JPH0720485A - Structure for connecting circuit board and its connecting method - Google Patents
Structure for connecting circuit board and its connecting methodInfo
- Publication number
- JPH0720485A JPH0720485A JP26360693A JP26360693A JPH0720485A JP H0720485 A JPH0720485 A JP H0720485A JP 26360693 A JP26360693 A JP 26360693A JP 26360693 A JP26360693 A JP 26360693A JP H0720485 A JPH0720485 A JP H0720485A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electrode terminal
- conductive particles
- connection
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、主回路基板上に形成さ
れた接続電極端子に半導体素子などの電子部品や従回路
基板の電極端子が接続された回路基板の接続構造および
該回路基板の接続方法に関する。さらに詳しくは、例え
ば液晶表示パネルなどの絶縁基板に形成された接続電極
端子に、液晶駆動用ＩＣの電極端子などを接続する際
に、確実に接続され、しかも短絡事故などを起こさない
ような回路基板の接続構造およびその接続方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board connection structure in which electronic parts such as semiconductor elements and electrode terminals of a sub circuit board are connected to connection electrode terminals formed on a main circuit board, and a circuit board connecting structure. Regarding connection method. More specifically, for example, a circuit that is surely connected to a connection electrode terminal formed on an insulating substrate of a liquid crystal display panel or the like when an electrode terminal of a liquid crystal driving IC is connected and does not cause a short circuit accident. The present invention relates to a board connecting structure and a connecting method thereof.
【０００２】[0002]
【従来の技術】従来、回路基板の接続方法、例えば液晶
表示パネルに液晶駆動用ＩＣを実装する方法としては、
「ＩＭＣ’92インターナショナル マイクロエレクトロ
ニクスコンファランス（International Microelectroni
cs Conference）」に発明者らによって発表された「チ
ップ オン グラス パッケージング テクノロジーユ
ージング コンダクティブ パーティクルズ（CHIP-ON-
GLASS PACKAGING TECH-NOLOGY USING CONDUCTIVE PART
ICLES）」に示されるように、導電粒子による接続構造
が用いられている。図２４〜２９はこの従来の接続方法
を工程順に示す製造工程図である。図２４〜２９におい
て、１はガラスなどの透明基板からなる液晶表示パネ
ル、２はこの液晶表示パネル１上に形成された接続電極
端子、３は液晶表示パネル１上に形成された配線パター
ン、例えば液晶駆動用ＩＣに駆動電圧などを供給するバ
スライン、４は液晶表示パネル１の実装部に形成された
パッシベーション膜であり、接続電極端子２の部分には
開口部が設けられている。５は樹脂球の表面に金などの
金属がメッキされた導電粒子で、例えばミクロパール
(商品名、積水ファインケミカル（株）製）、６は液晶
表示パネル１に取り付けられる液晶駆動用ＩＣ、７は液
晶駆動用ＩＣ６の電極端子、８は多数の導電粒子５が混
入されたポジ型の感光性樹脂、９はこの感光性樹脂８を
露光する露光装置、10は液晶表示パネル１に液晶駆動用
ＩＣ６を固定するための紫外線硬化樹脂である。2. Description of the Related Art Conventionally, as a method of connecting circuit boards, for example, a method of mounting a liquid crystal driving IC on a liquid crystal display panel,
"IMC'92 International Microelectronics Conference
cs Conference) "," chip on glass packaging technology using conductive particles (CHIP-ON-
GLASS PACKAGING TECH-NOLOGY USING CONDUCTIVE PART
ICLES) ”, a connection structure using conductive particles is used. 24 to 29 are manufacturing process diagrams showing this conventional connecting method in the order of processes. 24 to 29, 1 is a liquid crystal display panel made of a transparent substrate such as glass, 2 is a connecting electrode terminal formed on the liquid crystal display panel 1, 3 is a wiring pattern formed on the liquid crystal display panel 1, for example, Bus lines 4 for supplying a driving voltage to the liquid crystal driving IC are passivation films formed on the mounting portion of the liquid crystal display panel 1, and openings are provided at the connection electrode terminals 2. 5 is a conductive particle in which a metal such as gold is plated on the surface of a resin sphere, for example, micropearl
(Trade name, manufactured by Sekisui Fine Chemical Co., Ltd.), 6 is a liquid crystal driving IC mounted on the liquid crystal display panel 1, 7 is an electrode terminal of the liquid crystal driving IC 6, and 8 is a positive type in which a large number of conductive particles 5 are mixed. A photosensitive resin, 9 is an exposure device for exposing the photosensitive resin 8, and 10 is an ultraviolet curable resin for fixing the liquid crystal driving IC 6 to the liquid crystal display panel 1.
【０００３】つぎに、このように構成された従来の液晶
表示装置における液晶表示パネル１と液晶駆動用ＩＣ６
の接続方法について説明する。Next, the liquid crystal display panel 1 and the liquid crystal driving IC 6 in the conventional liquid crystal display device configured as described above.
The connection method of will be described.
【０００４】まず、図２４に示されるように、液晶表示
パネル１の実装部表面に導電粒子５を混入させたポジ型
の感光性樹脂８を、スピンコート法や印刷法などによっ
て数μｍ程度の膜厚に付着する。つぎに、この液晶表示
パネル１を90℃程度に加熱して前記ポジ型感光性樹脂８
をプリベークする。First, as shown in FIG. 24, a positive photosensitive resin 8 mixed with conductive particles 5 is applied to the surface of the mounting portion of the liquid crystal display panel 1 to a thickness of about several μm by spin coating or printing. Adhere to the film thickness. Next, the liquid crystal display panel 1 is heated to about 90 ° C. to heat the positive photosensitive resin 8
Pre-bake.
【０００５】つぎに図２５に示されるように、液晶表示
パネル１の実装部におけるポジ型の感光性樹脂８を、液
晶表示パネル１の裏面側より露光装置９によって露光す
る。このとき、液晶表示パネル１の接続電極端子２など
の配線パターンはアルミニウム膜などの遮光効果を有す
るものによって形成されているので、マスク機能を果た
すことになる。Next, as shown in FIG. 25, the positive type photosensitive resin 8 in the mounting portion of the liquid crystal display panel 1 is exposed from the rear surface side of the liquid crystal display panel 1 by an exposure device 9. At this time, since the wiring pattern such as the connection electrode terminals 2 of the liquid crystal display panel 1 is formed of a material having a light shielding effect such as an aluminum film, the mask function is achieved.
【０００６】したがって、露光後現像を行うことによっ
て、図２６に示されるように、導電粒子５が接続電極端
子２やバスラインなどの配線パターン３上に選択的に配
されることになる。Therefore, by carrying out post-exposure development, the conductive particles 5 are selectively arranged on the connection electrode terminals 2 and the wiring patterns 3 such as bus lines as shown in FIG.
【０００７】つぎに図２７〜２８に示されるように、液
晶表示パネル１の実装部に紫外線硬化樹脂10を塗布し、
液晶駆動用ＩＣ６を液晶表示パネル１上に位置合わせし
たのち、加圧ヘッド34を用いて加圧する。このとき、導
電粒子５の下にあったポジ型感光性樹脂８、および導電
粒子５上の紫外線硬化樹脂10はこの加圧力によって押し
出され、液晶表示パネル１の接続電極端子２と液晶駆動
用ＩＣ６の電極端子７は導電粒子５を介して接触し、電
気的に接続されることになる。この状態を保持して、紫
外線照射装置11によって液晶表示パネル１の裏面側より
紫外線を照射し、紫外線硬化樹脂10を硬化させ、図２９
に示されるように、液晶表示パネル１上に液晶駆動用Ｉ
Ｃ６を固着していた。Next, as shown in FIGS. 27 to 28, the ultraviolet curable resin 10 is applied to the mounting portion of the liquid crystal display panel 1,
After aligning the liquid crystal driving IC 6 on the liquid crystal display panel 1, pressure is applied by using the pressure head 34. At this time, the positive photosensitive resin 8 under the conductive particles 5 and the ultraviolet curable resin 10 on the conductive particles 5 are pushed out by this pressing force, and the connection electrode terminals 2 of the liquid crystal display panel 1 and the liquid crystal driving IC 6 The electrode terminals 7 of 1 are in contact with each other through the conductive particles 5 and are electrically connected. While maintaining this state, ultraviolet rays are emitted from the rear surface side of the liquid crystal display panel 1 by the ultraviolet ray irradiation device 11 to cure the ultraviolet ray curable resin 10, and FIG.
As shown in FIG.
C6 was stuck.
【０００８】また図３０は、例えば特開昭63-55527号公
報に示された従来の回路基板の一例を示す断面図であ
る。図３０において、図２９と同じ符号は、回路基板の
同じ部分を示す。FIG. 30 is a sectional view showing an example of a conventional circuit board disclosed in, for example, Japanese Patent Laid-Open No. 63-55527. 30, the same reference numerals as those in FIG. 29 indicate the same parts of the circuit board.
【０００９】図３０に示される回路基板は、例えば液晶
表示パネル１の接続電極端子２に導電粒子５をエアーガ
ンにより吹きつけることにより分散させ、一方、液晶駆
動用ＩＣ６には電極端子７に紫外線硬化樹脂10を塗布す
る。そして液晶表示パネル１と液晶駆動用ＩＣ６を両電
極端子部を対向させ圧着し、液晶表示パネル１の裏面よ
り紫外線を照射して紫外線硬化樹脂10を硬化させること
により接続部にたわみや歪が生じることなく液晶表示パ
ネル１と液晶駆動用ＩＣ６とを接続している。The circuit board shown in FIG. 30 is dispersed, for example, by spraying conductive particles 5 to the connecting electrode terminals 2 of the liquid crystal display panel 1 by an air gun, while the liquid crystal driving IC 6 has ultraviolet curing on the electrode terminals 7. Apply resin 10. Then, the liquid crystal display panel 1 and the liquid crystal driving IC 6 are pressure-bonded with both electrode terminal portions facing each other, and ultraviolet rays are irradiated from the rear surface of the liquid crystal display panel 1 to cure the ultraviolet curable resin 10, thereby causing bending and distortion in the connection portion. The liquid crystal display panel 1 and the liquid crystal driving IC 6 are connected without a connection.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら、前述の
ような従来の回路基板の接続構造や該回路基板の接続方
法ではつぎのような問題がある。 （１）従来の方法では、液晶表示パネル１の接続電極端
子２以外の配線パターン３上にも導電粒子５が配されて
いる（図２８参照）。そのため、液晶表示パネル１の配
線パターン３、例えばバスラインが液晶駆動用ＩＣ６の
下部に形成されている場合、バスライン上の導電粒子５
が液晶駆動用ＩＣ６の配線を加圧し、液晶駆動用ＩＣ６
が破壊することがある。また紫外線照射装置によって液
晶表示パネル１の裏面より紫外線を照射し、紫外線硬化
樹脂10を硬化させる工程において、液晶表示パネル１に
形成された接続電極端子２や配線パターン３がマスク機
能を果たすため、接続電極端子２上の紫外線硬化樹脂10
は硬化しない。そのため、紫外線硬化樹脂10の粘度が液
晶駆動用ＩＣ６やバックライトの発熱によって低下し、
未硬化の紫外線硬化樹脂10が導電粒子５の表面を覆い、
液晶表示パネル１の接続電極端子２と液晶駆動用ＩＣ６
の電極端子７とのあいだで接続不良や導通抵抗が高くな
るなどの問題が生じている。 （２）現像工程で、配線パターン部以外の導電粒子５が
完全に除去されず、接続電極端子２間に残存する導電粒
子５によって、接続電極端子２相互間が導通する問題が
ある。 （３）スピンコート法によって導電粒子５が混入された
感光性樹脂８を塗布する場合、導電粒子５は遠心力によ
って外周にひろがり易く、接続電極端子２の部分におい
ても、図３１に示されるように、導電粒子５はパッシベ
ーション膜４と接続電極端子２との境界部の段差に引っ
掛かり、接続電極端子２の外周辺のみに配される。その
ため、液晶表示パネル１の接続電極端子２と液晶駆動用
ＩＣ６の電極端子７とのあいだで接続不良や導通抵抗が
高くなるなどの問題が生じている。 （４）紫外線硬化樹脂10が液晶駆動用ＩＣ６およびバッ
クライトの発熱で膨張すると、紫外線硬化樹脂10は導電
粒子５よりも熱膨張係数が大きいため、導電粒子５と液
晶駆動用ＩＣ６の電極端子７との接触が離れ、オープン
不良が発生するという問題が生じている。 （５）液晶駆動用ＩＣ６に形成された電極端子７の高さ
のバラツキや加圧ヘッドの加圧力によって、導電粒子５
上の紫外線硬化樹脂10が完全に除去されず、液晶表示パ
ネル１の接続電極端子２上に搭載された導電粒子５が液
晶駆動用ＩＣ６の電極端子７に接触せず、オープン不良
が生じることがある。 （６）硬化した紫外線硬化樹脂10の接着力のみで液晶表
示パネル１と液晶駆動用ＩＣ６との接続状態を保持して
いるため、相互の接続電極端子間の接続不良が生じやす
く信頼性が低下するという問題がある。 （７）一度液晶表示パネル１に液晶駆動用ＩＣ６を接続
してしまうと、ＩＣ６に欠陥があった場合や接続後に欠
陥が生じた場合に交換の為の取り外しが困難であるとい
う問題がある。 （８）ポジ型感光性樹脂と共に塗布した導電粒子５のほ
とんどは電極の接続に利用されることなく現像時に廃棄
している。このため、高価な導電粒子５の使用に無駄が
多く、製造に要する材料費が高くなるという問題があ
る。 （９）液晶表示パネル１上の接続電極２上に固着する導
電粒子５の数、言い換えれば、その密度の増加に限界が
あり、このため接続不良が発生しやすい。 （１０）液晶駆動用ＩＣ６の交換は接続電極上に残存す
る導電粒子５を利用するから、電極上に設置できる導電
粒子数が少ない従来の回路基板では、不良ＩＣ６を取り
外すときにさらに少なくなり最悪の場合には無くなって
しまい、液晶駆動用ＩＣ６の交換ができないという問題
点がある。However, the above-mentioned conventional circuit board connection structure and circuit board connection method have the following problems. (1) In the conventional method, the conductive particles 5 are also arranged on the wiring pattern 3 other than the connection electrode terminals 2 of the liquid crystal display panel 1 (see FIG. 28). Therefore, when the wiring pattern 3 of the liquid crystal display panel 1, for example, the bus line is formed below the liquid crystal driving IC 6, the conductive particles 5 on the bus line 5 are formed.
Presses the wiring of the liquid crystal driving IC6, and the liquid crystal driving IC6
May be destroyed. Further, in the step of irradiating the ultraviolet ray from the back surface of the liquid crystal display panel 1 with the ultraviolet ray irradiation device to cure the ultraviolet curable resin 10, the connection electrode terminals 2 and the wiring pattern 3 formed on the liquid crystal display panel 1 perform a mask function, UV curable resin 10 on the connecting electrode terminal 2
Does not cure. Therefore, the viscosity of the ultraviolet curable resin 10 decreases due to the heat generation of the liquid crystal driving IC 6 and the backlight,
The uncured UV curable resin 10 covers the surface of the conductive particles 5,
Connection electrode terminal 2 of liquid crystal display panel 1 and liquid crystal driving IC 6
There is a problem such as a poor connection between the electrode terminal 7 and the electrode terminal 7 and an increase in conduction resistance. (2) In the developing process, the conductive particles 5 other than the wiring pattern portion are not completely removed, and there is a problem that the conductive particles 5 remaining between the connection electrode terminals 2 cause conduction between the connection electrode terminals 2. (3) When the photosensitive resin 8 mixed with the conductive particles 5 is applied by the spin coating method, the conductive particles 5 are easily spread to the outer periphery by the centrifugal force, and the connecting electrode terminals 2 are also shown in FIG. 31. In addition, the conductive particles 5 are caught on the step at the boundary between the passivation film 4 and the connection electrode terminal 2, and are arranged only on the outer periphery of the connection electrode terminal 2. Therefore, problems such as poor connection and high conduction resistance occur between the connection electrode terminal 2 of the liquid crystal display panel 1 and the electrode terminal 7 of the liquid crystal driving IC 6. (4) When the UV curable resin 10 expands due to the heat generated by the liquid crystal driving IC 6 and the backlight, the UV curable resin 10 has a larger coefficient of thermal expansion than the conductive particles 5, so that the conductive particles 5 and the electrode terminals 7 of the liquid crystal driving IC 6 are formed. There is a problem that the contact with is separated and an open defect occurs. (5) The conductive particles 5 are caused by the height variation of the electrode terminals 7 formed on the liquid crystal driving IC 6 and the pressure applied by the pressure head.
