JPH07186041A - Polishing method and polishing device - Google Patents
Polishing method and polishing deviceInfo
- Publication number
- JPH07186041A JPH07186041A JP34890093A JP34890093A JPH07186041A JP H07186041 A JPH07186041 A JP H07186041A JP 34890093 A JP34890093 A JP 34890093A JP 34890093 A JP34890093 A JP 34890093A JP H07186041 A JPH07186041 A JP H07186041A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- polishing
- finishing
- agent
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Cyclones (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ウエーハ、ガラス、セ
ラミック、金属一般等のプレートに対する研磨方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing method for plates such as wafers, glass, ceramics and metals in general.
【０００２】[0002]
【従来の技術】研磨方法の基本的手段の一つに、回転し
ているテーブル上に研磨剤を供給し、テーブルに対して
静止、平行移動又は曲線運動関係に保持されたウエーハ
等の研磨素材を研磨、研削するものである。この公知手
段は、研磨剤として、荒仕上げ用、（１５〜４４μ粒
径）中仕上げ用（５〜２０μ粒径）、仕上げラッピング
用（0.５〜５μ粒径）に仕訳された研磨剤を購入し、こ
れらを仕上加工順に応じてテーブル上に供給して研磨、
研削を行なう。2. Description of the Related Art One of the basic means of a polishing method is to supply a polishing agent onto a rotating table and hold a polishing material such as a wafer held in a stationary, parallel or curvilinear relationship with the table. Are to be polished and ground. This publicly known means uses, as an abrasive, an abrasive which has been classified for rough finishing, (15 to 44 μ particle diameter), medium finishing (5 to 20 μ particle diameter) and finish lapping (0.5 to 5 μ particle diameter). We purchase and supply these to the table according to the finishing processing order and polish,
Grind.
【０００３】[0003]
【発明が解決しようとする課題】前述した従来技術で
は、たとえば、５０枚の研磨素材の荒仕上げをした後、
荒仕上げ用研磨剤を新しいものと取り換える。中仕上げ
や仕上げラッピング用研磨剤も、所定数の研磨素材の加
工をした後、新しい研磨剤に取り換えられる。これは、
研磨、研削仕上げにより砥粒子の平均粒径が小さくなり
所望の仕上げが不可能になることによる。粒径の落ちた
研磨剤は、捨てられる。これは研磨剤の不経済な利用法
となっている。本発明は、前述した従来技術の不具合を
解消させることを解決すべき課題とする。In the above-mentioned prior art, for example, after 50 sheets of abrasive material are roughly finished,
Replace the rough finish abrasive with a new one. The polishing agent for intermediate finishing and finishing lapping is also replaced with a new polishing agent after processing a predetermined number of polishing materials. this is,
This is because polishing and grinding finish reduce the average particle size of the abrasive particles, making it impossible to achieve the desired finish. Abrasive with reduced grain size is discarded. This has become an uneconomical use of abrasives. An object of the present invention is to solve the above-mentioned problems of the conventional technology.
【０００４】[0004]
【課題を解決するための手段】本発明は、前述した課題
を解決するために、サイクロンによる分流分級原理を用
いて、研磨剤中の砥粒を分別し、仕上げ加工状態に適し
た平均粒径を有する研磨剤を提供する基本的手段を採用
する。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention separates abrasive grains in an abrasive by using a flow classification principle by a cyclone to obtain an average particle size suitable for a finish processing state. The basic means of providing an abrasive having
【０００５】具体的には、本発明は、複数個のサイクロ
ン式砥粒分流分級装置と、該装置により分流分級された
砥粒を有する研磨剤を受ける複数個の受け器と、各受け
器からの研削剤の供給を受ける複数個の研削機と、各研
削機からの研削剤を受け且つ最初の砥粒分流分級装置に
連結された原剤器とを有する研磨装置を提供する。Specifically, the present invention is directed to a plurality of cyclone type abrasive grain sorting and classifying devices, a plurality of receivers for receiving an abrasive having abrasive grains that have been sorted and classified by the device, and a plurality of receivers. A polishing apparatus having a plurality of grinding machines supplied with the grinding agent and a raw material agent receiving the grinding agent from each grinding machine and connected to an initial abrasive grain dividing / classifying apparatus.
