JPS5941262A - Manufacture of laminated board - Google Patents

Manufacture of laminated board

Info

Publication number
JPS5941262A
JPS5941262A JP57152260A JP15226082A JPS5941262A JP S5941262 A JPS5941262 A JP S5941262A JP 57152260 A JP57152260 A JP 57152260A JP 15226082 A JP15226082 A JP 15226082A JP S5941262 A JPS5941262 A JP S5941262A
Authority
JP
Japan
Prior art keywords
laminate
pressure
manufacturing
temperature
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57152260A
Other languages
Japanese (ja)
Other versions
JPS621827B2 (en
Inventor
中井 道雄
島本 勇治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP57152260A priority Critical patent/JPS5941262A/en
Publication of JPS5941262A publication Critical patent/JPS5941262A/en
Publication of JPS621827B2 publication Critical patent/JPS621827B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は、電子計算機、:11信機器、工業計測器等
に用いられる銅張積層板等績層板の製法に関するもので
、その目的とすると仁ろは、加工時の寸法安定性に優れ
た積層板を提供することにある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing copper-clad laminates and other laminates used in electronic computers, communications equipment, industrial measuring instruments, etc. The object of the present invention is to provide a laminate with excellent dimensional stability.

竹近、部品の自動挿入が一般化してきておシ、加工後の
寸法変化率の小さい積層板に対する要求が強くなってき
ている。しかし、現状は、■へ層板の収縮量を加味して
加工設備を改良したり、積層板を加工前に加熱して予め
収縮させておいたりして、寸法変化率の大きい積層板を
加工工程でカバーする方法がとられているにすぎず、不
イIt足な結果しか得られていない。
As automatic insertion of parts has become commonplace, there is an increasing demand for laminates with a small rate of dimensional change after processing. However, currently, processing laminates with a large rate of dimensional change is being processed by improving processing equipment by taking into account the amount of shrinkage of the laminate, or by heating the laminate to shrink it before processing. The method of covering this up in the process has only been used, and only unsatisfactory results have been obtained.

このような問題を解決するべく、発明者らは種々検討を
重ねた。その結果、寸法変化の起きるもつとも大きな原
因はつぎのようなところにあることが分かった。すなわ
ち、従来は、積層板の成形において、加熱終了後加圧下
で水冷を行ない、内部温度が80〜100℃になった時
点で成形を完了していたため、成形品の内部にストレス
が残り、成形品の寸法変化率が大きくなっていたのであ
る。
In order to solve such problems, the inventors have conducted various studies. As a result, it was found that the major causes of dimensional changes are as follows. In other words, in the past, when molding a laminate, water cooling was performed under pressure after heating, and molding was completed when the internal temperature reached 80 to 100°C, which caused stress to remain inside the molded product, causing the molding to deteriorate. The rate of dimensional change of the product was increasing.

発明者らの見出したところによると、成形品の冷却を無
圧下で放冷することとすれば、上記のような現象が起き
ないようにすることができる。ところが、さらに検討を
進めてみると、このように加熱終了後直ちに無圧下の放
冷に入る方法によった場合、製品の表面粗度に不満足な
結果を生じることがあることが分かり、その点の改善が
求められた。そして、加熱終了後直ちに放冷に入るので
なく、まず水冷して成形機の内部1.清廉を少し下げ、
そののち無圧下で放冷するようにするとよいことが分か
った。この発明は、このようにして完成された。
According to the findings of the inventors, if the molded product is allowed to cool without pressure, the above phenomenon can be prevented from occurring. However, upon further investigation, it was found that using this method of allowing the product to cool without pressure immediately after completion of heating may result in unsatisfactory results in the surface roughness of the product. Improvements were required. The inside of the molding machine is not cooled immediately after heating, but is first cooled with water. Lower your integrity a little,
It was found that it is best to allow the mixture to cool without pressure. This invention was completed in this way.

したがって、この発明は、加熱加圧下で成形し積層板を
得るにあたり、加熱終了後水冷によって内部温度を少し
下げ、その後無圧下で放冷することを特徴とする積層板
の製法を要旨とする。以下にこれを詳しく述べる。
Therefore, the gist of the present invention is a method for manufacturing a laminate, which is characterized in that when forming a laminate under heat and pressure, the internal temperature is lowered slightly by water cooling after heating, and then allowed to cool under no pressure. This will be explained in detail below.

