JPH07156263A - Polystyrene-based film for capacitor - Google Patents
Polystyrene-based film for capacitorInfo
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- JPH07156263A JPH07156263A JP30411693A JP30411693A JPH07156263A JP H07156263 A JPH07156263 A JP H07156263A JP 30411693 A JP30411693 A JP 30411693A JP 30411693 A JP30411693 A JP 30411693A JP H07156263 A JPH07156263 A JP H07156263A
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- film
- polystyrene
- poly
- capacitor
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Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はコンデンサ用シンジオタ
クチックポリスチレン系フィルム、さらに詳しく言えば
電気特性及び耐熱性が良好で、且つ絶縁破壊電圧に優れ
更に厚み均一性に優れたコンデンサ用ポリスチレン系フ
ィルムに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a syndiotactic polystyrene film for a capacitor, and more specifically, a polystyrene film for a capacitor which has good electrical characteristics and heat resistance, excellent dielectric breakdown voltage and excellent thickness uniformity. It is about.
【0002】[0002]
【従来の技術】シンジオタクチックポリスチレン系重合
体を主成分とする樹脂組成物を二軸延伸、熱固定した二
軸延伸フィルムは耐熱性、電気特性などに優れ、フィル
ムコンデンサの誘電体に展開されている(特開平2-1438
51、特開平3-124750、特開平5-200858)。2. Description of the Related Art A biaxially stretched film obtained by biaxially stretching and heat-fixing a resin composition containing a syndiotactic polystyrene-based polymer as a main component is excellent in heat resistance and electric properties and is developed as a dielectric for a film capacitor. (Japanese Patent Laid-Open No. 2-1438
51, JP-A-3-124750, JP-A-5-200858).
【0003】[0003]
【発明が解決しようとする課題】しかし、これら従来の
シンジオタクチックポリスチレン系フィルムにおいては
絶縁破壊電圧が不良またはフィルムの厚みむら増大に基
づく絶縁破壊電圧のばらつきやコンデンサとしたあとの
容量のばらつきを発生することが分かった。絶縁破壊電
圧が不良となった場合、フィルムを厚くする必要が生
じ、その結果コンデンサの体積が大きくなるという問題
があった。また、容量や絶縁破壊電圧のばらつきが大き
い場合、コンデンサの信頼性が得られないという問題が
あることが分かった。本発明は、電気特性及び耐熱性が
良好で、且つ絶縁破壊電圧に優れかつ厚み均一性に優れ
たコンデンサ用ポリスチレン系フィルムを提供すること
を目的としている。However, in these conventional syndiotactic polystyrene films, the dielectric breakdown voltage is defective, or the variation in the dielectric breakdown voltage due to an increase in the unevenness of the film or the variation in the capacitance after being formed into a capacitor. It turned out to occur. When the dielectric breakdown voltage becomes defective, it is necessary to make the film thick, resulting in a problem that the volume of the capacitor becomes large. Further, it was found that there is a problem that the reliability of the capacitor cannot be obtained when the variations in the capacitance and the breakdown voltage are large. An object of the present invention is to provide a polystyrene-based film for a capacitor, which has good electric characteristics and heat resistance, excellent dielectric breakdown voltage, and excellent thickness uniformity.
【0004】[0004]
【課題を解決するための手段】本発明のポリスチレン系
フィルムはシンジオタクチック構造を有するスチレン系
重合体からなり平均屈折率が1.582 以上1.590 以下であ
ることを特徴とする電気特性及び耐熱性が良好で、且つ
絶縁破壊電圧に優れ更に厚み均一性に優れたコンデンサ
用ポリスチレン系フィルム提供するものである。Means for Solving the Problems The polystyrene film of the present invention is made of a styrene polymer having a syndiotactic structure and has an average refractive index of 1.582 or more and 1.590 or less, and has good electrical properties and heat resistance. The present invention provides a polystyrene-based film for capacitors, which has excellent dielectric breakdown voltage and thickness uniformity.
