JPH0660930A - Anisotropic conductive connector and manufacture thereof - Google Patents
Anisotropic conductive connector and manufacture thereofInfo
- Publication number
- JPH0660930A JPH0660930A JP22647492A JP22647492A JPH0660930A JP H0660930 A JPH0660930 A JP H0660930A JP 22647492 A JP22647492 A JP 22647492A JP 22647492 A JP22647492 A JP 22647492A JP H0660930 A JPH0660930 A JP H0660930A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- resin sheet
- holes
- conductive paste
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ＩＣメモリカード用
コネクター、液晶パネル用接点、ＬＳＩの表面実装等電
子デバイスを電気的に接続するための異方導電性コネク
ター及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive connector for electrically connecting electronic devices such as IC memory card connectors, liquid crystal panel contacts, and LSI surface mounting.
【０００２】[0002]
【従来の技術】異方導電性コネクターは、シートの厚さ
方向に良好な導電性を有し、シートの厚さ方向に直交す
る方向には絶縁を保つものである。このような異方導電
性コネクターは、導電性繊維を微細なピッチで整列させ
て型内に設置し、その中にシリコーンゴム等を注型して
ブロックを成形し、これを導電性繊維に対して直角に切
断し、一定の厚さにして製造する方法及びその製造され
たものが知られている。あるいは、金属箔をエッチング
して微細な導電性平行線を得、樹脂シートと積層接着
し、これを導電性平行線に対して直角に切断して一定の
厚さにする製造方法及びその製造されたものも知られて
いる。さらに、導電性繊維と絶縁繊維の織物を作り、樹
脂シートと積層，接着し、これを導電性繊維に対して直
角に切断し一定の厚さにする製造方法及びその製造され
たものも知られている。さらにまた導電性繊維を所定の
長さに短く切り、全表面を金メッキしたものをシリコー
ンゴム等を金型に注型した中で所定方向に配向させて硬
化させ、必要な幅に切断する方法及びその方法により得
られたものも知られている。2. Description of the Related Art An anisotropic conductive connector has good conductivity in the thickness direction of a sheet and maintains insulation in a direction orthogonal to the thickness direction of the sheet. Such an anisotropically conductive connector has conductive fibers aligned at a fine pitch and placed in a mold, and a silicone rubber or the like is cast into the block to form a block. There is known a method for producing a uniform thickness by cutting at a right angle and a product produced by the method. Alternatively, a method for producing a fine conductive parallel line by etching a metal foil, laminating and adhering it to a resin sheet, and cutting this at a right angle to the conductive parallel line to have a certain thickness, and a method for producing the same Some are known. Further, a manufacturing method of manufacturing a woven fabric of conductive fibers and insulating fibers, laminating and adhering it to a resin sheet, cutting the woven fabric at a right angle with respect to the conductive fibers to have a certain thickness, and a manufactured product thereof are also known. ing. Furthermore, a method in which conductive fibers are cut into a predetermined length, gold-plated on the entire surface, is oriented in a predetermined direction in a mold in which silicone rubber or the like is cast, and cured, and cut into a required width, and Those obtained by that method are also known.
