JP3876993B2 - Adhesive structure, liquid crystal device, and electronic device - Google Patents

Adhesive structure, liquid crystal device, and electronic device Download PDF

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JP3876993B2
JP3876993B2 JP2003337421A JP2003337421A JP3876993B2 JP 3876993 B2 JP3876993 B2 JP 3876993B2 JP 2003337421 A JP2003337421 A JP 2003337421A JP 2003337421 A JP2003337421 A JP 2003337421A JP 3876993 B2 JP3876993 B2 JP 3876993B2
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adhesive layer
adhesive
electrode terminal
adherend
liquid crystal
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JP2004136673A (en
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憲治 内山
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Seiko Epson Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]

Abstract

<P>PROBLEM TO BE SOLVED: To realize a bonded structure which can increase the force of adhesion to each object to be bonded, even in the case of the adhesion to two kinds of the objects to be bonded, different in the properties of materials, and to prevent the occurrence of a poor connection between electrode terminals which are formed in the objects to be bonded. <P>SOLUTION: The thickness of the electrode terminal 12 from the surface of a glass substrate 11 is smaller than that of the electrode terminal 14 from the surface of a tape carrier package (TCP) 13; a first adhesive layer 4 and a second adhesive layer 5 are laminated together in an adhesive 1; the adhesive layer 4 includes conductive particles 3; the thickness of the adhesive layer 4 is greater in dimension than the diameter of the conductive particle 3; the force of the adhesion of the adhesive layer 4 to the glass substrate 11 is greater than that of the adhesion of the adhesive layer 5 thereto; and the force of the adhesion of the adhesive layer 5 to the TCP 13 is greater than that of the adhesion of the adhesive layer 4 thereto. <P>COPYRIGHT: (C)2004,JPO

Description

本発明は、接着剤、特に導電粒子を含有する異方導電性接着剤を用いた接続構造、さらには、液晶パネルと外部回路基板又は半導体素子との接続に異方導電性接着剤を用いた液晶装置に関する。また、この液晶装置を表示部として備えた電子機器に関する。   The present invention uses an anisotropic conductive adhesive for connecting an adhesive, particularly an anisotropic conductive adhesive containing conductive particles, and further for connecting a liquid crystal panel to an external circuit board or a semiconductor element. The present invention relates to a liquid crystal device. The present invention also relates to an electronic device including the liquid crystal device as a display unit.

液晶パネルのガラス基板上に設けられた入力端子とＴＣＰ（Ｔａｐｅ Ｃａｒｒｉｅｒ Ｐａｃｋａｇe）の端子（端子上にバンプが形成されている場合もある）との接続のように、ファインピッチの端子間の接続には異方導電性の接着剤が用いられている。   Connection between fine pitch terminals, such as connection between input terminals provided on a glass substrate of a liquid crystal panel and TCP (Tape Carrier Package) terminals (there may be bumps formed on the terminals) An anisotropic conductive adhesive is used.

従来の異方導電性の接着剤は、エポキシ樹脂等の熱硬化性あるいは熱可塑性の絶縁性接着材料と、この接着剤内に配置された複数の導電粒子とで構成されていた。ここで、絶縁性接着材料は、被接着物、つまりガラス基板とポリイミド製のＴＣＰとに接着されるため、これらの材質の異なる被接着物のいずれにも所定の接着力で接着できるように汎用性の高い接着剤を用いていた。   Conventional anisotropically conductive adhesives are composed of a thermosetting or thermoplastic insulating adhesive material such as an epoxy resin and a plurality of conductive particles arranged in the adhesive. Here, since the insulating adhesive material is bonded to an adherend, that is, a glass substrate and a polyimide TCP, it is general-purpose so that it can adhere to any of these different adherends with a predetermined adhesive force. A highly adhesive was used.

しかしながら、汎用性がある接着剤は、どの材質の被接着物に対しても一定レベルの接着力が得られるが、一方の被接着物に対して一定レベル以上の接着力を求めると、他方の被接着物との接着力が低下してしまい、全体としては一定レベル以上の接着力が得られないという問題があった。   However, a versatile adhesive can obtain a certain level of adhesive force for any material to be adhered, but when a certain level of adhesive force is obtained for one object, the other There was a problem in that the adhesive strength with the object to be bonded was reduced, and as a whole, an adhesive strength of a certain level or more could not be obtained.

特に、液晶パネルにガラス基板を用い、そのガラス基板と外部回路基板である高分子基板とを接続する場合にあっては、両者の接着特性が著しく異なることがある。そのため、接着剥がれに起因する不良が、ガラス基板と高分子基板のうちのどちらか一方のみにおいて起こりやすい傾向にあった。   In particular, when a glass substrate is used for the liquid crystal panel and the glass substrate is connected to a polymer substrate that is an external circuit substrate, the adhesive properties of the two may be significantly different. For this reason, defects due to adhesion peeling tend to occur only in one of the glass substrate and the polymer substrate.

本発明の目的は、材質が異なる２種類の被接着物に接着される場合でも、各被接着物との接着力をそれぞれ向上できる異方導電性接着剤を用いた接着構造を実現すること、及び、接続不良が生じない液晶装置及びそれを用いた電子機器等を実現することにある。   The object of the present invention is to realize an adhesive structure using an anisotropic conductive adhesive that can improve the adhesive force with each adherend, even when bonded to two kinds of adherends of different materials, Another object of the present invention is to realize a liquid crystal device that does not cause poor connection and an electronic device using the same.

本発明の接着構造は、第１電極端子が設けられた第１被接着物と、第２電極端子が設けられた第２被接着物との間に第１接着層と第２接着層を介在させて接着し、前記第１電極端子と前記第２電極端子とを電気的に接続する接着構造であって、前記第１電極端子の前記第１被接着物の表面からの厚さは、前記第２電極端子の前記第２被接着物の表面からの厚さより薄く、前記第１接着層は導電性粒子を含み該導電性粒子の直径よりも大きな厚みを有し、前記第２接着層は前記導電性粒子を含まない接着構造において、前記第１接着層は、前記第１被接着物に対する接着力が前記第２接着層よりも高く設定されているとともに、前記第１被接着物の前記第１電極端子が設けられていない部分で前記第２接着層よりも厚い厚みを有して前記第１被接着物と接着されており、前記第２接着層は、前記第２被接着物に対する接着力が前記第１接着層よりも高く設定されているとともに、前記第２被接着物の前記第２電極端子が設けられていない部分で前記第１接着層よりも薄い厚みを有し、かつ、前記第２電極端子より薄い厚みを有して前記第２被接着物と接着されており、前記第２電極端子が、前記第２接着層を前記第２被接着物の前記第２電極端子が設けられていない部分に押し出して貫通することによって、前記第１電極端子と前記第２電極端子が、前記第１接着層の前記導電性粒子を介して電気的に接続されていることを特徴とする。   In the adhesive structure of the present invention, the first adhesive layer and the second adhesive layer are interposed between the first adherend provided with the first electrode terminal and the second adherend provided with the second electrode terminal. The first electrode terminal and the second electrode terminal are electrically connected, and the thickness of the first electrode terminal from the surface of the first adherend is The thickness of the second electrode terminal is thinner than the surface of the second adherend, the first adhesive layer includes conductive particles and has a thickness larger than the diameter of the conductive particles, and the second adhesive layer is In the adhesive structure not including the conductive particles, the first adhesive layer has an adhesive force with respect to the first adherend that is set higher than that of the second adhesive layer. The portion where the first electrode terminal is not provided has a thickness greater than that of the second adhesive layer and has the first cover. The second adhesive layer is bonded to a kimono, and the second adhesive layer has a higher adhesive force to the second adherend than the first adhesive layer, and the second electrode terminal of the second adherend The second electrode has a thickness thinner than the first adhesive layer and a thickness thinner than the second electrode terminal, and is bonded to the second adherend. The terminal pushes and penetrates the second adhesive layer into a portion of the second adherend where the second electrode terminal is not provided, so that the first electrode terminal and the second electrode terminal are It is electrically connected through the conductive particles of one adhesive layer.

