JPH0688293A - High-speed homogeneous plating device for electronic parts or the like - Google Patents
High-speed homogeneous plating device for electronic parts or the likeInfo
- Publication number
- JPH0688293A JPH0688293A JP23735992A JP23735992A JPH0688293A JP H0688293 A JPH0688293 A JP H0688293A JP 23735992 A JP23735992 A JP 23735992A JP 23735992 A JP23735992 A JP 23735992A JP H0688293 A JPH0688293 A JP H0688293A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- jig
- cathode current
- hanger
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、短尺のＩＣ等リード
フレーム等の電子部品等に半田メッキ、錫メッキ、イン
ジウムメッキ等のメッキを高速対応、しかも均質、良好
にメッキする装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for high-speed, uniform and excellent plating of solder plating, tin plating, indium plating, etc. on electronic parts such as lead frames of short ICs and the like.
【０００２】[0002]
【従来の技術】従来、ＩＣ等のリードフレームに半田メ
ッキ、錫メッキ、その他のメッキを施行する装置として
特公昭63−14079 号公報に記載されたものが知られてい
る。この技術は一方向が開口状になっているバスケット
(カゴ) の底面に陰極電流接点部を配置したメッキ用の
治具を使用して、これは例えば被メッキ体として短尺リ
ードフレームを入れ、メッキ液中で該リードフレームが
落ちないように水平状態を維持し、アンロード位置で開
口部側を下にすることでメッキの施されたリードフレー
ムを落下させるようにして取り出すものである。2. Description of the Related Art Conventionally, a device disclosed in Japanese Patent Publication No. 63-14079 is known as a device for performing solder plating, tin plating, and other plating on a lead frame such as an IC. This technology is a basket with an opening in one direction.
Using a jig for plating with the cathode current contact part on the bottom of the (basket), for example, put a short lead frame as the object to be plated and keep it horizontal so that the lead frame does not fall in the plating solution. Is maintained and the opening side is turned down at the unloading position so that the plated lead frame is dropped and taken out.
【０００３】したがって、この技術はあたかもカゴメッ
キと同じようにリードフレームを無造作にロード位置で
投入することができ、アンロードでは自然落下により取
り出すことの出来る合理的なメッキ方法である。Therefore, this technique is a rational plating method in which the lead frame can be randomly inserted at the load position as if it was basket plating, and can be taken out by natural fall during unloading.
【０００４】[0004]
【発明が解決しようとする課題】ところが、上記装置
は、メッキ用治具を首振り状態に循環搬送装置に取り付
けているため陽極の配列がメッキ槽の底面部になり、メ
ッキ厚さの極めて大きなバラツキを発生させた。特にメ
ッキ時間を短縮するために電解電流密度を上げると、バ
ラツキが更に大きくなると共に一部にはメッキ金属組織
の異常部が生じ不適当であった。また、カゴメッキと同
一の技術思想による品物の自重と底面陰極電流接点部に
よりメッキしているが、被メッキ体のリードフレームが
装置の振動等により浮き上がることが多く、その結果電
流の断続が生じ品質の低下が多く実用には致命的な欠陥
があった。However, in the above apparatus, since the plating jig is attached to the circulating and conveying apparatus in a swinging state, the arrangement of the anode is the bottom of the plating tank, and the plating thickness is extremely large. There was variation. In particular, when the electrolytic current density was increased to shorten the plating time, the variation was further increased, and an abnormal portion of the plated metal structure was generated in part, which was inappropriate. In addition, although the product's own weight and the bottom cathode current contact part are plated according to the same technical idea as the basket plating, the lead frame of the object to be plated often floats up due to vibration of the device, etc., resulting in intermittent current flow and quality. However, there was a fatal defect in practical use.
【０００５】そこで、本発明者は、上記公報に記載され
たメッキ用治具を作成して、該公報に開示されているよ
うにメッキ液中で水平にして、2A/dm2、10min の条件に
て半田メッキを試みた。この結果、特に開口部があるこ
とと陽極が下部にあることが原因して、平均のメッキ厚
は 5ミクロンを得たが、該リードフレーム一枚のなかで
は治具開口部側で32ミクロン、中央部で 2ミクロン、支
持腕側で 5ミクロンという大きなバラツキが生じた。更
に、多少の予測はしていたがこの治具は先端にアンロー
ド用の開口部があるため、治具の製作精度が悪かった
り、循環搬送装置の精度が悪いと、工程中で品物が落
下、又は飛び出し、その結果通電が不安定となり密着不
良等をはじめとする不良の発生が多かった。Therefore, the present inventor created the plating jig described in the above publication and made it horizontal in the plating solution as disclosed in this publication under the conditions of 2 A / dm 2 and 10 min. I tried solder plating. As a result, the average plating thickness was 5 microns, especially because of the presence of the opening and the anode at the bottom, but 32 microns on the jig opening side in one of the lead frames, There was a large variation of 2 microns in the center and 5 microns on the support arm side. Furthermore, although some prediction was made, this jig has an opening for unloading at the tip, so if the manufacturing accuracy of the jig is poor or the accuracy of the circulation transfer device is poor, the product will drop during the process. Or, it popped out, and as a result, the energization became unstable, and many defects such as poor adhesion occurred.
【０００６】さらに、以上のことは10、20、50、100/dm
2 等の高速メッキ (高電流密度作業) においてはさらに
上記の不適性を助長する。即ち、一部が開口した不安定
なカゴメッキであるため品物の保持の状態が安定せず、
特に高電流を通電すると、少ない接触面積であることか
ら、極端にはスパークが観察されるほどで、メッキの厚
さバラツキを始め分極による異常析出等の各種の不具合
が発生した。また、陰極電流の治具への供給方法につい
て特別な配慮がないため、システム上の電気抵抗が高く
電流密度の偏りが発生して、均質なメッキおよび高速対
応等の必要性能が得られないことが分かった。Further, the above is 10, 20, 50, 100 / dm
In high-speed plating of 2nd grade (high current density work), the above inadequacy is further promoted. In other words, because of unstable basket plating with some openings, the state of holding the product is not stable,
In particular, when a high current is applied, the contact area is small, so that sparks are extremely observed, and various problems such as variation in plating thickness and abnormal precipitation due to polarization occur. In addition, since there is no special consideration regarding the method of supplying the cathode current to the jig, the electrical resistance on the system is high and the current density is biased, so that the required performance such as uniform plating and high-speed response cannot be obtained. I understood.
