JPH0637492A - Electronic parts inserter - Google Patents
Electronic parts inserterInfo
- Publication number
- JPH0637492A JPH0637492A JP4187772A JP18777292A JPH0637492A JP H0637492 A JPH0637492 A JP H0637492A JP 4187772 A JP4187772 A JP 4187772A JP 18777292 A JP18777292 A JP 18777292A JP H0637492 A JPH0637492 A JP H0637492A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- insertion hole
- board
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品のリード線の
寸法・形状不良または基板の挿入孔の位置精度不良があ
るときも補正して、高信頼性で、高密度挿入ができる電
子部品挿入装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention corrects a defect in the size and shape of the lead wire of an electronic component or the positional accuracy of an insertion hole in a substrate to correct the electronic component, and makes it possible to insert the electronic component with high reliability and high density. Regarding the insertion device.
【０００２】[0002]
【従来の技術】近年、多品種のプリント基板上に様々な
電子部品を狭隣接で挿入する高信頼性で高密度実装の要
望が一層高まりつつある。2. Description of the Related Art In recent years, there has been an increasing demand for highly reliable and high-density mounting in which various electronic components are closely and closely inserted on various types of printed circuit boards.
【０００３】以下に従来の電子部品挿入装置について説
明する。図６ないし図８に示すように、パーツカセット
２に収納したラジアルテーピングした電子部品１をフィ
ードするパーツ送り部３と、電子部品１のリード線とテ
ープを切断するカッター部４と、カッター部４による切
断時に電子部品１のリード線を保持し、かつ挿入軸側に
受け渡しの役目をする移載リードチャック部５と、挿入
ヘッド６と、電子部品１のボディを挟持するボディチャ
ック部８と、電子部品１のリード線を案内するガイド部
９と、ガイド部９の開閉を行うガイド開閉用ブロック１
１と、電子部品１が挿入される基板１２を任意の位置に
位置決めするＸ−Ｙテーブル部１３と、基板１２に挿入
された電子部品１のリード線を切断し、折り曲げするア
ンビル部１４で構成されている。A conventional electronic component inserting device will be described below. As shown in FIG. 6 to FIG. 8, a parts feeding section 3 for feeding the electronic component 1 that is housed in the parts cassette 2 and subjected to radial taping, a cutter section 4 for cutting the lead wire and the tape of the electronic component 1, and a cutter section 4 A transfer lead chuck portion 5 that holds the lead wire of the electronic component 1 at the time of cutting by and also serves as a transfer to the insertion shaft side; an insertion head 6; and a body chuck portion 8 that clamps the body of the electronic component 1. A guide portion 9 for guiding the lead wire of the electronic component 1 and a guide opening / closing block 1 for opening / closing the guide portion 9
1, an XY table portion 13 for positioning the substrate 12 into which the electronic component 1 is inserted at an arbitrary position, and an anvil portion 14 for cutting and bending the lead wire of the electronic component 1 inserted in the substrate 12. Has been done.