本発明の接着構造を用いて、第１被接着物と第２被接着物を接着する場合にあっては、第１接着層と第１被接着物とを接しさせ、第２接着層と第２被接着物とを接しさせることができる。そうすることにより、各被接着物が各々に応じた接着特性の下で、他方の被接着物と接着されるため、被接着物同士の接着が強固なものになる。   In the case of bonding the first adherend and the second adherend using the adhesive structure of the present invention, the first adhesive layer and the first adherend are brought into contact with each other, and the second adhesive layer and the second adherend are bonded. 2 The object to be bonded can be brought into contact. By doing so, since each adherend is bonded to the other adherend under the bonding characteristics corresponding to each, the adherence between the adherends becomes strong.

第１被接着物と第２被接着物との間で電気的接続をとる必要が有る場合にあっては、本発明のように第１接着層中に導電性粒子を混入させれば良い。もちろん、第２接着層中にも導電性粒子を混入してもかまわないが、通常、第１被接着物と第２被接着物との間で電気的接続をおこなう場合にあっては第１被接着物と第２被接着物とを互いに押しつけるようにして接着する。そのため、第１接着層中にのみ導電粒子を混入させれば電気的接続はできる。   When it is necessary to establish an electrical connection between the first adherend and the second adherend, conductive particles may be mixed into the first adhesive layer as in the present invention. Of course, conductive particles may also be mixed into the second adhesive layer, but the first is usually used when electrical connection is made between the first adherend and the second adherend. The adherend and the second adherend are bonded together so as to press each other. Therefore, electrical connection can be made by mixing conductive particles only in the first adhesive layer.

第１接着層中にのみ導電性粒子を配置すると、導電性粒子の数や配置を管理しやすいので、容易に異方導電性の接着剤を製造することができる。この場合において、第２接着層は第２被接着物との接着のみに利用できればよいため、第１接着層に比べて接着層の厚みを薄く形成することができ、第２接着層の厚みを第２電極端子の厚みより薄くする。   If the conductive particles are arranged only in the first adhesive layer, the number and arrangement of the conductive particles can be easily managed, so that the anisotropic conductive adhesive can be easily manufactured. In this case, since it is sufficient that the second adhesive layer can be used only for adhesion to the second adherend, the thickness of the adhesive layer can be reduced compared to the first adhesive layer, and the thickness of the second adhesive layer can be reduced. It is made thinner than the thickness of the second electrode terminal.

また、一般的に、被接着物の接着は圧着により行う。この圧着の際には、電極端子によって接着剤が押し出され、そして流出する。当然のことながら、電極端子の厚みが厚い電極端子によって押し出される接着剤の量の方が、厚みが薄い電極端子によって押し出される接着剤の量より多い。第１被接着物と第２被接着物との間で確実な電気的接続を行うためには、導電粒子の流出をなくすことが好ましい。   In general, the adherend is bonded by pressure bonding. During the crimping, the adhesive is pushed out by the electrode terminal and flows out. As a matter of course, the amount of the adhesive pushed out by the electrode terminal having the thick electrode terminal is larger than the amount of the adhesive pushed out by the electrode terminal having the thin thickness. In order to make reliable electrical connection between the first adherend and the second adherend, it is preferable to eliminate the outflow of the conductive particles.

本発明においては、導電性粒子が混入された第１接着層と、電極端子の厚みが薄い電極端子を有する基板とを接しさせるため、圧着の際の導電性粒子の流出を防止することができる。   In the present invention, since the first adhesive layer mixed with the conductive particles is brought into contact with the substrate having the electrode terminal with a thin electrode terminal, it is possible to prevent the conductive particles from flowing out during the pressure bonding. .

また、本発明の液晶装置は、第１電極端子が設けられた液晶パネルの基板と、第２電極端子が設けられた被接着物との間に第１接着層と第２接着層を介在させて接着し、前記第１電極端子と前記第２電極端子とを電気的に接続する液晶装置であって、前記第１電極端子の前記液晶パネルの基板の表面からの厚さは、前記第２電極端子の前記被接着物の表面からの厚さより薄く、前記第１接着層は導電性粒子を含み該導電性粒子の直径よりも大きな厚みを有し、前記第２接着層は前記導電性粒子を含まない液晶装置において、前記第１接着層は、前記液晶パネルの基板に対する接着力が前記第２接着層よりも高く設定されているとともに、前記液晶パネルの基板の前記第１電極端子が設けられていない部分で前記第２接着層よりも厚い厚みを有して前記液晶パネルの基板と接着されており、前記第２接着層は、前記第２被接着物に対する接着力が前記第１接着層よりも高く設定されているとともに、前記第２被接着物の前記第２電極端子が設けられていない部分で前記第１接着層よりも薄い厚みを有し、かつ、前記第２電極端子より薄い厚みを有して前記第２被接着物と接着されており、前記第２電極端子が、前記第２接着層を前記第２被接着物の前記第２電極端子が設けられていない部分に押し出して貫通することによって、前記第１電極端子と前記第２電極端子が、前記第１接着層の前記導電性粒子を介して電気的に接続されていることを特徴とする。   In the liquid crystal device of the present invention, the first adhesive layer and the second adhesive layer are interposed between the substrate of the liquid crystal panel provided with the first electrode terminal and the adherend provided with the second electrode terminal. And the first electrode terminal and the second electrode terminal are electrically connected to each other, wherein the thickness of the first electrode terminal from the surface of the substrate of the liquid crystal panel is the second The electrode terminal is thinner than the surface of the object to be bonded, the first adhesive layer includes conductive particles, and has a thickness larger than the diameter of the conductive particles, and the second adhesive layer is the conductive particles. In the liquid crystal device not including the first adhesive layer, the first adhesive layer is set to have higher adhesive force to the substrate of the liquid crystal panel than the second adhesive layer, and the first electrode terminal of the substrate of the liquid crystal panel is provided. Thickness that is thicker than the second adhesive layer The second adhesive layer is set to have a higher adhesive force with respect to the second adherend than the first adhesive layer, and the second adhesive layer is bonded to the substrate of the liquid crystal panel. The portion where the second electrode terminal is not provided has a thickness thinner than that of the first adhesive layer and is thinner than the second electrode terminal and is bonded to the second adherend. The second electrode terminal pushes and penetrates the second adhesive layer into a portion of the second adherend where the second electrode terminal is not provided, whereby the first electrode terminal and the second electrode The terminal is electrically connected through the conductive particles of the first adhesive layer.

本発明の液晶装置は、液晶パネルの基板と被接着物を接着する場合にあっては、第１接着層と液晶パネルの基板とを接しさせ、第２接着層と被接着物とを接しさせることができる。そうすることにより、各被接着物が各々に応じた接着特性の下で、他方の被接着物と接着されるため、被接着物同士の接着が強固なものになる。   In the liquid crystal device of the present invention, when the substrate of the liquid crystal panel and the adherend are bonded, the first adhesive layer and the substrate of the liquid crystal panel are brought into contact with each other, and the second adhesive layer and the adherend are brought into contact with each other. be able to. By doing so, since each adherend is bonded to the other adherend under the bonding characteristics corresponding to each, the adherence between the adherends becomes strong.

