JPH07214486A - Gripping device with gripping temperature control function - Google Patents
Gripping device with gripping temperature control functionInfo
- Publication number
- JPH07214486A JPH07214486A JP6010410A JP1041094A JPH07214486A JP H07214486 A JPH07214486 A JP H07214486A JP 6010410 A JP6010410 A JP 6010410A JP 1041094 A JP1041094 A JP 1041094A JP H07214486 A JPH07214486 A JP H07214486A
- Authority
- JP
- Japan
- Prior art keywords
- gripping
- temperature
- grip
- gripping device
- temperature control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manipulator (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、環境条件（特に温度条
件）が厳しい月面基地、惑星基地、宇宙ステーション等
において、その温度範囲が広い対象物把持部を把持する
把持装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gripping device for gripping an object gripping part having a wide temperature range in a lunar base, a planetary base, a space station, etc. where environmental conditions (particularly temperature conditions) are severe.
【０００２】[0002]
【従来の技術】図８は本発明が適用される把持機構の概
要を示す説明図である。例えばロボットアーム等の先端
にとりつけられた把持装置１０は、本体１２の先端部に
第１の把持手段２０を備える。この把持手段２０は３本
の爪２２を有し、爪２２はリモートコントロールにより
開閉操作を行なう。把持装置１０の本体１２の外周部に
はＴＶカメラ１４等が装備されて把持操作を監視する。
把持対象物５０は、例えば宇宙空間にある人工衛星等で
あって、本体５２の端部に第２の把持手段６０を備え
る。第２の把持手段６０は、例えば、第１の把持手段２
０の爪２２が係合するスリット６２を有し、このスリッ
ト６２に対して、爪２２を案内するテーパー状の案内面
６３を備える。この種の把持装置は、特開平１−１６９
１２１号公報に開示されている。2. Description of the Related Art FIG. 8 is an explanatory view showing an outline of a gripping mechanism to which the present invention is applied. For example, the gripping device 10 attached to the tip of a robot arm or the like includes a first gripping means 20 at the tip of the main body 12. The gripping means 20 has three claws 22, and the claws 22 are opened and closed by remote control. A TV camera 14 or the like is mounted on the outer peripheral portion of the main body 12 of the gripping device 10 to monitor the gripping operation.
The gripping target 50 is, for example, an artificial satellite or the like in outer space, and has a second gripping means 60 at the end of the main body 52. The second grip means 60 is, for example, the first grip means 2
0 has a slit 62 with which the claw 22 is engaged, and a tapered guide surface 63 for guiding the claw 22 is provided for the slit 62. This type of gripping device is disclosed in Japanese Patent Laid-Open No. 1-169.
No. 121 is disclosed.
【０００３】対象物５０を把持する際には、ロボットア
ーム等を操作して把持装置１０を対象物５０に近づけ、
第１の把持手段２０の爪２２を対象物５０の第２の把持
手段６０のスリット６２に挿入し、両者の結合を行な
う。この結合により、把持装置１０に設けた電気コネク
タ３０，３５は対象物５０に設けた電気コネクタ３２，
３７に結合され、両者は電気的に接続される。必要に応
じて、把持装置１０の中心部にシャフト２４を設けてお
き、対象物５０にも対応するシャフト６４を設けること
により、把持装置１０から対象物５０にトルクの伝達を
行なうこともできる。宇宙空間等にあっては、地球上の
温度状態に比べて、温度状態の変動が大きくなるので、
宇宙航行物体の温度を測定し、温度制御するものは、例
えば、特開平３−５７７９９号公報、特開平２−２７９
４９９号公報等に開示されている。同じく、宇宙空間で
使用する把持装置の把持部の温度状態と把持対象物の把
持部の温度状態が大きく異なる場合が生ずる。すなわ
ち、把持装置及び対象物把持部のうち熱的にクリティカ
ルな把持装置の許容温度範囲を設定し、機械的制条件
（材質、線膨張係数、はめあい等）から対象物把持部の
許容温度範囲が設定されている。When gripping the object 50, the robot arm or the like is operated to bring the gripping device 10 close to the object 50,
The claws 22 of the first gripping means 20 are inserted into the slits 62 of the second gripping means 60 of the object 50 to connect them. By this coupling, the electrical connectors 30 and 35 provided on the gripping device 10 are connected to the electrical connectors 32 and 35 provided on the object 50.
37, and both are electrically connected. If necessary, the shaft 24 is provided in the center of the gripping device 10 and the shaft 64 corresponding to the object 50 is also provided, so that torque can be transmitted from the gripping device 10 to the object 50. In outer space, etc., the temperature condition changes more greatly than the temperature condition on the earth.
A device for measuring the temperature of a space navigation object and controlling the temperature is disclosed in, for example, JP-A-3-57799 and JP-A-2-279.
No. 499, etc. Similarly, there may be a case where the temperature state of the grip portion of the grip device used in outer space and the temperature state of the grip portion of the object to be gripped differ greatly. That is, the allowable temperature range of the thermally critical gripping device of the gripping device and the object gripping part is set, and the allowable temperature range of the object gripping part is set from the mechanical control conditions (material, linear expansion coefficient, fit, etc.). It is set.
