JPH07192954A - Production of multilayer electronic device - Google Patents
Production of multilayer electronic deviceInfo
- Publication number
- JPH07192954A JPH07192954A JP5332166A JP33216693A JPH07192954A JP H07192954 A JPH07192954 A JP H07192954A JP 5332166 A JP5332166 A JP 5332166A JP 33216693 A JP33216693 A JP 33216693A JP H07192954 A JPH07192954 A JP H07192954A
- Authority
- JP
- Japan
- Prior art keywords
- groove
- conductor layer
- sheet
- forming
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Abstract
Description
【０００１】[0001]
【０００２】本発明は、積層構造のコイル導体を内蔵し
た積層チップインダクタ，積層トランス，ＬＣ複合部品
等の積層型電子部品に有用な製造方法に関するものであ
る。The present invention relates to a manufacturing method useful for a laminated electronic component such as a laminated chip inductor, a laminated transformer, an LC composite component, etc., which incorporates a coil conductor having a laminated structure.
【従来の技術】この種の積層型電子部品、例えば積層チ
ップインダクタは、図７に示すように未焼成の磁性体シ
ート１〜４及び１０〜１２と、同シートにスルーホール
と各種パターン形状のコイル用導体層Ｐ５〜Ｐ９を設け
て形成されたシート５〜９とを用意し、これらを同図右
側に示す所定の順序で積層して熱圧着した後に焼成し、
焼成後の積層チップの表面に外部電極となる導電ペース
トを塗布し焼き付けることで製造されている。シート５
〜８を介し隣接する導体層Ｐ５〜Ｐ９はスルーホールを
介してコイル状に接続され、これにより積層チップ内に
所定周回のコイル導体が形成される。図面では説明上１
部品に対応するものを示してあるが、実際の各シートは
多数の部品に対応する大きさを有し、導体層等も部品取
得個数分だけ形成されており、積層，圧着後に部品寸法
に切断してから焼成される。2. Description of the Related Art As shown in FIG. 7, a multilayer electronic component of this type, such as a multilayer chip inductor, has unbaked magnetic sheets 1 to 4 and 10 to 12, through holes and various pattern shapes. Sheets 5 to 9 formed by providing coil conductor layers P5 to P9 are prepared, these are laminated in a predetermined order shown on the right side of the drawing, thermocompression-bonded, and fired,
It is manufactured by applying a conductive paste to be external electrodes on the surface of the laminated chip after baking and baking it. Sheet 5
The conductor layers P5 to P9 which are adjacent to each other via the through holes 8 to 8 are connected in a coil shape through the through holes, whereby a coil conductor of a predetermined turn is formed in the laminated chip. 1 for explanation in the drawings
Although the ones corresponding to the parts are shown, each actual sheet has a size corresponding to many parts, and the conductor layers, etc. are formed by the number of acquired parts. And then fired.
【０００３】上記の導体層Ｐ５〜Ｐ９は、通常、導電ペ
ーストを各シート５〜９の上面に所定パターン形状でス
クリーン印刷することにより形成されているため、換言
すれば各シート５〜９の上面に導体層Ｐ５〜Ｐ９がその
厚み分だけ突出してしまうことから、コイル導体の周回
数を増加してインダクタンス拡大に対応させたり、或い
は各導体層Ｐ５〜Ｐ９の厚みを増加して許容電流拡大に
対応させようとすると、部品寸法が大きくなるばかりか
上記の圧着時に積層ずれを生じ易くなる。The conductor layers P5 to P9 are usually formed by screen-printing a conductive paste on the upper surfaces of the sheets 5 to 9 in a predetermined pattern. In other words, the upper surfaces of the sheets 5 to 9 are formed. In addition, since the conductor layers P5 to P9 protrude by the thickness thereof, the number of turns of the coil conductor is increased to cope with the increase in inductance, or the thickness of each conductor layer P5 to P9 is increased to increase the allowable current. If it is attempted to cope with this, not only the size of the component becomes large, but also the stacking deviation is likely to occur during the above-mentioned pressure bonding.