【０００７】以上のように、従来の短尺リードフレーム
のメッキ方法には重大な問題点があり、かつこのような
状況であるため、業界の要望する高速メッキ対応、高品
質メッキの開発は待たれていた。本発明は上記に鑑み、
メッキ用治具に取り付けられ被メッキ体が、メッキ槽中
において該治具に多少の振動が生じても電流の流れを確
保して品質良好なメッキを得ることを第１の目的とし、
また、本発明はメッキ用治具のメッキ液くみ出し、くみ
こみを減少させ、メッキ液の破壊、水洗水等の汚れ等を
防止することにより均質良好なメッキを得ることを第２
の目的とし、更に、本発明は、ライン抵抗が低く安定し
て長期間のランニングが可能で、しかも高い電流を低い
電圧で通電でき、均質な良好なメッキを得ることを第３
の目的とする。As described above, the conventional plating method for a short lead frame has serious problems, and in such a situation, the development of high-quality plating and high-speed plating required by the industry is awaited. Was there. In view of the above, the present invention is
A first object is to obtain a good-quality plating by ensuring a current flow even if the object to be plated attached to the plating jig has some vibration in the jig in the plating tank.
In addition, the present invention aims to obtain a uniform and good plating by reducing the pumping out of the plating solution from the plating jig, reducing the pumping-in, and preventing the plating solution from breaking down and dirt such as washing water.
The third object of the present invention is to obtain a stable and good plating, which has a low line resistance, can be stably run for a long period of time, can pass a high current at a low voltage.
The purpose of.
【０００８】[0008]
【課題を解決するための手段】本発明は、上記目的を達
成するため、次の技術的手段を講じた。請求項１に記載
の発明は、電子部品等の高速対応均質メッキ装置とし
て、自重による陰極電流接点部を治具底面に配置し、他
の部分は被メッキ体を保持するための電気絶縁体で構成
した保持体とでなるバスケット形メッキ用治具を使用す
るメッキ装置において、前記被メッキ体上部を押圧する
ための押え部材をメッキ用治具に配置し、陽極電極を被
メッキ体正面部に対面配置したことを特徴とする点にあ
り、このさい請求項２のように押え部材を逆Ｖ字形に形
成としても良い。The present invention takes the following technical means in order to achieve the above object. The invention according to claim 1 is, as a high-speed homogenous plating apparatus for electronic parts or the like, a cathode current contact portion due to its own weight is arranged on the bottom surface of the jig, and the other portion is an electrical insulator for holding the object to be plated. In a plating device using a basket-type plating jig composed of a holding body, a holding member for pressing the upper part of the object to be plated is arranged on the jig for plating, and an anode electrode is provided on the front part of the object to be plated. It is characterized in that they are arranged facing each other. In this case, the pressing member may be formed in an inverted V shape.
【０００９】請求項３の発明は、請求項１，請求項２に
おいて、バスケット形メッキ用治具を保持するハンガー
をメッキ装置の全部又は一部の空間において、ハンガー
移動方向の一端を傾斜させる液切り傾斜手段を設けたこ
とを特徴とする点にあり、請求項４の発明は、請求項１
〜３において、一端を傾斜させる液切り傾斜機構によ
り、上部空間にハンガーに保持されたメッキ用治具が位
置したとき、傾斜高部側よりシャワー水洗水を噴射する
噴射手段を設けたことを特徴とする点にあり、請求項５
の発明は、請求項１〜４において、ハンガーに取り付け
られた陰極電流導入部とメッキ槽に取り付けられた陰極
電流送電部の接触部が、水中接触するように、陰極電流
送電部をメッキ槽の一部に配置したことを特徴とするも
のである。According to a third aspect of the present invention, in the first and second aspects, the hanger for holding the basket-type plating jig is a liquid for inclining one end of the hanger moving direction in all or a part of the space of the plating apparatus. The present invention of claim 4 is characterized in that a cutting and tilting means is provided.
3 to 3, the liquid draining and tilting mechanism that tilts one end is provided with a spraying means for spraying shower washing water from the sloped high portion side when the plating jig held by the hanger is positioned in the upper space. According to claim 5,
The invention of claim 1, in claims 1 to 4, the cathode current transmitting unit of the plating tank so that the contact portion of the cathode current introducing unit attached to the hanger and the contact portion of the cathode current transmitting unit attached to the plating tank are underwater contact. It is characterized by being placed in a part.
【００１０】[0010]
【作用】メッキ用治具1 の底面に配置された陰極電流接
点部2 にたいしてリードフレーム6 の端面がその自重に
より接すると共に、上部の端面が逆Ｖ字形状の押圧接触
部7'を有する押え部材7 により保持され、しかも押え部
材7 の荷重が加わることにより、より確かな電流の流れ
を確保するので、メッキ槽18中で多少の振動が生じても
品質良好なメッキを得る。また、逆Ｖ字の押圧接触部7'
はリードフレーム6 を陽極電極9 にたいしてきちんと対
面配置できるので大変有効である。[Function] A holding member having an end surface of the lead frame 6 contacting the cathode current contact portion 2 arranged on the bottom surface of the plating jig 1 by its own weight and an upper end surface having a pressing contact portion 7'having an inverted V shape. Since a more reliable current flow is secured by being held by 7 and the load of the pressing member 7 being applied, good quality plating can be obtained even if some vibration occurs in the plating tank 18. Also, the inverted V-shaped pressure contact portion 7 '
Is very effective because the lead frame 6 can be properly placed facing the anode electrode 9.
【００１１】また、一端を傾斜させる液切り傾斜機構29
により、傾斜高部側よりシャワー水洗水を噴射する噴射
手段27を設けたので、メッキ用治具1 によるくみ出し、
くみこみの減少効果に加えて、相乗効果以上に、くみ出
し、くみこみが減じられ、各種の液の破壊、水洗水の汚
れ等がほとんど皆無となり、高速メッキ数十秒単位の激
しい槽間の移動においても何等の不都合も無く均質良好
メッキを供給することができた。Further, a liquid-cutting tilting mechanism 29 for tilting one end
As a result, since the spraying means 27 for spraying the shower washing water from the inclined high portion side is provided, the pumping-out by the plating jig 1,
In addition to the effect of reducing lumps, pumping out and lumps are reduced more than the synergistic effect, there is almost no destruction of various liquids, stains on washing water, etc.High speed plating Moving between tanks in tens of seconds unit In this case, it was possible to supply uniform plating without any inconvenience.