【０００４】図９は、この許容温度の設定を示す説明図
である。すなわち、対象物はその把持部が許容温度範囲
内となるよう熱設計を行う。しかし、対象物は受動的熱
制御が主となるため、対象物把持部の温度データが測定
不可能な場合が多い。そのため、この設計法は、環境条
件（特に温度条件）が既知で対象物温度が予測が可能な
人工衛星においては有効であるが、環境条件が著しく変
化したり、また、対象物温度が予期できないシステム
（月面基地、惑星基地等）においては、把持対象物の温
度が許容温度範囲外になる可能性があり、また把持対象
物の温度測定ができない場合には把持装置で対象物把持
部を把持可能か否かが判断できない不具合が生ずる。FIG. 9 is an explanatory diagram showing the setting of the allowable temperature. That is, the object is thermally designed so that the grip portion is within the allowable temperature range. However, since the object is mainly passive thermal control, the temperature data of the object gripping part cannot be measured in many cases. Therefore, this design method is effective for artificial satellites whose environmental conditions (especially temperature conditions) are known and whose target temperature can be predicted, but the environmental conditions change significantly and the target temperature cannot be predicted. In the system (Lunar base, planet base, etc.), the temperature of the object to be grasped may be outside the allowable temperature range. There is a problem that it is not possible to judge whether or not it can be held.
【０００５】[0005]
【発明が解決しようとする課題】把持装置で把持対象物
を把持可能か否かを判断するためには、把持装置側で対
象物把持部の温度測定可能でなくてはならない。また、
実際対象物把持部が許容温度範囲外であっても、把持装
置と把持対象物の温度差が許容温度範囲内であれば把持
可能である。つまり、把持装置と把持対象物の温度が測
定できて、お互いの機械的条件（材質、線膨張係数、は
めあい等）がわかっていれば、把持装置が対象物把持部
を機械的に把持可能かの判断ができる。また、把持不可
能の判定がでても、許容温度差以内になれば把持可能で
ある。そこで、把持装置が把持対象物を把持できるよう
に、把持対象物または把持装置自身の温度を制御し把持
可能な温度差にする機能が必要となる。よって、本発明
の目的は、把持装置と対象物の温度を直接的または間接
的に測定でき、対象物または把持装置自身の温度を制御
し把持可能な温度差に収める機能を有する把持装置を提
供することにある。In order to judge whether or not the object to be grasped can be grasped by the grasping device, the temperature of the object grasping portion must be measurable on the grasping device side. Also,
Even if the target object gripping portion is actually outside the allowable temperature range, it can be gripped if the temperature difference between the gripping device and the target object is within the allowable temperature range. In other words, if the temperature of the gripping device and the gripping target can be measured and the mutual mechanical conditions (material, linear expansion coefficient, fit, etc.) are known, then the gripping device can mechanically grip the target gripping part. You can judge. Even if it is determined that gripping is impossible, gripping is possible if it is within the allowable temperature difference. Therefore, it is necessary to have a function of controlling the temperature of the object to be grasped or the grasping device itself so that the grasping device can grasp the object to be grasped so as to obtain a temperature difference capable of grasping. Therefore, an object of the present invention is to provide a gripping device capable of directly or indirectly measuring the temperature of the gripping device and an object, and having a function of controlling the temperature of the object or the gripping device itself so that the temperature difference can be held within a grippable temperature difference. To do.
【０００６】[0006]
【課題を解決するための手段】上記目的を達するため
に、把持装置と対象物の温度が測定可能とし、把持対象
物と把持装置自身の温度を直接的または間接的に測定す
るために温度センサまたは赤外線センサを用いる。次
に、対象物と把持装置の温度とお互いの機械的条件（材
質、線膨張係数、はめあい等）から、把持可能か否かの
判断または把持可能な温度差を算出する計算機能を持た
せる。また、対象物と把持装置の温度差を許容範囲に制
御するため把持装置に、対象物を温度制御する機能また
は把持装置自身を温度制御する機能を持たせる。前者と
して、例えばレイザー光等の放射光により対象物を加熱
する方法がある。後者として、把持装置を内臓ヒータに
より加熱したり、放熱面を増やすことにより冷却して温
度制御する。In order to achieve the above object, the temperature of a gripping device and an object can be measured, and a temperature sensor for directly or indirectly measuring the temperature of the gripping object and the gripping device itself. Alternatively, an infrared sensor is used. Next, a calculation function is provided to judge whether gripping is possible or to calculate a gripping temperature difference from the temperature of the object and the gripping device and the mutual mechanical conditions (material, linear expansion coefficient, fit, etc.). Further, in order to control the temperature difference between the target object and the gripping device within an allowable range, the gripping device is provided with a function of controlling the temperature of the target object or a function of controlling the temperature of the gripping device itself. As the former, there is a method of heating an object with radiant light such as laser light. As the latter, the gripping device is heated by a built-in heater or cooled by increasing the heat radiation surface to control the temperature.
【０００７】[0007]
【作用】本発明によれば、把持部は能動的に温度制御さ
れる。したがって、環境条件（特に温度条件）が著しく
変化し、把持対象物の温度が受動的な熱制御だけでは、
許容温度範囲に入れる事ができない場合においても、把
持装置の対象物把持が可能となる。According to the present invention, the temperature of the grip portion is actively controlled. Therefore, environmental conditions (especially temperature conditions) change significantly, and the temperature of the object to be gripped is only controlled by passive heat control.
Even when the temperature cannot be set within the allowable temperature range, the gripping device can grip the object.
