JPH0680212A - Moving mechanism for semi-conductor wafer - Google Patents
Moving mechanism for semi-conductor waferInfo
- Publication number
- JPH0680212A JPH0680212A JP28201491A JP28201491A JPH0680212A JP H0680212 A JPH0680212 A JP H0680212A JP 28201491 A JP28201491 A JP 28201491A JP 28201491 A JP28201491 A JP 28201491A JP H0680212 A JPH0680212 A JP H0680212A
- Authority
- JP
- Japan
- Prior art keywords
- cassette
- base
- semiconductor wafer
- elevator
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Warehouses Or Storage Devices (AREA)
- Specific Conveyance Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、研削加工前の多数枚の
半導体ウエハを単品毎に桟体で仕切って収納されている
カセットから単品毎に送出する、又は、研削加工後の半
導体ウエハをカセットの桟体で仕切って単品毎に格納す
るための半導体ウエハの移送機構に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention sends a large number of unprocessed semiconductor wafers individually from a cassette that is separated by a crosspiece and stored in a cassette, or a semiconductor wafer after grinding. The present invention relates to a semiconductor wafer transfer mechanism which is partitioned by a crosspiece of a cassette and is stored individually.
【０００２】[0002]
【従来技術とその問題点】従来、この種の半導体ウエハ
を研削する自動平面研削盤は、多数枚の半導体ウエハを
桟体で仕切って単品毎に送出側カセットへ集積格納して
おり、該送出側カセットは昇降自在なエレベーター台へ
載置されて、該エレベーター台の前方へ配設された送出
側移送ベルト上へエレベーター台の昇降動作によって載
置され、該送出側移送ベルトの駆動によって搬送され、
該送出側移送ベルト上の半導体ウエハは先端に吸着パッ
トを備え反転機能を有する反転アームの前記吸着パット
によって下方より吸着され、送出側反転アームの垂直方
向の枢動によって反転されプリポジション装置の面上へ
載置され、プリポジション装置で正確な位置決めと洗浄
とを液体の噴流によって行ない、先端にバキューム吸着
パットを備えた昇降可能で且つ水平方向に回転可能な送
出側移送アームの正確な軌道によって、自動平面研削盤
のロータリーテーブルへ等分間隔に形設したチャック機
構へ正確に案内され確りとバキューム吸着されて、ロー
タリーテーブルの回転によって次のチャック位置へ移動
し、下端にカップホイール型ダイヤモンド砥石を固定し
たモーターによって自回転し、スピンドル軸が自動降下
して最初の荒研削が開始されるものである。2. Description of the Related Art Conventionally, an automatic surface grinding machine for grinding semiconductor wafers of this type divides a large number of semiconductor wafers with crosspieces and stores them individually in a cassette on the delivery side. The side cassette is placed on an elevator platform that can be raised and lowered, and is placed on the delivery side transfer belt disposed in front of the elevator platform by the elevator base lifting operation, and is conveyed by driving the delivery side transfer belt. ,
The semiconductor wafer on the delivery side transfer belt is attracted from below by the attraction pad of the reversing arm having a suction pad at the tip and having a reversing function, and is inverted by the vertical pivot of the delivery side reversing arm and the surface of the preposition device. It is placed on the top, precise positioning and cleaning are performed by a pre-positioning device by a jet of liquid, and the precise trajectory of a vertically movable and horizontally rotatable delivery-side transfer arm equipped with a vacuum suction pad is provided. Accurately guided to a chuck mechanism that is formed at equal intervals on a rotary table of an automatic surface grinder, and vacuum-adsorbed accurately, the rotary table moves to the next chuck position, and a cup wheel type diamond grindstone at the lower end. It rotates by the motor that fixed the spindle, and the spindle axis automatically descends to perform the first rough grinding. It is intended to be started.