【０００６】さらに、本発明は、複数個のサイクロン式
砥粒分流分級装置により分別された研磨剤の内、研磨素
材が装填された研削機に、研磨素材の加工状態に適した
平均砥粒の研磨剤を選択供給する研磨方法を提供する。Further, according to the present invention, among the abrasives sorted by a plurality of cyclone type abrasive grain flow classifiers, a grinding machine loaded with an abrasive raw material is provided with an average abrasive grain suitable for the processing state of the abrasive raw material. A polishing method for selectively supplying an abrasive is provided.
【０００７】[0007]
【作用】サイクロン式砥粒分流分級装置は、研磨剤を荒
仕上げ用、中仕上げ用、さらには仕上げラッピング用の
平均砥粒を有する研磨剤に分別できるので、分別された
研磨剤を各研磨剤に最っとも適した加工条件の下に供給
できる。このため、一定量の研磨剤を循環させて利用さ
れる。[Function] In the cyclone type abrasive grain sorting and classifying device, the abrasives can be sorted into the abrasives having the average abrasive grains for rough finishing, intermediate finishing and final lapping. Can be supplied under the most suitable processing conditions. Therefore, a certain amount of polishing agent is circulated and used.
【０００８】[0008]
【実施例】図１を参照する。ウエーハ等の研磨素材１を
コンベヤ２を用いて、回転自在のテーブル３を有する研
削機を複数個備える。研削機は、荒研削機４、中研削機
５、細研削機６、仕上げラッピング研削機７よりなる。
各研削機からのスラリー状研磨剤は、原剤器８に戻され
る。サイクロン式砥粒分流分級装置９、１０、１１は、
三液分離サイクロン式のものが用いられ、このタイプの
分流分級装置として実公昭５３−１６５５号公報に開示
される装置や湿式サイクロン分流分級装置（大石機械製
作所製ＴＲ−１０型）が利用可能である。原剤器８内に
炭化珪素、ダイヤモンド、又はアルミナ系等を主成分と
するスラリー状研磨剤を原剤として貯える。該原剤は、
Ａ２０〜４０μ；Ｂ１５〜３０μ；Ｃ１０〜２０μ；Ｄ
８〜１５μ；Ｅ５〜１０μ；Ｆ0.５〜３μの平均粒径の
砥粒を含む。ＡとＢは荒仕上げ用、ＣとＤは中仕上げ
用、Ｅは細仕上げ用、Ｆは最終仕上のための仕上げラッ
ピング用として、たとえば、活用される。EXAMPLE Referring to FIG. A plurality of grinding machines having a rotatable table 3 using a conveyor 2 for polishing material 1 such as a wafer are provided. The grinder includes a rough grinder 4, a medium grinder 5, a fine grinder 6, and a finishing lapping grinder 7.
The slurry-like abrasive from each grinder is returned to the base material container 8. The cyclone type abrasive grain sorting and classifying devices 9, 10, 11 are
A three-liquid separation cyclone type is used, and as this type of flow classifying device, the device disclosed in Japanese Utility Model Publication No. 53-1655 and a wet cyclone flow classifying device (TR-10 type manufactured by Oishi Machinery Co., Ltd.) can be used. is there. A slurry abrasive containing silicon carbide, diamond, or alumina as a main component is stored as a stock in the stock solution container 8. The drug substance is
A20-40μ; B15-30μ; C10-20μ; D
8 to 15 µ; E5 to 10 µ; F 0.5 to 3 µ containing an average grain size of abrasive grains. For example, A and B are used for rough finishing, C and D are for medium finishing, E is for fine finishing, and F is for finishing lapping for final finishing.
