JPH0645910Y2 - Dew condensation prevention device for socket board - Google Patents
Dew condensation prevention device for socket boardInfo
- Publication number
- JPH0645910Y2 JPH0645910Y2 JP14833187U JP14833187U JPH0645910Y2 JP H0645910 Y2 JPH0645910 Y2 JP H0645910Y2 JP 14833187 U JP14833187 U JP 14833187U JP 14833187 U JP14833187 U JP 14833187U JP H0645910 Y2 JPH0645910 Y2 JP H0645910Y2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- board
- socket board
- air
- heat insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、ICハンドラの測定部に設けられるソケットボ
ードに結露することを防止する装置に関するものであ
る。[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a device for preventing dew condensation on a socket board provided in a measuring section of an IC handler.
ICハンドラは、多数のICを順次に搬送してIC測定ソケッ
トに装着して電気的性能の検査に供し、かつ、上記測定
ソケットから離脱せしめたICを検査結果に従って級別に
分類して搬出する自動機器である。The IC handler automatically conveys a large number of ICs, attaches them to IC measurement sockets for electrical performance inspection, and classifies the ICs detached from the measurement sockets according to the inspection results and carries them out automatically. Equipment.
上記電気的性能の検査は所定の検査条件温度（例えば−
40℃、また例えば150℃）で行われる。このため。前記
のIC測定ソケットは断熱板で囲まれた恒温室内に設置さ
れ、該恒温室内は所定の検査条件温度に保たれる。従っ
て、この恒温室は低温槽である場合もあり、高温槽であ
る場合もある。The above electrical performance inspection is performed under a predetermined inspection condition temperature (for example, −
40 ° C., for example 150 ° C.). For this reason. The IC measurement socket is installed in a temperature-controlled room surrounded by a heat insulating plate, and the temperature inside the temperature-controlled room is maintained at a predetermined inspection condition temperature. Therefore, this temperature-controlled room may be a low temperature tank or a high temperature tank.
第２図は従来例のICハンドラのIC測定部付近を示す垂直
断面図である。FIG. 2 is a vertical cross-sectional view showing the vicinity of the IC measuring portion of the conventional IC handler.
１は断熱板であって、この断熱板で囲まれた空間内にIC
搬送路２が設けられている。1 is a heat insulating plate, and the IC is enclosed in the space surrounded by this heat insulating plate.
A transport path 2 is provided.
IC3は矢印a,b,cの如く搬送されてIC測定ソケット４に装
着され、矢印d,eの如く次工程に送り出される。The IC3 is conveyed as indicated by arrows a, b and c, mounted on the IC measuring socket 4, and sent to the next step as indicated by arrows d and e.
上記IC測定ソケット４は断熱板１で囲まれた空間内に、
IC搬送路に沿って設けられ、ICソケットボード５に対し
て電気的に接続されている。The IC measurement socket 4 is placed in the space surrounded by the heat insulating plate 1,
It is provided along the IC transport path and is electrically connected to the IC socket board 5.
上記ソケットボード５に対向離間して、これと平行に配
設されたインタフェイス基板７は、電線８によって前記
ソケットボード５と接続されており、複数本（本従来例
においては４本）の支柱６によって断熱板１に支承され
ている。An interface substrate 7 which is opposed to and separated from the socket board 5 and is arranged in parallel with the socket board 5 is connected to the socket board 5 by an electric wire 8 and has a plurality of (four in the conventional example) support posts. It is supported by the heat insulating plate 1 by 6.
前記のインタフェイス基板７は、ICハンドラの外筐をな
すカバー９に設けられた開口に嵌め込まれた形に、設カ
バー９とほぼ同一面に揃えて配設されている。このイン
タフェイス基板７は、ICテスタのテスタヘッド10に対向
当接せしめられて使用される。The interface board 7 is fitted in an opening provided in a cover 9 which is an outer casing of the IC handler, and is arranged substantially flush with the installation cover 9. The interface board 7 is used by being brought into contact with a tester head 10 of an IC tester so as to face it.
前記断熱板１内が、室温よりも低温（例えば−35℃）に
保たれる場合、該断熱板１の外表面、及び、該外表面に
当接している部材の表面に結露を生じる。このため、前
記ソケットボード５の外側面（断面板５の反対側の面）
に結露が生じる。When the inside of the heat insulating plate 1 is kept at a temperature lower than room temperature (for example, −35 ° C.), dew condensation occurs on the outer surface of the heat insulating plate 1 and the surface of the member in contact with the outer surface. Therefore, the outer surface of the socket board 5 (the surface opposite to the cross-section plate 5)
Condensation occurs on the.