【０００３】次いで、夫々のチャック位置のチャック機
構で所定の研削加工を施され、半導体ウエハは最後のチ
ャック位置に移送された後、先端に吸着パットを備えた
水平方向に回転かつ昇降可能な収納側移送アームで吸着
され洗浄及び乾燥装置へ移送されて、洗浄並びに乾燥後
にバキューム吸着パットを備える格納側反転アームで収
納側移送ベルトに載置され、該格納側移送ベルトの駆動
と、格納側カセットが載置されている格納側エレベータ
ー台の昇降によって、該格納側カセットの桟体へ単品毎
に順次収納される構成である。Next, after a predetermined grinding process is performed by the chuck mechanism at each chuck position and the semiconductor wafer is transferred to the last chuck position, it is equipped with a suction pad at the tip and can be rotated and moved up and down in the horizontal direction. After being adsorbed by the side transfer arm and transferred to the cleaning and drying device, it is placed on the storage side transfer belt by the storage side reversing arm equipped with a vacuum adsorption pad after cleaning and drying, and driving of the storage side transfer belt and the storage side cassette. When the storage-side elevator stand on which is mounted is moved up and down, the storage-side cassette is sequentially stored in the crosspiece of the storage-side cassette.
【０００４】前述の説明は、半導体ウエハが一枚での研
削工程の説明であるが、半導体ウエハが送出側カセット
より送出側移送ベルトを経て、プリポジション装置へ移
送された時には、次の半導体ウエハは送出側カセットよ
り送出側移送ベルトで移送され、前の半導体ウエハがロ
ータリーテーブルのチャック位置へ移送されるのを待機
する等、これらの動作を繰返し連続して行なえる自動送
り出し機構を有する構成であり、ロータリーテーブルに
設けたチャック機構の各々のチャック位置では夫々作業
を同時に連続して行なうものである。The above description is for the grinding process with one semiconductor wafer. However, when the semiconductor wafer is transferred from the cassette on the sending side to the preposition device via the transfer belt on the sending side, the next semiconductor wafer is transferred. Is transferred from the transfer cassette by the transfer belt and waits for the previous semiconductor wafer to be transferred to the chuck position on the rotary table. In each chuck position of the chuck mechanism provided on the rotary table, the work is simultaneously and continuously performed.
【０００５】然し乍ら、前述の構成では夫々のカセット
は一機のみであり、使用中のカセットに収納している半
導体ウエハが送出側では無くなり、又は、格納側で一杯
になるかした場合にタイミング良く人力でカセットの交
換をしなければ成らず、絶えず、人が監視していなけれ
ばならず、手間暇かかる作業となっていた。However, in the above-mentioned configuration, each cassette has only one cassette, and the semiconductor wafers stored in the cassettes in use are exhausted on the delivery side or filled up on the storage side with good timing. The cassettes had to be replaced manually, and people had to constantly monitor them, which was a time-consuming task.
【０００６】その為、近年では作業能率を向上させるた
めに夫々二機のエレベーター台を並設して水平方向に移
動させカセットを交互に交換する自動平面研削盤も開発
されているが、研削加工前の半導体ウエハをカセット内
からプリポジョン装置へ、又、研削加工後の半導体ウエ
ハを洗浄及び乾燥装置よりカセット内へ移送するために
夫々移送用ベルトを設け、一旦、移送用ベルトに載置し
て反転アームで移送しており、複雑な構造と成ってい
た。Therefore, in recent years, in order to improve work efficiency, an automatic surface grinder has been developed in which two elevator stands are installed side by side, moved horizontally and the cassettes are replaced alternately. A transfer belt is provided to transfer the previous semiconductor wafer from the cassette to the pre-positioning device, and to transfer the ground semiconductor wafer from the cleaning and drying device into the cassette, and once placed on the transfer belt. It was transferred by an inversion arm and had a complicated structure.
