JPH07154064A - Method for soldering electronic component to printed board - Google Patents

Method for soldering electronic component to printed board

Info

Publication number
JPH07154064A
JPH07154064A JP29666693A JP29666693A JPH07154064A JP H07154064 A JPH07154064 A JP H07154064A JP 29666693 A JP29666693 A JP 29666693A JP 29666693 A JP29666693 A JP 29666693A JP H07154064 A JPH07154064 A JP H07154064A
Authority
JP
Japan
Prior art keywords
soldering
solder
heating member
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29666693A
Other languages
Japanese (ja)
Inventor
Koichi Miyagi
孝一 宮城
Yoshihisa Takeda
佳久 武田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KK filed Critical Seikosha KK
Priority to JP29666693A priority Critical patent/JPH07154064A/en
Publication of JPH07154064A publication Critical patent/JPH07154064A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To solder an electronic component efficiently to a correct position on a printed board without causing any damage on the electronic device. CONSTITUTION:Each of a pair of heating members 1 provided oppositely each other is bent to have an inclining lower end part 1a and a groove 1b is made in the upper side at the bent part. A wire solder 3 fed out from a wire solder feeding means 2 can abut, at the forward end part thereof, on the groove lb. The heating member 1 heated up to a specified temperature is then lowered to abut, at the lower end part 1a thereof, on a soldering land 4b formed on the upper face of a printed board 4. When the feeding means 2 feeds the wire solder 3 by a specified length, the forward end part 3a thereof is fused by the heating means 1 and drips onto the soldering land 4b through the groove 1b thus soldering an electronic device, e.g. an IC chip, to the printed board 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、プリント基板への電気
部品のはんだ付け方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering an electric component to a printed board.

【０００２】[0002]

【従来の技術】プリント基板へのＩＣなどの電気部品の
実装は、一般にはんだ付けによって行われている。この
ためのはんだ付けの方法としては一般に次のようなもの
が採用されている。第１の方法は、加熱手段としてリフ
ロー炉またはラインリフロー炉を用い、プリント基板上
に電気部品とはんだとを載せたものをキャリア上に並
べ、次々とリフロー炉内に送り込み、炉内で加熱するこ
とによりはんだ付けが行われる。第２の方法として、は
んだごてを用い手作業で個々にはんだ付けする。そして
第３の方法として、加熱手段としてレーザービームを用
い、はんだ付けか所にレーザービームを照射してはんだ
付けが行われる。2. Description of the Related Art Mounting of an electric component such as an IC on a printed circuit board is generally performed by soldering. The following soldering methods are generally adopted for this purpose. In the first method, a reflow furnace or a line reflow furnace is used as a heating means, and a printed board on which electric components and solder are placed is arranged on a carrier, which are successively fed into the reflow furnace and heated in the furnace. As a result, soldering is performed. As a second method, a soldering iron is used to manually solder individually. Then, as a third method, a laser beam is used as the heating means and the soldering place is irradiated with the laser beam to perform the soldering.

【０００３】[0003]

【発明が解決しようとする課題】従来技術の第１の方法
は、プリント基板全体をリフロー炉によって２２０〜２
５０℃の高温で加熱するため、水晶などの熱に弱い電気
部品のはんだ付けには向かないので、適用上の制約を受
ける。第２の方法は小さな電気部品の場合ははんだごて
が接触して実装位置がずれて正確なはんだ付けができな
くなるおそれがあるほか、作業能率が劣る欠点がある。
第３の方法ではレーザービームを瞬時に照射するのでフ
ラックスが飛散し、かつはんだボールが多数発生して他
の電気部品に付着するなどの不都合が生じる欠点があ
る．そこで本発明の目的は、他の電気部品を損傷させず
かつ正しいプリント基板の実装位置にしかも能率よくは
んだ付けができるようにすることにある。According to the first method of the prior art, the entire printed circuit board is heated by a reflow oven to 220-2.
Since it is heated at a high temperature of 50 ° C., it is not suitable for soldering heat-sensitive electric parts such as crystal, and thus there are restrictions on application. The second method has a drawback that in the case of a small electric component, the soldering iron may come into contact with the soldering iron and the mounting position may be displaced to prevent accurate soldering, and the work efficiency may be poor.
In the third method, since the laser beam is radiated instantaneously, flux is scattered, and there are disadvantages that a large number of solder balls are generated and adhere to other electric parts. Therefore, an object of the present invention is to enable soldering to a correct printed circuit board mounting position and efficiently without damaging other electric components.