【０００４】上記各構成要素よりなる電子部品挿入装置
について、各構成要素の関係と動作を説明する。パーツ
カセット２内に収納された電子部品１がパーツ送り部３
によって、１ピッチ送りでカッター部４まで供給され
る。移載リードチャック部５はカッター部４の側に旋回
し、電子部品１のリード線を保持する。電子部品１のリ
ード線とテープはカッター部４で切断された後、移載リ
ードチャック部５により挿入ヘッド６側へ旋回される。
そこで待機している挿入ヘッド６に取り付けたボディチ
ャック部８により、電子部品１のボディは挟持され、そ
のまま挿入ヘッド６は降下する。図９（ａ）に示すよう
に、挿入ガイド軸７も同時に降下することにより、ガイ
ド部９が電子部品１のリード線１ａに接し、リード線１
ａの矯正と案内を行う。ついで、図９（ｂ）に示すよう
に、挿入ヘッド６と挿入ガイド軸７は共に降下して、ガ
イド部９の先端が基板１２の挿入孔に沿うまで降下す
る。このとき、挿入ガイド軸７は停止するが挿入ヘッド
６がさらに降下することにより、ボディチャック部８に
挟持された電子部品１のリード線１ａはガイド部９に案
内されながら、図９（ｃ）に示すように、基板１２へ挿
入される。それとともに挿入ヘッド６に取り付けられた
ガイド開閉用ブロック１１も降下するので、ガイド部９
が取り付けられている揺動ブロック１０はガイド開閉用
ブロック１１の直線部をはずれ、図９（ｄ）および図１
０（ａ）（ｂ）に示すように、ガイド部９とともに斜め
上方向に逃げ上がる。なお、電子部品１が正常に基板１
２の挿入孔に装着されたときは、アンビル部１４によ
り、リード線のカットおよびクリンチが行われ所定の挿
入が完了する。以後、この動作を繰り返す。以上の動作
工程をフローチャートにまとめたものが図１１である。With respect to the electronic component inserting apparatus including the above-mentioned components, the relationship and operation of each component will be described. The electronic component 1 housed in the parts cassette 2 is the parts feeder 3
Thus, it is fed to the cutter unit 4 by one pitch feed. The transfer lead chuck unit 5 turns to the side of the cutter unit 4 and holds the lead wire of the electronic component 1. The lead wire and the tape of the electronic component 1 are cut by the cutter unit 4, and then swung toward the insertion head 6 side by the transfer lead chuck unit 5.
Therefore, the body of the electronic component 1 is clamped by the body chuck portion 8 attached to the standby insertion head 6, and the insertion head 6 descends as it is. As shown in FIG. 9A, when the insertion guide shaft 7 also descends at the same time, the guide portion 9 comes into contact with the lead wire 1 a of the electronic component 1, and the lead wire 1
Correct and guide a. Then, as shown in FIG. 9B, both the insertion head 6 and the insertion guide shaft 7 descend, and the tip of the guide portion 9 descends along the insertion hole of the substrate 12. At this time, the insertion guide shaft 7 is stopped, but the insertion head 6 is further lowered, so that the lead wire 1a of the electronic component 1 sandwiched by the body chuck portion 8 is guided by the guide portion 9, and as shown in FIG. As shown in FIG. At the same time, the guide opening / closing block 11 attached to the insertion head 6 also descends.
The swing block 10 to which is attached is separated from the straight line portion of the guide opening / closing block 11, and the swing block 10 shown in FIG.
As shown in 0 (a) and (b), the guide portion 9 and the guide portion 9 run obliquely upward. It should be noted that the electronic component 1 normally operates on the substrate 1
When it is mounted in the second insertion hole, the lead wire is cut and clinched by the anvil portion 14, and the predetermined insertion is completed. After that, this operation is repeated. FIG. 11 is a flowchart summarizing the above operation steps.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、図１２に示すように、電子部品１のリー
ド線が所定の位置から△Ｘ1傾いたリード線１ｂまたは
△Ｘ2だけ偏心したリード線１ｃのときは、基板１２の
挿入孔１２ａからはみでて挿入不良が生じるという問題
点、また図１３に示すように、リード線１２ａの挿入ピ
ッチＰ１が正しくでている電子部品１でも基板１２の挿
入孔のピッチＰ２，Ｐ３がピッチＰ１からずれている挿
入孔１２ｂを形成された基板１２に挿入されるときも同
様に挿入不良が生じるという問題点を有していた。However, in the above-mentioned conventional structure, as shown in FIG. 12, the lead wire of the electronic component 1 is eccentric by the lead wire 1b or ΔX 2 inclined by ΔX 1 from the predetermined position. In the case of the lead wire 1c, there is a problem that the insertion failure occurs when the lead wire 1c sticks out from the insertion hole 12a of the board 12, and as shown in FIG. Also, when the pitch P2, P3 of the insertion holes is deviated from the pitch P1, the insertion failure similarly occurs when it is inserted into the substrate 12 in which the insertion holes 12b are formed.
