JPH071290A - Dimensional abnormality detecting method - Google Patents

Dimensional abnormality detecting method

Info

Publication number
JPH071290A
JPH071290A JP14388793A JP14388793A JPH071290A JP H071290 A JPH071290 A JP H071290A JP 14388793 A JP14388793 A JP 14388793A JP 14388793 A JP14388793 A JP 14388793A JP H071290 A JPH071290 A JP H071290A
Authority
JP
Japan
Prior art keywords
measurement data
dimension
sampling
abnormality
data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14388793A
Other languages
Japanese (ja)
Other versions
JP2974548B2 (en
Inventor
Tomokazu Sato
知一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP5143887A priority Critical patent/JP2974548B2/en
Publication of JPH071290A publication Critical patent/JPH071290A/en
Application granted granted Critical
Publication of JP2974548B2 publication Critical patent/JP2974548B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Automatic Control Of Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Numerical Control (AREA)

Abstract

PURPOSE:To prevent the occurrence of defective machining, such as excessive machining, of a work by a method wherein, when a magnitude relation between measurement data measured at every sampling is reversed and a difference between the data exceeds a given value, an abnormal signal is outputted. CONSTITUTION:An analogue output from a size measuring part to measure the size of a work is inputted to an AMP 1. The analogue output of the AMP 1 is inputted as digital data to a microprocessor 3 by means of an A/D converter 2. The inputted digital data is processed by the microprocessor 3 and a size abnormal signal is outputted from an input output part 4. Namely, a magnitude relation between first measurement data of a work measured at every sampling and second measurement data measured during sampling right before the first measurement data is reversed, and. When a difference between data exceeds a given value, an abnormal signal is outputted from the input output part 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は研削等の加工機械による
加工中のワークの加工寸法の異常を検出する寸法異常検
出方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dimension abnormality detecting method for detecting an abnormality in a machining dimension of a work being machined by a machining machine such as grinding.

【0002】[0002]

【従来の技術】図5は、加工中のワークの加工寸法を計
測する具体例を示す図である。本図は図示しない研削機
械の主軸に円筒51を固定し円筒51を紙面上から見て
反時計方向に回転し、砥石52を同様に紙面上から見て
反時計方向に回転しつつ矢印Aの方向に送り、円筒51
を切削するところを示す。円筒51の外径寸法は、所定
圧力で円筒51を挟んで押圧する2つのワーク接触部5
3とワーク接触部53の移動量から円筒51の外径寸法
を計測する寸法計測部54からなる接触式定寸装置で計
測され、この接触式定寸装置は円筒51が一定の寸法に
なると出力信号を発生し研削機械に出力し、研削機械は
その出力信号を受信し主軸の回転を停止し砥石52の回
転を停止すると同時に砥石52を矢印Aの反対方向に戻
し加工を終了する。
2. Description of the Related Art FIG. 5 is a diagram showing a specific example of measuring a processing dimension of a work being processed. In this figure, a cylinder 51 is fixed to a spindle of a grinding machine (not shown), the cylinder 51 rotates counterclockwise when viewed from the paper surface, and the grindstone 52 also rotates counterclockwise when viewed from the paper surface. Direction, cylinder 51
Shows where to cut. The outer diameter of the cylinder 51 has two work contact portions 5 that press the cylinder 51 with a predetermined pressure.
3 and the movement amount of the work contact portion 53, the outer diameter of the cylinder 51 is measured by a contact-type sizing device including a dimension measuring unit 54. This contact-type sizing device outputs when the cylinder 51 has a constant dimension. A signal is generated and output to the grinding machine, and the grinding machine receives the output signal, stops the rotation of the spindle and stops the rotation of the grindstone 52, and at the same time returns the grindstone 52 in the direction opposite to the arrow A and finishes the machining.

【0003】[0003]

【発明が解決しようとする課題】しかるに、前記説明し
た従来の技術による寸法異常検出方法は、砥石の表面に
はりつけられているダイアモンドの砥粒やワークのバリ
が剥がれワークである円筒の表面部に付着し、円筒の外
径寸法がその付着分等を含み実際の寸法より大きい外径
寸法として計測され、加工過多となる問題がある。同様
に、円筒の内径寸法を計測しながら加工するときは、切
削によるバリによる付着分やゴミ等を含んだ実際の寸法
より小さい内径寸法として計測され加工過多となる問題
がある。
However, the above-described conventional method for detecting dimensional abnormality according to the prior art described above is such that the abrasive grains of the diamond stuck to the surface of the grindstone or the burrs of the work are peeled off and the surface of the cylinder, which is the work, is peeled off. There is a problem in that the outer diameter of the cylinder adheres and is measured as an outer diameter larger than the actual size including the adhered portion and the like, resulting in excessive processing. Similarly, when machining is performed while measuring the inner diameter of the cylinder, there is a problem that the inner diameter is smaller than the actual dimension including the amount of adhered dust due to burrs due to cutting, dust, etc., resulting in excessive machining.

【0004】図6は、ワークの寸法の変化を示すグラフ
であり、(A)は加工過多のまま加工した場合、(B)
は寸法異常を検出し異常排除後に加工を続行した場合を
それぞれ示す。本図は横軸に時間を、縦軸に寸法をとっ
て示す。図6の(A)において時刻t0 からt2 までの
実線で示す曲線と時刻t2 以降の点線で示す曲線はワー
クにゴミ等の付着がなく正常に加工され設定寸法ls
なった時刻t5 で加工を終了した場合の加工寸法の変化
を示し、時刻t0 以降全て実線で示す曲線はワークにゴ
ミ等が付着して加工過多となった場合の加工寸法の変化
を示す。この場合時刻t2 でワークへのゴミ等の付着に
より寸法異常が発生しその付着物が付着したまま加工が
続行され設定寸法ls となった時刻t6 で加工を終了し
た場合の加工寸法の変化を示す。付着物による寸法はl
e だけ加工過多となる。
FIG. 6 is a graph showing changes in the dimensions of the work. FIG. 6A shows the case where the machining is carried out with excessive machining, and FIG.
Indicates the case where a dimensional abnormality is detected and processing is continued after the abnormality is eliminated. In this figure, the horizontal axis represents time and the vertical axis represents dimensions. In FIG. 6A, the curve shown by the solid line from the time t 0 to t 2 and the curve shown by the dotted line after the time t 2 are the time when the workpiece is normally machined without dust and the like and the set dimension is s. A change in the processing dimension when the processing is completed at t 5 is shown, and all curves shown by solid lines after the time t 0 show a change in the processing dimension when dust and the like adhere to the work and become excessive. Machining dimensions when machining remain dimension abnormality occurs that deposits due to the adhesion is adhered has finished processing at time t 6 became set dimension l s continue, such as dust to the work in this case the time t 2 Show changes. The size of the deposit is l
Only e is over- processed.

【0005】図6の(B)は寸法異常を検出し異常排除
後に加工を続行した場合のワークの寸法の変化を示すグ
ラフである。すなわち時刻t11でワークへのゴミ等の付
着により寸法異常が発生し、寸法異常を検出し加工機械
に知らせ、例えば加工工具を時刻t12で逃がしワークに
付いた付着物を取り除いた後、時刻t13で再び加工を続
行し、設定寸法ls となった時刻t14で加工を終了した
場合の加工寸法の変化を示す。この場合付着物による寸
法le は寸法異常を検出後にワークに付いた付着物を取
り除くことにより0となり加工過多とならない。
FIG. 6B is a graph showing the change in the dimension of the workpiece when the dimension abnormality is detected and the machining is continued after the abnormality is eliminated. That is, at time t 11 , a dimensional abnormality occurs due to adhesion of dust or the like to the work, the dimensional abnormality is detected and the processing machine is informed, for example, after the machining tool is released at time t 12 , the adhered matter on the work is removed, The machining size is changed when the machining is continued again at t 13 and the machining is finished at the time t 14 when the set dimension becomes l s . In this case, the dimension l e due to the adhering matter becomes 0 by removing the adhering matter adhering to the work after detecting the dimension abnormality, so that there is no excessive machining.

【0006】それゆえ本発明は前記問題を解決するた
め、加工中のワークの加工寸法の異常を検出し、即座に
加工を中止して加工過多等の加工不良を防止する寸法異
常検出方法を提供することを目的とする。
Therefore, in order to solve the above problems, the present invention provides a dimension abnormality detecting method for detecting an abnormality in the machining dimension of a workpiece being machined and immediately stopping the machining to prevent machining defects such as excessive machining. The purpose is to do.

【0007】[0007]

【課題を解決するための手段】図1は、本発明による第
1の寸法異常検出方法の基本処理フローチャートであ
る。本発明による第1の寸法異常検出方法は、加工中の
ワークの寸法異常を検出する寸法異常検出方法におい
て、ワークの加工寸法の計測データを所定周期でサンプ
リングし、サンプリング毎に計測された第1計測データ
と第1計測データの直前のサンプリング時に計測された
第2計測データとのデータ間の大小関係が逆転し、かつ
データ間の差が所定値より大となるとき異常信号を出力
するよう構成する。図6の(A)を参照して具体的に説
明すると、加工寸法に関する時刻t1の計測データはそ
の直前のサンプリング時の計測データより小であるが、
時刻t 2 の計測データはその直前のサンプリング時の時
刻t1 の計測データより大となり、上述の第1計測デー
タと第2計測データとのデータ間の大小関係が逆転す
る。この差が許容値より大となったとき異常信号を出力
する。
FIG. 1 shows a first embodiment of the present invention.
It is a basic processing flowchart of the dimensional abnormality detection method of 1.
It The first dimensional abnormality detection method according to the present invention is
In the dimension abnormality detection method for detecting workpiece dimension abnormality
Sample the measured data of the machining dimension of the workpiece at a predetermined cycle.
First measurement data that is measured by ringing and sampling
And was measured at the time of sampling just before the first measurement data
The magnitude relationship between the second measurement data and the data is reversed, and
Outputs an abnormal signal when the difference between data exceeds a specified value
To configure. A concrete explanation will be given with reference to FIG.
Clearly, the time t related to the machining dimension1The measurement data of
Although it is smaller than the measurement data at the time of sampling immediately before,
Time t 2The measurement data of is the time of the last sampling
Tick t1Is larger than the measurement data of
Data and the second measurement data are reversed in magnitude relationship.
It Outputs an abnormal signal when this difference exceeds the allowable value
To do.

【0008】図2は、本発明による第2および第3の寸
法異常検出方法の基本処理フローチャートである。本発
明による第2の寸法異常検出方法は、加工中のワークの
寸法異常を検出する寸法異常検出方法において、ワーク
の加工寸法の計測データを所定周期でサンプリングし、
サンプリング毎に計測された第1計測データと第1計測
データの直前までのサンプリング時に計測されたデータ
の最小値と比較し第1計測データがその最小値より大と
なるサンプリング計測が所定回数だけ発生したとき異常
信号を出力するよう構成する。
FIG. 2 is a basic processing flowchart of the second and third dimension abnormality detecting methods according to the present invention. A second dimension abnormality detecting method according to the present invention is a dimension abnormality detecting method for detecting a dimension abnormality of a workpiece being machined, in which measurement data of a machining dimension of the workpiece is sampled at a predetermined cycle,
The first measurement data measured for each sampling is compared with the minimum value of the data measured at the time of sampling up to immediately before the first measurement data, and the first measurement data is larger than the minimum value, and the sampling measurement occurs a predetermined number of times. When this happens, an abnormal signal is output.

【0009】本発明による第3の寸法異常検出方法は、
加工中のワークの寸法異常を検出する寸法異常検出方法
において、ワークの加工寸法の計測データを所定周期で
サンプリングし、サンプリング毎に計測された第1計測
データと第1計測データの直前までのサンプリング時に
計測されたデータの最大値と比較し第1計測データがそ
の最大値より小となるサンプリング計測が所定回数だけ
発生したとき異常信号を出力するよう構成する。
A third dimension abnormality detecting method according to the present invention is
In a dimension abnormality detecting method for detecting a dimension abnormality of a workpiece during machining, the measurement data of the machining dimension of the workpiece is sampled at a predetermined cycle, and the first measurement data measured at each sampling and the sampling up to immediately before the first measurement data are sampled. The abnormal signal is output when the sampling measurement in which the first measurement data is smaller than the maximum value compared with the maximum value of the occasionally measured data occurs a predetermined number of times.

【0010】図6の(A)を参照して具体的に説明する
と、加工寸法に関する時刻t1 の計測データはその直前
までのサンプリング時の計測データより小であるが、時
刻t 2 の計測データはその直前までのサンプリング時の
時刻t1 の計測データより大であり、上述の第1計測デ
ータがその最小値より大となったことが判る。時刻t 3
の計測データも同様である。このような計測が発生した
とき計数し、所定回数計数したとき異常信号を出力す
る。例えば計数設定値が2のとき時刻t3 で異常信号を
出力する。
A specific description will be given with reference to FIG.
And the time t regarding the processing dimension1Immediately before that
Is smaller than the measurement data when sampling up to
Tick t 2The measurement data of the
Time t1Is larger than the measurement data of
It can be seen that the data has exceeded the minimum value. Time t 3
The same applies to the measurement data of. Such measurement has occurred
When it counts, it outputs an abnormal signal when it counts a predetermined number of times.
It For example, when the count setting value is 2, time t3An abnormal signal at
Output.

【0011】本発明による第4の寸法異常検出方法は、
第2または第3の寸法異常検出方法において、サンプリ
ング計測が所定回数だけ連続的に発生したときにのみ異
常信号を出力するように構成する。
A fourth dimension abnormality detecting method according to the present invention is
In the second or third dimension abnormality detecting method, the abnormality signal is output only when the sampling measurement is continuously performed a predetermined number of times.

【0012】前記第1乃至第4の何れか1つの寸法異常
検出方法は、サンプリング時に計測するデータとして所
定条件下の計測データを除外してサンプリングするよう
に構成してもよい。
The dimensional abnormality detecting method according to any one of the first to fourth aspects may be configured to exclude measurement data under a predetermined condition as data to be measured at the time of sampling and perform sampling.

【0013】[0013]

【作用】本発明の寸法異常検出装置方法によれば、加工
中のワークの加工寸法をサンプリングして計測し、その
計測データから加工寸法の異常を検出し加工機械へ出力
することにより、ワークの加工不良を防止することがで
きる。
According to the dimensional abnormality detecting method of the present invention, the machining dimension of the workpiece being machined is sampled and measured, and the abnormality of the machining dimension is detected from the measured data and output to the machining machine. Processing defects can be prevented.

【0014】[0014]

【実施例】図3は、本発明の実施例による寸法異常検出
方法の基本処理フローチャートである。本発明による外
径定寸装置の実施例による寸法異常検出方法は、下記の
各ステップから構成される。 (第1ステップ):加工中のワークの加工寸法の異常を
検出する寸法異常検出方法において、ワークの加工寸法
の計測開始時に第1バッファ、第3バッファおよびカウ
ンタを初期リセットする。 (第2ステップ):前記ワークの加工寸法の計測データ
を所定周期でサンプリングし、該サンプリング毎に計測
される第1計測データを第1バッファに更新して記憶す
る。 (第3ステップ):前記第1バッファに記憶した第1計
測データと前記第1計測データの直後のサンプリング時
に計測する第2計測データとを比較して何れか小となる
データを最小値データとして第3バッファへ記憶する。 (第4ステップ):前記第1計測データと前記第3バッ
ファへ記憶したデータを比較し、前記第1計測データが
前記第3バッファへ記憶したデータより大と変化したと
き、前記カウンタに計数入力し該カウンタが設定値に達
したとき異常信号を出力する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 3 is a basic processing flowchart of a dimension abnormality detecting method according to an embodiment of the present invention. The dimension abnormality detecting method according to the embodiment of the outer diameter sizing apparatus according to the present invention includes the following steps. (First step): In a dimension abnormality detecting method for detecting an abnormality in a machining dimension of a workpiece being machined, a first buffer, a third buffer, and a counter are initially reset when measurement of a machining dimension of a workpiece is started. (Second step): The measurement data of the machining dimension of the work is sampled at a predetermined cycle, and the first measurement data measured at each sampling is updated and stored in the first buffer. (Third step): The first measurement data stored in the first buffer is compared with the second measurement data measured at the time of sampling immediately after the first measurement data, and any one of the smaller data is set as the minimum value data. Store in the third buffer. (Fourth step): The first measurement data is compared with the data stored in the third buffer, and when the first measurement data is larger than the data stored in the third buffer, a count is input to the counter. Then, when the counter reaches a set value, an abnormal signal is output.

【0015】本発明による内径定寸装置の実施例による
寸法異常検出方法は、上記第1ステップと第2ステップ
を実行した後、下記の第3ステップと第4ステップから
構成される。 (第3ステップ):前記第1バッファに記憶した第1計
測データと前記第1計測データの直後のサンプリング時
に計測する第2計測データとを比較して何れか大となる
データを最大値データとして第3バッファへ記憶する。 (第4ステップ):前記第1計測データと前記第3バッ
ファへ記憶したデータを比較し、前記第1計測データが
前記第3バッファへ記憶したデータより小と変化したと
き、前記カウンタに計数入力し該カウンタが設定値に達
したとき異常信号を出力する。
The dimension abnormality detecting method according to the embodiment of the inner diameter sizing apparatus according to the present invention comprises the following third step and fourth step after executing the first step and the second step. (Third step): The first measurement data stored in the first buffer is compared with the second measurement data measured at the time of sampling immediately after the first measurement data, and any one of the larger data is set as the maximum value data. Store in the third buffer. (Fourth step): The first measurement data is compared with the data stored in the third buffer, and when the first measurement data is smaller than the data stored in the third buffer, a count is input to the counter. Then, when the counter reaches a set value, an abnormal signal is output.

【0016】図4は、本発明の実施例の回路図である。
一点鎖線で囲まれた部分は定寸装置10であり、図5で
示したワークの寸法を計測する寸法計測部54からのア
ナログ出力がAMP1へ入力され、AMP1のアナログ
出力はA/Dコンバータ2でデジタルデータとしてマイ
クロプロセッサ3へ入力される。マイクロプロセッサ3
は図3で説明したフローチャートに基づき入力されたデ
ジタルデータを処理し、寸法異常信号を入出力部4から
出力するよう設計する。
FIG. 4 is a circuit diagram of an embodiment of the present invention.
The portion surrounded by the alternate long and short dash line is the sizing device 10. The analog output from the dimension measuring unit 54 for measuring the dimension of the work shown in FIG. 5 is input to the AMP1, and the analog output of the AMP1 is the A / D converter 2 Is input to the microprocessor 3 as digital data. Microprocessor 3
Is designed to process the input digital data based on the flowchart described in FIG. 3 and output a dimension abnormality signal from the input / output unit 4.

【0017】本発明による他の寸法異常検出方法は、サ
ンプリング計測が所定回数だけ連続的に発生したときに
のみ異常信号を出力するようにする。このことにより、
瞬間的に発生する無視可能な異常検出を除外でき誤動作
が発生しない安定した寸法異常検出方法を提供できる。
Another dimension abnormality detecting method according to the present invention outputs an abnormality signal only when sampling measurement is continuously generated a predetermined number of times. By this,
An ignorable abnormality detection that occurs instantaneously can be excluded, and a stable dimension abnormality detection method that does not cause a malfunction can be provided.

【0018】本発明による他の寸法異常検出方法は、サ
ンプリング時に計測するデータとして所定条件下の計測
データを除外してサンプリングするようにする。所定条
件として、例えば溝付きシリンダの外径加工においてそ
の溝に相当する部分をサンプリングして計測したデータ
を寸法異常検出の処理に使用しないことにより、本発明
により加工できる加工対象物の適用範囲を広範囲に拡大
できる。ここで、溝付きシリンダの溝に相当する部分を
サンプリングして計測したデータを除外するためには、
溝を加工しているタイミングの信号を研削機械側から受
けるか、定寸装置への加工寸法入力データが所定値より
小となるタイミングを捕らえるか、または加工機械の溝
付きシリンダを固定する主軸回転信号を入力し溝を加工
するタイミングを捕らえるかの何れかの方法を用いれば
よい。
Another dimensional abnormality detecting method according to the present invention excludes measurement data under a predetermined condition as data to be measured at the time of sampling and performs sampling. As a predetermined condition, for example, in the outer diameter machining of a grooved cylinder, by not using the data measured by sampling the portion corresponding to the groove for the processing of the dimensional abnormality detection, the applicable range of the machining object that can be machined by the present invention is determined. Can be expanded over a wide range. Here, in order to exclude the data measured by sampling the portion corresponding to the groove of the grooved cylinder,
The signal of the timing of machining the groove is received from the grinding machine side, the timing when the machining dimension input data to the sizing device becomes smaller than the specified value is caught, or the spindle rotation that fixes the grooved cylinder of the machining machine. Any method of inputting a signal and capturing the timing of processing the groove may be used.

【0019】[0019]

【発明の効果】以上説明したように本発明によれば、ワ
ークの加工過多等の加工不良を防止する信頼性のある寸
法異常検出方法を提供することができる。また本発明
は、溝付きシリンダの外径加工においてその溝に相当す
る部分を計測したデータを除外することにより溝付きシ
リンダの加工にも適用できるなど広範囲の加工対象物に
適用できる。
As described above, according to the present invention, it is possible to provide a reliable dimension abnormality detecting method for preventing machining defects such as excessive machining of a workpiece. Further, the present invention can be applied to a wide range of objects to be processed, such as being applicable to machining of a grooved cylinder by excluding data obtained by measuring a portion corresponding to the groove in the outer diameter machining of the grooved cylinder.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による第1の寸法異常検出方法の基本処
理フローチャートである。
FIG. 1 is a basic processing flowchart of a first dimensional abnormality detection method according to the present invention.

【図2】本発明による第2および第3の寸法異常検出方
法の基本処理フローチャートである。
FIG. 2 is a basic processing flowchart of second and third dimension abnormality detection methods according to the present invention.

【図3】本発明の実施例による寸法異常検出方法の基本
処理フローチャートである。
FIG. 3 is a basic processing flowchart of a dimension abnormality detection method according to an embodiment of the present invention.

【図4】本発明の実施例の回路図である。FIG. 4 is a circuit diagram of an embodiment of the present invention.

【図5】加工中のワークの加工寸法を計測する具体例を
示す図である。
FIG. 5 is a diagram showing a specific example of measuring a processing dimension of a workpiece being processed.

【図6】ワークの寸法の変化を示すグラフであり、
(A)は加工過多のまま加工した場合、(B)は寸法異
常を検出し異常排除後に加工を続行した場合をそれぞれ
示す。
FIG. 6 is a graph showing changes in the dimensions of the work,
(A) shows the case where the machining is performed with excessive machining, and (B) shows the case where the dimension abnormality is detected and the machining is continued after the abnormality is eliminated.

【符号の説明】[Explanation of symbols]

1…AMP 2…A/Dコンバータ 3…マイクロプロセッサ 4…入出力部 10…定寸装置 51…円筒 52…砥石 53…ワーク接触部 54…寸法計測部 DESCRIPTION OF SYMBOLS 1 ... AMP 2 ... A / D converter 3 ... Microprocessor 4 ... Input / output part 10 ... Sizing device 51 ... Cylinder 52 ... Grinding stone 53 ... Work contact part 54 ... Dimension measurement part