【００１２】更にハンガー17に取り付けられた陰極電流
導入部22とメッキ槽18に取り付けられた陰極電流送電部
21の接触部24が水中接触するようにしたから、接触抵抗
が極めて低く良い状態を維持できるので高速対応、均質
良好なメッキを得ることができる。Further, a cathode current introducing portion 22 attached to the hanger 17 and a cathode current transmitting portion attached to the plating tank 18
Since the contact portions 24 of the 21 are brought into contact with each other in water, the contact resistance can be kept extremely low and a good state can be maintained, so that it is possible to obtain high-speed and uniform plating.
【００１３】[0013]
【実施例】本発明の実施例を図１〜図７に基づいて詳述
する。図１は本発明で使用するメッキ用治具の正面図で
あり、図２は同側面図であり、図３はメッキ用治具の使
用概念図、図４はメッキ用治具の断面図である。また図
５はメッキラインの概念図であり、図６はメッキ槽等全
体の斜視図、図７は液切り傾斜手段およびシャワー水洗
噴射手段の概念図である。Embodiments of the present invention will be described in detail with reference to FIGS. FIG. 1 is a front view of a plating jig used in the present invention, FIG. 2 is a side view of the same, FIG. 3 is a conceptual view of use of the plating jig, and FIG. 4 is a sectional view of the plating jig. is there. Further, FIG. 5 is a conceptual view of the plating line, FIG. 6 is a perspective view of the entire plating tank and the like, and FIG. 7 is a conceptual view of the liquid draining inclination means and the shower water washing / injection means.
【００１４】図１〜図３において、１はメッキ用治具
で、線材によりバスケット形状に形成されている。この
治具1 は水平部a とこの水平部a の両端を上方に折曲げ
た垂直部b,b からなる上向きコ字状部材c の１対を平行
に設け、前記部材c,c の水平部a,a 間に渡架して適宜間
隔を設けてＭ字状とされた複数個の陰極電流接点部2 を
溶接固定すると共に、該接点部2,2 間にこの接点部2 よ
りも背高のＶ字状とされた複数個の支持体3 を水平部a,
a 間に渡架して溶接固定し、更に水平部a の略中央位置
に前記支持体3 よりも背高の上向きコ字状の分離体4 を
水平部a,a 間に渡架して溶接固定してある。In FIGS. 1 to 3, reference numeral 1 denotes a plating jig, which is formed of a wire rod in a basket shape. This jig 1 is provided with a pair of upward U-shaped members c composed of a horizontal part a and vertical parts b and b in which both ends of the horizontal part a are bent upward. A plurality of M-shaped cathode current contact portions 2 which are bridged between a and a are provided at appropriate intervals and are fixed by welding, and the height between the contact portions 2 and 2 is higher than that of the contact portion 2. A plurality of V-shaped supports 3 are provided on the horizontal part a,
It is bridged between the horizontal parts a and fixed by welding, and an upwardly U-shaped separator 4 which is taller than the support 3 is bridged between the horizontal parts a and a and welded at a substantially central position of the horizontal part a. It is fixed.
【００１５】そして、この分離体4 との中間にストッパ
ー5 を横架溶接固定されており、これと同様のストッパ
ー5,5 が部材c,c の垂直部b の対応位置に横架溶接固定
されている。また、部材c,c の各垂直部b,b の上部に方
形状の電気導体部8,8 が溶接固定されている。7 は、そ
の上端部を前記導体部8 の下部中央に弾性的に固定さ
れ、下部自由端を逆Ｖ字形に形成した押圧接触部7'を有
する線材により形成された押え部材7 で、下方傾斜状に
配置されている。なお、前記逆Ｖ字の押圧接触部7'の形
状については、必ずしも逆Ｖ字が完全でなくとも良いこ
とは勿論であるが、幅がメッキ用治具1 の幅と同程度に
すれば適当で、Ｖ字の開き角度は 160゜程度のものまで
が好ましいが、最も好ましくは30゜〜 100゜のものが良
い。これは後述する被メッキ体の一例としてのリードフ
レーム6 を容易に逆Ｖ字両辺にガイドするとともに直立
させ易い。また、この逆Ｖ字の押圧接触部7'の構造は上
記のことから多くの変化変形が考えられるので本発明を
特に制約するものではない。A stopper 5 is horizontally welded and fixed in the middle of the separating body 4, and stoppers 5 and 5 similar to this are horizontally welded and fixed to corresponding positions of the vertical portions b of the members c and c. ing. Further, the rectangular electric conductor portions 8 and 8 are welded and fixed to the upper portions of the respective vertical portions b and b of the members c and c. The pressing member 7 is a pressing member 7 formed by a wire having an upper end portion elastically fixed to the lower center of the conductor portion 8 and a pressing contact portion 7'having a lower free end formed in an inverted V shape. Are arranged in a shape. Regarding the shape of the inverted V-shaped pressing contact portion 7 ′, it is needless to say that the inverted V-shaped portion is not necessarily perfect, but it is appropriate if the width is approximately the same as the width of the plating jig 1. The V-shaped opening angle is preferably up to about 160 °, but most preferably 30 ° to 100 °. This makes it easy to guide the lead frame 6 as an example of the object to be plated, which will be described later, to both sides of the inverted V-shape and to make it upright. Further, the structure of the inverted V-shaped pressing contact portion 7'is not limited to the present invention because many variations can be considered from the above.