【０００８】[0008]
【実施例】図１は本発明の第１の実施例を示す説明図で
ある。全体を符号１８０で示すロボットアームは、例え
ば宇宙ステーション本体１８２より支持され、複数の間
接部１８４，１８８，１９２とロッド１８６，１９０を
備えて自由度の高い操作が可能である。ロボットアーム
１８０の先端に装備される把持装置１００は、本体１１
０の先端部に第１の把持手段２０を備える。この第１の
把持手段２０の構成は、図８で説明したものと同様の機
構を備えるものである。把持対象物５０は、例えば人工
衛星であって、その本体５２の端部には第２の把持手段
６０を備える。この第２の把持手段６０の構成も図８で
説明したものと同様の機構を備えるものである。FIG. 1 is an explanatory view showing a first embodiment of the present invention. A robot arm generally denoted by reference numeral 180 is supported by, for example, the space station main body 182, and is provided with a plurality of indirect portions 184, 188, 192 and rods 186, 190, and can be operated with a high degree of freedom. The gripping device 100 mounted on the tip of the robot arm 180 includes the main body 11
The first gripping means 20 is provided at the tip portion of 0. The configuration of the first gripping means 20 has the same mechanism as that described in FIG. The gripping target 50 is, for example, an artificial satellite, and has a second gripping means 60 at the end of the main body 52 thereof. The configuration of the second gripping means 60 also has a mechanism similar to that described in FIG.
【０００９】把持装置１００は、その本体１１０の外周
部にヒータ１２０を備える。ヒータ１２０は、例えば電
気ヒータが用いられる。本体１１０内には、第１の温度
センサ１１２が装備されており、この第１の温度センサ
１１２は第１の把持手段２０の把持部Ａの温度状態を検
知する。本体１１０の第１の把持手段２０を装備した先
端部には、第２の温度センサ１３２が設けられ、そのプ
ローブ１３０は、把持対象物５０の第２の把持手段６０
側へ突出している。制御部１５０は、制御装置１５２
と、電源１５４と、２個の制御部１６０，１６２と、ヒ
ータスイッチ１７０を有する。第１の温度センサ１１２
から送られてくる第１の把持手段２０の把持部Ａの温度
データは第１の処理部１６０で処理され、第１の温度情
報１６１として制御装置１５２へ送られる。The gripping device 100 is provided with a heater 120 on the outer peripheral portion of its main body 110. As the heater 120, for example, an electric heater is used. A first temperature sensor 112 is installed in the main body 110, and the first temperature sensor 112 detects the temperature state of the grip portion A of the first grip means 20. A second temperature sensor 132 is provided at the tip portion of the main body 110 equipped with the first gripping means 20, and the probe 130 thereof has the second gripping means 60 for gripping the object to be gripped 50.
It projects to the side. The control unit 150 includes a control device 152.
It has a power source 154, two control units 160 and 162, and a heater switch 170. First temperature sensor 112
The temperature data of the gripping part A of the first gripping means 20 sent from is processed by the first processing part 160 and sent to the control device 152 as the first temperature information 161.
【００１０】把持装置１００の先端部に設けられたプロ
ーブ１３０は、把持装置１００が対象物５０に接近する
と、対象物５０の第２の把持手段６０の把持部Ｂの温度
状態を検知し、そのデータは第２の温度センサ１３２か
ら制御部の第２の処理部１６２に送られる。第２の処理
部１６２で処理された第２の温度情報１６３は制御装置
１５２へ送られる。プローブ１３０は、把持部Ｂに接触
して温度を測定するか、または非接触で温度を測定する
赤外線センサのような手段を用いることができる。制御
装置１５２は、入力される第１の温度情報１６１と第２
の温度情報１６３に基づいて、後述するアルゴリズムに
よってヒータ信号１５３を出力する。このヒータ信号１
５３はヒータスイッチ１７０をオン、オフして電源１５
４から送られる電気エネルギー１７２をヒータ１２０へ
供給し、把持部Ａ，Ｂの温度管理を実行する。When the gripping device 100 approaches the object 50, the probe 130 provided at the tip of the gripping device 100 detects the temperature state of the gripping part B of the second gripping means 60 of the object 50, The data is sent from the second temperature sensor 132 to the second processing unit 162 of the control unit. The second temperature information 163 processed by the second processing unit 162 is sent to the control device 152. The probe 130 may use a means such as an infrared sensor that measures the temperature by contacting the grip portion B or measures the temperature without contact. The control device 152 receives the first temperature information 161 and the second temperature information 161 that are input.
Based on the temperature information 163 of 1., the heater signal 153 is output by an algorithm described later. This heater signal 1
53 is a power supply 15 for turning on / off the heater switch 170.
The electric energy 172 sent from the No. 4 is supplied to the heater 120, and the temperature control of the grips A and B is executed.
