JPH07201640A - Production of multilayer ceramic electronic device - Google Patents
Production of multilayer ceramic electronic deviceInfo
- Publication number
- JPH07201640A JPH07201640A JP5353781A JP35378193A JPH07201640A JP H07201640 A JPH07201640 A JP H07201640A JP 5353781 A JP5353781 A JP 5353781A JP 35378193 A JP35378193 A JP 35378193A JP H07201640 A JPH07201640 A JP H07201640A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrodes
- sheet
- ceramic green
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、積層セラミック電子
部品の製造方法、更に詳しくはマザーシート上に配置さ
れた複数の電極が、プレス圧着によるシートの変形で変
位するために生じる電子部品の電極の位置ずれを防止す
る方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated ceramic electronic component, and more specifically, electrodes of an electronic component produced when a plurality of electrodes arranged on a mother sheet are displaced by deformation of the sheet by press-compression bonding. The present invention relates to a method for preventing the positional deviation of the.
【０００２】[0002]
【従来の技術】積層セラミック電子部品の製造方法とし
ては、まず、セラミック粉末とバインダーや溶剤を混合
したスラリーをシーティングして乾燥したセラミックグ
リーンシートを得て、このシートをマザーシートとして
上面に複数の電子部品に対応する複数の電極を規則正し
く配置して形成した後、電極を形成したシートと形成し
ないシートを適宜構成して積層し、プレス圧着する。そ
の後に該シートの積層体から個々の電子部品を切り出し
た後に焼成し、内部電極と導通する外部電極を形成して
積層セラミック電子部品を得ていた。2. Description of the Related Art As a method for producing a laminated ceramic electronic component, first, a slurry obtained by mixing a ceramic powder with a binder or a solvent is sheeted to obtain a dried ceramic green sheet. After a plurality of electrodes corresponding to electronic components are regularly arranged and formed, a sheet on which electrodes are formed and a sheet on which electrodes are not formed are appropriately configured and laminated, and press-bonded. After that, individual electronic components were cut out from the laminated body of the sheet and then fired to form external electrodes that were electrically connected to the internal electrodes to obtain a laminated ceramic electronic component.
【０００３】[0003]
【発明が解決しようとする課題】図４（ａ）（ｂ）はプ
レス圧着前のセラミックグリーンシート７と圧着後のセ
ラミックグリーンシート８を誇張して表したものであ
り、（ａ）に示すように、個々の電子部品の切り出しを
考慮して、各電極２はシート７のＸＹ方向の直線上に規
則正しく整列させて形成していた。4 (a) and 4 (b) are exaggerated representations of the ceramic green sheet 7 before press-press bonding and the ceramic green sheet 8 after press-bonding, as shown in FIG. 4 (a). In consideration of the cutting out of individual electronic components, the electrodes 2 are regularly formed on the straight line of the sheet 7 in the XY directions.
【０００４】しかし、図４（ｂ）に示す積層してプレス
圧着された後においては、プレス前の（ａ）の状態で各
電極２の並びがＸＹ方向で直線になっていても、プレス
で高圧をかけることで成形後のシート８が太鼓状に変形
してしまうために、電極２の並びが外側に湾曲してしま
う。そしてこの湾曲はシート８の外周付近に配置された
電極において顕著となる。However, after the layers are stacked and press-bonded as shown in FIG. 4B, even if the arrangement of the electrodes 2 is straight in the XY direction in the state of (a) before pressing, it is still pressed. Since the sheet 8 after molding is deformed into a drum shape by applying a high pressure, the arrangement of the electrodes 2 is curved outward. And this curvature becomes remarkable in the electrodes arranged near the outer periphery of the sheet 8.
【０００５】この電極２の並びが湾曲した状態で個々の
電子部品とするためのカットを行なうと、カット刃は通
常直線でしか入らないため、カット後の個々の電子部品
において、湾曲した内側もしくは外側で切り取られた電
子部品の電極と切り口とのギャップがシート上の位置に
より変わってしまい、ギャップ不良等の不具合が発生し
てしまう。When cutting is performed to form individual electronic parts in a state where the array of electrodes 2 is curved, the cutting blade normally enters only a straight line. The gap between the electrode and the cut end of the electronic component cut off on the outside changes depending on the position on the sheet, and a defect such as a gap defect occurs.