【００１６】なお、上記のメッキ用治具1 はその構成部
材としての線材15をハステロイ合金(例えば、合金成分
として Ｎｉ：55.5〜59.5％、Ｍｏ：18〜22％、Ｃo ：
0.4〜0.15％、残部Ｆｅ) を使用することが好ましく、
陰極電流接点部2 以外の部分はその表面にフッ素樹脂16
を電気絶縁皮膜および耐食性皮膜としてコーティングし
てあり、図４にその断面を示す。このようにメッキ用治
具1 を構成する線材にハステロイ合金を使用し、これを
芯材として表面にフッ素樹脂コーティング層を設けてお
けば、そのコーティング層の作用でメッキ工程液に対す
るは撥水作用で、それだけメッキ工程液の持ち出し、持
ち込みが少なく、従って、メッキ工程液を壊すことが少
なくなり、延いてはそれだけランニングコストが低くな
り、生産性も向上し、被メッキ体の品質が向上される。
一方、陰極電流接点部2 は露出したハステロイ合金15で
あるから、腐食が少なく、それだけ治具寿命が向上する
し、メッキ液の劣化もそれだけ少なくなる等の効果があ
る。In the plating jig 1 described above, the wire material 15 as a constituent member of the jig 1 is a Hastelloy alloy (for example, Ni: 55.5 to 59.5%, Mo: 18 to 22%, Co:
It is preferable to use 0.4 to 0.15% and the balance Fe),
The parts other than the cathode current contact part 2 are made of fluororesin 16
Is coated as an electric insulation film and a corrosion resistant film, and its cross section is shown in FIG. In this way, if the Hastelloy alloy is used for the wire material that constitutes the plating jig 1, and the fluororesin coating layer is provided on the surface using this as the core material, the coating layer acts to make the plating process water repellent. Therefore, the amount of plating process liquid brought out and carried in is reduced, so that the plating process liquid is less likely to be destroyed, which in turn lowers running costs, improves productivity, and improves the quality of the object to be plated. .
On the other hand, since the cathode current contact portion 2 is the exposed Hastelloy alloy 15, it has effects such as less corrosion, a longer jig life, and less deterioration of the plating solution.
【００１７】しかしながら、メッキ用治具1 並びに押え
部材7 の材質は上記のものに限定されず、例えば線材と
してステンレス、チタン等の耐食性金属材を使用し、ま
た合成樹脂コーティング材として他の耐食性のものをコ
ーティングして使用してもよい。次に図３について、更
に説明すると、6 は被メッキ体で例えば短尺リードフレ
ームであり、メッキ用治具1 の上部から装入してその下
端面を該治具1 の底面に配置された陰極電流接点部2 上
に載置すると、リードフレーム6 の下端面がその自重に
より接すると共に、上端面を逆Ｖ字状の押圧接触部7'を
有する押え部材7により保持させてある。この際、押え
部材7 の荷重が加わることにより、より確かな電流の流
れを確保できるので、後述するメッキ槽18中で多少の振
動が生じても品質良好なメッキを得る。However, the materials of the plating jig 1 and the pressing member 7 are not limited to those described above, and for example, a corrosion-resistant metal material such as stainless steel or titanium is used as the wire material, and another corrosion-resistant metal material is used as the synthetic resin coating material. You may coat and use a thing. Next, with reference to FIG. 3, reference numeral 6 denotes an object to be plated, which is, for example, a short lead frame, which is loaded from the upper portion of the plating jig 1 and whose lower end surface is placed on the bottom surface of the jig 1. When the lead frame 6 is placed on the current contact portion 2, the lower end surface of the lead frame 6 contacts by its own weight, and the upper end surface is held by a holding member 7 having an inverted V-shaped pressing contact portion 7 '. At this time, since a more reliable current flow can be secured by applying a load to the pressing member 7, good quality plating can be obtained even if some vibration occurs in the plating tank 18 described later.
【００１８】前記、押え部材7 の押圧接触部7'は、逆Ｖ
字の内面がガイド面となり、リードフレーム6 の上下端
面を正確に直立させる。また、このメッキ用治具1 は両
サイド、中央部にストッパー5 が配置されているため、
上部を除いてどこにもリードフレーム6 を落下させるよ
うな開口部は構成されていないので、製品のリードフレ
ーム6 の保持が良好であると共にストッパー5 が電流の
遮蔽効果を発揮する結果、該リードフレーム6 の両サイ
ドに集中的に発生し易い極端な高電流を緩和するため均
質なメッキ厚みを獲得し易い。The pressing contact portion 7'of the pressing member 7 has a reverse V
The inner surface of the letter serves as a guide surface so that the upper and lower end surfaces of the lead frame 6 are correctly erected. In addition, since this plating jig 1 has stoppers 5 on both sides and in the center,
Since there is no opening for dropping the lead frame 6 anywhere except the upper part, the lead frame 6 of the product is held well and the stopper 5 has the effect of shielding the current. It is easy to obtain a uniform plating thickness because it alleviates the extremely high current that tends to concentrate on both sides of 6.
【００１９】図３において、9 は陽極電極であり、前記
メッキ用治具1 に平行にすなわち対面に片側又は両側に
配置することと、リードフレーム6 の正面に対面配置す
ることは同じことで、リードフレーム6 が少しの傾斜を
していても特別な問題は発生しない。リードフレーム6
と陽極電極9 との距離については特に限定するところで
はなく、使用する電流の強度、使用メッキ液の種類、被
メッキ体の形状等を考慮して設計すればよい。In FIG. 3, reference numeral 9 denotes an anode electrode, which is arranged in parallel with the jig 1 for plating, that is, on one side or on both sides facing each other, and it is the same as arranging the lead frame 6 on the front side facing each other. Even if the lead frame 6 is slightly inclined, no special problems occur. Lead frame 6
The distance between the anode electrode 9 and the anode electrode 9 is not particularly limited, and may be designed in consideration of the strength of the current used, the type of plating solution used, the shape of the object to be plated, and the like.
【００２０】図５は、被メッキ体の１例であるリードフ
レーム6 の半田メッキラインの平面からみた概念図であ
り、同図の10,10 は二つの搬送コンベアー、11はメッキ
槽等の設備本体、9 は搬送コンベアー10に平行して配置
された半田メッキの陽極電極、12は有機酸タイプのハン
ダメッキ液、13は二つの搬送コンベアー10に対応する二
つのロード、14は二つのアンロードである。FIG. 5 is a conceptual view of the solder plating line of the lead frame 6, which is an example of the object to be plated, as seen from the plane. In FIG. 5, 10 and 10 are two conveyors and 11 is equipment such as a plating tank. Main body, 9 is a solder-plated anode electrode arranged in parallel with the conveyor 10, 12 is an organic acid type solder plating solution, 13 is two loads corresponding to the two conveyors 10, and 14 is two unloads. Is.