【0005】本発明に用いられる立体規則性がシンジオ
タクチック構造であるポリスチレン系重合体は、側鎖で
あるフェニル基又は置換フェニル基が核磁気共鳴法によ
り定量されるタクティシティがダイアッド(構成単位が
二個)で85%以上、ペンタッド(構成単位が5個)で50
%以上のシンジオタクチック構造であることが望まし
い。The polystyrene-based polymer having stereoregular syndiotactic structure used in the present invention has a tacticity in which the side chain phenyl group or substituted phenyl group is quantified by a nuclear magnetic resonance method, which is a diad (constituent unit). 85% or more for 2) and 50 for pentad (5 units)
It is desirable that the structure has a syndiotactic structure of not less than%.
【0006】該ポリスチレン系重合体としては、ポリス
チレン、ポリ(p-、m-又はo-メチルスチレン)、ポリ
(2,4-、2,5-、3,4-又は3,5-ジメチルスチレン)、ポリ
(p-ターシャリーブチルスチレン)などのポリ(アルキ
ルスチレン)、ポリ(p-、m-又はo-クロロスチレン)、
ポリ(p-、m-又はo-ブロモスチレン)、ポリ(p-、m-又
はo-フルオロスチレン)、ポリ(o-メチル-p- フルオロ
スチレン)などのポリ(ハロゲン化スチレン)、ポリ
(p-、m-又はo-クロロメチルスチレン)などのポリ(ハ
ロゲン置換アルキルスチレン)、ポリ(p-、m-又はo-メ
トキシスチレン)、ポリ(p-、m-又はo-エトキシスチレ
ン)などのポリ(アルコキシスチレン)、ポリ(p-、m-
又はo-カルボキシメチルスチレン)などのポリ(カルボ
キシアルキルスチレン)ポリ(p-ビニルベンジルプロピ
ルエーテル)などのポリ(アルキルエーテルスチレ
ン)、ポリ(p-トリメチルシリルスチレン)などのポリ
(アルキルシリルスチレン)、さらにはポリ(ビニルベ
ンジルジメトキシホスファイド)などが挙げられる。Examples of the polystyrene polymer include polystyrene, poly (p-, m- or o-methylstyrene), poly (2,4-, 2,5-, 3,4- or 3,5-dimethylstyrene. ), Poly (alkylstyrene) such as poly (p-tertiarybutylstyrene), poly (p-, m- or o-chlorostyrene),
Poly (halogenated styrene) such as poly (p-, m- or o-bromostyrene), poly (p-, m- or o-fluorostyrene), poly (o-methyl-p-fluorostyrene), poly ( p-, m- or o-chloromethylstyrene) and other poly (halogen-substituted alkylstyrenes), poly (p-, m- or o-methoxystyrene), poly (p-, m- or o-ethoxystyrene), etc. Poly (alkoxystyrene), poly (p-, m-
Or poly (carboxyalkylstyrene) such as o-carboxymethylstyrene), poly (alkyletherstyrene) such as poly (p-vinylbenzylpropylether), poly (alkylsilylstyrene) such as poly (p-trimethylsilylstyrene), Examples include poly (vinylbenzyldimethoxyphosphide) and the like.