【０００３】[0003]
【発明が解決しようとする課題】従来の、導電性コンパ
ウンド，導電性繊維または金属箔からなる微細に整列さ
れた平行線に対して直角に切断する際、それらの導電体
が抜けて接点としての信頼性が欠けたり、切断面の平滑
性が不充分なため、研磨し、さらにはメッキ処理等を施
し、接触抵抗を小さくし、長期的な信頼性を確保しよう
としていたが、複雑な工程となりコスト高になってい
た。特にＩＣメモリカード用コネクターとしては、接点
接触の確実性を確保するために、コネクターに剪断力を
加えてピンを横から挿入し、コネクターの厚み方向に適
度に圧縮され、適度な挿抜抵抗のある構造である必要が
あるが、繰り返しの挿抜、例えば１〜１０万回以上に耐
える耐久性が必要である。また、電子スチルカメラ等屋
外用途へのＩＣメモリカードの適用が進む中で、上述し
たような繰り返し耐久性に加えて、外気温度，湿度の影
響を受けない素材の選択と、外気と塵をＩＣメモリカー
ド内部に導かないようにピンを抜いた状態ではコネクタ
ーが対向して置かれるゴム状物質と接触し、密閉される
必要もある。そのためには、初期の接触抵抗の確保と合
せて、耐候性，耐熱性，耐湿性に優れた樹脂及び導電体
の素材と形状，配列に起因する厚み，均一な弾性，復元
力の最適設計と長期使用過程での均一変形が求められて
いる。しかしながら、従来技術では、導電体の折れ曲が
りによる接触抵抗の増加や導電体と樹脂部の剛性と摩擦
係数の違いから、コネクター表面に凹凸ができ、外気か
らの密閉性，防塵性，耐環境性が低下する等充分満足で
きるものではなかった。また、従来樹脂としてはシリコ
ーンゴムが主として使用されているが、シリコーンゴム
は元来吸水率が高く、金属細線の発錆を招き、また繰り
返しの挿抜に対して引き裂きに弱く、またシリコーンゴ
ムの表面摩擦抵抗を緩和する為に摺動用オイルをぬる
が、このオイルによって膨潤する等品質的に問題があっ
た。When cutting at a right angle to a finely aligned parallel line made of a conductive compound, a conductive fiber or a metal foil, those conductors come out to serve as a contact point. Due to lack of reliability and insufficient smoothness of the cut surface, we tried to reduce contact resistance by polishing and then plating to reduce contact resistance, but it was a complicated process. The cost was high. In particular, as a connector for an IC memory card, in order to ensure the contact contact reliability, a shearing force is applied to the connector to insert the pin from the side, and the pin is appropriately compressed in the thickness direction of the connector and has appropriate insertion / removal resistance. Although it needs to have a structure, it is required to have durability to withstand repeated insertion and removal, for example, 100,000 to 100,000 times or more. In addition, as the use of IC memory cards for outdoor applications such as electronic still cameras is progressing, in addition to the above-mentioned repeated durability, selection of materials that are not affected by outside temperature and humidity, and the use of outside air and dust for IC When the pins are pulled out so as not to lead to the inside of the memory card, the connector comes into contact with a rubber-like substance placed facing each other, and it is necessary to seal the connector. For that purpose, in addition to ensuring the initial contact resistance, the optimum design of the material and shape of the resin and conductor with excellent weather resistance, heat resistance, and moisture resistance, the thickness due to the arrangement, uniform elasticity, and restoring force. Uniform deformation during long-term use is required. However, in the prior art, due to the increase in contact resistance due to the bending of the conductor and the difference in rigidity and friction coefficient between the conductor and the resin part, the connector surface has irregularities, which results in sealing from the outside air, dustproofness, and environmental resistance. It was not sufficiently satisfactory such as the decrease. Silicone rubber has been mainly used as a conventional resin.Since silicone rubber has a high water absorption rate, it causes rusting of fine metal wires and is not easily torn by repeated insertion / removal. Although the sliding oil is wetted to reduce the frictional resistance, there is a problem in quality such as swelling due to this oil.
【０００４】そこで、この発明は、導電体の径や整列ピ
ッチを任意に設定でき、導電体を切断する必要がないの
で導電体が抜け落ちる不安もなく、信頼性が高く、繰り
返しの挿抜にも耐え得る異方導電性コネクターを提供す
るとともに、かかるコネクターを容易に製造する方法を
提供することを目的とする。Therefore, according to the present invention, the diameter and the arrangement pitch of the conductors can be arbitrarily set, and since it is not necessary to cut the conductors, there is no fear that the conductors will fall out, the reliability is high, and it can endure repeated insertion and removal. It is an object of the present invention to provide an anisotropic conductive connector to be obtained and a method for easily producing such a connector.