【０００４】これら事情に係り、特開平３−２１９６０
５号公報にはその解決方法の一例が示されている。同公
報に開示された方法は、図８及び図９に示すように導体
層形成前のシートＳの上面に金型押圧によって導体層Ｐ
に対応する溝Ｄを予め形成し、該溝Ｄ内に導電ペースト
を印刷して導体層Ｐを形成したものであり、該方法によ
れば溝Ｄの深さ分だけ導体層Ｐの突出高さを小さくする
ことができ、コイル導体の周回数を増加する場合や導体
層Ｐの厚みを増加する場合でも部品寸法が大きくなら
ず、また圧着時に積層ずれが生じ難くなる。Regarding these circumstances, Japanese Patent Laid-Open No. 3-219960
Japanese Patent No. 5 discloses an example of the solution. In the method disclosed in the publication, as shown in FIGS. 8 and 9, the conductor layer P is formed by pressing a die on the upper surface of the sheet S before the conductor layer is formed.
Is formed in advance, and a conductive paste is printed in the groove D to form a conductor layer P. According to this method, the protrusion height of the conductor layer P is equal to the depth of the groove D. It is possible to reduce the size of the coil conductor, and even when the number of turns of the coil conductor is increased or the thickness of the conductor layer P is increased, the component size is not increased, and the stacking deviation is less likely to occur during pressure bonding.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、導体層
形成に厚膜法を利用する以上は、上記のように溝Ｄ内に
導体層Ｐを形成する場合でもその全部を該溝Ｄ内に納め
入れることは不可能であり、図９に示すように導体層Ｐ
の上面部分がシート上面から僅かに突出してしまう。However, as long as the thick film method is used to form the conductor layer, even if the conductor layer P is formed in the groove D as described above, all of the conductor layer P is accommodated in the groove D. Is impossible, and as shown in FIG.
The upper surface of the sheet slightly protrudes from the upper surface of the seat.
【０００６】つまり、導体層形成後のシートＳを積層し
圧着すると、図１０に示すように上側シートＳの導体層
接触部分に応力が集中して同部分が高密度化され、焼成
後の透磁率が変化して電気特性にばらつきを生じる問題
点がある。上記の問題は積層チップインダクタに限ら
ず、同様の積層構造のコイル導体を内蔵した積層トラン
ス，ＬＣ複合部品等の他の積層型電子部品にも生じ得
る。That is, when the sheets S on which the conductor layers have been formed are stacked and pressure-bonded, stress concentrates on the conductor layer contacting portions of the upper sheet S to densify the same, as shown in FIG. There is a problem that the magnetic susceptibility changes and the electrical characteristics vary. The above problem may occur not only in the multilayer chip inductor but also in other multilayer electronic components such as a multilayer transformer and an LC composite component having a coil conductor of the same multilayer structure built therein.
【０００７】本発明は上記問題点に鑑みてなされたもの
で、その目的とするところのは、電気特性が安定し、且
つ小型化が可能な積層型電子部品の製造方法を提供する
ことにある。The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing a laminated electronic component which has stable electric characteristics and can be miniaturized. .
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、請求項１の発明は、グリーンシートの表面に溝を形
成する工程と、該溝内に厚膜法によってコイル用導体層
を形成する工程と、これら工程を経て得られた複数のシ
ートを積層，圧着する工程とを具備した積層型電子部品
の製造方法において、上記溝形成工程で溝内面に凹凸を
設けたことを特徴としている。In order to achieve the above object, the invention of claim 1 forms a groove on the surface of the green sheet, and forms a coil conductor layer in the groove by a thick film method. In a method for manufacturing a laminated electronic component, which comprises steps and a step of laminating and press-bonding a plurality of sheets obtained through these steps, the groove forming step is characterized in that unevenness is provided on an inner surface of the groove.
【０００９】請求項２の発明は、グリーンシートの表面
に溝を形成する工程と、該溝内に厚膜法によってコイル
用導体層を形成する工程と、これら工程を経て得られた
複数のシートを積層，圧着する工程とを具備した積層型
電子部品の製造方法において、上記溝形成工程で形成さ
れる溝幅を導体層の幅よりも大きくしたことを特徴とし
ている。According to a second aspect of the invention, a step of forming a groove on the surface of the green sheet, a step of forming a coil conductor layer in the groove by a thick film method, and a plurality of sheets obtained through these steps In the method of manufacturing a laminated electronic component, which comprises the steps of laminating and pressure bonding, the groove width formed in the groove forming step is larger than the width of the conductor layer.
【００１０】請求項３の発明は、グリーンシートの表面
に溝を形成する工程と、該溝内に厚膜法によってコイル
用導体層を形成する工程と、これら工程を経て得られた
複数のシートを積層，圧着する工程とを具備した積層型
電子部品の製造方法において、上記溝形成工程で溝開口
端に面取り部を設けたことを特徴としている。According to a third aspect of the invention, a step of forming a groove on the surface of the green sheet, a step of forming a coil conductor layer in the groove by a thick film method, and a plurality of sheets obtained through these steps In the method of manufacturing a laminated electronic component, which comprises the steps of laminating and pressure bonding, the chamfered portion is provided at the groove opening end in the groove forming step.