【００２１】このメッキライン概念図において、被メッ
キ体であるリードフレーム6 はロード13で投入され、ド
ーナツ型の設備本体11中を搬送コンベアー10,10 に乗っ
て移動処理され、最終的にアンロード14より取り出され
る。この循環工程において半田メッキ液12中でメッキが
行われる。この搬送コンベアー10には、図６、図７に示
すメッキ用治具1 の取り付け用ハンガー17が固定されて
いる。このハンガー17は陽極電極9 と平行に配置した長
辺17a,17a と、該長辺17a に垂直な短辺17b,17b とから
なる長方形の枠体とでなり、メッキ用治具1 の各電気導
体部8,8 は前記短辺17b,17b の中央に固定されて垂下さ
れている。In this conceptual diagram of the plating line, the lead frame 6 which is the object to be plated is loaded by the load 13 and moved through the doughnut-shaped equipment main body 11 on the transfer conveyors 10 and 10 and finally unloaded. Taken out from 14. In this circulation process, plating is performed in the solder plating solution 12. A hanger 17 for mounting the plating jig 1 shown in FIGS. 6 and 7 is fixed to the transfer conveyor 10. The hanger 17 comprises a rectangular frame body having long sides 17a, 17a arranged parallel to the anode electrode 9 and short sides 17b, 17b perpendicular to the long side 17a. The conductor portions 8 and 8 are fixed and hung down at the centers of the short sides 17b and 17b.
【００２２】このように設計した短尺リードフレーム6
のメッキラインにおいて本発明者はさらに高速対応、均
質、良好なメッキを施すためにより高度な工夫をした。
すなわち、図６に示すようにメッキ用治具1 を取り付け
るハンガー17の長辺17a の片側又は両側にメッキをする
ための陰極電流を受け取るために設けられた陰極電流導
入部22とメッキ槽18に取り付けられた陰極電流送電部21
の接触部24を、使用に際し常時水中に位置するようにし
た。図６の18は絶縁体で構成したメッキ槽で、20はメッ
キ槽18の側面に固定された水溝で、21は電気導体からな
る陰極電流送電部で、22は電気導体からなる陰極電流導
入部で、24は陰極電流導入部22と送電部21との接触部で
ある。これに流水又は溜水の水23を接触部24が常時浸っ
ているように配した。Short lead frame 6 designed in this way
In this plating line, the present inventor has made more advanced measures to apply high speed, uniform and good plating.
That is, as shown in FIG. 6, the hanger 17 to which the plating jig 1 is attached has a cathode current introduction part 22 and a plating tank 18 provided to receive a cathode current for plating on one side or both sides of the long side 17a. Cathode current transmitter 21 installed
The contact portion 24 of was always placed in water when used. Reference numeral 18 in FIG. 6 is a plating tank composed of an insulator, 20 is a water groove fixed to the side surface of the plating tank 18, 21 is a cathode current transmitting section made of an electric conductor, and 22 is a cathode current introduction made of an electric conductor. Reference numeral 24 denotes a contact portion between the cathode current introducing portion 22 and the power transmitting portion 21. The running water or the accumulated water 23 was arranged so that the contact portion 24 was constantly immersed therein.
【００２３】搬送コンベアー10により移動するハンガー
17において、陰極電流を供給する上で最も大切なことは
各部の電気接点が良いか悪いかにある。こうしたライン
においてはハンガー17に取り付けられた電流導入部22と
電流送電部21の接触が完全でなければならない。特に高
速対応、均質良質なメッキを求めるときは大変重要であ
る。今、その接触部24を水23で浸け込んでおくと、接触
抵抗が極めて低く良い状態を維持できる。このようにし
た結果、実用テストの結果、ライン抵抗が低く安定して
長期の期間のランニングが可能でしかも高い電流を低い
電圧で通電でき、均質な良好なメッキを得ることが容易
となった。陰極電流送電部21と陰極電流導入部22の断面
形状は共に角度の近似なＶ字形状が位置決め、接触の点
から最も好ましいが、その他の多くの変化変形の形状が
考えられる。Hangers that are moved by the conveyor 10
In 17, the most important thing in supplying the cathode current is whether or not the electrical contact of each part is good or bad. In such a line, the contact between the current introducing section 22 attached to the hanger 17 and the current transmitting section 21 must be perfect. This is very important especially when high-speed plating and uniform quality plating are required. If the contact portion 24 is soaked with water 23, the contact resistance is extremely low and a good state can be maintained. As a result of the above, as a result of the practical test, the line resistance was low, stable running was possible for a long period of time, high current could be applied at low voltage, and it became easy to obtain uniform and good plating. The cross-sectional shapes of the cathode current transmitting portion 21 and the cathode current introducing portion 22 are most preferably V-shaped with an approximate angle, from the viewpoint of positioning and contact, but many other deformed shapes are conceivable.
【００２４】次に、本発明者はこの装置を運転していて
さらに改善を加えた。すなわち、高速対応、均質良好メ
ッキを求めだすと、各種の処理薬品液、メッキ液のくみ
出し、くみこみが特に問題になることである。そこで工
夫の結果、図７のように、メッキ液12又はその回収液1
2' 槽のハンガー12の液中移動の最終即ち槽間飛び越え
の際に、メッキ液回収液12' の上部空間26にハンガー17
が位置した時に、進行方向28側のハンガー17端をエアー
シリンダー等の機械的な動作による持ち上げ手段でハン
ガー17を傾斜させ、メッキ用治具1 、被メッキ体のリー
ドフレーム6 を傾斜させる手段29を配置した。また、こ
の時メッキ用治具1 とリードフレーム6 に傾斜高部側よ
りシャワー水洗水27を噴射する手段を配置した。Next, the present inventor was operating this apparatus and made further improvements. That is, when a high-speed compatible plating with good homogeneity is sought, various processing chemical liquids, squeezing out of the plating liquid, and pitting are particularly problematic. Therefore, as a result of the device, as shown in FIG. 7, the plating liquid 12 or the collected liquid 1
At the end of the movement of the hanger 12 in the 2'tank in the liquid, that is, when jumping between tanks, the hanger 17 is placed in the upper space 26 of the plating liquid recovery liquid 12 '.