The above ultraviolet curable resin 10 is not completely removed, and the conductive particles 5 mounted on the connection electrode terminals 2 of the liquid crystal display panel 1 do not come into contact with the electrode terminals 7 of the liquid crystal driving IC 6, which may cause an open defect. is there. (6) Since the connection state between the liquid crystal display panel 1 and the liquid crystal driving IC 6 is maintained only by the adhesive force of the cured UV curable resin 10, the connection failure between mutual connection electrode terminals is likely to occur and the reliability is lowered. There is a problem of doing. (7) Once the liquid crystal driving IC 6 is connected to the liquid crystal display panel 1, there is a problem that it is difficult to remove for replacement when the IC 6 has a defect or a defect occurs after the connection. (8) Most of the conductive particles 5 applied together with the positive photosensitive resin are not used for connecting electrodes and are discarded at the time of development. For this reason, there is a problem in that the use of the expensive conductive particles 5 is wasteful and the material cost required for manufacturing is high. (9) There is a limit to the increase in the number of the conductive particles 5 fixed on the connection electrodes 2 on the liquid crystal display panel 1, in other words, the density thereof, and thus connection failure is likely to occur. (10) Since the replacement of the liquid crystal driving IC 6 uses the conductive particles 5 remaining on the connection electrodes, the conventional circuit board having a small number of conductive particles that can be installed on the electrodes has a smaller number when the defective IC 6 is removed. In this case, there is a problem that the liquid crystal driving IC 6 cannot be replaced because it is lost.
【００１１】本発明はかかる問題を解決するためになさ
れたものであって、液晶表示パネルと液晶駆動用ＩＣと
が確実に電気的に接続され得る回路基板の接続構造およ
び該回路基板の接続方法を提供することを目的とする。The present invention has been made to solve the above problems, and a circuit board connection structure and a circuit board connection method by which a liquid crystal display panel and a liquid crystal driving IC can be reliably electrically connected. The purpose is to provide.
【００１２】[0012]
【課題を解決するための手段】請求項１記載の発明によ
る回路基板の接続構造は、接続電極端子および配線パタ
ーンが形成された透光性の第１回路基板の該接続電極端
子と、電子部品または第２回路基板の電極端子とが、導
電粒子を介して接続されてなる回路基板の接続構造であ
って、前記配線パターンが金属膜からなり、該配線パタ
ーンのうち前記導電粒子の付着を阻止せしめる部分は透
明導電膜により形成されているものである。According to a first aspect of the present invention, there is provided a circuit board connection structure, wherein a connection electrode terminal and a connection electrode terminal of a translucent first circuit board having a wiring pattern are formed, and an electronic component. Or a circuit board connection structure in which the electrode terminals of the second circuit board are connected via conductive particles, wherein the wiring pattern is made of a metal film, and the conductive particles of the wiring pattern are prevented from adhering to each other. The portion to be bent is formed of a transparent conductive film.
【００１３】また、請求項２記載の発明の回路基板の接
続構造は、前記接続電極端子が金属膜からなり、該接続
電極端子の一部は透明導電膜により形成されていること
を特徴とする。The circuit board connection structure according to the present invention is characterized in that the connection electrode terminals are made of a metal film, and a part of the connection electrode terminals is made of a transparent conductive film. .
【００１４】また、請求項３記載の発明の回路基板の接
続構造は、前記接続電極端子の周囲にパッシベーション
膜からなる枠が形成されると共に、該枠の内部にも部分
的にパッシベーション膜が形成されていることを特徴と
する。In the circuit board connection structure according to the present invention, a frame made of a passivation film is formed around the connection electrode terminals, and a passivation film is partially formed inside the frame. It is characterized by being.
【００１５】また、請求項４記載の発明の回路基板の接
続構造は、前記電極端子と異なるところで、第１回路基
板と前記電子部品または第２回路基板とがはんだ付けに
より固着されていることを特徴とする。According to a fourth aspect of the present invention, in the circuit board connection structure, the first circuit board and the electronic component or the second circuit board are fixed to each other by soldering at a position different from the electrode terminals. Characterize.
【００１６】また、請求項５記載の発明の回路基板の接
続構造は、前記導電粒子の少なくとも一部がはんだボー
ルで形成されていることを特徴とする。The circuit board connection structure according to a fifth aspect of the present invention is characterized in that at least a part of the conductive particles is formed of a solder ball.
【００１７】また、請求項６記載の発明の回路基板の接
続構造は、前記導電粒子が強磁性体で形成されているこ
とを特徴とする。The circuit board connection structure according to a sixth aspect of the present invention is characterized in that the conductive particles are formed of a ferromagnetic material.
【００１８】また、請求項７記載の発明の回路基板の接
続構造は、前記導電粒子が高分子材料で形成された球の
表面に強磁性体が被覆されてなるものであることを特徴
とする。The circuit board connection structure according to the present invention is characterized in that the conductive particles are formed by coating a surface of a sphere formed of a polymer material with a ferromagnetic material. .
【００１９】また、請求項８記載の発明の回路基板の接
続構造は、前記導電粒子が、高分子材料からなり中空部
を有する球の表面に導電材料が被覆されたものであるこ
とを特徴とする。Further, in the circuit board connection structure of the present invention as defined in claim 8, the conductive particles are characterized in that the surface of a sphere having a hollow portion made of a polymer material is coated with the conductive material. To do.
【００２０】また、請求項９記載の発明の回路基板の接
続構造は、前記接続電極端子、前記電子部品または第２
回路基板の電極端子、および前記導電粒子のうちの少な
くとも１つが永久磁石からなり、残部が強磁性体からな
ることを特徴とする。According to a ninth aspect of the present invention, there is provided a circuit board connecting structure, wherein the connecting electrode terminal, the electronic component or the second
At least one of the electrode terminal of the circuit board and the conductive particles is made of a permanent magnet, and the rest is made of a ferromagnetic material.
【００２１】また、請求項１０記載の発明の回路基板の
接続構造は、前記電子部品または第２回路基板の周縁の
少なくとも一部と該周縁の一部と対向する部分の第１回
路基板の一方に永久磁石が設けられ、他方に永久磁石ま
たは強磁性体が設けられていることを特徴とする。According to a tenth aspect of the present invention, there is provided a circuit board connecting structure, wherein at least a part of a peripheral edge of the electronic component or the second circuit board and a part of the first circuit board facing a part of the peripheral edge. Is provided with a permanent magnet, and the other is provided with a permanent magnet or a ferromagnetic material.
【００２２】また、請求項１１記載の発明の回路基板の
接続構造は、前記電子部品または第２回路基板の一部に
強磁性体が設けられ、前記電子部品または第２回路基板
と接続される第１回路基板の前記強磁性体に対向する位
置の第１回路基板の裏面に永久磁石が設けられているこ
とを特徴とする。In the circuit board connection structure according to the eleventh aspect of the present invention, a ferromagnetic material is provided in a part of the electronic component or the second circuit board, and the electronic component or the second circuit board is connected to the electronic component or the second circuit board. A permanent magnet is provided on the back surface of the first circuit board at a position facing the ferromagnetic body of the first circuit board.
【００２３】また、請求項１２記載の発明の回路基板の
接続構造は、前記電子部品または第２回路基板と第１回
路基板の接続部を覆い内部を負圧状態に保たれた気密性
シートを備えてなることを特徴とする。According to a twelfth aspect of the present invention, there is provided a circuit board connection structure, comprising an airtight sheet which covers the connection part between the electronic component or the second circuit board and the first circuit board and keeps a negative pressure inside. It is characterized by being prepared.
【００２４】また、請求項１３記載の発明の回路基板の
接続構造は、前記接続部近傍における前記電子部品また
は第２回路基板と第１回路基板間に介在し、両者間の気
密を保持する樹脂枠、該樹脂枠内を負圧状態にする排気
孔、および該排気孔を塞ぐ栓を備え、前記接続部近傍に
おける前記電子部品または第２回路基板と第１回路基板
間を負圧状態に保持してなることを特徴とする。According to a thirteenth aspect of the present invention, there is provided a circuit board connection structure, wherein a resin is interposed between the electronic component or the second circuit board and the first circuit board in the vicinity of the connection portion to maintain airtightness therebetween. A frame, an exhaust hole for making the inside of the resin frame in a negative pressure state, and a plug for closing the exhaust hole, and maintaining a negative pressure state between the electronic component or the second circuit board and the first circuit board in the vicinity of the connection portion. It is characterized by being done.
【００２５】さらに、請求項１４記載の発明の回路基板
の接続方法は、接続電極端子および配線パターンが形成
された第１回路基板上に導電粒子を含む感光性樹脂を塗
布する工程と、該感光性樹脂を選択的に露光し、ついで
現像することにより前記配線パターン上以外の感光性樹
脂を除去する工程と、前記導電粒子を介して第１回路基
板上の接続電極端子と電子部品または第２回路基板の電
極端子とを接触させ、第１回路基板に前記電子部品また
は第２回路基板を接着する工程とを備える回路基板の接
続方法であって、前記感光性樹脂の現像の際に、現像液
槽に浸漬した第１回路基板に前記現像液または気泡を吹
きつけながら現像することを特徴とする。Furthermore, in the method of connecting a circuit board according to a fourteenth aspect of the present invention, a step of applying a photosensitive resin containing conductive particles onto the first circuit board on which connection electrode terminals and wiring patterns are formed, Of the photosensitive resin other than on the wiring pattern by selectively exposing the conductive resin to light and then developing the conductive resin, and connecting electrode terminals on the first circuit board and the electronic component or the second through the conductive particles. A method of connecting a circuit board, comprising the step of contacting an electrode terminal of the circuit board and adhering the electronic component or the second circuit board to a first circuit board, the method comprising: It is characterized in that the first circuit board immersed in the liquid tank is developed while spraying the developing solution or bubbles.
【００２６】さらに、請求項１５記載の発明の回路基板
の接続方法は、前記感光性樹脂の現像の際に、現像液槽
に浸漬した第１回路基板にエアーを吹きつけながら前記
現像液槽から第１回路基板を引き上げることを特徴とし
ている。Further, in the circuit board connecting method according to the invention of claim 15, during the development of the photosensitive resin, the first circuit board immersed in the developing solution tank is blown with air from the developing solution tank. The feature is that the first circuit board is pulled up.
【００２７】[0027]
【作用】請求項１記載の発明によれば、第１回路基板の
配線パターンのうち導電粒子を搭載したくない部分を透
明電極端子によって形成しているので、露光によって透
明電極端子上のポジ型感光性樹脂には透明電極端子を透
過して紫外線が当たり、現像の際に感光性樹脂とともに
導電粒子も除去される。そのため、例えば導電粒子が液
晶駆動用ＩＣなどの電子部品などの表面を加圧するよう
なことはなく、電子部品を破壊することはない。According to the first aspect of the present invention, the portion of the wiring pattern of the first circuit board on which the conductive particles are not to be mounted is formed by the transparent electrode terminals. Ultraviolet rays pass through the transparent electrode terminal and strike the photosensitive resin, and the conductive particles are removed together with the photosensitive resin during development. Therefore, for example, the conductive particles do not press the surface of an electronic component such as a liquid crystal driving IC, and the electronic component is not destroyed.
【００２８】また請求項２記載の発明によれば、液晶表
示パネルの接続電極端子の一部を透明電極端子によって
形成する場合は、紫外線照射工程において、接続電極端
子上の紫外線硬化樹脂にも透明電極端子を透過し、か
つ、透明電極からの回り込みによって紫外線が当たり、
接続電極端子上の紫外線硬化樹脂は硬化される。そのた
め、液晶表示パネルの接続電極端子と液晶駆動用ＩＣの
電極端子とが確実に導電粒子を介して電気的に接続され
る。According to the second aspect of the invention, when a part of the connecting electrode terminals of the liquid crystal display panel is formed by transparent electrode terminals, it is transparent to the ultraviolet curable resin on the connecting electrode terminals in the ultraviolet irradiation step. Ultraviolet rays pass through the electrode terminals and wrap around from the transparent electrode,
The ultraviolet curable resin on the connection electrode terminals is cured. Therefore, the connection electrode terminal of the liquid crystal display panel and the electrode terminal of the liquid crystal driving IC are surely electrically connected via the conductive particles.
【００２９】また、請求項３記載の発明によれば、接続
電極端子周囲のパッシベーション膜の枠内の一部にもパ
ッシベーション膜を形成しているので、導電粒子が、こ
のパッシベーション膜と接続電極端子の段差に引っ掛か
って、電極端子の中央部にも搭載されているため、例え
ば液晶表示パネルと液晶駆動用ＩＣの電極端子間でオー
プン不良が発生することはない。また、導通抵抗も低減
できる。According to the third aspect of the invention, since the passivation film is also formed in a part of the frame of the passivation film around the connection electrode terminal, the conductive particles form the passivation film and the connection electrode terminal. Since it is caught in the step and is also mounted in the central portion of the electrode terminal, an open defect does not occur between the electrode terminal of the liquid crystal display panel and the electrode terminal of the liquid crystal driving IC, for example. In addition, conduction resistance can also be reduced.
【００３０】また、請求項４記載の発明によれば、例え
ば液晶駆動用ＩＣなど電子部品や第２回路基板がはんだ
によって液晶表示パネルなどの第１回路基板に固定され
ている。そのため、例えば液晶駆動用ＩＣやバックライ
トなどの発熱によりはんだは熱膨張を起こすが、はんだ
は導電粒子よりも熱膨張係数が小さいため、導電粒子と
電子部品などと第１回路基板の電極端子間の接触が離
れ、オープン不良が発生することはない。According to the fourth aspect of the invention, the electronic component such as the liquid crystal driving IC and the second circuit board are fixed to the first circuit board such as the liquid crystal display panel by soldering. Therefore, for example, the solder causes thermal expansion due to heat generated by a liquid crystal driving IC or a backlight, but since the thermal expansion coefficient of the solder is smaller than that of the conductive particles, the conductive particles and the electronic component or the like are not connected between the electrode terminals of the first circuit board. The contacts will not be separated and the open failure will not occur.
【００３１】また、請求項５記載の発明によれば、導電
粒子にはんだボールが含まれているため、オープン不良
端子が発生した場合、その電極端子部をレーザ光によっ
て加熱することによりはんだが溶融し、液晶表示パネル
などの第１回路基板の接続電極端子と液晶駆動用ＩＣな
どの電子部品などの電極端子が接触して、電気的に接続
され、オープン不良が修復される。According to the invention of claim 5, since the conductive particles include solder balls, when an open defective terminal occurs, the solder is melted by heating the electrode terminal portion with laser light. Then, the connection electrode terminal of the first circuit board such as the liquid crystal display panel and the electrode terminal of the electronic component such as the liquid crystal driving IC are brought into contact with each other to be electrically connected and the open defect is repaired.