液晶パネルの基板と被接着物との間で電気的接続をとる必要が有る場合にあっては、本発明のように第１接着層中に導電性粒子を混入させれば良い。もちろん、第２接着層中にも導電性粒子を混入してもかまわないが、通常、液晶パネルの基板と被接着物との間で電気的接続をおこなう場合にあっては液晶パネルの基板と被接着物とを互いに押しつけるようにして接着する。そのため、第１接着層中にのみ導電性粒子を混入させれば電気的接続はできる。   In the case where it is necessary to establish electrical connection between the substrate of the liquid crystal panel and the adherend, conductive particles may be mixed into the first adhesive layer as in the present invention. Of course, conductive particles may also be mixed in the second adhesive layer, but in general, when electrical connection is made between the liquid crystal panel substrate and the adherend, Bonding is performed by pressing the objects to be bonded together. Therefore, electrical connection can be made by mixing conductive particles only in the first adhesive layer.

第１接着層中にのみ導電性粒子を配置すると、導電性粒子の数や配置を管理しやすいので、容易に異方導電性の接着剤を製造することができる。この場合において、第２接着層は被接着物との接着のみに利用できればよいため、第１接着層に比べて接着層の厚みを薄く形成することができ、第２接着層の厚みを第２電極端子の厚みより薄くする。   If the conductive particles are arranged only in the first adhesive layer, the number and arrangement of the conductive particles can be easily managed, so that the anisotropic conductive adhesive can be easily manufactured. In this case, since it is sufficient that the second adhesive layer can be used only for adhesion to the adherend, the thickness of the adhesive layer can be reduced compared to the first adhesive layer, and the thickness of the second adhesive layer can be reduced to the second. Make it thinner than the thickness of the electrode terminal.

また、液晶パネルの基板と被接着物の接着を圧着により行う際には、電極端子によって接着剤が押し出され、そして流出する。当然のことながら、電極端子の厚みが厚い電極端子によって押し出される接着剤の量の方が、厚みが薄い電極端子によって押し出される接着剤の量より多い。液晶パネルの基板と被接着物との間で確実な電気的接続を行うためには、導電性粒子の流出をなくすことが好ましい。本発明においては、導電性粒子が混入された第１接着層と、電極端子の厚みが薄い電極端子を有する基板とを接しさせるため、圧着の際の導電性粒子の流出を防止することができる。   Further, when the substrate of the liquid crystal panel and the adherend are bonded by pressure bonding, the adhesive is pushed out by the electrode terminal and flows out. As a matter of course, the amount of the adhesive pushed out by the electrode terminal having the thick electrode terminal is larger than the amount of the adhesive pushed out by the electrode terminal having the thin thickness. In order to make reliable electrical connection between the substrate of the liquid crystal panel and the adherend, it is preferable to eliminate the outflow of conductive particles. In the present invention, since the first adhesive layer mixed with the conductive particles is brought into contact with the substrate having the electrode terminal with a thin electrode terminal, it is possible to prevent the conductive particles from flowing out during the pressure bonding. .

第１接着層及び第２接着層の接着特性を調整する具体的な手段としては、
（１）第１接着層中の絶縁性接着材料の主成分と第２接着層中の絶縁性接着材料の主成分を異なったものとする
（２）第１接着層及び第２接着層とに異なるカップリング剤を添加する
（３）絶縁性接着材料の主成分並びに添加するカップリング剤を第１接着層と第２接着層とで異なるものを利用する
等が考えられるが、第１接着層と第２接着層とで同一の絶縁性接着材料を用い、そして第１接着層には第１被接着物に応じた第１カップリング剤を添加し、第２接着層には第２被接着物に応じた第２カップリング剤を添加すれば、カップリング剤の種類を変えるだけで接着剤の特性を変化させることができるので、使用する絶縁性接着材料の種類を少なくでき、製造効率を向上できてコストも低減できる。 As a specific means for adjusting the adhesive properties of the first adhesive layer and the second adhesive layer,
(1) The main component of the insulating adhesive material in the first adhesive layer is different from the main component of the insulating adhesive material in the second adhesive layer. (2) The first adhesive layer and the second adhesive layer are different. Add different coupling agent (3) The main component of the insulating adhesive material and the coupling agent to be added may be different for the first adhesive layer and the second adhesive layer. The same insulating adhesive material is used for the second adhesive layer, and a first coupling agent corresponding to the first adherend is added to the first adhesive layer, and the second adhesive layer is attached to the second adhesive layer. If the second coupling agent according to the product is added, the characteristics of the adhesive can be changed simply by changing the type of the coupling agent, so the number of insulating adhesive materials to be used can be reduced, and the production efficiency can be reduced. It can be improved and cost can be reduced.

また、本発明の液晶装置における被接着物を回路基板とすることができる。この発明の液晶装置によれば、液晶パネルの基板（主にガラス基板）と、回路基板（主に高分子基板）との接続に、それぞれの基板に応じた接着特性を有する複数の接着層がある接着剤を用いる。その結果、双方の基板の接着力が均一に強固なものなり、液晶装置の接続信頼性が向上する。   Moreover, the adherend in the liquid crystal device of the present invention can be used as a circuit board. According to the liquid crystal device of the present invention, a plurality of adhesive layers having adhesive properties corresponding to each substrate are connected to a circuit board (mainly a polymer substrate) and a substrate of the liquid crystal panel (mainly a glass substrate). Use some adhesive. As a result, the adhesive strength between the two substrates is uniformly strong, and the connection reliability of the liquid crystal device is improved.

一般的に、液晶パネルの基板と外部回路基板との接続は圧着により行う。この圧着の際には、電極端子によって接着剤が押し出され、そして流出する。当然のことながら、電極端子の厚みが厚い電極端子によって押し出される接着剤の量の方が、厚みが薄い電極端子によって押し出される接着剤の量より多い。液晶パネルの基板と外部回路基板との間で確実な電気的接続を行うためには、導電性粒子の流出をなくすことが好ましい。本発明においては、導電性粒子が混入された第１接着層と、電極端子厚みが薄い電極端子が形成された基板とを接しさせるため、圧着の際の導電性粒子の流出を防止することができる。   In general, the connection between the substrate of the liquid crystal panel and the external circuit substrate is made by pressure bonding. During the crimping, the adhesive is pushed out by the electrode terminal and flows out. As a matter of course, the amount of the adhesive pushed out by the electrode terminal having the thick electrode terminal is larger than the amount of the adhesive pushed out by the electrode terminal having the thin thickness. In order to ensure reliable electrical connection between the substrate of the liquid crystal panel and the external circuit substrate, it is preferable to eliminate the outflow of conductive particles. In the present invention, since the first adhesive layer mixed with the conductive particles is brought into contact with the substrate on which the electrode terminal having the thin electrode terminal thickness is formed, it is possible to prevent the conductive particles from flowing out during the crimping. it can.

