JPH054836B2 - - Google Patents
Info
- Publication number
- JPH054836B2 JPH054836B2 JP25222887A JP25222887A JPH054836B2 JP H054836 B2 JPH054836 B2 JP H054836B2 JP 25222887 A JP25222887 A JP 25222887A JP 25222887 A JP25222887 A JP 25222887A JP H054836 B2 JPH054836 B2 JP H054836B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- film
- substrate
- cavity
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 description 15
- 238000000465 moulding Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920006269 PPS film Polymers 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229920013655 poly(bisphenol-A sulfone) Polymers 0.000 description 1
- 229920003208 poly(ethylene sulfide) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明はプリント回路基板の製造方法に関
し、特には両面側に回路パターンを有する回路基
板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a printed circuit board, and particularly to a method of manufacturing a circuit board having circuit patterns on both sides.
（従来の技術）
従来のプリント回路基板の製造方法としては、
例えば銅板と基板材をホツトプレスで積層した後
この同板面をエツチングによつて回路パターンに
加工する方法や、あるいは基板材に導電性インク
をスクリーン印刷したり無電解メツキによつて回
路パターンを形成する方法が多用されている。(Conventional technology) The conventional method for manufacturing printed circuit boards is as follows:
For example, after laminating a copper plate and a substrate material by hot pressing, the surface of the same plate is processed into a circuit pattern by etching, or a circuit pattern is formed by screen printing conductive ink on the substrate material or by electroless plating. There are many methods used.
近年、基板の素材として、従来のガラスエポキ
シ等に代つて、耐熱性および電気特製に優れたポ
リサルフオン、ポリエーテルサルフオン、ポリエ
ーテルイミド等の熱可塑性樹脂が出現し、この熱
可塑性樹脂によつて基板本体を射出成形する試み
が行なわれている。この射出成形による基板本体
の成形にあつては、該素材樹脂が有する耐熱性お
よび誘電率、誘電正接等の電気特性の向上に加え
て、基板形状、透孔および取付部等の付加形状を
一体に成形でき、従来のような爾後の切削やプレ
ス等の後加工が不要になるという大きな利点を有
している。この射出成形によつて得られた基板本
体は前述した印刷またはメツキ等の手段によつて
その表面に回路パターンが形成される。 In recent years, thermoplastic resins such as polysulfon, polyethersulfon, and polyetherimide, which have excellent heat resistance and electrical properties, have appeared as materials for substrates, replacing conventional glass epoxy. Attempts have been made to injection mold the substrate body. When molding the board body by injection molding, in addition to improving the heat resistance, dielectric constant, dielectric loss tangent, and other electrical properties of the resin material, the board shape, through holes, mounting parts, and other additional shapes are integrated. It has the great advantage of eliminating the need for post-processing such as cutting and pressing as required in the past. A circuit pattern is formed on the surface of the substrate main body obtained by this injection molding by the above-described printing, plating, or other means.
（発明が解決しようとする問題点）
この発明は、上述の従来技術を背景として、基
板の射出成形時に、回路部も一体に成形するこ
と、さらに詳しく言えば基板の両面側に回路部を
一体に成形したプリント回路基板の製法を提案す
るものである。(Problems to be Solved by the Invention) Based on the background of the above-mentioned prior art, the present invention aims at integrally molding the circuit parts during injection molding of the board, and more specifically, by integrally molding the circuit parts on both sides of the board. This paper proposes a manufacturing method for printed circuit boards molded into
すなわち、上述した従来技術にあつては、基板
の射出成形後に、回路部の形成工程を必要とする
のであるが、この発明では、基板の射出成形と同
時に当該基板の両面に回路部を形成するこによつ
て、この種のプリント回路基板の製造工程を飛躍
的に簡略化し、かつ効率化しようとするものであ
る。 That is, in the above-mentioned conventional technology, a step of forming the circuit part is required after the injection molding of the board, but in the present invention, the circuit part is formed on both sides of the board at the same time as the injection molding of the board. This is intended to dramatically simplify and improve the efficiency of the manufacturing process for this type of printed circuit board.
