例について、図７との相違点を中心に説明す
る。図８（ａ），（ｂ）は溝６に形成した流入室１６の
構成を変更した事例を示している。図８（ａ）におい
て、溝６の上方には上板１８が設けられ、流入室１６は
内側にのみ開口している。この場合、樹脂接着剤５のは
み出しが上板１８によって妨げられる。又、図８（ｂ）
において、溝６には流入室１６が複数段（図では２段）
に形成されている（流入室１６の形状は任意であって、
成形が容易な形状が好ましい）。この場合、樹脂接着剤
５の上昇がいずれかの流入室１６にて確実に止められ、
溝６の開口部から外部へのはみ出しが防止される。In the following, another embodiment in which the adhesive structure of the second embodiment is modified will be described focusing on the difference from FIG. 8A and 8B show an example in which the structure of the inflow chamber 16 formed in the groove 6 is changed. In FIG. 8A, an upper plate 18 is provided above the groove 6 and the inflow chamber 16 is open only inside. In this case, the protrusion of the resin adhesive 5 is blocked by the upper plate 18. Also, FIG. 8 (b)
In, the groove 6 has a plurality of inflow chambers 16 (two in the figure)
(The shape of the inflow chamber 16 is arbitrary,
A shape that is easy to mold is preferable). In this case, the rise of the resin adhesive 5 is surely stopped in any of the inflow chambers 16,
The protrusion from the opening of the groove 6 to the outside is prevented.

【００３４】図９に示す接着構造においては、溝６の側
壁６ａが開口部まで同一寸法で構成され、突条７の側壁
７ａの切欠により突条７側に流入室１６が形成されてい
る。この場合においても、上記図７，図８と同様の作用
・効果が得られる。In the bonded structure shown in FIG. 9, the side wall 6a of the groove 6 is formed to have the same size up to the opening, and the inflow chamber 16 is formed on the side of the ridge 7 by the notch of the side wall 7a of the ridge 7. Also in this case, the same action and effect as those in FIGS. 7 and 8 can be obtained.

【００３５】さらに、上記各実施例は以下に示す様態で
も具体化することができる。上記各実施例では、半導体
圧力センサの樹脂ケースに具体化していたが、これと同
様に半導体回路を含む加速度センサやＭＲＥセンサ等の
ケースに具体化したり、ＥＣＵの保護ケースに具体化す
ることもできる。Further, each of the above-mentioned embodiments can be embodied in the following modes. In each of the above-described embodiments, the resin case of the semiconductor pressure sensor is embodied, but likewise, it may be embodied as a case such as an acceleration sensor or a MRE sensor including a semiconductor circuit, or as an ECU protection case. it can.

【００３６】上記各実施例では、樹脂接着剤としてエポ
キシ樹脂を用いたが、ユリア樹脂，メラミン樹脂，フェ
ノール樹脂等の他の熱硬化性樹脂を用いることも可能で
ある。In each of the above embodiments, the epoxy resin is used as the resin adhesive, but other thermosetting resins such as urea resin, melamine resin and phenol resin can also be used.

【００３７】[0037]

【発明の効果】請求項１の発明によれば、凹部の開口部
における凹部の側壁と凸部の側壁との間隔を凹部の内方
部よりも大きくしたことにより、毛細管現象による樹脂
接着剤の外部へのはみ出しを防止して良好な接着状態を
得ることができるという優れた効果を発揮する。According to the invention of claim 1, the gap between the side wall of the concave portion and the side wall of the convex portion in the opening portion of the concave portion is made larger than that of the inner portion of the concave portion. It has an excellent effect that it can be prevented from protruding to the outside and a good adhesion state can be obtained.

【００３８】請求項２の発明によれば、凹部の開口部に
近い程、毛細管現象による樹脂接着剤の吸い上げが弱め
られ、凹部の開口部から外部への樹脂接着剤のはみ出し
を確実に防止することができる。According to the second aspect of the present invention, the closer to the opening of the recess, the weaker the suction of the resin adhesive due to the capillary phenomenon is, and the protrusion of the resin adhesive from the opening of the recess to the outside is surely prevented. be able to.

【００３９】請求項３の発明によれば、吸い上げられた
樹脂接着剤が接着剤流入室に流入することにより、凹部
の開口部から外部への樹脂接着剤のはみ出しを確実に防
止することができる。According to the third aspect of the present invention, the resin adhesive sucked up flows into the adhesive inflow chamber, so that the resin adhesive can be reliably prevented from protruding from the opening of the recess to the outside. .

【００４０】請求項４の発明によれば、凸部と凹部との
位置ずれが確実に防止され、毛細管現象による悪影響を
さらに低減させることができる。According to the fourth aspect of the invention, the positional deviation between the convex portion and the concave portion can be surely prevented, and the adverse effect due to the capillary phenomenon can be further reduced.