【００１１】請求項４の発明は、請求項１〜３何れか１
項記載の製造方法において、溝をレーザ光照射によって
形成したことを特徴としている。The invention of claim 4 is any one of claims 1 to 3.
In the manufacturing method described in the item 1, the groove is formed by laser light irradiation.
【００１２】[0012]
【作用】請求項１の発明では、コイル用導体層を受容す
る溝内面に凹凸を設けてあるので、溝内面の凹凸と導体
層との間に形成される隙間に導体層の一部を侵入させる
ことで圧着時にシートの導体層接触部分に加わる応力を
軽減して同部分の高密度化を防止できる。According to the first aspect of the invention, since the groove inner surface for receiving the coil conductor layer is provided with irregularities, part of the conductor layer penetrates into the gap formed between the irregularity of the groove inner surface and the conductor layer. By doing so, it is possible to reduce the stress applied to the conductor layer contact portion of the sheet at the time of pressure bonding, and to prevent high density of the portion.
【００１３】請求項２の発明では、コイル用導体層を受
容する溝幅を該導体層の幅よりも大きくしてあるので、
溝内の幅方向の面と導体層との間に形成される隙間に導
体層の一部を侵入させることで圧着時にシートの導体層
接触部分に加わる応力を軽減して同部分の高密度化を防
止できる。According to the second aspect of the invention, the groove width for receiving the coil conductor layer is made larger than the width of the conductor layer.
By inserting a part of the conductor layer into the gap formed between the widthwise surface in the groove and the conductor layer, the stress applied to the conductor layer contact part of the sheet during crimping is reduced and the density of the part is increased. Can be prevented.
【００１４】請求項３の発明では、コイル用導体層を受
容する溝の開口端に面取り部を設けてあるので、溝開口
端の面取り部と導体層との間に形成される隙間に導体層
の一部を侵入させることで圧着時にシートの導体層接触
部分に加わる応力を軽減して同部分の高密度化を防止で
きる。In the invention of claim 3, since the chamfered portion is provided at the opening end of the groove for receiving the coil conductor layer, the conductor layer is provided in the gap formed between the chamfered portion at the groove opening end and the conductor layer. By intruding a part of the above, it is possible to reduce the stress applied to the conductor layer contact portion of the sheet at the time of pressure bonding and prevent the density increase of the portion.
【００１５】請求項４の発明では、レーザ光照射により
シートの一部を除去して上記各溝を形成しているので、
金型押圧で溝を形成する場合のように溝底面部分が高密
度化されず、また復元等による溝寸法変化を確実に防止
できる。According to the fourth aspect of the present invention, the grooves are formed by removing a part of the sheet by laser light irradiation.
Unlike the case where the groove is formed by pressing the mold, the groove bottom portion is not densified, and the groove dimension change due to restoration or the like can be reliably prevented.
【００１６】[0016]
【実施例】図１及び図２は本発明の第１実施例に係るも
ので、図１はシートの部分断面図、図２は溝内に導体層
を形成した状態を示す図である。1 and 2 relate to a first embodiment of the present invention. FIG. 1 is a partial sectional view of a sheet, and FIG. 2 is a view showing a state in which a conductor layer is formed in a groove.
【００１７】シートＳはＮｉ−Ｚｎ−Ｃｕ系フェライト
等の粉末をバインダーと混合して調製したスラリーを材
料とし、ドクターブレード法によってＰＥＴ等の可撓性
フィルムの上面に数十μｍ程度の厚みで塗工することで
形成されている。このシートＳの上面には導体層の印刷
形状とほぼ合致する溝Ｄ１が所定の深さ寸法で形成され
ており、また該溝Ｄ１の内面には多数の凹凸Ｄ１ａが設
けられている。凹凸部Ｄ１ａの形状は図示例のようなラ
ンダム状のものの他、規則的なものであってもよい。The sheet S is made of a slurry prepared by mixing powder of Ni-Zn-Cu type ferrite or the like with a binder, and has a thickness of about several tens of μm on the upper surface of a flexible film such as PET by the doctor blade method. It is formed by coating. Grooves D1 having a predetermined depth are formed on the upper surface of the sheet S so as to substantially match the printed shape of the conductor layer, and a large number of irregularities D1a are provided on the inner surface of the grooves D1. The shape of the uneven portion D1a may be regular as well as the random shape as shown in the drawing.