また、本発明の液晶装置における被接着物を半導体素子とすることができる。この発明によれば、液晶パネル基板上に半導体素子を直接実装するいわゆるＣＯＧ（Ｃhip on Ｇlass）方式の液晶装置において、液晶パネル基板と半導体素子との接続を強固なものにすることができる。   Moreover, the adherend in the liquid crystal device of the present invention can be a semiconductor element. According to the present invention, in a so-called COG (Chip on Glass) type liquid crystal device in which a semiconductor element is directly mounted on a liquid crystal panel substrate, the connection between the liquid crystal panel substrate and the semiconductor element can be strengthened.

一般的には、液晶パネル基板に形成された電極端子は透明導電膜（ＩＴＯ）であり、回路基板あるいは半導体素子に形成された電極端子は金属膜である場合が多く、その場合においては、第１の接着層は液晶パネル基板と接し、第２の接着層は前記回路基板と接しさせるとよい。なぜならば、通常、ＩＴＯは金属膜より薄く形成されるからである。   In general, the electrode terminal formed on the liquid crystal panel substrate is a transparent conductive film (ITO), and the electrode terminal formed on the circuit substrate or the semiconductor element is often a metal film. The first adhesive layer may be in contact with the liquid crystal panel substrate, and the second adhesive layer may be in contact with the circuit substrate. This is because ITO is usually formed thinner than a metal film.

本発明の電子機器は、上述した液晶装置を表示部として備え、且つ前記表示部が収納される筺体を備えることを特徴とする。本発明の電子機器とは、例えば、携帯電話、腕時計、ノートパソコンなどであり、液晶装置と外部回路又は半導体素子との接着に本発明の電子部品の接着構造を用いているので、液晶パネルと外部回路又は半導体素子の接着力を向上でき、液晶装置や電子機器の不良品の発生率を低減できて製造コストも低減することができる。   According to another aspect of the invention, there is provided an electronic apparatus including the above-described liquid crystal device as a display unit and a housing in which the display unit is stored. The electronic device of the present invention is, for example, a mobile phone, a wrist watch, a notebook personal computer, etc., and uses the bonding structure of the electronic component of the present invention for bonding the liquid crystal device to an external circuit or a semiconductor element. The adhesive force of an external circuit or a semiconductor element can be improved, the incidence of defective products of liquid crystal devices and electronic devices can be reduced, and the manufacturing cost can be reduced.

以下に図面に示した本発明の実施の形態を参照しながらさらに詳しく説明する。   Hereinafter, the present invention will be described in more detail with reference to the embodiments of the present invention shown in the drawings.

図１には、本発明の接着構造の第１実施形態に用いる接着剤１が示されている。接着剤１は、複数の導電粒子３が配置された第１の接着層４と、この第１の接着層４の上に積層された第２の接着層５とを備えている。   FIG. 1 shows an adhesive 1 used in the first embodiment of the adhesive structure of the present invention. The adhesive 1 includes a first adhesive layer 4 in which a plurality of conductive particles 3 are disposed, and a second adhesive layer 5 laminated on the first adhesive layer 4.

導電粒子３は、半田粒子、Ｎｉ、Ａｕ、Ａｇ、Ｃｕ、Ｐｂ、Ｓｎ等の単独の金属粒子や、複数の金属の混合物、合金、メッキなどによる複合金属粒子でもよいし、プラスチック粒子（ポリスチレン系、ポリカーボネート系、アクリル系、ジベニルベンゼン系樹脂）にＮｉ、Ａｕ、Ｃｕ、Ｆｅ等の単独または複数のメッキをした粒子やカーボン粒子などでもよい。   The conductive particles 3 may be solder metal, single metal particles such as Ni, Au, Ag, Cu, Pb and Sn, composite metal particles such as a mixture of a plurality of metals, alloys and plating, or plastic particles (polystyrene type). Further, it may be particles such as Ni, Au, Cu, Fe, etc., or a plurality of plated particles or carbon particles.

また、第１の接着層４と第２の接着層５とには、各接着層４，５が接着される被接着物との接着力が高い絶縁性接着材料が主成分として用いられている。   Further, the first adhesive layer 4 and the second adhesive layer 5 are mainly composed of an insulating adhesive material having a high adhesive force with the adherend to which the adhesive layers 4 and 5 are bonded. .

例えば、図２に示すように、接着剤１が、液晶パネルのガラス基板１１上に設けられた電極端子１２と、ＴＣＰ１３の電極端子１４との間に配置される場合、第１の接着層４は、ガラス基板１１およびＩＴＯ等からなる端子１２との接着力が高い絶縁性接着材料を主成分とし、第２の接着層５は、ポリイミド製のＴＣＰ１３および銅の表面に錫メッキを施した電極端子１４との接着力が高い絶縁性接着材料を主成分として用いている。   For example, as shown in FIG. 2, when the adhesive 1 is disposed between the electrode terminal 12 provided on the glass substrate 11 of the liquid crystal panel and the electrode terminal 14 of the TCP 13, the first adhesive layer 4 Is mainly composed of an insulating adhesive material having a high adhesive force with the glass substrate 11 and the terminal 12 made of ITO or the like, and the second adhesive layer 5 is made of polyimide TCP 13 and a copper-plated electrode with tin plating. An insulating adhesive material having high adhesive strength with the terminal 14 is used as a main component.

なお、第１の接着層４は、ガラス基板１１および電極端子１２に接着されるが、より接着面積が大きいのはガラス基板１１との接着であるから、ガラス基板１１との接着力がより大きくなるような絶縁性接着材料を主成分として用いてもよい。   The first adhesive layer 4 is bonded to the glass substrate 11 and the electrode terminal 12, but since the adhesive area is larger with the glass substrate 11, the first adhesive layer 4 has a larger adhesive force with the glass substrate 11. Such an insulating adhesive material may be used as a main component.

同様に、第２の接着層５も、接着面積が大きなＴＣＰ１３（ポリイミド製）との接着力がより大きくなるような絶縁性接着材料を主成分として用いてもよい。   Similarly, the second adhesive layer 5 may also be made of an insulating adhesive material that has a greater adhesive force with the TCP 13 (made of polyimide) having a large adhesion area as a main component.

各接着層４，５の主成分として用いられる絶縁性接着材料は、具体的には、スチレンブタジエンスチレン（ＳＢＳ）系、エポキシ系、アクリル系、ポリエステル系、ウレタン系等の単独または複数の混合物もしくは化合物等である。この際、各接着層４，５の主成分として、異なる種類の絶縁性接着材料を用いてもよいが、本実施形態では同じ種類の絶縁性接着材料を用い、添加するカップリング剤の種類を変えて接着特性を変えている。   Specifically, the insulating adhesive material used as the main component of each of the adhesive layers 4 and 5 is a single or a mixture of styrene butadiene styrene (SBS), epoxy, acrylic, polyester, urethane, etc. Compounds and the like. At this time, different types of insulating adhesive materials may be used as the main components of the adhesive layers 4 and 5, but in this embodiment, the same type of insulating adhesive material is used, and the type of coupling agent to be added is changed. Change the adhesive properties.

接着層４に用いる具体的なカップリング剤としては、ジメチルジメトキシシラン、γ−アミノプロピルトリエトキシシラン等が上げられるが、官能基としてメトキシ基又はエトキシ基を多く含むカップリング剤であればガラスとの接着強度を高めることができる。   Specific examples of the coupling agent used for the adhesive layer 4 include dimethyldimethoxysilane, γ-aminopropyltriethoxysilane, and the like. If the coupling agent contains many methoxy groups or ethoxy groups as functional groups, glass and The adhesive strength can be increased.