【０００４】[0004]

【課題を解決するための手段】上記の目的を達成するた
めに、本発明は以下の手段を採用した。すなわち、下端
部近傍を所定角度に傾斜するように屈成させ、この屈成
した部分の上側に下端部まで通じる溝部が設けてある加
熱部材と、この加熱部材と一体になって昇降可能に設け
られた糸はんだの供給手段とを備えたはんだ付け装置を
用い、加熱部材の下端部をプリント基板のはんだ付けラ
ンドに当接し、供給手段から送り出される糸はんだの先
端を溝部に当接させ、この糸はんだを所定の長さだけ送
り出し、加熱部材によって糸はんだの先端部を溶融さ
せ、溶融したはんだが溝部に沿ってはんだ付けランドに
流れ落ちることによって、電気部品をプリント基板には
んだ付けする。In order to achieve the above object, the present invention adopts the following means. That is, the vicinity of the lower end is bent so as to be inclined at a predetermined angle, and a heating member in which a groove communicating with the lower end is provided above the bent part, and the heating member is provided so as to be able to move up and down integrally. Using a soldering device provided with a thread solder supply means, the lower end of the heating member is brought into contact with the soldering land of the printed circuit board, and the tip of the thread solder sent from the supply means is brought into contact with the groove portion. The wire solder is sent out by a predetermined length, the tip of the wire solder is melted by the heating member, and the melted solder flows down along the groove to the soldering land, thereby soldering the electric component to the printed circuit board.

【０００５】上記した加熱部材は１対を対向するように
設け、電気部品の両側方から同時に２ヶ所にはんだ付け
することが望ましい。It is desirable that one pair of the above-mentioned heating members be provided so as to face each other and be soldered to two locations from both sides of the electric component at the same time.

【０００６】[0006]

【作用】所定温度に加熱された加熱部材を下降させて、
下端部をプリント基板のはんだ付けランドに当接し、糸
はんだを所定の長さ分だけ送り出すと、糸はんだの先端
部が加熱部材によって加熱されて溶融し、溝部に沿って
下端部（はんだ付けランド）まで流れ落ち、電気部品が
プリント基板にはんだ付けされる。[Function] By lowering the heating member heated to a predetermined temperature,
When the lower end is brought into contact with the soldering land on the printed circuit board and the thread solder is sent out for a predetermined length, the tip of the thread solder is heated and melted by the heating member, and the lower end (solder land ) And electrical components are soldered to the printed circuit board.

【０００７】加熱部材を対向するように設け、電気部品
の両側方から同時に溶融はんだを流し込むようにすれ
ば、電気部品が溶融はんだによって位置ずれを生じるこ
とがなくなる。If the heating members are provided so as to face each other and the molten solder is poured simultaneously from both sides of the electric component, the electric component will not be displaced by the molten solder.

【０００８】[0008]

【実施例】以下本発明の一実施例について図面を参照し
て説明する。初めに本実施例に使用するはんだ付け装置
について説明する。図１に示す１対の加熱部材１，１及
び１対の糸はんだの供給手段２，２はそれぞれ図示しな
いヒーターブロックに取り付けられており、両者はいず
れもヒーターブロックの昇降運動に連動して昇降・移動
可能である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. First, the soldering apparatus used in this embodiment will be described. The pair of heating members 1 and 1 and the pair of yarn solder supply means 2 and 2 shown in FIG. 1 are attached to a heater block (not shown), and both of them are raised and lowered in conjunction with the raising and lowering motion of the heater block. -Can be moved.