【００３２】また、請求項６および７記載の発明によれ
ば、導電粒子の少なくとも一部が強磁性体で形成されて
いるので、接続時に外部磁力により導電粒子を電極上に
より多く集めることができ、使用する導電粒子の総数を
低減でき、さらに電極上の固着密度を増加できるから接
続不良を低減できる。According to the sixth and seventh aspects of the invention, since at least a part of the conductive particles is made of a ferromagnetic material, it is possible to collect more conductive particles on the electrode due to an external magnetic force at the time of connection. Since the total number of conductive particles used can be reduced and the adhesion density on the electrodes can be increased, connection defects can be reduced.
【００３３】また、請求項８記載の発明によれば、導電
粒子が、高分子材料からなり中空部を有する球の表面に
導電材料が被覆されたものであるので、接続時に加圧に
よる球の変形が可能となり、両電極に確実に接触できる
ので、接続の信頼性が向上する。According to the invention of claim 8, the conductive particles are spheres made of a polymeric material and having a hollow portion, and the surface of the sphere is coated with the conductive material. Deformation is possible and both electrodes can be surely contacted, so the reliability of connection is improved.
【００３４】さらに請求項９〜１１記載の発明によれ
ば、第１回路基板上に電子部品または第２回路基板を接
続する際、第１回路基板、電子部品もしくは第２回路基
板、導電粒子の各々の一部の少なくとも一カ所に永久磁
石を設け、他の部分に強磁性体を設けているため、相互
間に働く磁気的吸引力により、第１回路基板と電子部品
または第２回路基板の電気的接続不良を低減すると共
に、組立時の位置合せを容易にしている。Further, according to the invention of claims 9 to 11, when the electronic component or the second circuit board is connected to the first circuit board, the first circuit board, the electronic component or the second circuit board, and the conductive particles are formed. Since at least one part of each part is provided with a permanent magnet and the other part is provided with a ferromagnetic material, the magnetic attraction force acting between them causes the first circuit board and the electronic component or the second circuit board to move. It reduces electrical connection defects and facilitates alignment during assembly.
【００３５】また、請求項１２および１３記載の発明に
よれば、接続部近傍における電子部品または第２回路基
板と第１回路基板間を負圧状態に保持することにより電
気的接続を行うので、負圧状態を解放すれば容易に両者
を分離できる。これにより両者を接続した後に不良が発
生しても容易に不良回路基板または電子部品を交換でき
る。また、従来は加熱して不良の回路基板または電子部
品を取り外していたが、本発明では必ずしも熱などは必
要としないので修復による第１回路基板の信頼性低下を
防止できる。According to the twelfth and thirteenth aspects of the present invention, since electrical connection is made by maintaining a negative pressure between the electronic component or the second circuit board and the first circuit board in the vicinity of the connection portion, The two can be easily separated by releasing the negative pressure state. This makes it possible to easily replace the defective circuit board or electronic component even if a defect occurs after connecting the two. Further, in the past, the defective circuit board or electronic component was removed by heating, but in the present invention, heat or the like is not always required, so that it is possible to prevent the reliability of the first circuit board from being lowered due to the repair.
【００３６】また、請求項１４記載の発明によれば、現
像液槽に浸漬した第１回路基板に前記現像液または気泡
を吹きつけながら現像するので、吹きつけによる圧力で
配線パターン部以外の感光性樹脂を効率的、かつ、確実
に除去することができる。その結果、例えば液晶表示パ
ネルなど第１回路基板の接続電極端子相互間で短絡が生
じることはない。According to the fourteenth aspect of the invention, since the development is performed while spraying the developing solution or bubbles onto the first circuit board immersed in the developing solution tank, the pressure other than the wiring pattern portion exposes the photosensitive layer except the wiring pattern section. It is possible to remove the functional resin efficiently and surely. As a result, a short circuit does not occur between the connection electrode terminals of the first circuit board such as a liquid crystal display panel.
【００３７】また、請求項１５記載の発明によれば、第
１回路基板にエアーを吹きつけながら前記第１回路基板
を現像液槽から引き上げるので、接続電極端子間に残存
する導電粒子がエアーによって吹き飛ばされ、接続電極
端子間の導電粒子は効率的、かつ、確実に除去される。
その結果、例えば液晶表示パネルなど第１回路基板の接
続電極端子間で短絡が生じることはない。According to the invention as set forth in claim 15, since the first circuit board is pulled up from the developer tank while blowing air on the first circuit board, the conductive particles remaining between the connection electrode terminals are generated by the air. The conductive particles between the connection electrode terminals are blown off and removed efficiently and surely.
As a result, a short circuit does not occur between the connection electrode terminals of the first circuit board such as a liquid crystal display panel.
【００３８】[0038]
【実施例】つぎに、本発明の回路基板の接続構造および
接続方法について図面を参照しながら説明する。なお、
以下の各実施例では第１回路基板として液晶表示パネル
を、電子部品または第２回路基板として液晶駆動用ＩＣ
を例にとって説明するが、これらに限定されるものでは
なく、第１回路基板としては、例えばプラズマディスプ
レイ、エレクトロルミネッセントディスプレイなどの他
の平面表示パネルや、ＣＣＤ、サーマルヘッド、密着イ
メージセンサなどに用いられる回路基板などでも同様に
本発明を適用できる。また、電子部品または第２回路基
板としては、例えば抵抗、コンデンサやディスクリート
半導体装置、インダクタ、ボリュームなどの電子部品や
接続配線が可撓性フィルムで保持されたフレキシブルプ
リント基板やＴＡＢなどの接続配線や他の回路基板など
でも同様に本発明を適用できる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a circuit board connection structure and connection method of the present invention will be described with reference to the drawings. In addition,
In each of the following embodiments, a liquid crystal display panel is used as the first circuit board, and a liquid crystal driving IC is used as the electronic component or the second circuit board.
However, the first circuit board is not limited to these, and examples of the first circuit board include other flat display panels such as plasma displays and electroluminescent displays, CCDs, thermal heads, and contact image sensors. The present invention can be similarly applied to a circuit board used in the above. Further, as the electronic component or the second circuit board, for example, electronic components such as resistors, capacitors, discrete semiconductor devices, inductors, and volumes, and flexible printed boards in which connection wiring is held by a flexible film, connection wiring such as TAB, The present invention can be similarly applied to other circuit boards and the like.
【００３９】実施例１．図１は請求項１記載の発明によ
る回路基板の接続構造の一実施例を示す断面図である。Example 1. FIG. 1 is a sectional view showing an embodiment of a circuit board connection structure according to the first aspect of the present invention.
【００４０】本実施例では例えば液晶駆動用ＩＣの下側
の配線パターン３などのように、導電粒子５を搭載した
くない配線パターンの部分をＩＴＯ（Indium Tin Oxid
e）などの透明電極端子で形成することに特徴がある。
その結果、露光工程において、バスラインなどの配線パ
ターン３上のポジ型の感光性樹脂８は透明電極端子を透
過して紫外線が当たるため、現像によって配線パターン
３上の感光性樹脂６は除去される。したがって、液晶駆
動用ＩＣ６の下側の配線パターン３上に導電粒子５は配
されず、液晶駆動用ＩＣ６を液晶表示パネル１にフェー
スダウンで位置合わせして加圧する際に、導電粒子５が
液晶表示パネル１の表面を加圧することはなく、液晶駆
動用ＩＣ６は破壊せず、接続信頼性が向上する。In this embodiment, a portion of the wiring pattern on which the conductive particles 5 are not desired to be mounted, such as the wiring pattern 3 on the lower side of the liquid crystal driving IC, is ITO (Indium Tin Oxid).
It is characterized by forming with transparent electrode terminals such as e).
As a result, in the exposure process, the positive photosensitive resin 8 on the wiring pattern 3 such as a bus line passes through the transparent electrode terminal and is exposed to ultraviolet rays, so that the photosensitive resin 6 on the wiring pattern 3 is removed by development. It Therefore, the conductive particles 5 are not arranged on the wiring pattern 3 below the liquid crystal driving IC 6, and when the liquid crystal driving IC 6 is positioned face down on the liquid crystal display panel 1 and pressure is applied, the conductive particles 5 are liquid crystal. The surface of the display panel 1 is not pressed, the liquid crystal driving IC 6 is not destroyed, and the connection reliability is improved.
【００４１】実施例２．つぎに、請求項１記載の発明に
よる回路基板の接続構造の他の実施例を図２を参照しな
がら説明する。図２（ａ）に示されるように、液晶表示
パネル１の実装部にパッシベーション膜が形成されてい
ない場合、接続電極端子２と各画素を結ぶ配線パターン
３上の導電粒子Ａが、液晶駆動用ＩＣ６のシリコン基板
に接触し、並んで設けられている接続電極端子２の相互
間でショートが発生することがある。そこで、図２
（ｂ）に示されるように、接続電極端子２と各画素を結
ぶ配線パターン３の一部（図中の網点部）３ａを透明導
電膜で形成することにより、前述のようにこの透明導電
膜３ａ上の導電粒子５は除去されるため、接続電極端子
２間でショートは発生せず、高信頼性の接続を達成する
ことができる。Example 2. Next, another embodiment of the circuit board connecting structure according to the invention will be described with reference to FIG. As shown in FIG. 2A, when the passivation film is not formed on the mounting portion of the liquid crystal display panel 1, the conductive particles A on the wiring pattern 3 connecting the connection electrode terminal 2 and each pixel are used for driving the liquid crystal. A short circuit may occur between the connection electrode terminals 2 arranged side by side in contact with the silicon substrate of the IC 6. Therefore, FIG.
As shown in (b), by forming a part (halftone dot portion in the figure) 3a of the wiring pattern 3 connecting the connection electrode terminal 2 and each pixel with a transparent conductive film, the transparent conductive film is formed as described above. Since the conductive particles 5 on the film 3a are removed, a short circuit does not occur between the connection electrode terminals 2, and a highly reliable connection can be achieved.
【００４２】さらに、液晶表示パネル１の配線メタライ
ズは一般にＩＴＯ膜上にアルミニウム膜などを蒸着法や
スパッタ法で積み上げることにより成膜されており、配
線パターンの一部を透明導電膜で形成するためには、ア
ルミニウム膜などのメタライズをエッチングにより除去
するだけでよく、成膜コストが増加することはない。Further, the wiring metallization of the liquid crystal display panel 1 is generally formed by stacking an aluminum film or the like on the ITO film by a vapor deposition method or a sputtering method, and a part of the wiring pattern is formed of a transparent conductive film. However, the metallization of the aluminum film or the like need only be removed by etching, and the film formation cost does not increase.
【００４３】実施例３．図３は請求項２記載の発明の回
路基板の接続構造の一実施例を説明する平面図である。
本実施例３では、接続電極端子２の一部がＩＴＯ（Indi
um Tin Oxide）などの透明電極端子２ａで形成されるこ
とにより、紫外線硬化樹脂10の硬化工程において紫外線
が透明電極端子２ａを透過して、さらに透明電極端子２
ａからの回り込みによって、接続電極端子２上の紫外線
硬化樹脂10に紫外線が当たり、紫外線硬化樹脂10は完全
に硬化する。したがって、液晶駆動用ＩＣ６およびバッ
クライトの発熱によって紫外線硬化樹脂10の粘度が低下
して、紫外線硬化樹脂10が移動することはない。これに
伴い、導電粒子５も接続電極端子２上から移動したり、
紫外線硬化樹脂10が導電粒子５の表面を覆うことがな
い。そのため、液晶表示パネル１の接続電極端子２と液
晶駆動用ＩＣ６の電極端子７とのあいだで接続不良や導
通抵抗が高くなるなどの不良は発生せず、接続信頼性が
向上する。Example 3. FIG. 3 is a plan view illustrating an embodiment of the circuit board connection structure according to the second aspect of the present invention.
In the third embodiment, a part of the connection electrode terminal 2 is made of ITO (Indi
um Tin Oxide) and the like, so that in the curing step of the ultraviolet curable resin 10, ultraviolet rays pass through the transparent electrode terminal 2a, and the transparent electrode terminal 2a
By the wraparound from a, the ultraviolet ray curing resin 10 on the connection electrode terminal 2 is exposed to ultraviolet rays, and the ultraviolet ray curing resin 10 is completely cured. Therefore, the heat generated by the liquid crystal driving IC 6 and the backlight does not reduce the viscosity of the ultraviolet curable resin 10 and the ultraviolet curable resin 10 does not move. Along with this, the conductive particles 5 also move from above the connection electrode terminal 2,
The ultraviolet curable resin 10 does not cover the surface of the conductive particles 5. Therefore, a connection failure or a failure such as an increase in conduction resistance does not occur between the connection electrode terminal 2 of the liquid crystal display panel 1 and the electrode terminal 7 of the liquid crystal driving IC 6, and the connection reliability is improved.
【００４４】また、接続電極端子２の一部を透明電極端
子２ａで形成することにより接続電極端子２に搭載され
る導電粒子５の数は減少するが、数個以上の導電粒子５
が接続電極端子２上にあれば、導通抵抗は１Ω以下であ
り、問題はない。Further, although the number of the conductive particles 5 mounted on the connection electrode terminal 2 is reduced by forming a part of the connection electrode terminal 2 by the transparent electrode terminal 2a, the number of the conductive particles 5 is not less than several.
Is on the connection electrode terminal 2, the conduction resistance is 1Ω or less, and there is no problem.
【００４５】実施例４．図４に請求項２記載の発明にか
かる回路基板の接続構造の他の実施例を示す。図４にお
いて36は紫外線照射装置のファイバーであり、加圧ヘッ
ド34に取りつけられている。液晶表示パネル１の接続電
極端子２と各画素を結ぶ配線パターン３上の紫外線硬化
樹脂の端部10ａが、配線パターン３がマスクとなり未硬
化であると、湿気が浸入し電極端子２、７が腐食を起こ
し、オープン不良が発生するおそれがある。Example 4. FIG. 4 shows another embodiment of the circuit board connection structure according to the second aspect of the present invention. In FIG. 4, reference numeral 36 denotes a fiber of the ultraviolet irradiation device, which is attached to the pressure head 34. If the end portion 10a of the ultraviolet curable resin on the wiring pattern 3 connecting the connection electrode terminal 2 of the liquid crystal display panel 1 and each pixel is uncured by using the wiring pattern 3 as a mask, moisture penetrates and the electrode terminals 2 and 7 are formed. Corrosion may occur and open defects may occur.
【００４６】そこで、液晶駆動用ＩＣ６を液晶表示パネ
ル１に加圧ヘッド34で押しつけた状態で、裏面から紫外
線照射装置11により紫外線を照射すると同時に、ファイ
バー36からも紫外線を照射することによって、紫外線硬
化樹脂10を硬化させる。これにより、配線パターン３上
の端部の紫外線硬化樹脂10ａも完全に硬化するため、接
続電極端子２などの腐食が発生することはなく、接続の
信頼性が一層向上する。Therefore, while the liquid crystal driving IC 6 is pressed against the liquid crystal display panel 1 by the pressure head 34, ultraviolet rays are radiated from the back surface by the ultraviolet ray radiating device 11, and at the same time, ultraviolet rays are also radiated from the fiber 36. The curing resin 10 is cured. As a result, the ultraviolet curable resin 10a at the end of the wiring pattern 3 is also completely cured, so that the connection electrode terminals 2 and the like are not corroded and the connection reliability is further improved.
【００４７】また、前述の実施例３のように接続電極端
子２の一部を透明電極端子で形成し、裏面より紫外線を
照射すると同時に、ファイバー36によって上面からも紫
外線を照射して紫外線硬化樹脂10を硬化させることによ
り、接続信頼性が一層向上することはいうまでもない。Further, as in the third embodiment, a part of the connecting electrode terminal 2 is formed of a transparent electrode terminal, and ultraviolet rays are radiated from the back surface, and at the same time, ultraviolet rays are also radiated from the upper surface by the fiber 36 so that an ultraviolet curable resin is obtained. Needless to say, curing 10 further improves the connection reliability.
