JPH07122825A - Solid molded circuit substrate and its manufacture - Google Patents
Solid molded circuit substrate and its manufactureInfo
- Publication number
- JPH07122825A JPH07122825A JP26449793A JP26449793A JPH07122825A JP H07122825 A JPH07122825 A JP H07122825A JP 26449793 A JP26449793 A JP 26449793A JP 26449793 A JP26449793 A JP 26449793A JP H07122825 A JPH07122825 A JP H07122825A
- Authority
- JP
- Japan
- Prior art keywords
- film
- pps
- circuit
- resin
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Landscapes
- Moulding By Coating Moulds (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器部品や装置に
存在する樹脂製のキャビネットやカバー等を用いて狭い
空間内に電子部品などを効率的に実装するために用いる
ＰＰＳ樹脂を用いた三次元形状の立体成形回路基板及び
その製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a PPS resin which is used for efficiently mounting electronic parts and the like in a narrow space by using resin-made cabinets and covers which are present in electronic equipment parts and devices. The present invention relates to a three-dimensionally shaped three-dimensional molded circuit board and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、樹脂成形体の表面に三次元形状の
パターンを設けて立体的な回路基板を形成するに当たっ
ては、例えば、図４に示すような樹脂射出成形機に取り
付けた金型Ａ1，Ａ2の間に回路パターン４１を設けたフ
ィルムからなるキャリヤーシートＫを金型内に装着し
（図４（ａ））、樹脂の射出成形を行って（図４
（ｂ））回路パターン４１を転写する方法が行われてい
る（図４（ｃ），（ｄ））。かかる方法において用いら
れるキャリヤーシートＫはプラスチックフィルム等の面
上に接着等の方法によって導電性金属箔を設け、それを
エッチング等によって回路パターン４１を形成したもの
であり、図４（ａ）〜（ｄ）に示す様に金型Ａ1，Ａ2の
中で樹脂が成形される際に回路パターン４１は、キャリ
ヤーシートＫより樹脂成形体の表面上に転写され、立体
形状の樹脂製の立体成形回路基板Ｒ（立体射出成形回路
基板のこと）が得られるものである。2. Description of the Related Art Conventionally, in forming a three-dimensional circuit board by providing a three-dimensional pattern on the surface of a resin molding, for example, a mold A attached to a resin injection molding machine as shown in FIG. 4 is used. A carrier sheet K made of a film having a circuit pattern 41 provided between 1 and A 2 is mounted in a mold (FIG. 4 (a)), and resin injection molding is performed (FIG. 4).
(B)) A method of transferring the circuit pattern 41 is performed (FIGS. 4C and 4D). The carrier sheet K used in such a method is one in which a conductive metal foil is provided on the surface of a plastic film or the like by a method such as adhesion and the circuit pattern 41 is formed by etching or the like, as shown in FIGS. As shown in d), when the resin is molded in the molds A 1 and A 2 , the circuit pattern 41 is transferred from the carrier sheet K onto the surface of the resin molded body, and the three-dimensional resin three-dimensional molding is performed. A circuit board R (referred to as a three-dimensional injection molded circuit board) is obtained.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら上述した
転写法においては以下のような問題点がある。つまり図
４（ｃ）に示す様に射出成形の際に回路パターンを保持
する為のキャリヤーシートＫが必要になる。図４に示す
ように射出成形時にキャリヤーシートＫは、ロールＲR
で供給され金型内に挿入される。そして射出成形後にキ
ャリヤーシートＫは、立体成形回路基板Ｒから剥離され
金型から回収される（図４（ｄ））が、射出成形前後を
通じて金型の内部で適当な張力を加えて保持されなくて
はならず、またキャリヤーシートＫ自体一度の使用で再
使用が不可能で成形品よりもかなり大きなものを必要と
し、コスト上昇の原因の１つになる。またキャリヤーシ
ートＫから成形品を引きはがす必要がありその工程が増
えると供に、引きはがす時に充分な剥離強度を保持して
いる必要がある。さらに、回路作成の工程上必要な防錆
処理やソルダーレジスト等の処理を樹脂射出成形後に立
体成形回路基板Ｒの上に後工程で行わなくてはならず、
立体成形回路基板Ｒとして完成するまでには時間と労力
を要する。However, the above-mentioned transfer method has the following problems. That is, as shown in FIG. 4C, a carrier sheet K for holding a circuit pattern during injection molding is required. As shown in FIG. 4, the carrier sheet K is roll R R during injection molding.