（問題点を解決するための手段）
すなわち、この発明のプリント回路基板の製法
は、基板形状のキヤビテイを規定する固定型と可
動型とを含み、前記固定型の型面には、合成樹脂
のベースフイルム表面にプリント回路を構成する
電導体よりなる回路パターンが形成されかつ溶融
樹脂注入のための透孔を有する固定型側回路フイ
ルムを、他方の可動型の型面には、合成樹脂のベ
ースフイルム表面にプリント回路を構成する電導
体よりなる回路パターンが形成された可動型側回
路フイルムを、それぞれ前記ベースフイルムがキ
ヤビテイ内側となるように配置し、しかる後型締
めし、前記固定型側回路フイルムの透孔を介して
基板を構成する溶融樹脂を前記キヤビテイ内に注
入し、前記固定型側回路フイルムおよび可動型側
回路フイルムの各ベースフイルムと当該溶融樹脂
とを一体に接合しつつ基板形状を成形し、もつて
両面側に回路パターンを有する基板を得ることを
特徴とするプリント回路基板の製造方法に係る。(Means for Solving the Problems) That is, the method for manufacturing a printed circuit board of the present invention includes a fixed mold and a movable mold that define a cavity in the shape of the board, and the mold surface of the fixed mold is coated with synthetic resin. A fixed mold side circuit film is formed with a circuit pattern made of conductors constituting a printed circuit on the surface of the base film and has a through hole for injecting molten resin, and a synthetic resin base is placed on the other movable mold surface. A movable mold side circuit film, on which a circuit pattern made of conductors constituting a printed circuit is formed on the film surface, is arranged so that the base film is on the inside of the cavity, and then the mold is clamped, and the fixed mold side circuit is The molten resin constituting the substrate is injected into the cavity through the through holes in the film, and the base films of the fixed type side circuit film and the movable type side circuit film are joined together with the molten resin while forming the substrate shape. The present invention relates to a method of manufacturing a printed circuit board, which is characterized by forming a printed circuit board, thereby obtaining a board having a circuit pattern on both sides.
（作用）
この発明では、あらかじめ合成樹脂のベースフ
イルムにプリント回路を構成する電導体よりなる
回路パターンが形成されかつ溶融樹脂注入のため
の透孔を有する固定型側回路フイルムおよび同じ
く合成樹脂のベースフイルムにプリント回路を構
成する電導体よりなる回路パターンが形成された
可動型側回路フイルムが用意される。そして、基
板の射出成形時に、固定型側回路フイルムをキヤ
ビテイの固定側型面に、また可動型側回路フイル
ムを同じくキヤビテイの可動型の型面にそれらの
ベースフイルム面がキヤビテイ側となるように配
する。そして型締め後、基板を構成する溶融樹脂
を該キヤビテイ内に注入する。キヤビテイ内に注
入された溶融樹脂は前記各回路フイルムのベース
フイルムと一体に接合しつつ基板形状に賦形さ
れ、表裏面に所定の回路パターンを有するプリン
ト基板が得られる。(Function) In this invention, a circuit pattern made of conductors constituting a printed circuit is formed in advance on a base film made of synthetic resin, and a fixed side circuit film having a through hole for injecting molten resin and a base film made of synthetic resin as well. A movable type side circuit film is prepared, in which a circuit pattern made of conductors constituting a printed circuit is formed on the film. Then, during injection molding of the board, the circuit film on the fixed mold side is placed on the fixed mold side of the cavity, and the circuit film on the movable mold side is placed on the mold side of the movable mold in the same cavity, so that the base film surface is on the cavity side. Allocate. After the mold is clamped, molten resin constituting the substrate is injected into the cavity. The molten resin injected into the cavity is shaped into a substrate while being integrally bonded to the base film of each of the circuit films, thereby obtaining a printed circuit board having a predetermined circuit pattern on its front and back surfaces.
