JPH071852A - Thermal stencil paper and screen printing method - Google Patents
Thermal stencil paper and screen printing methodInfo
- Publication number
- JPH071852A JPH071852A JP14759593A JP14759593A JPH071852A JP H071852 A JPH071852 A JP H071852A JP 14759593 A JP14759593 A JP 14759593A JP 14759593 A JP14759593 A JP 14759593A JP H071852 A JPH071852 A JP H071852A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- heat
- printing
- support
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は感熱孔版原紙および孔版
印刷方法に関し、さらに詳しくはサーマルヘッド等によ
り穿孔される感熱孔版原紙およびこれを用いた孔版印刷
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-sensitive stencil sheet and a stencil printing method, and more particularly to a heat-sensitive stencil sheet perforated by a thermal head and the like and a stencil printing method using the same.
【０００２】[0002]
【従来の技術】従来の感熱孔版原紙は、熱可塑性樹脂フ
ィルムと多孔性薄葉紙などの多孔性支持体とを接着剤で
貼り合わせ、さらにサーマルヘッドとの熱融着を防止す
るため、熱可塑性高分子フィルム表面に剥離層が設けら
れる。この感熱孔版原紙の製版は、フィルム側からサー
マルヘッドの熱により文字絵柄などが逆像で印字されて
フィルムが溶融穿孔され、印刷時には感熱孔版原紙の多
孔性支持体側からインクが供給される。しかしながら、
このような感熱孔版原紙では、熱可塑性樹脂フィルムと
多孔性支持体を接着剤で貼り合わせているため、フィル
ムと多孔性支持体の接触部分の穿孔径が不均一となり、
またインクの通過が多孔性支持体に遮られるため、画像
の鮮明性が低下するという欠点があった。またサーマル
ヘッドを使用して穿孔する際には逆像で印字する必要が
あるため、一般的なサーマルプリンターやワープロ等を
使用して簡単に製版することができないという欠点があ
った。2. Description of the Related Art A conventional heat-sensitive stencil sheet has a high thermoplasticity because a thermoplastic resin film and a porous support such as porous thin paper are bonded together with an adhesive to prevent thermal fusion with a thermal head. A release layer is provided on the surface of the molecular film. In the plate making of this heat-sensitive stencil sheet, a character pattern or the like is printed in reverse image by the heat of the thermal head from the film side to melt and perforate the film, and at the time of printing, ink is supplied from the porous support side of the heat-sensitive stencil sheet. However,
In such a heat-sensitive stencil sheet, since the thermoplastic resin film and the porous support are bonded with an adhesive, the perforation diameter of the contact portion between the film and the porous support becomes uneven,
Moreover, since the passage of the ink is blocked by the porous support, there is a drawback that the sharpness of the image is lowered. Further, when punching using a thermal head, it is necessary to print with an inverse image, so that there is a drawback that it is not possible to easily carry out plate making using a general thermal printer or word processor.
【０００３】[0003]
【発明が解決しようとする課題】本発明の目的は、上記
従来技術の問題を解決し、サーマルヘッドでの正像印字
が可能であり、穿孔径およびインク通過量が均一で、画
像の鮮明性に優れ、かつ取扱いが容易である感熱孔版原
紙および孔版印刷方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, to enable normal image printing with a thermal head, to have a uniform perforation diameter and ink passage amount, and to provide a clear image. An object of the present invention is to provide a heat-sensitive stencil sheet and a stencil printing method which are excellent in handling and easy to handle.
【０００４】[0004]
【課題を解決するための手段】本願で特許請求する発明
は以下のとおりである。 （１）厚さ０．５〜２０μｍの熱可塑性樹脂フィルム
と、印刷時に該熱可塑性樹脂フィルムから剥離される支
持体とを熱可塑性樹脂接着剤で貼り合わせたことを特徴
とする感熱孔版原紙。 （２）熱可塑性樹脂接着剤の溶解性パラメーターが１０
以下であり、該熱可塑性樹脂接着剤がインク中の成分に
よって溶解および／または膨潤することを特徴とする
（１）の感熱孔版原紙。 （３）熱可塑性樹脂接着剤に有機および／または無機系
の微粒子を含有することを特徴とする（１）の感熱孔版
原紙。 （４）製版した感熱孔版原紙にインクを供給して孔版印
刷を行うに当たり、感熱孔版原紙として厚さ０．５〜２
０μｍの熱可塑性樹脂フィルムと支持体とを熱可塑性樹
脂接着剤で貼り合わせた感熱孔版原紙を用い、印刷時に
上記支持体を熱可塑性樹脂フィルムから剥離することを
特徴とする孔版印刷方法。The invention claimed in this application is as follows. (1) A heat-sensitive stencil sheet, wherein a thermoplastic resin film having a thickness of 0.5 to 20 μm and a support which is peeled off from the thermoplastic resin film at the time of printing are attached with a thermoplastic resin adhesive. (2) The solubility parameter of the thermoplastic resin adhesive is 10
The heat-sensitive stencil sheet of (1), characterized in that the thermoplastic resin adhesive is dissolved and / or swelled by the components in the ink. (3) The heat-sensitive stencil sheet of (1), characterized in that the thermoplastic resin adhesive contains organic and / or inorganic fine particles. (4) When the ink is supplied to the heat-sensitive stencil sheet thus prepared to perform stencil printing, the thickness of the heat-sensitive stencil sheet is 0.5 to 2
A stencil printing method comprising using a heat-sensitive stencil sheet in which a thermoplastic resin film having a thickness of 0 μm and a support are bonded together with a thermoplastic resin adhesive, and peeling the support from the thermoplastic resin film during printing.