When the is positioned, the end of the hanger 17 on the traveling direction 28 side is tilted by a lifting means by a mechanical operation such as an air cylinder to tilt the plating jig 1 and the lead frame 6 of the object to be plated 29 Was placed. Further, at this time, a means for spraying the shower rinsing water 27 from the inclined high portion side was arranged on the plating jig 1 and the lead frame 6.
【００２５】[0025]
【具体的実施例】短尺リードフレーム (Ｗ80mm×Ｌ250m
m) 6を２枚投入できるように、図１のように陰極電流導
体部8 を有するメッキ用治具1 を、ニッケル55％、モリ
ブデン22％、クロム 3％、残部鉄からなるハステロイ15
の 5mmφを心材として、これにフッ素樹脂16を 1mmコー
ティングして、さらに同様の構造 (図５）の支持体3 、
分離帯4 、ストッパー5 を構成させ、この底面に一部ハ
ステロイ15の露出した陰極電流接点部2 を配置してなる
メッキ用治具1 を用意する。[Specific example] Short lead frame (W80mm × L250m
m) 6 so that 2 sheets can be charged, a plating jig 1 having a cathode current conductor portion 8 as shown in FIG. 1 is used as a Hastelloy 15 consisting of 55% nickel, 22% molybdenum, 3% chromium and the balance iron.
5mmφ of the core material is coated with 1mm of fluororesin 16 and the support 3 of the same structure (Fig. 5)
There is prepared a plating jig 1 which comprises a separation zone 4 and a stopper 5, and a cathode current contact portion 2 with a part of Hastelloy 15 exposed on the bottom surface thereof.
【００２６】次いで、これにメッキ用治具1 と同じ材質
からなり先端に逆Ｖ字 (一辺20mm、開き角度90゜) の押
圧接触部7'を有する押え部材7 を自然荷重が加わるよう
に回転コマを介してメッキ用治具1 と一体的に取り付け
る。次に、図５のように前処理槽、後処理槽、半田メッ
キ槽からなるドーナツ型に配列されたメッキ槽本体11と
搬送コンベアー10をライン (図４では２ライン）配置
し、さらに陽極電極9 をハンダメッキ液12中に搬送コン
ベアー10をはさむように平行に２列、図６に示すように
配置した。Next, a pressing member 7 made of the same material as the plating jig 1 and having an inverted V-shaped (20 mm on one side, opening angle 90 °) pressing contact portion 7'at the tip is rotated so that a natural load is applied. It is attached integrally with the plating jig 1 via the top. Next, as shown in FIG. 5, a doughnut-shaped plating tank body 11 and a conveyer conveyor 10 arranged in a doughnut-type consisting of a pretreatment tank, a post-treatment tank, and a solder plating tank are arranged in a line (two lines in FIG. 4), and an anode electrode is further arranged. 9 were placed in parallel in the solder plating solution 12 so as to sandwich the transfer conveyor 10 in two rows as shown in FIG.
【００２７】続いて、メッキ用治具1 を陰極電流導体部
22を介して、図６に示すハンガー17に固定するように取
り付ける。このハンガー17の両側には陰極電流導入部22
が設けられている。なお、図では片側は図示省略してあ
る。また、メッキ等設備本体11の両側側面の上部には水
溝20が配置され、水溝20の内側にはＶ字の陰極電流送電
部21が配置され、さらにその陰極電流導入部22と陰極電
流送電部21との接触部21が十分浸かるように水23が配置
した。Subsequently, the plating jig 1 is attached to the cathode current conductor portion.
It is fixedly attached to the hanger 17 shown in FIG. On both sides of this hanger 17 are cathode current introducing parts 22
Is provided. In addition, one side is not shown in the drawing. Further, a water groove 20 is arranged on the upper side of both sides of the equipment body 11 such as plating, a V-shaped cathode current transmitting portion 21 is arranged inside the water groove 20, and further, a cathode current introducing portion 22 and a cathode current introducing portion 22 thereof. The water 23 was arranged so that the contact part 21 with the power transmission part 21 was sufficiently immersed.
【００２８】さらに、図７に示すように、半田メッキ液
12槽後の回収液12' 槽の、次工程水洗水25槽への飛び越
し移動の段階で、空間26に位置した時、進行方向28側の
ハンガー17端を30゜の角度にエアーシリンダーで持ち上
げ傾斜させる手段29を配置した。同時に、傾斜してスト
ップしている時間を数秒とり、この間に傾斜の高部側か
らメッキ用治具1 および投入されたリードフレーム6 に
対してシャワー水洗水27を噴射する手段を配置した。Further, as shown in FIG. 7, solder plating solution
When the 12 'tank of the recovered liquid after 12 tanks is jumped to the 25th tank of the next process, the hanger 17 end on the moving direction 28 side is lifted by the air cylinder at the angle of 30 ° when it is located in the space 26. A means 29 for tilting is arranged. At the same time, a time for tilting and stopping was set for several seconds, and means for spraying the shower rinsing water 27 from the high side of the tilt to the plating jig 1 and the introduced lead frame 6 was arranged during this time.
【００２９】以上のように準備を終了した装置におい
て、最初図５に例示するロード13位置で、リードフレー
ム6 を２枚チャッキングマシンによりメッキ用治具1 の
中へ投入する。この時あらかじめ自動制御により押え部
材7 は押し出しピンにより、リードフレーム6 の投入の
弊害の生じない高さに押し上げられ、リードフレーム6
の投入後は再びピンは下がり押え部材7 はリードフレー
ム6 をメッキ用治具1 に付加した陰極電流接点部2 との
間でしっかり挟持する。やがて搬送コンベアー10により
ハンガー17を介してリードフレーム6 はメッキ液12の槽
に搬送される。メッキ槽18には有機酸からなる半田メッ
キ液12があり、陽極電極9 は対面に両側に配置されてお
り、電流は陰極電流送電部21と陰極電流導入部22を介し
てハンガー17に伝わり、さらに陰極電流導体部8 を伝わ
りメッキ用治具1 に伝わりメッキが開始される。その結
果、2 A/dm2 、10min 間のメッキでは、平均メッキ厚さ
は 7ミクロンであり、しかもメッキ厚さのバラツキはど
の部分も±2 ミクロンの範囲であり極めて精度の高いメ
ッキが安定して得られた。In the apparatus thus prepared, the lead frame 6 is first put into the plating jig 1 by the chucking machine at the load 13 position illustrated in FIG. At this time, the presser member 7 is pushed up by the automatic control in advance by the push-out pin to a height that does not cause any adverse effect on the insertion of the lead frame 6.