【０００６】本発明は上記従来の問題点を解決するもの
で、電子部品の挿入不良を防止し、安定して高密度に装
着できる電子部品挿入装置を提供することを目的とす
る。The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide an electronic component inserting apparatus which prevents defective insertion of electronic components and enables stable and high-density mounting.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するため
に本発明の電子部品挿入装置は、電子部品のリード線認
識カメラと、基板挿入孔認識カメラと、それらの検知に
よる補正データを受けてリード線を可変矯正および可変
案内する可変ガイド部および可変駆動部を備えたもので
ある。To achieve this object, an electronic component inserting apparatus of the present invention receives a lead wire recognizing camera for electronic components, a board insertion hole recognizing camera, and correction data obtained by detecting them. It is provided with a variable guide unit and a variable drive unit for variably correcting and guiding the lead wire.
【０００８】[0008]
【作用】この構成において、リード線の間隔精度がわる
く、もしくはリード線が偏心している電子部品または、
挿入孔のピッチ間隔の精度がわるい基板に対しても電子
部品を挿入不良を起こすことなく装着できることとな
る。In this configuration, the lead wire spacing accuracy is poor, or the lead wire is eccentric, or
This makes it possible to mount electronic components on a substrate with poor accuracy in the pitch spacing of the insertion holes without causing defective insertion.
【０００９】[0009]
【実施例】以下本発明の一実施例について図面を参照し
ながら説明する。本発明の一実施例を示す図１ないし図
４では、従来例と同一部品に同一番号を付してその説明
を省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 to 4 showing an embodiment of the present invention, the same parts as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted.
【００１０】図１に示すように、本実施例の特徴とする
ところは、前述従来の構成に移載リードチャック部５に
より挟持された電子部品１の挟持されていないリード線
の曲がりを検知するリード線認識カメラ１５と、基板１
２の挿入孔の位置誤差，ピッチ誤差，寸法精度を検知す
る基板挿入孔認識カメラ１６と、リード線認識カメラ１
５や基板挿入孔認識カメラ１６の検知による補正データ
を受けて電子部品１のリード線を可変矯正および可変案
内する可変ガイド部１７および可変駆動部２１を付加し
たことにある。図中の１８は可変ガイド部１７を可変さ
せる移動ねじ、１９は可変ガイド部１７を支えるサポー
ト軸、２０は可変ガイド部１７側の継手、２２は可変駆
動部２１の継手である。なお、図１で図示していない
が、可変ガイド部１７はバックラッシュ除去用ばねを備
えている。As shown in FIG. 1, the feature of the present embodiment is that the bending of the non-sandwiched lead wire of the electronic component 1 sandwiched by the transfer lead chuck portion 5 in the above-mentioned conventional structure is detected. Lead wire recognition camera 15 and substrate 1
Board insertion hole recognition camera 16 for detecting the position error, pitch error, and dimensional accuracy of the insertion hole 2 and the lead wire recognition camera 1
5 and the variable guide unit 17 and the variable drive unit 21 for receiving the correction data detected by the board insertion hole recognition camera 16 and variably correcting and guiding the lead wire of the electronic component 1. In the figure, 18 is a moving screw for changing the variable guide portion 17, 19 is a support shaft for supporting the variable guide portion 17, 20 is a joint on the variable guide portion 17 side, and 22 is a joint for the variable drive portion 21. Although not shown in FIG. 1, the variable guide portion 17 includes a backlash removing spring.
【００１１】上記各構成要素よりなる電子部品挿入装置
について、各構成要素の関係と動作を説明する。前述従
来の動作と同じ動作については説明を省略する。With respect to the electronic component inserting apparatus including the above-mentioned components, the relationship and operation of each component will be described. The description of the same operation as the above-mentioned conventional operation is omitted.