【０００９】各サイクロン式砥粒分流分級装置９、１
０、１１は、下出口１２、横出口１３、上出口１４及び
入口１５を有す。第１の分流分級装置９の入口１５を原
剤器８に結合し、Ａ−Ｆの粒径の砥粒を含有するスラリ
ー状の研磨剤を第１の分流分級装置９の入口１５にポン
プを用いて供給する。第１の分流分級装置９は、下出口
１２よりＡ−Ｆ、横出口１３よりＤ−Ｆ、上出口１４よ
り下の砥粒を分別する。下出口１２からの研磨剤のＡ−
Ｆは第１容器１６を介して第２の分流分級装置１０の入
口１５に供給する。横出口１３からの研磨剤Ｃ−Ｆは第
２容器１７を介して第３の分流分級装置１１に供給され
る。上出口１４からの研磨剤Ｆは微粒粉スラリー液用容
器１８に貯えられる。Cyclone type abrasive grain dividing / classifying devices 9, 1
0 and 11 have a lower outlet 12, a side outlet 13, an upper outlet 14 and an inlet 15. The inlet 15 of the first flow classifier 9 is connected to the raw material container 8, and a slurry-like abrasive containing abrasive particles of A-F particle size is pumped to the inlet 15 of the first flow classifier 9. Supply using. The first separation / classification device 9 separates the abrasive particles from the lower outlet 12 into AF, from the lateral outlet 13 into DF, and from the upper outlet 14 below. A- of the abrasive from the lower outlet 12
F is supplied to the inlet 15 of the second separation / classification device 10 through the first container 16. The abrasive C-F from the lateral outlet 13 is supplied to the third flow classifying device 11 via the second container 17. The abrasive F from the upper outlet 14 is stored in the fine particle slurry liquid container 18.
【００１０】第２の分流分級装置１０は下出口１２より
研磨剤Ａ、Ｂを粗粒粉スラリー液用容器１９に供給す
る。横出口１３からの研磨剤Ｃ−Ｆが第２容器１７に入
る。上出口１４からの研磨剤Ｆが微粒粉スラリー液用容
器１８内に貯えられる。The second flow classifier 10 supplies the abrasives A and B to the coarse particle powder slurry container 19 from the lower outlet 12. The abrasive C-F from the side outlet 13 enters the second container 17. The abrasive F from the upper outlet 14 is stored in the fine particle slurry liquid container 18.
【００１１】第２容器１７内の研磨剤Ｃ−Ｆは、第３の
分流分級装置１１の入口１５に供給され、砥粒の分別が
成される。その下出口１２から研磨剤Ｃ、Ｄが分流さ
れ、この研磨剤Ｃ、Ｄが中粒粉スラリー液用容器２０内
に貯えられ、横出口１３からの研磨剤Ｅが細粒粉スラリ
ー液用容器２１内に貯えられる。上出口１４からの研磨
剤Ｆは微粒粉スラリー液用容器１８に貯えられる。The abrasive C-F in the second container 17 is supplied to the inlet 15 of the third flow classifier 11 to separate the abrasive grains. The abrasives C and D are diverted from the lower outlet 12, the abrasives C and D are stored in the container 20 for medium-sized powder slurry, and the abrasive E from the lateral outlet 13 is a container for fine-grained slurry. It is stored in 21. The abrasive F from the upper outlet 14 is stored in the fine particle slurry liquid container 18.
【００１２】粗粒粉スラリー液用容器１９を荒研削機４
に連結し、中粒粉スラリー液用容器２０を中研削機５に
連結し、細粒粉スラリー液用容器２１を細研削機６に連
結し、微粒粉スラリー液用容器１８を仕上げラッピング
研削機７に連結する。The coarse-grained powder slurry container 19 is attached to the rough grinding machine 4
To the middle grinding machine 5, the fine grain slurry solution container 21 to the fine grinding machine 6, and the fine grain slurry solution container 18 to a finishing lapping grinder. Connect to 7.