【００１８】上記の溝Ｄ１は好ましくはレーザ光照射、
詳しくはＹＡＧレーザ等のレーザ光源から発振されたノ
ーマルパルスのレーザ光を導体層と相似形の透光部を有
するマスクに照射し、該透光部を通過した光をレンズで
集光してシートＳの上面に導体層と同形状で結像させ、
該部分を溶融，気化することで形成される。溝Ｄ１の深
さはレーザ光出力によって調整することができ、また凹
凸部Ｄ１ａはレーザ光照射時に発生する溶融残留物を排
除せずそのまま溝Ｄ１内に残す方法や、レーザ光照射で
溝Ｄ１を形成した後に凹凸面を有する金型で溝内面を軽
く押圧する方法等によって簡単に形成することができ
る。The groove D1 is preferably irradiated with laser light,
Specifically, a normal pulsed laser beam oscillated from a laser light source such as a YAG laser is applied to a mask having a transparent portion similar in shape to a conductor layer, and the light passing through the transparent portion is condensed by a lens to form a sheet. Form an image on the upper surface of S with the same shape as the conductor layer,
It is formed by melting and vaporizing the portion. The depth of the groove D1 can be adjusted by the laser light output, and the uneven portion D1a does not remove the molten residue generated at the time of laser light irradiation and leaves it in the groove D1 as it is, or the groove D1 is formed by laser light irradiation. It can be easily formed by a method of lightly pressing the inner surface of the groove with a mold having an uneven surface after the formation.
【００１９】図示を省略したがシートＳには必要に応じ
て導体層接続用のスルーホールが溝Ｄ１の一部と交錯す
るように形成されており、該スルーホール形成には上記
同様のレーザ光照射が利用される。Although not shown, a through hole for connecting a conductor layer is formed on the sheet S so as to intersect with a part of the groove D1 if necessary, and the same laser beam as above is used for forming the through hole. Irradiation is used.
【００２０】コイル用導体層ＰはＡｇ等の粉末をバイン
ダーと混合して調製した導電ペーストを材料とし、スク
リーン印刷等の厚膜法によって上記溝Ｄ１内に所定のパ
ターン形状で印刷することで形成されている。シートＳ
にスルーホールが形成されている場合はこの導体層形成
と同時に該スルーホール内に導電ペーストが充填され
る。この導体層Ｐは大部分を溝Ｄ１内に受容されその上
面部分をシートＳの上面から僅かに突出しており、また
該導体層Ｐと溝Ｄ１内面の凹凸部Ｄ１ａとの間には該凹
凸部Ｄ１ａの窪みに応じた多数の隙間Ｅが形成される。The coil conductor layer P is formed by printing a conductive paste prepared by mixing a powder of Ag or the like with a binder and printing it in the groove D1 in a predetermined pattern by a thick film method such as screen printing. Has been done. Sheet S
If a through hole is formed in the through hole, the conductive paste is filled in the through hole at the same time when the conductor layer is formed. Most of the conductor layer P is received in the groove D1, and the upper surface of the conductor layer P slightly projects from the upper surface of the sheet S. Further, between the conductor layer P and the uneven portion D1a on the inner surface of the groove D1, the uneven portion is formed. A large number of gaps E corresponding to the depressions of D1a are formed.
【００２１】導体層形成後のシートＳの上に他のシート
を積層し圧着すると、該圧着力により導体層Ｐの凹凸部
近傍部分が上記隙間Ｅ内に侵入して該導体層Ｐの上面が
降下し、これにより圧着時に上側シートの導体層接触部
分に加わる応力が軽減され同部分の高密度化が防止され
る。When another sheet is laminated on the sheet S on which the conductor layer has been formed and pressure-bonded thereto, the pressure-bonding force causes the portion of the conductor layer P in the vicinity of the uneven portion to enter into the gap E, so that the upper surface of the conductor layer P is By this, the stress applied to the conductor layer contact portion of the upper sheet at the time of pressure bonding is reduced, and high density of the portion is prevented.
【００２２】本実施例によれば、溝Ｄ１の深さ分だけ導
体層Ｐの突出高さを小さくできるので、コイル導体の周
回数を増加する場合や導体層Ｐの厚みを増加する場合で
も部品寸法が大きくならず、また圧着時に積層ずれが生
じ難い。According to this embodiment, since the protruding height of the conductor layer P can be reduced by the depth of the groove D1, even when the number of turns of the coil conductor is increased or the thickness of the conductor layer P is increased, the component The size does not become large, and it is difficult for misalignment to occur during pressure bonding.