この発明にかかる積層板の製法は、従来と同様、基材に
合成樹脂を含浸させ乾燥してなるプリプレグ1枚もしく
は複数板の1?!層物を基板材料とし、これに銅箔を重
ね合わせて加熱等により硬化させ、絹張積層板を得る。
The manufacturing method of the laminate according to the present invention is similar to the conventional method, in which a base material is impregnated with a synthetic resin and dried, and one or more prepreg sheets are prepared. ! The layered material is used as a substrate material, and a copper foil is laminated thereon and cured by heating or the like to obtain a silk-clad laminate.

この発明に用いる基材は、ポリアミド、ポリエステル等
の合成繊維、ガラス、アスベスト等の無機(哉維や紙等
の天然繊維の単独もしくは混紡による布や不織布または
紙であり、繊維を合成樹脂バインダーで結合させたもの
もしくはバインダーを用いず繊維の絡みを利用したもの
等が用いられる。
The base material used in this invention is cloth, nonwoven fabric, or paper made of synthetic fibers such as polyamide and polyester, glass, inorganic fibers such as asbestos (or natural fibers such as fibers, paper, etc.) alone or in a blend, and the fibers are combined with a synthetic resin binder. Those that are bound or those that utilize the entanglement of fibers without using a binder are used.

樹脂としては、エポキシ樹脂、ポリイミド樹脂。Epoxy resin and polyimide resin are used as resins.

不飽和ポリエステル樹脂等の熱硬化性樹脂が用いられる
。ガラス織布とガラス不織布等種類の異なる基材を複合
して用いるコンポジットfR層板の場合は、これらの樹
脂にガラス、アスベスト、水酸化アルミニウム、ケイ酸
カルシウム、酸化チタン等の無機粉末充填剤を混合させ
ておくとよい。銅箔は、特Vこ限定するものでなく、通
常の銅箔を用い、基材の両表面もしくは片面のどちらに
配置しても良い。
Thermosetting resins such as unsaturated polyester resins are used. In the case of composite fR laminates that use a combination of different types of base materials such as woven glass fabric and non-woven glass fabric, these resins are combined with inorganic powder fillers such as glass, asbestos, aluminum hydroxide, calcium silicate, and titanium oxide. It is best to keep them mixed. The copper foil is not particularly limited to V, and ordinary copper foil may be used and may be placed on either both surfaces or one surface of the base material.

これらの基材、樹脂お−よび銅箔を用いて加熱加圧下で
成形する。加熱加圧時間は樹脂の硬化に必要な役低時間
あれば良い。この発明は、加熱加圧完了後、加圧下で5
〜10分水冷し、成形機の内部温度を少し下げ、好まし
くは150℃以下130℃以上の範囲内に達した時点で
圧力を零にし、かつ水冷を止めて放冷に入る。このよう
にして成形品を得る。150℃近辺にも下がっていない
のに放冷に入ると、表面粗度が悪くなる傾向があり、1
30℃を少し下廻るまで水冷を行なうと、寸法変化率の
向上があまりみとめられなくなる。放冷tま別のプレス
に移して行ってもよく、積層板の温度が室温もしくは5
0℃程度になるまでするのである。
These base materials, resin, and copper foil are molded under heat and pressure. The heating and pressurizing time may be as short as necessary for curing the resin. In this invention, after the completion of heating and pressurization, the
Cool with water for ~10 minutes, lower the internal temperature of the molding machine a little, and when it reaches a temperature preferably in the range of 150°C or lower and 130°C or higher, reduce the pressure to zero, stop water cooling, and start cooling. In this way, a molded product is obtained. If you start cooling even though the temperature has not dropped to around 150℃, the surface roughness tends to deteriorate.
If water cooling is performed to a temperature slightly below 30°C, the dimensional change rate will not improve much. The laminate may be left to cool and transferred to another press until the temperature of the laminate is at room temperature or 5.
This is done until the temperature reaches around 0°C.

この発明にかかる積層板の製法は、このように、加熱終
了稜一旦水冷して内部温度を少し下げたのち無圧下で放
冷するようにしているため、これによれば積層板内部の
ストレスが開放され、積層板tよ成形終了時に収縮する
。したがって、yt/M板加工時の寸法変化率が小さく
なる。そして、表面粗度の悪化も起きない。
In this way, the manufacturing method of the laminate according to the present invention is such that once the heating is completed, the edge is cooled with water to lower the internal temperature a little, and then allowed to cool under no pressure. According to this method, stress inside the laminate is reduced. The laminate t is released and contracts at the end of molding. Therefore, the rate of dimensional change during processing of the Yt/M plate is reduced. Also, no deterioration of surface roughness occurs.

以下、実施例について比較例および従来例と併せて説明
する。
Examples will be described below along with comparative examples and conventional examples.

〔実施例1〕 厚み0.2 manのガラス織布に硬化剤含有エポキシ
樹脂を含19−乾イ・Lして、ガラス織布成分が60重
間−のプリプレグ(以下「プリプレグA」と称す)を百
た。このプリプレグAを8枚重ねた両面に厚み0.03
5 mmO銅笛を配置し、これを全日プレート間に挿入
し7、rlkl原形40 kg/〜、成形温度170°
Cで100分間積層成形し、その後、5分間、圧力4 
(1kg /c−の寸オ水冷し、ft層板の温度が15
0℃になった時点で圧力を抜き、プレスから取り出して
室温になるまでjib冷し、厚み1.6mmの銅張積層
板を得た。
[Example 1] A prepreg (hereinafter referred to as "prepreg A") with a glass woven fabric having a thickness of 60 layers was prepared by adding a hardening agent-containing epoxy resin to a 0.2-man thick glass woven fabric. ) was a hundred. Thickness 0.03 on both sides of 8 sheets of prepreg A
Place a 5 mmO copper whistle and insert it between the plates 7, rlkl original form 40 kg/~, molding temperature 170°
Laminate molding at C for 100 minutes, then press 4 for 5 minutes.
(The temperature of the ft layer plate is 15 kg/cm).
When the temperature reached 0° C., the pressure was released, the press was taken out, and the jib was cooled to room temperature to obtain a copper-clad laminate with a thickness of 1.6 mm.

〔実l、イ+i fll 2 ) 実/@例IKおいで、加熱加圧成形後10分間水冷し、
積層板のT見度が130℃になった時点で圧力を抜いて
、プレスから11”<り出した。
[Real I, I + i flll 2) Real/@Example IK, cooled in water for 10 minutes after heating and pressure molding,
When the T visibility of the laminate reached 130° C., the pressure was released and the laminate was pulled out from the press by 11 inches.

〔比軸列l〕[Ratio axis sequence l]

加圧水冷せず、加トへ加圧成形終了後直ちにプレスから
敗り出し、放冷L7た。
The product was not cooled with water under pressure, and immediately after the completion of pressure molding, it began to fall out of the press and was left to cool at L7.

〔実施例3〕 厚み0.0fimmのガラス繊維不織布に、硬化剤含有
エボギシ樹脂100¥に置部に対し乾燥水i’Jl化ア
ル化工ルミニウム30重量部した積層板用樹脂を含浸・
乾燥して、ガラス繊維成分が15重量%のプリプレグ(
以下「プリプレグB」と1(トす)を得た。
[Example 3] A glass fiber non-woven fabric with a thickness of 0.0 fimm was impregnated with a laminate resin made by adding 30 parts by weight of dry water i'Jl aluminized aluminum to 100 yen of curing agent-containing epoxy resin.
After drying, a prepreg with a glass fiber component of 15% by weight (
Hereinafter, "prepreg B" and 1 (tos) were obtained.

このプリプレグを3枚重ねた両面に、実施例1のプリプ
レグA=i各々1枚ずつ介して、厚み0.035mm0
銅箔を配置し、これら合金V4プレート(15に挿入し
て、実施例1と同様の成形方法で厚み1.6mmのコン
ポジット型鋼張積層板を得た。
A thickness of 0.035 mm
Copper foil was arranged and inserted into these alloy V4 plates (15), and a composite type steel clad laminate with a thickness of 1.6 mm was obtained by the same molding method as in Example 1.

〔実施例4〕 実施例3のコンポジット積層板に於いて、実施例2と同
様の成形方法で、厚み1.6mmの別張績層板を得た。
[Example 4] Regarding the composite laminate of Example 3, a separately stretched laminate having a thickness of 1.6 mm was obtained using the same molding method as in Example 2.

〔比較例2〕 コンポジット積層板に於いて、比較例1と同様の成形方
法を行った。
[Comparative Example 2] The same molding method as in Comparative Example 1 was performed on a composite laminate.

〔従来例〕[Conventional example]

コンポジット積層板において、室温になるまで40kg
/cIIの加圧下で水冷した。
In composite laminates, 40 kg until room temperature.
The mixture was cooled with water under a pressure of /cII.

実施例ど比較例および従来列で得た各積層板につき、そ
れぞれの寸法変化率と表面粗度を測定した。結!iは第
1表のとおりであり、実施例は比較例および従来例に比
しすぐれていた。
The dimensional change rate and surface roughness of each laminate obtained in Examples, Comparative Examples, and Conventional rows were measured. Conclusion! i is as shown in Table 1, and the examples were superior to the comparative examples and conventional examples.

寸法変化率の(fIll定は、缶、^を全面エツチング
したのち、130℃で1時間加熱したときの平面におけ
るx−y方向の収縮率を寸法変化率とする方法によった
The dimensional change rate was determined by a method in which the shrinkage rate in the x-y direction in the plane when the can was etched on the entire surface and then heated at 130° C. for 1 hour was taken as the dimensional change rate.

第1表Table 1

Claims (4)

【特許請求の範囲】[Claims] (1)加熱加圧下で成形し積層板を得るにあたり、加熱
終了後水冷によって内部温度を少し下げ、その後無圧下
で放冷するこ1とを特徴とする積層板の製法。
(1) A method for manufacturing a laminate, which is characterized in that when forming a laminate under heat and pressure, the internal temperature is lowered slightly by cooling with water after heating, and then allowed to cool under no pressure.
(2)水冷によって内部温度をtlは130〜150°
Cに下げたのち、無圧下で放冷する特許請求の範囲第1
項記載の積層板の製法。
(2) Internal temperature by water cooling tl is 130~150°
Claim 1, in which the temperature is lowered to C and then allowed to cool under no pressure.
Manufacturing method for the laminate described in Section 1.
(3)積層板が、ガラス織布にエポキシ樹脂を含浸させ
てなるプリプレグを用いた銅張積層板である!1ゲ許請
求の範囲第1項または第2項記載の積層板の製法。
(3) The laminate is a copper-clad laminate using prepreg made by impregnating glass woven fabric with epoxy resin! 1. A method for manufacturing a laminate according to claim 1 or 2.
(4)積層板が、ガラス織布にエポキシ樹脂を含浸させ
てなるプリプレグと、ガラス不織布にエポキシ樹脂を含
浸させてなるプリプレグとを用いたコンポジット型の銅
張積層板である特許請求の範囲第1項または第2項記載
の積層板の製法。
(4) The laminate is a composite copper-clad laminate using a prepreg made of a glass woven fabric impregnated with an epoxy resin and a prepreg made of a glass nonwoven fabric impregnated with an epoxy resin. A method for producing a laminate according to item 1 or 2.
JP57152260A 1982-08-31 1982-08-31 Manufacture of laminated board Granted JPS5941262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57152260A JPS5941262A (en) 1982-08-31 1982-08-31 Manufacture of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57152260A JPS5941262A (en) 1982-08-31 1982-08-31 Manufacture of laminated board

Publications (2)

Publication Number Publication Date
JPS5941262A true JPS5941262A (en) 1984-03-07
JPS621827B2 JPS621827B2 (en) 1987-01-16

Family

ID=15536590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57152260A Granted JPS5941262A (en) 1982-08-31 1982-08-31 Manufacture of laminated board

Country Status (1)

Country Link
JP (1) JPS5941262A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62259822A (en) * 1986-05-07 1987-11-12 Matsushita Electric Works Ltd Manufacture of electrical laminated sheet
JPS63151436A (en) * 1986-12-15 1988-06-24 Matsushita Electric Works Ltd Treatment method for glass base epoxy resin laminated sheet

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03117533U (en) * 1990-03-09 1991-12-04

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62259822A (en) * 1986-05-07 1987-11-12 Matsushita Electric Works Ltd Manufacture of electrical laminated sheet
JPH046527B2 (en) * 1986-05-07 1992-02-06 Matsushita Electric Works Ltd
JPS63151436A (en) * 1986-12-15 1988-06-24 Matsushita Electric Works Ltd Treatment method for glass base epoxy resin laminated sheet

Also Published As

Publication number Publication date
JPS621827B2 (en) 1987-01-16

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