【0007】本発明においては、前記ポリスチレン系重
合体のなかで、特にポリスチレンが好適である。また、
本発明で用いるシンジオタクチック構造を有するポリス
チレン系重合体は、必ずしも単一化合物である必要はな
く、シンジオタクティシティが前記範囲内であればアタ
クチック構造やアイソタクチック構造のポリスチレン系
重合体との混合物や、共重合体及びそれらの混合物でも
よい。また本発明に用いるポリスチレン系重合体は、重
量平均分子量が10,000以上、更に好ましくは50,000以上
である。重量平均分子量が10,000未満のものでは、強伸
度特性や耐熱性に優れたフィルムを得ることができな
い。重量平均分子量の上限については、特に限定される
ものではないが、1500,000以上では延伸張力の増加に伴
う破断の発生などが生じるため余り好ましくない。In the present invention, polystyrene is particularly preferable among the polystyrene polymers. Also,
The polystyrene polymer having a syndiotactic structure used in the present invention is not necessarily a single compound, and if the syndiotacticity is within the above range, a polystyrene polymer having an atactic structure or an isotactic structure is used. It may be a mixture of, a copolymer and a mixture thereof. The polystyrene-based polymer used in the present invention has a weight average molecular weight of 10,000 or more, more preferably 50,000 or more. If the weight average molecular weight is less than 10,000, it is not possible to obtain a film having excellent strength and elongation characteristics and heat resistance. The upper limit of the weight average molecular weight is not particularly limited, but if it is 1500,000 or more, breakage occurs due to an increase in stretching tension, which is not preferable.
【0008】本発明に用いられるシンジオタクチックポ
リスチレン系重合体には必要に応じて、公知の酸化防止
剤、帯電防止剤、滑り性を付与するための微粒子等を適
量配合したものを用いることができる。配合量はシンジ
オタクチックポリスチレン系重合体100 重量%に対して
10重量%以下が望ましい。10重量%を越えると延伸時に
破断を起こしやすくなり、生産安定性不良となるので好
ましくない。The syndiotactic polystyrene-based polymer used in the present invention may contain, if necessary, known compounds such as antioxidants, antistatic agents, and fine particles for imparting slipperiness. it can. The compounding amount is based on 100% by weight of the syndiotactic polystyrene polymer.
10% by weight or less is desirable. If it exceeds 10% by weight, breakage easily occurs during stretching, resulting in poor production stability.
【0009】微粒子としては、例えばシリカ、二酸化チ
タン、タルク、カオリナイト、ゼオライト等の金属酸化
物、炭酸カルシウム、リン酸カルシウム、硫酸バリウム
などの金属の塩またはシリコーン樹脂、架橋ポリスチレ
ン等の有機重合体からなる粒子等の添加が例示される。
そして、これら微粒子は、いずれか一種を単独で用いて
もよく、また2種以上を併用してもよいが、使用する微
粒子の平均粒子系は0.01μm以上2.0 μm以下、特に0.
05μm以上1.5 μm以下が好ましく、粒子径のばらつき
度(標準偏差と平均粒子径との比率)が25%以下が好ま
しい。添加量はシンジオタクチックポリスチレン系重合
体100 重量%に対し0.005 重量%以上2.0 重量%以下含
有することが好ましく、特に0.1 重量%以上1.0 重量%
以下が好ましい。The fine particles include, for example, metal oxides such as silica, titanium dioxide, talc, kaolinite and zeolite, salts of metals such as calcium carbonate, calcium phosphate and barium sulfate, or organic polymers such as silicone resins and crosslinked polystyrene. The addition of particles and the like is exemplified.
These fine particles may be used alone or in combination of two or more, but the average particle size of the fine particles used is 0.01 μm or more and 2.0 μm or less, and particularly, 0.
The thickness is preferably 05 μm or more and 1.5 μm or less, and the degree of variation in particle size (ratio between standard deviation and average particle size) is preferably 25% or less. The addition amount is preferably 0.005% by weight or more and 2.0% by weight or less, particularly 0.1% by weight or more and 1.0% by weight, based on 100% by weight of the syndiotactic polystyrene polymer.
The following are preferred.