【０００５】[0005]
【作用】本発明の感熱孔版原紙は、サーマルヘッドによ
り熱可塑性樹脂フィルムに文字画像等を正像で穿孔して
製版した後、該原紙を熱可塑性樹脂フィルム側からイン
クが供給されるように孔版印刷機に設置され、次に熱可
塑性樹脂フィルムに貼り合わされている支持体を剥離し
て印刷が行われる。このように本発明の感熱孔版原紙
は、印刷時には支持体のない熱可塑性樹脂フィルムの状
態で使用されるため、従来のように多孔性支持体でイン
クの通過が遮ぎられることがなく、鮮明な画像を得るこ
とができる。またサーマルヘッドで穿孔する際には、正
像印字が可能であるため、一般的なサーマルプリンター
やワープロ等を使用することができる。さらに熱可塑性
樹脂フィルムと支持体を張り合わせる熱可塑性樹脂接着
剤に微粒子を含有させることにより、熱可塑性樹脂フィ
ルムと接着剤層および該接着剤層と支持体の接触面に微
粒子の凹凸により空気の断熱層が形成されるため、接着
剤層および支持体と対向するフィルム表面と接触するサ
ーマルヘッドの熱効率が向上し、フィルムの熱穿孔性が
向上して均一な孔の穿孔が可能となる。The heat-sensitive stencil sheet of the present invention is prepared by punching a character image or the like in a normal image on a thermoplastic resin film with a thermal head to make a plate, and then the ink is supplied from the thermoplastic resin film side to the stencil sheet. Printing is carried out by peeling off the support placed on the printing machine and then attached to the thermoplastic resin film. As described above, the heat-sensitive stencil sheet of the present invention is used in the state of a thermoplastic resin film having no support at the time of printing, so that it does not obstruct the passage of ink by a porous support as in the conventional case, and it is clear. It is possible to obtain a clear image. Further, when punching with a thermal head, since a normal image can be printed, a general thermal printer, word processor or the like can be used. Further, by incorporating fine particles into the thermoplastic resin adhesive that bonds the thermoplastic resin film and the support, air bubbles are formed on the contact surface between the thermoplastic resin film and the adhesive layer and the adhesive layer and the support due to the unevenness of the fine particles. Since the heat-insulating layer is formed, the thermal efficiency of the thermal head that contacts the adhesive layer and the surface of the film facing the support is improved, the thermal piercing property of the film is improved, and uniform holes can be perforated.
【０００６】本発明に用いられる熱可塑性樹脂フィルム
としては、例えばポリエチレン、ポリプロピレン、ポリ
塩化ビニル、ポリ塩化ビニリデン、ポリエステル、ポリ
スチレン、ポリウレタン、ポリカーボネート、アクリル
樹脂、シリコーン樹脂などが挙げられ、これらのうち特
にポリ塩化ビニリデン、ポリエステルが好ましい。該熱
可塑性樹脂フィルムの厚さは０．５〜２０μｍ、好まし
くは１〜１５μｍの範囲である。フィルムの厚さが０．
５μｍ未満では取扱性および強度が劣り、また２０μｍ
を超えるとサーマルヘッドの発熱量では穿孔がしにくく
なる。Examples of the thermoplastic resin film used in the present invention include polyethylene, polypropylene, polyvinyl chloride, polyvinylidene chloride, polyester, polystyrene, polyurethane, polycarbonate, acrylic resin, silicone resin, and the like. Polyvinylidene chloride and polyester are preferable. The thickness of the thermoplastic resin film is in the range of 0.5 to 20 μm, preferably 1 to 15 μm. The film thickness is 0.
If it is less than 5 μm, the handling and strength are poor, and it is 20 μm
If it exceeds, it becomes difficult to perforate the heat generated by the thermal head.
【０００７】本発明に用いられる支持体としては、紙、
プラスチックフィルム、布などが挙げられる。支持体は
サーマルヘッドで製版する際の補強部材としての作用を
し、印刷時には剥離される。支持体の材質や厚さ等は取
扱性等により適宜選定することができる。The support used in the present invention is paper,
Examples include plastic films and cloth. The support acts as a reinforcing member during plate making with a thermal head, and is peeled off during printing. The material, thickness, etc. of the support can be appropriately selected depending on the handling property and the like.