【０００７】[0007]
【問題点を解決する手段】本発明は、送出側及び搬出側
の夫々のエレベーター台を昇降自在とし、上下方向へ複
数のカセットを載置可能すると共に、枢動して反転可能
な反転機構を備えた反転アームの先端辺へカセットの開
口に挿脱自在に進退する伸縮機構を備えると共に先端へ
は半導体ウエハをバキューム吸着する吸着パットを付設
したことによって、従来必要としていた二機のエレベー
ター台の内の一機と、夫々の移送用ベルトを排除し、前
述の問題点を解決したものである。SUMMARY OF THE INVENTION The present invention provides a reversing mechanism in which elevators on the sending side and the unloading side can be raised and lowered, a plurality of cassettes can be placed in the vertical direction, and can be pivoted and inverted. By equipping the tip side of the provided reversing arm with an expansion / contraction mechanism that moves back and forth in the opening of the cassette so that it can be inserted / removed freely, and by attaching a suction pad for vacuum suction of semiconductor wafers to the tip of The above problem is solved by eliminating one of these machines and each transfer belt.
【０００８】[0008]
【発明の目的】本発明は上記の事由に着目して、鋭意研
鑽の結果、従来複雑化していたカセットからの半導体ウ
エハの送出又は格納する装置、及び、エレベーター台の
近傍の装置を簡素化した自動平面研削盤の移送装置に創
達し、これを供する目的ものである。DISCLOSURE OF THE INVENTION The present invention has focused on the above reasons, and as a result of diligent research, it has simplified the device for delivering or storing semiconductor wafers from a cassette, which has been complicated in the past, and the device in the vicinity of an elevator stand. The purpose of the invention is to provide a transfer device for an automatic surface grinder and to use it.
【０００９】[0009]
【発明の構成】本発明の構成は、エレベーター台の基台
へ螺条孔を貫設し、螺条孔へ回転停止自在なポール螺子
を貫通螺合させ、基台の上方へ平行する載置台を設け、
基台と載置台とにカセットを載置させると共に、夫々の
エレベーター台とプリポジション装置又は洗浄及び乾燥
装置との間へ枢動可能な反転機構を備えた反転アームを
配設し、反転アームの先端辺へカセットの開口へ挿脱自
在に進退する伸縮機構を備え、伸縮機構の先端へ吸着パ
ットを付設させた構成である。The structure of the present invention is such that a screw hole is provided through the base of an elevator base, and a pole screw whose rotation can be stopped is screwed through the screw hole so that the mounting base is parallel to the upper side of the base. Is provided
While mounting the cassette on the base and the mounting table, a reversing arm having a reversing mechanism capable of pivoting between each elevator stand and the preposition device or the cleaning and drying device is provided, and This is a configuration in which an extension / contraction mechanism that moves back and forth to and from the opening of the cassette to and from the tip side is freely attached, and a suction pad is attached to the tip of the extension / contraction mechanism.
【００１０】[0010]
【発明の実施例】斯る目的を達成した本発明の半導体ウ
エハの自動平面研削盤における半導体ウエハの移送機構
を以下実施例の図面によって説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor wafer transfer mechanism in an automatic surface grinding machine for semiconductor wafers according to the present invention which achieves the above object will be described below with reference to the drawings of the embodiments.
【００１１】図１は自動平面研削盤の概要を説明するた
めの概要平面図であり、図２は本発明の要部の説明側面
図であり、図３はその説明平面図である。FIG. 1 is a schematic plan view for explaining the outline of an automatic surface grinder, FIG. 2 is a side view for explaining an essential part of the present invention, and FIG. 3 is a plan view for explaining the same.