【００１１】図２は、把持部Ａ及び把持部Ｂの温度と把
持可能温度範囲の関係を示す。同図（ａ）は把持部Ａの
温度がｔA、把持部Ｂの温度がｔBである。把持部同志
は、基準温度条件下で製作、調整されており、両者に過
大な温度差が生ずると、材料の温度熱膨張／収縮により
ハメアイ部寸法が変化し、把持が困難になったり、把持
後のガタが大きくなったりする。また、把持後に把持部
Ａ及び把持部Ｂの温度差が大きくなった場合は、把持解
除が困難となる場合がある。これらの条件から、把持性
能を保証するための許容温度範囲が求まる。把持部Ａ及
び把持部Ｂの温度差をΔＴとし、把持可能温度差をＴと
すれば、下記の許容温度範囲となる。 ｜ｔA−ｔB｜＝ΔＴ≦Ｔ ─────────────── ［１］ ｔAmin≦ｔA≦ｔAmax ────────────────── ［２］ ｔBmin≦ｔB≦ｔBmax ────────────────── ［３］FIG. 2 shows the relationship between the temperatures of the grips A and B and the grippable temperature range. In the same figure (a), the temperature of the grip portion A is tA and the temperature of the grip portion B is tB. The grips are manufactured and adjusted under standard temperature conditions.If an excessive temperature difference occurs between the grips, the thermal expansion / contraction of the material causes the size of the eye-eye part to change, making gripping difficult or difficult. The backlash afterwards becomes large. Further, when the temperature difference between the grip portion A and the grip portion B becomes large after gripping, it may be difficult to release the grip. From these conditions, the allowable temperature range for guaranteeing the grip performance can be obtained. If the temperature difference between the gripping portion A and the gripping portion B is ΔT and the grippable temperature difference is T, the allowable temperature range will be as follows. │tA-tB│ = ΔT ≦ T ─────────────── [1] tAmin ≦ tA ≦ tAmax ─────────────────── [2] tBmin ≤ tB ≤ tBmax ────────────────── [3]
【００１２】ここで、ｔAmin／ｔAmax、ｔBmin／ｔBmax
はそれぞれ把持部Ａ、把持部Ｂの機械的強度、表面特性
が把持に適応しうる最高／最低温度である。また、同図
（ｂ）に［１］式が成り立たない例を示す。この時、把
持部Ａと把持部Ｂは把持不可能であり、把持可能にする
には、［１］式が成り立つように把持部Ａまたは把持部
Ｂを温度制御する必要がある。Here, tAmin / tAmax, tBmin / tBmax
Are the maximum / minimum temperatures at which the mechanical strength and surface characteristics of the gripping part A and the gripping part B can be adapted to gripping, respectively. Further, FIG. 2B shows an example in which the expression [1] does not hold. At this time, the gripping part A and the gripping part B cannot be gripped, and in order to enable gripping, it is necessary to control the temperature of the gripping part A or the gripping part B so that the expression [1] is satisfied.
【００１３】図３は、温度情報から把持可能か否かを判
断するアルゴリズムを示す。ステップ１０００でスター
トした処理は、ステップ１０１０で把持装置側の把持部
Ａの温度ｔAを測定し、処理部を介して制御装置へ送
る。同時に、ステップ１０２０で対象物側の把持部Ｂの
温度ｔBを測定し制御装置へ送る。ステップ１０３０で
は、温度ｔAと温度ｔBの差の絶対値と把持可能温度差Ｔ
との数値の大きさが比較される。ｔAとｔBの温度差が把
持可能温度差以内であれば、ステップ１０４０へ進み、
把持可能と判断され、ステップ１０５０で把持装置１０
０による対象物５０の把持操作が実行され、ステップ１
２００で処理を終了する。FIG. 3 shows an algorithm for judging whether or not the grip is possible from the temperature information. The process started in step 1000 measures the temperature tA of the gripping part A on the gripping device side in step 1010 and sends it to the control device via the processing part. At the same time, in step 1020, the temperature tB of the grip portion B on the object side is measured and sent to the control device. In step 1030, the absolute value of the difference between the temperature tA and the temperature tB and the grippable temperature difference T
The magnitudes of the numbers and are compared. If the temperature difference between tA and tB is within the grippable temperature difference, the process proceeds to step 1040,
It is determined that the gripping device 10 can hold the gripping device 10 in step 1050.
The gripping operation of the object 50 by 0 is executed, and step 1
The process ends at 200.
【００１４】把持部Ａと把持部Ｂとの温度差が把持可能
温度差以内になければ、ステップ１１００へ進み、把持
が不可能と判断される。ステップ１１１０でヒータスイ
ッチのＯＮ／ＯＦＦが指令され、把持装置１００側の加
温や加温停止が実行される。この状態でステップ１０１
０，１０２０へ戻り、再度把持部Ａと把持部Ｂの温度測
定が行なわれ、以下の処理が継続される。このヒータに
よる加熱操作により、把持部Ａと把持部Ｂの温度差を把
持可能温度差以内になるように温度制御を行なうことが
できる。If the temperature difference between the gripping portion A and the gripping portion B is not within the grippable temperature difference, the routine proceeds to step 1100, where it is judged that the gripping is impossible. In step 1110, an instruction to turn on / off the heater switch is issued, and heating or stopping of heating on the gripping device 100 side is executed. Step 101 in this state
The process returns to 0 and 1020, the temperature of the grip portion A and the grip portion B is measured again, and the following processing is continued. By this heating operation by the heater, the temperature control can be performed so that the temperature difference between the grip portion A and the grip portion B is within the grippable temperature difference.