なお、ベースフイルムが基板を構成する樹脂と
同種かまたは相溶性のある樹脂からなる場合に
は、両者の接合は融合状態となつて極めて強固と
なる。 Note that when the base film is made of the same type of resin or a resin that is compatible with the resin constituting the substrate, the bond between the two becomes fused and becomes extremely strong.
（実施例） 以下添付の図面に従つて実施例を説明する。(Example) Embodiments will be described below with reference to the accompanying drawings.
添付の図面の第１図はこの発明方法を実施する
射出成形装置の一例を示す要部の断面図、第２図
は回路フイルムの一例を示す一部拡大断面図、第
３図は同じく回路フイルムの他の例を示す一部拡
大断面図、第４図は成形前の状態を示す金型の一
部拡大断面図、第５図はその成形時の一部拡大断
面図、第６図はこの発明によつて得られたプリン
ト回路基板の部分拡大断面図である。 FIG. 1 of the accompanying drawings is a cross-sectional view of essential parts showing an example of an injection molding apparatus for carrying out the method of the present invention, FIG. 2 is a partially enlarged cross-sectional view showing an example of a circuit film, and FIG. 3 is a similar circuit film. Fig. 4 is a partially enlarged sectional view of the mold showing the state before molding, Fig. 5 is a partially enlarged sectional view of the mold during molding, and Fig. 6 is a partially enlarged sectional view showing another example of FIG. 2 is a partially enlarged sectional view of a printed circuit board obtained according to the invention.
第１図にはこの発明方法を実施する射出成形装
置が示される。 FIG. 1 shows an injection molding apparatus for carrying out the method of the invention.
基板形状を規定するキヤビテイ１０は、固定型
１１、可動型１５および中間型２０とによつて生
成される。固定型１１および可動型１５のキヤビ
テイプレート１２および１６の表面は、通常平面
（または必要に応じて曲面）の板面状に形成され
る。中間型２０のキヤビテイ面２１は基板の厚み
を規定する。なお、取付部等の基板の機能的帰依
状部は必要に応じて適宜形成されることはいうま
でもない。図中の符号２５は中間型２０のための
ガイドピンである。 A cavity 10 that defines the shape of the substrate is produced by a fixed mold 11, a movable mold 15, and an intermediate mold 20. The surfaces of the cavity plates 12 and 16 of the fixed mold 11 and the movable mold 15 are generally formed into flat (or curved, if necessary) plate shapes. The cavity surface 21 of the intermediate mold 20 defines the thickness of the substrate. It goes without saying that the functional dependent portions of the substrate, such as the mounting portions, may be formed as necessary. Reference numeral 25 in the figure is a guide pin for the intermediate mold 20.
まず、固定型１１側につてい説明すると、第１
図に示したように、固定盤１３に取付けられた固
定型１１のキヤビテイプレート１２表面には、基
板表面側回路部を構成する回路パターン３１がベ
ースフイルム３２表面に形成された固定型側回路
フイルム３０が配される。回路フイルム３０はそ
のベースフイルム３２がキヤビテイ１０内側とな
るよう配置される。 First, to explain the fixed mold 11 side, the first
As shown in the figure, on the surface of the cavity plate 12 of the fixed mold 11 attached to the fixed platen 13, a circuit pattern 31 constituting the circuit section on the front surface side of the board is formed on the surface of the base film 32. A film 30 is placed. The circuit film 30 is arranged so that its base film 32 is inside the cavity 10.
また、表面側回路フイルム３０には、基板の射
出成形時に、該フイルム３０がスプルー孔２５を
塞ぐことなく、射出ノズルＩからの溶解樹脂がキ
ヤビテイ１０へ注入されることができるように、
該回路フイルム３０のスプルー孔２５に対応する
位置に該孔と同じかわずかに大きい大きさを有す
る透孔部３５が形成されている。 Further, the front side circuit film 30 is provided with so that melted resin from the injection nozzle I can be injected into the cavity 10 without the film 30 blocking the sprue hole 25 during injection molding of the substrate.