【０００８】本発明に用いられる熱可塑性樹脂接着剤と
しては、上記熱可塑性樹脂フィルムと支持体を貼り合わ
せることができ、かつ印刷時には支持体を熱可塑性樹脂
フィルムから剥離することができるものであれば特に制
限はなく、例えば、公知の熱可塑性ポリマー、オリゴマ
ーからなる接着剤または粘着剤を使用することができ
る。印刷時に熱可塑性樹脂フィルムから支持体を剥離し
易くするためには、熱可塑性樹脂接着剤の溶解性パラメ
ーターを１０以下、好ましくは９．５以下とするのが好
ましい。溶解性パラメーター（ＳＰ値）は、溶媒および
溶質の凝集エネルギー密度を表すものであり、一般に物
質の極性の表示に使用される。プラスチックは自己のＳ
Ｐ値に近いＳＰ値を持つ溶剤によく溶ける。一般的な孔
版印刷インクに使用される高沸点溶剤およびオイルの溶
解性パラメーターは９．５以下である。従って、本発明
に使用される熱可塑性樹脂接着剤のＳＰ値は１０以下の
ものが使用される。The thermoplastic resin adhesive used in the present invention may be one that can bond the above-mentioned thermoplastic resin film to a support and can peel the support from the thermoplastic resin film during printing. There is no particular limitation, and for example, a known thermoplastic polymer or oligomer adhesive or pressure-sensitive adhesive can be used. In order to facilitate the peeling of the support from the thermoplastic resin film during printing, the solubility parameter of the thermoplastic resin adhesive is preferably 10 or less, more preferably 9.5 or less. The solubility parameter (SP value) represents the cohesive energy density of a solvent and a solute, and is generally used to indicate the polarity of a substance. Plastic is my own S
It is well soluble in solvents with SP values close to P value. The solubility parameter of high boiling point solvents and oils used in common stencil printing inks is 9.5 or less. Therefore, the SP value of the thermoplastic resin adhesive used in the present invention is 10 or less.
【０００９】このような熱可塑性樹脂接着剤を用いるこ
とにより、該接着剤層がインク中の成分、例えば、高沸
点溶剤やオイルなどによって溶解および／または膨潤さ
れ易くなり、その結果、熱可塑性樹脂フィルムと支持体
との接着力が減少して熱可塑性樹脂フィルムから支持体
を剥がしやすくなる。溶解性パラメーターが１０以下で
ある熱可塑性樹脂接着剤としては、例えば、エチレン−
酢酸ビニル共重合体、スチレン樹脂、アルキッド樹脂、
アクリル樹脂、スチレン−アクリル共重合体、スチレン
−ブタジエン共重合体、ブタジエンゴム、イソブチレ
ン、テルペン樹脂、クマロンインデン樹脂等が挙げられ
る。これらの接着剤は溶剤溶解型、水分分散型、ホット
メルト型など、いずれのタイプでもよい。By using such a thermoplastic resin adhesive, the adhesive layer is easily dissolved and / or swelled by a component in the ink, for example, a high boiling solvent or oil, and as a result, the thermoplastic resin is used. The adhesive force between the film and the support is reduced, and the support is easily peeled off from the thermoplastic resin film. Examples of the thermoplastic resin adhesive having a solubility parameter of 10 or less include ethylene-
Vinyl acetate copolymer, styrene resin, alkyd resin,
Examples thereof include acrylic resins, styrene-acrylic copolymers, styrene-butadiene copolymers, butadiene rubber, isobutylene, terpene resins and coumarone indene resins. These adhesives may be of any type such as solvent-soluble type, water-dispersed type and hot-melt type.
【００１０】熱可塑性樹脂接着剤の塗工は、通常の塗工
法、例えばロールコータ、グラビアコーター、ワイヤー
バーコーターなどにより行うことができる。熱可塑性樹
脂接着剤は、熱可塑性樹脂フィルムまたは支持体のどち
らの表面に塗工してもよく、また貼り合わせは、ヒート
ローラー、圧着ローラーなどで行うことができる。塗工
量は支持体の剥離性等の点から０．１〜１０ｇ／ｍ2 が
好ましい。The application of the thermoplastic resin adhesive can be carried out by a usual coating method, for example, a roll coater, a gravure coater, a wire bar coater or the like. The thermoplastic resin adhesive may be applied to either surface of the thermoplastic resin film or the support, and the bonding can be performed with a heat roller, a pressure roller or the like. The coating amount is preferably 0.1 to 10 g / m 2 from the viewpoint of the releasability of the support.
【００１１】また熱可塑性樹脂接着剤には、粒径０．１
〜２０μｍ、好ましくは０．２〜１０μｍの有機および
／または無機系の微粒子を含有することが好ましい。微
粒子の粒径が０．１μｍ未満では、サーマルヘッドによ
る穿孔時に熱可塑性樹脂フィルムと接着剤層および該接
着剤層と支持体の間に形成される空気の断熱層の厚さが
小さいため充分な断熱効果が得られず、熱可塑性樹脂フ
ィルムの穿孔性の向上が図れない。また２０μｍを超え
ると熱可塑性樹脂フィルムの厚さに比して微粒子径が大
きすぎるため、フィルムと支持体を接着するのに必要な
接着剤の使用量が量が多くなり、印刷時の支持体の剥離
がしにくくなる。微粒子を熱可塑性樹脂接着剤に含有さ
せることにより、熱可塑性樹脂フィルムと接着剤層およ
び該接着剤層と支持体の接触面に微粒子の凹凸により空
気の断熱層が形成されるため、サーマルヘッドの熱効率
およびフィルムの熱穿孔性が向上し、均一な孔の穿孔が
可能となる。The thermoplastic resin adhesive has a particle size of 0.1.