It is supplied by and inserted into the mold. After the injection molding, the carrier sheet K is separated from the three-dimensional molding circuit board R and recovered from the mold (FIG. 4 (d)), but is not held by applying appropriate tension inside the mold before and after the injection molding. In addition, the carrier sheet K itself cannot be reused after being used once and requires a considerably larger product than a molded product, which is one of the causes of cost increase. Further, it is necessary to peel off the molded product from the carrier sheet K, and as the number of steps increases, it is necessary to maintain sufficient peel strength at the time of peeling. Furthermore, the rust-prevention treatment and the treatment such as solder resist necessary in the process of circuit formation must be performed on the three-dimensional molded circuit board R in a post-process after resin injection molding.
It takes time and labor to complete the three-dimensional molded circuit board R.
【０００４】本発明は、上記問題点を解決する立体成形
回路基板及びその製造方法を提供するものである。The present invention provides a three-dimensional molded circuit board and a method for manufacturing the same, which solves the above problems.
【０００５】[0005]
【課題を解決するための手段】本発明の立体成形回路基
板は、ＰＰＳフィルム上に接着層を介して所定の回路パ
ターンに加工された導電箔を有する回路フィルムをＰＰ
Ｓ樹脂成形体溶着一体化したことを特徴とする。A three-dimensional molded circuit board of the present invention comprises a PP film having a conductive film processed into a predetermined circuit pattern through an adhesive layer on a PP film.
It is characterized in that the S resin molded body is integrated by welding.
【０００６】また、本発明の立体成形回路基板は、上記
接着層の厚さが１０〜５０μｍであることを特徴とす
る。The three-dimensional molded circuit board of the present invention is characterized in that the adhesive layer has a thickness of 10 to 50 μm.
【０００７】また、本発明の立体成形回路基板の製造方
法は、所定の回路パターンに加工された導電箔を接着層
により固着されたＰＰＳフィルムからなる所定の大きさ
の回路フィルムを射出成形金型の中に位置決め挿入する
工程と、上記射出成形金型の金型温度を９０〜１６０℃
及びＰＰＳ樹脂の樹脂射出温度２８０〜３６０℃の条件
下で、上記ＰＰＳ樹脂を射出して上記回路フィルムと溶
着一体化してＰＰＳ樹脂成形体を形成する工程と、を含
むことを特徴とする。In the method for manufacturing a three-dimensional molded circuit board of the present invention, a circuit film of a predetermined size made of a PPS film having a conductive foil processed into a predetermined circuit pattern fixed by an adhesive layer is injection-molded. The step of positioning and inserting into the mold, and the mold temperature of the injection mold is 90 to 160 ° C.
And a step of forming the PPS resin molded body by injecting the PPS resin and welding and integrating the PPS resin under the condition of a resin injection temperature of the PPS resin of 280 to 360 ° C.
【０００８】また、本発明の立体成形回路基板の製造方
法は、上記回路フィルムを位置決め手段を有したフィル
ムストッカーに複数枚保持し、該フィルムストッカーか
ら逐次供給することを特徴とする。Further, the method for manufacturing a three-dimensional molded circuit board of the present invention is characterized in that a plurality of the above-mentioned circuit films are held in a film stocker having a positioning means and are sequentially supplied from the film stocker.
【０００９】[0009]
【作用】本発明によれば、ＰＰＳ樹脂とＰＰＳフィルム
を使用することにより射出製造方法時の成形条件でＰＰ
Ｓ樹脂とＰＰＳフィルムの溶着力（剥離強度）を制御で
き、溶着剥離強度が実用上十分高い（剥離強度１ｋｇ／
ｃｍ以上）ことがあげられる。According to the present invention, by using the PPS resin and the PPS film, the PP can be manufactured under the molding conditions in the injection manufacturing method.