A through hole portion 35 having the same size or slightly larger than the sprue hole 25 is formed in the circuit film 30 at a position corresponding to the sprue hole 25.
図の符号２５はスプルー孔、２６はスプルーブ
ツシユ、３８は表面側回路フイルム３０の送りロ
ーラ３９は巻取ローラ、Ｉは射出成形機の加熱筒
先端の射出ノズル部を表わす。 Reference numeral 25 in the figure represents a sprue hole, 26 a sprue bush, 38 a take-up roller 39 for feeding the front side circuit film 30, and I an injection nozzle at the tip of a heating cylinder of an injection molding machine.
一方、可動盤１７に取付けられた可動型１５の
キヤビテイプレート１６表面には、基板裏面の回
路部を構成擦る回路パターン４１がベースフイル
ム４２表面に形成された可動型側回路フイルム４
０が配される。この可動型側回路フイルム４０
も、前記した固定型側回路フイルム３０と同様
に、そのベースフイルム４２がキヤビテイ１０内
側となるように配置される。図の符号３８は該回
路フイルム４０の送りローラ、４９は巻取りロー
ラである。 On the other hand, on the surface of the cavity plate 16 of the movable mold 15 attached to the movable platen 17, a circuit film 4 on the movable mold side is formed on the surface of the base film 42, and a circuit pattern 41 that constitutes the circuit section on the back side of the board is formed.
0 is assigned. This movable side circuit film 40
Similarly to the fixed type side circuit film 30 described above, the base film 42 is placed inside the cavity 10. The reference numeral 38 in the figure is a feed roller for the circuit film 40, and the reference numeral 49 is a take-up roller.
中間型２０は、この発明においては、キヤビテ
イ１０の基板両面側位置に回路フイルム３０およ
び４０を配する必要から設けられたものである。
符号２９は連結ロツドを表わす。 In the present invention, the intermediate mold 20 is provided because it is necessary to arrange the circuit films 30 and 40 on both sides of the substrate of the cavity 10.
Reference numeral 29 represents a connecting rod.
この発明において使用される回路フイルム３０
または４０は、第２図または第３図に図示したよ
うに、合成樹脂のベースフイルム３２，４２の表
面にプリント回路を構成する銅箔等の伝導体より
なる回路パターン３１，４１を形成したものであ
る。第２図は蒸着またはメツキ法によつて回路パ
ターン３１，４１を形成したもので、同図の符号
３３，４３は表面に残つたマスキング部、３４，
４４は接着材層である。これらのマスキング部３
３，４３および接着材層３４，４４は基板成形時
の熱によつて溶融する。また、第３図の回路フイ
ルム３０，４０はキヤリアフイルム３２（４２）
の上面への印刷によつて直接回路パターン３１，
４１を形成したものである。 Circuit film 30 used in this invention
Or 40, as shown in FIG. 2 or 3, has circuit patterns 31, 41 made of a conductor such as copper foil forming a printed circuit formed on the surface of base films 32, 42 made of synthetic resin. It is. In FIG. 2, circuit patterns 31 and 41 are formed by vapor deposition or plating method.
44 is an adhesive layer. These masking parts 3
3, 43 and adhesive layers 34, 44 are melted by heat during substrate molding. In addition, the circuit films 30 and 40 in FIG. 3 are carrier films 32 (42).
directly by printing on the top surface of the circuit pattern 31,
41 was formed.