【００１５】図４は本発明の他の実施例に係る把持装置
の説明図である。把持装置２００は、ロボットアーム１
８０の先端にとりつけられ、対象物５０を把持する手段
を有する。把持装置２００の本体２１０は電気式サーマ
ルルーバ２２０を備える。この電気式サーマルルーバ２
２０は、把持装置２００側の把持部Ａの放熱面積を調整
し、把持部Ａの温度制御を行なう機能を有する。把持装
置２００は、把持部Ａの温度を測定する第１の温度セン
サ２１２と、プローブ２３０を介して対象物側の把持部
Ｂの温度を測定する第２の温度センサ２３２を有する。FIG. 4 is an explanatory view of a gripping device according to another embodiment of the present invention. The gripping device 200 includes the robot arm 1
It is attached to the tip of 80 and has means for gripping the object 50. The main body 210 of the grip device 200 includes an electric thermal louver 220. This electric thermal louver 2
20 has a function of adjusting the heat radiation area of the gripping portion A on the gripping device 200 side and controlling the temperature of the gripping portion A. The gripping device 200 has a first temperature sensor 212 that measures the temperature of the gripping portion A and a second temperature sensor 232 that measures the temperature of the gripping portion B on the object side via the probe 230.
【００１６】制御部２５０は、第１の温度センサ２１２
からの温度信号を処理する第１の処理部２６０と、第２
の温度センサ２３２からの温度信号を処理する第２の処
理部２６２を有し、それぞれの温度情報２６１，２６３
は制御装置２５２へ送られる。電源２５４は電気的サー
マルルーバスイッチ２７０を介して把持装置に装備され
たサーマルルーバ２２０を制御する。制御装置２５２
は、把持部Ａと把持部Ｂの温度情報に基づいて、図３で
説明したアルゴリズムと同様のアルゴリズムによって、
電気式サーマルルーバスイッチ２７０へＯＮ／ＯＦＦ信
号２５３を送り、把持部Ａの温度制御を実行する。この
温度制御により、把持部Ａと把持部Ｂの温度差を把持可
能温度差以内に制御した後に、把持操作を実行する。こ
れにより、機械的に確実な結合が達成できる。The control unit 250 includes a first temperature sensor 212.
A first processing unit 260 for processing the temperature signal from the
Has a second processing unit 262 for processing the temperature signal from the temperature sensor 232 of
Is sent to the controller 252. The power supply 254 controls the thermal louver 220 mounted on the gripping device via the electric thermal louver switch 270. Control device 252
Is based on the temperature information of the gripping part A and the gripping part B, by an algorithm similar to the algorithm described in FIG.
An ON / OFF signal 253 is sent to the electric thermal louver switch 270 to control the temperature of the grip portion A. By this temperature control, the temperature difference between the grips A and B is controlled within the grippable temperature difference, and then the gripping operation is executed. This allows a mechanically secure connection to be achieved.
【００１７】図５は、把持対象物側の温度制御を可能と
する把持装置の実施例を示す。把持装置３００がロボッ
トアーム１８０の先端部に装備されることは、前述の実
施例と同様である。把持装置３００は、本体３１０の側
部に発光装置３２０を備える。この発光装置３２０は、
例えばレーザビームＬ等の光エネルギーを把持対象物５
０に向けて照射し、対象物５０側の把持部Ｂを加熱する
機能を有する。把持装置３００は、ロボットアーム１８
０の先端にとりつけられ、対象物５０を把持する手段を
有する。把持装置３００の本体３１０は発光装置３２０
を備える。この発光装置３２０は、対象物５０の把持部
Ｂにエネルギーを供給し、把持部Ｂの温度制御を行なう
機能を有する。把持装置３００は、把持部Ａの温度を測
定する第１の温度センサ３１２と、プローブ２３０を介
して対象物側の把持部Ｂの温度を測定する第２の温度セ
ンサ３３２を有する。FIG. 5 shows an embodiment of a gripping device capable of controlling the temperature of the gripping target side. The gripping device 300 is mounted on the tip of the robot arm 180, as in the above-described embodiment. The grip device 300 includes a light emitting device 320 on a side portion of a main body 310. The light emitting device 320 is
For example, the light energy of the laser beam L or the like is grasped by the object 5
It has a function of irradiating toward 0 and heating the grip portion B on the object 50 side. The gripping device 300 includes the robot arm 18
It is attached to the tip of 0 and has means for gripping the object 50. The main body 310 of the gripping device 300 is a light emitting device 320.
Equipped with. The light emitting device 320 has a function of supplying energy to the grip portion B of the object 50 and controlling the temperature of the grip portion B. The grip device 300 includes a first temperature sensor 312 that measures the temperature of the grip A and a second temperature sensor 332 that measures the temperature of the grip B on the object side via the probe 230.
【００１８】制御部３５０は、第１の温度センサ３１２
からの温度信号を処理する第１の処理部３６０と、第２
の温度センサ３３２からの温度信号を処理する第２の処
理部３６２を有し、それぞれの温度情報３６１，３６３
は制御装置３５２へ送られる。電源３５４は発光器スイ
ッチ３７０を介して把持装置に装備されたサーマルルー
バ２２０に電気エネルギーを供給する。制御装置３５２
は、把持部Ａと把持部Ｂの温度情報に基づいて、図３で
説明したアルゴリズムと同様のアルゴリズムによって、
発光器スイッチ３７０へＯＮ／ＯＦＦ信号を送り、把持
部Ｂの温度制御を実行する。この温度制御により、把持
部Ａと把持部Ｂの温度差を把持可能温度差以内に制御し
た後に、把持操作を実行する。これにより、機械的に確
実な結合が達成できる。The control unit 350 controls the first temperature sensor 312.
A first processing unit 360 for processing the temperature signal from the
Has a second processing unit 362 for processing the temperature signal from the temperature sensor 332 of
Is sent to the controller 352. The power supply 354 supplies electric energy to the thermal louver 220 mounted on the gripping device via the light emitter switch 370. Control device 352
Is based on the temperature information of the gripping part A and the gripping part B, by an algorithm similar to the algorithm described in FIG.