【００４８】実施例５．つぎに、請求項３記載の発明に
かかる回路基板の接続構造の一実施例について説明す
る。従来、スピンコート法によって導電粒子５が混入さ
れた感光性樹脂８を液晶表示パネル１の表面に塗布する
場合、図３１に示したように、導電粒子５は遠心力によ
って接続電極端子２の外周辺にのみ配される。そのた
め、液晶表示パネル１の接続電極端子２と液晶駆動用Ｉ
Ｃ６の電極端子７で接続不良や導通抵抗が高くなるなど
の問題が生じている。Example 5. Next, an embodiment of the circuit board connection structure according to the invention of claim 3 will be described. Conventionally, when the photosensitive resin 8 mixed with the conductive particles 5 is applied to the surface of the liquid crystal display panel 1 by the spin coating method, the conductive particles 5 are applied to the outside of the connection electrode terminal 2 by the centrifugal force as shown in FIG. It is distributed only in the surrounding area. Therefore, the connection electrode terminal 2 of the liquid crystal display panel 1 and the liquid crystal driving I
Problems such as poor connection and high conduction resistance occur at the electrode terminal 7 of C6.
【００４９】本実施例５では、図５に示されるように、
電極端子２の周囲に設けられているパッシベーション膜
４の枠内の接続電極端子２の中央部にも帯状に形成され
ている。これによって、スピンコート法によって導電粒
子５を液晶表示パネル１に搭載する際に、導電粒子５が
接続電極端子２の中央部に形成されたパッシベーション
膜４の段差に引っ掛かり、接続電極端子２の中央部にも
導電粒子５が配されることとなる。そのため、液晶表示
パネル１の接続電極端子２と液晶駆動用ＩＣ６の電極端
子７で接続不良や導通抵抗が高くなるなどの問題が生じ
ることはなく、接続歩留りおよび接続信頼性が向上す
る。In the fifth embodiment, as shown in FIG.
A strip is also formed in the central portion of the connection electrode terminal 2 within the frame of the passivation film 4 provided around the electrode terminal 2. As a result, when the conductive particles 5 are mounted on the liquid crystal display panel 1 by the spin coating method, the conductive particles 5 are caught in the step of the passivation film 4 formed in the central portion of the connection electrode terminal 2, and the center of the connection electrode terminal 2 is caught. The conductive particles 5 are also arranged on the part. Therefore, the connection yield and the connection reliability of the connection electrode terminal 2 of the liquid crystal display panel 1 and the electrode terminal 7 of the liquid crystal driving IC 6 do not arise, and the connection yield and the connection reliability are improved.
【００５０】なお、図５では接続電極端子２上のパッシ
ベーション膜４の枠内でのパッシベーション膜が帯状に
形成された場合を示したが、これに限られるものではな
く、例えば図６〜図８に示されるように、パッシベーシ
ョン膜４がそれぞれ田の字型や島状や突起状に形成され
てもよい。Although FIG. 5 shows the case where the passivation film in the frame of the passivation film 4 on the connection electrode terminal 2 is formed in a band shape, the present invention is not limited to this, and for example, FIGS. As shown in, the passivation film 4 may be formed in the shape of a square, an island, or a protrusion.
【００５１】実施例６．つぎに、請求項４記載の発明に
かかる回路基板の接続構造の一実施例を図９を参照しな
がら説明する。Example 6. Next, an embodiment of the circuit board connection structure according to the invention will be described with reference to FIG.
【００５２】図９において31は液晶駆動用ＩＣ６の中央
部に形成されたはんだバンプ、32は液晶表示パネル１に
形成されたＩＣ固定用パッドで、はんだバンプ31がはん
だ付けされる。33はＩＣ固定用パッド32にレーザ光を照
射するレーザ光照射装置である。In FIG. 9, 31 is a solder bump formed in the center of the liquid crystal driving IC 6, 32 is an IC fixing pad formed in the liquid crystal display panel 1, and the solder bump 31 is soldered. Reference numeral 33 is a laser light irradiation device for irradiating the IC fixing pad 32 with laser light.
【００５３】液晶表示パネル１の接続電極端子２に導電
粒子５を搭載後、液晶駆動用ＩＣ６を位置合せする。つ
ぎに、液晶駆動用ＩＣ６を加圧ヘッド34で加圧しなが
ら、液晶表示パネル１の裏面からＩＣ固定用パッド32に
レーザ光照射装置33によりレーザ光を照射し、はんだバ
ンプ31を溶融して、液晶表示パネル１の固定用パッド32
に液晶駆動用ＩＣ６をはんだ付け固定する。After mounting the conductive particles 5 on the connection electrode terminals 2 of the liquid crystal display panel 1, the liquid crystal driving IC 6 is aligned. Next, while pressing the liquid crystal driving IC 6 with the pressing head 34, the IC fixing pad 32 is irradiated with laser light from the laser light irradiation device 33 from the back surface of the liquid crystal display panel 1 to melt the solder bumps 31, LCD display panel 1 fixing pad 32
Then, the liquid crystal driving IC 6 is fixed by soldering.
【００５４】はんだの熱膨張係数は2.5×10-5／℃、ま
た導電粒子、例えばミクロパール（商品名、積水ファイ
ンケミカル（株）製）の熱膨張係数は4.73×10-5／℃で
あり、導電粒子５の熱膨張係数は、はんだの約２倍であ
る。そのため、液晶駆動用ＩＣ６やバックライトの発熱
によって、はんだバンプ31が膨張しても接続電極端子２
と導電粒子５の接触が離れ、オープン不良が発生するこ
とはなく、接続信頼性が向上する。The thermal expansion coefficient of solder is 2.5 × 10 -5 / ° C., and the thermal expansion coefficient of conductive particles such as Micropearl (trade name, manufactured by Sekisui Fine Chemical Co., Ltd.) is 4.73 × 10 -5 / ° C. The coefficient of thermal expansion of the conductive particles 5 is about twice that of solder. Therefore, even if the solder bumps 31 expand due to the heat generated by the liquid crystal driving IC 6 and the backlight, the connection electrode terminals 2
The contact between the conductive particles 5 and the conductive particles 5 is not separated, and the open failure does not occur, so that the connection reliability is improved.
【００５５】また、レーザ光によるはんだ付けの適用に
より、局所加熱で液晶駆動用ＩＣ６を固定できるため、
液晶表示パネル１に熱ストレスが生じることはない。同
様に、不良ＩＣを取り替える場合、レーザ光で局部加熱
することによって、容易に不良ＩＣを取り外すことがで
きる。さらに、低融点はんだを用いることにより、液晶
表示パネル１への熱ストレスを一層低減することができ
る。Further, by applying soldering with laser light, the liquid crystal driving IC 6 can be fixed by local heating,
Thermal stress does not occur in the liquid crystal display panel 1. Similarly, when replacing a defective IC, the defective IC can be easily removed by locally heating with laser light. Furthermore, by using the low melting point solder, the thermal stress on the liquid crystal display panel 1 can be further reduced.
【００５６】さらにまた、液晶駆動用ＩＣ６の中央部で
液晶表示パネル１とはんだ付けするため、はんだ部に生
じる熱応力を小さくできる。Further, since the central portion of the liquid crystal driving IC 6 is soldered to the liquid crystal display panel 1, the thermal stress generated in the solder portion can be reduced.
【００５７】実施例７．つぎに、請求項４記載の発明に
かかる回路基板の接続構造の他の実施例を図１０を参照
しながら説明する。Example 7. Next, another embodiment of the circuit board connecting structure according to the invention will be described with reference to FIG.
【００５８】35は液晶駆動用ＩＣ６の周囲に設けられた
樹脂モールドである。図１０に示されるように、液晶表
示パネル１に液晶駆動用ＩＣ６がはんだ付けされたの
ち、液晶駆動用ＩＣ６の周囲に樹脂モールド35が設けら
れることにより、電極端子２、７の湿気による腐食を防
止することができ、接続の信頼性が一層向上する。A resin mold 35 is provided around the liquid crystal driving IC 6. As shown in FIG. 10, after the liquid crystal driving IC 6 is soldered to the liquid crystal display panel 1, the resin mold 35 is provided around the liquid crystal driving IC 6 to prevent the electrode terminals 2 and 7 from being corroded by moisture. This can be prevented and the reliability of the connection is further improved.
【００５９】なお、ＩＣ固定用パッド32ははんだ付け可
能なメタライズで形成する必要があるが、ジェットプリ
ンティング法などによって、ＩＣ固定用パッド32に選択
的にＣｕ薄膜を形成することにより、コストを増加させ
ることなく設けられる。Although the IC fixing pad 32 needs to be formed by solderable metallization, the cost is increased by selectively forming a Cu thin film on the IC fixing pad 32 by a jet printing method or the like. It is provided without letting it go.
【００６０】実施例８．図１１は請求項５記載の発明の
回路基板の接続構造の一実施例を示す。図１１におい
て、37ははんだボールである。Example 8. FIG. 11 shows an embodiment of the circuit board connection structure according to the fifth aspect of the present invention. In FIG. 11, 37 is a solder ball.
【００６１】液晶駆動用ＩＣ６に形成された電極端子７
の高さのバラツキや液晶駆動用ＩＣ６の加圧工程におい
て、紫外線硬化樹脂10が導電粒子５上から完全に除去さ
れず、導電粒子５と電極端子７とが接触せずにオープン
不良になるものが発生することがあった。Electrode terminals 7 formed on the liquid crystal driving IC 6
Of the ultraviolet curable resin 10 is not completely removed from the conductive particles 5 in the step of applying pressure to the liquid crystal driving IC 6 due to variations in height of the liquid crystal driving IC 6 and the conductive particles 5 and the electrode terminals 7 do not come into contact with each other, resulting in an open defect. May occur.
【００６２】そこで、図１１（ａ）に示されるように、
はんだボール37を含む導電粒子５を接続電極端子２上に
搭載する。そして、図１１（ｂ）に示されるように、液
晶駆動用ＩＣ６を下側にして、オープン不良が発生した
接続電極端子２に背面よりレーザ光照射装置33によって
レーザ光を照射し、はんだボール37を溶融させる。その
結果、図１１（ｃ）に示されるように、溶融したはんだ
は重力によって下側に垂れ、接続電極端子２と電極端子
７の両方に接触して電気的に接続され、オープン不良を
容易に修復することができる。さらに、レーザ光による
局部加熱のため、液晶表示パネル１に熱ストレスが発生
することはない。Therefore, as shown in FIG.
The conductive particles 5 including the solder balls 37 are mounted on the connection electrode terminals 2. Then, as shown in FIG. 11B, with the liquid crystal driving IC 6 on the lower side, the connection electrode terminal 2 having the open defect is irradiated with laser light from the back surface by the laser light irradiation device 33, and the solder ball 37 To melt. As a result, as shown in FIG. 11C, the molten solder hangs downward due to gravity, contacts both the connection electrode terminal 2 and the electrode terminal 7 and is electrically connected, facilitating open failure. Can be repaired. Further, since the laser light locally heats the liquid crystal display panel 1, no thermal stress is generated.
【００６３】また、導電粒子５を使用しないではんだボ
ール37のみを用いても、同様の効果がえられることはい
うまでもない。Needless to say, the same effect can be obtained by using only the solder balls 37 without using the conductive particles 5.
【００６４】実施例９．請求項６記載の発明にかかる回
路基板の接続構造の一実施例をその接続工程を示す図１
２を参照しながら説明する。図において、16は磁石、17
はスピンコート用の台座である。この例では導電粒子は
例えば鉄、コバルト、ニッケル、クロムまたはそれらの
合金などの強磁性体で形成さている。その表面には腐食
防止のためのコーティングが施されてもよい。Example 9. FIG. 1 is a diagram showing a connecting step of an embodiment of a circuit board connecting structure according to a sixth aspect of the present invention.
This will be described with reference to 2. In the figure, 16 is a magnet, 17
Is a pedestal for spin coating. In this example, the conductive particles are made of a ferromagnetic material such as iron, cobalt, nickel, chromium, or an alloy thereof. The surface may be provided with a coating for preventing corrosion.
【００６５】次に接続方法について説明する。まず、導
電粒子５を固定する接続電極端子２の背面に予め磁石16
を設置し、この状態で導電粒子５を液晶パネル１上に散
布する。導電粒子５は磁石16の磁力により接続電極端子
２上とその周辺に集められる。次に、ポジ型感光性樹脂
をスピンコート法により塗布する。この際、磁石16の磁
力をスピンコート時に受ける導電粒子５の遠心力よりも
強く設定すれば、導電粒子５はその位置をほとんど変え
ることなくポジ型感光性樹脂を塗布することができる。
この後、従来と同様の方法で露光、現像処理し、液晶駆
動用ＩＣ６を搭載する。Next, the connection method will be described. First, a magnet 16 is previously provided on the back surface of the connection electrode terminal 2 for fixing the conductive particles 5.
And the conductive particles 5 are sprayed on the liquid crystal panel 1 in this state. The conductive particles 5 are collected on and around the connection electrode terminals 2 by the magnetic force of the magnet 16. Next, a positive photosensitive resin is applied by spin coating. At this time, if the magnetic force of the magnet 16 is set to be stronger than the centrifugal force of the conductive particles 5 received during the spin coating, the conductive particles 5 can be coated with the positive photosensitive resin without changing the position thereof.
After that, exposure and development are performed in the same manner as in the conventional method, and the liquid crystal driving IC 6 is mounted.
【００６６】なお、この実施例９では導電粒子５とし
て、鉄、コバルト、ニッケル、クロムまたはそれらの合
金からなる強磁性体を使用しているが、これらに限るこ
とはなく、例えば鉄の酸化物のように導電性を有する強
磁性体であれば適用が可能である。In Example 9, a ferromagnetic material made of iron, cobalt, nickel, chromium, or an alloy thereof is used as the conductive particles 5, but the conductive particles 5 are not limited to these, and, for example, iron oxide. Any conductive ferromagnetic material can be used.
【００６７】また、この実施例９では、導電粒子５を散
布後に感光性樹脂を塗布しているが、予め感光性樹脂に
導電粒子５を混入してもよく、この場合にも磁力により
導電粒子５は電極２上とその周辺に集中する。この場合
には、感光性樹脂の粘性により、先に導電粒子５を散布
する方法に比べて、導電粒子５は電極２上とその周辺に
集中しづらくなるが、例えば機械的な振動を液晶パネル
１に与えることにより容易に集中する。さらに、この振
動は液晶パネル１に限らず磁石16に与えてもよい。さら
に振動に限らず、磁石16を回転させてもよい。In the ninth embodiment, the photosensitive resin is applied after the conductive particles 5 are sprayed, but the conductive particles 5 may be mixed in advance with the photosensitive resin. 5 is concentrated on and around the electrode 2. In this case, due to the viscosity of the photosensitive resin, the conductive particles 5 are less likely to be concentrated on and around the electrode 2 as compared with the method of previously spraying the conductive particles 5, but, for example, mechanical vibration may occur in the liquid crystal panel. Concentrate easily by giving 1. Further, this vibration may be applied to the magnet 16 as well as the liquid crystal panel 1. Furthermore, the magnet 16 may be rotated without being limited to vibration.
【００６８】また、図１２に示すようにスピンコートす
る台座17に予め電極２の位置に一致する磁石16を埋設し
ておけば、次ぎ次ぎに同一の工程を処理することがで
き、生産性が向上する。Further, as shown in FIG. 12, if the magnet 16 corresponding to the position of the electrode 2 is embedded in the pedestal 17 to be spin-coated in advance, the same process can be performed one after another, and the productivity is improved. improves.