また、接着層５に用いる具体的なカップリング剤としては、Ｎ−β（アミノエチル）γ−アミノプロピルトリメトキシシラン、γグリシドキプロピルトリメトキシシラン等が上げられるが、官能基としてアミノ基、エポキシ基を多く含むカップリング剤であればポリイミドとの接着強度を高めることができる。   Specific coupling agents used for the adhesive layer 5 include N-β (aminoethyl) γ-aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and the like. If it is a coupling agent containing many epoxy groups, the adhesive strength with a polyimide can be raised.

このような構成の接着剤１は、例えば、導電粒子３が配合された第１の接着層４を、製造用ベース板やセパレータ上に積層し、その上に、第２の接着層５を積層することなどで製造される。   In the adhesive 1 having such a configuration, for example, a first adhesive layer 4 in which conductive particles 3 are blended is laminated on a manufacturing base plate or a separator, and a second adhesive layer 5 is laminated thereon. It is manufactured by doing.

このように構成された接着剤１は、図２に示すように、液晶パネルのガラス基板１１と、ＴＣＰ１３との間に配置される。そして、各電極端子１２，１４を熱圧着などによって接着剤１側に押し込み、各電極端子１２，１４間に導電粒子３を介在させて導通するとともに、各接着層４，５でガラス基板１１およびＴＣＰ１３とを接着する。   As shown in FIG. 2, the adhesive 1 configured as described above is disposed between the glass substrate 11 of the liquid crystal panel and the TCP 13. Then, the electrode terminals 12 and 14 are pushed into the adhesive 1 side by thermocompression bonding or the like, and the conductive particles 3 are interposed between the electrode terminals 12 and 14, and the glass substrate 11 and the adhesive layers 4 and 5 are connected. Adhere to TCP13.

このような手順により、図３に示すように、液晶パネル１０と、液晶ドライバＩＣ１５が搭載されたＴＣＰ１３とが接着剤１で接着された液晶装置１００が構成される。この液晶装置１００は、各種の電子機器の筐体に組み込まれて利用される。例えば、図４に示す携帯電話２００の筐体２０１内に組み込まれたり、図５に示すノートパソコン３００の筐体３０１内に組み込まれて利用される。   With such a procedure, as shown in FIG. 3, a liquid crystal device 100 in which the liquid crystal panel 10 and the TCP 13 on which the liquid crystal driver IC 15 is mounted is bonded with the adhesive 1 is configured. The liquid crystal device 100 is used by being incorporated in a housing of various electronic devices. For example, it is incorporated in the case 201 of the mobile phone 200 shown in FIG. 4 or incorporated in the case 301 of the notebook computer 300 shown in FIG.

このような第１実施形態においては、次のような効果がある。
第１および第２の２種類の接着層４，５を積層して接着剤１を構成したので、ガラス基板１１や電極端子１２に接着される第１の接着層４をこれらのガラス基板１１などとの接着力が高い種類の接着層とし、ＴＣＰ１３や端子１４に接着される第２の接着層５をこれらのＴＣＰ１３などとの接着力が高い種類の接着層で構成することができる。このため、従来のように、１種類の接着層でガラス基板１１、ＴＣＰ１３を接着させる場合に比べて、各被接着物１１，１３との接着力を向上でき、接着特性に優れた接着剤１とすることができる。 Such a first embodiment has the following effects.
Since the adhesive 1 is configured by laminating the first and second types of adhesive layers 4 and 5, the first adhesive layer 4 bonded to the glass substrate 11 and the electrode terminal 12 is used as the glass substrate 11 and the like. And the second adhesive layer 5 bonded to the TCP 13 and the terminal 14 can be formed of a type of adhesive layer having a high adhesive force with the TCP 13 and the like. For this reason, compared with the case where the glass substrate 11 and TCP13 are adhere | attached by 1 type of adhesive layers conventionally, the adhesive force with each to-be-adhered object 11 and 13 can be improved, and the adhesive agent 1 excellent in the adhesive characteristic. It can be.

導電粒子３は、第１の接着層４のみに含まれているので、各接着層４，５の両方に導電粒子３を配置する場合に比べて、導電粒子３の数や配置を管理しやすく、容易に製造することができる。また、各接着層４，５の接着特性を変えるにあたって、絶縁性接着材料の種類を変えずに添加するカップリング剤の種類を変えているので、各接着層４，５の接着特性を低コストでかつ容易に設定することができる。   Since the conductive particles 3 are included only in the first adhesive layer 4, it is easier to manage the number and arrangement of the conductive particles 3 than in the case where the conductive particles 3 are arranged in both the adhesive layers 4 and 5. Can be manufactured easily. Moreover, when changing the adhesive properties of the adhesive layers 4 and 5, the type of the coupling agent to be added is changed without changing the type of the insulating adhesive material, so that the adhesive properties of the adhesive layers 4 and 5 are reduced in cost. And can be set easily.

また、一般的に、ガラス基板１１とＴＣＰ１３との接着は圧着により行う。この圧着の際には、電極端子によって接着剤が押し出され、そして流出する。当然のことながら、電極端子の厚みが厚い電極端子によって押し出される接着剤の量の方が、厚みが薄い電極端子によって押し出される接着剤の量より多い。ガラス基板１１とＴＣＰ１３との間で確実な電気的接続を行うためには、導電性粒子３の流出をなくすことが好ましい。本発明においては、導電性粒子３が混入された第１接着層４と、厚さが薄い方の電極端子１２が形成されたガラス基板１１とを接しさせるため、圧着の際の導電性粒子３の流出を防止することができる。   In general, the glass substrate 11 and the TCP 13 are bonded by pressure bonding. During the crimping, the adhesive is pushed out by the electrode terminal and flows out. As a matter of course, the amount of the adhesive pushed out by the electrode terminal having the thick electrode terminal is larger than the amount of the adhesive pushed out by the electrode terminal having the thin thickness. In order to perform reliable electrical connection between the glass substrate 11 and the TCP 13, it is preferable to eliminate the outflow of the conductive particles 3. In the present invention, the first adhesive layer 4 mixed with the conductive particles 3 is brought into contact with the glass substrate 11 on which the electrode terminal 12 having a smaller thickness is formed. Can be prevented from flowing out.

次に、本発明の第２実施形態について、図６，７を参照して説明する。なお、本実施形態において、前記第１実施形態と同一または同様の構成部分には同一符号を付し、説明を省略あるいは簡略する。   Next, a second embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the same or similar components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.

第２実施形態の接着剤１（異方導電性接着剤）は、複数の導電粒子３が配置された導電層４と、この導電層４の下に積層された第１の接着層６と、導電層４の上に積層された第２の接着層５とを備えている。   The adhesive 1 (anisotropic conductive adhesive) of the second embodiment includes a conductive layer 4 in which a plurality of conductive particles 3 are arranged, a first adhesive layer 6 laminated under the conductive layer 4, And a second adhesive layer 5 laminated on the conductive layer 4.

ここで、導電層４は、導電粒子３を配合しやすい接着剤で構成され、また、導電粒子３が膜厚方向には一列（一層）となるように比較的薄く形成されている。導電粒子が一層であれば、接着時に端子間に移動する導電粒子の量も少なくなり、端子間がショートする可能性も更に低下する。   Here, the conductive layer 4 is made of an adhesive that easily mixes the conductive particles 3, and is formed relatively thin so that the conductive particles 3 are arranged in a row (one layer) in the film thickness direction. If the number of conductive particles is one, the amount of conductive particles that move between terminals during bonding is reduced, and the possibility of short-circuiting between terminals is further reduced.