【０００６】図５は切り出された個々の電子部品を示す
もので、小型電子部品は、例えば、幅が約１〜１．５ｍ
ｍとして、内部電極９の幅が３００〜５００μｍ、電極
９と外側のギャップｄが約２００μｍ程度のものがある
が、内部電極９がシート上でギャップｄより大きく変位
すると、内部電極９の端部が電子部品の幅よりはみ出し
て外部に露出したり、逆に外部電極と導通すべき表面に
内部電極９が露出しないという不具合が生じるおそれが
ある。FIG. 5 shows individual electronic components cut out. Small electronic components have a width of, for example, about 1 to 1.5 m.
As m, the width of the internal electrode 9 is 300 to 500 μm, and the gap d between the electrode 9 and the outside is about 200 μm. However, when the internal electrode 9 is displaced more than the gap d on the sheet, the end portion of the internal electrode 9 However, there is a possibility that a problem may occur in that the external electrode is exposed outside the width of the electronic component, or conversely, the internal electrode 9 is not exposed on the surface that should be electrically connected to the external electrode.
【０００７】特に最近は電子部品の小型化によりギャッ
プｄのマージンを小さくすることが要求され、マザーシ
ート上での電極並びの精度の要求も高くなってきた。In particular, recently, it has been required to reduce the margin of the gap d due to the miniaturization of electronic parts, and the precision of the arrangement of electrodes on the mother sheet has also been increased.
【０００８】この発明は上記のような課題を解決し、マ
ザーシートの圧着で発生する電極の変位による切り出し
後の個々の電子部品の電極ずれにより生じる不具合を防
止することを課題とする。An object of the present invention is to solve the above problems and prevent problems caused by electrode displacement of individual electronic components after cutting due to electrode displacement caused by pressure bonding of a mother sheet.
【０００９】[0009]
【課題を解決するための手段】上記の課題を解決するた
め、この発明は、複数の電極を規則的に配置したセラミ
ックグリーンシートを少なくとも１枚以上含んだ複数の
シートを積層して圧着した後に個々の電子部品にカット
する積層セラミック電子部品の製造方法において、圧着
により生じる電極の変位分を打ち消すように、あらかじ
め圧着前のセラミックグリーンシート上で各電極を変位
させて配置することを特徴とする製造方法である。In order to solve the above-mentioned problems, according to the present invention, after a plurality of sheets containing at least one ceramic green sheet in which a plurality of electrodes are regularly arranged are laminated and pressure-bonded, A method for manufacturing a monolithic ceramic electronic component that is cut into individual electronic components, characterized in that each electrode is displaced in advance on the ceramic green sheet before pressure bonding so as to cancel the displacement of the electrode caused by pressure bonding. It is a manufacturing method.
【００１０】[0010]
【作用】セラミックグリーンシートのマザーシート上
に、プレス圧着で各電極位置が変位する量をみこして、
それを打ち消す分だけ電極位置をずらしたパターンで印
刷することにより、プレス圧着後、各電極はＸＹ方向共
に整列状態となり、その後の個々のユニットサイズに切
り出すカット作業で電子部品ごとに電極の位置が違った
り、マージンが小さくなってしまう不良を防止できる。[Function] On the mother sheet of the ceramic green sheet, the amount of displacement of each electrode position by press bonding is taken into consideration,
By printing with a pattern in which the electrode positions are offset by the amount by which they are canceled, after press-press bonding, the electrodes are aligned in both the XY directions, and the position of the electrodes for each electronic component is changed by cutting work to cut into individual unit sizes thereafter. It is possible to prevent defects that are different or the margin is reduced.
【００１１】[0011]
【実施例】以下、この発明の実施例を図１乃至３に基づ
いて説明するが、従来例と同一部分は同一の符号を付
す。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS. 1 to 3, and the same parts as those in the conventional example are designated by the same reference numerals.
【００１２】図１はこの発明のプレス前のセラミックグ
リーンシート１を示すものであり、図示のように各電極
を配置して印刷する。ａはＹ方向に並んだ電極の列にお
ける中央付近と外側付近の各列の電極の配置のＸ方向で
の変位量である。尚、図示の電極２は説明を簡単にする
ため各列４個づつで４列であるが、実際には多くの電極
が並び、ａは各列の電極２の変位の最大値を表し、ａ1
はシートの最も外側の列の変位量、ａ2はシートの中央
部の列の変位量を表すものとする。FIG. 1 shows a ceramic green sheet 1 before pressing according to the present invention, in which each electrode is arranged and printed as shown. a is the amount of displacement in the X direction of the arrangement of the electrodes in the vicinity of the center and in the vicinity of the outside of the row of electrodes arranged in the Y direction. It should be noted that the electrodes 2 shown in the figure are four rows, with four rows for each row for simplification of description, but in reality many electrodes are arranged, and a represents the maximum value of the displacement of the electrodes 2 in each row, and 1
Is the displacement of the outermost row of the sheet, and a 2 is the displacement of the central row of the sheet.