It is preferable to contain organic and / or inorganic fine particles of ˜20 μm, preferably 0.2 to 10 μm. If the particle size of the fine particles is less than 0.1 μm, the thickness of the thermoplastic resin film and the adhesive layer and the air heat insulating layer formed between the adhesive layer and the support at the time of punching with a thermal head are small, which is sufficient. The heat insulating effect cannot be obtained, and the perforability of the thermoplastic resin film cannot be improved. Further, when it exceeds 20 μm, the fine particle diameter is too large compared to the thickness of the thermoplastic resin film, so that the amount of the adhesive used for adhering the film and the support becomes large, and the support during printing is increased. Is difficult to peel off. By including fine particles in the thermoplastic resin adhesive, an air heat insulating layer is formed on the contact surface between the thermoplastic resin film and the adhesive layer and the contact between the adhesive layer and the support due to the unevenness of the fine particles. The thermal efficiency and the thermal perforation property of the film are improved, and uniform perforation is possible.
【００１２】本発明に用いられる微粒子としては、アク
リル樹脂、ウレタン樹脂、シリコーン樹脂、尿素−ホル
マリン縮合樹脂、フェノール樹脂、エポキシ樹脂、ベン
ゾグアナミン樹脂、ポリスチレン等の有機系微粒子、二
酸化珪素、炭酸カルシウム、硫酸カルシウム、タルク、
クレー、マイカ等の無機系微粒子が挙げられる。有機系
微粒子としては耐熱性を有するものが好ましい。また微
粒子の形状には特に限定はなく、球状、板状、燐片状、
不定形状またはこれらの中空状などいずれでもよい。こ
れらの微粒子は単独でまたは併用して使用することがで
きる。The fine particles used in the present invention include acrylic resin, urethane resin, silicone resin, urea-formalin condensation resin, phenol resin, epoxy resin, benzoguanamine resin, organic fine particles such as polystyrene, silicon dioxide, calcium carbonate, sulfuric acid. Calcium, talc,
Examples include inorganic fine particles such as clay and mica. As the organic fine particles, those having heat resistance are preferable. The shape of the fine particles is not particularly limited, and may be spherical, plate-like, flake-like,
It may be indefinite shape or hollow shape thereof. These fine particles can be used alone or in combination.
【００１３】微粒子と熱可塑性樹脂接着剤の使用割合
は、重量比（微粒子／熱可塑性樹脂接着剤）で５０／１
〜１／１が好ましく、２０／１〜２／１がより好まし
い。微粒子の使用量が熱可塑性樹脂接着剤量の５０倍を
超えると微粒子の固着性能が低下し、また微粒子の使用
量が熱可塑性樹脂接着剤量より少ないと形成される断熱
層の容量が小さくなり断熱効果が減少する。The weight ratio of the fine particles to the thermoplastic resin adhesive is 50/1 (fine particles / thermoplastic resin adhesive).
~ 1/1 is preferable, and 20/1 to 2/1 is more preferable. If the amount of the fine particles used exceeds 50 times the amount of the thermoplastic resin adhesive, the adhesion performance of the fine particles deteriorates, and if the amount of the fine particles used is less than the amount of the thermoplastic resin adhesive, the capacity of the heat insulating layer formed becomes small. The heat insulation effect decreases.