また、第１および第２の接着層６，５は、前記第１実施形態における接着層４，５と同様に、各接着層６，５が接着される被接着物との接着力が高い接着層で構成されている。
例えば、図７に示すように、接着剤１が、液晶パネルのガラス基板１１上に設けられた電極端子１２と、ＩＣ２１の端子（バンプ）２２との間に配置される場合、第１の接着層６は、ガラス基板１１およびＩＴＯ等からなる電極端子１２との接着力が高い接着層が用いられ、第２の接着層５は、セラミックなどからなるＩＣ２１のパッケージおよび金メッキを施した端子２２との接着力が高い接着層が用いられる。 Also, the first and second adhesive layers 6 and 5 are bonded with high adhesive strength to the adherend to which the adhesive layers 6 and 5 are bonded, like the adhesive layers 4 and 5 in the first embodiment. Consists of layers.
For example, as shown in FIG. 7, when the adhesive 1 is disposed between the electrode terminal 12 provided on the glass substrate 11 of the liquid crystal panel and the terminal (bump) 22 of the IC 21, the first adhesion is performed. As the layer 6, an adhesive layer having a high adhesive force with the glass substrate 11 and the electrode terminal 12 made of ITO or the like is used. An adhesive layer having a high adhesive strength is used.

なお、本実施形態においても、第１の接着層６は、ガラス基板１１との接着面積が大きいから、ガラス基板１１との接着力がより大きくなるような接着層を用いてもよいし、第２の接着層５も、接着面積が大きなＩＣ２１との接着力がより大きくなるような接着層を用いてもよい。なお、各接着層６、５及び導電層４に主成分として用いる絶縁性接着材料は、前記第１実施形態と同様であり、添加するカップリング剤の種類を変えて接着特性を変化させている。   In the present embodiment, the first adhesive layer 6 has a large adhesive area with the glass substrate 11, and therefore, an adhesive layer that increases the adhesive force with the glass substrate 11 may be used. The second adhesive layer 5 may also be an adhesive layer that has a larger adhesive force with the IC 21 having a large adhesion area. The insulating adhesive material used as the main component for each of the adhesive layers 6 and 5 and the conductive layer 4 is the same as that of the first embodiment, and the adhesive properties are changed by changing the type of coupling agent to be added. .

このような構成の接着剤１は、例えば、第１の接着層６を、製造用ベース板やセパレータ上に積層し、その上に、導電粒子３が配合された導電層４および第２の接着層５を順次積層することなどで製造される。   In the adhesive 1 having such a configuration, for example, the first adhesive layer 6 is laminated on a manufacturing base plate or a separator, and the conductive layer 4 in which the conductive particles 3 are blended thereon and the second adhesive. The layer 5 is manufactured by laminating sequentially.

このように構成された接着剤１は、図７に示すように、液晶パネルのガラス基板１１と、ＩＣ２１との間に配置される。そして、各電極端子１２，２２を熱圧着などによって接着剤１側に押し込み、各端子１２，２２間に導電粒子３を介在させて導通するとともに、各接着層６，５でガラス基板１１およびＩＣ２１を接着する。また、ＩＣ２１に信号を入力するために、ＩＣ２１の入力端子に接続されている電極端子１２にフレキシブル基板を接続するが、そのフレキシブル基板とガラス基板上の電極端子１２との接続には、第１の実施形態で示した接着剤を用いるのが好ましい。   As shown in FIG. 7, the adhesive 1 configured in this way is disposed between the glass substrate 11 of the liquid crystal panel and the IC 21. Then, the electrode terminals 12 and 22 are pushed into the adhesive 1 side by thermocompression bonding or the like, and the conductive particles 3 are interposed between the terminals 12 and 22 so that they are electrically connected. Glue. In order to input a signal to the IC 21, a flexible substrate is connected to the electrode terminal 12 connected to the input terminal of the IC 21. For connection between the flexible substrate and the electrode terminal 12 on the glass substrate, the first terminal is used. It is preferable to use the adhesive shown in the embodiment.

このような実施例２においても、前記実施例１と同様の効果がある。
すなわち、第１の接着層６、第２の接着層５及び導電層４の３つの層を積層して接着剤１を構成したので、ガラス基板１１や電極端子１２に接着される第１の接着層６をこれらのガラス基板１１などとの接着力が高い種類の接着層とし、ＩＣ２１や電極端子２２に接着される第２の接着層５をこれらのＩＣ２１などとの接着力が高い種類の接着層で構成することができる。このため、従来のように、１種類の接着層でガラス基板１１、ＩＣ２１と接着させる場合に比べて、各被接着物との接着力を向上でき、接着特性に優れた接着剤１とすることができる。 Such Example 2 also has the same effect as Example 1.
That is, since the adhesive 1 is configured by laminating the three layers of the first adhesive layer 6, the second adhesive layer 5, and the conductive layer 4, the first adhesion bonded to the glass substrate 11 and the electrode terminal 12 is performed. The layer 6 is a kind of adhesive layer having a high adhesive force with the glass substrate 11 and the like, and the second adhesive layer 5 to be adhered to the IC 21 and the electrode terminal 22 is a kind of adhesive having a high adhesive force with the IC 21 and the like. Can be composed of layers. For this reason, compared with the case where it adheres with the glass substrate 11 and IC21 with one type of adhesive layer like before, adhesive strength with each to-be-adhered object can be improved, and it is set as the adhesive 1 excellent in the adhesive characteristic. Can do.

導電粒子３は、導電層４のみに含まれているので、接着層６、５及び導電層４に導電粒子３を配置する場合に比べて、導電粒子３の数や配置を管理しやすく、容易に製造することができる。   Since the conductive particles 3 are included only in the conductive layer 4, the number and arrangement of the conductive particles 3 can be easily managed and easily compared to the case where the conductive particles 3 are arranged in the adhesive layers 6, 5 and the conductive layer 4. Can be manufactured.

第１、第２の接着層６，５は、導電粒子３が配置されないため、膜厚を任意に形成できる。本発明においては第１接着層６の厚さを第２接着層５の厚さに比べて薄く形成している。これによって、第１実施形態と同様に第１接着層６と、厚さが薄い方の電極端子１２が形成されたガラス基板１１とを接しさせることができ、圧着の際の導電性粒子３の流出を防止することができる。   Since the first and second adhesive layers 6 and 5 are not provided with the conductive particles 3, the film thickness can be arbitrarily formed. In the present invention, the first adhesive layer 6 is formed thinner than the second adhesive layer 5. As a result, as in the first embodiment, the first adhesive layer 6 can be brought into contact with the glass substrate 11 on which the electrode terminal 12 having the smaller thickness is formed. Outflow can be prevented.

各接着層６，５の接着特性は、添加するカップリング剤の種類で変化させているので、各接着層６，５の接着特性を低コストでかつ容易に設定することができる。   Since the adhesive properties of the adhesive layers 6 and 5 are changed depending on the type of coupling agent to be added, the adhesive properties of the adhesive layers 6 and 5 can be easily set at low cost.