【００１２】本発明は、研削加工前の多数枚の半導体ウ
エハＷを単品毎に桟体Ｓで仕切って収納されているカセ
ットＣから単品毎に送出、又は、研削加工後の半導体ウ
エハＷをカセットＣの桟体Ｓで仕切って単品毎に格納す
るため半導体ウエハＷの移送機構に関するものであり、
一側面へ開口Ｋを備えたカセットＣを載置するエレベー
ター台１と、前記カセットＣの送出側及び格納側の夫々
の移送機構において、前記エレベーター台１の平板状の
基台２へ螺条孔３を貫設し、該螺条孔３へ駆動源４と接
続され回転停止自在なポール螺子５を貫通螺合させ、前
記基台２の上方へ間隔を有して平行する載置台６を設
け、前記基台２の上面と載置台６の上面とにはカセット
Ｃの開口Ｋを同一方向にして載置させると共に、前記夫
々のエレベーター台１とプリポジション装置７又は洗浄
及び乾燥装置８との間へ垂直方向に枢動可能な反転機構
１０を備えた反転アーム９を配設し、該反転アーム９の
先端辺へ前記カセットＣの開口Ｋへ挿脱自在に進退する
伸縮機構１１を備え、該伸縮機構１１の先端へ半導体ウ
エハＷをバキューム吸着する吸着パット１２を付設させ
たものである。According to the present invention, a large number of semiconductor wafers W before grinding are individually delivered from a cassette C which is partitioned by a crosspiece S and housed, or semiconductor wafers W after grinding are cassettes. The present invention relates to a transfer mechanism for a semiconductor wafer W, which is partitioned by the crosspiece S of C and stored individually.
In the elevator base 1 on which the cassette C having the opening K on one side is placed, and in the transfer mechanism on each of the sending side and the storage side of the cassette C, a screw hole is formed in the flat base 2 of the elevator base 1. 3 is penetrated, and a rotation stopable pole screw 5 connected to the drive source 4 is screwed through the screw hole 3, and a mounting table 6 is provided above the base 2 with a space in parallel. The opening K of the cassette C is mounted on the upper surface of the base 2 and the upper surface of the mounting table 6 in the same direction, and the elevator base 1 and the preposition device 7 or the cleaning and drying device 8 are mounted. A reversing arm 9 having a reversing mechanism 10 that can pivot in the vertical direction is disposed between the reversing arm 9 and a retracting mechanism 11 that reciprocates in the opening K of the cassette C to and from the tip side of the reversing arm 9. Vacuum the semiconductor wafer W to the tip of the expansion mechanism 11. It is obtained by attaching a suction pad 12 for wear.
【００１３】即ち、本発明は、半導体ウエハＷを自動研
削する平面研削盤Ａにおいて、多数枚の研削加工前の半
導体ウエハＷを単品毎に桟体で仕切って集積格納されて
いる送出側カセットＣから正確な位置決めと洗浄とを行
なうプリポジション装置７へ移送する機構、又は、洗浄
及び乾燥装置８へ移送された研削加工後の半導体ウエハ
Ｗを単品毎に桟体で仕切って集積格納する格納側カセッ
トＣへ移送する機構の簡素化を図るものである。That is, according to the present invention, in a surface grinder A for automatically grinding a semiconductor wafer W, a delivery-side cassette C in which a large number of unground semiconductor wafers W are individually stored by partitioning each piece by a crosspiece. A mechanism for transferring from the wafer to the pre-positioning device 7 that performs accurate positioning and cleaning, or a storage side that stores the ground semiconductor wafers W that have been transferred to the cleaning and drying device 8 by dividing the individual semiconductor wafers by a crosspiece for storage. The mechanism for transferring to the cassette C is simplified.
【００１４】前記夫々のカセットＣは研削加工前又は研
削加工後の多数枚の半導体ウエハＷを桟体Ｓで仕切って
単品毎に収納されている又は収納するものであり、該桟
体Ｓは半導体ウエハＷの外周辺を支持して載置させ、中
心辺を切欠いたものであり、夫々のカセットＣの一側面
は半導体ウエハＷを出し入れするための開口Ｋを設けて
いるものである。Each of the cassettes C is a container in which a large number of semiconductor wafers W before or after the grinding process are divided by a crosspiece S to be housed or housed individually. The crosspiece S is a semiconductor. The outer periphery of the wafer W is supported and placed, and the central side is cut out, and one side surface of each cassette C is provided with an opening K for taking in and out the semiconductor wafer W.