【０００９】加熱部材１は、耐熱性に秀れかつはんだが
付着しにくいステンレス丸棒材を用い、下端部１ａから
所定長さの位置でわずかに屈成して、上側となる斜面に
溝部１ｂが設けてある。加熱部材１の上端部はヒーター
ブロックの下部に移動可能に取り付けられており、垂直
に設けられた部分１ｃにはニクロム線からなるヒータ
（図示略）が巻き付けられている。このニクロム線に電
圧の電流を加えれば、ジュール熱が加熱部材に伝達さ
れ、溝部１ｂの部分も所定温度に加熱可能である。下端
部１ａは水平面と対向可能に平坦に仕上げてあり、溝部
１ｂに囲まれた範囲は、後述のプリント基板のはんだ付
けランド位置と対向可能である。The heating member 1 is made of a stainless round bar which has excellent heat resistance and does not easily adhere to solder. The heating member 1 bends slightly from the lower end 1a at a position of a predetermined length, and the groove 1b is formed on the upper slope. Is provided. The upper end of the heating member 1 is movably attached to the lower part of the heater block, and a heater (not shown) made of nichrome wire is wound around the vertically provided portion 1c. When a voltage current is applied to this nichrome wire, Joule heat is transmitted to the heating member, and the groove portion 1b can also be heated to a predetermined temperature. The lower end portion 1a is finished to be flat so as to be able to face the horizontal surface, and the area surrounded by the groove portion 1b can face the soldering land position of the printed circuit board described later.

【００１０】糸はんだの供給手段２は、ヒーターブロッ
ク上に設けられた糸はんだのボビン近くに上端が位置
し、下端は糸はんだ３の先端３ａが加熱手段１の溝部１
ｂに当接するように方向を定めて設けてある。供給手段
２の根元部（上端）には、糸はんだの送給ローラ（図示
略）が設けてあり、糸はんだ３を所定量ずつ送り出し可
能である。An upper end of the thread solder supplying means 2 is located near the bobbin of the thread solder provided on the heater block, and a tip 3a of the thread solder 3 is provided at a lower end of the groove portion 1 of the heating means 1.
The direction is determined so as to come into contact with b. At the base portion (upper end) of the supply means 2, a yarn solder feeding roller (not shown) is provided, and the yarn solder 3 can be delivered by a predetermined amount.

【００１１】図２はプリント基板４の上面におけるはん
だ付けランド及びその周囲の状態を示すもので、パター
ン４ａ，４ａの各端部の面積を大きくした四角状のはん
だ付けランド４ｂ，４ｂに両脚を当接するように電気部
品であるＩＣチップ５が載せてある。ＩＣチップ５の両
側に設けられた端子５ａ，５ａは、それぞれパターン４
ａ，４ａ上に載せられている。この状態にあるとき、取
り付けブロックを下降させて、加熱部材１の下端部１
ａ，１ａを端子５ａ，５ａの側方となるプリント基板上
のはんだ付けランド４ｂ，４ｂに当接する。このとき加
熱部材１，１は予めヒータによって２３０℃前後に加熱
してある。FIG. 2 shows the soldering lands on the upper surface of the printed circuit board 4 and the surroundings thereof. Both legs are attached to the square soldering lands 4b and 4b in which the area of each end of the patterns 4a and 4a is increased. An IC chip 5 which is an electric component is placed so as to abut. The terminals 5a, 5a provided on both sides of the IC chip 5 have the pattern 4
a, 4a. In this state, the mounting block is lowered to lower the lower end portion 1 of the heating member 1.
The a and 1a are brought into contact with the soldering lands 4b and 4b on the printed circuit board which are lateral to the terminals 5a and 5a. At this time, the heating members 1 and 1 are preheated to about 230 ° C. by the heater.

【００１２】次に糸はんだ供給手段２，２によって糸は
んだ３を所定量だけ送り出すと、各糸はんだの先端部が
加熱された加熱部材１，１の溝部１ｂ，１ｂに押し付け
られて先端部が溶融する。ここで溶融したはんだは、溝
部がぬれ性の悪いステンレス材でできているため、溝部
には付着せず、表面張力によって球状体となり、重力作
用によって溝部の斜面を流れ落ちて下端に導かれ、はん
だ付け用ランド４ｂ，４ｂに到達してそこで広がり、は
んだ３ｂ，３ｂがはんだ付けランドに固着し、ＩＣチッ
プの端子５ａ，５ａをプリント基板４にはんだ付けす
る。はんだ付け終了後にヒーターブロックを上昇させれ
ば、加熱部材１がプリント基板４上から離れ、プリント
基板４は移動可能となる。Next, when the thread solder supplying means 2 and 2 send out the thread solder 3 by a predetermined amount, the tip portions of the respective thread solders are pressed against the groove portions 1b and 1b of the heated heating members 1 and 1 and the tip portions are moved. To melt. The molten solder here does not adhere to the groove because the groove is made of stainless steel with poor wettability, it becomes a spherical body due to surface tension, and it flows down the slope of the groove due to gravity action and is guided to the lower end. It reaches the mounting lands 4b, 4b and spreads there, the solders 3b, 3b are fixed to the soldering lands, and the terminals 5a, 5a of the IC chip are soldered to the printed board 4. When the heater block is raised after the soldering is completed, the heating member 1 is separated from the printed board 4 and the printed board 4 can be moved.

【００１３】プリント基板がプリント基板のはんだ付け
ライン上にキャリアを介して搬送するようにしてあれ
ば、プリント基板は、加熱部材が上昇している間に次の
はんだ付け装置に搬送されて、続いて次のプリント基板
が移動してくることによって、次々と流れ作業ではんだ
付け可能な状態となる。If the printed circuit board is carried on the soldering line of the printed circuit board via the carrier, the printed circuit board is carried to the next soldering device while the heating member is being raised, and As the next printed circuit board moves, it becomes ready for soldering in sequence.

【００１４】本実施例では、加熱手段及び糸はんだの供
給手段を対向する１対のものとしてあるので、溶融はん
だの流れ込みによってＩＣチップの位置がずれるのを防
ぐ役割を果たしている。ＩＣチップの４辺に端子が設け
てあるものをはんだ付けする場合には、２対の加熱部材
をそれぞれ対向するように設けて四方からはんだを流し
込むようにしてもよい。In this embodiment, the heating means and the thread solder supplying means are provided in a pair so as to face each other, and therefore, the IC chip is prevented from being displaced due to the inflow of the molten solder. When soldering an IC chip having terminals provided on four sides, two pairs of heating members may be provided so as to face each other and the solder may be poured from four sides.

【００１５】これに対し、１か所または３か所を同時に
はんだ付けするような場合には、電気部品が溶融はんだ
によって動かされることがないので、ＩＣチップを押さ
え付けた状態ではんだ付けするようにすれば、加熱手段
を３個または１個とすることも可能である。On the other hand, when soldering at one or three places at the same time, the electric parts are not moved by the molten solder, so the soldering should be performed while the IC chip is being held down. In this case, the number of heating means can be three or one.

【００１６】[0016]

【発明の効果】本発明は、リフロー炉のような高温の雰
囲気中を通すことなしにはんだ付けすることができるの
で、水晶のような高温に弱い電気部品のはんだ付けにも
適用可能となる。また、加熱部材の溝部から流れ込む溶
融はんだによってはんだ付けするものであるので、はん
だごてを使用して行う場合のように電気部品の取り付け
位置をずらしてしまうようなことが生じない。また、レ
ーザービームによるはんだ付けのように、電気部品の近
接位置に熱エネルギーを集中させることもないので、フ
ラックスが飛散したり、はんだボールが発生したりする
こともなくなるので、プリント基板面を汚さずはんだ付
けの歩留まりの向上に寄与する。INDUSTRIAL APPLICABILITY Since the present invention can be soldered without passing through a high temperature atmosphere such as in a reflow furnace, it can also be applied to soldering of electric parts which are susceptible to high temperature such as crystal. Further, since the soldering is performed by the molten solder flowing in from the groove of the heating member, the mounting position of the electric component is not shifted unlike the case where the soldering iron is used. Also, unlike soldering with a laser beam, heat energy is not concentrated in the vicinity of electrical parts, so flux is not scattered and solder balls are not generated, so the printed circuit board surface is not polluted. Not contributing to the improvement of soldering yield.

【００１７】１対の加熱部材を対向するように設け、電
気部品の両側方から同時にはんだ付けするようにすれ
ば、電気部品が溶融はんだの流れによって位置のずれを
生じることもなくなるので作業能率をさらに向上させる
ことができる。If a pair of heating members are provided so as to face each other and soldering is performed from both sides of the electric component at the same time, the electric component is prevented from being displaced due to the flow of the molten solder, thus improving work efficiency. It can be further improved.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の要部の正面図である。FIG. 1 is a front view of a main part of an embodiment of the present invention.

【図２】図１のＡ−Ａ線断面図である。FIG. 2 is a sectional view taken along the line AA of FIG.