【００２３】また、溝Ｄ１内面の凹凸部Ｄ１ａと導体層
Ｐとの間に形成される隙間Ｅに該導体層Ｐの一部を侵入
させることで圧着時に上側シートの導体層接触部分に加
わる応力を軽減して同部分の高密度化を防止できるの
で、焼成後の透磁率変化を回避して安定した電気特性を
得ることができる。Further, by causing a part of the conductor layer P to enter the gap E formed between the uneven portion D1a on the inner surface of the groove D1 and the conductor layer P, the stress applied to the conductor layer contact portion of the upper sheet during pressure bonding. Since it is possible to prevent the density of the same portion from being increased, it is possible to avoid a change in magnetic permeability after firing and obtain stable electric characteristics.
【００２４】更に、レーザ光照射によりシートＳの一部
を除去して溝Ｄ１を形成しているので、金型押圧により
溝を形成する場合のように溝底面部分が高密度化され
ず、また復元等による溝寸法変化を防止でき、上記の特
性安定化に貢献できる。Further, since the groove D1 is formed by removing a part of the sheet S by laser light irradiation, the groove bottom portion is not densified as in the case of forming the groove by pressing the mold, and It is possible to prevent the groove dimensions from changing due to restoration or the like, which contributes to the stabilization of the above characteristics.
【００２５】図３及び図４は本発明の第２実施例に係る
もので、図３はシートの部分断面図、図４は溝内に導体
層を形成した状態を示す図である。3 and 4 relate to the second embodiment of the present invention. FIG. 3 is a partial sectional view of the sheet, and FIG. 4 is a view showing a state in which a conductor layer is formed in the groove.
【００２６】シートＳは第１実施例同様のスラリーをド
クターブレード法によってフィルム上面に塗工すること
で形成されている。このシートＳの上面には導体層の印
刷形状よりも幅寸法が大きな溝Ｄ２が所定の深さ寸法で
形成されている。この溝Ｄ２は第１実施例同様のレーザ
光照射によって形成されるもので、またシートＳには必
要に応じて導体層接続用のスルーホールが形成される。The sheet S is formed by applying the same slurry as the first embodiment on the upper surface of the film by the doctor blade method. On the upper surface of the sheet S, a groove D2 having a width dimension larger than the printed shape of the conductor layer is formed with a predetermined depth dimension. The groove D2 is formed by laser light irradiation as in the first embodiment, and a through hole for connecting a conductor layer is formed in the sheet S if necessary.
【００２７】コイル用導体層Ｐは第１実施例同様の導電
ペーストを厚膜法によって上記溝Ｄ２内に該溝Ｄ２より
も幅寸法が小さなパターン形状で印刷することで形成さ
れている。シートＳにスルーホールが形成されている場
合はこの導体層形成と同時に該スルーホール内に導電ペ
ーストが充填される。この導体層Ｐは大部分を溝Ｄ１内
に受容されその上面部分をシートＳの上面から僅かに突
出しており、また該導体層Ｐと溝Ｄ２内の幅方向の面と
の間には両者の幅寸法の差に基づく隙間Ｅが形成され
る。The coil conductor layer P is formed by printing a conductive paste similar to that of the first embodiment in the groove D2 in a pattern shape having a width smaller than that of the groove D2 by a thick film method. When a through hole is formed in the sheet S, the conductive paste is filled in the through hole at the same time when the conductor layer is formed. Most of the conductor layer P is received in the groove D1 and its upper surface portion slightly protrudes from the upper surface of the sheet S. Further, between the conductor layer P and the widthwise surface in the groove D2, both of them are formed. A gap E is formed based on the difference in width dimension.
【００２８】導体層形成後のシートＳの上に他のシート
を積層し圧着すると、該圧着力により導体層Ｐの幅方向
部分が上記隙間Ｅ内に侵入して該導体層Ｐの上面が降下
し、これにより圧着時に上側シートの導体層接触部分に
加わる応力が軽減され同部分の高密度化が防止される。
本実施例でも第１実施例と同様の効果を得ることができ
る。When another sheet is laminated on the sheet S on which the conductor layer has been formed and pressure-bonded thereto, the widthwise portion of the conductor layer P penetrates into the gap E by the pressure force and the upper surface of the conductor layer P descends. As a result, the stress applied to the conductor layer contact portion of the upper sheet at the time of pressure bonding is reduced, and the density increase of the portion is prevented.