【００１５】前記カセットＣを載置する送出側及び格納
側夫々のエレベーター台１は、平板状の基台２へ螺条孔
３を貫設し、該螺条孔３へモーター等の駆動源４と機械
的に接続され回転停止自在なポール螺子５を貫通螺合さ
せ昇降可能とするもので、前記基台２の上方へ間隔を有
して平行させて設ける載置台６は、前記基台２へ複数の
杆体を立設させて一体的に間隔を有し且つ平行に形成し
ても、別体の平板状の載置台６を前記ポール螺子５へ担
持させて設けても構わないものであり、前記基台２の上
面と載置台６の上面とにはカセットＣの開口Ｋを夫々同
一方向に向けて載置させ、該エレベーター台１は回転停
止自在なポール螺子５によって自在に昇降停止するもの
である。The elevator bases 1 on the sending side and the storage side on which the cassette C is placed respectively have a flat plate-shaped base 2 with a screw hole 3 penetrating through the screw hole 3 and a drive source 4 such as a motor. A pole screw 5 which is mechanically connected to and is rotatable with respect to which it can be raised and lowered by being screwed therethrough. The mounting table 6 provided in parallel above the base 2 with a space is the base 2. A plurality of rods may be provided upright to be integrally formed with a space and parallel to each other, or a separate flat plate-shaped mounting table 6 may be supported by the pole screw 5. The openings K of the cassette C are placed on the upper surface of the base 2 and the upper surface of the mounting table 6 in the same direction, and the elevator base 1 is freely stopped up and down by a pawl screw 5 which is freely rotatable. It is a thing.
【００１６】そして、夫々のエレベーター台１とプリポ
ジション装置７又は洗浄及び乾燥装置８との間へ反転ア
ーム９を立設させたもので、該反転アーム９の先端部を
垂直方向に枢動させて反転可能にさせるために基端側は
垂直軸を立設させ、該垂直軸の上方部と水平軸の基端部
とを枢動自在としたジョイントで接続した反転機構１０
を備えると共に、前記反転アーム９の先端部は入れ子式
で前記カセットＣの開口Ｋへ挿脱自在に進退する伸縮機
構１１を備え、該伸縮機構１１の先端へ半導体ウエハＷ
をバキューム吸着する吸着パット１２を付設したもの
で、前記反転アーム９は半導体ウエハＷをバキューム吸
着させるために中空軸として真空ポンプに連通している
ものである。A reversing arm 9 is erected between each elevator stand 1 and the preposition device 7 or the cleaning and drying device 8, and the tip of the reversing arm 9 is vertically pivoted. Inverting mechanism 10 in which a vertical shaft is erected on the base end side so as to be reversible, and an upper part of the vertical shaft and a base end part of the horizontal shaft are connected by a pivotable joint.
In addition, the tip end of the reversing arm 9 is provided with a telescopic mechanism 11 that is telescopically inserted and retracted into and from the opening K of the cassette C. The semiconductor wafer W is attached to the tip of the telescopic mechanism 11.
Is attached with a suction pad 12 for vacuum suction, and the reversing arm 9 communicates with a vacuum pump as a hollow shaft for vacuum suction of the semiconductor wafer W.