【００１４】[0014]
【実施例】以下に本発明を実施例により詳しく説明する
が、本発明はこれらに限定されるものではない。なお、
例中の部は重量部を意味する。 実施例１ （１）感熱孔版原紙の作製 下記の組成からなる塗工液を、攪拌機で１時間分散した
後、２．５μｍのポリエステルフィルム上にワイヤーバ
ーで塗布し、乾燥して付着量３ｇ／ｍ2 の接着剤層を形
成した。次いで接着剤層上に、上質紙を重ねて８０℃の
ヒートローラで貼り合わせて感熱孔版原紙を得た。 塗工液：シリカ微粒子（平均粒径：３μｍ） １００部 エチレン−酢ビ共重合体（溶解性パラメータ９．０） ３０部 トルエン ２２０部 メチルエチルケトン １１０部 EXAMPLES The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto. In addition,
Parts in the examples mean parts by weight. Example 1 (1) Preparation of heat-sensitive stencil base paper A coating solution having the following composition was dispersed with a stirrer for 1 hour, then applied on a 2.5 μm polyester film with a wire bar, and dried to deposit 3 g / An adhesive layer of m 2 was formed. Then, a high-quality paper was superposed on the adhesive layer and laminated with a heat roller at 80 ° C. to obtain a heat-sensitive stencil sheet. Coating liquid: Silica fine particles (average particle diameter: 3 μm) 100 parts Ethylene-vinyl acetate copolymer (solubility parameter 9.0) 30 parts Toluene 220 parts Methyl ethyl ketone 110 parts
【００１５】（２）感熱孔版原紙の穿孔 （１）で得られた感熱孔版原紙のフィルム表面にシリコ
ーンオイルを塗布し、該シリコーンオイル塗工面を４０
０ｄｐｉのサーマルヘッドに接触させ、感熱孔版原紙の
上質紙側をプラテンローラーで支持して印加エネルギー
０．０７ｍＪ／ｄｏｔで穿孔した。穿孔画像は、印刷物
を評価するための全ベタ部、１０本／mmの細線部および
文字部と耐刷性を評価するための罫線部の４種類とし
た。 （３）印刷 （２）で穿孔した感熱孔版原紙を、孔版印刷機（理想科
学工業社製、リソグラフＲＣ１１５Ｄ（登録商標））の
印刷ドラムにポリエステルフィルム面をドラム側にして
巻付けた後、感熱孔版原紙の接着剤層の溶解および／ま
たは膨潤を手助けするため、ドラムを回転させながらプ
レスローラによって加圧した。その後、上質紙をポリエ
ステルフィルムから剥離し、熱可塑性樹脂フィルムのみ
で孔版印刷を行った。(2) Perforation of heat-sensitive stencil base paper Silicone oil is applied to the film surface of the heat-sensitive stencil base paper obtained in (1), and the surface coated with silicone oil is 40
The heat-sensitive stencil sheet was contacted with a thermal head of 0 dpi, and the high-quality paper side was supported by a platen roller to punch with an applied energy of 0.07 mJ / dot. There were four types of punched images: a full solid portion for evaluating printed matter, a thin line portion of 10 lines / mm, a character portion, and a ruled line portion for evaluating printing durability. (3) Printing The heat-sensitive stencil sheet perforated in (2) was wrapped around the printing drum of a stencil printer (Risograph RC115D (registered trademark)) with the polyester film side facing the drum side, and then heat-sensitive. To assist the dissolution and / or swelling of the adhesive layer of the stencil paper, pressure was applied by a press roller while rotating the drum. After that, the high-quality paper was peeled off from the polyester film, and stencil printing was performed using only the thermoplastic resin film.
【００１６】フィルムと上質紙との剥離状態、得られた
印刷物の全ベタ部の濃淡ムラおよび印刷濃度、細線部と
文字部の再現性ならび耐刷性の評価を以下のようにして
行い、その結果を表１に示した。 １）フィルムの剥離状態：剥離する際にフィルムの穿孔
部を目視で観察し、次のようにして評価した。 ○：支持体を剥離する際にフィルムの穿孔部が切断しな
い。 ×：支持体を剥離する際にフィルムの穿孔部が切断す
る。 ２）全ベタ部の濃淡ムラ：印刷物の全ベタ部の濃淡ムラ
の有無を目視で観察して次のように評価した。 ○：濃淡ムラがない。 ×：濃淡ムラがある。 ３）全ベタ部の印刷濃度：印刷物の全ベタ部の印刷濃度
を反射式濃度計（マクベス社製）で測定した。 ４）細線部と文字部の再現性：印刷物の１０本／mmの細
線部と文字部の鮮明性を目視で観察し、次のように評価
した。 ○：印刷物が鮮明であり、細線の切れ、太りが全くな
い。 ×：細線部、文字部とも、線が切れており、太さにムラ
がある。 ５）耐刷性：３０００枚以上印刷し、次のように評価し
た。 ○：３０００枚以上印刷しても罫線の太りが発生しな
い。 ×：３０００枚未満で罫線の太りが発生し、原紙の罫線
部分に切れが生じる。The peeling state between the film and the high-quality paper, the uneven density and printing density of all solid parts of the obtained printed matter, the reproducibility of the fine line part and the character part and the printing durability were evaluated as follows. The results are shown in Table 1. 1) Peeling state of film: The perforated portion of the film was visually observed during peeling and evaluated as follows. ◯: The perforated portion of the film is not cut when the support is peeled off. X: The perforated portion of the film is cut when the support is peeled off. 2) Density unevenness in all solid areas: The presence or absence of uneven density in all solid areas of the printed matter was visually observed and evaluated as follows. ◯: There is no unevenness in light and shade. X: There is unevenness in light and shade. 3) Print density of all solid areas: The print density of all solid areas of the printed matter was measured with a reflection densitometer (manufactured by Macbeth Co.). 4) Reproducibility of fine line part and character part: The vividness of the thin line part and character part of the printed matter of 10 lines / mm was visually observed and evaluated as follows. ◯: The printed matter is clear and there are no fine line breaks or thickening. X: The line is broken in both the thin line portion and the character portion, and the thickness is uneven. 5) Printing durability: 3000 sheets or more were printed and evaluated as follows. ◯: The ruled line does not become thick even after printing 3000 sheets or more. X: If less than 3000 sheets, the ruled line is thickened and the ruled line portion of the base paper is cut.