【０００５】[0005]
【課題を解決するための手段】上述の目的を達成するた
め、この発明は、樹脂シート面に垂直に穴を明け、導電
性ペーストを穴の内部に埋め込んで硬化させ、シート面
に垂直に所定寸法で切断したものである。なお、ここで
導電性ペーストとは導電性粒子と樹脂と溶剤の混合物を
いい、導電性ペーストを硬化させたものを導電体とい
う。In order to achieve the above-mentioned object, according to the present invention, a hole is formed perpendicularly to the surface of a resin sheet, a conductive paste is embedded in the hole to be cured, and a predetermined length is perpendicular to the surface of the sheet. It is cut to size. Here, the conductive paste refers to a mixture of conductive particles, a resin, and a solvent, and a cured product of the conductive paste is referred to as a conductor.
【０００６】[0006]
【作用】この発明においては、樹脂シート面に垂直方向
に明けられた穴に埋め込まれた導電性ペーストが導電体
となり、この径や整列ピッチを任意に設定することがで
きる。また、樹脂シートとして例えば適度なゴム弾性が
あり、耐候性，耐湿性，接着性に優れ、引き裂きにも強
いエチレン−酢酸ビニル共重合体等を使用すれば、繰り
返しの挿抜に耐える耐久性も向上し、耐候性，耐熱性，
耐湿性にも優れたものとなる。また、導電性ペーストを
穴の内部に埋め込んであることにより、全体として均一
で適度な弾力と復元力、挿抜抵抗を発現し、圧縮力と剪
断力に長期に耐えることが可能となる。また、樹脂シー
トと導電性ペーストとの組み合わせにより磨耗を均等化
でき、表面の凹凸を少なくして外気の密閉度を維持する
ことも可能である。さらに、導電性ペーストが埋め込ま
れた個所以外で切断することによって任意の形状の異方
導電性コネクターを得ることができ、厚いシート、コネ
クターとすることも可能である。In the present invention, the conductive paste embedded in the holes opened in the direction perpendicular to the resin sheet surface serves as a conductor, and the diameter and the alignment pitch can be set arbitrarily. In addition, if a resin sheet such as an ethylene-vinyl acetate copolymer that has appropriate rubber elasticity, excellent weather resistance, moisture resistance, adhesiveness, and is resistant to tearing is used, the durability to withstand repeated insertion and removal is also improved. Weather resistance, heat resistance,
It also has excellent moisture resistance. Further, by embedding the conductive paste in the holes, uniform and appropriate elasticity and restoring force, and insertion / removal resistance are exhibited as a whole, and it becomes possible to endure the compressive force and the shearing force for a long period of time. Further, by combining the resin sheet and the conductive paste, it is possible to equalize the wear, reduce surface irregularities, and maintain the degree of airtightness. Furthermore, an anisotropically conductive connector of any shape can be obtained by cutting at a place other than the place where the conductive paste is embedded, and a thick sheet or connector can also be obtained.
【０００７】[0007]
【実施例】以下に、この発明の好適な実施例を図面を参
照にして説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings.
【０００８】図１に示す異方導電性コネクターは、樹脂
シート１の面に垂直方向に明けられた穴２の内部に導電
性ペーストが埋め込まれたものを示す。穴２は、図２に
示すように樹脂シート１に対しレーザービーム例えばＣ
Ｏ2 レーザー：出力３０〜２００Ｗ，Ｎｄ：ＹＡＧレー
ザー：出力３００〜５００Ｗまたはエキシマレーザー：
出力５０〜１５０Ｗにより所望の位置に明けられる。樹
脂シート１としては、先にも述べたようにエチレン−酢
酸ビニル共重合体が好適に使用される。０．１〜０．５
mmの厚みの樹脂シート１に対するレーザービームによる
穴２の形成において、穴２の径を４０〜１５０μｍに形
成する。穴２の間のピッチは２００〜３００μｍ程度と
した。次いで、図３に示すように印刷方式により導電体
３を穴２に形成する。穴２に対する導電体３の形成は、
導電性ペーストをスクリーン印刷技術を用いて埋め込む
ことができる。導電性ペーストとしては、まず、金，
銀，銅，ニッケル粒子，カーボン，銀・カーボンの混合
あるいは樹脂微粒子の表面に金メッキしたもの等の導電
性粒子を熱可塑性または熱硬化性の樹脂または紫外線硬
化形の樹脂あるいは液状ゴムと溶剤に混合し穴２に埋め
込んだ。導電性ペーストの埋め込みは圧力をかけながら
埋め込んでもよいし、真空で引いて埋め込んでもよい。
このようにして穴２に導電性ペーストを埋め込んだ後オ
ーブンに入れて溶剤を溶かし、樹脂またはゴムを硬化さ
せる。または、紫外線ランプにて紫外線を照射して硬化
させる。The anisotropic conductive connector shown in FIG. 1 shows a resin sheet 1 in which a conductive paste is embedded in a hole 2 vertically formed in the surface thereof. As shown in FIG. 2, the hole 2 is formed on the resin sheet 1 by a laser beam such as C
O 2 laser: output 30 to 200 W, Nd: YAG laser: output 300 to 500 W or excimer laser:
The power of 50 to 150 W is used to open at a desired position. As the resin sheet 1, as described above, the ethylene-vinyl acetate copolymer is preferably used. 0.1-0.5
In forming the holes 2 by the laser beam on the resin sheet 1 having a thickness of mm, the diameter of the holes 2 is formed to 40 to 150 μm. The pitch between the holes 2 was about 200 to 300 μm. Next, as shown in FIG. 3, the conductor 3 is formed in the hole 2 by a printing method. The formation of the conductor 3 in the hole 2 is
The conductive paste can be embedded using screen printing techniques. As the conductive paste, first, gold,
Conductive particles such as silver, copper, nickel particles, carbon, a mixture of carbon, silver / carbon, or gold plated on the surface of resin particles are mixed with a thermoplastic or thermosetting resin or an ultraviolet curable resin or liquid rubber and a solvent. I buried it in hole 2. The conductive paste may be embedded by applying pressure or may be pulled by a vacuum to be embedded.
In this way, the hole 2 is filled with the conductive paste and then placed in an oven to dissolve the solvent and cure the resin or rubber. Alternatively, it is cured by irradiating it with ultraviolet rays from an ultraviolet lamp.
【０００９】ピンとの接触を確実にするために、必要に
応じて、樹脂シート１の裏面にステンレス板のマスター
４を置き、図４に示すように導電体３の表面に２〜５０
μｍの金メッキ５を施してもよい。あるいは図５に示す
ように導電体３の表裏両面に金メッキ５を施してもよ
い。金メッキ５の代わりにニッケルやニッケルボロン等
のメッキを施すことも可能である。In order to ensure the contact with the pins, a stainless steel plate master 4 is placed on the back surface of the resin sheet 1 if necessary, and 2 to 50 are placed on the surface of the conductor 3 as shown in FIG.
The gold plating 5 of μm may be applied. Alternatively, as shown in FIG. 5, both sides of the conductor 3 may be plated with gold. Instead of the gold plating 5, nickel, nickel boron or the like may be plated.
【００１０】図６に示す異方導電性コネクターはＩＣメ
モリカード用コネクターを示し導電体３が２列の千鳥パ
ターンで配列されている。図７は液晶パネル用の異方導
電性コネクターを示し、図８はＬＳＩ表面の実装用異方
導電性コネクターを示す。The anisotropic conductive connector shown in FIG. 6 is an IC memory card connector in which the conductors 3 are arranged in two rows in a staggered pattern. 7 shows an anisotropic conductive connector for a liquid crystal panel, and FIG. 8 shows an anisotropic conductive connector for mounting on the surface of an LSI.
【００１１】また、導電体３が埋め込まれる穴２のパタ
ーンは、図９乃至図１２に示すように種々のパターンの
形成が可能である。The holes 2 in which the conductors 3 are embedded can be formed in various patterns as shown in FIGS. 9 to 12.
【００１２】レーザーによる穴２の形成位置の誤差また
は穴明け後の樹脂シート１の収縮，変形により穴明け精
度とスクリーン印刷の刷版の穴位置がずれるおそれがあ
る場合は、図１３に示すように樹脂シート１の表面にカ
プトン粘着テープ（厚さ２５〜５０μｍ）６を貼り付
け、次いで図１４に示すようにレーザービームにより穴
２を形成し、その後図１５に示すように導電性ペースト
を埋め込む。ここでカプトン粘着テープ以外にＰＥＴ粘
着テープ，セロテープを用いても良い。導電性ペースト
を埋め込んだ後図１６に示すようにカプトン粘着テープ
６を剥離することにより、カプトン粘着テープ６の厚み
分，導電体３の一端側が凸状となり、接点の確実性が増
す。更には図１７〜図２０に示すように、裏面にもカプ
トン粘着テープを貼って穴明けし、導電性ペーストを埋
めて乾燥させた後に表，裏面のテープを剥離することに
よって表，裏両端側が凸状となり、更に接点の確実性が
増す。If there is a possibility that the hole forming accuracy and the hole position of the plate for screen printing may shift due to an error in the formation position of the hole 2 due to the laser or contraction and deformation of the resin sheet 1 after the hole forming, as shown in FIG. Kapton adhesive tape (thickness: 25 to 50 μm) 6 is attached to the surface of the resin sheet 1, and then a hole 2 is formed by a laser beam as shown in FIG. 14, and then a conductive paste is embedded as shown in FIG. . Here, PET adhesive tape or cellophane tape may be used instead of the Kapton adhesive tape. After the conductive paste is embedded, the Kapton pressure-sensitive adhesive tape 6 is peeled off as shown in FIG. 16, so that one end side of the conductor 3 is convex by the thickness of the Kapton pressure-sensitive adhesive tape 6, and the reliability of the contact is increased. Further, as shown in FIGS. 17 to 20, a Kapton adhesive tape is also attached to the back surface to make a hole, the conductive paste is filled and dried, and then the tape on the front surface and the back surface are peeled off. It becomes convex, and the certainty of the contact is further increased.
【００１３】樹脂シート１としては、シリコーンゴムを
使用することも可能である。前述のエチレン−酢酸ビニ
ル共重合体を使用する場合、酢酸ビニルの含有率を２０
〜３５％としたものでは、適度なゴム弾性を示して接着
性もあり、耐候性，耐湿性，耐水性に優れ、引き裂き強
度も大きく、電子スチルカメラ用コネクターのように屋
外用途でしかも繰り返し挿抜力が加わる場合には挿抜抵
抗も適切となり好適なものとなる。It is also possible to use silicone rubber as the resin sheet 1. When the above ethylene-vinyl acetate copolymer is used, the content of vinyl acetate is 20%.
With a content of up to 35%, it exhibits appropriate rubber elasticity and adhesiveness, excellent weather resistance, moisture resistance, and water resistance, and has a large tear strength, and it can be used for outdoor applications like electronic still camera connectors and can be repeatedly inserted and removed. When a force is applied, the insertion / removal resistance becomes appropriate, which is preferable.
【００１４】[0014]
【発明の効果】以上説明したように、この発明の異方導
電性コネクターによれば、導電体の径や整列ピッチを任
意に設定でき、導電体の個所を切断する必要がないの
で、導電体が抜け落ちる不安もなく、信頼性の高いもの
となる。また、導電性ペーストと樹脂シートの材料の組
み合わせにより、接触抵抗を安定させながら均一で適度
な弾力と復元力を発現し、圧縮力と剪断力に長期に耐え
られる異方導電性コネクターを提供することができる。
また、エチレン−酢酸ビニル共重合体を樹脂シートとし
て用いた場合には、ピンの挿抜の繰り返しによる耐久性
が向上し、表面の凹凸を少なくして外気の密閉度を維持
でき、防湿，防塵性等耐環境性の確保ができる。また、
導電体を形成した個所以外の個所で所定サイズに切断す
ることによって、任意の形状のものを容易に得ることが
できる。さらに、樹脂シート面に垂直に穴を明け、導電
性ペーストを穴の内部に埋め込んで硬化させ、シート面
に垂直に所定寸法で切断するので、導電体の径や整列ピ
ッチを任意に設定でき、全体として任意の形状のものを
容易に製造することができ、厚いシート，コネクターと
することも可能である。As described above, according to the anisotropic conductive connector of the present invention, the diameter and the alignment pitch of the conductors can be set arbitrarily, and it is not necessary to cut the portions of the conductors. There is no fear of falling out, and it becomes highly reliable. Also, by combining the material of the conductive paste and the resin sheet, it provides an anisotropic conductive connector that stabilizes the contact resistance, develops uniform and appropriate elasticity and resilience, and can withstand compressive force and shearing force for a long period of time. be able to.
Also, when ethylene-vinyl acetate copolymer is used as the resin sheet, durability is improved by repeated insertion and removal of pins, surface irregularities can be reduced and the airtightness can be maintained, and moisture and dust resistance. It is possible to secure equal environmental resistance. Also,
An arbitrary shape can be easily obtained by cutting to a predetermined size at a place other than the place where the conductor is formed. Furthermore, holes are made perpendicularly to the resin sheet surface, the conductive paste is embedded inside the holes to be hardened, and cut at a predetermined dimension perpendicularly to the sheet surface, so that the diameter and alignment pitch of the conductors can be set arbitrarily, As a whole, an arbitrary shape can be easily manufactured, and a thick sheet or connector can be used.
【図１】この発明の異方導電性コネクターの斜視図。FIG. 1 is a perspective view of an anisotropic conductive connector of the present invention.
【図２】樹脂シートに穴を形成した状態の断面図。FIG. 2 is a sectional view showing a state in which holes are formed in a resin sheet.
【図３】穴に導電性ペーストを埋め込んだ状態の断面
図。FIG. 3 is a sectional view showing a state in which a conductive paste is embedded in the holes.
【図４】導電体の一端側に金メッキ又はニッケル・ボロ
ンメッキを施した例を示す断面図。FIG. 4 is a cross-sectional view showing an example in which one end side of a conductor is plated with gold or nickel-boron.
【図５】導電体の両端側に金メッキ又はニッケル・ボロ
ンメッキを施した例を示す断面図。FIG. 5 is a sectional view showing an example in which both ends of a conductor are plated with gold or nickel-boron.
【図６】ＩＣメモリカード用コネクターとして構成した
例を示す斜視図。FIG. 6 is a perspective view showing an example configured as an IC memory card connector.
【図７】液晶パネル用とした例を示す斜視図。FIG. 7 is a perspective view showing an example for a liquid crystal panel.
【図８】ＬＳＩ表面実装用とした例を示す斜視図。FIG. 8 is a perspective view showing an example for LSI surface mounting.
【図９】導電体のパターンの一例を示す平面図。FIG. 9 is a plan view showing an example of a conductor pattern.
【図１０】導電体を千鳥状に配列したパターンを示す平
面図。FIG. 10 is a plan view showing a pattern in which conductors are arranged in a staggered pattern.
【図１１】導電体を斜めに配列したパターンを示す平面
図。FIG. 11 is a plan view showing a pattern in which conductors are obliquely arranged.
【図１２】導電体を矩形状に連続するようにした配列し
たパターンを示す平面図。FIG. 12 is a plan view showing a pattern in which conductors are arranged so as to be continuous in a rectangular shape.
【図１３】樹脂シートに穴明けをする前にカプトン粘着
テープを片面に貼り付けた状態の断面図。FIG. 13 is a cross-sectional view of a state in which a Kapton adhesive tape is attached to one surface before making holes in a resin sheet.
【図１４】レーザービームにより穴を明けた状態の断面
図。FIG. 14 is a cross-sectional view showing a state in which a hole is formed by a laser beam.
【図１５】カプトン粘着テープに形成された穴も含めて
樹脂シートの穴に導電性ペーストを埋め込んだ状態の断
面図。FIG. 15 is a cross-sectional view showing a state in which a conductive paste is embedded in the holes of the resin sheet including the holes formed in the Kapton adhesive tape.
【図１６】カプトン粘着テープを剥がした状態の断面
図。FIG. 16 is a cross-sectional view showing a state in which the Kapton adhesive tape is peeled off.
【図１７】樹脂シートに穴明けをする前にカプトン粘着
テープを表，裏面に貼り付けた状態の断面図。FIG. 17 is a cross-sectional view showing a state in which a Kapton adhesive tape is attached to the front and back surfaces before punching a resin sheet.
【図１８】レーザービームにより穴を明けた状態の断面
図。FIG. 18 is a cross-sectional view showing a state where a hole is formed by a laser beam.
【図１９】カプトン粘着テープに形成された穴も含めて
樹脂シートの穴に導電性ペーストを埋め込んだ状態の断
面図。FIG. 19 is a cross-sectional view showing a state in which a conductive paste is embedded in the holes of the resin sheet including the holes formed in the Kapton adhesive tape.
【図２０】カプトン粘着テープを剥がした状態の断面
図。FIG. 20 is a sectional view showing a state in which the Kapton adhesive tape is peeled off.
１ 樹脂シート ２ 穴 ３ 導電体 1 Resin sheet 2 Hole 3 Conductor
Claims (2)
使用される異方導電性コネクターにおいて、 樹脂シート面に垂直方向に明けられた穴の内部に導電性
ペーストが埋め込まれていることを特徴とする異方導電
性コネクター。1. An anisotropic conductive connector used as an electrical connector between electronic devices, characterized in that a conductive paste is embedded inside a hole opened in a direction perpendicular to a resin sheet surface. One-way conductive connector.
使用される異方導電性コネクターの製造方法において、 樹脂シート面に垂直に穴を明け、導電性ペーストを前記
穴の内部に埋め込んで硬化させ、 シート面に垂直に所定寸法で切断することを特徴とする
異方導電性コネクターの製造方法。2. A method for manufacturing an anisotropic conductive connector used as an electrical connector between electronic devices, comprising forming a hole perpendicular to a resin sheet surface, embedding a conductive paste inside the hole, and curing the sheet. A method for producing an anisotropically conductive connector, which comprises cutting the surface at a predetermined dimension perpendicularly to the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22647492A JPH0660930A (en) | 1992-08-03 | 1992-08-03 | Anisotropic conductive connector and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22647492A JPH0660930A (en) | 1992-08-03 | 1992-08-03 | Anisotropic conductive connector and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0660930A true JPH0660930A (en) | 1994-03-04 |
Family
ID=16845670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22647492A Pending JPH0660930A (en) | 1992-08-03 | 1992-08-03 | Anisotropic conductive connector and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0660930A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233828A (en) * | 1997-02-20 | 1998-09-02 | Matsushita Electric Ind Co Ltd | Microphone holder |
| US5902438A (en) * | 1997-08-13 | 1999-05-11 | Fry's Metals, Inc. | Process for the formation of anisotropic conducting material |
| JP2000511339A (en) * | 1996-05-17 | 2000-08-29 | ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー | Electrically and thermally anisotropic conductive structure |
| WO2005059571A1 (en) * | 2003-12-18 | 2005-06-30 | Jsr Corporation | Anisotropic conductive connector and circuit device inspection method |
| JP2006294527A (en) * | 2005-04-14 | 2006-10-26 | Nec Corp | Connector and its manufacturing method |
| JP2007227111A (en) * | 2006-02-22 | 2007-09-06 | Polymatech Co Ltd | Connector sheet and portable electronic equipment |
| US7267559B2 (en) | 2001-05-10 | 2007-09-11 | Fujitsu Limited | Anisotropic conductive sheet, production process, contact structure, electronic device and inspection apparatus for operation test |
| JP2008234947A (en) * | 2007-03-19 | 2008-10-02 | Sumitomo Electric Ind Ltd | Anisotropic conductive sheet manufacturing method |
| US7435101B2 (en) * | 2006-02-09 | 2008-10-14 | Japan Aviation Electronics Industry, Limited | Electrical connection member for connection between objects to be connected |
| WO2014065252A1 (en) * | 2012-10-24 | 2014-05-01 | ポリマテック・ジャパン株式会社 | Electromagnetic wave shield gasket and electromagnetic wave shield structure |
| JP2018185175A (en) * | 2017-04-24 | 2018-11-22 | デクセリアルズ株式会社 | Method for manufacturing inspection jig |
| WO2019065089A1 (en) * | 2017-09-29 | 2019-04-04 | 古河電気工業株式会社 | Anisotropically conductive sheet and anisotropically conductive sheet manufacturing method |
-
1992
- 1992-08-03 JP JP22647492A patent/JPH0660930A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000511339A (en) * | 1996-05-17 | 2000-08-29 | ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー | Electrically and thermally anisotropic conductive structure |
| JPH10233828A (en) * | 1997-02-20 | 1998-09-02 | Matsushita Electric Ind Co Ltd | Microphone holder |
| US5902438A (en) * | 1997-08-13 | 1999-05-11 | Fry's Metals, Inc. | Process for the formation of anisotropic conducting material |
| US7267559B2 (en) | 2001-05-10 | 2007-09-11 | Fujitsu Limited | Anisotropic conductive sheet, production process, contact structure, electronic device and inspection apparatus for operation test |
| WO2005059571A1 (en) * | 2003-12-18 | 2005-06-30 | Jsr Corporation | Anisotropic conductive connector and circuit device inspection method |
| JP2006294527A (en) * | 2005-04-14 | 2006-10-26 | Nec Corp | Connector and its manufacturing method |
| US7435101B2 (en) * | 2006-02-09 | 2008-10-14 | Japan Aviation Electronics Industry, Limited | Electrical connection member for connection between objects to be connected |
| JP2007227111A (en) * | 2006-02-22 | 2007-09-06 | Polymatech Co Ltd | Connector sheet and portable electronic equipment |
| JP4690908B2 (en) * | 2006-02-22 | 2011-06-01 | ポリマテック株式会社 | Connector sheet and portable electronic device |
| JP2008234947A (en) * | 2007-03-19 | 2008-10-02 | Sumitomo Electric Ind Ltd | Anisotropic conductive sheet manufacturing method |
| WO2014065252A1 (en) * | 2012-10-24 | 2014-05-01 | ポリマテック・ジャパン株式会社 | Electromagnetic wave shield gasket and electromagnetic wave shield structure |
| JP2018185175A (en) * | 2017-04-24 | 2018-11-22 | デクセリアルズ株式会社 | Method for manufacturing inspection jig |
| WO2019065089A1 (en) * | 2017-09-29 | 2019-04-04 | 古河電気工業株式会社 | Anisotropically conductive sheet and anisotropically conductive sheet manufacturing method |
| JPWO2019065089A1 (en) * | 2017-09-29 | 2019-11-14 | 古河電気工業株式会社 | Anisotropic conductive sheet and method for producing anisotropic conductive sheet |
| TWI709632B (en) * | 2017-09-29 | 2020-11-11 | 日商古河電氣工業股份有限公司 | Anisotropic conductive sheet and manufacturing method of anisotropic conductive sheet |
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