【００１７】つまり、送出側カセットＣへ収納されてい
る半導体ウエハＷはエレベーター台１の昇降によって適
宜な位置で停止し、反転アーム９の先端部に付設した吸
着パット１２を伸縮機構１１の進退によってカセットＣ
内の半導体ウエハＷの下面の中心辺へ伸長移動させ、下
方より吸着パット１２で半導体ウエハＷをバキューム吸
着し、伸縮機構１１によって伸長させた状態から短縮さ
せた状態となり反転機構１０で反転させることによっ
て、プリポジション装置７の上面へ移送し吸着パット１
２のバキューム吸着を開放することによって、該プリポ
ジション装置７の上に載置されるものである。That is, the semiconductor wafer W stored in the delivery side cassette C is stopped at an appropriate position by raising and lowering the elevator base 1, and the suction pad 12 attached to the tip end portion of the reversing arm 9 is moved forward and backward by the retracting mechanism 11. Cassette C
The semiconductor wafer W is extended and moved to the center side of the lower surface of the inside, and the semiconductor wafer W is vacuum-sucked by the suction pad 12 from below, and the state in which the semiconductor wafer W is extended by the expansion mechanism 11 is shortened and is inverted by the inversion mechanism 10. And transfer it to the upper surface of the pre-positioning device 7 by the suction pad 1
It is placed on the preposition device 7 by releasing the vacuum suction of No. 2.
【００１８】一方、格納側カセットＣでは前記動作の逆
と成り、研削加工後の半導体ウエハＷは洗浄及び乾燥装
置８の上に載置されており、該半導体ウエハＷを上方か
ら吸着パット１２で吸着し、反転機構１０で半導体ウエ
ハＷを反転させて伸縮機構１１を伸長状態とさせること
によって、適宜位置で待機しているエレベーター台１に
載置されたカセットＣの桟体Ｓの間へ移送し、バキュー
ム吸着を開放することによって格納するもので、前記動
作を夫々繰り返すことによってカセットＣからの送出、
又は、カセットＣへの格納ができるものである。On the other hand, in the cassette C on the storage side, the above operation is reversed, and the semiconductor wafer W after the grinding process is placed on the cleaning and drying device 8, and the semiconductor wafer W is attached from above by the suction pad 12. By sucking and reversing the semiconductor wafer W by the reversing mechanism 10 to make the expansion / contraction mechanism 11 in the extended state, the semiconductor wafer W is transferred between the crosspieces S of the cassette C placed on the elevator stand 1 waiting at an appropriate position. Then, it is stored by opening the vacuum suction, and is sent from the cassette C by repeating the above operation.
Alternatively, it can be stored in the cassette C.
【００１９】夫々のカセットＣは順次工程を完了すると
人力又は自動的に交換され、満杯になったカセットＣ又
は空となったカセットＣは別のカセットＣと交換するも
のである。Each of the cassettes C is replaced manually or automatically when the steps are completed, and the full cassette C or the empty cassette C is replaced with another cassette C.
【００２０】[0020]
【発明の効果】本発明は、前述の構成によって、従来の
機能を損なわず、従来必要としていた移送用ベルトと二
機のエレベーター台の内の一機を排除したもので、簡素
化し製造工程を容易化し、廉価に提供できるものであ
り、且つ、画期的でその貢献度は計りしれないものがあ
る極めて有意義な効果を奏するものである。As described above, the present invention does not impair the conventional functions and eliminates the transfer belt and one of the two elevator stands, which have been conventionally required, by the structure described above. It can be provided easily and at a low price, and it has an extremely significant effect that is epoch-making and its contribution is immeasurable.
【００２１】[0021]
【図１】図１は自動平面研削盤を概要を説明するための
概要平面図である。FIG. 1 is a schematic plan view for explaining the outline of an automatic surface grinder.
【図２】図２は本発明の要部の説明側面図である。FIG. 2 is an explanatory side view of an essential part of the present invention.
【図３】図３はその説明平面図である。FIG. 3 is an explanatory plan view thereof.