Also in this embodiment, the same effect as in the first embodiment can be obtained.
【００２９】図５及び図６は本発明の第３実施例に係る
もので、図５はシートの部分断面図、図６は溝内に導体
層を形成した状態を示す図である。FIGS. 5 and 6 relate to the third embodiment of the present invention. FIG. 5 is a partial sectional view of the sheet, and FIG. 6 is a view showing a state in which a conductor layer is formed in the groove.
【００３０】シートＳは第１実施例同様のスラリーをド
クターブレード法によってフィルム上面に塗工すること
で形成されている。このシートＳの上面には導体層の印
刷形状とほぼ合致する溝Ｄ３が所定の深さ寸法で形成さ
れており、また該溝Ｄ３の開口端に曲面状の面取り部Ｄ
３ａが該溝Ｄ３に沿って設けられている。面取り部Ｄ３
ａの形状は図示例のような曲面状のものの他、テーパ状
のものであってもよい。この溝Ｄ３は第１実施例同様の
レーザ光照射によって形成されるもので、またシートＳ
には必要に応じて導体層接続用のスルーホールが形成さ
れる。The sheet S is formed by applying the same slurry as the first embodiment on the upper surface of the film by the doctor blade method. A groove D3 that substantially matches the printed shape of the conductor layer is formed on the upper surface of the sheet S with a predetermined depth, and a curved chamfered portion D is formed at the opening end of the groove D3.
3a is provided along the groove D3. Chamfer D3
The shape of a may be a curved shape as shown in the drawing, or may be a tapered shape. This groove D3 is formed by laser light irradiation similar to the first embodiment, and the sheet S
A through hole for connecting a conductor layer is formed in the conductor as required.
【００３１】コイル用導体層Ｐは第１実施例同様の導電
ペーストを厚膜法によって上記溝Ｄ３内に所定のパター
ン形状で印刷することで形成されている。シートＳにス
ルーホールが形成されている場合はこの導体層形成と同
時に該スルーホール内に導電ペーストが充填される。こ
の導体層Ｐは大部分を溝Ｄ１内に受容されその上面部分
をシートＳの上面から僅かに突出しており、また該導体
層Ｐと溝Ｄ１開口端の面取り部Ｄ３ａとの間には該面取
り部Ｄ３ａの大きさに応じた隙間Ｅが形成される。The coil conductor layer P is formed by printing a conductive paste similar to that of the first embodiment in the groove D3 in a predetermined pattern by a thick film method. When a through hole is formed in the sheet S, the conductive paste is filled in the through hole at the same time when the conductor layer is formed. Most of the conductor layer P is received in the groove D1 and its upper surface portion slightly protrudes from the upper surface of the sheet S, and the chamfered portion is formed between the conductor layer P and the chamfered portion D3a at the opening end of the groove D1. A gap E corresponding to the size of the portion D3a is formed.
【００３２】導体層形成後のシートＳの上に他のシート
を積層し圧着すると、該圧着力により導体層Ｐの面取り
部近傍部分が上記隙間Ｅ内に侵入して該導体層Ｐの上面
が降下し、これにより圧着時に上側シートの導体層接触
部分に加わる応力が軽減され同部分の高密度化が防止さ
れる。本実施例でも第１実施例と同様の効果を得ること
ができる。When another sheet is laminated on the sheet S on which the conductor layer has been formed and pressure-bonded thereto, the pressure-bonding force causes the portion near the chamfered portion of the conductor layer P to enter the gap E so that the upper surface of the conductor layer P is By this, the stress applied to the conductor layer contact portion of the upper sheet at the time of pressure bonding is reduced, and high density of the portion is prevented. Also in this embodiment, the same effect as in the first embodiment can be obtained.
【００３３】以上、本発明を積層チップインダクタに適
用した例を示したが、本発明はグリーンシートの溝内に
コイル用導体層を形成するようにした他の積層型電子部
品、例えば積層トランス，ＬＣ複合部品等にも幅広く適
用でき同様の効果を得ることができる。An example in which the present invention is applied to a laminated chip inductor has been described above. However, the present invention shows another laminated electronic component, such as a laminated transformer, in which a conductor layer for a coil is formed in a groove of a green sheet. It can be widely applied to LC composite parts and the like, and similar effects can be obtained.