【００１７】実施例２ 下記の組成からなる塗工液を実施例１と同様に分散して
ポリエステルフィルム上に塗布して接着剤層を形成し、
この接着剤層上に５０μｍのフィルムを重ね合わせて１
００℃のヒートローラで貼り合わせ、感熱孔版原紙を作
製し、次いでこれを用いて実施例１と同様にして穿孔お
よび印刷を行い、印刷物等の評価を行い、その結果を表
１に示した。 塗工液：テトラフルオロエチレン樹脂微粉末（平均粒径９μｍ） ８０部 スチレン樹脂（溶解性パラメーター８．６） ３０部 トルエン ２２０部 メチルエチルケトン １１０部Example 2 A coating solution having the following composition was dispersed in the same manner as in Example 1 and applied onto a polyester film to form an adhesive layer,
Overlay a 50 μm film on this adhesive layer and
A heat sensitive stencil sheet was prepared by laminating with a heat roller at 00 ° C. Then, using this, perforation and printing were carried out in the same manner as in Example 1 to evaluate the printed matter and the results are shown in Table 1. Coating liquid: Tetrafluoroethylene resin fine powder (average particle size 9 μm) 80 parts Styrene resin (solubility parameter 8.6) 30 parts Toluene 220 parts Methyl ethyl ketone 110 parts
【００１８】実施例３ 下記の組成からなる塗工液を実施例１と同様に分散して
ポリエステルフィルム上に塗布して接着剤層を形成し、
この接着剤層上に上質紙を重ね合わせて１００℃のヒー
トローラで貼り合わせ、感熱孔版原紙を作製し、次いで
これを用いて実施例１と同様にして穿孔および印刷を行
い、印刷物等の評価を行い、その結果を表１に示した。 塗工液：硬質アクリル系微粒子（平均粒径３〜５μｍ） １００部 低分子量ポリエチレン（溶解性パラメーター７．９）２０部 トルエン ２２０部 メチルエチルケトン １１０部Example 3 A coating solution having the following composition was dispersed in the same manner as in Example 1 and applied onto a polyester film to form an adhesive layer,
A high-quality paper is superposed on this adhesive layer and laminated with a heat roller at 100 ° C. to prepare a heat-sensitive stencil sheet, which is then used for perforation and printing in the same manner as in Example 1 to evaluate printed matter and the like. The results are shown in Table 1. Coating liquid: Hard acrylic fine particles (average particle size 3 to 5 μm) 100 parts Low molecular weight polyethylene (solubility parameter 7.9) 20 parts Toluene 220 parts Methyl ethyl ketone 110 parts
【００１９】実施例４ 下記の組成からなる塗工液を実施例１と同様に分散して
ポリエステルフィルム上に塗布して接着剤層を形成し、
この接着剤層上に上質紙を重ね合わせて１００℃のヒー
トローラで貼り合わせ、感熱孔版原紙を作製し、次いで
これを用いて実施例１と同様にして穿孔および印刷を行
い、印刷物等の評価を行い、その結果を表１に示した。 塗工液：シリコーン樹脂微粒子（平均粒径２μｍ） １２０部 スチレン−アクリル樹脂（溶解性パラメーター８．８） ３０部 トルエン ２２０部 メチルエチルケトン １１０部Example 4 A coating solution having the following composition was dispersed in the same manner as in Example 1 and applied onto a polyester film to form an adhesive layer,
A high-quality paper is superposed on this adhesive layer and laminated with a heat roller at 100 ° C. to prepare a heat-sensitive stencil sheet, which is then used for perforation and printing in the same manner as in Example 1 to evaluate printed matter and the like. The results are shown in Table 1. Coating liquid: Silicone resin fine particles (average particle size 2 μm) 120 parts Styrene-acrylic resin (solubility parameter 8.8) 30 parts Toluene 220 parts Methyl ethyl ketone 110 parts
【００２０】実施例５ 下記の組成からなる塗工液を上質紙上にワイヤーバーで
塗布、乾燥して付着量２ｇ／ｍ2 の接着剤層を形成し、
この接着剤層上に２．５μｍのポリエステルフィルムを
重ね合わせて圧着ローラーで貼り合わせ、感熱孔版原紙
を作製し、次いでこれを用いて実施例１と同様にして穿
孔および印刷を行い、印刷物等の評価を行い、その結果
を表１に示した。 塗工液：シリカ微粒子（平均粒径３μｍ） １００部 アクリル樹脂エマルジョン溶液（５０重量％） １００部 （アクリル樹脂の溶解性パラメーター９．０） 水 １００部Example 5 A coating solution having the following composition was coated on a high-quality paper with a wire bar and dried to form an adhesive layer having an adhesion amount of 2 g / m 2 .