【００６９】さらに、スピンコートする台座17を例えば
アクリル材料などの非磁性体で構成すれば、磁力が横方
向に広がることを防止するから導電粒子５の電極２上の
密度を向上することができる．Further, if the pedestal 17 to be spin-coated is made of a non-magnetic material such as an acrylic material, the magnetic force is prevented from spreading in the lateral direction, so that the density of the conductive particles 5 on the electrode 2 can be improved. ．
【００７０】実施例１０．図１３は請求項７記載の発明
にかかる回路基板の接続構造の一実施例を示す断面図で
あり、導電粒子５が高分子材料で形成された球すなわち
樹脂球51の表面に強磁性体52が被覆されたものである以
外は従来例や上記実施例９のものと同一である。このよ
うに、従来の金による被覆に代えて強磁性体52で樹脂球
51を被覆することにより、導電粒子５は磁力で所望の箇
所に集めることができる。よって、上記実施例９で述べ
た接続工程を適用することにより、良好な電気的接続を
得ることができる。Example 10. FIG. 13 is a cross-sectional view showing an embodiment of a circuit board connection structure according to the invention of claim 7, in which a ferromagnetic material 52 is formed on the surface of a sphere in which the conductive particles 5 are made of a polymer material, that is, a resin sphere 51. Is the same as that of the conventional example and the above-mentioned Example 9 except that it is coated. Thus, instead of the conventional gold coating, the ferromagnetic material 52
By coating 51, the conductive particles 5 can be magnetically collected at a desired position. Therefore, good electrical connection can be obtained by applying the connection step described in the ninth embodiment.
【００７１】なお、代表的な強磁性体52である鉄や鉄−
クロムの合金は、従来例で用いられる金よりも延性等が
乏しく加圧接続時に微細な亀裂が生じ易く、最悪の場合
には樹脂球51から剥離することがある。このため、加圧
接続時や液晶ディスプレイを動作中に電気的な接続不良
を生じることがあり、信頼性の低下を招き易い。よっ
て、強磁性体膜52は、応力を緩和する観点から膜厚５μ
ｍ以下とするのが望ましい。It should be noted that iron and iron, which are typical ferromagnetic materials 52,
Chromium alloy is less ductile than gold used in the conventional example, and is likely to cause fine cracks during pressure connection, and in the worst case, it may be separated from the resin ball 51. For this reason, electrical connection failure may occur during pressure connection or during operation of the liquid crystal display, and the reliability is likely to deteriorate. Therefore, the ferromagnetic film 52 has a film thickness of 5 μ from the viewpoint of relaxing the stress.
It is desirable that the thickness is m or less.
【００７２】また、代表的な強磁性体である鉄や鉄−ク
ロムの合金は、大気中などの酸化性雰囲気において酸素
と反応しやすい。よって、この強磁性体膜52の上層に金
などの貴金属材料を被覆することによってこの酸化を防
止してもよく、電気的接続の信頼性をより向上すること
が可能になる。Further, iron and iron-chromium alloys, which are typical ferromagnetic materials, easily react with oxygen in an oxidizing atmosphere such as the air. Therefore, the oxidation may be prevented by coating the upper layer of the ferromagnetic film 52 with a noble metal material such as gold, and the reliability of electrical connection can be further improved.
【００７３】実施例１１．図１４は請求項７および８記
載の発明にかかる回路基板の接続構造の要部である導電
粒子の一実施例を示す断面図であり、この例では、高分
子材料からなり中空部53を有する球すなわち樹脂球51の
表面に鉄、コバルト、ニッケル、クロムまたはそれらの
合金からなる強磁性体52が被覆されている。従来の接続
構造の問題点として、樹脂球51の高さに分布があるため
加圧接続時に電気的接続に寄与しない樹脂球51が多く発
生していた。このため、接続不良の抑制には上記実施例
９、１０で述べたように電極２上の導電粒子５の密度を
増加させるだけでは限界がある。そこで、この実施例１
１で開示した樹脂球51はの中空部53を有するため、加圧
接続時に圧縮変形する。よって、樹脂球51の高さの分布
を吸収して両電極に確実に接触できる。液晶ディスプレ
イにおける接続点数は数１００カ所から場合によっては
数１０００を越える。１カ所の接続不良は液晶ディスプ
レイそのものを不良とするから、接続不良の発生頻度は
可能な限り減少させねばならない。Example 11. FIG. 14 is a cross-sectional view showing an embodiment of the conductive particles which is the main part of the circuit board connection structure according to the invention of claims 7 and 8, and in this example, it is made of a polymer material and has a hollow portion 53. The surface of the sphere, that is, the resin sphere 51 is coated with a ferromagnetic material 52 made of iron, cobalt, nickel, chromium or an alloy thereof. As a problem of the conventional connection structure, there are many resin balls 51 that do not contribute to electrical connection during pressure connection because the resin balls 51 have a distribution in height. Therefore, there is a limit to the suppression of the connection failure only by increasing the density of the conductive particles 5 on the electrode 2 as described in the ninth and tenth embodiments. Therefore, this embodiment 1
Since the resin sphere 51 disclosed in 1 has the hollow portion 53, it is compressed and deformed at the time of pressure connection. Therefore, the height distribution of the resin balls 51 can be absorbed to surely make contact with both electrodes. The number of connection points in a liquid crystal display is from several hundreds to over several thousands in some cases. Since the connection failure at one place makes the liquid crystal display itself defective, the frequency of occurrence of connection failure should be reduced as much as possible.
【００７４】実施例１２．図１５は請求項７および８記
載の発明にかかる回路基板の接続構造の要部である導電
粒子の他の実施例を示す断面図である。上記実施例１１
では中空構造53を有する樹脂球51について述べている
が、中空構造に限らず、樹脂球51の高さの分布を吸収で
きるものであれば適用が可能であり、例えば、樹脂球51
の径よりも小さい微細な気泡54を有する構造であっても
よい。なお、この気泡からなる中空部54は樹脂球51に埋
設している必要はなく、その１部が図１５に示すように
樹脂球表面に露出していてもよい。この場合には新たな
効果として、強磁性体からなる皮膜52と樹脂球51との密
着強度が向上し、先に述べた強磁性体皮膜52の剥離を防
止することができる。さらに、この露出した気泡による
凹凸が磁性体皮膜52に発生する応力を緩和するから、強
磁性体皮膜52の亀裂を防止することができる。さらに、
これらの効果だけでななく、微細な凹凸により電極との
接触面積が増加するから接続不良を低減することができ
る。これらの効果は強磁性体皮膜52に限らず、その上層
に貴金属皮膜を被覆形成した場合この貴金属皮膜にも及
ぶことは明白である。Example 12 FIG. 15 is a cross-sectional view showing another embodiment of the conductive particles, which is a main part of the circuit board connection structure according to the seventh and eighth aspects of the invention. Example 11 above
In the above, the resin sphere 51 having the hollow structure 53 is described. However, the resin sphere 51 is not limited to the hollow structure and may be applied as long as the height distribution of the resin sphere 51 can be absorbed.
It may be a structure having fine bubbles 54 smaller than the diameter of. The hollow portion 54 made of bubbles need not be embedded in the resin ball 51, and a part thereof may be exposed on the surface of the resin ball as shown in FIG. In this case, as a new effect, the adhesion strength between the coating 52 made of a ferromagnetic material and the resin ball 51 is improved, and the above-described peeling of the ferromagnetic coating 52 can be prevented. Furthermore, since the unevenness caused by the exposed bubbles relieves the stress generated in the magnetic film 52, cracking of the ferromagnetic film 52 can be prevented. further,
Not only these effects, but also the contact area with the electrode is increased due to the fine irregularities, so that connection failure can be reduced. It is obvious that these effects are not limited to the ferromagnetic film 52, but also extend to the noble metal film when the noble metal film is formed on the upper layer thereof.
【００７５】実施例１３．なお、上記実施例１１、１２
は共に請求項７記載の発明と請求項８記載の発明とを組
み合わせたものであるが、請求項８記載の発明単独でも
適用可能である。すなわち、図１４および１５に示した
導電粒子おいて、強磁性体皮膜52の代わりに従来例と同
様に金等の導電材料が被覆されていてもよく、この場合
にも樹脂球51はの中空部53を有するため、加圧接続時に
圧縮変形する。よって、樹脂球51の高さの分布を吸収し
て両電極に確実に接触できる。Example 13 In addition, the above-mentioned Examples 11 and 12
Both are a combination of the invention described in claim 7 and the invention described in claim 8, but the invention described in claim 8 is also applicable. That is, in the conductive particles shown in FIGS. 14 and 15, instead of the ferromagnetic film 52, a conductive material such as gold may be coated as in the conventional example, and in this case also, the resin sphere 51 is hollow. Since it has the portion 53, it is compressed and deformed at the time of pressure connection. Therefore, the height distribution of the resin balls 51 can be absorbed to surely make contact with both electrodes.
【００７６】実施例１４．つぎに、請求項９記載の発明
にかかる回路基板の接続構造の実施例を図１６を参照し
ながら説明する。図１６において、接続電極端子２、７
には例えば鉄、コバルト、ニッケルまたはそれらの合金
などの強磁性体が用いられている。その表面には腐食防
止のためのコーティングが施されてもよい。また導電粒
子５には、例えばバリウムフェライト、サマリウム−コ
バルト合金や鉄−ニッケル−ボロン合金などの永久磁石
が用いられていることに特徴がある。Example 14 Next, an embodiment of a circuit board connection structure according to the invention of claim 9 will be described with reference to FIG. In FIG. 16, the connection electrode terminals 2, 7
For example, a ferromagnetic material such as iron, cobalt, nickel, or an alloy thereof is used. The surface may be provided with a coating for preventing corrosion. The conductive particles 5 are characterized by using, for example, a permanent magnet such as barium ferrite, samarium-cobalt alloy or iron-nickel-boron alloy.
【００７７】本実施例１４においては、導電粒子５に永
久磁石、液晶表示パネル１の接続電極端子２および液晶
駆動用ＩＣ６の電極端子７に強磁性体が用いられている
ことにより、液晶駆動用ＩＣ６を液晶表示パネル１上に
フェースダウンで搭載する際、相互に磁気的な引力が働
き、位置あわせが容易になる。また、この磁気的作用に
より接続電極端子２、電極端子７および導電粒子５の相
互の接続不良が低減できるという効果がある。In the fourteenth embodiment, the permanent magnets are used for the conductive particles 5, and the ferromagnetic material is used for the connection electrode terminals 2 of the liquid crystal display panel 1 and the electrode terminals 7 of the liquid crystal driving IC 6. When the IC 6 is mounted face down on the liquid crystal display panel 1, mutual magnetic attraction works and alignment becomes easy. In addition, this magnetic effect has an effect of reducing connection failure between the connection electrode terminal 2, the electrode terminal 7 and the conductive particles 5.
【００７８】実施例１５．つぎに請求項１０記載の発明
にかかる回路基板の接続構造の実施例を図１７を参照し
ながら説明する。図１７に示されるように、液晶駆動用
ＩＣ６を液晶表示パネル１上にフェースダウンで搭載
し、導電粒子５を介して接続電極端子２および電極端子
７間で接続する際、液晶駆動用ＩＣ６の電極端子７が形
成された面上の電極端子７を除く周縁部に永久磁石から
なる圧着部材41が配され、液晶表示パネル１上の圧着部
材41に対応する位置の磁性体パターン42が強磁性体材料
によって形成されている。この場合、液晶表示パネル１
側が永久磁石、液晶駆動用ＩＣ６側が強磁性体とされて
もよく、または両方が永久磁石とされていてもよい。Example 15. Next, an embodiment of the circuit board connection structure according to the tenth aspect of the present invention will be described with reference to FIG. As shown in FIG. 17, when the liquid crystal driving IC 6 is mounted face down on the liquid crystal display panel 1 and the connection electrode terminals 2 and the electrode terminals 7 are connected via the conductive particles 5, the liquid crystal driving IC 6 is A crimping member 41 made of a permanent magnet is arranged on the peripheral portion of the surface on which the electrode terminals 7 are formed excluding the electrode terminals 7, and the magnetic material pattern 42 at a position corresponding to the crimping member 41 on the liquid crystal display panel 1 is ferromagnetic. It is made of body material. In this case, the liquid crystal display panel 1
The side may be a permanent magnet and the liquid crystal driving IC 6 side may be a ferromagnetic body, or both may be permanent magnets.
【００７９】本実施例１５において、液晶駆動用ＩＣ６
の電極端子７が形成された面上の周縁部に永久磁石から
なる圧着部材41が配され、液晶表示パネル１上の圧着部
材41に対応する位置に強磁性体材料で磁性体パターン42
が形成されていることにより、液晶駆動用ＩＣ６を液晶
表示パネル１上にフェースダウンで搭載する際、相互に
磁気的な吸引力が働き、この磁気的作用により接続電極
端子２、電極端子７および導電粒子５の相互の接続不良
が低減できるという効果がある。また本実施例では、導
電粒子５や電極端子２、７に永久磁石を用いないので、
強磁性体自身の自発磁界による電磁ノイズが発生するこ
とはない。In the fifteenth embodiment, the liquid crystal driving IC6
A crimping member 41 made of a permanent magnet is arranged on the peripheral portion on the surface on which the electrode terminal 7 is formed, and a magnetic material pattern 42 made of a ferromagnetic material is provided at a position corresponding to the crimping member 41 on the liquid crystal display panel 1.
Since the liquid crystal driving IC 6 is mounted face down on the liquid crystal display panel 1, magnetic attraction forces are exerted on each other by this formation, and this magnetic action causes the connection electrode terminal 2, the electrode terminal 7, and There is an effect that defective connection between the conductive particles 5 can be reduced. Further, in this embodiment, since no permanent magnet is used for the conductive particles 5 and the electrode terminals 2 and 7,
No electromagnetic noise is generated by the spontaneous magnetic field of the ferromagnetic material itself.
【００８０】実施例１６．図１８に請求項１１記載の発
明にかかる回路基板の接続構造の実施例を示す。図１８
に示されるように液晶駆動用ＩＣ６を液晶表示パネル１
上にフェースダウンで搭載し導電粒子５を介して接続電
極端子２と電極端子７とを接続する際、液晶駆動用ＩＣ
６の電極端子７が形成された面上の電極端子７を除く周
縁部に強磁性体からなる圧着部材43ｂが設けられ、液晶
表示パネル１のＩＣ実装位置の裏面に前記強磁性体に対
向させる形態で永久磁石からなる圧着部材43ａが設けら
れている。Example 16 FIG. 18 shows an embodiment of a circuit board connection structure according to the invention of claim 11. FIG.
As shown in FIG.
A liquid crystal driving IC when the connection electrode terminal 2 and the electrode terminal 7 are mounted face down on top of each other through the conductive particles 5.
A pressure-bonding member 43b made of a ferromagnetic material is provided on the peripheral portion of the surface of the liquid crystal display panel 1 on which the electrode terminals 7 are formed, excluding the electrode terminals 7, and is opposed to the ferromagnetic material on the back surface of the liquid crystal display panel 1 at the IC mounting position. A crimping member 43a made of a permanent magnet is provided.
【００８１】本実施例１６においては、液晶駆動用ＩＣ
６の電極端子７の形成された面の周縁部に強磁性体が設
けられ、液晶表示パネル１のＩＣ６の実装位置の裏面に
永久磁石が設けられていることにより、液晶駆動用ＩＣ
６を液晶表示パネル１上にフェースダウンで搭載する
際、相互に磁気的な吸引力が働き、この吸引力により接
続電極端子２、電極端子７および導電粒子５の相互の接
続不良を低減することができるという効果がある。In the sixteenth embodiment, a liquid crystal driving IC
6, a ferromagnetic material is provided on the peripheral portion of the surface of the liquid crystal display panel 1 on which the electrode terminals 7 are formed, and a permanent magnet is provided on the back surface of the liquid crystal display panel 1 where the IC 6 is mounted.
When 6 is mounted face down on the liquid crystal display panel 1, magnetic attraction forces are exerted on each other, and this attraction force reduces defective connection between the connection electrode terminal 2, the electrode terminal 7 and the conductive particles 5. There is an effect that can be.