After the insertion, the pin is lowered again and the pressing member 7 is firmly clamped between the lead frame 6 and the cathode current contact portion 2 added to the plating jig 1. Eventually, the lead frame 6 is transported to the bath of the plating liquid 12 via the hanger 17 by the transport conveyor 10. There is a solder plating solution 12 made of an organic acid in the plating tank 18, the anode electrodes 9 are arranged on opposite sides, and the current is transmitted to the hanger 17 via the cathode current transmitting unit 21 and the cathode current introducing unit 22, Further, it is transmitted through the cathode current conductor portion 8 to the plating jig 1, and plating is started. As a result, when plating for 2 A / dm 2 for 10 min, the average plating thickness is 7 μm, and the variation in plating thickness is within ± 2 μm in every part, and stable plating with extremely high accuracy is achieved. It was obtained.
【００３０】また、20 A/dm2、1 min のメッキでは、平
均メッキ厚さは 7ミクロン±2.25ミクロンであり、100
A/dm2 、12scc のメッキでは、どの部分でも平均メッキ
厚さ7 ミクロン±2.40ミクロンという大変満足のゆく精
度の高い良質のメッキが安定して得られた。また、この
時のラインの電気抵抗は非常に低く、接触抵抗のような
ものは無かった。これは明らかに、電流導入部22と送電
部21の接触部24に水23が介在したことによる効果とリー
ドフレーム6 が押え部材7 とメッキ用治具1 の底面接点
とでしっかり挟持されていたためである。In the case of plating at 20 A / dm 2 and 1 min, the average plating thickness is 7 μm ± 2.25 μm,
With A / dm 2 and 12 scc plating, we were able to consistently obtain high-quality plating with an extremely satisfactory average precision of 7 μm ± 2.40 μm in any part. Also, the electric resistance of the line at this time was very low, and there was no such thing as contact resistance. This is apparently because the effect of water 23 intervening in the contact part 24 of the current introducing part 22 and the power transmitting part 21 and that the lead frame 6 was firmly sandwiched between the holding member 7 and the bottom contact of the plating jig 1. Is.
【００３１】次に、メッキの終了したリードフレーム6
はメッキ液の回収液12' の槽に移動し、処理されたの
ち、次工程の水洗水25の槽に移動されるのであるがその
前に、回収液12' の上空間26で傾斜手段29で傾斜、スト
ップし液切りが行われると共にシャワー水洗水による噴
射手段27により完全に洗浄され、液の持ち出し、持ち込
みは本発明特定のメッキ用治具の効果とも相乗してほぼ
完全に無くすることが可能となった。Next, the lead frame 6 that has been plated
Is transferred to the tank of the recovery solution 12 'of the plating solution, treated and then transferred to the tank of the washing water 25 of the next step. Before that, the tilting means 29 is used in the upper space 26 of the recovery solution 12'. Inclining and stopping at and draining is performed, and it is completely washed by the jetting means 27 by the shower washing water, and the carry-out and carry-in of the fluid should be almost completely eliminated together with the effect of the plating jig specific to the present invention. Became possible.
【００３２】以後、乾燥等の工程をへて移動し、アンロ
ード14よりチャッキングマシンにより取り出される。こ
の時、押え部材7 は投入時と同じようにピンの上下によ
り取り出しを阻害しないように動作する。かくして、作
業は終了し、高速対応、均質、良好な短尺リードフレー
ムのメッキが得られた。Thereafter, the process such as drying is moved to and the product is taken out from the unload 14 by a chucking machine. At this time, the pressing member 7 operates so as not to hinder the removal due to the upper and lower sides of the pin, as in the case of insertion. Thus, the work was completed, and plating of high speed, uniform and good short lead frame was obtained.
【００３３】[0033]
【発明の効果】本発明のメッキ装置は、メッキ用治具1
の底面に配置された陰極電流接点部2にたいしてリード
フレーム6 の端面がその自重により接すると共に、上部
の端面が逆Ｖ字形状の押圧接触部7'を有する押え部材7
により保持され、しかも押え部材7 の荷重が加わること
により、より確かな電流の流れを確保するので、メッキ
槽18中で多少の振動が生じても品質良好なメッキを得
る。また、逆Ｖ字の押圧接触部7'はリードフレーム6 を
陽極電極9 にたいしてきちんと対面配置できるので大変
有効である。EFFECT OF THE INVENTION The plating apparatus of the present invention is a plating jig 1
The end face of the lead frame 6 is in contact with the cathode current contact part 2 arranged on the bottom face of the lead frame by its own weight, and the upper end face has a pressing contact part 7'having an inverted V shape.
Since a more reliable current flow is ensured by holding the load of the pressing member 7 by means of the above, the plating with good quality can be obtained even if some vibration occurs in the plating tank 18. In addition, the inverted V-shaped pressing contact portion 7'is very effective because the lead frame 6 can be properly arranged face-to-face with the anode electrode 9.
【００３４】また、一端を傾斜させる液切り傾斜機構29
により、傾斜高部側よりシャワー水洗水を噴射する噴射
手段27を設けたので、メッキ用治具1 によるくみ出し、
くみこみの減少効果に加えて、相乗効果以上に、くみ出
し、くみこみが減じられ、各種の液の破壊、水洗水の汚
れ等がほとんど皆無となり、高速メッキ数十秒単位の激
しい槽間の移動においても何等の不都合も無く均質良好
メッキを供給することができた。Further, a liquid-cutting tilting mechanism 29 for tilting one end
As a result, since the spraying means 27 for spraying the shower washing water from the inclined high portion side is provided, the pumping-out by the plating jig 1,
In addition to the effect of reducing lumps, pumping out and lumps are reduced more than the synergistic effect, there is almost no destruction of various liquids, stains on washing water, etc.High speed plating Moving between tanks in tens of seconds unit In this case, it was possible to supply uniform plating without any inconvenience.