【図面の簡単な説明】[Brief description of drawings]

【図１】第１実施例における半導体圧力センサの構成を
示す側断面図である。FIG. 1 is a side sectional view showing a configuration of a semiconductor pressure sensor in a first embodiment.

【図２】（ａ），（ｂ）は共に、第１実施例における樹
脂ケースの接着構造を拡大して示す断面図である。2 (a) and 2 (b) are sectional views showing, in an enlarged manner, an adhesive structure of a resin case in the first embodiment.

【図３】第１実施例の変形例における接着構造を示す断
面図である。FIG. 3 is a cross-sectional view showing an adhesive structure in a modified example of the first embodiment.

【図４】（ａ），（ｂ）は共に、第１実施例の変形例に
おける凹部の形状を示す断面図である。FIGS. 4A and 4B are cross-sectional views showing the shape of a recess in a modification of the first embodiment.

【図５】第１実施例の変形例における接着構造を示す断
面図である。FIG. 5 is a cross-sectional view showing an adhesive structure in a modification of the first embodiment.

【図６】第１実施例の変形例における接着構造を示す断
面図である。FIG. 6 is a sectional view showing an adhesive structure in a modification of the first embodiment.

【図７】第２実施例における接着構造を示す断面図であ
る。FIG. 7 is a cross-sectional view showing an adhesive structure in a second embodiment.

【図８】（ａ），（ｂ）は共に、第２実施例の変形例に
おける接着構造を示す断面図である。8A and 8B are cross-sectional views showing a bonding structure in a modified example of the second embodiment.

【図９】第２実施例の変形例における接着構造を示す断
面図である。FIG. 9 is a cross-sectional view showing an adhesive structure in a modification of the second embodiment.

【図１０】（ａ），（ｂ）は共に、従来技術における接
着構造を示す断面図である。10 (a) and 10 (b) are cross-sectional views showing an adhesive structure in the prior art.

【符号の説明】[Explanation of symbols]

１…樹脂ケース、２…被接着部材としての底板、３…被
接着部材としての枠体、４…被接着部材としての蓋体、
５…樹脂接着剤、６…凹部としての溝、６ａ…側壁、７
…凸部としての突条、７ａ…側壁、１６…接着剤流入
室、１７…案内部としての案内面。DESCRIPTION OF SYMBOLS 1 ... Resin case, 2 ... Bottom plate as adherend member, 3 ... Frame body as adherend member, 4 ... Lid body as adherend member,
5 ... Resin adhesive, 6 ... Groove as recess, 6a ... Side wall, 7
... Projections as protrusions, 7a ... Side walls, 16 ... Adhesive inflow chamber, 17 ... Guide surface as guide portions.

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 一方の被接着部材に形成した凹部に、他
方の被接着部材に形成した凸部と樹脂接着剤とを配置
し、該樹脂接着剤の硬化により前記両被接着部材を接着
させた樹脂ケースの接着構造において、 前記凹部の開口部における前記凹部の側壁と前記凸部の
側壁との間隔を、前記凹部の内方部よりも大きくしたこ
とを特徴とする樹脂ケースの接着構造。1. A convex portion formed on the other member to be adhered and a resin adhesive are arranged in a concave portion formed on one member to be adhered, and the two members to be adhered are adhered by curing the resin adhesive. In the resin case bonding structure, the distance between the sidewall of the recess and the sidewall of the protrusion in the opening of the recess is larger than that of the inner portion of the recess. 【請求項２】 前記凹部の開口部に近い程、前記凹部の
側壁と前記凸部の側壁との間隔を大きくした請求項１に
記載の樹脂ケースの接着構造。2. The resin case bonding structure according to claim 1, wherein the distance between the side wall of the concave portion and the side wall of the convex portion is increased as it is closer to the opening of the concave portion. 【請求項３】 前記凹部の開口部付近には、前記凹部の
側壁と前記凸部の側壁との間隔を局部的に大きくする接
着剤流入室を設けた請求項１に記載の樹脂ケースの接着
構造。3. The resin case bonding according to claim 1, wherein an adhesive inflow chamber for locally increasing a distance between the side wall of the recess and the side wall of the protrusion is provided near the opening of the recess. Construction. 【請求項４】 前記凹部には、前記凸部を凹部の所定位
置に案内するための案内部を設けた請求項１〜３のいず
れかに記載の樹脂ケースの接着構造。4. The resin case bonding structure according to claim 1, wherein the concave portion is provided with a guide portion for guiding the convex portion to a predetermined position of the concave portion.
JP03045094A 1994-02-28 1994-02-28 Adhesive structure of resin case Expired - Lifetime JP3355761B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03045094A JP3355761B2 (en) 1994-02-28 1994-02-28 Adhesive structure of resin case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03045094A JP3355761B2 (en) 1994-02-28 1994-02-28 Adhesive structure of resin case

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Publication Number Publication Date
JPH07237267A true JPH07237267A (en) 1995-09-12
JP3355761B2 JP3355761B2 (en) 2002-12-09

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