A 2.5 μm polyester film is overlaid on this adhesive layer and bonded with a pressure roller to prepare a heat-sensitive stencil sheet. Then, using this, perforation and printing are performed in the same manner as in Example 1 to obtain a printed matter or the like. The evaluation was performed and the results are shown in Table 1. Coating liquid: Silica fine particles (average particle diameter 3 μm) 100 parts Acrylic resin emulsion solution (50% by weight) 100 parts (Acrylic resin solubility parameter 9.0) Water 100 parts
【００２１】実施例６ 下記の組成からなる塗工液を実施例５と同様にして感熱
孔版原紙を作製し、次いでこれを用いて実施例５と同様
にして穿孔および印刷を行い、印刷物等の評価を行い、
その結果を表１に示した。 塗工液：シリコーン樹脂微粒子（平均粒径２μｍ） １００部 スチレン−ブタジエン樹脂エマルジョン溶液 １００部 （４５重量％） （スチレン−ブラジエン樹脂の溶解性パラメーター８．７） 水 １００部Example 6 A coating solution having the following composition was used to prepare a heat-sensitive stencil sheet in the same manner as in Example 5, and then this was used to perforate and print in the same manner as in Example 5 to obtain a printed matter or the like. Evaluate,
The results are shown in Table 1. Coating liquid: Silicone resin fine particles (average particle size 2 μm) 100 parts Styrene-butadiene resin emulsion solution 100 parts (45% by weight) (Styrene-Bradiene resin solubility parameter 8.7) Water 100 parts
【００２２】比較例１ 下記の組成からなる塗工液を実施例１と同様に分散して
ポリエステルフィルム上に塗布して接着剤層を形成し、
この接着剤層上に上質紙を重ね合わせて１５０℃のヒー
トローラで貼り合わせ、感熱孔版原紙を作製し、次いで
これを用いて実施例１と同様にして穿孔および印刷を行
い、印刷物等の評価を行い、その結果を表１に示した。 塗工液：シリカ微粒子 （平均粒径３μｍ） １００部 ウレタン樹脂（溶解性パラメーター１３．６） ３０部 トルエン ２２０部 メチルエチルケトン １１０部Comparative Example 1 A coating solution having the following composition was dispersed in the same manner as in Example 1 and applied onto a polyester film to form an adhesive layer,
Fine paper is superposed on this adhesive layer and laminated with a heat roller at 150 ° C. to prepare a heat-sensitive stencil sheet, which is then used for perforation and printing in the same manner as in Example 1 to evaluate printed matter and the like. The results are shown in Table 1. Coating liquid: Silica fine particles (average particle size 3 μm) 100 parts Urethane resin (solubility parameter 13.6) 30 parts Toluene 220 parts Methyl ethyl ketone 110 parts
【００２３】比較例２ 下記の組成からなる塗工液を実施例１と同様に分散して
ポリエステルフィルム上に塗布して接着剤層を形成し、
この接着剤層上に上質紙を重ね合わせて８０℃のヒート
ローラで貼り合わせ、感熱孔版原紙を作製し、次いでこ
れを用いて実施例１と同様にして穿孔および印刷を行
い、印刷物等の評価を行い、その結果を表１に示した。 塗工液：シリカ微粒子 （平均粒径３０μｍ） １００部 エチレン−酢ビ共重合体（溶解性パラメーター９．０） ３０部 トルエン ２２０部 メチルエチルケトン １１０部Comparative Example 2 A coating solution having the following composition was dispersed in the same manner as in Example 1 and applied onto a polyester film to form an adhesive layer,
Fine paper is superposed on this adhesive layer and laminated with a heat roller at 80 ° C. to prepare a heat-sensitive stencil sheet, which is then used for perforation and printing in the same manner as in Example 1 to evaluate printed matter and the like. The results are shown in Table 1. Coating liquid: Silica fine particles (average particle size 30 μm) 100 parts Ethylene-vinyl acetate copolymer (solubility parameter 9.0) 30 parts Toluene 220 parts Methyl ethyl ketone 110 parts
【００２４】比較例３ 下記の組成からなる塗工液を実施例１と同様に分散して
ポリエステルフィルム上に塗布して接着剤層を形成し、
この接着剤層上に上質紙を重ね合わせて８０℃のヒート
ローラで貼り合わせ、感熱孔版原紙を作製し、次いでこ
れを用いて実施例１と同様にして穿孔および印刷を行
い、印刷物等の評価を行い、その結果を表１に示した。 塗工液：エチレン−酢ビ共重合体（溶解性パラメーター９．０）３０部 トルエン ２２０部 メチルエチルケトン １１０部Comparative Example 3 A coating solution having the following composition was dispersed in the same manner as in Example 1 and applied on a polyester film to form an adhesive layer,
Fine paper is superposed on this adhesive layer and laminated with a heat roller at 80 ° C. to prepare a heat-sensitive stencil sheet, which is then used for perforation and printing in the same manner as in Example 1 to evaluate printed matter and the like. The results are shown in Table 1. Coating liquid: ethylene-vinyl acetate copolymer (solubility parameter 9.0) 30 parts Toluene 220 parts Methyl ethyl ketone 110 parts
【００２５】[0025]
【表１】 [Table 1]
【００２６】表１から、比較例１では溶解性パラメータ
ーの大きいウレタン樹脂を用いているため支持体を剥離
することができず、比較例２では微粒子径が大きすぎる
ため画像の鮮明性および耐刷性に劣り、比較例３では微
粒子を全く含まないため画像の鮮明性に劣るが、実施例
１〜４ではフィルムから支持体が剥がれやすく、印刷物
の画像鮮明性が良好であり、耐刷性にも優れることが示
される。From Table 1, it is impossible to peel off the support in Comparative Example 1 because the urethane resin having a large solubility parameter is used. In Comparative Example 2, the sharpness of the image and the printing durability are large because the particle size is too large. In contrast, Comparative Example 3 is inferior in image clarity because it contains no fine particles at all, but in Examples 1 to 4, the support is easily peeled off from the film, the image clarity of the printed matter is good, and printing durability is low. Is also shown to be excellent.