An ON / OFF signal is sent to the light emitter switch 370 to control the temperature of the grip portion B. By this temperature control, the temperature difference between the grips A and B is controlled within the grippable temperature difference, and then the gripping operation is executed. This allows a mechanically secure connection to be achieved.
【００１９】また、図６において、把持後も温度制御を
行い、把持状態の維持が可能か否かを判断するものの実
施例について説明する。この構成は、図１において説明
したものと同じである。把持状態の維持が可能か否かを
判断する。すなわち、ロボットアーム１８０の先端にと
りつけられた把持装置１００はその把持手段を対象物５
０の把持手段に係合して対象物５０を把持する。この結
合状態にあっては、第１の温度センサ１１２は把持装置
１００側の把持部Ａの温度状態を測定し、第２の温度セ
ンサ１３２は対象物５０の把持部に挿入されてプローブ
１３０を介して、対象物側の把持部Ｂの温度状態を測定
する。まず、把持後も、把持部Ａの温度ｔA、把持部Ｂ
の温度ｔBを測定する。把持部Ａ及び把持部Ｂの温度は
その温度差をΔＴとし、把持可能温度差をＴとすれば、
はずれなくなる前に対応しなくてはいけないためその温
度余裕をＴ１して、下記の許容温度範囲となる。 ｜ｔA−ｔB｜＝ΔＴ≦Ｔ−Ｔ１ ───────────── ［４］ ｔAmin≦ｔA≦ｔAmax ────────────────── ［５］ ｔBmin≦ｔB≦ｔBmax ────────────────── ［６］Further, referring to FIG. 6, an embodiment will be described in which temperature control is performed even after gripping and it is determined whether or not the gripped state can be maintained. This structure is the same as that described in FIG. It is determined whether the gripped state can be maintained. That is, the gripping device 100 attached to the tip of the robot arm 180 uses the gripping means as the target object 5.
The object 50 is gripped by engaging the gripping means of 0. In this combined state, the first temperature sensor 112 measures the temperature state of the gripping portion A on the gripping device 100 side, and the second temperature sensor 132 is inserted into the gripping portion of the object 50 and the probe 130 is inserted. Through this, the temperature state of the grip portion B on the object side is measured. First, even after the grip, the temperature tA of the grip A and the grip B
The temperature tB is measured. If the temperature difference between the gripping part A and the gripping part B is ΔT and the grippable temperature difference is T,
Since it must be dealt with before it does not come off, the temperature margin is set to T1 and becomes the following allowable temperature range. │tA-tB│ = ΔT≤T-T1 ───────────── [4] tAmin ≦ tA ≦ tAmax ──────────────────── [5] tBmin≤tB≤tBmax ─────────────────── [6]
【００２０】ここで、ｔAmin／ｔAmax、ｔBmin／ｔBmax
はそれぞれ把持部Ａ、把持部Ｂの機械的強度、表面特性
が把持に適応しうる最高／最低温度である。［４］式が
成り立つときは、把持状態の維持が可能と判断し、
［４］式が成り立つように把持部Ａまたは把持部Ｂを温
度制御を続ける。［４］式が成り立たないときは、把持
状態の維持が不可能と判断し、システムに対して警告を
出す。また、把持対象物であるペイロードを安全なとこ
ろまで持っていき、把持状態を解除する。Here, tAmin / tAmax, tBmin / tBmax
Are the maximum / minimum temperatures at which the mechanical strength and surface characteristics of the gripping part A and the gripping part B can be adapted to gripping, respectively. When the formula [4] is established, it is determined that the gripping state can be maintained,
The temperature control of the gripping portion A or the gripping portion B is continued so that the expression [4] is established. When the formula [4] is not established, it is determined that the gripping state cannot be maintained, and a warning is issued to the system. Further, the payload, which is an object to be grasped, is brought to a safe place and the grasped state is released.
【００２１】図７は把持状態の維持が可能か否かを判断
するアルゴリズムの例を示す。ステップ２０００でスタ
ートした処理は、ステップ２０１０で把持部Ａの温度ｔ
Aを測定するとともに、ステップ２０２０で把持部Ｂの
温度ｔBを測定する。ステップ２０３０では、ｔＡとｔ
Ｂの温度差と把持可能温度差Ｔから温度余裕Ｔ1を差し
引いた温度△Ｔとを比較する。把持部Ａと把持部Ｂの温
度差が△Ｔ以内であれば、ステップ２０４０へ進み、把
持状態の継続が可能と判断し、ステップ２０５０で現在
の温度制御の継続を指令して、ステップ２０１０，２０
２０へ戻る。ステップ２０３０で把持部Ａ，Ｂの温度差
が△Ｔ以上となったときには、ステップ２１００へ進
み、把持状態の継続が不可能と判断され、ステップ２１
１０で所定の警告が発せられる。FIG. 7 shows an example of an algorithm for judging whether or not the gripping state can be maintained. The process started at step 2000 is the temperature t of the gripping part A at step 2010.
In addition to measuring A, the temperature tB of the grip portion B is measured in step 2020. At step 2030, tA and t
The temperature difference of B and the temperature difference ΔT obtained by subtracting the temperature margin T 1 from the grippable temperature difference T are compared. If the temperature difference between the gripping portion A and the gripping portion B is within ΔT, the process proceeds to step 2040, it is determined that the gripping state can be continued, and in step 2050, an instruction to continue the current temperature control is issued. 20
Return to 20. When the temperature difference between the gripping portions A and B becomes ΔT or more in step 2030, the process proceeds to step 2100, it is determined that the gripping state cannot be continued, and step 21
At 10, a predetermined warning is issued.