【００１３】プレス圧着によりシートは太鼓状に広がる
ため、この変位を打ち消すように、各電極２はその分の
変位をみこしてＸＹ方向共、各列ごとに直線上を列の前
後のものは外側、列の中央付近のものは内側に変位させ
て配置されている。Since the sheet spreads in a drum shape by press-compression bonding, each electrode 2 has a displacement corresponding to that displacement so as to cancel out this displacement, and in each of the XY directions, each electrode 2 is on a straight line in front of and behind the line. , Those near the center of the row are displaced inward.
【００１４】又、シート外周付近の方が中央付近よりプ
レスによる変位量が大きいので、外側の列における変位
量ａ1，ａ1´の方が、内側の列における変位量ａ2，ａ2
´よりも大きくなっている。図示しないが、これはＸ方
向に並んだ列のＹ方向への変位量においても同様であ
る。Further, since the displacement amount due to the press is larger in the vicinity of the outer periphery of the sheet than in the vicinity of the center, the displacement amounts a 1 and a 1 ′ in the outer row are the displacement amounts a 2 and a 2 in the inner row.
It is bigger than ´. Although not shown, this also applies to the displacement amount in the Y direction of the rows aligned in the X direction.
【００１５】尚、ａ1，ａ2，ａ2´，ａ1´の値は、シー
トサイズ、電極形状及びそのサイズ、電極の個数、密
度、シートの材質、あるいは積み重ね枚数等により各条
件において最適になるように設定される。例えば、８０
×６０ｍｍシートの場合、適するａ1，ａ1´の値は約２
００μｍ、ａ2，ａ2´の値は約１００μｍであった。The values of a 1 , a 2 , a 2 ′ and a 1 ′ are optimal under each condition depending on the sheet size, the electrode shape and size, the number of electrodes, the density, the material of the sheets, the number of stacked sheets and the like. Is set to. For example, 80
In the case of a x60 mm sheet, suitable values of a 1 and a 1 ′ are about 2
The values of 00 μm, a 2 and a 2 ′ were about 100 μm.
【００１６】図２（ａ）（ｂ）はこの発明に用いられる
プレス圧着前のセラミックグリーンシート１及び圧着後
のセラミックグリーンシート３を誇張して示したもので
あり、シート１上の電極２の配置は糸巻形であるが、プ
レス圧着後はシート３が太鼓状に変形しても、その電極
２の配置はＸＹ方向共に規則正しく並ぶことになる。2 (a) and 2 (b) are exaggerated views of the ceramic green sheet 1 before press bonding and the ceramic green sheet 3 after pressing, which are used in the present invention. Although the arrangement is a pincushion type, even if the sheet 3 is deformed into a drum shape after press-pressing, the arrangement of the electrodes 2 is regularly arranged in the XY directions.
【００１７】尚、上記実施例は長方形の電極形状のもの
について述べたが、電極形状は長方形のものに限られ
ず、円形やその他の形状のものであってもよい。Although the above embodiment has described the rectangular electrode shape, the electrode shape is not limited to the rectangular shape, and may be a circular shape or another shape.
【００１８】図３で示すセラミックグリーンシート４の
場合、丸形電極５をプレスによる変位量を打ち消すよう
変位して配置する。この時、各電子部品の分割は直線カ
ットではなく打ち抜き円６に沿う打ち抜きであっても、
この発明により、プレス圧縮後に丸形電極６がシート上
で直線に並ぶことになり、打ち抜き円６を打ち抜く機械
の移動が直線となり、又、打ち抜き円６と丸型電極５の
位置ずれも生じない。In the case of the ceramic green sheet 4 shown in FIG. 3, the round electrodes 5 are arranged so as to be displaced so as to cancel the displacement amount by the press. At this time, even if the division of each electronic component is not straight line cutting but punching along the punching circle 6,
According to the present invention, the round electrodes 6 are arranged in a straight line on the sheet after press compression, the movement of the machine for punching the punching circle 6 becomes a straight line, and the positional deviation between the punching circle 6 and the round electrode 5 does not occur. .