【００１２】図２に示すように、従来例と同様にして、
電子部品１のリード線とテープはカッター部４で切断さ
れた後に、移載リードチャック部５により部品リード線
認識カメラ１５の位置まで旋回され、その位置でリード
線の曲がりを認識および検出する。リード線に曲がりが
あるときは、リード線の曲がりおよび偏心を検出した補
正データが可変駆動部２１に指令された後、その補正量
だけ可変駆動部２１の継手２２を前進，回転させ可変ガ
イド部１７側の継手２０を介し、所定の補正量だけ可変
ガイド部１７を移動させる。認識後、移載リードチャッ
ク部５は挿入ヘッド６側に旋回され、そこで待機してい
る挿入ヘッド６に取り付けられたボディチェック部８に
より電子部品１は挟持されている。リード線の曲がりま
たは偏心補正量だけＸ−Ｙテーブル１３も所定の位置か
ら補正移動する。また、挿入孔に対してもこれまでの動
作と平行して、Ｘ−Ｙテーブル１３上の基板１２の挿入
孔は基板挿入孔認識カメラ１６により、その挿入孔の寸
法精度，ピッチ誤差，位置精度が読み取られ、その補正
すべきデータが本体の指令部を通じて、可変駆動部２１
に伝達される。As shown in FIG. 2, similarly to the conventional example,
After the lead wire and the tape of the electronic component 1 are cut by the cutter unit 4, the transfer lead chuck unit 5 turns them to the position of the component lead wire recognition camera 15, and the bend of the lead wire is recognized and detected at that position. When there is a bend in the lead wire, correction data for detecting bend and eccentricity of the lead wire is instructed to the variable drive unit 21, and then the joint 22 of the variable drive unit 21 is moved forward and rotated by the correction amount and the variable guide unit is moved. The variable guide portion 17 is moved by a predetermined correction amount via the joint 20 on the 17 side. After the recognition, the transfer lead chuck part 5 is swung to the insertion head 6 side, and the electronic component 1 is held by the body check part 8 attached to the insertion head 6 standing by there. The XY table 13 is also corrected and moved from the predetermined position by the amount of bending or eccentricity correction of the lead wire. Further, in parallel with the operation so far for the insertion hole, the insertion hole of the substrate 12 on the XY table 13 is detected by the board insertion hole recognition camera 16 by the dimensional accuracy, pitch error, and positional accuracy of the insertion hole. Is read, and the data to be corrected is sent to the variable drive unit 21 through the command unit of the main body.
Be transmitted to.
【００１３】図３（ａ）または図４（ａ）に示すよう
に、電子部品１のリード線が所定の位置から△Ｘ1だけ
傾いたリード線１ｂ、または、△Ｘ2だけ偏心したリー
ド線１ｃのときは、これらのリード線１ｂまたは１ｃの
傾きまたは偏心誤差を補正することにより、その補正量
を受けて可変駆動部２１の継手２２が矢印ａまたは矢印
ｂの方向に移動して、図３（ｂ）または図４（ｂ）に示
すように、可変ガイド部１７は、リード線１ｂまたは１
ｃを△Ｘ1または△Ｘ2だけ矯正・案内されて基板１２の
挿入孔に合致される。As shown in FIG. 3 (a) or FIG. 4 (a), the lead wire of the electronic component 1 is a lead wire 1b inclined by ΔX 1 from a predetermined position, or a lead wire eccentric by ΔX 2. In the case of 1c, by correcting the inclination or eccentricity error of these lead wires 1b or 1c, the joint 22 of the variable drive unit 21 moves in the direction of arrow a or arrow b in response to the correction amount, As shown in FIG. 3 (b) or FIG. 4 (b), the variable guide portion 17 includes the lead wire 1b or 1
The c is corrected and guided by ΔX 1 or ΔX 2, and is fitted into the insertion hole of the substrate 12.
【００１４】図５（ａ）に示すように、可変ガイド部１
７を左右に備え、２列のリード線を有する電子部品の例
では、正しいセンターからのピッチＰ１に対して、基板
１２の挿入孔がピッチＰ１と異なるピッチＰ２，Ｐ３に
なっているときは、挿入孔のピッチ誤差を補正するた
め、その補正量を可変駆動部２１の継手２２が矢印Ｂ，
Ｃの方向に移動して、可変ガイド部１７はリード線ピッ
チを左右独立にＰ２−Ｐ１とＰ３−Ｐ１だけ矯正され、
図５（ｂ）に示すように、基板１２の挿入孔のピッチＰ
２，Ｐ３に合致される。As shown in FIG. 5A, the variable guide unit 1
In an example of an electronic component having seven rows on the left and right and having two rows of lead wires, when the insertion holes of the substrate 12 are pitches P2 and P3 different from the pitch P1 with respect to the pitch P1 from the correct center, In order to correct the pitch error of the insertion hole, the correction amount is set by the joint 22 of the variable drive unit 21 by the arrow B,
By moving in the direction C, the variable guide portion 17 corrects the lead wire pitches independently by P2-P1 and P3-P1.
As shown in FIG. 5B, the pitch P of the insertion holes of the substrate 12
2, P3 is matched.
【００１５】以上のように本実施例によれば、電子部品
１のリード線１ａのずれまたは基板１２の挿入孔のずれ
に応じ、可変ガイド部１７は補正移動し、リード線を矯
正することにより、挿入位置決め上に補正移動してきた
Ｘ−Ｙテーブル１３上の基板１２の所定の挿入孔に信頼
性良く、かつ高密度で電子部品１を挿入し、前述従来例
と同様にアンビル部１４により、リード線１ａのカット
およびクリンチが行われ所定の挿着が完了する。As described above, according to this embodiment, the variable guide portion 17 is corrected and moved to correct the lead wire according to the deviation of the lead wire 1a of the electronic component 1 or the deviation of the insertion hole of the substrate 12. , The electronic component 1 is inserted into the predetermined insertion hole of the substrate 12 on the XY table 13 which has been corrected and moved on the insertion positioning with high reliability and high density, and by the anvil portion 14 as in the conventional example described above. The lead wire 1a is cut and clinched, and the predetermined insertion is completed.
【００１６】[0016]
【発明の効果】以上の実施例の説明からも明らかなよう
に本発明は、電子部品のリード線認識カメラと、基板挿
入孔認識カメラと、それらの検知による補正データを受
けてリード線を可変矯正および可変案内する可変ガイド
部および可変駆動部を備えた構成により、電子部品の挿
入不良を防止し、安定して高密度に挿着できる優れた電
子部品挿入装置を実現できるものである。As is apparent from the above description of the embodiments, the present invention makes it possible to change the lead wire by receiving a lead wire recognizing camera for electronic parts, a board insertion hole recognizing camera, and correction data obtained by detecting them. With the configuration including the variable guide unit for correcting and variably guiding and the variable drive unit, it is possible to realize an excellent electronic component insertion device that prevents defective insertion of electronic components and allows stable and high-density insertion.
【図１】（ａ）本発明の一実施例の電子部品挿入装置の
概略斜視図 （ｂ）同電子部品挿入装置の可変ガイド部の概略斜視図FIG. 1A is a schematic perspective view of an electronic component insertion device according to an embodiment of the present invention. FIG. 1B is a schematic perspective view of a variable guide portion of the electronic component insertion device.
【図２】同電子部品挿入装置による動作工程のフローチ
ャートFIG. 2 is a flowchart of an operation process performed by the electronic component insertion device.
【図３】同電子部品挿入装置で電子部品のリード線の曲
がり不良を可変矯正，案内する状態を示した要部正面図FIG. 3 is a front view of essential parts showing a state in which the electronic component inserting device variably corrects and guides a bending defect of a lead wire of an electronic component.
【図４】同電子部品挿入装置で部品のリード線の偏心不
良を可変矯正，案内する状態を示した要部正面図FIG. 4 is a main part front view showing a state of variably correcting and guiding an eccentricity defect of a lead wire of a component by the electronic component insertion device.
【図５】同電子部品挿入装置で基板の挿入孔の寸法精度
不良のときリード線を可変矯正，案内する状態を示した
要部正面図FIG. 5 is a front view of an essential part showing a state in which the lead wire is variably corrected and guided when dimensional accuracy of an insertion hole of a board is poor in the electronic component insertion device.