【００２２】ステップ２１２０ではオペレータの操作に
よるか、又は自動により把持部Ａと把持部Ｂとの結合を
開放し、ステップ２２００で処理を終了する。以上の処
理により、把持装置１００が対象物を把持した後の温度
変化によって、把持状態の開放が不可能となる不都合を
確実に回避することができる。なお、図６及び図７は本
発明の第１の実施例の場合について説明したが、本発明
の他の実施例に係る把持装置の場合にも、同様のアルゴ
リズムにより、把持状態の管理を実行することができ
る。At step 2120, the connection between the gripping portion A and the gripping portion B is released by an operator's operation or automatically, and the processing ends at step 2200. By the above process, it is possible to reliably avoid the inconvenience that the gripping state cannot be released due to the temperature change after the gripping device 100 grips the object. 6 and 7 have been described with respect to the case of the first embodiment of the present invention, the gripping state management is executed by the same algorithm also in the case of the gripping device according to another embodiment of the present invention. can do.
【００２３】[0023]
【発明の効果】本発明によれば、環境条件（特に温度条
件）が著しく変化し、把持対象物の温度が受動的な熱制
御だけでは、許容温度範囲に入れる事ができない場合に
おいても、把持装置の対象物把持が可能となる。さら
に、把持装置及び対象物の温度を測定し、把持装置また
は把持対象物を温度制御することで熱的機械的に確実な
結合をすることができる。According to the present invention, even when the environmental condition (particularly the temperature condition) changes remarkably and the temperature of the object to be gripped cannot be brought into the allowable temperature range by only passive thermal control, the gripping target can be held. The object of the device can be gripped. Furthermore, by measuring the temperature of the gripping device and the object and controlling the temperature of the gripping device or the object to be gripped, a reliable thermomechanical coupling can be achieved.
【図１】本発明にかかるー実施例の構成図。FIG. 1 is a configuration diagram of an embodiment according to the present invention.
【図２】本発明にかかるー実施例の把持部Ａ及び把持部
Ｂの温度と把持可能温度範囲の関係図。FIG. 2 is a diagram showing a relationship between temperatures of a grip portion A and a grip portion B and a grippable temperature range according to an embodiment of the present invention.
【図３】本発明にかかるー実施例の温度情報から把持可
能か否かを判断するアルゴリズムを示す図。FIG. 3 is a diagram showing an algorithm for determining whether gripping is possible based on temperature information according to an embodiment of the present invention.
【図４】本発明にかかる他の実施例の構成図。FIG. 4 is a configuration diagram of another embodiment according to the present invention.
【図５】本発明にかかる他の実施例の構成図。FIG. 5 is a configuration diagram of another embodiment according to the present invention.
【図６】本発明にかかるの把持装置及び対象物把持部の
概観図。FIG. 6 is a schematic view of a gripping device and an object gripping portion according to the present invention.
【図７】把持装置及び対象物把持部の許容温度範囲を設
定法を示す説明図。FIG. 7 is an explanatory diagram showing a method for setting an allowable temperature range of the gripping device and the object gripping portion.
【図８】本発明を適用する把持装置の概要図。FIG. 8 is a schematic diagram of a gripping device to which the present invention is applied.
【図９】従来の許容温度範囲の設定を示す説明図。FIG. 9 is an explanatory diagram showing setting of a conventional allowable temperature range.
１０ 把持装置 ２０ 第１の把持手段 ５０ 対象物 ６０ 第２の把持手段 １００ 把持装置 １１０ 本体 １１２ 第１の温度センサ １２０ ヒータ １３０ プローブ １３２ 第２の温度センサ １５０ 制御部 １５２ 制御装置 １５４ 電源 １６６ 第１の処理部 １６２ 第２の処理部 １８０ ロボットアーム ２００ 把持装置 ２２０ 電気式サーマルルーバ ３００ 把持装置 ３２０ 発光装置 10 gripping device 20 first gripping means 50 object 60 second gripping means 100 gripping device 110 main body 112 first temperature sensor 120 heater 130 probe 132 second temperature sensor 150 controller 152 controller 154 power supply 166 first Processing unit 162 second processing unit 180 robot arm 200 gripping device 220 electric thermal louver 300 gripping device 320 light emitting device
Claims (10)
持装置であって、把持装置は対象物に装備される第２の
把持手段を把持する第１の把持手段と、第１の把持手段
の把持部の温度を測定する第１の温度センサと、第２の
把持手段の把持部の温度を測定する第２の温度センサ
と、温度制御手段と、把持部の温度情報に基づいて温度
制御手段を制御する制御装置とを備えてなる把持温度制
御機能を有する把持装置。1. A gripping device for gripping an object in a three-dimensional space, the gripping device comprising: first gripping means for gripping a second gripping means mounted on the object; and a first gripping means. A first temperature sensor that measures the temperature of the grip portion, a second temperature sensor that measures the temperature of the grip portion of the second grip means, a temperature control means, and a temperature control means based on temperature information of the grip portion. And a gripping device having a gripping temperature control function.