第４図および第５図には成形時における金型キ
ヤビテイの一部拡大断面図が示される。第４図に
図示したように、各回路フイルム３０，４０はそ
れらのベースフイルム３２，４２面がキヤビテイ
側となるように基板キヤビテイ１０内となるよう
に配置され、そして、第５図のように、固定型１
１のスプルー孔２５および表面側回路フイルム３
０の透孔部３５を介してキヤビテイ１０内に基板
を構成する溶解樹脂Ｐが注入される。 4 and 5 are partially enlarged sectional views of the mold cavity during molding. As shown in FIG. 4, the circuit films 30 and 40 are arranged in the substrate cavity 10 with their base films 32 and 42 facing the cavity side, and as shown in FIG. , fixed type 1
1 sprue hole 25 and front side circuit film 3
The molten resin P constituting the substrate is injected into the cavity 10 through the through hole 35 .
成形に際して溶融樹脂がキヤビテイ内に注入さ
れると、第５図のように、該基板樹脂Ｐは注入の
圧力によつて各回路フイルム３０，４０のベース
フイルム３２，４２を背面から押圧して表面の各
回路パターン３１，４１を各キヤビテイプレート
１２，１６に密に押し付け基板表面を面一な表面
としつつ、各ベースフイルム３２，４２と一体に
接合する。 When molten resin is injected into the cavity during molding, as shown in FIG. The respective circuit patterns 31 and 41 are tightly pressed against the respective cavity plates 12 and 16 to make the substrate surfaces flush with each other and integrally joined to the respective base films 32 and 42.
このように、基板を構成する溶融樹脂Ｐはキヤ
ビテイ内において各回路フイルム３０，４０のベ
ースフイルム３２，４２と一体に接合して基板と
回路フイルムとの強固な一体接合が得られる。な
お、前述したように、基板樹脂Ｐとベースフイル
ム３２との付着性を高めるなめに接着剤を介在さ
せてもよい。 In this manner, the molten resin P constituting the substrate is integrally bonded to the base films 32, 42 of each circuit film 30, 40 within the cavity, resulting in a strong integral bond between the substrate and the circuit film. Note that, as described above, an adhesive may be used to increase the adhesion between the substrate resin P and the base film 32.
さらに、最も好ましい例としては、ベースフイ
ルム３２を基板樹脂Ｐと同種かまたは相溶性のあ
る樹脂によつて構成することである。一般にこの
種基板の射出成形用樹脂としては、耐熱性プラス
チツクとして、PPS、PEI、PES、PSF等が用い
られ、汎用プラスチツクとしては、ABS、
PMMA、ポリカーボネイト等が使用されるが、
可能な限りベースフイルム３２，４２には基板樹
脂と同種のものを選択するのが望ましい。なお、
実施例では、基板樹脂としてPPS、ベースフイル
ムにPPSフイルムを使用したいが、この場合には
接合部が判別不能なほど両者は融合溶着し一体的
結合を得ることができた。さらに、ベースフイル
ムとしてPETは各種の基板樹脂と相溶性が良く
好ましい材料である。 Furthermore, the most preferable example is that the base film 32 is made of the same type of resin as the substrate resin P or a resin that is compatible with the resin P. Heat-resistant plastics such as PPS, PEI, PES, and PSF are generally used as resins for injection molding of this type of substrate, and general-purpose plastics include ABS,
PMMA, polycarbonate, etc. are used, but
It is desirable to select the same type of resin for the base films 32 and 42 as the substrate resin as much as possible. In addition,
In the example, it is desired to use PPS as the substrate resin and a PPS film as the base film, but in this case, the two were fused and welded to such an extent that the joint was indistinguishable, and an integral bond could be obtained. Furthermore, PET is a preferable material for the base film because it has good compatibility with various substrate resins.
実施例には図示しないが、基板の成形と同時に
端子ピンを立設することも可能である。この場合
にはあらかじめいずれかのキヤビテイプレートに
所定の端子ピンをインサートしてセツトし成形が
なされる。 Although not shown in the embodiment, it is also possible to erect the terminal pins at the same time as molding the substrate. In this case, predetermined terminal pins are inserted into one of the cavity plates in advance and set, and molding is performed.