The welding force (peeling strength) between the S resin and PPS film can be controlled, and the welding peeling strength is sufficiently high for practical use (peeling strength 1 kg /
cm or more).
【００１０】また、次工程に存在するリフロー工程で耐
熱性があり、実装時に十分な強度を提供することができ
る。この立体成形回路基板は、面上に防錆処理等が施さ
れた回路フィルムを溶着固定したものなので、当然後工
程で防錆処理等を施す必要もなくただちに次工程に使用
できる。Further, it has heat resistance in the reflow process, which is the next process, and can provide sufficient strength during mounting. Since this three-dimensional molded circuit board is formed by welding and fixing a circuit film that has been subjected to anticorrosion treatment or the like on its surface, it can be immediately used in the next step without the need for anticorrosion treatment or the like in a later step.
【００１１】[0011]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。図１に、本発明の実施例に係る立体成形回路基板
の製造方法を示す。また、図２に、本発明の実施例に係
る回路フィルムを示す。また、図３に、本発明の実施例
に係る得られた立体成形回路基板を示す。また、図５
に、本発明の実施例に係る回路フィルムの供給方法を示
す。また、図６に、本発明の実施例に係る射出成形時の
種々の成形条件における剥離強度の変化を示す。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a method for manufacturing a three-dimensional molded circuit board according to an embodiment of the present invention. Further, FIG. 2 shows a circuit film according to an example of the present invention. Further, FIG. 3 shows the obtained three-dimensional molded circuit board according to the embodiment of the present invention. Also, FIG.
The method of supplying the circuit film according to the embodiment of the present invention is shown in FIG. 6 shows changes in peel strength under various molding conditions during injection molding according to the embodiment of the present invention.
【００１２】まず、ＰＰＳ（ポリフェニレンサルファイ
ト）フィルムを用いた回路フィルム２３を金型Ａ1，Ａ2
の間に挿入する（図１（ａ））。ここで、導電箔２２が
設けられていない回路フィルム２３の面Ｓを射出成形時
にＰＰＳ樹脂の注入される方に向けて位置決めして挿入
する。First, the circuit film 23 using a PPS (polyphenylene sulphite) film is used to mold the molds A 1 and A 2.
It is inserted between the two (FIG. 1 (a)). Here, the surface S of the circuit film 23 on which the conductive foil 22 is not provided is positioned and inserted toward the direction where the PPS resin is injected during injection molding.
【００１３】なお、図２に示したように、回路フィルム
２３は、厚さ２５μｍのＰＰＳフィルム２１の上に厚さ
３５μｍの導電箔２２を厚さ２０μｍの接着剤２４（本
実施例中ではポリエステル系接着剤を使用）で貼り付
け、エッチング加工が施され回路パターンが形成されて
いる。その後、回路フィルム２３にソルダーレジストや
防錆処理液等をスクリーン印刷で塗布し、さらに、回路
フィルム２３を所定の形状に切断し回路フィルム２３が
完成する。ここで、回路フィルム２３を所定の形状に切
断したのは、ＰＰＳ樹脂の射出成形完了後に立体成形品
を後加工をほどこさずにそのまま後工程（例えば実装工
程など）に使用できることをめざした為である。また、
上記回路フィルム２３でのＰＰＳフィルム２１の厚さは
８〜１００μｍ、導電箔２２の厚さは１０〜５００μ
ｍ、接着剤２４の厚さは１０〜５０μｍであるのが好ま
しい。さらに、導電箔２２として、圧延銅箔、電解銅
箔、圧延アルミ箔、銀箔、あるいはこれら箔を積層した
ものを用いることができる。この中では、特に銅箔を用
いたものが好ましい。さらに、また、上記接着剤とし
て、ポリイミド系接着剤や他の熱硬化性接着剤を用いる
こともできる。As shown in FIG. 2, the circuit film 23 includes a PPS film 21 having a thickness of 25 μm, a conductive foil 22 having a thickness of 35 μm, an adhesive 24 having a thickness of 20 μm (polyester in this embodiment). A circuit adhesive is used), and a circuit pattern is formed by etching. After that, a solder resist, an anticorrosive treatment liquid, etc. are applied to the circuit film 23 by screen printing, and the circuit film 23 is cut into a predetermined shape to complete the circuit film 23. Here, the reason why the circuit film 23 is cut into a predetermined shape is that after the injection molding of the PPS resin is completed, the three-dimensional molded article can be used as it is in a subsequent step (for example, a mounting step) without post-processing. Is. Also,
In the circuit film 23, the PPS film 21 has a thickness of 8 to 100 μm, and the conductive foil 22 has a thickness of 10 to 500 μm.
m, and the thickness of the adhesive 24 is preferably 10 to 50 μm. Furthermore, as the conductive foil 22, a rolled copper foil, an electrolytic copper foil, a rolled aluminum foil, a silver foil, or a laminate of these foils can be used. Among these, the one using copper foil is particularly preferable. Furthermore, a polyimide-based adhesive or another thermosetting adhesive may be used as the adhesive.
【００１４】次に、金型温度を１３０℃にして金型
Ａ1，Ａ2を閉じ、回路フィルム２３のＰＰＳフィルム２
１の面ＳにＰＰＳ樹脂ＰP樹脂射出温度３００℃にて射
出成形機を用いて注入する（図１（ｂ））。ここで、本
発明者らが検討した結果、後述するように、上記金型温
度は９０〜１６０℃が好ましく、上記樹脂射出温度は２
８０〜３６０℃が好ましい。また、上記射出成形時の樹
脂射出圧力は１５００ｋｇ／ｃｍ2、樹脂射出速度は１
３０ｍｍ／ｓｅｃと、従来の条件に設定して行ったが、
これらの値を多少変更しても剥離強度に変化がないた
め、これらの値に限定されるものではない。Next, the mold temperature is set to 130 ° C., the molds A 1 and A 2 are closed, and the PPS film 2 of the circuit film 23 is closed.
The PPS resin P P resin is injected into the first surface S at an injection temperature of 300 ° C. by using an injection molding machine (FIG. 1B). As a result of examination by the present inventors, the mold temperature is preferably 90 to 160 ° C. and the resin injection temperature is 2 as described later.
80-360 degreeC is preferable. The resin injection pressure at the time of the above injection molding is 1500 kg / cm 2 , and the resin injection speed is 1
It was set under the conventional condition of 30 mm / sec,
The peel strength does not change even if these values are changed to some extent, and thus the values are not limited to these values.
【００１５】その後、金型Ａ1，Ａ2を開けば、三次元形
状の立体成形回路基板Ｐが直ちに得られる（図１
（ｃ））。After that, when the molds A 1 and A 2 are opened, the three-dimensionally shaped three-dimensional molded circuit board P is immediately obtained (FIG. 1).
(C)).
【００１６】なお、上記立体成形回路基板Ｐは、図３に
示すように、樹脂射出成形品の三次元形状の面上にソル
ダーレジストや防錆処理等が施された回路フィルム２３
を溶着固定したもので、当然回路フィルム２３上に後工
程でソルダーレジストや防錆処理等を施す必要もなく、
ただちに実装等の次工程に使用できるものである。As shown in FIG. 3, the three-dimensional molded circuit board P is a circuit film 23 in which a resin injection molded product has a three-dimensional surface on which a solder resist, a rust preventive treatment or the like is applied.
Is fixed by welding, of course, there is no need to apply solder resist or rust-proof treatment on the circuit film 23 in a later step,
It can be used immediately in the next process such as mounting.
【００１７】また、回路フィルム２３は立体成形品の表
面に回路パターンを溶着したもので、立体成形品の表面
積より回路フィルム２３の溶着面は小さくなり、回路パ
ターンやフィルムの端などは完全に立体成形品の表面に
埋め込まれた形になり回路パターンや回路フィルムの剥
離強度が上昇する。The circuit film 23 is formed by welding a circuit pattern on the surface of a three-dimensional molded product. The welding surface of the circuit film 23 is smaller than the surface area of the three-dimensional molded product, and the circuit pattern and the edges of the film are completely three-dimensional. It becomes a form embedded in the surface of the molded product, and the peel strength of the circuit pattern and circuit film increases.
【００１８】次に、本発明の実施例に係る回路フィルム
２３の供給方法を図５を用いて説明する。回路フィルム
２３は、まずフィルムストッカー５５に複数枚を供給し
フィルム押え５６により回路フィルム２３を複数枚、保
持しておく。その時回路フィルム２３は、フィルムスト
ッカー５５に位置決めピン５７を設置し、そのピン５７
にフィルム上に開けられた位置決め穴５２を通して保持
される（図５（ａ））。その回路フィルム２３を吸着供
給装置５４でフィルムストッカー５５より取り出される
（図５（ｂ））。その回路フィルム２３を吸着供給装置
５４により金型Ａ1に発送し金型Ａ1内に設置された位置
決め装置５１（ここでは金型内に位置決めピンを設置、
この他にも成形品に穴を開ける為に設置されるピンを利
用しても良い。）に供給し、金型内固定装置５３（ここ
では回路フィルム２３を真空吸着で固定）により固定さ
れる。この例では、回路フィルム２３の両端は支持する
必要はない（図５（ｃ））。次に金型Ａ1を閉じ金型内
に回路フィルム２３を閉じ込める（図５（ｄ））。そし
て高温高圧のＰＰＳ樹脂を金型内に射出すれば（図５
（ｅ））、ＰＰＳ樹脂が金型Ａ1の形状に沿うように流
れ、回路フィルム２３は金型Ａ1の表面に押し付けられ
て成型品に溶着する。以上の説明を簡単にまとめると、
回路フィルム２３は金型内のフィルム位置決め部に装着
し、金型内で位置決めされる。また、図５の様な金型の
場合、可動側金型Ａ1のフィルム位置決め部に装着され
るが、回路フィルムを金型の凸形状に合わせて折り曲げ
加工を行わなくても、金型内に樹脂を射出するゲート部
を金型の凸形状の上部に設定し回路フィルムの面に沿っ
て樹脂を流せば、射出成型品の表面に回路パターンを作
成することが出来る。この金型は、既存の樹脂製品のキ
ャビネットやフレームで使用する金型も利用可能であ
る。Next, a method of supplying the circuit film 23 according to the embodiment of the present invention will be described with reference to FIG. A plurality of circuit films 23 are first supplied to the film stocker 55, and a plurality of circuit films 23 are held by the film retainer 56. At that time, the circuit film 23 has the positioning pin 57 installed on the film stocker 55, and the pin 57
It is held through a positioning hole 52 formed on the film (FIG. 5 (a)). The circuit film 23 is taken out from the film stocker 55 by the suction supply device 54 (FIG. 5 (b)). The circuit film 23 is sent to the mold A 1 by the suction supply device 54, and the positioning device 51 installed in the mold A 1 (here, positioning pins are installed in the mold,
Besides this, a pin installed to make a hole in the molded product may be used. ) And is fixed by an in-mold fixing device 53 (here, the circuit film 23 is fixed by vacuum suction). In this example, it is not necessary to support both ends of the circuit film 23 (FIG. 5 (c)). Next, the mold A 1 is closed and the circuit film 23 is confined in the mold (FIG. 5 (d)). If high temperature and high pressure PPS resin is injected into the mold (Fig.
(E)), the PPS resin flows along the shape of the mold A 1 , and the circuit film 23 is pressed against the surface of the mold A 1 and welded to the molded product. To summarize the above description briefly,
The circuit film 23 is mounted on the film positioning portion in the mold and positioned in the mold. Further, in the case of the mold as shown in FIG. 5, the mold is mounted on the film positioning portion of the movable mold A 1 , but the circuit film can be fitted to the convex shape of the mold without bending the mold. A circuit pattern can be created on the surface of the injection-molded product by setting the gate portion for injecting resin on the upper part of the convex shape of the mold and flowing the resin along the surface of the circuit film. As this mold, a mold used in an existing resin product cabinet or frame can also be used.
【００１９】また、本発明でＰＰＳ樹脂とＰＰＳフィル
ムを使用したのは、ＰＰＳ樹脂とＰＰＳフィルムであれ
ば、射出成形時の成形条件であればＰＰＳ樹脂とＰＰＳ
フィルムの溶着力（剥離強度）を制御でき、溶着剥離強
度が実用上十分高い（剥離強度１ｋｇ／ｃｍ以上）こと
があげられる。以下に、その説明を行う。In the present invention, the PPS resin and the PPS film are used in the case of the PPS resin and the PPS film, if the molding conditions at the time of injection molding are the PPS resin and the PPS film.
The welding force (peeling strength) of the film can be controlled, and the welding peeling strength is sufficiently high for practical use (peeling strength 1 kg / cm or more). The description will be given below.
【００２０】図６（ａ）に、樹脂射出温度３００℃の時
の剥離強度と金型温度との関係を、図６（ｂ）に、金型
温度１３０℃の時の剥離強度と樹脂射出温度の関係を示
す。本発明者らが、鋭意検討した結果、金型温度を９０
〜１６０℃に設定し、さらに前記金型温度で樹脂射出温
度２８０〜３６０℃で射出成形を行えば、基板に要求さ
れる剥離強度１ｋｇ／ｃｍ以上を満足できることが判明
した。また、ＰＰＳ樹脂をここで使用しているのは、比
較的安価なＰＥＴ樹脂では耐熱温度が１２０℃（連続使
用温度）と低く、ＰＩ樹脂やＬＣＰ樹脂では耐熱温度が
それぞれ２３０℃、２２５℃と十分な耐熱性を示すが、
ＰＩ樹脂やＬＣＰ樹脂は非常に高価でＬＣＰ樹脂には同
樹脂のフィルムは存在せず、ＰＩ樹脂にはＰＩフィルム
は存在するがフィルム自身は溶融せず溶着させるのは困
難であった。またＰＰＳ樹脂は次工程に存在するリフロ
ーでの耐熱性があり実装時に十分な強度を有し、比較的
安価であることによる。FIG. 6A shows the relationship between the peel strength and the mold temperature when the resin injection temperature is 300 ° C., and FIG. 6B shows the peel strength and the resin injection temperature when the mold temperature is 130 ° C. Shows the relationship. As a result of intensive studies by the present inventors, the mold temperature was set to 90
It was found that the peel strength of 1 kg / cm or more required for the substrate can be satisfied by setting the temperature to ˜160 ° C. and performing the injection molding at the mold temperature at the resin injection temperature of 280 to 360 ° C. Further, the PPS resin is used here because the heat resistance temperature of the relatively inexpensive PET resin is as low as 120 ° C. (continuous use temperature), and the heat resistance temperature of the PI resin and LCP resin is 230 ° C. and 225 ° C., respectively. Shows sufficient heat resistance,
The PI resin and the LCP resin are very expensive, and the LCP resin does not have a film of the same resin. The PI resin has the PI film, but the film itself does not melt and it is difficult to weld the film. Further, the PPS resin has heat resistance in reflow in the next step, has sufficient strength at the time of mounting, and is relatively inexpensive.
【００２１】次に、本実施例に係るＰＰＳフィルムを使
用したのは、例えばＰＥＴフィルムやＰＥＩフィルムの
様な異種材料フィルムでは十分な溶着強度（剥離強度）
が得られず、溶着と言うよりも射出成形時の熱と圧力で
圧着しているに過ぎなかった。また前述したようにＰＩ
フィルムでは、溶着させるのも困難であった。Next, the PPS film according to the present embodiment is used because it has sufficient welding strength (peel strength) in the case of a different material film such as a PET film or a PEI film.
However, rather than welding, they were merely pressed by heat and pressure during injection molding. As mentioned above, PI
The film was also difficult to weld.
【００２２】また、図７に、導電箔とＰＰＳフィルムの
剥離強度と導電箔をＰＰＳフィルムに接着している接着
剤の厚みとの関係を示す。接着剤の厚みが１０〜５０μ
ｍの間であれば、上述した金型温度（９０〜１６０℃）
と樹脂射出温度（２８０〜３６０℃）の範囲で導電箔と
ＰＰＳフィルムの間の剥離強度を１ｋｇ／ｃｍ以上にす
ることができる。なお、接着剤の厚みが５０μｍを超え
ると接着剤内部で剥離が起こり、導電箔とＰＰＳフィル
ムの間の剥離強度は小さくなる。また、導電箔とＰＰＳ
フィルム間の接着剤は、後工程の部品実装時にリフロー
等の熱処理工程を経る時には、接着剤は完全硬化の状態
でなくても、後工程で硬化をすすめることが可能にな
る。図７に示すようにリフロー工程を経ることにより、
より高い剥離強度が得られる。従って、この接着剤は、
半硬化状態でも完全硬化状態でもよい。FIG. 7 shows the relationship between the peel strength between the conductive foil and the PPS film and the thickness of the adhesive that bonds the conductive foil to the PPS film. Thickness of adhesive is 10-50μ
If it is between m, the mold temperature described above (90 to 160 ° C)
In the range of resin injection temperature (280 to 360 ° C.), the peel strength between the conductive foil and the PPS film can be 1 kg / cm or more. If the thickness of the adhesive exceeds 50 μm, peeling occurs inside the adhesive and the peel strength between the conductive foil and the PPS film becomes small. In addition, conductive foil and PPS
The adhesive between the films can be cured in the post-process even when the adhesive is not in a completely cured state when a heat treatment process such as reflow is performed at the time of mounting components in the post-process. By going through the reflow process as shown in FIG.
Higher peel strength is obtained. Therefore, this adhesive
It may be in a semi-cured state or a completely cured state.
【００２３】[0023]
【発明の効果】本発明によれば、以下のような効果があ
る。つまり、回路フィルム（ＰＰＳフィルム）を金型の
中に挿入し樹脂射出成形を行うことにより三次元形状の
任意の立体成形回路基板を製造するものであり、実装工
程やリフロー工程等での熱や強度に十分耐え得るものが
容易に安価で得られ、ＰＰＳフィルムとＰＰＳ樹脂が強
固に溶着したことにより一工程で製品の樹脂製のキャビ
ネットやフレームと同時に成形される利点がある。The present invention has the following effects. In other words, a circuit film (PPS film) is inserted into a mold and resin injection molding is performed to manufacture an arbitrary three-dimensional molded circuit board. A product that can withstand sufficient strength can be easily obtained at a low cost, and since the PPS film and the PPS resin are firmly welded, there is an advantage that they can be molded simultaneously with the resin cabinet or frame of the product in one step.
【図１】本発明の実施例に係る立体成形回路基板の製造
方法を示す図である。FIG. 1 is a diagram showing a method for manufacturing a three-dimensional molded circuit board according to an embodiment of the present invention.
【図２】本発明の実施例に係る回路フィルムを示す図で
ある。FIG. 2 is a diagram showing a circuit film according to an example of the present invention.
【図３】本発明の実施例に係る立体成形回路基板を示す
図である。FIG. 3 is a diagram showing a three-dimensional molded circuit board according to an embodiment of the present invention.
【図４】従来技術による立体成形回路基板の製造方法を
示す図である。FIG. 4 is a diagram showing a method for manufacturing a three-dimensional molded circuit board according to a conventional technique.
【図５】本発明の実施例に係る回路フィルムの供給方法
を説明するための図である。FIG. 5 is a diagram illustrating a method of supplying a circuit film according to an example of the present invention.
【図６】（ａ）本発明の実施例に係る剥離強度と金型温
度との関係を示す図である。（ｂ）本発明の実施例に係
る剥離強度と溶融樹脂温度との関係を示す図である。FIG. 6 (a) is a diagram showing a relationship between peel strength and mold temperature according to an example of the present invention. (B) It is a figure which shows the relationship between the peeling strength and molten resin temperature which concern on the Example of this invention.
【図７】本発明の実施例に係る剥離強度と接着剤の厚み
との関係を示す図である。FIG. 7 is a diagram showing the relationship between peel strength and adhesive thickness according to an example of the present invention.