持手段の把持部に接触して温度を測定する手段を備える
請求項１記載の把持温度制御機能を有する把持装置。2. The gripping device having a gripping temperature control function according to claim 1, wherein the second temperature sensor includes means for contacting a gripping portion of the second gripping means of the object to measure the temperature.
持手段の把持部に非接触で温度を測定する手段を備える
請求項１記載の把持温度制御機能を有する把持装置。3. The gripping device having a gripping temperature control function according to claim 1, wherein the second temperature sensor includes means for measuring the temperature of the object without contacting the gripping portion of the second gripping means.
項１記載の把持温度制御機能を有する把持装置。4. A gripping device having a gripping temperature control function according to claim 1, wherein the temperature control means is an electric heater.
である請求項１記載の把持温度制御機能を有する把持装
置。5. A gripping device having a gripping temperature control function according to claim 1, wherein the temperature control means is an electric thermal louver.
把持部を加熱する温度制御手段を備える請求項１記載の
把持温度制御機能を有する把持装置。6. The gripping device having a gripping temperature control function according to claim 1, wherein the gripping device comprises temperature control means for heating the gripping part of the second gripping means of the object.
６記載の把持温度制御機能を有する把持装置。7. The gripping device having a gripping temperature control function according to claim 6, wherein the temperature control means is a light emitting device.
の温度情報により温度制御手段を操作して把持部の温度
差が把持可能温度差以内となるように温度制御するアル
ゴリズムを備える請求項１記載の把持温度制御機能を備
える把持装置。8. The control device comprises an algorithm for operating the temperature control means based on the temperature information of the grip portion prior to the grip operation to control the temperature so that the temperature difference of the grip portion is within the grippable temperature difference. A gripping device having the gripping temperature control function according to 1.
度情報により温度制御手段を操作して把持状態継続可能
温度差以内になるように温度制御するアルゴリズムを備
える請求項１記載の把持温度制御機能を有する把持装
置。9. The grip temperature according to claim 1, wherein the control device includes an algorithm for operating the temperature control means based on the temperature information of the grip portion in the grip state to control the temperature so as to be within the temperature difference in which the grip state can be continued. A gripping device having a control function.
態継続温度差をこえたときは警告を発し、把持状態を解
除するアルゴリズムを備える請求項１記載の把持温度制
御機能を有する把持装置。10. The gripping device having a gripping temperature control function according to claim 1, wherein the control device has an algorithm for issuing a warning when the temperature difference between the gripping parts exceeds the gripping state continuous temperature difference and canceling the gripping state. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01041094A JP3147637B2 (en) | 1994-02-01 | 1994-02-01 | Gripping device with gripping temperature control function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01041094A JP3147637B2 (en) | 1994-02-01 | 1994-02-01 | Gripping device with gripping temperature control function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07214486A true JPH07214486A (en) | 1995-08-15 |
| JP3147637B2 JP3147637B2 (en) | 2001-03-19 |
Family
ID=11749384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01041094A Expired - Fee Related JP3147637B2 (en) | 1994-02-01 | 1994-02-01 | Gripping device with gripping temperature control function |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3147637B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003098441A (en) * | 2001-09-25 | 2003-04-03 | Natl Space Development Agency Of Japan | Space telescope |
| WO2023188993A1 (en) * | 2022-03-28 | 2023-10-05 | 国立研究開発法人産業技術総合研究所 | Temperature control device and temperature control method |
-
1994
- 1994-02-01 JP JP01041094A patent/JP3147637B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003098441A (en) * | 2001-09-25 | 2003-04-03 | Natl Space Development Agency Of Japan | Space telescope |
| WO2023188993A1 (en) * | 2022-03-28 | 2023-10-05 | 国立研究開発法人産業技術総合研究所 | Temperature control device and temperature control method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3147637B2 (en) | 2001-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IL107460A0 (en) | Controlled cryogenic contact system | |
| PT868884E (en) | DEVICE AND PROCESS FOR CATLATING ABLACATION | |
| CN101669016A (en) | Heat treatment apparatus | |
| JPH07214486A (en) | Gripping device with gripping temperature control function | |
| KR20180097165A (en) | Method and apparatus for optimizing effect of infrared ray radiation through transparent ceramic glass | |
| US5412178A (en) | Iron-tip temperature detector of electric soldering iron | |
| MY133823A (en) | Temperature control system for test heads | |
| US7084593B2 (en) | Method and apparatus for thermal management of an electric power assist steering control system by compensating steering motor current | |
| EP1029625A3 (en) | Muffle convection brazing and annealing system and method | |
| JPH07153550A (en) | Method for controlling temperature of electric heater | |
| US7054791B2 (en) | Method for monitoring a device used to guide an energy source such as a handling device | |
| US20030168584A1 (en) | Time phased constant ir energy delta source | |
| JP3554182B2 (en) | Temperature measurement device and substrate heat treatment device | |
| JP3346583B2 (en) | Infrared sensor and radiation thermometer | |
| JPH10163277A (en) | Bonding equipment | |
| JPH0476618B2 (en) | ||
| CN220770818U (en) | High-pressure container heat treatment device | |
| JP2643861B2 (en) | Satellite-mounted temperature controller | |
| Huo et al. | Determination of optimal heating time with computer aid | |
| KR101688073B1 (en) | Induction Heating system for Heating-bolt | |
| JPH0929683A (en) | Target marker having temperature information display function | |
| KR0133443B1 (en) | Electronic soldering iron | |
| JPH0552445B2 (en) | ||
| JPS6243806B2 (en) | ||
| JPH0470644B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |