JPH0679195U - Radiator - Google Patents

Radiator

Info

Publication number
JPH0679195U
JPH0679195U JP1870093U JP1870093U JPH0679195U JP H0679195 U JPH0679195 U JP H0679195U JP 1870093 U JP1870093 U JP 1870093U JP 1870093 U JP1870093 U JP 1870093U JP H0679195 U JPH0679195 U JP H0679195U
Authority
JP
Japan
Prior art keywords
nut
circuit board
heat
fixing
screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1870093U
Other languages
Japanese (ja)
Inventor
和彦 清水
正雄 森川
Original Assignee
菊水電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 菊水電子工業株式会社 filed Critical 菊水電子工業株式会社
Priority to JP1870093U priority Critical patent/JPH0679195U/en
Publication of JPH0679195U publication Critical patent/JPH0679195U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】 【目的】 回路基板等の取付け対象となる被放熱体の取
付け条件に応じてその固定位置を自在に設定することが
でき、しかも取付けにかかわるコストの低減を図ること
のできる放熱器を提供する。 【構成】 押出し成形時に成形面(10A)に沿って開
口スリット(11A)と共に押出し方向に形成された固
定溝(11)を有し、これにねじ部材(14)の頭部
(14B)またはナット部材(12,13)を挿入した
上、対応するナットまたは固定ねじ(3)をスリット
(11A)を介して螺合することにより前記成形面(1
0A)に被放熱体(回路基板2)を固定させるようにし
た放熱器(10)。
(57) [Abstract] [Purpose] The fixing position of the heat sink to be mounted on a circuit board or the like can be freely set according to the mounting conditions, and the cost for mounting can be reduced. Provide a radiator. [Structure] A fixing groove (11) is formed along with a slit (11A) along a molding surface (10A) during extrusion molding in the extrusion direction, and a head (14B) or a nut of a screw member (14) or a nut is provided therein. The molding surface (1
A radiator (10) adapted to fix the heat-dissipating body (circuit board 2) to 0A).

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、放熱器に関し、特に電子回路の電源として使用される直流あるいは 交流の安定化電源等に組込んで使用されるに好適な放熱器(以下でヒートシンク という)に関する。 The present invention relates to a radiator, and more particularly to a radiator (hereinafter referred to as a heat sink) suitable for being incorporated in a stabilized DC or AC power source used as a power source for an electronic circuit.

【0002】[0002]

【従来の技術】[Prior art]

近年のメカトロニクスにかかわる電子機器にはその構成部品として温度変化に 敏感な半導体素子や熱変化を起こし易い高分子材料等が多用されており、温度が 高くなり過ぎると素子の破壊、寿命の低下等により性能低下や故障多発の要因に なり易い。上記の安定化電源においても、負荷の変動がもたらす周囲温度の変化 等にかかわらず一定の電圧・電流が供給されるようにするために、トランジスタ 等多くの半導体素子がその安定化回路に組込まれている。そして、このような半 導体素子の接合部では特に大量の高熱が発生するのでその放熱をする必要があり 、例えばその回路基板をヒートシンクに保持させるようにして、回路基板からヒ ートシンクを介して冷却が行われるようにしている。 In recent years, electronic devices related to mechatronics often use semiconductor elements that are sensitive to temperature changes and polymer materials that are susceptible to thermal changes as their components.If the temperature becomes too high, the elements will break down and their life will decrease. Therefore, it is likely to cause performance deterioration and frequent failures. Even in the above stabilized power supply, many semiconductor elements such as transistors are incorporated in the stabilization circuit in order to supply constant voltage and current regardless of changes in ambient temperature caused by load fluctuations. ing. A particularly large amount of high heat is generated at the junction of such semiconductor elements, so it is necessary to radiate the heat.For example, by holding the circuit board on a heat sink, cooling it from the circuit board via a heat sink. Is being done.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら、上記のようなこれまでの例えば空冷型ヒートシンクでは、その 本体が一般にアルミニウム等の押出し成形により図3に示すように放熱し易い櫛 歯型に形成されていて、ヒートシンク1本体の平坦な成形面1Aの一部に放熱の 対象となる例えば回路基板2をねじ3によって固定するようにしている。そのた めに、成形面1Aおよび回路基板2双方の対応する位置にねじ孔1Bおよび固定 孔2Bを穿設しなければならず、これらのねじ孔設定位置が規制されるばかりで なく、孔明けおよび取付のために工数がかかる。 However, in the conventional air-cooled heat sink as described above, its main body is generally formed by extrusion molding of aluminum or the like into a comb shape as shown in FIG. For example, a circuit board 2 which is a target of heat radiation is fixed to a part of the surface 1A by screws 3. Therefore, the screw holes 1B and the fixing holes 2B must be formed at the corresponding positions on both the molding surface 1A and the circuit board 2, and not only the screw hole setting positions are regulated, but also the holes are opened. And it takes man-hours for mounting.

【0004】 本考案の目的は、上述したような従来の問題に着目し、その解決を図るべく、 回路基板等取付けの対象となる被放熱体の取付条件に応じてその固定位置を自在 に設定することができ、しかもその固定にかかわる溝を押出し成形時に容易に形 成することにより取付けを含め全体のコスト低減を図ることのできる放熱器を提 供することにある。The object of the present invention is to pay attention to the above-mentioned conventional problems, and in order to solve the problems, the fixing position can be freely set according to the mounting conditions of the heat-radiating body to be mounted such as a circuit board. The purpose of the present invention is to provide a radiator that can be manufactured and the cost related to its fixing can be reduced by easily forming the groove during extrusion molding.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

かかる目的を達成するために、本考案は、押出し成形時に成形面に沿って前記 押出し方向に形成され、前記成形面に前記押出し方向のスリットを開口させた固 定溝を有し、該固定溝にねじ部材の頭部またはナット部材を挿入自在となして、 前記ねじ部材に対応するナットまたは前記ナット部材に対応する固定ねじを前記 スリットを介して前記固定溝に挿入したねじ部材のねじ部またはナット部材に螺 合させることにより被放熱体を前記成形面に固定させるようにしたことを特徴と するものである。 In order to achieve such an object, the present invention has a fixed groove formed in the extrusion direction along a molding surface during extrusion molding and having a fixed groove in which a slit in the extrusion direction is opened in the molding surface. The head of the screw member or the nut member can be inserted into the screw member, and the nut corresponding to the screw member or the fixing screw corresponding to the nut member is inserted into the fixing groove through the slit. The heat-dissipating member is fixed to the molding surface by being screwed into a nut member.

【0006】[0006]

【作用】[Action]

本考案によれば、固定溝にねじ部材の頭部またはナット部材を挿入し、スリッ トを介して前記ねじ部材のねじに外部からナットを螺合するか若しくは前記ナッ ト部材に外部から固定ねじを螺合することにより、これらの固定手段によって被 放熱体を放熱器の1つの成形面に固定することができ、従来のように放熱体の固 定のためにその固定される成形面に被放熱体固定孔に合わせてねじ孔を設けたり する必要がない。 According to the present invention, the head of the screw member or the nut member is inserted into the fixing groove, and the nut of the screw member is externally screwed through the slit, or the nut member is fixed to the nut member from the outside. The heat-dissipating member can be fixed to one molding surface of the radiator by these fixing means by screwing, and the heat-dissipating member is fixed to the molding surface to be fixed for fixing the heat-dissipating member as in the conventional case. It is not necessary to provide a screw hole in accordance with the radiator fixing hole.

【0007】[0007]

【実施例】【Example】

以下に、図面を参照しつつ本考案の実施例を具体的に説明する。 Embodiments of the present invention will be specifically described below with reference to the drawings.

【0008】 図1は本考案の一実施例を示す。ここで、10は本考案にかかる放熱器(ヒー トシンク)であり、例えばアルミニウムなどの押出し成形によって一体成形され る。10Aはヒートシンク10の成形時に形成される回路基板取付面、10Cは 放熱器10の長手方向に形成された櫛歯形の放熱面であり、11は回路基板取付 面10Aの長手方向に沿って形成した断面がほぼ方形をなす溝(以下で固定溝と いう)である。また、固定溝11には回路基板取付面10Aに開口する切溝(以 下でスリットという)11Aが形成されていて、スリット11Aの幅は固定溝1 1の同方向の幅より十分狭くしてある。なお、固定溝11およびスリット11A はヒートシンク10の成形時に放熱面10Cに形成される長手方向の櫛歯形の放 熱フィン10Bと共に同時成形されるものである。FIG. 1 shows an embodiment of the present invention. Here, 10 is a radiator (heat sink) according to the present invention, which is integrally formed by extrusion molding of aluminum or the like. 10A is a circuit board mounting surface formed when the heat sink 10 is molded, 10C is a comb-shaped heat dissipating surface formed in the longitudinal direction of the radiator 10, and 11 is formed along the longitudinal direction of the circuit board mounting surface 10A. It is a groove whose cross section is almost square (hereinafter referred to as a fixed groove). Further, the fixed groove 11 is formed with a cut groove (hereinafter referred to as a slit) 11A opening to the circuit board mounting surface 10A, and the width of the slit 11A is made sufficiently narrower than the width of the fixed groove 11 in the same direction. is there. The fixing groove 11 and the slit 11A are formed at the same time as the comb-shaped heat radiation fins 10B in the longitudinal direction formed on the heat dissipation surface 10C when the heat sink 10 is formed.

【0009】 このように構成した空冷型のヒートシンク10ではその回路基板取付面10A に例えば図3によって示したと同様な回路基板2を取付けるにあたり、放熱器1 0の両端部に開口する固定溝11の開口端部からばね性を有するクリップナット 12または固定溝11に挿入自在な断面形状に形成されたプレート型のナット1 3をまず挿入する。そして、これらのナット12または13に穿設されているね じ孔12Aまたは13Aの位置を回路基板2側の固定孔2Bの位置に合わせるよ うにした上、回路基板2の固定孔2Bに差込んだねじ3のねじ部3Aを切溝11 Aから固定溝11に挿入したナット12のねじ孔12Aまたはナット13のねじ 孔13Aに螺締するだけでよい。このように、回路基板2側の固定孔2Bがどの 位置に穿設されていようともナット12や13の位置をそれに対応して固定溝1 1中で自在に位置決めすることができる。In the air-cooled heat sink 10 having the above-described structure, when mounting the circuit board 2 similar to that shown in FIG. 3 on the circuit board mounting surface 10 A, for example, the fixing grooves 11 opened at both ends of the radiator 10 are provided. First, a plate-type nut 13 having a cross-sectional shape that can be inserted into the clip nut 12 having springiness or the fixing groove 11 from the opening end is inserted. Then, the positions of the screw holes 12A or 13A formed in the nuts 12 or 13 are aligned with the positions of the fixing holes 2B on the circuit board 2 side, and then inserted into the fixing holes 2B of the circuit board 2. It is only necessary to screw the threaded portion 3A of the external screw 3 into the threaded hole 12A of the nut 12 or the threaded hole 13A of the nut 13 inserted into the fixed groove 11 from the cut groove 11A. In this way, the positions of the nuts 12 and 13 can be freely positioned in the fixing groove 11 in correspondence with the positions of the fixing holes 2B on the circuit board 2 side.

【0010】 図2は本考案の他の実施例を示す。本例は、固定溝11の断面形状を、例えば その両端の開口端部からクリップナット12やプレート型ナット13を挿入した ときに押込み易く、かつ固定溝11内でがたついて姿勢が定まらなかったりする ことのないように凸字型等に形成したものである。なお、図1や図2に示した固 定溝11にナット類にかえて、14として示したような頭部14Bを有するボル ト部材を挿入するようにしてもよい。この場合、そのねじ部14Aをスリット1 1Aを介して外部に突出させる状態に保った上、回路基板2側の固定孔2Bを上 記のねじ部14Aに嵌め合わせ、ナット(不図示)を螺着して基板2を回路基板 取付面10Aに固定することができる。FIG. 2 shows another embodiment of the present invention. In this example, the cross-sectional shape of the fixing groove 11 is easy to push in when the clip nut 12 or the plate type nut 13 is inserted from the open end portions of both ends thereof, and the posture is unstable due to rattling in the fixing groove 11. It is formed in a convex shape so that it will not occur. It should be noted that a bolt member having a head portion 14B shown as 14 may be inserted into the fixing groove 11 shown in FIGS. 1 and 2 instead of the nuts. In this case, the threaded portion 14A is kept in a state of being projected to the outside through the slit 11A, the fixing hole 2B on the circuit board 2 side is fitted into the threaded portion 14A, and a nut (not shown) is screwed. The circuit board 2 can be attached to fix the circuit board 2 to the circuit board mounting surface 10A.

【0011】 以上に述べたような構成によるヒートシンク10では、熱伝導率の良いアルミ ニウム等でその放熱面10Cが放熱し易いように櫛歯型に形成されていることで 、温度が高まり易い回路基板2等の被放熱体から伝達された熱を効率良く放熱す ることができる。なお、本例では、回路基板2の取付面10Aおよび固定溝11 をヒートシンク10の側面に形成したが、かかる取付面10Aおよびその取付面 10A側に形成される固定溝11の形成位置としては上記のような側面に限られ るものではない。また、ヒートシンク10の形状、特にそのフィン10Bが形成 される放熱面10Cとしても図1や図2に示した形状に限られるものではない。 さらにまた、固定溝11およびスリット11Aはヒートシンク10の押出し成形 時にフィン10Bと同方向に同時成形される限りヒートシンク10の配置や形状 に応じて適切に形成することができる。In the heat sink 10 having the above-described configuration, the heat dissipation surface 10C is formed in a comb shape so as to easily dissipate heat with aluminum or the like having a high thermal conductivity, so that the temperature easily rises. It is possible to efficiently dissipate the heat transmitted from the body to be radiated such as the substrate 2. In this example, the mounting surface 10A and the fixing groove 11 of the circuit board 2 are formed on the side surface of the heat sink 10. However, the positions of the mounting surface 10A and the fixing groove 11 formed on the mounting surface 10A side are as described above. It is not limited to such aspects. Further, the shape of the heat sink 10, especially the heat radiation surface 10C on which the fins 10B are formed is not limited to the shape shown in FIGS. Furthermore, the fixing groove 11 and the slit 11A can be appropriately formed according to the arrangement and shape of the heat sink 10 as long as they are simultaneously formed in the same direction as the fin 10B when the heat sink 10 is extruded.

【0012】 さらにまた、本考案は強制冷却あるいは自然冷却のためのヒートシンクに限ら ず、例えば水冷,蒸発冷却の外、ヒートパイプ形態のものに対しても適用可能で あり、放熱器自体が押出し成形で形成され、また放熱器に冷却のために基板等の 被放熱体が直接固定される形態のものに広く適用できることはいうまでもない。Furthermore, the present invention is not limited to a heat sink for forced cooling or natural cooling, but can be applied not only to water cooling, evaporative cooling, but also to a heat pipe type, and the radiator itself is extruded and molded. It is needless to say that the present invention can be widely applied to a structure in which a heat-dissipating body such as a substrate is directly fixed to the radiator for cooling.

【0013】[0013]

【考案の効果】[Effect of device]

以上説明してきたように、本考案によれば、押出し成形時に成形面に沿って前 記押出し方向に形成され、前記成形面に前記押出し方向のスリットを開口させた 固定溝を有し、該固定溝にねじ部材の頭部またはナット部材を挿入自在となして 、前記ねじ部材に対応するナットまたは前記ナット部材に対応する固定ねじを前 記スリットを介して前記固定溝に挿入したねじ部材のねじ部またはナット部材に 螺合させることにより被放熱体を前記成形面に固定させるようにしたので、放熱 器に基板等の冷却対象物を取り付けるためのねじ孔加工の必要がなく、しかもそ の取付けが容易となり、コスト低減に貢献する。 As described above, according to the present invention, there is a fixing groove formed in the above-mentioned extrusion direction along the molding surface at the time of extrusion molding, and having the fixing groove having the slit in the extrusion direction opened on the molding surface. The head of the screw member or the nut member can be inserted into the groove so that the nut corresponding to the screw member or the fixing screw corresponding to the nut member is inserted into the fixing groove through the slit. Since the heat-dissipating body is fixed to the molding surface by screwing it onto the heat-dissipating part or nut member, there is no need to machine a screw hole to attach a cooling object such as a board to the heat-dissipator. Facilitates and contributes to cost reduction.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案放熱器の構成の一例を示す斜視図であ
る。
FIG. 1 is a perspective view showing an example of the structure of a radiator according to the present invention.

【図2】本考案の他の実施例の構成を示す斜視図であ
る。
FIG. 2 is a perspective view showing the configuration of another embodiment of the present invention.

【図3】従来例の構成を示す斜視図である。FIG. 3 is a perspective view showing a configuration of a conventional example.