さらに、第２実施形態によれば、導電粒子３が含まれる導電層４は，接着剤１の中間に配置されて被接着物に直接接触しないため、被接着物１１，２１に合わせて材質を選定する必要がない。このため、接着剤１がどのような被接着物に接着される場合でも、それらの被接着物に応じて第１の接着層６及び第２の接着層５を設定すればよく、導電層４は共通して利用することができるので、様々な接着特性を有する接着剤１を製造するにあたって、製造効率を向上できてコストも低減できる。   Furthermore, according to the second embodiment, the conductive layer 4 containing the conductive particles 3 is arranged in the middle of the adhesive 1 and does not directly contact the adherend, so that the material is selected according to the adherends 11 and 21. There is no need to select. For this reason, even when the adhesive 1 is bonded to any adherend, the first adhesive layer 6 and the second adhesive layer 5 may be set according to the adherend, and the conductive layer 4 Can be used in common, so that the manufacturing efficiency can be improved and the cost can be reduced in manufacturing the adhesive 1 having various adhesive properties.

導電粒子３は、接着剤１の膜厚方向には１列（一層）となるように配置されているため、各電極端子１２，２２間に介在される導電粒子３の数は、各電極端子１２，２２の接続面の面積と、導電粒子３の単位面積当たりの散布数とで容易に管理でき、各電極端子１２，２２間に介在される導電粒子３の数、つまり導通性能を高精度に調整、設定することができる。   Since the conductive particles 3 are arranged in one row (one layer) in the film thickness direction of the adhesive 1, the number of the conductive particles 3 interposed between the electrode terminals 12 and 22 depends on the number of the electrode terminals. 12 and 22 can be easily managed by the area of the connection surface and the number of sprayed conductive particles 3 per unit area, and the number of conductive particles 3 interposed between the electrode terminals 12 and 22, that is, the conduction performance is highly accurate. Can be adjusted and set.

なお、本発明は前述の各実施形態に限定されるものではなく、本発明の目的を達成できる範囲での変形、改良等は本発明に含まれるものである。   The present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.

例えば、前記各実施形態では、導電粒子３は、第１実施形態における第１の接着層又は第２実施形態における導電層４のみに含まれていたが、他の層、例えば第１の実施形態における第２の接着層５や第２の実施形態における第２の接着層５にも含ませる、又は、第１の実施形態における第１の接着層４又は第２の実施形態における導電層４には導電粒子を含ませず、他の層、例えば第１の実施形態における第２の接着層５や第２の実施形態における第２の接着層５のみに導電粒子を含ませる、といった構成を採用しても、接着強度という点においては第１又は第２に実施形態と同様の効果を得ることができる。   For example, in each of the above embodiments, the conductive particles 3 are included only in the first adhesive layer in the first embodiment or the conductive layer 4 in the second embodiment, but other layers, for example, the first embodiment. In the second adhesive layer 5 in the second embodiment and the second adhesive layer 5 in the second embodiment, or in the first adhesive layer 4 in the first embodiment or the conductive layer 4 in the second embodiment. Adopts a configuration in which the conductive particles are not included, and other layers, for example, the second adhesive layer 5 in the first embodiment and the second adhesive layer 5 in the second embodiment only include the conductive particles. Even in the point of adhesive strength, the same effect as the first or second embodiment can be obtained.

また、導電粒子３は、図１に示すように、膜厚が比較的厚い接着剤層に均一に配置してもよいし、図６に示すように、膜厚が比較的薄い接着剤層に膜厚方向には１〜２列程度となるように配置してもよい。   In addition, the conductive particles 3 may be uniformly disposed in a relatively thick adhesive layer as shown in FIG. 1, or the conductive particles 3 may be placed in a relatively thin adhesive layer as shown in FIG. You may arrange | position so that it may become about 1 to 2 rows in a film thickness direction.

さらに、接着剤１としては、４層以上の積層構造を有するものでもよい。この場合には、ガラス基板１１やＴＣＰ１３、ＩＣ２１に接着される接着剤のほかに、各電極端子１２，１４，２２に接着される接着層を別途設けて、各々の接着層を被接着物１２，１４，２２に適したものを利用することができ、接着剤と被接着物との接着力をより一層向上することができる。   Further, the adhesive 1 may have a laminated structure of four or more layers. In this case, in addition to the adhesive bonded to the glass substrate 11, the TCP 13, and the IC 21, an adhesive layer bonded to each electrode terminal 12, 14, 22 is separately provided, and each adhesive layer is attached to the object to be bonded 12. , 14, 22 can be used, and the adhesive force between the adhesive and the adherend can be further improved.

また、第２実施形態の３層構造の接着剤１を、第１実施形態の液晶パネル用ガラス基板１１の電極端子１２と、ＴＣＰ１３の電極端子１４との導通接続に用いてもよいし、逆に、第１実施形態の２層構造の接着剤１を、第２実施形態のガラス基板１１およびＩＣ２１の接着に用いてもよい。   Moreover, you may use the adhesive agent 1 of the 3 layer structure of 2nd Embodiment for the conductive connection of the electrode terminal 12 of the glass substrate 11 for liquid crystal panels of 1st Embodiment, and the electrode terminal 14 of TCP13, and vice versa. Moreover, you may use the adhesive agent 1 of the 2 layer structure of 1st Embodiment for adhesion | attachment of the glass substrate 11 and IC21 of 2nd Embodiment.

さらに、本発明の接着剤は、液晶パネル用の部品の接着に限らず、各種電気部品同士の導通に広く利用することができる。また、各接着層４、５、６及び導電層４の接着特性を設定するには、カップリング剤を添加する場合に限らず、絶縁性接着材料の主成分の種類自体を変えて設定してもよいし、他の添加物等を適宜加えて設定してもよい。   Furthermore, the adhesive of the present invention can be widely used not only for bonding components for liquid crystal panels but also for conduction between various electric components. Further, the adhesive properties of the adhesive layers 4, 5, 6 and the conductive layer 4 are not limited to the case where a coupling agent is added, but can be set by changing the type of the main component of the insulating adhesive material itself. Alternatively, other additives and the like may be added as appropriate.

要するに、接着剤１の接着層４、５、６及び導電層４や導電粒子３の材質（絶縁性接着材料の主成分の種類や添加するカップリング剤の種類）、大きさ（膜厚や粒子径）等は、適用する被接着物の種類に応じて適宜設定すればよい。従って、本発明の接着剤１を用いた電子機器としても、携帯電話２００やノートパソコン３００のように液晶装置１００を表示部として備えるものに限らず、液晶装置を備えない各種電子機器にも適用できる。   In short, the adhesive layers 4, 5, 6 of the adhesive 1, the material of the conductive layer 4 and the conductive particles 3 (the type of the main component of the insulating adhesive material and the type of coupling agent to be added), the size (the film thickness and the particles) (Diameter) and the like may be appropriately set according to the type of adherend to be applied. Therefore, the electronic device using the adhesive 1 of the present invention is not limited to the electronic device provided with the liquid crystal device 100 as a display unit, such as the mobile phone 200 or the notebook personal computer 300, but also applied to various electronic devices not provided with the liquid crystal device. it can.

本発明の第１実施形態で用いる接着剤の断面を示す図である。It is a figure which shows the cross section of the adhesive agent used in 1st Embodiment of this invention. 第１実施形態における液晶パネル基板とＴＣＰ基板との接続部分の断面を示す図である。It is a figure which shows the cross section of the connection part of the liquid crystal panel board | substrate and TCP board | substrate in 1st Embodiment. 本発明における液晶装置の斜視図である。It is a perspective view of the liquid crystal device in the present invention. 本発明における携帯電話の斜視図である。It is a perspective view of a mobile phone in the present invention. 本発明におけるノートパソコンを示す斜視図である。It is a perspective view which shows the notebook computer in this invention. 本発明の第２実施形態における接着剤の断面を示す図である。It is a figure which shows the cross section of the adhesive agent in 2nd Embodiment of this invention. 本発明の第２実施形態における液晶パネル基板と半導体素子との接続部分の断面を示す図である。It is a figure which shows the cross section of the connection part of the liquid crystal panel substrate and semiconductor element in 2nd Embodiment of this invention.