【００１３】作業開始に際して、各研削機と分流分級装
置のためのポンプＰとモータＭ、並びに各コンベヤの動
力源を作動状態とさせる。各容器１７、１８、１９、２
０、２１内の研磨剤が、予め決められた各研削機４、
５、６、７に供給され、研磨素材１が、荒仕上げ、中仕
上げ、細仕上げ、最終仕上げラッピング研削を順次行な
う。各研削機４、５、６、７内の研磨剤は原剤器８に戻
される。研磨剤は、循環して使用される。たとえば、粗
粒粉スラリー液用容器１９内の研磨剤が平均粒度が小さ
くなることで不足傾向になれば、該容器１９に適する平
均粒径の研磨剤を補充すればよい。又、平均粒径が、作
業回数が進むにつれて小さくなり、たとえば、微粒粉ス
ラリー液用容器１８内の研磨剤が増加すれば、余剰分を
除去すればよい。At the start of work, the pumps P and motors M for the respective grinders and the flow classifiers, and the power source for the respective conveyors are activated. Each container 17, 18, 19, 2
Abrasives in 0 and 21 are the predetermined grinding machines 4,
5, 6, and 7, the polishing material 1 is subjected to rough finishing, intermediate finishing, fine finishing, and final finishing lapping grinding in order. The abrasive in each of the grinding machines 4, 5, 6, 7 is returned to the base material container 8. The polishing agent is circulated for use. For example, if the average particle size of the abrasive in the coarse-grain powder slurry liquid container 19 tends to become insufficient, the abrasive having an average particle size suitable for the container 19 may be replenished. Further, if the average particle diameter becomes smaller as the number of operations increases, and, for example, the amount of the abrasive in the fine particle slurry liquid container 18 increases, the surplus portion may be removed.
【００１４】図１の例は、複数のテーブル３を用いる方
法を示したが、図２に１個のテーブル３を用いた加工方
法を示す。ウエーハ等の研磨素材１をコンベヤ２を用い
て研削機２２の回転テーブル３に対して静止、平行移動
又は曲線運動状態に保持させる。テーブル３をモータＭ
で回転させる。研削機２２を原剤器８に接続し、研削器
２２からのスラリー状の研削剤を原剤器８に戻す。図１
で用いたものと同じサイクロン式分流分級装置９、１０
を用いる。原剤器８内の研磨剤は、Ａ１５〜４４μ、Ｂ
５〜２０μ、Ｃ0.５〜５μの平均粒径の炭化珪素、ダイ
ヤモンド、又はアルミナ系等を含有するスラリー状のも
のである。第１の分流分級装置９に入ったスラリー状研
磨剤は、下出口１２より研磨剤Ａ−Ｃ、横出口１３より
研磨剤Ｂ、上出口１４より研磨剤Ｃを分流分級吐出す
る。While the example of FIG. 1 shows a method using a plurality of tables 3, FIG. 2 shows a processing method using a single table 3. The polishing material 1 such as a wafer is held stationary, in parallel or in a curved motion with respect to the rotary table 3 of the grinder 22 using the conveyor 2. Table 3 is motor M
Rotate with. The grinder 22 is connected to the drug substance device 8 and the slurry-like abrasive from the grinder 22 is returned to the drug substance device 8. Figure 1
Cyclone type flow classifiers 9 and 10 same as those used in
To use. The polishing agent in the drug substance container 8 is A15-44μ, B
It is in the form of a slurry containing silicon carbide, diamond, or alumina having an average particle diameter of 5 to 20 μm and C 0.5 to 5 μm. The slurry-like polishing agent that has entered the first classification / classification device 9 discharges and separates the polishing agent A-C from the lower outlet 12, the polishing agent B from the side outlet 13, and the polishing agent C from the upper outlet 14.