【００８２】実施例１７．図１９は請求項１２記載の発
明にかかる回路基板の接続構造の一実施例を示す断面図
である。図において、18は液晶駆動用ＩＣ６を覆う気密
性の高い膜（シート）すなわち気密性シート、19は液晶
表示パネル１に設けられた排気孔、20は排気孔19を埋め
る樹脂栓である。Example 17 FIG. 19 is a sectional view showing an embodiment of the circuit board connection structure according to the twelfth aspect of the invention. In the figure, 18 is a film (sheet) having high airtightness that covers the liquid crystal driving IC 6, that is, an airtight sheet, 19 is an exhaust hole provided in the liquid crystal display panel 1, and 20 is a resin plug filling the exhaust hole 19.
【００８３】次に接続方法について説明する。液晶表示
パネル１に形成してある接続電極端子２上に選択的に導
電粒子５を搭載した後、駆動用ＩＣ６を電極７と電極２
が重なるように所定の位置合わせする。そして、駆動用
ＩＣ６を気密性シート18で覆い、液晶表示パネル１に固
定する。この場合、気密性シート18としては例えば耐久
性の高いポリイミドのシート等が用いられる。さらに、
液晶表示パネル１にＣＯ2レーザ等により設けた排気孔1
9より排気し、その後樹脂栓20で孔を埋めると両基板間
が負圧状態となる。これより駆動用ＩＣ６が大気圧によ
り加圧される状態となるので電極２と７が導電粒子５を
介して電気的に接続されることになる。なお、両基板を
分離するには、例えば気密性シート18の一部に貫通孔を
設ける。Next, the connection method will be described. After the conductive particles 5 are selectively mounted on the connection electrode terminals 2 formed on the liquid crystal display panel 1, the driving IC 6 is connected to the electrodes 7 and the electrodes 2.
Position them so that they overlap. Then, the driving IC 6 is covered with the airtight sheet 18 and fixed to the liquid crystal display panel 1. In this case, as the airtight sheet 18, for example, a highly durable polyimide sheet or the like is used. further,
Exhaust hole 1 provided in the liquid crystal display panel 1 by a CO 2 laser or the like
Evacuating from 9 and then filling the hole with the resin stopper 20 creates a negative pressure between both substrates. As a result, the driving IC 6 is pressurized by the atmospheric pressure, so that the electrodes 2 and 7 are electrically connected via the conductive particles 5. In order to separate the two substrates, a through hole is provided in a part of the airtight sheet 18, for example.
【００８４】なお、上記実施例１７では排気孔19より排
気したが、排気孔19は無くてもよく、この場合は気密性
シート18と液晶表示パネル１との隙間に排気用のパイプ
等を挿入し、排気後このパイプを引き抜いてもよい。In the seventeenth embodiment, the gas is exhausted from the exhaust hole 19, but the exhaust hole 19 may be omitted. In this case, an exhaust pipe or the like is inserted in the gap between the airtight sheet 18 and the liquid crystal display panel 1. However, you may pull out this pipe after exhausting.
【００８５】実施例１８．図２０は請求項１３記載の発
明にかかる回路基板の接続構造の一実施例を示す断面図
である。図において、21は液晶駆動用ＩＣ６と液晶表示
パネル１間に介在し、両者間の気密を保持する樹脂枠で
ある。Example 18. FIG. 20 is a sectional view showing an embodiment of the circuit board connection structure according to the thirteenth aspect of the present invention. In the figure, reference numeral 21 denotes a resin frame which is interposed between the liquid crystal driving IC 6 and the liquid crystal display panel 1 to maintain airtightness between them.
【００８６】接続方法は、まず、液晶表示パネル１に形
成してある接続電極端子２上に選択的に導電粒子５を搭
載する。駆動用ＩＣ６にはＩＣ周辺に樹脂枠21を形成す
る。そして、駆動用ＩＣ６を電極７と電極２が重なるよ
うに所定の位置合わせする。この場合、樹脂枠21には例
えば液晶表示パネル１のシール材に用いられているポリ
イミド樹脂等を用いるとよい。次に、液晶表示パネル１
に設けた排気孔19より排気し、その後樹脂栓20で排気孔
19を埋めると両基板間が負圧状態となる。これより駆動
用ＩＣ６が大気圧により加圧される状態となるので電極
２と７が導電粒子５を介して電気的に接続されることに
なる。なお、両基板を分離するには、例えば加熱により
樹脂枠21の一部を溶かして貫通孔を設ける。なお、樹脂
枠21に紫外線硬化型樹脂を用いて液晶駆動用ＩＣ６と液
晶表示パネル１とを接着すれば、接続の信頼性が一層向
上する。In the connection method, first, the conductive particles 5 are selectively mounted on the connection electrode terminals 2 formed on the liquid crystal display panel 1. A resin frame 21 is formed around the IC of the driving IC 6. Then, the driving IC 6 is aligned in a predetermined manner so that the electrode 7 and the electrode 2 overlap each other. In this case, for the resin frame 21, it is preferable to use, for example, a polyimide resin used as a sealing material of the liquid crystal display panel 1. Next, the liquid crystal display panel 1
Exhaust from the exhaust hole 19 provided in the
When 19 is filled, a negative pressure state is created between both substrates. As a result, the driving IC 6 is pressurized by the atmospheric pressure, so that the electrodes 2 and 7 are electrically connected via the conductive particles 5. In order to separate the two substrates, a through hole is provided by melting a part of the resin frame 21 by heating, for example. If the liquid crystal driving IC 6 and the liquid crystal display panel 1 are bonded to the resin frame 21 by using an ultraviolet curable resin, the reliability of connection is further improved.
【００８７】実施例１９．図２１は請求項１３記載の発
明にかかる回路基板の接続構造の他の実施例を示す断面
図である。この例では、排気孔19が液晶駆動用ＩＣ６に
設けられている点を除けば、他の構成および接続方法は
図２０で示した実施例１８の場合と同様である。Example 19 21 is a sectional view showing another embodiment of the circuit board connection structure according to the thirteenth aspect of the present invention. In this example, except that the exhaust hole 19 is provided in the liquid crystal driving IC 6, the other configuration and connection method are the same as in the case of the eighteenth embodiment shown in FIG.
【００８８】なお、図２０、２１において、樹脂枠21に
排気孔19を設けてもよい。20 and 21, an exhaust hole 19 may be provided in the resin frame 21.
【００８９】このように、請求項１２、１３の発明によ
れば、従回路基板と主回路基板間を負圧（真空）状態に
することにより電気的接続を行うので、負圧状態を解放
すれば容易に両回路基板を分離できる。これより両基板
を接続した後に不良が発生しても容易に不良従回路基板
を交換できるので従回路基板の修復が容易になる。ま
た、従来は加熱して不良の従回路基板を取り外していた
が、本発明ではほんの一部を加熱するあるいは熱などは
必要としないので修復による液晶表示パネルの信頼性低
下を防止できる。As described above, according to the twelfth and thirteenth aspects of the present invention, the negative pressure (vacuum) state is maintained between the sub circuit board and the main circuit board, so that the negative pressure state is released. If so, both circuit boards can be easily separated. As a result, even if a defect occurs after connecting the two substrates, the defective slave circuit substrate can be easily replaced, so that the slave circuit substrate can be easily repaired. Further, conventionally, the defective sub-circuit board is removed by heating, but in the present invention, since only a part of the sub-circuit board is heated or heat is not required, it is possible to prevent deterioration of reliability of the liquid crystal display panel due to repair.
【００９０】なお、前記各実施例においては、第１回路
基板である液晶表示パネル１に半導体部品である液晶駆
動用ＩＣ６を接続する場合について説明したが、ＩＣチ
ップなどの電子部品を搭載したガラス基板やフィルムキ
ャリア基板などの第２回路基板の各電極端子を接続する
場合にも適用でき、半導体部品など電子部品の電極端子
と第２回路基板の接続電極端子とを接続することもでき
る。In each of the embodiments described above, the case where the liquid crystal display IC 1 which is a semiconductor component is connected to the liquid crystal display panel 1 which is the first circuit board has been described. However, a glass on which an electronic component such as an IC chip is mounted is described. It can also be applied to the case where each electrode terminal of a second circuit board such as a board or a film carrier board is connected, and the electrode terminal of an electronic part such as a semiconductor part and the connection electrode terminal of the second circuit board can also be connected.
【００９１】なお、前記各実施例においては、液晶表示
装置の場合について説明したが、密着イメージセンサま
たはサーマルヘッドなどに半導体部品や第２回路基板を
接続する場合においても、適用できることはいうまでも
ない。In each of the above embodiments, the case of the liquid crystal display device has been described, but it is needless to say that the present invention can be applied to the case where a semiconductor component or a second circuit board is connected to a contact image sensor or a thermal head. Absent.
【００９２】実施例２０．図２２（ａ）は請求項１４記
載の発明の回路基板の接続方法の一実施例を説明する断
面構成図で、（ｂ）は液晶表示パネル１の平面説明図で
ある。図２２において、１ａは液晶表示パネル１のソー
ス用端子、１ｂはコモン用端子、12は液晶表示パネル１
を現像する現像液槽、13は液晶表示パネル１に現像液を
吹きつけるノズルである。Example 20. 22A is a cross-sectional configuration diagram for explaining an embodiment of the circuit board connecting method according to the fourteenth aspect of the present invention, and FIG. 22B is a plan explanatory diagram of the liquid crystal display panel 1. In FIG. 22, 1a is a source terminal of the liquid crystal display panel 1, 1b is a common terminal, and 12 is a liquid crystal display panel 1.
And a nozzle 13 for spraying the developing solution onto the liquid crystal display panel 1.
【００９３】図２２に示されるように、液晶表示パネル
１を現像液槽12で現像する際に、現像液をノズル13から
の吹き出し圧力により液晶表示パネル１の実装部に吹き
つける。この吹きつけ圧力によって、液晶表示パネル１
に塗布されたポジ型感光性樹脂は効率的に、かつ、完全
に除去される。これに伴い、配線パターン部以外の導電
粒子も除去されるので、導電粒子が残存し接続電極端子
２間で短絡が発生することはなく、接続の信頼性が向上
する。さらに、ポジ型の感光性樹脂を効率的に除去でき
るため、生産性が向上する。As shown in FIG. 22, when the liquid crystal display panel 1 is developed in the developing solution tank 12, the developing solution is sprayed onto the mounting portion of the liquid crystal display panel 1 by the blowing pressure from the nozzle 13. Due to this blowing pressure, the liquid crystal display panel 1
The positive type photosensitive resin applied to is efficiently and completely removed. Along with this, since the conductive particles other than the wiring pattern portion are also removed, the conductive particles do not remain and a short circuit does not occur between the connection electrode terminals 2, and the connection reliability is improved. Further, the positive photosensitive resin can be removed efficiently, so that the productivity is improved.
【００９４】また、液晶表示パネル１を現像液槽12で現
像する際に、気泡をノズル13から液晶表示パネル１の実
装部に吹きつけてもよい。これによっても、液晶表示パ
ネル１に塗布されたポジ型感光性樹脂は効率的かつ完全
に除去される。Further, when developing the liquid crystal display panel 1 in the developer tank 12, bubbles may be blown from the nozzles 13 to the mounting portion of the liquid crystal display panel 1. Also by this, the positive photosensitive resin applied to the liquid crystal display panel 1 is efficiently and completely removed.
【００９５】なお、図２２（ａ）に断面図で示されるよ
うに、液晶表示パネル１の形状に合わせてロ字状のノズ
ル13を用いることによって、ソース用端子１ａとコモン
用端子１ｂに同時に現像液を吹きつければ一層生産性が
向上するが、ノズルの形状はこれに限られるものではな
く、ソース用端子１ａおよびコモン用端子１ｂにそれぞ
れ対向して配置されたそれぞれ２本ずつの棒状のノズル
によって両端子１ａ、１ｂに同時に現像液を吹きつけて
もよい。As shown in the sectional view of FIG. 22 (a), by using a square-shaped nozzle 13 according to the shape of the liquid crystal display panel 1, the source terminal 1a and the common terminal 1b are simultaneously formed. The productivity is further improved by spraying the developing solution, but the shape of the nozzle is not limited to this, and two nozzles each having a rod shape are provided so as to face the source terminal 1a and the common terminal 1b. The developing solution may be simultaneously sprayed onto both terminals 1a and 1b by a nozzle.
【００９６】実施例２１．図２３は請求項１５記載の発
明の回路基板の接続方法の一実施例を示す。図２３にお
いて、14は液晶表示パネル１にエアーを吹きつけるエア
ーノズルである。図２３に示されるように、液晶表示パ
ネル１を現像後、現像液槽12から引き上げる際に、液晶
表示パネル１の表面にエアーノズル14よりエアーを吹き
つける。これによって、接続電極端子間に残存している
導電粒子がエアーの風圧によって吹き飛ばされ、接続電
極端子間の導電粒子は容易に、かつ、完全に除去され、
ショート不良が生じることはない。さらに、エアーとし
てイオン化空気を吹きつけることによって、液晶表示パ
ネル１の静電破壊を防止することができ、信頼性、生産
性がより一層向上する。Example 21. 23 shows an embodiment of the circuit board connecting method according to the fifteenth aspect of the present invention. In FIG. 23, 14 is an air nozzle for blowing air to the liquid crystal display panel 1. As shown in FIG. 23, when the liquid crystal display panel 1 is developed and then pulled up from the developer tank 12, air is blown from the air nozzle 14 onto the surface of the liquid crystal display panel 1. Thereby, the conductive particles remaining between the connection electrode terminals are blown away by the wind pressure of the air, the conductive particles between the connection electrode terminals are easily and completely removed,
No short circuit failure will occur. Furthermore, by spraying ionized air as the air, electrostatic breakdown of the liquid crystal display panel 1 can be prevented, and reliability and productivity are further improved.
【００９７】また、液晶表示パネル１に現像液または気
泡を吹きつける工程とエアーを吹きつけながら液晶表示
パネル１を現像液槽12から引き上げる工程の両方を行う
ことにより、一層効果があることはいうまでもない。Further, it is said that it is more effective to carry out both the step of spraying the developing solution or bubbles to the liquid crystal display panel 1 and the step of pulling up the liquid crystal display panel 1 from the developing solution tank 12 while blowing air. There is no end.
【００９８】[0098]
【発明の効果】以上のように、請求項１記載の発明によ
れば、回路基板の配線パターンのうち導電粒子を搭載し
ない部分が透明電極端子によって形成されているので、
露光によって透明電極端子上のポジ型感光性樹脂には透
明電極端子を透して紫外線が当たり、現像の際に感光性
樹脂とともに導電粒子も除去される。そのため、導電粒
子が電子部品や第２回路基板の表面を加圧してこれらを
破壊することはなく、高信頼性および高歩留りを達成す
ることができる。As described above, according to the first aspect of the invention, the portion of the wiring pattern of the circuit board on which the conductive particles are not mounted is formed by the transparent electrode terminal.
Upon exposure, the positive photosensitive resin on the transparent electrode terminal is exposed to ultraviolet rays through the transparent electrode terminal, and the conductive particles are removed together with the photosensitive resin during development. Therefore, the conductive particles do not pressurize the surface of the electronic component or the second circuit board to destroy them, and high reliability and high yield can be achieved.
【００９９】また、請求項２記載の発明によれば接続電
極端子の一部が透明電極端子で形成されることにより、
紫外線照射によって接続電極端子上の紫外線硬化樹脂に
も透明電極端子を透して、さらに透明電極端子からの回
り込みによって紫外線が当たり、完全に硬化される。そ
のため、未硬化の紫外線硬化樹脂が導電粒子の表面を覆
いオープン不良が生じることはなく、信頼性が大幅に向
上する。According to the second aspect of the present invention, part of the connection electrode terminal is formed of the transparent electrode terminal,
The transparent electrode terminal is also transmitted through the ultraviolet curable resin on the connection electrode terminal by the irradiation of the ultraviolet ray, and further the ultraviolet ray hits the transparent electrode terminal to circulate and the ultraviolet ray is completely cured. Therefore, the uncured ultraviolet curable resin does not cover the surface of the conductive particles to cause an open defect, and the reliability is significantly improved.