【００１９】[0019]
【発明の効果】以上のように、この発明による積層セラ
ミック電子部品の製造方法によると、マザー基板に形成
される電極並びのプレス圧着による湾曲を補正して、直
線上の並びにでき、プレスによる歪みをカット位置でカ
バーできない製品に対して個々の電子部品とするための
カット時のカットずれ不良を抑制することができる。As described above, according to the method for manufacturing a monolithic ceramic electronic component according to the present invention, the curvature of the electrode array formed on the mother substrate due to the press-compression bonding can be corrected to form a straight line, and distortion due to the press can be obtained. It is possible to suppress the cut misalignment at the time of cutting to make an individual electronic component for a product that cannot be covered at the cutting position.
【００２０】更に、カット時に生じる個々の電子部品に
おけるギャップ不良を防止することができるので、電極
端部と電子部品表面との間のマージンを小さく取ること
ができ、電子部品の小型化が可能となる。Furthermore, since it is possible to prevent gap defects in individual electronic components that occur during cutting, it is possible to reduce the margin between the electrode end and the surface of the electronic component, and to reduce the size of the electronic component. Become.
【図１】この発明において用いるセラミックグリーンシ
ートを示す図である。FIG. 1 is a diagram showing a ceramic green sheet used in the present invention.
【図２】（ａ）はプレス前のこの発明において用いるセ
ラミックグリーンシート、（ｂ）はプレス後のセラミッ
クグリーンシートを誇張して示したものである。2A is an exaggerated view of a ceramic green sheet used in the present invention before pressing, and FIG. 2B is an exaggerated view of a ceramic green sheet after pressing.
【図３】この発明において用いるセラミックグリーンシ
ートの他の例を示す図である。FIG. 3 is a diagram showing another example of a ceramic green sheet used in the present invention.
【図４】（ａ）はプレス前の従来のセラミックグリーン
シート、（ｂ）はプレス後のセラミックグリーンシート
を誇張して示したものである。4A is an exaggerated view of a conventional ceramic green sheet before pressing, and FIG. 4B is an exaggerated view of a ceramic green sheet after pressing.
【図５】カット後の電子部品の１部切欠平面図である。FIG. 5 is a partial cutaway plan view of the electronic component after cutting.
１，４，７ プレス前のセラミックグリーンシート ２，５ 電極 ３，８ プレス後のセラミックグリーンシート ９ 内部電極 ａ1，ａ1´，ａ2，ａ2´ 印刷時の変位量 ｄ ギャップ1,4,7 Ceramic green sheet before pressing 2,5 Electrodes 3,8 Ceramic green sheet after pressing 9 Internal electrodes a 1 , a 1 ′, a 2 , a 2 ′ Displacement amount during printing d Gap
Claims (1)
クグリーンシートを少なくとも１枚以上含んだ複数のシ
ートを積層して圧着した後に個々の電子部品にカットす
る積層セラミック電子部品の製造方法において、圧着に
より生じる電極の変位分を打ち消すように、あらかじめ
圧着前のセラミックグリーンシート上で各電極を変位さ
せて配置することを特徴とする積層セラミック電子部品
の製造方法。1. A method of manufacturing a laminated ceramic electronic component, comprising laminating a plurality of sheets containing at least one ceramic green sheet having a plurality of electrodes arranged regularly, press-bonding the sheets, and cutting into individual electronic components. A method for manufacturing a monolithic ceramic electronic component, wherein each electrode is displaced and arranged in advance on a ceramic green sheet before pressure bonding so as to cancel the displacement of the electrode caused by pressure bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5353781A JPH07201640A (en) | 1993-12-28 | 1993-12-28 | Production of multilayer ceramic electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5353781A JPH07201640A (en) | 1993-12-28 | 1993-12-28 | Production of multilayer ceramic electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07201640A true JPH07201640A (en) | 1995-08-04 |
Family
ID=18433179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5353781A Pending JPH07201640A (en) | 1993-12-28 | 1993-12-28 | Production of multilayer ceramic electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07201640A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008142847A (en) * | 2006-12-12 | 2008-06-26 | Tdk Corp | Device for cutting green sheet laminate, and method for cutting green sheet laminate |
| JP2018093050A (en) * | 2016-12-02 | 2018-06-14 | 株式会社村田製作所 | Manufacturing method of multilayer electronic component |
-
1993
- 1993-12-28 JP JP5353781A patent/JPH07201640A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008142847A (en) * | 2006-12-12 | 2008-06-26 | Tdk Corp | Device for cutting green sheet laminate, and method for cutting green sheet laminate |
| JP2018093050A (en) * | 2016-12-02 | 2018-06-14 | 株式会社村田製作所 | Manufacturing method of multilayer electronic component |
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