【００１５】下出口１２より吐出した研磨剤は、容器１
６を介して、第２の分流分級装置１０の入口１５に供給
される。第２の分流分級装置１０は、下出口１２より研
磨剤Ａ、横出口１３より研磨剤Ｂ、上出口１４より研磨
剤Ｃを分流分級分別して吐出する。第１と第２の分流分
級装置９、１０の横出口１３からの研磨剤Ｂは合流して
一つのライン２３を作り、上出口１４からの研磨剤Ｃは
合流して一つのライン２４を作る。下出口１２からのラ
イン２５を含む各ライン２３、２４は、電磁弁２６、２
７、２８を有す。各ライン２３、２４、２５は研削機２
２上の研磨素材１の上方に開口する。The polishing agent discharged from the lower outlet 12 is the container 1
It is supplied to the inlet 15 of the second separation / classification device 10 via 6. The second classification and classification apparatus 10 classifies and discharges the abrasive A through the lower outlet 12, the abrasive B through the lateral outlet 13, and the abrasive C through the upper outlet 14. The abrasives B from the lateral outlets 13 of the first and second flow classifiers 9 and 10 merge to form one line 23, and the abrasives C from the upper outlet 14 merge to form one line 24. . Each of the lines 23 and 24 including the line 25 from the lower outlet 12 includes solenoid valves 26 and 2.
7 and 28. Each line 23, 24, 25 is a grinder 2
Open above the polishing material 1 on 2.
【００１６】加工作業の開始に際して、ポンプＰとモー
タＭ、並びにコンベヤ２を作動状態とさせる。原剤器８
からの研磨剤は、第１と第２の分流分級装置９、１０に
より分流分級分別され、ライン２５に荒仕上げ用の研磨
剤Ａ、ライン２３に中仕上げ用の研磨剤Ｂ、ライン２４
に最終仕上げ用の研磨剤Ｃを供給する。回転テーブル３
上の研磨素材１に対して研磨剤Ａをライン２５の電磁弁
２６を開にして供給し、荒仕上げする。次いで、電磁弁
２６を閉にし、電磁弁２７を開にし、ライン２３から研
磨剤Ｂを研磨素材１に供給し、中仕上げをする。中仕上
げ完了とともに、電磁弁２７を閉じ、電磁弁２８を開に
し、ライン２４内の研磨剤Ｃを研削機２２内に供給し、
最終ラッピング仕上げをする。好ましくは、電磁弁２
６、２７、２８は三方向弁で、一つの電磁弁が開状態で
研磨剤をテーブル３上に供給している間、他の電磁弁が
研磨剤を原剤器８に直接戻すようにし、分流分級装置の
サイクロン効率の低下を防止する。三方向弁に代えて、
二方向弁を用い、二方向弁を各ライン２３、２４、２５
に設けたタンク（図示）に接続してもよい。最終仕上げ
を終了させると、研磨素材１はテーブル３からコンベヤ
２に移され、加工を必要とする新しい研磨素材１をテー
ブル３上に配し、前述した作業をくり返す。At the start of the processing operation, the pump P, the motor M, and the conveyor 2 are activated. API 8
The abrasive from No. 1 is divided and classified by the first and second flow classifiers 9 and 10, and a line 25 is used for rough finishing A, a line 23 is used for intermediate finishing B, and a line 24 is used.
Is supplied with polishing agent C for final finishing. Rotating table 3
The abrasive A is supplied to the upper polishing material 1 by opening the solenoid valve 26 of the line 25 to rough finish. Next, the electromagnetic valve 26 is closed, the electromagnetic valve 27 is opened, the abrasive B is supplied to the polishing material 1 from the line 23, and the intermediate finishing is performed. When the intermediate finishing is completed, the solenoid valve 27 is closed, the solenoid valve 28 is opened, and the abrasive C in the line 24 is supplied into the grinder 22.
Final wrapping finish. Preferably, the solenoid valve 2
Reference numerals 6, 27, and 28 denote three-way valves. While one solenoid valve supplies the polishing agent onto the table 3 in an open state, the other solenoid valve returns the polishing agent directly to the drug substance container 8, Prevents the reduction of cyclone efficiency of the flow classifier. Instead of a three-way valve,
A two-way valve is used, and the two-way valve is used for each line 23, 24, 25.