Claims (7)

第１電極端子が設けられた第１被接着物と、第２電極端子が設けられた第２被接着物との間に第１接着層と第２接着層を介在させて接着し、前記第１電極端子と前記第２電極端子とを電気的に接続する接着構造であって、
前記第１電極端子の前記第１被接着物の表面からの厚さは、前記第２電極端子の前記第２被接着物の表面からの厚さより薄く、前記第１接着層は導電性粒子を含み該導電性粒子の直径よりも大きな厚みを有し、前記第２接着層は前記導電性粒子を含まない接着構造において、
前記第１接着層は、前記第１被接着物に対する接着力が前記第２接着層よりも高く設定されているとともに、前記第１被接着物の前記第１電極端子が設けられていない部分で前記第２接着層よりも厚い厚みを有して前記第１被接着物と接着されており、
前記第２接着層は、前記第２被接着物に対する接着力が前記第１接着層よりも高く設定されているとともに、前記第２被接着物の前記第２電極端子が設けられていない部分で前記第１接着層よりも薄い厚みを有し、かつ、前記第２電極端子より薄い厚みを有して前記第２被接着物と接着されており、
前記第２電極端子が、前記第２接着層を前記第２被接着物の前記第２電極端子が設けられていない部分に押し出して貫通することによって、前記第１電極端子と前記第２電極端子が、前記第１接着層の前記導電性粒子を介して電気的に接続されていることを特徴とする接着構造。 Adhering between the first adherend provided with the first electrode terminal and the second adherend provided with the second electrode terminal with a first adhesive layer and a second adhesive layer interposed therebetween, An adhesive structure for electrically connecting one electrode terminal and the second electrode terminal,
The thickness of the first electrode terminal from the surface of the first adherend is thinner than the thickness of the second electrode terminal from the surface of the second adherend, and the first adhesive layer includes conductive particles. And having a thickness larger than the diameter of the conductive particles, and the second adhesive layer does not include the conductive particles,
The first adhesive layer is a portion where the adhesive force to the first adherend is set higher than that of the second adhesive layer, and the first electrode terminal of the first adherend is not provided. It has a thickness thicker than the second adhesive layer and is bonded to the first adherend,
The second adhesive layer is a portion where the adhesive force to the second adherend is set higher than that of the first adhesive layer and the second electrode terminal of the second adherend is not provided. It has a thickness thinner than the first adhesive layer, and has a thickness thinner than the second electrode terminal, and is bonded to the second adherend,
The second electrode terminal pushes and penetrates the second adhesive layer through a portion of the second adherend where the second electrode terminal is not provided, whereby the first electrode terminal and the second electrode terminal Are electrically connected through the conductive particles of the first adhesive layer. 第１電極端子が設けられた液晶パネルの基板と、第２電極端子が設けられた被接着物との間に第１接着層と第２接着層を介在させて接着し、前記第１電極端子と前記第２電極端子とを電気的に接続する液晶装置であって、
前記第１電極端子の前記液晶パネルの基板の表面からの厚さは、前記第２電極端子の前記被接着物の表面からの厚さより薄く、前記第１接着層は導電性粒子を含み該導電性粒子の直径よりも大きな厚みを有し、前記第２接着層は前記導電性粒子を含まない液晶装置において、
前記第１接着層は、前記液晶パネルの基板に対する接着力が前記第２接着層よりも高く設定されているとともに、前記液晶パネルの基板の前記第１電極端子が設けられていない部分で前記第２接着層よりも厚い厚みを有して前記液晶パネルの基板と接着されており、
前記第２接着層は、前記第２被接着物に対する接着力が前記第１接着層よりも高く設定されているとともに、前記第２被接着物の前記第２電極端子が設けられていない部分で前記第１接着層よりも薄い厚みを有し、かつ、前記第２電極端子より薄い厚みを有して前記第２被接着物と接着されており、
前記第２電極端子が、前記第２接着層を前記第２被接着物の前記第２電極端子が設けられていない部分に押し出して貫通することによって、前記第１電極端子と前記第２電極端子が、前記第１接着層の前記導電性粒子を介して電気的に接続されていることを特徴とする液晶装置。 The first electrode terminal is bonded with a first adhesive layer and a second adhesive layer interposed between the substrate of the liquid crystal panel provided with the first electrode terminal and the adherend provided with the second electrode terminal. And a liquid crystal device that electrically connects the second electrode terminal,
The thickness of the first electrode terminal from the surface of the substrate of the liquid crystal panel is thinner than the thickness of the second electrode terminal from the surface of the adherend, and the first adhesive layer includes conductive particles and the conductive layer is electrically conductive. In the liquid crystal device having a thickness larger than the diameter of the conductive particles, the second adhesive layer does not include the conductive particles,
The first adhesive layer is set such that the adhesive force of the liquid crystal panel to the substrate is higher than that of the second adhesive layer, and the first electrode terminal of the liquid crystal panel substrate is not provided with the first adhesive layer. 2 is thicker than the adhesive layer and bonded to the liquid crystal panel substrate,
The second adhesive layer is a portion where the adhesive force to the second adherend is set higher than that of the first adhesive layer and the second electrode terminal of the second adherend is not provided. It has a thickness thinner than the first adhesive layer, and has a thickness thinner than the second electrode terminal, and is bonded to the second adherend,
The second electrode terminal pushes and penetrates the second adhesive layer through a portion of the second adherend where the second electrode terminal is not provided, whereby the first electrode terminal and the second electrode terminal Is electrically connected through the conductive particles of the first adhesive layer. 前記被接着物は、回路基板であることを特徴とする請求項２に記載の液晶装置。   The liquid crystal device according to claim 2, wherein the adherend is a circuit board. 前記被接着物は、半導体素子であることを特徴とする請求項２に記載の液晶装置。   The liquid crystal device according to claim 2, wherein the adherend is a semiconductor element. 前記第１電極端子は透明導電膜であり、前記第２電極端子は金属膜であることを特徴とする請求項２ないし４のいずれか１項に記載の液晶装置。   5. The liquid crystal device according to claim 2, wherein the first electrode terminal is a transparent conductive film, and the second electrode terminal is a metal film. 請求項１に記載の接着構造を用いたことを特徴とする電子機器。   An electronic apparatus using the adhesive structure according to claim 1. 請求項２ないし５のいずれか１項に記載の液晶装置を用いたことを特徴とする電子機器。   An electronic apparatus using the liquid crystal device according to claim 2.
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ATE550401T1 (en) 2006-07-21 2012-04-15 Hitachi Chemical Co Ltd MATERIAL OF CONNEXION DE CIRCUIT, STRUCTURE OF CONNEXION D'ELEMENT DE CIRCUIT ET PROCEDE DE CONNEXION DE L'ELEMENT DE CIRCUIT
JP5218725B2 (en) * 2006-08-16 2013-06-26 デクセリアルズ株式会社 Connection method
JP4930712B2 (en) * 2007-05-21 2012-05-16 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive film
JP6177642B2 (en) * 2013-09-26 2017-08-09 デクセリアルズ株式会社 Connection film, connection structure, method for manufacturing connection structure, connection method
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