【符号の説明】[Explanation of symbols]

１ 加熱部材 １ａ 下端部 １ｂ 溝部 ２ 糸はんだの供給手段 ３ 糸はんだ ３ａ 先端 ４ プリント基板 ４ｂ はんだ付けランド ５ 電気部品 DESCRIPTION OF SYMBOLS 1 Heating member 1a Lower end 1b Groove 2 Thread solder supply means 3 Thread solder 3a Tip 4 Printed circuit board 4b Soldering land 5 Electrical component

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 下端部近傍を所定角度に傾斜するように
屈成させ、この屈成した部分の上側に上記下端部まで通
じる溝部が設けてある加熱部材と、上記加熱部材と一体
になって昇降可能に設けられた糸はんだの供給手段とを
備えたはんだ付け装置を用い、 上記加熱部材の下端部をプリント基板のはんだ付けラン
ドに当接し、上記供給手段から送り出される糸はんだの
先端を上記溝部に当接させ、上記糸はんだを所定の長さ
だけ送り出し、上記加熱部材によって糸はんだの先端部
を溶融させ、上記溶融したはんだが上記溝部に沿って上
記はんだ付けランドに流れ落ちることによって、電気部
品を上記プリント基板にはんだ付けすることを特徴とす
るプリント基板への電気部品のはんだ付け方法。1. A heating member in which the vicinity of the lower end portion is bent so as to be inclined at a predetermined angle, and a groove portion communicating with the lower end portion is provided above the bent portion, and the heating member is integrated with the heating member. Using a soldering device provided with a thread solder supply means that can be moved up and down, the lower end of the heating member is brought into contact with the soldering land of the printed circuit board, and the tip of the thread solder sent out from the supply means is Abutting on the groove portion, the thread solder is sent out by a predetermined length, the tip of the thread solder is melted by the heating member, and the molten solder flows down along the groove portion to the soldering land to generate electricity. A method of soldering an electric component to a printed circuit board, the method comprising: soldering a component to the printed circuit board. 【請求項２】 請求項１において、上記加熱部材は１対
を対向するように設け、上記電気部品の両側方から同時
に２ヶ所にはんだ付けすることを特徴とするプリント基
板への電気部品のはんだ付け方法。2. The soldering of an electric component to a printed circuit board according to claim 1, wherein a pair of the heating members are provided so as to face each other, and the electric component is simultaneously soldered to two positions from both sides. How to attach.
JP29666693A 1993-11-26 1993-11-26 Method for soldering electronic component to printed board Pending JPH07154064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29666693A JPH07154064A (en) 1993-11-26 1993-11-26 Method for soldering electronic component to printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29666693A JPH07154064A (en) 1993-11-26 1993-11-26 Method for soldering electronic component to printed board

Publications (1)

Publication Number Publication Date
JPH07154064A true JPH07154064A (en) 1995-06-16

Family

ID=17836510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29666693A Pending JPH07154064A (en) 1993-11-26 1993-11-26 Method for soldering electronic component to printed board

Country Status (1)

Country Link
JP (1) JPH07154064A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012183552A (en) * 2011-03-04 2012-09-27 Miyachi Technos Corp Heater tip, joining device, and joining method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012183552A (en) * 2011-03-04 2012-09-27 Miyachi Technos Corp Heater tip, joining device, and joining method

Similar Documents

Publication Publication Date Title
US4700044A (en) Laser soldering apparatus and method
KR100384796B1 (en) Apparatus and method for bonding conductors
CA2000449C (en) Diode laser soldering system
JP2018148136A (en) Solder joint device
US20020148881A1 (en) Process for manufacturing solid-solder-deposit printed circuit boards
JPH07154064A (en) Method for soldering electronic component to printed board
DE69009421T2 (en) Process for the simultaneous arrangement and soldering of SMD components.
JP3211580B2 (en) Soldering equipment
JP4024068B2 (en) Method and apparatus for soldering electronic components
JPH026055A (en) Method of soldering printed circuit board and silicon chip
JP2001129664A (en) Soldering iron, soldering method and soldering device
JP2001047221A (en) Soldering device for micro object
JP5056590B2 (en) Soldering method and apparatus
JP2009200170A (en) Heating device for terminal
JPS59150665A (en) Soldering method
JP2597695Y2 (en) Reflow furnace
JPH04315494A (en) Method of connecting wire to circuit component
JPH0415414Y2 (en)
JPS6384766A (en) Soldering device
JPS59137174A (en) Preliminary soldering method
JPS63160297A (en) Laser soldering
JP2005268473A (en) Manufacturing method of member for extension boards
JPS59136990A (en) Reflow soldering method
JPH0230142Y2 (en)
JPH0449678A (en) Manufacture of thermoelectric module and its product