【0010】そして、前記の平均屈折率は、フィルムの
製膜条件調整される。得られたフィルムの平均屈折率が
所定の範囲にはいるならば製造条件は特に限定されない
が、例えば、縦延伸及び横延伸を順に行なう逐次二軸延
伸方法のほか、横・縦・縦延伸法、縦・横・縦延伸法、
縦・縦・横延伸法などの延伸方法を採用することがで
き、要求される強度や寸法安定性などの諸特性に応じて
選択される。また、熱固定処理、縦弛緩処理、横弛緩処
理などを施すことができる。特に実施例に示してある様
な製膜条件が好ましく、本発明を達成することができ
る。また、蒸着層の接着特性等を向上するために、イン
ラインコートやオフラインコートにより接着層を設けた
り、コロナ処理や火炎プラズマ処理等を行うことができ
る。The above-mentioned average refractive index is adjusted by the film forming conditions. The production conditions are not particularly limited as long as the average refractive index of the obtained film is within a predetermined range, and for example, a sequential biaxial stretching method in which longitudinal stretching and transverse stretching are performed in order, as well as a transverse / longitudinal / longitudinal stretching method. , Longitudinal / transverse / longitudinal stretching method,
A stretching method such as a longitudinal / longitudinal / horizontal stretching method can be adopted, and the stretching method is selected according to various characteristics such as required strength and dimensional stability. Further, heat setting treatment, vertical relaxation treatment, lateral relaxation treatment, etc. can be performed. In particular, the film forming conditions as shown in the examples are preferable, and the present invention can be achieved. Further, in order to improve the adhesive property and the like of the vapor deposition layer, an adhesive layer can be provided by in-line coating or off-line coating, corona treatment or flame plasma treatment can be performed.
【0011】本発明のポリスチレン系フィルムの平均屈
折率は1.582 以上、更に好ましくは1.584 以上である。
平均屈折率が1.582 未満では絶縁破壊電圧が不良とな
る。また、平均屈折率の上限は1.590 以下、更に好まし
くは1.589 以下である。平均屈折率が1.590 より大きく
なると厚みむらが大きくなるため、フィルムの破壊電圧
の絶対値の変動が大きくなり且つ容量変化が増大するた
め、コンデンサとしての信頼性が低くなる。The average refractive index of the polystyrene film of the present invention is 1.582 or more, more preferably 1.584 or more.
If the average refractive index is less than 1.582, the dielectric breakdown voltage becomes poor. The upper limit of the average refractive index is 1.590 or less, more preferably 1.589 or less. When the average refractive index is larger than 1.590, the thickness unevenness becomes large, the fluctuation of the absolute value of the breakdown voltage of the film becomes large, and the capacitance change becomes large, so that the reliability as a capacitor becomes low.
【0012】更に、本発明のポリスチレン系フィルムの
150 ℃における熱収縮率は3%以下、好ましくは2.5 %
以下、更に好ましくは2%以下である。熱収縮率が3%
より大きいとコンデンサーの製造工程で収縮や平面性の
乱れが生じ、製品の不良につながる。ここで、熱収縮率
を下げるために高温にフィルムを長時間さらすと耐摩耗
性が不良になるため、縦延伸処理後に緩和処理を行うこ
とや、熱固定温度及び時間を一定範囲に保つこと、更に
必要に応じて熱固定処理後に横及び/又は縦弛緩処理す
ることが好ましい。ここで、縦延伸後の縦弛緩処理は延
伸温度以上、冷結晶化温度以下で弛緩処理し、熱固定処
理は220℃以上、融点未満の温度で30秒以内、好ましく
は20秒以内で行い、横及び縦方向の弛緩処理は熱固定処
理の最高温度以下で平面性が乱れない程度に弛緩処理す
ることが好ましい。Further, the polystyrene film of the present invention
Heat shrinkage at 150 ℃ is less than 3%, preferably 2.5%
Hereafter, it is more preferably 2% or less. Heat shrinkage rate is 3%
If it is larger, shrinkage and irregularity of flatness occur in the manufacturing process of the capacitor, leading to defective products. Here, since the abrasion resistance becomes poor when the film is exposed to a high temperature for a long time in order to reduce the heat shrinkage rate, a relaxation treatment is performed after the longitudinal stretching treatment, and the heat setting temperature and time are kept within a certain range, Further, if necessary, it is preferable to perform lateral and / or longitudinal relaxation treatment after the heat setting treatment. Here, the longitudinal relaxation treatment after the longitudinal stretching is a stretching temperature or higher, a relaxation treatment at a cold crystallization temperature or lower, and a heat setting treatment is performed at 220 ° C. or higher and at a temperature lower than the melting point within 30 seconds, preferably within 20 seconds, The relaxation treatment in the horizontal and vertical directions is preferably such that the flatness is not disturbed at a temperature not higher than the maximum temperature of the heat setting treatment.