【００２７】[0027]
【発明の効果】本発明の感熱孔版原紙およびこれを用い
た孔版印刷方法によれば、サーマルヘッドの熱効率を向
上させることができるため、フィルムの穿孔性が向上
し、均一な孔の形成が可能であり、また支持体を剥離し
て熱可塑性樹脂フィルムのみで印刷を行うため、インク
通過性が向上し、印刷物、特にベタ部の濃淡ムラが減少
し、細字部等の鮮明性が向上する。また正像印字が可能
であり、一般的なサーマルプリンタやワープロを使用し
て容易に製版することが可能である。According to the heat-sensitive stencil sheet and the stencil printing method using the same of the present invention, since the thermal efficiency of the thermal head can be improved, the piercing property of the film is improved and uniform holes can be formed. In addition, since the support is peeled off and printing is performed only with the thermoplastic resin film, the ink passing property is improved, the density unevenness of the printed matter, particularly the solid part is reduced, and the sharpness of the fine character part is improved. Further, it is possible to print a normal image, and it is possible to easily make a plate using a general thermal printer or a word processor.
Claims (4)
ィルムと、印刷時に該熱可塑性樹脂フィルムから剥離さ
れる支持体とを熱可塑性樹脂接着剤で貼り合わせたこと
を特徴とする感熱孔版原紙。1. A heat-sensitive stencil characterized in that a thermoplastic resin film having a thickness of 0.5 to 20 μm and a support which is peeled off from the thermoplastic resin film during printing are bonded together with a thermoplastic resin adhesive. Base paper.
ーが１０以下であり、該熱可塑性樹脂接着剤がインク中
の成分によって溶解および／または膨潤することを特徴
とする請求項１記載の感熱孔版原紙。2. The heat-sensitive stencil according to claim 1, wherein the thermoplastic resin adhesive has a solubility parameter of 10 or less, and the thermoplastic resin adhesive is dissolved and / or swelled by a component in the ink. Base paper.
μｍの有機および／または無機系の微粒子を含有するこ
とを特徴とする請求項１記載の感熱孔版原紙。3. The thermoplastic resin adhesive has a particle size of 0.1 to 20.
The heat-sensitive stencil sheet according to claim 1, characterized in that it contains organic and / or inorganic fine particles of μm.
て孔版印刷を行うに当たり、感熱孔版原紙として厚さ
０．５〜２０μｍの熱可塑性樹脂フィルムと支持体とを
熱可塑性樹脂接着剤で貼り合わせた感熱孔版原紙を用
い、印刷時に上記支持体を熱可塑性樹脂フィルムから剥
離することを特徴とする孔版印刷方法。4. A thermosensitive stencil sheet having a thickness of 0.5 to 20 μm, which is a thermoplastic resin film, and a support are pasted together with a thermoplastic resin adhesive when ink is supplied to the prepared stencil sheet for stencil printing. A stencil printing method comprising using the combined heat-sensitive stencil sheet and peeling the support from the thermoplastic resin film during printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14759593A JP3454864B2 (en) | 1993-06-18 | 1993-06-18 | Thermosensitive stencil paper and stencil printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14759593A JP3454864B2 (en) | 1993-06-18 | 1993-06-18 | Thermosensitive stencil paper and stencil printing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH071852A true JPH071852A (en) | 1995-01-06 |
| JP3454864B2 JP3454864B2 (en) | 2003-10-06 |
Family
ID=15433907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14759593A Expired - Fee Related JP3454864B2 (en) | 1993-06-18 | 1993-06-18 | Thermosensitive stencil paper and stencil printing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3454864B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0688681A1 (en) * | 1994-05-23 | 1995-12-27 | Riso Kagaku Corporation | Stencil printed method and heat-sensitive stencil sheet |
| JP2003011541A (en) * | 2001-06-28 | 2003-01-15 | Mizunami Seiki Kk | Method for producing original plate for screen process printing and original plate for screen process printing |
| JP2007245679A (en) * | 2006-03-20 | 2007-09-27 | Duplo Seiko Corp | Stencil printing base paper and stencil printing apparatus |
-
1993
- 1993-06-18 JP JP14759593A patent/JP3454864B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0688681A1 (en) * | 1994-05-23 | 1995-12-27 | Riso Kagaku Corporation | Stencil printed method and heat-sensitive stencil sheet |
| JP2003011541A (en) * | 2001-06-28 | 2003-01-15 | Mizunami Seiki Kk | Method for producing original plate for screen process printing and original plate for screen process printing |
| JP2007245679A (en) * | 2006-03-20 | 2007-09-27 | Duplo Seiko Corp | Stencil printing base paper and stencil printing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3454864B2 (en) | 2003-10-06 |
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