ソケットボード５は一種の配線基板であって、上記の結
露によって回路パターン間の電気的絶縁が低下してリー
クを生じる。このため、ICの電気的性能の検査精度が損
われる。The socket board 5 is a kind of wiring board, and due to the above-mentioned dew condensation, the electrical insulation between the circuit patterns is reduced and a leak occurs. Therefore, the inspection accuracy of the electrical performance of the IC is impaired.
本考案は上述の事情に鑑みて為されたもので、上述した
ソケットボードの結露を防止し得る装置を提供すること
を目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an apparatus capable of preventing dew condensation on the socket board.
上記の目的を達成するために創作した本考案は、 （ａ）断熱板で囲まれたIC搬送路と、 （ｂ）上記搬送路に沿って設置されたIC測定ソケット
と、 （ｃ）前記断熱板に沿って設置され、上記IC測定ソケッ
トを搭載しているソケットボードと、 （ｄ）上記ソケットボードと平行に、該ソケットボード
から離間して、前記断熱板で囲まれた空間外に設置され
たインタフェイス基板とを備えたICハンドラの測定部に
おいて、 （ｅ）前記ソケットボードとインタフェイス基板とに挟
まれた空間内に空気を送りこんで循環させる為のエア環
流ファンと、送気管とを設けると共に、 （ｆ）上記送気管内を流通する空気を加熱するエアヒー
タを設けたものである。The present invention, which was created to achieve the above object, includes (a) an IC transport path surrounded by a heat insulating plate, (b) an IC measurement socket installed along the transport path, and (c) the thermal insulation. A socket board that is installed along the board and that mounts the IC measurement socket, and (d) is installed outside the space surrounded by the heat insulating board in parallel with the socket board and apart from the socket board. (E) An air recirculation fan for sending air into the space sandwiched between the socket board and the interface board for circulation, and an air supply pipe. (F) An air heater for heating the air flowing through the air supply pipe is provided.
上記の構成によれば、加熱されて湿度が低下した温風が
ソケットボードの外側面に沿って流れるので、該ソケッ
トボードの結露が防止される。従って、結露に起因する
電気的リークが未然に、かつ完全に防止され、ICの電気
的性能の検査精度が維持される。According to the above configuration, the warm air that has been heated and has reduced humidity flows along the outer surface of the socket board, so that dew condensation on the socket board is prevented. Therefore, electrical leakage due to dew condensation is prevented before and completely, and the inspection accuracy of the electrical performance of the IC is maintained.
第１図は本考案に係る結露防止装置の１実施例を示す断
面図である。FIG. 1 is a sectional view showing one embodiment of a dew condensation preventing device according to the present invention.
この実施例（第１図）は、前記の従来例（第２図）の測
定部に本考案を適用して改良したものであって、第２図
におけると同一の図面参照番号（１〜10を付したもの
は、前記従来例におけると同様の構成部分である。This embodiment (FIG. 1) is an improvement in which the present invention is applied to the measuring unit of the above-mentioned conventional example (FIG. 2), and the same drawing reference numerals (1 to 10) as those in FIG. Those marked with are components similar to those in the conventional example.
次に、従来例（第２図）に比して異なる点を説明する。Next, differences from the conventional example (FIG. 2) will be described.
前記の複数本の支柱６を取り巻くように囲い板11を設
け、前記ソケットボード５とインタフェイス基板７とに
挟まれた空間を覆う、これにより、一つの室Ｒが形成さ
れる。本考案を実施する際、この室Ｒの密閉性は完全で
なくても良い。A surrounding plate 11 is provided so as to surround the plurality of pillars 6 and covers the space sandwiched between the socket board 5 and the interface board 7, whereby one chamber R is formed. When carrying out the present invention, the airtightness of the chamber R may not be perfect.
エア循環ファン12を設ける。12aは該エア循環ファンの
駆動モータである。An air circulation fan 12 is provided. 12a is a drive motor for the air circulation fan.
上記エア循環ファン12と前述の室Ｒとの間に送気管路13
及び戻り管路14を設け、該エア循環ファンの吐出空気を
前記の室Ｒ内に循環させ、その気流をソケットボード５
の外側面（断熱板１と反対側の面）に接せしめる。An air supply line 13 is provided between the air circulation fan 12 and the chamber R described above.
Also, a return pipe line 14 is provided to circulate the air discharged from the air circulation fan into the chamber R, and the air flow of the air is supplied to the socket board
The outer surface (the surface opposite to the heat insulating plate 1) of the.
前記送気管路13の途中に電気ヒータ15を設けて循環空気
流を加熱する。これにより、エア循環ファンから吐出さ
れた空気は相対湿度の低い温風になって室Ｒ内に供給さ
れ、ソケットボード５の外側面に沿って流動し、該部の
結露を防止する。An electric heater 15 is provided in the middle of the air supply line 13 to heat the circulating air flow. As a result, the air discharged from the air circulation fan becomes warm air with a low relative humidity, is supplied into the chamber R, flows along the outer surface of the socket board 5, and prevents dew condensation at this portion.
本実施例においては、戻り管路13にドライエア供給管16
を接続連通せしめて、循環気流の絶対湿度を下げるよう
に構成してある。In the present embodiment, the return air line 13 is provided with the dry air supply pipe 16
Are connected and communicated with each other to lower the absolute humidity of the circulating air flow.
上記のドライエア供給管16を戻り管路14側に接続する
と、該戻り管路内は負圧であるから、別段のポンプ手段
を設けることなく大気圧のドライエアを吸引することが
できる。When the above dry air supply pipe 16 is connected to the side of the return pipe line 14, since the inside of the return pipe line has a negative pressure, dry air at atmospheric pressure can be sucked without providing a separate pump means.
以上説明したように、本考案の装置をICハンドラの測定
部に適用すると、該測定部を低温に保つ場合にもソケッ
トボードに結露しないという優れた実用的効果を奏し、
結露に起因する電気的リークを未然に防止して、ICハン
ドラの測定精度向上に貢献するところ多大である。As described above, when the device of the present invention is applied to the measuring part of the IC handler, it has an excellent practical effect that no condensation occurs on the socket board even when the measuring part is kept at a low temperature.
It greatly contributes to the improvement of the measurement accuracy of the IC handler by preventing the electric leak caused by the dew condensation.
第１図は本考案に係る「ソケットボードの結露防止装
置」を備えたICハンドラの測定部を示し、模式的に描い
た垂直断面図である。 第２図は従来例のICハンドラ測定部の模式的な垂直断面
図である。 １……断熱板、２……IC搬送路、３……IC、４……IC測
定ソケット、５……ソケットボード、７……インタフェ
イス基板、12……エア循環ファン、15……ヒータ。FIG. 1 is a schematic vertical sectional view of a measuring part of an IC handler equipped with a “socket board dew condensation preventing device” according to the present invention. FIG. 2 is a schematic vertical sectional view of a conventional IC handler measuring section. 1 ... Insulation plate, 2 ... IC transport path, 3 ... IC, 4 ... IC measurement socket, 5 ... Socket board, 7 ... Interface board, 12 ... Air circulation fan, 15 ... Heater.
Claims (1)
と、 （ｃ）前記断熱板に沿って設置され、上記IC測定ソケッ
トを搭載しているソケットボードと、 （ｄ）上記ソケットボードと平行に、該ソケットボード
から離間して、前記断熱板で囲まれた空間外に設置され
たインタフェイス基板とを備えたICハンドラの測定部に
おいて、 （ｅ）前記ソケットボードとインタフェイス基板とに挟
まれた空間内に空気を送りこんで循環させる為のエア環
流ファンと、送気管とを設けると共に、 （ｆ）上記送気管内を流通する空気を加熱するエアヒー
タを設けたこと、 を特徴とする、ICハンドラ測定部のソケットボードの結
露防止装置。1. An IC carrying path surrounded by a heat insulating plate, (b) an IC measuring socket installed along the carrying path, and (c) an IC measuring socket installed along the heat insulating plate. An IC including a socket board on which a measurement socket is mounted, and (d) an interface board which is installed in parallel to the socket board and apart from the socket board and outside the space surrounded by the heat insulating plate. In the measurement part of the handler, (e) an air circulating fan for sending air into the space sandwiched between the socket board and the interface board for circulation and an air supply pipe are provided, and (f) the air supply An anti-condensation device for the socket board of the IC handler measuring section, characterized by being provided with an air heater for heating the air flowing through the pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14833187U JPH0645910Y2 (en) | 1987-09-30 | 1987-09-30 | Dew condensation prevention device for socket board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14833187U JPH0645910Y2 (en) | 1987-09-30 | 1987-09-30 | Dew condensation prevention device for socket board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6453977U JPS6453977U (en) | 1989-04-03 |
| JPH0645910Y2 true JPH0645910Y2 (en) | 1994-11-24 |
Family
ID=31419553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14833187U Expired - Lifetime JPH0645910Y2 (en) | 1987-09-30 | 1987-09-30 | Dew condensation prevention device for socket board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645910Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014007084A1 (en) * | 2012-07-02 | 2014-01-09 | 東京エレクトロン株式会社 | Semiconductor inspection system and method for preventing condensation at interface part |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH075425Y2 (en) * | 1987-12-09 | 1995-02-08 | 株式会社アドバンテスト | Condensation preventive device for measuring part |
-
1987
- 1987-09-30 JP JP14833187U patent/JPH0645910Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014007084A1 (en) * | 2012-07-02 | 2014-01-09 | 東京エレクトロン株式会社 | Semiconductor inspection system and method for preventing condensation at interface part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6453977U (en) | 1989-04-03 |
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