【００２４】[0024]
【符号の説明】 Ａ 平面自動研削盤 Ｗ 半導体ウエハ Ｃ カセット Ｓ 桟体 Ｋ 開口 １ エレベーター台 ２ 基台 ３ 螺条孔 ４ 駆動源 ５ ポール螺子 ６ 載置台 ７ プリポジション装置 ８ 洗浄及び乾燥装置 ９ 反転アーム １０ 反転機構 １１ 伸縮機構 １２ 吸着パット[Explanation of symbols] A Surface automatic grinding machine W Semiconductor wafer C Cassette S Bar body K Opening 1 Elevator stand 2 Base stand 3 Screw hole 4 Drive source 5 Pole screw 6 Mounting table 7 Prepositioning device 8 Cleaning and drying device 9 Inversion Arm 10 Inversion mechanism 11 Expansion / contraction mechanism 12 Suction pad
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/68 Ｂ 8418−4Ｍ Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01L 21/68 B 8418-4M
Claims (1)
って多数枚の半導体ウエハを単品毎に収納したカセット
を載置するエレベーター台と、前記カセットから半導体
ウエハを送出又はカセットへ半導体ウエハを格納する反
転アームとを備えた送出側及び格納側の夫々の移送機構
において、 前記エレベーター台の平板状の基台へ螺条孔を貫設し、
該螺条孔へ駆動源と接続され回転停止自在なポール螺子
を貫通螺合させ、前記基台の上方へ間隔を有して平行す
る載置台を設け、前記基台の上面と載置台の上面とには
カセットの開口を同一方向に向けて載置させると共に、
前記夫々のエレベーター台とプリポジション装置又は洗
浄及び乾燥装置との間へ垂直方向に枢動可能な反転機構
を備えた反転アームを配設し、該反転アームの先端辺へ
前記カセットの開口へ挿脱自在に進退する伸縮機構を備
え、該伸縮機構の先端へは半導体ウエハをバキューム吸
着する吸着パットを付設させたことを特徴とする半導体
ウエハの移送機構。1. An elevator stand having an opening on one side and partitioning the interior with a crosspiece to accommodate a cassette containing a large number of semiconductor wafers individually, and a semiconductor wafer sent from the cassette or a semiconductor to the cassette. In each of the sending side and the storing side transfer mechanism including a reversing arm for storing a wafer, a screw hole is provided through a flat base of the elevator base,
A mounting table that is connected to a drive source and is rotatable in a stoppable manner is passed through the screw hole, and a parallel mounting table is provided above the base with a space therebetween. The upper surface of the base and the upper surface of the mounting table are parallel to each other. And put the cassette opening in the same direction,
A reversing arm having a reversing mechanism capable of pivoting in a vertical direction is provided between each of the elevator stands and the preposition device or the cleaning and drying device, and the tip end side of the reversing arm is inserted into the opening of the cassette. A semiconductor wafer transfer mechanism comprising a retractable mechanism that releasably moves forward and backward, and a suction pad that vacuum-sucks a semiconductor wafer is attached to the tip of the retractable mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28201491A JPH0680212A (en) | 1991-10-03 | 1991-10-03 | Moving mechanism for semi-conductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28201491A JPH0680212A (en) | 1991-10-03 | 1991-10-03 | Moving mechanism for semi-conductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0680212A true JPH0680212A (en) | 1994-03-22 |
Family
ID=17647033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28201491A Pending JPH0680212A (en) | 1991-10-03 | 1991-10-03 | Moving mechanism for semi-conductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680212A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112224851A (en) * | 2020-09-27 | 2021-01-15 | 苏州富强科技有限公司 | Workpiece feeding, discharging and standing device |
| KR20220012745A (en) * | 2020-07-23 | 2022-02-04 | 주식회사 로보스타 | Telescopic arm robot |
-
1991
- 1991-10-03 JP JP28201491A patent/JPH0680212A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220012745A (en) * | 2020-07-23 | 2022-02-04 | 주식회사 로보스타 | Telescopic arm robot |
| CN112224851A (en) * | 2020-09-27 | 2021-01-15 | 苏州富强科技有限公司 | Workpiece feeding, discharging and standing device |
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