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 加工中のワークの寸法異常を検出する寸
法異常検出方法において、 前記ワークの加工寸法の計測データを所定周期でサンプ
リングし、該サンプリング毎に計測された第1計測デー
タと該第1計測データの直前のサンプリング時に計測さ
れた第2計測データとのデータ間の大小関係が逆転し、
かつ該データ間の差が所定値より大となるとき異常信号
を出力することを特徴とする寸法異常検出方法。
1. A dimension abnormality detecting method for detecting a dimension abnormality of a workpiece being machined, wherein measurement data of the machining dimension of the workpiece is sampled at a predetermined cycle, and the first measurement data and the first measurement data measured at each sampling are collected. The magnitude relationship between the second measurement data and the data measured during the sampling immediately before the first measurement data is reversed,
A dimension abnormality detecting method is characterized in that an abnormality signal is output when the difference between the data becomes larger than a predetermined value.
【請求項2】 加工中のワークの寸法異常を検出する寸
法異常検出方法において、 前記ワークの加工寸法の計測データを所定周期でサンプ
リングし、 該サンプリング毎に計測された第1計測データと該第1
計測データの直前までのサンプリング時に計測されたデ
ータの最小値と比較し、 前記第1計測データが前記最小値より大となるサンプリ
ング計測が所定回数だけ発生したとき異常信号を出力す
ることを特徴とする寸法異常検出方法。
2. A dimension abnormality detecting method for detecting a dimension abnormality of a workpiece being machined, wherein measurement data of the machining dimension of the workpiece is sampled at a predetermined cycle, and the first measurement data and the first measurement data measured for each sampling. 1
Comparing with a minimum value of data measured at the time of sampling up to immediately before the measurement data, and outputting an abnormal signal when sampling measurement in which the first measurement data is larger than the minimum value occurs a predetermined number of times. Dimensional anomaly detection method.
【請求項3】 加工中のワークの寸法異常を検出する寸
法異常検出方法において、 前記ワークの加工寸法の計測データを所定周期でサンプ
リングし、 該サンプリング毎に計測された第1計測データと該第1
計測データの直前までのサンプリング時に計測されたデ
ータの最大値と比較し、 前記第1計測データが前記最大値より小となるサンプリ
ング計測が所定回数だけ発生したとき異常信号を出力す
ることを特徴とする寸法異常検出方法。
3. A dimension abnormality detecting method for detecting a dimension abnormality of a workpiece being machined, wherein measurement data of the machining dimension of the workpiece is sampled at a predetermined cycle, and the first measurement data and the first measurement data measured for each sampling. 1
Comparing with a maximum value of data measured at the time of sampling up to immediately before the measurement data, and outputting an abnormal signal when sampling measurement in which the first measurement data is smaller than the maximum value occurs a predetermined number of times. Dimensional anomaly detection method.
【請求項4】 前記サンプリング計測が前記所定回数だ
け連続的に発生したとき異常信号を出力することを特徴
とする請求項2または3に記載の寸法異常検出方法。
4. The dimensional abnormality detection method according to claim 2, wherein an abnormal signal is output when the sampling measurement is continuously generated the predetermined number of times.
【請求項5】 前記サンプリング時に計測するデータと
して所定条件下の計測データを除外してサンプリングす
ることを特徴とする請求項1乃至4の何れか1項に記載
の寸法異常検出方法。
5. The dimensional abnormality detection method according to claim 1, wherein measurement data under a predetermined condition is excluded as data to be measured at the time of sampling and sampling is performed.
JP5143887A 1993-06-15 1993-06-15 Dimension abnormality detection method Expired - Lifetime JP2974548B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5143887A JP2974548B2 (en) 1993-06-15 1993-06-15 Dimension abnormality detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5143887A JP2974548B2 (en) 1993-06-15 1993-06-15 Dimension abnormality detection method

Publications (2)

Publication Number Publication Date
JPH071290A true JPH071290A (en) 1995-01-06
JP2974548B2 JP2974548B2 (en) 1999-11-10

Family

ID=15349345

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP2974548B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002239876A (en) * 2001-02-19 2002-08-28 Toyoda Mach Works Ltd Processing device
JP2007030103A (en) * 2005-07-27 2007-02-08 Nissan Motor Co Ltd Method and device for deciding abnormality of machining portion of workpiece
JP2008161960A (en) * 2006-12-27 2008-07-17 Jtekt Corp Working method and working device
JP2008161959A (en) * 2006-12-27 2008-07-17 Jtekt Corp Working method and working device
JP2008161961A (en) * 2006-12-27 2008-07-17 Jtekt Corp Working method and working device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54116796A (en) * 1979-02-09 1979-09-11 Toyoda Mach Works Ltd Characteristics change detection device of grinding stone surface
JPS63302309A (en) * 1987-06-02 1988-12-09 Osaka Kiko Co Ltd Automatic measurement of object to be measured in nc machine tool
JPH04322950A (en) * 1991-04-19 1992-11-12 Honda Motor Co Ltd Finishing method of shaft-like work

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54116796A (en) * 1979-02-09 1979-09-11 Toyoda Mach Works Ltd Characteristics change detection device of grinding stone surface
JPS63302309A (en) * 1987-06-02 1988-12-09 Osaka Kiko Co Ltd Automatic measurement of object to be measured in nc machine tool
JPH04322950A (en) * 1991-04-19 1992-11-12 Honda Motor Co Ltd Finishing method of shaft-like work

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002239876A (en) * 2001-02-19 2002-08-28 Toyoda Mach Works Ltd Processing device
JP2007030103A (en) * 2005-07-27 2007-02-08 Nissan Motor Co Ltd Method and device for deciding abnormality of machining portion of workpiece
JP4715363B2 (en) * 2005-07-27 2011-07-06 日産自動車株式会社 Processed part abnormality determination method and apparatus for workpiece
JP2008161960A (en) * 2006-12-27 2008-07-17 Jtekt Corp Working method and working device
JP2008161959A (en) * 2006-12-27 2008-07-17 Jtekt Corp Working method and working device
JP2008161961A (en) * 2006-12-27 2008-07-17 Jtekt Corp Working method and working device

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