【0013】実施例 以下に実施例にて本発明を具体的に説明するが、本発明
はこれら実施例のみに限定されるものではない。なお、
フィルムの評価方法を以下に示す。EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. In addition,
The evaluation method of the film is shown below.
【0014】(1)平均屈折率 アタゴ光学社製アッベ屈折計4Tを用い、フィルムの屈折
率を長手方向、幅方向および厚み方向について測定し、
それら3方向の屈折率を平均し、平均屈折率を求めた。(1) Average Refractive Index The refractive index of the film was measured in the longitudinal direction, the width direction and the thickness direction using an Abbe refractometer 4T manufactured by Atago Optical Co., Ltd.
The refractive indexes in these three directions were averaged to obtain the average refractive index.
【0015】(2)絶縁破壊電圧 JIS C-2318に準じて行なった。10KV直流耐電圧試験機を
用い、23℃,50%RHの雰囲気下に於て、100V/secの昇圧速
度で、フィルムが破壊し短絡したときの電圧を読み取っ
た。(2) Dielectric breakdown voltage It was performed according to JIS C-2318. Using a 10KV DC withstanding voltage tester, the voltage when the film was broken and short-circuited was read at a boosting rate of 100V / sec in an atmosphere of 23 ° C and 50% RH.
【0016】(3)厚みむら ミクロン計測器社製連続厚さ測定器によりフィルムの幅
方向の中央部を長手方向に沿って測定し、次式により算
出した。 厚みむら=(最大厚さー最小厚さ)/平均厚さ×100 % 1級:厚みむら10%以上 2級:厚みむら8〜10% 3級:厚みむら6〜8% 4級:厚みむら4〜6% 5級:厚みむら4%以下(3) Thickness unevenness A continuous thickness measuring instrument manufactured by Micron Instruments Co., Ltd. was used to measure the central portion in the width direction of the film along the longitudinal direction, and the thickness was calculated by the following formula. Thickness unevenness = (maximum thickness-minimum thickness) / average thickness x 100% Grade 1: Thickness unevenness of 10% or more Grade 2: Thickness unevenness 8 to 10% Grade 3: Thickness unevenness 6 to 8% Grade 4: Thickness unevenness 4-6% Grade 5: Thickness unevenness 4% or less
【0017】(4)150℃における熱収縮率 無張力の状態で150 ℃の雰囲気中30分におけるフィルム
の収縮率を求めた。(4) Thermal Shrinkage Ratio at 150 ° C. The shrinkage ratio of the film in an atmosphere of 150 ° C. for 30 minutes without tension was determined.