【００３４】[0034]
【発明の効果】以上詳述したように、請求項１，２及び
３の発明によれば、シート表面の溝内にコイル用導体層
を形成しているので、溝深さ分だけ導体層の突出高さを
小さくして部品の小型化に貢献できる。また、溝内に形
成された導体層の一部を各隙間に侵入させることで圧着
時にシートの導体層接触部分に加わる応力を軽減して同
部分の高密度化を防止し、焼成後の透磁率変化を回避し
て安定した電気特性を得ることができる。As described above in detail, according to the first, second and third aspects of the invention, since the coil conductor layer is formed in the groove on the sheet surface, the conductor layer is formed by the groove depth. The protruding height can be reduced to contribute to the miniaturization of parts. In addition, by inserting a part of the conductor layer formed in the groove into each gap, the stress applied to the conductor layer contact portion of the sheet during pressure bonding is reduced to prevent densification of the same portion, and the transparency after firing is reduced. It is possible to avoid changes in magnetic susceptibility and obtain stable electrical characteristics.
【００３５】請求項４の発明によれば、レーザ光照射に
よりシートの一部を除去して上記各溝を形成しているの
で、金型押圧で溝を形成する場合のように溝底面部分が
高密度化されず、また復元等による溝寸法変化を確実に
防止でき、上記の特性安定化に貢献できる。According to the fourth aspect of the present invention, since the grooves are formed by removing a part of the sheet by irradiating the laser beam, the groove bottom surface portion is formed as in the case of forming the grooves by pressing the mold. It is not possible to increase the density, and it is possible to reliably prevent the groove dimension change due to restoration or the like, which contributes to the stabilization of the above characteristics.
【図１】本発明の第１実施例に係るシートの部分断面図FIG. 1 is a partial sectional view of a seat according to a first embodiment of the present invention.
【図２】溝内に導体層を形成した状態を示す図FIG. 2 is a diagram showing a state in which a conductor layer is formed in a groove.
【図３】本発明の第２実施例に係るシートの部分断面図FIG. 3 is a partial sectional view of a seat according to a second embodiment of the present invention.
【図４】溝内に導体層を形成した状態を示す図FIG. 4 is a diagram showing a state in which a conductor layer is formed in a groove.
【図５】本発明の第３実施例に係るシートの部分断面図FIG. 5 is a partial sectional view of a seat according to a third embodiment of the present invention.
【図６】溝内に導体層を形成した状態を示す図FIG. 6 is a view showing a state in which a conductor layer is formed in the groove.
【図７】積層チップインダクタの製造手順を示す図FIG. 7 is a diagram showing a manufacturing procedure of a multilayer chip inductor.
【図８】従来例を示すシートの上面図FIG. 8 is a top view of a seat showing a conventional example.
【図９】図８のＡ−Ａ線拡大断面図9 is an enlarged sectional view taken along line AA of FIG.
【図１０】従来例の問題点を説明するための図FIG. 10 is a diagram for explaining the problems of the conventional example.
Ｓ…シート、Ｄ１，Ｄ２，Ｄ３…溝、Ｄ１ａ…凹凸部、
Ｄ３ａ…面取り部、Ｅ…隙間、Ｐ…導体層。S ... Sheet, D1, D2, D3 ... Groove, D1a ... Uneven portion,
D3a ... chamfered portion, E ... gap, P ... conductor layer.
Claims (4)
程と、該溝内に厚膜法によってコイル用導体層を形成す
る工程と、これら工程を経て得られた複数のグリーンシ
ートを積層，圧着する工程とを具備した積層型電子部品
の製造方法において、 上記溝形成工程で溝内面に凹凸を設けた、 ことを特徴とする積層型電子部品の製造方法。1. A step of forming a groove on a surface of a green sheet, a step of forming a conductor layer for a coil in the groove by a thick film method, and laminating and pressure bonding a plurality of green sheets obtained through these steps. The method for producing a laminated electronic component according to claim 1, wherein the groove inner surface is provided with irregularities in the groove forming step.
程と、該溝内に厚膜法によってコイル用導体層を形成す
る工程と、これら工程を経て得られた複数のグリーンシ
ートを積層，圧着する工程とを具備した積層型電子部品
の製造方法において、 上記溝形成工程で形成される溝幅を導体層の幅よりも大
きくした、 ことを特徴とする積層型電子部品の製造方法。2. A step of forming a groove on the surface of a green sheet, a step of forming a conductor layer for a coil in the groove by a thick film method, and laminating and pressure bonding a plurality of green sheets obtained through these steps. The method for manufacturing a laminated electronic component according to claim 1, wherein the groove width formed in the groove forming step is larger than the width of the conductor layer.