【図６】従来の電子部品挿入装置の概略斜視図FIG. 6 is a schematic perspective view of a conventional electronic component insertion device.
【図７】同電子部品挿入装置の移載リードチャック部の
側面略図FIG. 7 is a schematic side view of a transfer lead chuck section of the electronic component inserting apparatus.
【図８】同電子部品挿入装置の挿入ヘッドの概略斜視図FIG. 8 is a schematic perspective view of an insertion head of the electronic component insertion device.
【図９】同電子部品挿入装置による部品のリード線が挿
入される状態を工程順に示した要部背面断面図FIG. 9 is a rear sectional view of an essential part showing a state in which a lead wire of a component is inserted by the electronic component inserting device in the order of steps.
【図１０】図９に続く工程の正面略図10 is a schematic front view of the process following FIG.
【図１１】従来の電子部品挿入装置による動作工程のフ
ローチャートFIG. 11 is a flowchart of an operation process performed by a conventional electronic component insertion device.
【図１２】同電子部品挿入装置で電子部品のリード線不
良のときの挿入できない状態を示した説明図FIG. 12 is an explanatory view showing a state in which the electronic component insertion device cannot insert the electronic component when the lead wire of the electronic component is defective.
【図１３】同電子部品挿入装置で基板の挿入孔の寸法精
度不良のときのリード線を挿入できない状態を示した説
明図FIG. 13 is an explanatory view showing a state in which lead wires cannot be inserted when the electronic component insertion device has poor dimensional accuracy of an insertion hole of a substrate.
４ カッター部 ５ 移載リードチャック部 ６ 挿入ヘッド ８ ボディチャック部 ９ ガイド部 １１ 開閉用ブロック １３ Ｘ−Ｙテーブル部 １４ アンビル部 １５ リード線認識カメラ １６ 基板挿入孔認識カメラ １７ 可変ガイド部 ２１ 可変駆動部 4 Cutter part 5 Transfer lead chuck part 6 Insertion head 8 Body chuck part 9 Guide part 11 Opening / closing block 13 XY table part 14 Anvil part 15 Lead wire recognition camera 16 Board insertion hole recognition camera 17 Variable guide part 21 Variable drive Department
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山上 秋男 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akio Yamagami 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (1)
た電子部品をフィードするパーツ送り部と、前記電子部
品のリード線とテープを切断するカッター部と、前記カ
ッター部による切断時に前記電子部品を保持し、かつ挿
入軸側に受け渡しの役目をする移載リードチャック部
と、挿入ヘッドと、前記電子部品のボディを挟持するボ
ディチャック部と、前記電子部品のリード線を案内する
ガイド部と、前記ガイド部の開閉を行う開閉用ブロック
と、前記電子部品が挿入される基板を位置決めするＸ−
Ｙテーブル部と、前記基板に挿入された前記電子部品の
リード線を切断し折り曲げるアンビル部とを備え、前記
移載リードチャック部により挟持された前記電子部品の
リード線の曲がりを検知するリード線認識カメラと、前
記基板の挿入孔の位置誤差，ピッチ誤差，寸法精度を検
知する基板挿入孔認識カメラと、前記リード線認識カメ
ラや前記基板挿入孔認識カメラの検知による補正データ
を受けて前記電子部品のリード線を可変矯正および可変
案内する可変ガイド部および可変駆動部を設けた電子部
品挿入装置。1. A parts feeding unit for feeding a taped electronic component housed in a parts cassette, a cutter unit for cutting a lead wire and a tape of the electronic component, and a holding unit for holding the electronic component when cut by the cutter unit, Also, a transfer lead chuck portion that serves as a transfer to the insertion shaft side, an insertion head, a body chuck portion that holds the body of the electronic component, a guide portion that guides the lead wire of the electronic component, and the guide portion. Opening / closing block for opening and closing, and X- for positioning the board into which the electronic component is inserted