【0018】(5)平均粒子径 微粒子を(株)日立製作所製S-510型走査型電子顕微
鏡で観察し、写真撮影したものを拡大して複写し、微粒
子の外形をトレースし任意に200 個の粒子を黒く塗りつ
ぶした。この像をニレコ(株)製ルーゼックス500 型画
像解析装置を用いて、それぞれの粒子の水平方向のフェ
レ径を測定し、その平均値を平均粒子径とした。また、
粒子径のばらつき度は下記の式により算出した。 ばらつき度=(粒子径の標準偏差/平均粒子径)× 100
(%)(5) Average particle size Fine particles are observed with a S-510 scanning electron microscope manufactured by Hitachi, Ltd., and photographed ones are magnified and copied to trace the outer shape of the fine particles and optionally 200 particles. Particles are painted black. This image was measured for the Feret diameter in the horizontal direction of each particle using a Luzex 500 type image analyzer manufactured by Nireco Corporation, and the average value was taken as the average particle diameter. Also,
The degree of variation in particle size was calculated by the following formula. Variability = (standard deviation of particle size / average particle size) x 100
(%)
【0019】実施例1 滑剤として、平均粒子径0.5 μm、ばらつき度20% 、面
積形状係数80% のシリカをシンジオタクチックポリスチ
レン(重量平均分子量300000)100 重量%に対して0.5
重量%添加したポリマーチップと、滑剤の添加されてい
ないポリマーチップを重量比で1対9の割合で混合した
後、乾燥し、290 ℃で溶融し、800 μmのリップギャッ
プのT ダイから押し出し、50℃の冷却ロールに静電印荷
法により密着・冷却固化し、60μmの無定形シートを得
た。該無定形シートをまず金属ロールにより95℃に予熱
し、表面温度141 ℃のセラミックロールを用い縦方向に
3倍延伸した後冷却し、更に120 ℃の金属ロールを用い
縦方向に1.2 倍延伸した。次いで、テンターでフィルム
を120 ℃に予熱し、横方向に延伸温度120 ℃で2倍延伸
し、更に150 ℃で1.6 倍延伸した後、255 ℃で12秒熱固
定処理した。その後、225 ℃で3%横弛緩処理した。得ら
れたフィルムの厚みは5.3 μmであり、走行性、ハンド
リング性が良好であった。また、アルミニウム薄膜を蒸
着により積層した場合においても平面性は良好でありコ
ンデンサ用フィルムとして好ましいものであると判断さ
れた。得られたフィルムの物性を表1に示す。Example 1 As a lubricant, silica having an average particle size of 0.5 μm, a degree of variation of 20%, and an area shape factor of 80% was added to 0.5% of syndiotactic polystyrene (weight average molecular weight 300000) 100% by weight.
After mixing the polymer chip added with the weight% and the polymer chip not added with the lubricant in a weight ratio of 1: 9, dried, melted at 290 ° C., and extruded from a T-die having a lip gap of 800 μm, It was brought into close contact with a 50 ° C. chill roll by an electrostatic loading method and solidified by cooling to obtain an amorphous sheet of 60 μm. The amorphous sheet was first preheated to 95 ° C. by a metal roll, longitudinally stretched 3 times using a ceramic roll having a surface temperature of 141 ° C., then cooled, and further stretched 1.2 times longitudinally using a metal roll at 120 ° C. . Then, the film was preheated to 120 ° C. with a tenter, stretched in the transverse direction at a stretching temperature of 120 ° C. by 2 times, further stretched at 150 ° C. by 1.6 times, and then heat set at 255 ° C. for 12 seconds. After that, 3% lateral relaxation treatment was performed at 225 ° C. The thickness of the obtained film was 5.3 μm, and the running property and handling property were good. Further, even when the aluminum thin films were laminated by vapor deposition, the flatness was good, and it was judged to be preferable as a film for capacitors. Table 1 shows the physical properties of the obtained film.
【0020】実施例2 縦延伸を141 ℃のセラミックロールにおいて2.4倍延伸
した後一度冷却し、更に120 ℃の金属ロールで1.5 倍延
伸した以外は実施例1と同様に行った。得られたフィル
ムの厚みは5.3 μmであり、アルミニウム薄膜を蒸着に
より積層した場合においても平面性は良好でありコンデ
ンサ用フィルムとして好ましいものであると判断され
た。得られたフィルムの物性を表1に示す。Example 2 The same procedure as in Example 1 was carried out except that longitudinal stretching was performed 2.4 times on a ceramic roll at 141 ° C., then cooled once, and further stretched 1.5 times on a metal roll at 120 ° C. The thickness of the obtained film was 5.3 μm, and the flatness was good even when an aluminum thin film was laminated by vapor deposition, and it was judged to be preferable as a film for capacitors. Table 1 shows the physical properties of the obtained film.