【０１００】また、請求項３記載の発明によれば、電極
端子の周囲に設けられたパッシベーション膜の枠内の一
部にもパッシベーション膜が形成されているので、導電
粒子が、この内部のパッシベーション膜と接続電極端子
との段差に引っ掛かって、電極端子の中央部にも搭載さ
れる。その結果、第１回路基板と半導体部品などの電子
部品や第２回路基板間でオープン不良が発生せず、か
つ、導電抵抗も低減でき、接続の信頼性を向上させるこ
とができる。Further, according to the third aspect of the invention, since the passivation film is also formed in a part of the frame of the passivation film provided around the electrode terminal, the conductive particles pass the passivation film inside the passivation film. It is also mounted on the central portion of the electrode terminal by catching on the step between the film and the connecting electrode terminal. As a result, an open defect does not occur between the first circuit board and an electronic component such as a semiconductor component or the second circuit board, and the conductive resistance can be reduced, so that the connection reliability can be improved.
【０１０１】また、請求項４記載の発明によれば、電子
部品が液晶表示パネルなど第１回路基板にはんだによっ
て固定されているため、熱膨張でオープン不良が発生す
ることはなく、信頼性が向上する。さらに、レーザ光に
よる局部加熱によって、不良ＩＣを容易に取り外すこと
ができ、生産性および歩留りが向上する。According to the invention described in claim 4, since the electronic component is fixed to the first circuit board such as the liquid crystal display panel by solder, the open failure does not occur due to the thermal expansion and the reliability is improved. improves. Further, the defective IC can be easily removed by the local heating by the laser beam, and the productivity and the yield are improved.
【０１０２】また、請求項５記載の発明によれば、はん
だボールを含む導電粒子によって第１回路基板の接続電
極端子と電子部品または第２回路基板の電極端子とが接
続されているため、オープン不良端子が発生した場合、
液晶表示パネルの背面より不良端子部をレーザ光で局部
加熱してはんだボールを溶融させ、接続電極端子と電子
部品などの電極端子とを電気的に接続することができ
る。そのため、オープン不良を容易に、かつ、確実に修
復することができ、また不良ＩＣが発生しても容易に修
復することができる。その結果、生産性および歩留りが
向上する。According to the fifth aspect of the invention, since the connecting electrode terminal of the first circuit board and the electrode terminal of the electronic component or the second circuit board are connected by the conductive particles containing the solder balls, the open state is achieved. If a bad terminal occurs,
It is possible to locally heat the defective terminal portion from the back surface of the liquid crystal display panel with laser light to melt the solder ball and electrically connect the connection electrode terminal and the electrode terminal such as an electronic component. Therefore, the open defect can be easily and reliably repaired, and even if a defective IC occurs, it can be easily repaired. As a result, productivity and yield are improved.
【０１０３】また、請求項６および７記載の発明によれ
ば、導電粒子の少なくとも一部が強磁性体で形成されて
いるので、接続時に外部磁力により導電粒子を電極上に
より多く集めることができ、使用する導電粒子の総数を
低減でき、さらに電極上の固着密度を増加できるから接
続不良を低減できる。According to the sixth and seventh aspects of the invention, since at least a part of the conductive particles is made of a ferromagnetic material, it is possible to collect more conductive particles on the electrode due to an external magnetic force at the time of connection. Since the total number of conductive particles used can be reduced and the adhesion density on the electrodes can be increased, connection defects can be reduced.
【０１０４】また、請求項８記載の発明によれば、導電
粒子が、高分子材料からなり中空部を有する球の表面に
導電材料が被覆されたものであるので、接続時に加圧に
よる球の変形が可能となり、両電極に確実に接触できる
ので、接続の信頼性が向上する。According to the invention of claim 8, the conductive particles are spheres made of a polymer material and having a hollow portion, and the surface of the sphere is coated with the conductive material. Deformation is possible and both electrodes can be surely contacted, so the reliability of connection is improved.
【０１０５】さらに、請求項９〜１１記載の発明によれ
ば、回路基板上に電子部品などを接続する際、回路基
板、電子部品、導電粒子の各々の一部に永久磁石または
永久磁石と強磁性体が設けられているため、相互間に働
く磁気的な吸引力を利用することにより、回路基板と電
子部品の電極端子間の電気的接続不良を低減できる回路
基板をうることができる。Further, according to the inventions of claims 9 to 11, when connecting an electronic component or the like on the circuit board, a permanent magnet or a permanent magnet and a strong magnet are added to a part of each of the circuit board, the electronic component, and the conductive particles. Since the magnetic body is provided, it is possible to obtain the circuit board that can reduce the electrical connection failure between the circuit board and the electrode terminal of the electronic component by utilizing the magnetic attraction force that acts between them.
【０１０６】また、請求項１２および１３記載の発明に
よれば、接続部近傍における電子部品または第２回路基
板と第１回路基板間を負圧状態に保持することにより電
気的接続を行うので、負圧状態を解放すれば容易に両者
を分離できる。これにより両者を接続した後に不良が発
生しても容易に不良回路基板または電子部品を交換でき
る。また、従来は加熱して不良の回路基板または電子部
品を取り外していたが、本発明では必ずしも熱などは必
要としないので修復による第１回路基板の信頼性低下を
防止できる。According to the twelfth and thirteenth aspects of the present invention, since electrical connection is made by maintaining a negative pressure between the electronic component or the second circuit board and the first circuit board in the vicinity of the connection portion, The two can be easily separated by releasing the negative pressure state. This makes it possible to easily replace the defective circuit board or electronic component even if a defect occurs after connecting the two. Further, in the past, the defective circuit board or electronic component was removed by heating, but in the present invention, heat or the like is not always required, so that it is possible to prevent the reliability of the first circuit board from being lowered due to the repair.
【０１０７】また、請求項１４記載の発明によれば、現
像液槽に浸漬した第１回路基板に前記現像液または気泡
を吹きつけながら現像するので、吹きつけ圧力で配線パ
ターン部以外の感光性樹脂を効率的、かつ、確実に除去
することができ、例えば第１回路基板の接続電極端子相
互間で導電粒子によって短絡が生じることはなく、信頼
性および生産性が向上する。According to the fourteenth aspect of the present invention, since the developing solution or bubbles are developed while being sprayed onto the first circuit board immersed in the developing solution tank, the photosensitive material other than the wiring pattern portion can be exposed by the spraying pressure. The resin can be removed efficiently and surely, and for example, the conductive particles do not cause a short circuit between the connection electrode terminals of the first circuit board, and the reliability and productivity are improved.
【０１０８】また、請求項１５記載の発明によれば、第
１回路基板にエアーを吹きつけながら第１回路基板を現
像液槽から引き上げるので、接続電極端子間に残存する
導電粒子がエアーによって吹き飛ばされ、接続電極端子
間の導電粒子は効率的、かつ、確実に除去される。その
結果、例えば第１回路基板の接続電極端子間で導電粒子
によって短絡が生じることはなく、信頼性および生産性
が向上する。According to the invention as set forth in claim 15, since the first circuit board is pulled up from the developer tank while blowing air on the first circuit board, the conductive particles remaining between the connection electrode terminals are blown off by the air. Therefore, the conductive particles between the connection electrode terminals are efficiently and surely removed. As a result, for example, the conductive particles do not cause a short circuit between the connection electrode terminals of the first circuit board, and reliability and productivity are improved.
【図１】請求項１記載の発明にかかる回路基板の接続構
造の一実施例を示す断面説明図である。FIG. 1 is a cross-sectional explanatory view showing an embodiment of a circuit board connection structure according to the invention of claim 1;
【図２】請求項１記載の発明にかかる回路基板の接続構
造の他の実施例を示す断面説明図である。FIG. 2 is a cross-sectional explanatory view showing another embodiment of the circuit board connection structure according to the invention of claim 1;
【図３】請求項２記載の発明にかかる回路基板の接続構
造の一実施例を示す断面説明図である。FIG. 3 is a cross-sectional explanatory view showing an embodiment of a circuit board connection structure according to the invention of claim 2;
【図４】請求項２記載の発明にかかる回路基板の接続構
造の他の実施例を示す断面説明図である。FIG. 4 is a sectional explanatory view showing another embodiment of the circuit board connection structure according to the invention of claim 2;
【図５】請求項３記載の発明にかかる回路基板の接続構
造の一実施例を示す要部の斜視説明図である。FIG. 5 is a perspective view of the essential parts showing an embodiment of the circuit board connection structure according to the invention of claim 3;
【図６】請求項３記載の発明にかかる回路基板の接続構
造の他の実施例を示す要部の斜視説明図である。FIG. 6 is a perspective view of the essential parts showing another embodiment of the circuit board connection structure according to the invention of claim 3;
【図７】請求項３記載の発明にかかる回路基板の接続構
造のさらに他の実施例を示す要部の斜視説明図である。FIG. 7 is a perspective explanatory view of a main part showing still another embodiment of the circuit board connection structure according to the invention of claim 3;
【図８】請求項３記載の発明にかかる回路基板の接続構
造のさらに他の実施例を示す要部の斜視説明図である。FIG. 8 is a perspective explanatory view of a main part showing still another embodiment of the circuit board connection structure according to the invention of claim 3;
【図９】請求項４記載の発明による回路基板の接続構造
の一実施例を示す断面説明図である。FIG. 9 is an explanatory sectional view showing an embodiment of a circuit board connection structure according to the invention of claim 4;
【図１０】請求項４記載の発明にかかる回路基板の接続
構造の他の実施例を示す断面説明図である。FIG. 10 is a sectional explanatory view showing another embodiment of the circuit board connection structure according to the invention of claim 4;
【図１１】請求項５記載の発明にかかる回路基板の接続
構造の一実施例の製造工程を示す断面説明図である。FIG. 11 is a sectional explanatory view showing a manufacturing process of the embodiment of the circuit board connection structure according to the invention of claim 5;
【図１２】請求項６記載の発明にかかる回路基板の接続
構造の一実施例の製造工程を示す斜視説明図である。FIG. 12 is a perspective explanatory view showing a manufacturing process of an embodiment of the circuit board connection structure according to the invention of claim 6;
【図１３】請求項７記載の発明にかかる回路基板の接続
構造の一実施例を示す断面説明図である。FIG. 13 is a sectional explanatory view showing an embodiment of a circuit board connection structure according to the invention of claim 7;
【図１４】請求項７および８記載の発明にかかる回路基
板の接続構造の要部である導電粒子の一実施例を示す断
面説明図である。FIG. 14 is a cross-sectional explanatory view showing an example of the conductive particles which is a main part of the connection structure of the circuit board according to the invention of claims 7 and 8.
【図１５】請求項７および８記載の発明にかかる回路基
板の接続構造の要部である導電粒子の他の実施例を示す
断面説明図である。FIG. 15 is a cross-sectional explanatory view showing another embodiment of the conductive particles, which is a main part of the circuit board connection structure according to the seventh and eighth aspects of the present invention.
【図１６】請求項９記載の発明にかかる回路基板の接続
構造の一実施例を示す断面説明図である。FIG. 16 is a cross-sectional explanatory view showing an embodiment of a circuit board connection structure according to the invention of claim 9;
【図１７】請求項１０記載の発明にかかる回路基板の接
続構造の一実施例を示す断面説明図である。FIG. 17 is a cross-sectional explanatory view showing an embodiment of a circuit board connection structure according to the invention of claim 10;
【図１８】請求項１１記載の発明にかかる回路基板の接
続構造の一実施例を示す断面説明図である。FIG. 18 is an explanatory sectional view showing an embodiment of the circuit board connection structure according to the invention of claim 11;
【図１９】請求項１２記載の発明にかかる回路基板の接
続構造の一実施例を示す断面説明図である。FIG. 19 is a sectional explanatory view showing an embodiment of a circuit board connection structure according to the invention of claim 12;
【図２０】請求項１３記載の発明にかかる回路基板の接
続構造の一実施例を示す断面説明図である。FIG. 20 is a sectional explanatory view showing an embodiment of a circuit board connection structure according to the invention of claim 13;
【図２１】請求項１３記載の発明にかかる回路基板の接
続構造の他の実施例を示す断面説明図である。FIG. 21 is a cross sectional view showing another embodiment of the circuit board connection structure according to the thirteenth invention.
【図２２】請求項１４記載の発明にかかる回路基板の接
続方法の一実施例を説明する断面構成図および平面説明
図である。22A and 22B are a sectional configuration diagram and a plan explanatory diagram illustrating an embodiment of a method of connecting circuit boards according to the invention of claim 14;
【図２３】請求項１５記載の発明にかかる回路基板の接
続方法の一実施例を示す断面説明図である。FIG. 23 is a sectional explanatory view showing an embodiment of a circuit board connecting method according to the invention of claim 15;
【図２４】従来の接続方法を工程順に示す製造工程図で
ある。FIG. 24 is a manufacturing process diagram showing a conventional connection method in process order.
【図２５】従来の接続方法を工程順に示す製造工程図で
ある。FIG. 25 is a manufacturing process diagram showing a conventional connection method in process order.
【図２６】従来の接続方法を工程順に示す製造工程図で
ある。FIG. 26 is a manufacturing process diagram showing a conventional connection method in process order.
【図２７】従来の接続方法を工程順に示す製造工程図で
ある。FIG. 27 is a manufacturing process diagram showing a conventional connection method in order of processes.
【図２８】従来の接続方法を工程順に示す製造工程図で
ある。FIG. 28 is a manufacturing process diagram showing the conventional connection method in order of processes.
【図２９】従来の接続方法を工程順に示す製造工程図で
ある。FIG. 29 is a manufacturing process diagram showing a conventional connection method in process order.
【図３０】従来の回路基板の一例を示す断面図である。FIG. 30 is a cross-sectional view showing an example of a conventional circuit board.
【図３１】従来の接続方法の問題点を説明する要部の斜
視図である。FIG. 31 is a perspective view of a main part for explaining a problem of the conventional connection method.