A lead wire that includes a Y table portion and an anvil portion that cuts and bends the lead wire of the electronic component inserted in the substrate, and detects bending of the lead wire of the electronic component that is sandwiched by the transfer lead chuck portion. A recognition camera, a board insertion hole recognition camera that detects a position error, a pitch error, and a dimensional accuracy of the insertion hole of the board, and the electronic device that receives correction data detected by the lead wire recognition camera and the board insertion hole recognition camera. An electronic component insertion device provided with a variable guide unit and a variable drive unit that variably corrects and guides a component lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4187772A JPH0637492A (en) | 1992-07-15 | 1992-07-15 | Electronic parts inserter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4187772A JPH0637492A (en) | 1992-07-15 | 1992-07-15 | Electronic parts inserter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0637492A true JPH0637492A (en) | 1994-02-10 |
Family
ID=16211948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4187772A Pending JPH0637492A (en) | 1992-07-15 | 1992-07-15 | Electronic parts inserter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0637492A (en) |
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|---|---|---|---|---|
| WO2014038087A1 (en) * | 2012-09-10 | 2014-03-13 | 富士機械製造株式会社 | Lead correction method and lead correction device |
| WO2015019456A1 (en) * | 2013-08-07 | 2015-02-12 | 富士機械製造株式会社 | Lead position detecting apparatus and component inserting machine |
| WO2015177854A1 (en) * | 2014-05-20 | 2015-11-26 | 富士機械製造株式会社 | Lead component mounting apparatus and lead component mounting method |
| JP2017098348A (en) * | 2015-11-20 | 2017-06-01 | 富士機械製造株式会社 | Lead component mounting machine and lead component mounting method |
| WO2019230940A1 (en) * | 2018-05-31 | 2019-12-05 | 川崎重工業株式会社 | Electronic component holding device |
| US10746535B2 (en) | 2016-04-28 | 2020-08-18 | Kawasaki Jukogyo Kabushiki Kaisha | Inspecting device and method for component with two wires |
| CN112512756A (en) * | 2018-09-28 | 2021-03-16 | 川崎重工业株式会社 | Teaching position setting method and teaching position setting device |
-
1992
- 1992-07-15 JP JP4187772A patent/JPH0637492A/en active Pending
Cited By (12)
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|---|---|---|---|---|
| WO2014038087A1 (en) * | 2012-09-10 | 2014-03-13 | 富士機械製造株式会社 | Lead correction method and lead correction device |
| CN104604357A (en) * | 2012-09-10 | 2015-05-06 | 富士机械制造株式会社 | Lead correction method and lead correction device |
| JPWO2014038087A1 (en) * | 2012-09-10 | 2016-08-08 | 富士機械製造株式会社 | Lead correction method and lead correction device |
| CN104604357B (en) * | 2012-09-10 | 2017-10-13 | 富士机械制造株式会社 | Pin antidote and pin apparatus for correcting |
| WO2015019456A1 (en) * | 2013-08-07 | 2015-02-12 | 富士機械製造株式会社 | Lead position detecting apparatus and component inserting machine |
| JPWO2015019456A1 (en) * | 2013-08-07 | 2017-03-02 | 富士機械製造株式会社 | Lead position detection device and component insertion machine |
| WO2015177854A1 (en) * | 2014-05-20 | 2015-11-26 | 富士機械製造株式会社 | Lead component mounting apparatus and lead component mounting method |
| JPWO2015177854A1 (en) * | 2014-05-20 | 2017-04-20 | 富士機械製造株式会社 | Lead component mounting machine and lead component mounting method |
| JP2017098348A (en) * | 2015-11-20 | 2017-06-01 | 富士機械製造株式会社 | Lead component mounting machine and lead component mounting method |
| US10746535B2 (en) | 2016-04-28 | 2020-08-18 | Kawasaki Jukogyo Kabushiki Kaisha | Inspecting device and method for component with two wires |
| WO2019230940A1 (en) * | 2018-05-31 | 2019-12-05 | 川崎重工業株式会社 | Electronic component holding device |
| CN112512756A (en) * | 2018-09-28 | 2021-03-16 | 川崎重工业株式会社 | Teaching position setting method and teaching position setting device |
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