Ａ1，Ａ2 金型 Ｓ ＰＰＳフィルム面 Ｐ 立体射出成形回路基板 ＰP ＰＰＳ樹脂 ２１ ＰＰＳフィルム ２２ 導電箔 ２３ 回路フィルムA 1 , A 2 mold S PPS film surface P Solid injection molded circuit board P P PPS resin 21 PPS film 22 Conductive foil 23 Circuit film
Claims (4)
の回路パターンに加工された導電箔を有する回路フィル
ムをＰＰＳ樹脂成形体に溶着一体化したことを特徴とす
る立体成形回路基板。1. A three-dimensional molded circuit board, wherein a circuit film having a conductive foil processed into a predetermined circuit pattern on a PPS film via an adhesive layer is fused and integrated with a PPS resin molded body.
ることを特徴とする請求項１に記載の立体成形回路基
板。2. The three-dimensional molded circuit board according to claim 1, wherein the adhesive layer has a thickness of 10 to 50 μm.
を接着層により固着されたＰＰＳフィルムからなる所定
の大きさの回路フイルムを射出成形金型の中に位置決め
挿入する工程と、 上記射出成形金型の金型温度を９０〜１６０℃及びＰＰ
Ｓ樹脂の樹脂射出温度２８０〜３６０℃の条件下で、上
記ＰＰＳ樹脂を射出して上記回路フィルムと溶着一体化
してＰＰＳ樹脂成形体を形成する工程と、を含むことを
特徴とする請求項１に記載の立体成形回路基板の製造方
法。3. A step of positioning and inserting a circuit film of a predetermined size made of a PPS film, in which a conductive foil processed into a predetermined circuit pattern is fixed by an adhesive layer, into a mold for injection molding, and the injection molding. Mold temperature is 90 ~ 160 ℃ and PP
The step of injecting the PPS resin under the conditions of a resin injection temperature of 280 to 360 ° C. of the S resin to fuse and integrate with the circuit film to form a PPS resin molded body. A method for manufacturing a three-dimensional molded circuit board according to.
たフィルムストッカーに複数枚保持し、該フィルムスト
ッカーから逐次供給することを特徴とする請求項３に記
載の立体成形回路基板の製造方法。4. The method for producing a three-dimensional molded circuit board according to claim 3, wherein a plurality of the circuit films are held in a film stocker having a positioning means, and are sequentially supplied from the film stocker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26449793A JPH07122825A (en) | 1993-10-22 | 1993-10-22 | Solid molded circuit substrate and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26449793A JPH07122825A (en) | 1993-10-22 | 1993-10-22 | Solid molded circuit substrate and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07122825A true JPH07122825A (en) | 1995-05-12 |
Family
ID=17404065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26449793A Pending JPH07122825A (en) | 1993-10-22 | 1993-10-22 | Solid molded circuit substrate and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07122825A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005096683A1 (en) * | 2004-03-31 | 2008-02-21 | 三菱電線工業株式会社 | Circuit board, manufacturing method thereof, and joint box using circuit board |
| WO2022030220A1 (en) * | 2020-08-03 | 2022-02-10 | Ｎｉｓｓｈａ株式会社 | Conductive circuit sheet-integrated molded article and method for producing same |
| KR20230054045A (en) * | 2021-10-15 | 2023-04-24 | 주식회사 엔에스테바 | Dielectric layer material for flexible copper clad laminate and manufacturing method thereof |
-
1993
- 1993-10-22 JP JP26449793A patent/JPH07122825A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005096683A1 (en) * | 2004-03-31 | 2008-02-21 | 三菱電線工業株式会社 | Circuit board, manufacturing method thereof, and joint box using circuit board |
| WO2022030220A1 (en) * | 2020-08-03 | 2022-02-10 | Ｎｉｓｓｈａ株式会社 | Conductive circuit sheet-integrated molded article and method for producing same |
| JP2022028547A (en) * | 2020-08-03 | 2022-02-16 | Ｎｉｓｓｈａ株式会社 | Conductive circuit sheet integrated molded product and manufacturing method of the same |
| KR20230054045A (en) * | 2021-10-15 | 2023-04-24 | 주식회사 엔에스테바 | Dielectric layer material for flexible copper clad laminate and manufacturing method thereof |
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