１ 液晶表示パネル ２ 接続電極端子 ３ 配線パターン ４ パッシベーション膜 ５ 導電粒子 ６ 液晶駆動用ＩＣ ７ 電極端子 ８ 感光性樹脂 ９ 露光装置 10 紫外線硬化樹脂 12 現像液槽 13 ノズル 14 エアーノズル 16 磁石 17 スピンコート台座 18 気密性シート 19 排気孔 20 樹脂栓 21 樹脂枠 31 はんだバンプ 37 はんだボール 41 圧着部材 42 磁性体パターン 43ａ 圧着部材 51 樹脂球 52 強磁性体 53 中空部 54 気泡 1 Liquid Crystal Display Panel 2 Connection Electrode Terminal 3 Wiring Pattern 4 Passivation Film 5 Conductive Particles 6 Liquid Crystal Driving IC 7 Electrode Terminal 8 Photosensitive Resin 9 Exposure Device 10 UV Curing Resin 12 Developer Tank 13 Nozzle 14 Air Nozzle 16 Magnet 17 Spin Coat Base 18 Airtight sheet 19 Exhaust hole 20 Resin stopper 21 Resin frame 31 Solder bump 37 Solder ball 41 Crimping member 42 Magnetic material pattern 43a Crimping member 51 Resin ball 52 Ferromagnetic material 53 Hollow part 54 Bubble
【手続補正書】[Procedure amendment]
【提出日】平成６年１月２１日[Submission date] January 21, 1994
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００５９[Correction target item name] 0059
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００５９】なお、ＩＣ固定用パッド32ははんだ付け可
能なメタライズで形成する必要があるが、ジェットプリ
ンティング法などによって、ＩＣ固定用パッド32に選択
的にＣｕなどの薄膜を形成することにより、コストを増
加させることなく設けられる。Although the IC fixing pad 32 needs to be formed by solderable metallization, the cost can be reduced by selectively forming a thin film of Cu or the like on the IC fixing pad 32 by a jet printing method or the like. It is provided without increasing.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００９２[Correction target item name] 0092
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００９２】実施例２０．図２２（ａ）は請求項１４記
載の発明の回路基板の接続方法の一実施例を説明する断
面構成図で、（ｂ）は液晶表示パネル１の平面説明図で
ある。図２２において、１ａは液晶表示パネル１のソー
ス用端子形成部、１ｂはコモン用端子形成部、12は液晶
表示パネル１を現像する現像液槽、13は液晶表示パネル
１に現像液を吹きつけるノズルである。Example 20. 22A is a cross-sectional configuration diagram for explaining an embodiment of the circuit board connecting method according to the fourteenth aspect of the present invention, and FIG. 22B is a plan explanatory diagram of the liquid crystal display panel 1. In FIG. 22, 1a is a source terminal forming portion of the liquid crystal display panel 1, 1b is a common terminal forming portion , 12 is a developing solution tank for developing the liquid crystal display panel 1, and 13 is a developing solution sprayed on the liquid crystal display panel 1. It is a nozzle.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００９５[Correction target item name] 0095
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００９５】なお、図２２（ａ）に断面図で示されるよ
うに、液晶表示パネル１の形状に合わせてロ字状のノズ
ル13を用いることによって、ソース用端子形成部１ａと
コモン用端子形成部１ｂに同時に現像液を吹きつければ
一層生産性が向上するが、ノズルの形状はこれに限られ
るものではなく、ソース用端子形成部１ａおよびコモン
用端子形成部１ｂにそれぞれ対向して配置されたそれぞ
れ２本ずつの棒状のノズルによって両端子１ａ、１ｂに
同時に現像液を吹きつけてもよい。As shown in the sectional view of FIG. 22A, by using a square-shaped nozzle 13 according to the shape of the liquid crystal display panel 1, the source terminal forming portion 1a and the common terminal forming portion 1a are formed. If the developing solution is sprayed onto the portion 1b at the same time, the productivity is further improved, but the shape of the nozzle is not limited to this, and the nozzle is arranged so as to face the source terminal forming portion 1a and the common terminal forming portion 1b, respectively. Alternatively, the developing solution may be simultaneously sprayed onto both terminals 1a and 1b by two rod-shaped nozzles.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図２２[Correction target item name] Fig. 22
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図２２】 FIG. 22
───────────────────────────────────────────────────── フロントページの続き (72)発明者 松川 文雄 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社材料デバイス研究所内 (72)発明者 嶋 睦宏 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社材料デバイス研究所内 (72)発明者 川戸 富雄 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社材料デバイス研究所内 (72)発明者 御福 英史 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社材料デバイス研究所内 (72)発明者 大内田 裕史 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社材料デバイス研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Fumio Matsukawa 8-1-1 Tsukaguchihonmachi, Amagasaki City Mitsubishi Electric Corporation Material Device Research Center (72) Inventor Mutsuhiro Shima 8-1-1 Tsukaguchihonmachi, Amagasaki Mitsubishi Electric Corporation Material Device Research Center (72) Inventor Tomio Kawato 8-1, 1-1 Tsukaguchi Honcho, Amagasaki City Mitsubishi Electric Corporation Material Device Research Center (72) Inventor Hidefumi Mifuku 8-1-1 Tsukaguchi Honcho, Amagasaki City No. Mitsubishi Electric Corporation Material Devices Research Laboratory (72) Inventor Hiroshi Ouchida 8-1-1 Tsukaguchihonmachi, Amagasaki City Mitsubishi Electric Corporation Material Devices Research Laboratory
Claims (15)
された透光性の第１回路基板の該接続電極端子と、電子
部品または第２回路基板の電極端子とが、導電粒子を介
して接続されてなる回路基板の接続構造であって、前記
配線パターンが金属膜からなり、該配線パターンのうち
前記導電粒子の付着を阻止せしめる部分は透明導電膜に
より形成されてなる回路基板の接続構造。1. A connection electrode terminal and a connection electrode terminal of a translucent first circuit board on which a wiring pattern is formed and an electrode terminal of an electronic component or a second circuit board are connected via conductive particles. The circuit board connection structure according to claim 1, wherein the wiring pattern is made of a metal film, and a portion of the wiring pattern that prevents the conductive particles from adhering is formed of a transparent conductive film.
された透光性の第１回路基板の該接続電極端子と、電子
部品または第２回路基板の電極端子とが、導電粒子を介
して接続されてなる回路基板の接続構造であって、前記
接続電極端子が金属膜からなり、該接続電極端子の一部
は透明導電膜により形成されてなる回路基板の接続構
造。2. The connecting electrode terminal of the translucent first circuit board on which the connecting electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. A connection structure of a circuit board, wherein the connection electrode terminal is made of a metal film, and a part of the connection electrode terminal is formed of a transparent conductive film.
された第１回路基板の該接続電極端子と、電子部品また
は第２回路基板の電極端子とが、導電粒子を介して接続
されてなる回路基板の接続構造であって、前記接続電極
端子の周囲にパッシベーション膜からなる枠が形成され
ると共に、該枠の内部にも部分的にパッシベーション膜
が形成されてなる回路基板の接続構造。3. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. The connection structure of the circuit board, wherein a frame made of a passivation film is formed around the connection electrode terminal, and a passivation film is partially formed inside the frame.
された第１回路基板の該接続電極端子と、電子部品また
は第２回路基板の電極端子とが、導電粒子を介して接続
されてなる回路基板の接続構造であって、前記電極端子
と異なるところで、第１回路基板と前記電子部品または
第２回路基板とがはんだ付けにより固着されてなる回路
基板の接続構造。4. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. Connection structure of the circuit board, wherein the first circuit board and the electronic component or the second circuit board are fixed to each other by soldering at a position different from the electrode terminals.
された第１回路基板の該接続電極端子と、電子部品また
は第２回路基板の電極端子とが、導電粒子を介して接続
されてなる回路基板の接続構造であって、前記導電粒子
の少なくとも一部がはんだボールで形成されてなる回路
基板の接続構造。5. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. The connection structure of the circuit board, wherein at least a part of the conductive particles is formed of solder balls.
された第１回路基板の該接続電極端子と、電子部品また
は第２回路基板の電極端子とが、導電粒子を介して接続
されてなる回路基板の接続構造であって、前記導電粒子
は強磁性体で形成されてなる回路基板の接続構造。6. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. Connection structure of a circuit board, wherein the conductive particles are made of a ferromagnetic material.
された第１回路基板の該接続電極端子と、電子部品また
は第２回路基板の電極端子とが、導電粒子を介して接続
されてなる回路基板の接続構造であって、前記導電粒子
は高分子材料で形成された球の表面に強磁性体が被覆さ
れてなるものである回路基板の接続構造。7. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. The connection structure of the circuit board, wherein the conductive particles are formed by coating the surface of a sphere made of a polymer material with a ferromagnetic material.
された第１回路基板の該接続電極端子と、電子部品また
は第２回路基板の電極端子とが、導電粒子を介して接続
されてなる回路基板の接続構造であって、前記導電粒子
は、高分子材料からなり中空部を有する球の表面に導電
材料が被覆されたものである回路基板の接続構造。8. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. The connection structure of the circuit board, wherein the conductive particles are spheres made of a polymer material and having a hollow portion, and the surfaces of the spheres are coated with the conductive material.
された第１回路基板の該接続電極端子と、電子部品また
は第２回路基板の電極端子とが、導電粒子を介して接続
されてなる回路基板の接続構造であって、前記接続電極
端子、前記電子部品または第２回路基板の電極端子、お
よび前記導電粒子のうちの少なくとも１つが永久磁石か
らなり、残部が強磁性体からなる回路基板の接続構造。9. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. Of the connection electrode terminal, the electrode terminal of the electronic component or the second circuit board, and the conductive particles, wherein at least one of the connection electrode terminals is a permanent magnet and the rest is a ferromagnetic material. Construction.
成された第１回路基板の該接続電極端子と、電子部品ま
たは第２回路基板の電極端子とが、導電粒子を介して接
続されてなる回路基板の接続構造であって、前記電子部
品または第２回路基板の周縁の少なくとも一部と該周縁
の一部と対向する部分の第１回路基板の一方に永久磁石
が設けられ、他方に永久磁石または強磁性体が設けられ
てなる回路基板の接続構造。10. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. Of the electronic component or the second circuit board, a permanent magnet is provided on one of the first circuit board and a permanent magnet on the other side of the first circuit board facing at least a part of the electronic circuit or the second circuit board. Circuit board connection structure with ferromagnetic material.
成された第１回路基板の該接続電極端子と、電子部品ま
たは第２回路基板の電極端子とが、導電粒子を介して接
続されてなる回路基板の接続構造であって、前記電子部
品または第２回路基板の一部に強磁性体が設けられ、前
記電子部品または第２回路基板と接続される第１回路基
板の前記強磁性体に対向する位置の第１回路基板の裏面
に永久磁石が設けられてなる回路基板の接続構造。11. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. And a ferromagnetic body is provided in a part of the electronic component or the second circuit board, and is opposed to the ferromagnetic body of the first circuit board connected to the electronic component or the second circuit board. A circuit board connection structure in which a permanent magnet is provided on the back surface of the first circuit board at the position.
成された第１回路基板の該接続電極端子と、電子部品ま
たは第２回路基板の電極端子とが、導電粒子を介して接
続されてなる回路基板の接続構造であって、前記電子部
品または第２回路基板と第１回路基板の接続部を覆い内
部を負圧状態に保たれた気密性シートを備えてなる回路
基板の接続構造。12. A circuit board in which the connection electrode terminals of a first circuit board on which connection electrode terminals and a wiring pattern are formed and the electrode terminals of an electronic component or a second circuit board are connected via conductive particles. The connection structure for a circuit board, comprising: an airtight sheet that covers the connection part between the electronic component or the second circuit board and the first circuit board and keeps a negative pressure inside.
成された第１回路基板の該接続電極端子と、電子部品ま
たは第２回路基板の電極端子とが、導電粒子を介して接
続されてなる回路基板の接続構造であって、前記接続部
近傍における前記電子部品または第２回路基板と第１回
路基板間に介在し、両者間の気密を保持する樹脂枠、該
樹脂枠内を負圧状態にする排気孔、および該排気孔を塞
ぐ栓を備え、前記接続部近傍における前記電子部品また
は第２回路基板と第１回路基板間を負圧状態に保持して
なる回路基板の接続構造。13. A circuit board in which the connection electrode terminal of the first circuit board on which the connection electrode terminal and the wiring pattern are formed and the electrode terminal of the electronic component or the second circuit board are connected via conductive particles. And a resin frame interposed between the electronic component or the second circuit board and the first circuit board in the vicinity of the connection portion and maintaining airtightness between the two, and a negative pressure state in the resin frame. A circuit board connection structure comprising an exhaust hole and a plug closing the exhaust hole, and holding a negative pressure between the electronic component or the second circuit board and the first circuit board in the vicinity of the connection portion.
成された第１回路基板上に導電粒子を含む感光性樹脂を
塗布する工程と、該感光性樹脂を選択的に露光し、つい
で現像することにより前記配線パターン上以外の感光性
樹脂を除去する工程と、前記導電粒子を介して第１回路
基板上の接続電極端子と電子部品または第２回路基板の
電極端子とを接触させ、第１回路基板に前記電子部品ま
たは第２回路基板を接着する工程とを備える回路基板の
接続方法であって、前記感光性樹脂の現像の際に、現像
液槽に浸漬した第１回路基板に前記現像液または気泡を
吹きつけながら現像することを特徴とする回路基板の接
続方法。14. A step of applying a photosensitive resin containing conductive particles onto a first circuit board having connection electrode terminals and a wiring pattern formed thereon, and the step of selectively exposing the photosensitive resin and then developing the photosensitive resin. A step of removing the photosensitive resin other than on the wiring pattern, and contacting the connection electrode terminal on the first circuit board with the electrode terminal of the electronic component or the second circuit board through the conductive particles, And a step of adhering the electronic circuit or the second circuit board to the circuit board, wherein the developing solution is applied to the first circuit board immersed in a developing solution tank when the photosensitive resin is developed. A method of connecting circuit boards, characterized in that development is performed while blowing bubbles.
成された第１回路基板上に導電粒子を含む感光性樹脂を
塗布する工程と、該感光性樹脂を選択的に露光し、つい
で現像することにより前記配線パターン上以外の感光性
樹脂を除去する工程と、前記導電粒子を介して第１回路
基板上の接続電極端子と電子部品または第２回路基板の
電極端子とを接触させ、第１回路基板に前記電子部品ま
たは第２回路基板を接着する工程とを備える回路基板の
接続方法であって、前記感光性樹脂の現像の際に、現像
液槽に浸漬した第１回路基板にエアーを吹きつけながら
前記現像液槽から第１回路基板を引き上げることを特徴
とする回路基板の接続方法。15. A step of applying a photosensitive resin containing conductive particles onto a first circuit board having connection electrode terminals and a wiring pattern formed thereon, and the step of selectively exposing the photosensitive resin and then developing the photosensitive resin. A step of removing the photosensitive resin other than on the wiring pattern, and contacting the connection electrode terminal on the first circuit board with the electrode terminal of the electronic component or the second circuit board through the conductive particles, And a step of adhering the second circuit board to the electronic component, the method for connecting the circuit board, wherein air is blown to the first circuit board immersed in the developer tank when developing the photosensitive resin. A method of connecting circuit boards, wherein the first circuit board is pulled up from the developer tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26360693A JP3286867B2 (en) | 1993-01-28 | 1993-10-21 | Circuit board connection structure |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1249493 | 1993-01-28 | ||
| JP5-12494 | 1993-05-07 | ||
| JP5-106465 | 1993-05-07 | ||
| JP10646593 | 1993-05-07 | ||
| JP26360693A JP3286867B2 (en) | 1993-01-28 | 1993-10-21 | Circuit board connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0720485A true JPH0720485A (en) | 1995-01-24 |
| JP3286867B2 JP3286867B2 (en) | 2002-05-27 |
Family
ID=27279849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26360693A Expired - Lifetime JP3286867B2 (en) | 1993-01-28 | 1993-10-21 | Circuit board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3286867B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100350852B1 (en) * | 1999-10-05 | 2002-09-09 | 밍-퉁 센 | Electro - optic device and method for manufacturing the same |
| JP2003076297A (en) * | 2001-09-06 | 2003-03-14 | Pioneer Electronic Corp | Display panel and apparatus for holding substrate |
| JP2012178349A (en) * | 2000-08-04 | 2012-09-13 | Sekisui Chem Co Ltd | Conductive particulate and substrate constituent |
| US11294498B2 (en) | 2019-10-31 | 2022-04-05 | Samsung Display Co., Ltd. | Touch sensor and display device including the same |
-
1993
- 1993-10-21 JP JP26360693A patent/JP3286867B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100350852B1 (en) * | 1999-10-05 | 2002-09-09 | 밍-퉁 센 | Electro - optic device and method for manufacturing the same |
| JP2012178349A (en) * | 2000-08-04 | 2012-09-13 | Sekisui Chem Co Ltd | Conductive particulate and substrate constituent |
| JP2003076297A (en) * | 2001-09-06 | 2003-03-14 | Pioneer Electronic Corp | Display panel and apparatus for holding substrate |
| US11294498B2 (en) | 2019-10-31 | 2022-04-05 | Samsung Display Co., Ltd. | Touch sensor and display device including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3286867B2 (en) | 2002-05-27 |
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