（効果）
第６図はこの発明によつて得られたプリント回
路基板の一部拡大断面図を示すものであるが、図
のように、この発明にあつては各回路フイルム３
０，４０のベースフイルム３２，４２と基板樹脂
Ｐとがその接合部において融合しつつ結合される
ものであるから一体かつ強固な接合が得られる。
また、同図から理解できるように、各回路フイル
ム３０，４０のベースフイルム３２，４２は基板
の射出成形時に回路パターン３１，４１を包むよ
うにして基板表面と面一に成形されるので、当該
回路パターン３１，４１は基板表面にしつかりと
包着され固定される。さらに、回路パターン３
１，４１は基板表面と面一に形成されるので摺動
部分でも磨耗や剥離のおそれなく使用できる。(Effects) FIG. 6 shows a partially enlarged sectional view of the printed circuit board obtained by the present invention, and as shown in the figure, in the present invention, each circuit film 3
Since the base films 32 and 42 of 0.0 and 40 and the substrate resin P are bonded while being fused at the bonded portion, an integral and strong bond can be obtained.
Further, as can be understood from the figure, the base films 32 and 42 of each circuit film 30 and 40 are molded flush with the surface of the circuit board so as to wrap around the circuit patterns 31 and 41 during injection molding of the circuit board, so that the circuit patterns 31 and 41 are tightly wrapped and fixed on the surface of the substrate. Furthermore, circuit pattern 3
Since 1 and 41 are formed flush with the substrate surface, they can be used without fear of abrasion or peeling even on sliding parts.
従来のプリント回路基板では、通常基板表面に
プリント回路が突出して形成されるので、プリン
ト回路の接合性が低く、また他物との接触しよつ
て該回路が損傷を受けたり、剥落したりするおそ
れがあり、摺動部または他物との接触部に使用す
ることはむずかしい。 In conventional printed circuit boards, the printed circuits are usually formed protruding from the surface of the board, so the bonding of the printed circuits is poor, and the circuits may be damaged or peeled off if they come into contact with other objects. Therefore, it is difficult to use it for sliding parts or parts that come into contact with other objects.
この発明によれば、このほかに、ベースフイル
ムは成形時に基板樹脂と一体に接合されるので、
耐熱性あるいは強度のある樹脂であることを必要
とせず経済的であり、また基板の射出成形に際し
ても型温度や樹脂温度を低く押えるなどといつた
特別な制限をすることなく実施でき、成形上大き
なメリツトを亨有することができる。 According to this invention, in addition to this, since the base film is integrally joined to the substrate resin during molding,
It is economical because it does not require heat-resistant or strong resin, and it can be carried out without special restrictions such as keeping the mold temperature or resin temperature low during injection molding of the substrate, making it easy to mold. It can have great advantages.
このように、この発明によれば、基板の射出成
形と同時にかつ一体に牙の表裏面に回路部を形成
することができこの種プリント回路基板の製造工
程を飛躍的に簡略化しかつ効率化することができ
るものである。 As described above, according to the present invention, the circuit parts can be formed on the front and back surfaces of the fang simultaneously and integrally with the injection molding of the board, dramatically simplifying and increasing the efficiency of the manufacturing process of this type of printed circuit board. It is something that can be done.
第１図はこの発明方法を実施する射出成形装置
の一例を示す要部の断面図、第２図は回路フイル
ムの一例を示す一部拡大断面図、第３図は同じく
回路フイルムの他の例を示す一部拡大断面図、第
４図は成形前の状態を示す金型の一部拡大断面
図、第５図はその成形時の一部拡大断面図、第６
図はこの発明によつて得られたプリント回路基板
の部分拡大断面図である。
１０……基板キヤビテイ、１１……固定型、１
５……可動型、１２，１６……キヤビテイプレー
ト、３０……固定型側回路フイルム、３１……回
路パターン、３２……ベースフイルム、４０……
可動型回路フイルム、４１……回路パターン、４
２……ベースフイルム、Ｐ……基板樹脂。
FIG. 1 is a cross-sectional view of essential parts showing an example of an injection molding apparatus for carrying out the method of the present invention, FIG. 2 is a partially enlarged cross-sectional view showing an example of a circuit film, and FIG. 3 is another example of a circuit film. FIG. 4 is a partially enlarged sectional view of the mold showing the state before molding, FIG. 5 is a partially enlarged sectional view of the mold during molding, and FIG.