【0021】比較例1 縦延伸141 ℃のセラミックロールにおいて2.4 倍延伸し
た後冷却せず、更に120 ℃の金属ロールで1.5倍延伸し
た以外は実施例1と同様に行った。得られたフィルムの
厚みは5.3μmであり、アルミニウム薄膜を蒸着により
積層した場合におい てもわずかに平面性にみだれが観
察されがコンデンサ用フィルムとして問題はないもので
あると判断された。得られたフィルムの物性を表1に示
す。Comparative Example 1 The same procedure as in Example 1 was carried out except that longitudinal stretching was performed at a ceramic roll of 141 ° C. for 2.4 times, followed by no cooling, and further at 120 ° C. for a metal roll of 1.5 times. The thickness of the obtained film was 5.3 μm, and even when a thin aluminum film was laminated by vapor deposition, a slight weeping was observed in the planarity, but it was judged that there is no problem as a film for capacitors. Table 1 shows the physical properties of the obtained film.
【0022】比較例2 滑剤として、平均粒子径0.5 μm、ばらつき度20% 、面
積形状係数80% のシリカをシンジオタクチックポリスチ
レン(重量平均分子量300000)100 重量%に対して0.5
重量%添加したポリマーチップと、滑剤の添加されてい
ないポリマーチップを重量比で1対9の割合で混合した
後、乾燥し、290 ℃で溶融し、800 μmのリップギャッ
プのT ダイから押し出し、50℃の冷却ロールに静電印荷
法により密着・冷却固化し、48μmの無定形シートを得
た。無定形シートをまず金属ロールにより95℃に予熱
し、表面温度141℃のセラミックロールを用い縦方向に
3倍延伸した。次いで、テンターでフィルムを120 ℃に
予熱し、横方向に延伸温度120 ℃で2倍延伸し、更に15
0 ℃で1.5 倍延伸した後、255 ℃で12秒熱固定処理し
た。その後、225 ℃で3%横弛緩処理した。得られたフィ
ルムの厚みは5.3 μmであった。該フィルムの平面性は
不良でありコンデンサ用フィルムとして好ましいもので
はないと判断された。得られたフィルムの物性を表1に
示す。Comparative Example 2 As a lubricant, silica having an average particle size of 0.5 μm, a degree of variation of 20%, and an area shape factor of 80% was added to 0.5% by weight of syndiotactic polystyrene (weight average molecular weight 300,000).
After mixing the polymer chip added with the weight% and the polymer chip not added with the lubricant in a weight ratio of 1: 9, dried, melted at 290 ° C., and extruded from a T-die having a lip gap of 800 μm, It was brought into close contact with a cooling roll at 50 ° C by an electrostatic printing method and solidified by cooling to obtain an amorphous sheet of 48 µm. The amorphous sheet was first preheated to 95 ° C. with a metal roll and stretched 3 times in the machine direction using a ceramic roll with a surface temperature of 141 ° C. The film is then preheated to 120 ° C with a tenter and stretched in the transverse direction at a stretching temperature of 120 ° C by a factor of 2 for a further 15
After stretching 1.5 times at 0 ° C, it was heat-set at 255 ° C for 12 seconds. After that, 3% lateral relaxation treatment was performed at 225 ° C. The thickness of the obtained film was 5.3 μm. It was judged that the film had poor flatness and was not preferable as a film for capacitors. Table 1 shows the physical properties of the obtained film.
【0023】比較例3 熱固定処理を215 ℃で20秒実施した以外は実施例1と同
様に行った。得られたフィルムの厚みは5.3 μmであっ
た。得られたフィルムの物性を表1に示す。得られたフ
ィルムはアルミニウム薄膜を蒸着により積層することに
より平面性にみだれを生じ、コンデンサ用フィルムとし
て好ましいものではないと判断された。Comparative Example 3 The procedure of Example 1 was repeated except that the heat setting treatment was carried out at 215 ° C. for 20 seconds. The thickness of the obtained film was 5.3 μm. Table 1 shows the physical properties of the obtained film. It was determined that the obtained film was not preferable as a film for capacitors because it had an uneven surface due to laminating an aluminum thin film by vapor deposition.