You may connect to the tank (illustration) provided in the. When the final finishing is completed, the polishing material 1 is transferred from the table 3 to the conveyor 2, a new polishing material 1 requiring processing is placed on the table 3, and the above-described work is repeated.
【００１７】各仕上げ加工に用いた研磨剤Ａ、Ｂ、Ｃ
は、原剤器８に集められ、再び、第１の分流分級装置９
に供給する。即ち、図１の例と同じように、研磨剤を循
環させて用い、各ライン２３、２４、２５内の研磨剤の
量を考慮して、不足傾向の粒径の砥粒を補充し、余剰傾
向のものを排出する。Abrasives A, B, C used for each finishing process
Are collected in the drug substance dispenser 8 and again the first diversion classifier 9
Supply to. That is, as in the example of FIG. 1, the abrasive is circulated and used, the amount of the abrasive in each of the lines 23, 24, 25 is taken into consideration, and the abrasive grains having a grain size that tends to be insufficient are replenished to cause an excess. Eject ones that tend.
【００１８】[0018]
【効果】本発明では、研磨剤の循環利用をし、研磨素材
の連続自動加工を経済的に可能にする。さらに、一つの
テーブルで研磨素材に対し、荒仕上げ、中仕上げ、最終
仕上げを連続的に行うことは、加工時間の短縮に有効で
ある。[Effect] According to the present invention, the polishing agent is circulated and used, and continuous automatic processing of the polishing material is economically enabled. Further, it is effective to reduce the processing time by continuously performing rough finishing, intermediate finishing and final finishing on the polishing material with one table.
【図１】複数のテーブルを用いた本発明の例を示す図で
ある。FIG. 1 is a diagram showing an example of the present invention using a plurality of tables.
【図２】一個のテーブルを用いた例を示す図である。FIG. 2 is a diagram showing an example using one table.
１ 研磨素材 ３ テーブル ４、５、６、７、２２ 研削機 ８ 原剤器 ９、１０、１１ サイクロン式砥粒分流分級装置 １２ 下出口 １３ 横出口 １４ 上出口 １５ 入口 １８、１９、２０、２１ スラリー液用容器 ２３、２４、２５ ライン ２６、２７、２８ 電磁弁 1 Abrasive Material 3 Table 4, 5, 6, 7, 22 Grinding Machine 8 Raw Material Agent 9, 10, 11 Cyclone Type Abrasive Grain Flow Sorting Device 12 Lower Outlet 13 Side Outlet 14 Upper Outlet 15 Inlet 18, 19, 20, 21 Slurry liquid container 23, 24, 25 Line 26, 27, 28 Solenoid valve
Claims (2)
と、該装置により分流分級された砥粒を有する研磨剤を
受ける複数個の受け器と、各受け器からの研削剤の供給
を受ける複数個の研削機と、各研削機からの研削剤を受
け且つ最初の砥粒分流分級装置に連結された原剤器とを
有する研磨装置。1. A plurality of cyclone type abrasive grain classification / classification devices, a plurality of receivers for receiving an abrasive having abrasive grains divided and classified by the device, and a supply of an abrasive from each receiver. A polishing apparatus having a plurality of grinding machines and a raw material agent container that receives the grinding agent from each grinding machine and is connected to an initial abrasive grain dividing / classifying device.