The figure is a partially enlarged sectional view of a printed circuit board obtained by the present invention. 10... Board cavity, 11... Fixed type, 1
5... Movable type, 12, 16... Cavity plate, 30... Fixed type side circuit film, 31... Circuit pattern, 32... Base film, 40...
Movable circuit film, 41...Circuit pattern, 4
2...Base film, P...Substrate resin.
Claims (1)
動型とを含み、前記固定型の型面には、合成樹脂
のベースフイルム表面にプリント回路を構成する
電導体よりなる回路パターンが形成されかつ溶融
樹脂注入のための透孔を有する固定型側回路フイ
ルムを、他方の可動型の型面には、合成樹脂のベ
ースフイルム表面にプリント回路を構成する電導
体よりなる回路パターンが形成された可動型側回
路フイルムを、それぞれ前記ベースフイルムがキ
ヤビテイ内側となるように配置し、しかる後型締
めし、前記固定型側回路フイルムの透孔を介して
基板を構成する溶融樹脂を前記キヤビテイ内に注
入し、前記固定型側回路フイルムおよび可動型側
回路フイルムの各ベースフイルムと当該溶融樹脂
とを一体に接合しつつ基板形状を成形し、もつて
両面側に回路パターンを有する基板を得ることを
特徴とするプリント回路基板の製造方法。 ２ ベースフイルムが基板を構成する樹脂と同種
かまたは互いに相溶性のある樹脂からなる特許請
求の範囲第１項記載のプリント回路基板の製造方
法。[Scope of Claims] 1. Includes a fixed mold and a movable mold that define a cavity in the shape of a board, and the mold surface of the fixed mold has a circuit pattern made of a conductor constituting a printed circuit on the surface of a synthetic resin base film. A fixed mold side circuit film is formed and has a through hole for injecting molten resin, and the other movable mold surface has a circuit pattern made of conductors constituting a printed circuit on the surface of a synthetic resin base film. The formed movable mold side circuit films are arranged so that the base film is on the inside of the cavity, and then the molds are clamped, and the molten resin constituting the substrate is poured into the fixed mold side circuit film through the through holes of the fixed mold side circuit film. The molten resin is injected into the cavity, and the base films of the fixed-type side circuit film and the movable-type side circuit film are integrally joined with the molten resin to form a substrate shape, thereby forming a substrate having circuit patterns on both sides. A method of manufacturing a printed circuit board, characterized in that: 2. The method of manufacturing a printed circuit board according to claim 1, wherein the base film is made of a resin that is the same as or compatible with the resin constituting the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25222887A JPH0194691A (en) | 1987-10-06 | 1987-10-06 | Printed circuit board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25222887A JPH0194691A (en) | 1987-10-06 | 1987-10-06 | Printed circuit board and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0194691A JPH0194691A (en) | 1989-04-13 |
| JPH054836B2 true JPH054836B2 (en) | 1993-01-20 |
Family
ID=17234298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25222887A Granted JPH0194691A (en) | 1987-10-06 | 1987-10-06 | Printed circuit board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0194691A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105583B2 (en) * | 1990-11-30 | 1995-11-13 | 日東紡績株式会社 | Printed wiring body |
| JPH11307884A (en) * | 1998-04-22 | 1999-11-05 | Shin Etsu Polymer Co Ltd | Integrated printed wiring board mold |
| JP4577715B2 (en) * | 2005-01-05 | 2010-11-10 | 株式会社神戸製鋼所 | Method for manufacturing porous dielectric substrate having pattern electrode |
-
1987
- 1987-10-06 JP JP25222887A patent/JPH0194691A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0194691A (en) | 1989-04-13 |
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