【0024】表より、実施例1、2で得られたフィルム
は絶縁破壊電圧に優れておりまたフィルム厚みの変動が
小さいためコンデンサ用フィルムとして優れたものであ
ることが分かる。From the table, it can be seen that the films obtained in Examples 1 and 2 are excellent as dielectric films because they have excellent dielectric breakdown voltage and small fluctuations in the film thickness.
【0025】[0025]
【発明の効果】以上、記載のとおり、本発明は前記特許
請求の範囲に記載のとおりの構成を採用することによ
り、絶縁破壊電圧に優れかつ厚み均一性に優れたコンデ
ンサ用ポリスチレン系フィルムが提供され、従って、本
発明の工業的価値は大である。As described above, the present invention provides a polystyrene-based film for capacitors, which has an excellent dielectric breakdown voltage and an excellent thickness uniformity by adopting the constitution as described in the claims. Therefore, the industrial value of the present invention is great.
【0026】[0026]
【表1】 [Table 1]
Claims (1)
ン系重合体からなる平均屈折率が1.582 以上1.590 以下
であり、且つ150 ℃における収縮率が3%以下であるこ
とを特徴とするコンデンサ用ポリスチレン系フィルム。1. A polystyrene-based film for a capacitor, which comprises a styrene-based polymer having a syndiotactic structure and has an average refractive index of 1.582 or more and 1.590 or less and a shrinkage ratio at 150 ° C. of 3% or less. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30411693A JP3491697B2 (en) | 1993-12-03 | 1993-12-03 | Polystyrene film for capacitors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30411693A JP3491697B2 (en) | 1993-12-03 | 1993-12-03 | Polystyrene film for capacitors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07156263A true JPH07156263A (en) | 1995-06-20 |
JP3491697B2 JP3491697B2 (en) | 2004-01-26 |
Family
ID=17929227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30411693A Expired - Fee Related JP3491697B2 (en) | 1993-12-03 | 1993-12-03 | Polystyrene film for capacitors |
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JP (1) | JP3491697B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011065585A1 (en) | 2009-11-30 | 2011-06-03 | 帝人株式会社 | High-insulating film |
WO2012147777A1 (en) | 2011-04-26 | 2012-11-01 | 帝人株式会社 | High-insulating film |
JP2012229340A (en) * | 2011-04-26 | 2012-11-22 | Teijin Ltd | High-insulating film |
US8859087B2 (en) | 2007-06-21 | 2014-10-14 | Teijin Limited | Insulating film |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3309933B2 (en) | 1993-12-01 | 2002-07-29 | 東洋紡績株式会社 | Polystyrene film |
-
1993
- 1993-12-03 JP JP30411693A patent/JP3491697B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8859087B2 (en) | 2007-06-21 | 2014-10-14 | Teijin Limited | Insulating film |
WO2011065585A1 (en) | 2009-11-30 | 2011-06-03 | 帝人株式会社 | High-insulating film |
US20120232209A1 (en) * | 2009-11-30 | 2012-09-13 | Teijin Limited | Highly insulating film |
US10438746B2 (en) * | 2009-11-30 | 2019-10-08 | Teijin Limited | Insulating film |
WO2012147777A1 (en) | 2011-04-26 | 2012-11-01 | 帝人株式会社 | High-insulating film |
JP2012229340A (en) * | 2011-04-26 | 2012-11-22 | Teijin Ltd | High-insulating film |
US9617407B2 (en) | 2011-04-26 | 2017-04-11 | Teijin Limited | Highly insulating film |
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JP3491697B2 (en) | 2004-01-26 |
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