【符号の説明】[Explanation of symbols]

2 回路基板 2B 固定孔 3 ねじ 10 放熱器(ヒートシンク) 10A 回路基板取付面 10B 放熱フィン 10C 放熱面 11 固定溝 11A スリット 12 クリップナット 12A,13A ねじ孔 13 プレート(型)ナット 14 ボルト部材 14A ねじ部 14B 頭部 2 Circuit board 2B Fixing hole 3 Screw 10 Radiator (heat sink) 10A Circuit board mounting surface 10B Radiating fin 10C Radiating surface 11 Fixing groove 11A Slit 12 Clip nut 12A, 13A Screw hole 13 Plate (mold) nut 14 Bolt member 14A Screw part 14B head

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 押出し成形時に成形面に沿って前記押出
し方向に形成され、前記成形面に前記押出し方向のスリ
ットを開口させた固定溝を有し、 該固定溝にねじ部材の頭部またはナット部材を挿入自在
となして、前記ねじ部材に対応するナットまたは前記ナ
ット部材に対応する固定ねじを前記スリットを介して前
記固定溝に挿入したねじ部材のねじ部またはナット部材
に螺合させることにより被放熱体を前記成形面に固定さ
せるようにしたことを特徴とする放熱器。
1. An extrusion groove formed along the molding surface in the extrusion direction, the molding surface having a fixing groove having an opening in the extrusion direction, and the fixing groove having a head portion or a nut of a screw member. By making the member insertable, by screwing a nut corresponding to the screw member or a fixing screw corresponding to the nut member to a screw portion or a nut member of the screw member inserted into the fixing groove through the slit. A radiator characterized in that a body to be radiated is fixed to the molding surface.
JP1870093U 1993-04-13 1993-04-13 Radiator Pending JPH0679195U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1870093U JPH0679195U (en) 1993-04-13 1993-04-13 Radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1870093U JPH0679195U (en) 1993-04-13 1993-04-13 Radiator

Publications (1)

Publication Number Publication Date
JPH0679195U true JPH0679195U (en) 1994-11-04

Family

ID=11978916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1870093U Pending JPH0679195U (en) 1993-04-13 1993-04-13 Radiator

Country Status (1)

Country Link
JP (1) JPH0679195U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015153901A (en) * 2014-02-14 2015-08-24 三洋テクノソリューションズ鳥取株式会社 Heat sink and electric device including the same
JP2019106459A (en) * 2017-12-12 2019-06-27 株式会社ケーヒン Electronic control device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0260288B2 (en) * 1983-03-15 1990-12-14 Iseki Agricult Mach

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0260288B2 (en) * 1983-03-15 1990-12-14 Iseki Agricult Mach

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015153901A (en) * 2014-02-14 2015-08-24 三洋テクノソリューションズ鳥取株式会社 Heat sink and electric device including the same
JP2019106459A (en) * 2017-12-12 2019-06-27 株式会社ケーヒン Electronic control device

Similar Documents

Publication Publication Date Title
US7898806B2 (en) Motor controller
JP4936021B2 (en) Motor control device
US20090120613A1 (en) Heat sink
JP3066726B2 (en) Mounting structure of semiconductor device
JPH0679195U (en) Radiator
JP2004146627A (en) Heat radiation structure of heater part
US6062300A (en) Evenly heat-dissipating apparatus
JPH0343751Y2 (en)
JPH0334916Y2 (en)
KR200364215Y1 (en) A aluminum radiator of a car sound amplifier
JP3098236U (en) Heat sink mounting structure for electronic circuit elements
JPH054309Y2 (en)
KR20010107096A (en) The cooling method and device of heat protect board for eiectronic machine
JP2002118216A (en) Electronic cooling device
JP2539719Y2 (en) Heating element mounting structure
JPH0412683Y2 (en)
JP4882108B2 (en) PCB heat dissipation structure
JP3953211B2 (en) Heat dissipation structure for electronic elements
JP2021158864A (en) Servo driver, heat dissipation device structure of the same, and heat dissipation structure
KR0121819Y1 (en) A heat-emitting device of regulators of ac generators
JPH0333077Y2 (en)
JP2595054Y2 (en) Radiator for electronic control unit
JPH0744071Y2 (en) Board mounting structure to heat sink
JPH06338576A (en) Heat sink
JP2002164483A (en) Cooling system