程と、該溝内に厚膜法によってコイル用導体層を形成す
る工程と、これら工程を経て得られた複数のグリーンシ
ートを積層，圧着する工程とを具備した積層型電子部品
の製造方法において、 上記溝形成工程で溝開口端に面取り部を設けた、 ことを特徴とする積層型電子部品の製造方法。3. A step of forming a groove on the surface of a green sheet, a step of forming a conductor layer for a coil in the groove by a thick film method, and laminating and pressure bonding a plurality of green sheets obtained through these steps. The method for manufacturing a laminated electronic component according to claim 1, wherein a chamfered portion is provided at an opening end of the groove in the groove forming step.
電子部品の製造方法。4. The method for manufacturing a laminated electronic component according to claim 1, wherein the groove is formed by laser light irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5332166A JP2999357B2 (en) | 1993-12-27 | 1993-12-27 | Manufacturing method of multilayer electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5332166A JP2999357B2 (en) | 1993-12-27 | 1993-12-27 | Manufacturing method of multilayer electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07192954A true JPH07192954A (en) | 1995-07-28 |
| JP2999357B2 JP2999357B2 (en) | 2000-01-17 |
Family
ID=18251898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5332166A Expired - Fee Related JP2999357B2 (en) | 1993-12-27 | 1993-12-27 | Manufacturing method of multilayer electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2999357B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5948200A (en) * | 1996-07-26 | 1999-09-07 | Taiyo Yuden Co., Ltd. | Method of manufacturing laminated ceramic electronic parts |
| US6345434B1 (en) | 1998-07-06 | 2002-02-12 | Tdk Corporation | Process of manufacturing an inductor device with stacked coil pattern units |
| US6362716B1 (en) | 1998-07-06 | 2002-03-26 | Tdk Corporation | Inductor device and process of production thereof |
| US6820320B2 (en) | 1998-07-06 | 2004-11-23 | Tdk Corporation | Process of making an inductor device |
| JP2005167029A (en) * | 2003-12-03 | 2005-06-23 | Tdk Corp | Laminated inductor |
| JP2011029222A (en) * | 2009-07-21 | 2011-02-10 | Murata Mfg Co Ltd | Electronic component |
| JP2013042102A (en) * | 2011-08-11 | 2013-02-28 | Samsung Electro-Mechanics Co Ltd | Coil component and manufacturing method thereof |
| CN109923950A (en) * | 2016-11-11 | 2019-06-21 | 株式会社村田制作所 | The manufacturing method of ceramic substrate and ceramic substrate |
-
1993
- 1993-12-27 JP JP5332166A patent/JP2999357B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5948200A (en) * | 1996-07-26 | 1999-09-07 | Taiyo Yuden Co., Ltd. | Method of manufacturing laminated ceramic electronic parts |
| US6200405B1 (en) | 1996-07-26 | 2001-03-13 | Taiyo Yuden Co., Ltd. | Method of manufacturing laminated ceramic electronic parts |
| US6345434B1 (en) | 1998-07-06 | 2002-02-12 | Tdk Corporation | Process of manufacturing an inductor device with stacked coil pattern units |
| US6362716B1 (en) | 1998-07-06 | 2002-03-26 | Tdk Corporation | Inductor device and process of production thereof |
| US6820320B2 (en) | 1998-07-06 | 2004-11-23 | Tdk Corporation | Process of making an inductor device |
| US7173508B2 (en) | 1998-07-06 | 2007-02-06 | Tdk Corporation | Inductor device |
| JP2005167029A (en) * | 2003-12-03 | 2005-06-23 | Tdk Corp | Laminated inductor |
| JP2011029222A (en) * | 2009-07-21 | 2011-02-10 | Murata Mfg Co Ltd | Electronic component |
| JP2013042102A (en) * | 2011-08-11 | 2013-02-28 | Samsung Electro-Mechanics Co Ltd | Coil component and manufacturing method thereof |
| CN109923950A (en) * | 2016-11-11 | 2019-06-21 | 株式会社村田制作所 | The manufacturing method of ceramic substrate and ceramic substrate |
| US10999927B2 (en) | 2016-11-11 | 2021-05-04 | Murata Manufacturing Co., Ltd. | Ceramic substrate and method for manufacturing ceramic substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2999357B2 (en) | 2000-01-17 |
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