により分別された研磨剤の内、研磨素材が装填された研
削機に、研磨素材の加工状態に適した平均砥粒の研磨剤
を選択供給する研磨方法。2. An abrasive having an average abrasive grain suitable for the processing state of the abrasive material is selected from among the abrasives sorted by a plurality of cyclone type abrasive grain flow classifiers for a grinding machine loaded with the abrasive material. Supplying polishing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5348900A JP2737108B2 (en) | 1993-12-28 | 1993-12-28 | Polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5348900A JP2737108B2 (en) | 1993-12-28 | 1993-12-28 | Polishing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07186041A true JPH07186041A (en) | 1995-07-25 |
| JP2737108B2 JP2737108B2 (en) | 1998-04-08 |
Family
ID=18400146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5348900A Expired - Lifetime JP2737108B2 (en) | 1993-12-28 | 1993-12-28 | Polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2737108B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0798080A1 (en) * | 1996-03-27 | 1997-10-01 | Shin-Etsu Handotai Company Limited | Lapping apparatus and method |
| EP0822033A1 (en) * | 1996-07-29 | 1998-02-04 | Integrated Process Equipment Corp. | Slurry recycling in chemical-mechanical polishing (CMP) apparatus |
| JP2006212626A (en) * | 2005-02-04 | 2006-08-17 | Samsung Electronics Co Ltd | Cyclone, slurry separating apparatus having the same, and slurry supply system and method utilizing the apparatus |
| JP2008541816A (en) * | 2005-05-27 | 2008-11-27 | ダイソン・テクノロジー・リミテッド | Dust and dust cyclone separator |
| US7867306B2 (en) | 2005-05-27 | 2011-01-11 | Dyson Technology Limited | Multistage cyclonic separating apparatus |
| JP2016055381A (en) * | 2014-09-09 | 2016-04-21 | 信越半導体株式会社 | Lapping method |
| CN108927735A (en) * | 2017-05-23 | 2018-12-04 | 天津滨海光热反射技术有限公司 | A kind of energy-saving burnishing device and polishing powder solution recycling method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0457672A (en) * | 1990-06-27 | 1992-02-25 | Komatsu Ltd | Method and device for shot peening |
-
1993
- 1993-12-28 JP JP5348900A patent/JP2737108B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0457672A (en) * | 1990-06-27 | 1992-02-25 | Komatsu Ltd | Method and device for shot peening |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0798080A1 (en) * | 1996-03-27 | 1997-10-01 | Shin-Etsu Handotai Company Limited | Lapping apparatus and method |
| US5800251A (en) * | 1996-03-27 | 1998-09-01 | Shin-Etsu Handotai Co., Ltd. | Apparatus and method of lapping works |
| EP0822033A1 (en) * | 1996-07-29 | 1998-02-04 | Integrated Process Equipment Corp. | Slurry recycling in chemical-mechanical polishing (CMP) apparatus |
| JP2006212626A (en) * | 2005-02-04 | 2006-08-17 | Samsung Electronics Co Ltd | Cyclone, slurry separating apparatus having the same, and slurry supply system and method utilizing the apparatus |
| US8020707B2 (en) | 2005-02-04 | 2011-09-20 | Samsung Electronics Co., Ltd. | Cyclone, apparatus for separating slurry having the cyclone, and system and method of supplying slurry using the apparatus |
| JP2008541816A (en) * | 2005-05-27 | 2008-11-27 | ダイソン・テクノロジー・リミテッド | Dust and dust cyclone separator |
| US7828866B2 (en) | 2005-05-27 | 2010-11-09 | Dyson Technology Limited | Dirt and dust cyclonic separating apparatus |
| US7867306B2 (en) | 2005-05-27 | 2011-01-11 | Dyson Technology Limited | Multistage cyclonic separating apparatus |
| US8562705B2 (en) | 2005-05-27 | 2013-10-22 | Dyson Technology Limited | Multistage cyclonic separating apparatus |
| JP2016055381A (en) * | 2014-09-09 | 2016-04-21 | 信越半導体株式会社 | Lapping method |
| CN108927735A (en) * | 2017-05-23 | 2018-12-04 | 天津滨海光热反射技术有限公司 | A kind of energy-saving burnishing device and polishing powder solution recycling method |
| CN108927735B (en) * | 2017-05-23 | 2023-08-15 | 天津滨海光热反射技术有限公司 | Energy-saving polishing device and polishing powder solution recycling method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2737108B2 (en) | 1998-04-08 |
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