【００３５】更にハンガー17に取り付けられた陰極電流
導入部22とメッキ槽18に取り付けられた陰極電流送電部
21の接触部24が水中接触するようにしたから、接触抵抗
が極めて低く良い状態を維持できるので高速対応、均質
良好なメッキを得ることができる。Further, a cathode current introducing portion 22 attached to the hanger 17 and a cathode current transmitting portion attached to the plating tank 18
Since the contact portions 24 of the 21 are brought into contact with each other in water, the contact resistance can be kept extremely low and a good state can be maintained, so that it is possible to obtain high-speed and uniform plating.
【図面の簡単な説明】[Brief description of drawings]
【図１】メッキ治具の正面図。FIG. 1 is a front view of a plating jig.
【図２】メッキ治具の側面図。FIG. 2 is a side view of the plating jig.
【図３】メッキ治具の使用概念図。FIG. 3 is a conceptual diagram of use of a plating jig.
【図４】メッキ治具の断面図。FIG. 4 is a sectional view of a plating jig.
【図５】メッキラインの概念図。FIG. 5 is a conceptual diagram of a plating line.
【図６】メッキ槽等全体斜視図。FIG. 6 is an overall perspective view of a plating tank and the like.
【図７】液切り傾斜手段およびシャワー水洗噴射手段の
概念図。FIG. 7 is a conceptual diagram of a liquid draining inclination means and a shower water washing / injection means.
１ メッキ用治具 ２ 陰極電流接点部 ３ 支持体 ４ 分離帯 ５ ストッパー ６ 短尺リードフレーム（被メッキ体） ７ 押え部材 ７' 押圧接触部 ８ 電気導体部 ９ 陽極電極 10 搬送コンベアー 11 メッキ設備等設備本体 12 メッキ液 12' 回収液 13 ロード 14 アンロード 15 線材 (ハステロイ合金) 16 フッ素樹脂 17 ハンガー 18 メッキ槽 19 陽極電極 20 水溝 21 陰極電流送電部 22 陰極電流導入部 23 水 24 接触部 25 水洗水 26 空間 27 シャワー水洗水噴射手段 28 移動進行方向 29 液切り傾斜手段 1 Plating jig 2 Cathode current contact point 3 Support 4 Separation band 5 Stopper 6 Short lead frame (plate to be plated) 7 Holding member 7'Pressing contact part 8 Electric conductor part 9 Anode electrode 10 Transport conveyor 11 Equipment such as plating equipment Main body 12 Plating liquid 12 'Recovery liquid 13 Load 14 Unload 15 Wire rod (Hastelloy alloy) 16 Fluororesin 17 Hanger 18 Plating tank 19 Anode electrode 20 Water groove 21 Cathode current transmission part 22 Cathode current introduction part 23 Water 24 Contact part 25 Washing Water 26 Space 27 Shower Rinse water injection means 28 Moving direction 29 Draining and tilting means
Claims (5)
配置し、他の部分は被メッキ体を保持するための電気絶
縁体で構成した保持体とでなるバスケット形メッキ用治
具を使用するメッキ装置において、 前記被メッキ体上部を押圧するための押え部材をメッキ
用治具に配置し、陽極電極を被メッキ体正面部に対面配
置したことを特徴とする電子部品等の高速対応均質メッ
キ装置。1. A basket type plating jig having a cathode current contact portion by its own weight disposed on the bottom surface of the jig, and the other portion having a holding member made of an electric insulator for holding a plated object. In the plating apparatus, the pressing member for pressing the upper part of the object to be plated is arranged on the plating jig, and the anode electrode is arranged facing the front part of the object to be plated. Plating equipment.
に記載の電子部品等の高速対応均質メッキ装置。2. The pressing member is formed in an inverted V shape.
High-speed homogeneous plating equipment for electronic parts, etc.
ンガーをメッキ装置の全部又は一部の空間において、ハ
ンガー移動方向の一端を傾斜させる液切り傾斜手段を設
けた請求項１又は２に記載の電子部品等の高速対応均質
メッキ装置。3. The liquid cutting and tilting means for tilting one end in the hanger moving direction of the hanger for holding the basket-type plating jig in all or part of the space of the plating apparatus. High-speed homogeneous plating equipment for electronic parts.
り、上部空間にハンガーに保持されたメッキ用治具が位
置したとき、傾斜高部側よりシャワー水洗水を噴射する
噴射手段を設けた請求項１〜３の１つに記載の電子部品
等の高速対応均質メッキ装置。4. A spraying means for spraying shower rinsing water from the sloped high portion side when the plating jig held by the hanger is positioned in the upper space by means of a draining and tilting mechanism which tilts one end. A high-speed homogenous plating apparatus for electronic parts and the like according to any one of 1 to 3.
部とメッキ槽に取り付けられた陰極電流送電部の接触部
が、水中接触するように、陰極電流送電部をメッキ槽の
一部に配置した請求項１〜４の１つに記載の電子部品等
の高速対応均質メッキ装置。5. The cathode current transmitting unit is arranged in a part of the plating tank so that the contact portion of the cathode current introducing unit attached to the hanger and the contact portion of the cathode current transmitting unit attached to the plating tank are in contact with each other in water. A high-speed homogeneous plating apparatus for electronic parts and the like according to any one of Items 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23735992A JPH0684560B2 (en) | 1992-09-04 | 1992-09-04 | High-speed homogeneous plating equipment for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23735992A JPH0684560B2 (en) | 1992-09-04 | 1992-09-04 | High-speed homogeneous plating equipment for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0688293A true JPH0688293A (en) | 1994-03-29 |
| JPH0684560B2 JPH0684560B2 (en) | 1994-10-26 |
Family
ID=17014226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23735992A Expired - Fee Related JPH0684560B2 (en) | 1992-09-04 | 1992-09-04 | High-speed homogeneous plating equipment for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0684560B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012082490A (en) * | 2010-10-14 | 2012-04-26 | Hiraide Seimitsu:Kk | Plating machine |
| CN106637369A (en) * | 2016-12-14 | 2017-05-10 | 淮海工业集团有限公司 | Electroplating hanger for bowl-shaped plating pieces |
-
1992
- 1992-09-04 JP JP23735992A patent/JPH0684560B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012082490A (en) * | 2010-10-14 | 2012-04-26 | Hiraide Seimitsu:Kk | Plating machine |
| CN106637369A (en) * | 2016-12-14 | 2017-05-10 | 淮海工业集团有限公司 | Electroplating hanger for bowl-shaped plating pieces |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0684560B2 (en) | 1994-10-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |