JPH0635633B2 - Copper alloy for electric and electronic parts and method for producing the same - Google Patents
Copper alloy for electric and electronic parts and method for producing the sameInfo
- Publication number
- JPH0635633B2 JPH0635633B2 JP61259337A JP25933786A JPH0635633B2 JP H0635633 B2 JPH0635633 B2 JP H0635633B2 JP 61259337 A JP61259337 A JP 61259337A JP 25933786 A JP25933786 A JP 25933786A JP H0635633 B2 JPH0635633 B2 JP H0635633B2
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- copper
- electric
- electronic parts
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
Landscapes
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、電気および電子部品用銅合金及びその製造方
法に関する。さらに詳しくは、端子、コネクター、ブス
バー等の電気部品用の銅合金材料およびトランジスタ
ー、リードフレーム、ＩＣリードフレーム、抵抗器リー
ド等の電子部品用の銅合金及びその製造方法に関するも
のである。TECHNICAL FIELD The present invention relates to a copper alloy for electric and electronic parts and a method for producing the same. More specifically, the present invention relates to a copper alloy material for electric parts such as terminals, connectors and bus bars, a copper alloy for electronic parts such as transistors, lead frames, IC lead frames and resistor leads, and a method for producing the same.
［従来の技術］ 電気および電子部品は、それらの部品を使用する装置が
小型、軽量化されるのに伴ない小型、軽量化されること
が要望されている。[Prior Art] Electric and electronic components are required to be smaller and lighter as devices using those components are smaller and lighter.
電気および電子部品用中の銅合金材料の小型軽量化は銅
合金材料を薄板化、細線化することにより対応されてい
る。The reduction in size and weight of copper alloy materials used in electric and electronic parts is achieved by thinning and thinning the copper alloy materials.
このように銅合金材料を薄板化、細線化すると、銅合金
材料には今まで以上に導電性に優れ、耐熱性がありかつ
機械的強度に優れた性質が望まれる。When the copper alloy material is thinned and thinned in this way, it is desired that the copper alloy material has more excellent conductivity, heat resistance, and mechanical strength.
これに対応した、銅合金材料にはＣｕ−０．１ｗｔ％Ｆ
ｅ−０．０３ｗｔ％ＰからなるＫＦＣあるいはＣｕ−
０．１２ｗｔ％Ｓｎ−０．０１ｗｔ％Ｐからなる錫入り
銅が知られている。Corresponding to this, Cu-0.1wt% F is used for the copper alloy material.
e-0.03 wt% P KFC or Cu-
Tin-containing copper composed of 0.12 wt% Sn-0.01 wt% P is known.
これらの銅合金はリン脱酸銅と同等な価格であり、リン
脱酸銅と同一の製造プロセスで製造でき、機械的性質は
リン脱酸銅より高く、耐熱性にも優れている。These copper alloys have the same price as phosphorous deoxidized copper, can be manufactured by the same manufacturing process as phosphorous deoxidized copper, have higher mechanical properties than phosphorous deoxidized copper, and have excellent heat resistance.
特に、ＫＦＣは焼鈍材の引張強度が３０ｋｇｆ／ｍm2、
耐力が１５ｋｇｆ／ｍm2、伸びが３８％、導電率が９２
％ＩＡＣＳで、これらの物性値が伸びを除いて錫入り銅
を４５０℃で２時間焼鈍した時の引張強度：２５ｋｇｆ
／ｍm2、耐力：６４ｋｇｆ／ｍm2、伸び：４８．５％、
導電率：９０％ＩＡＣＳより優れている。In particular, KFC has a tensile strength of 30 kgf / mm 2 of annealed material,
Proof strength 15kgf / mm 2 , elongation 38%, conductivity 92
% IACS, these physical properties have a tensile strength when tin-containing copper is annealed at 450 ° C. for 2 hours excluding elongation: 25 kgf
/ Mm 2 , yield strength: 64 kgf / mm 2 , elongation: 48.5%,
Conductivity: 90% better than IACS.
［発明が解決しようとする問題点］ 電気および電子部品は小型、軽量化のほかに電流容量を
向上させることが要求され始めている。[Problems to be Solved by the Invention] In addition to miniaturization and weight reduction of electric and electronic components, improvement of current capacity is beginning to be demanded.
電流容量を向上させると、銅合金材料の薄板化及び細線
化により、銅合金材料は今迄以上に発熱しやすくなる。
例えばパワートランジスタリードフレーム材料および端
子及びコネクタ用の材料がこれに当る。When the current capacity is improved, the copper alloy material is more likely to generate heat than ever due to the thinning and thinning of the copper alloy material.
For example, power transistor leadframe materials and materials for terminals and connectors.
このような部品に用いる銅合金は耐熱性が今迄以上に必
要となってくる。Copper alloys used for such parts are required to have higher heat resistance than ever.
従来からあるＫＦＣは２５０〜５５０℃の間の所定の温
度で５分間加熱し、ビッカース硬さを測定した時の硬さ
の変化で軟化特性を求めると約４００℃で硬さが低下し
始め上記のような部品に用いるには耐熱性が良くないと
いう問題点がある。A conventional KFC is heated at a predetermined temperature between 250 and 550 ° C. for 5 minutes, and when the softening property is obtained by the change in hardness when Vickers hardness is measured, the hardness starts to decrease at about 400 ° C. There is a problem that the heat resistance is not good for use in such parts.
本発明はＫＦＣと同等以上の機械的性質を有し、しかも
同等の導電率を備え、ＫＦＣよりも耐熱性が優れた銅合
金をリン脱酸銅と同一の工程で製造し供給することに特
徴がある。The present invention is characterized by producing and supplying a copper alloy having mechanical properties equal to or higher than KFC, having the same electrical conductivity, and higher heat resistance than KFC in the same process as phosphorous deoxidized copper. There is.
［問題点を解決するための手段］ 本願発明の第１の要旨は、重量％で、Ｆｅ：０．０５〜
０．１５％、Ｐ：０．０４〜０．０８％（但しＰ：０．
０４％は含まず）、Ｍｇ：０．０２〜０．１２％を含
み、残部がＣｕ及び不可避的不純物からなる銅合金中に
少なくともＦｅ２ＰとＭｇ３Ｐ２とを導電率が８５％Ｉ
ＡＣＳ以上となるように均一かつ微細に析出させたこと
を特徴とする電気および電子部品用銅合金に存在する。[Means for Solving Problems] The first gist of the present invention is, in weight%, Fe: 0.05 to
0.15%, P: 0.04-0.08% (however, P: 0.
04% is not included), Mg: 0.02 to 0.12% is contained, and the balance is at least Fe 2 P and Mg 3 P 2 in a copper alloy containing Cu and inevitable impurities, and the conductivity is 85% I.
It exists in a copper alloy for electric and electronic parts, which is characterized by being uniformly and finely precipitated so as to have ACS or more.
本願発明の第２の要旨は、重量％で、Ｆｅ：０．０５〜
０．１５％、Ｐ：０．０４〜０．０８％（但しＰ：０．
０４％は含まず）、Ｍｇ：０．０２〜０．１２％を含
み、残部がＣｕ及び不可避的不純物からなる銅合金を溶
製し鋳塊にした後に該銅合金を熱間加工により所定の形
状にした後、６００℃以上の温度の状態から２００℃以
下まで５℃／ｓｅｃ以上の速度で冷却し、その後６５％
以上の圧下率で冷間加工を行ない、その後４００〜６０
０℃に昇温し、３０分以上の焼鈍を行うことにより該銅
合金中にＦｅ２ＰおよびＭｇ３Ｐ２を析出させることを
特徴とする電気および電子部品用銅合金の製造方法に存
在する。The second gist of the present invention is, by weight%, Fe: 0.05 to
0.15%, P: 0.04-0.08% (however, P: 0.
04% is not included), Mg: 0.02 to 0.12% is contained, and the balance is made of a copper alloy having Cu and inevitable impurities, which is melted to form an ingot, and then the copper alloy is hot-worked to a predetermined amount. After shaping, cool from a temperature of 600 ° C or higher to 200 ° C or lower at a rate of 5 ° C / sec or more, then 65%
Cold working is performed at the above reduction rate, and then 400 to 60
There is a method for producing a copper alloy for electric and electronic parts, characterized in that Fe 2 P and Mg 3 P 2 are precipitated in the copper alloy by heating to 0 ° C. and annealing for 30 minutes or more. .
以下、本発明に係る電気及び電子部品用銅合金の含有成
分及び成分割合について説明する。Hereinafter, the contained components and component ratios of the copper alloy for electric and electronic parts according to the present invention will be described.
Ｆｅ，Ｐ，ＭｇをＣｕに添加するのは、Ｃｕ中にＦｅ２
ＰとＭｇ３Ｐ２とを析出させるためで、このときＦｅ２
ＰとＭｇ３Ｐ２を析出するためにはＦｅ，Ｐ，ＭｇをＣ
ｕに共添させなければならない。Adding Fe, P and Mg to Cu is due to Fe 2
In order to precipitate P and Mg 3 P 2 , Fe 2 at this time
In order to precipitate P and Mg 3 P 2 , Fe, P and Mg are replaced with C
Must be co-applied with u.
Ｆｅ添加量が０．０５％未満ではＰが添加されても銅合
金の強度が望まれず、また０．１５％を超えると加工硬
化が激しくなり、リン脱酸銅と同一工程では製造できな
くなる等の問題点が生じる。If the Fe addition amount is less than 0.05%, the strength of the copper alloy is not desired even if P is added, and if it exceeds 0.15%, work hardening becomes severe, and it cannot be manufactured in the same step as phosphorous deoxidized copper. The problem of occurs.
Ｍｇにより銅合金の強度を上昇させるには、０．０２％
以上必要であるが、０．１２％を超えて添加すると造塊
時の湯流れ性の低下、導電率の低下及びめっき性に問題
が生じてくる。To increase the strength of copper alloy by Mg, 0.02%
The above is required, but if added in excess of 0.12%, problems will occur in the flowability of molten metal during ingot making, the decrease in conductivity, and the plating property.
ＰはＦｅ及びＭｇとそれぞれリン化合物（Ｆｅ２Ｐ，Ｍ
ｇ３Ｐ２）を形成して、強度及び耐熱性を向上する効果
がある。P is Fe and Mg and phosphorus compounds (Fe 2 P, M
g 3 P 2 ) is formed to improve strength and heat resistance.
Ｆｅを０．０５〜０．１５％添加されている銅合金中に
Ｆｅ２Ｐの化合物を析出するためには、Ｐは０．０２〜
０．０４％必要である。In order to precipitate a Fe 2 P compound in a copper alloy containing 0.05 to 0.15% Fe, P is 0.02 to
0.04% is required.
同時にＭｇを０．０２〜０．１２％添加されている銅合
金中にＭｇ３Ｐ２を形成するためにはＰは０．０２〜
０．１０％必要である。At the same time, P is 0.02 to form Mg 3 P 2 in the copper alloy in which 0.02 to 0.12% of Mg is added.
0.10% is required.
従ってＦｅ２Ｐ，Ｍｇ３Ｐ２を同一銅合金中に析出させ
るにはＰは総量で０．４０〜０．１４％必要となる。Therefore, in order to precipitate Fe 2 P and Mg 3 P 2 in the same copper alloy, P needs to be 0.40 to 0.14% in total.
しかし、Ｐを多量に添加し、母相に固溶して残留するよ
うになると、銅合金の銅電率の低下及び応力腐食割れを
生じやすくなり、かつ０．０８％を越えて添加すると鋳
造及び熱間圧延時に割れを生じやすくなる。However, if a large amount of P is added and remains as a solid solution in the matrix phase, the copper electrical conductivity of the copper alloy will decrease and stress corrosion cracking will easily occur, and if it is added in excess of 0.08%, it will be cast. Also, cracks are likely to occur during hot rolling.
ここでＭｇは母相中に固溶して残留させても銅合金の機
械的性質等の特性の低下はＰほど大きくない。Here, even if Mg forms a solid solution in the mother phase and remains, the deterioration of the mechanical properties and other characteristics of the copper alloy is not so great as P.
したがって、Ｐの添加量は０．０４％より多く０．０８
％以下とした。Therefore, the amount of P added is more than 0.04% and 0.08%.
% Or less.
上記のように規定された元素を含む銅合金中にＦｅ２Ｐ
およびＭｇ３Ｐ２を析出させるには、溶製された銅合金
を熱間加工した後、６００℃以上の温度から２００℃以
下まで５℃／ｓｅｃ以上の冷却速度で冷却した後、その
後６５％以上の圧下率の冷間加工を行い、４００〜６０
０℃で３０分以上の焼鈍を行うことにより可能となる。Fe 2 P in a copper alloy containing the elements defined above
In order to precipitate Mg 3 P 2 and Mg 3 P 2 , after hot working the molten copper alloy, it is cooled from 600 ° C. or higher to 200 ° C. or lower at a cooling rate of 5 ° C./sec or more, and then 65%. 400 to 60 by performing cold working with the above reduction rate
It becomes possible by annealing at 0 ° C. for 30 minutes or more.
熱間加工後、６００℃以上の温度から銅合金を冷却する
理由は、Ｆｅ，Ｐ及びＭｇを母相中に強制的に固溶させ
るためである。The reason why the copper alloy is cooled from a temperature of 600 ° C. or higher after hot working is to force Fe, P and Mg to form a solid solution in the parent phase.
冷却最終温度を２００℃以下としたのは、２００℃以下
の温度では、銅合金中にＦｅ２Ｐ又はＭｇ３Ｐ２を析出
物を生じないためである。The cooling final temperature was set to 200 ° C. or lower because at a temperature of 200 ° C. or lower, Fe 2 P or Mg 3 P 2 does not precipitate in the copper alloy.
このとき、冷却速度を５℃／ｓｅｃ以上としてのは、冷
却速度が５℃／ｓｅｃ未満だと、冷却中にＦｅ２Ｐ又は
Ｍｇ３Ｐ２が析出し、冷却中に生じたこの析出物は銅合
金の耐熱性等の機械的性質の強化に寄与しないためであ
る。At this time, the cooling rate is set to 5 ° C./sec or more. When the cooling rate is less than 5 ° C./sec, Fe 2 P or Mg 3 P 2 is precipitated during cooling, and this precipitate generated during cooling is This is because it does not contribute to strengthening mechanical properties such as heat resistance of the copper alloy.
最後に、４００〜６００℃で３０分以上の焼鈍を行なう
のは、焼鈍温度が４００℃未満だとＦｅ２Ｐ又はＭｇ３
Ｐ２の析出物が銅合金中に均一かつ微細には生じないた
めである。Finally, annealing at 400 to 600 ° C. for 30 minutes or more is because if the annealing temperature is lower than 400 ° C., Fe 2 P or Mg 3 is used.
This is because the P 2 precipitate does not occur uniformly and finely in the copper alloy.
また、６００℃を超えるとＦｅ，Ｐ，Ｍｇの固溶領域と
なるため、銅合金中にＦｅ２Ｐ又はＭｇ３Ｐ２の析出量
が少なく、強度向上に寄与しないためである。Further, when it exceeds 600 ° C., it becomes a solid solution region of Fe, P and Mg, so that the precipitation amount of Fe 2 P or Mg 3 P 2 in the copper alloy is small and it does not contribute to the strength improvement.
ここで、本発明の銅合金において、強度を向上させる目
的で適度の冷間加工を加えても析出物の効果は何ら失な
われない。Here, in the copper alloy of the present invention, the effect of the precipitates is not lost even if appropriate cold working is performed for the purpose of improving the strength.
また、半導体リードフレーム材料等の用途に対して行な
われている２５０〜４００℃の歪除去焼鈍を本発明の銅
合金に対して行っても析出物の効果は何ら失なわれな
い。The effect of the precipitates is not lost even if the copper alloy of the present invention is subjected to strain relief annealing at 250 to 400 ° C., which is used for applications such as semiconductor lead frame materials.
なお、本発明合金にＦｅの代りにＣｏを、０．１０％を
越えない範囲で添加しても機械的性質、導電率及び耐熱
性には何ら差し支えることはない。すなわち、ＣｏはＦ
ｅと置換されて（Ｆｅ1-x Ｃｏｘ）２Ｐを生じ、Ｆｅ２
Ｐと同様の効果をもたらす。It should be noted that even if Co instead of Fe is added to the alloy of the present invention in a range not exceeding 0.10%, mechanical properties, electrical conductivity and heat resistance are not hindered. That is, Co is F
substituted with e to give (Fe 1-x Co x ) 2 P, Fe 2
It has the same effect as P.
［実施例］ 第１表に示す組成の銅合金を下記のように溶製した。Example A copper alloy having the composition shown in Table 1 was melted as follows.
電解銅をクリプトル電気炉中で本炭被覆下で約１２０
０℃で溶解する。Approximately 120 electrolytic copper was coated in the Cryptor electric furnace under the main coal coating.
Melt at 0 ° C.
金型へ装入する銅の約２割を残しておき、約８割を炉
中へ装入し第１表の組成に応じた重量のＦｅチップを同
じ炉中へ装入する。Approximately 20% of the copper charged in the mold is left, about 80% is charged into the furnace, and Fe chips having a weight corresponding to the composition shown in Table 1 are charged into the same furnace.
Ｆｅチップの溶け落ちを確認した後、残部の銅を炉中
へ装入して溶湯温度を１１８０〜１１９０℃まで低下さ
せる。After confirming that the Fe chips have burned out, the balance of the copper is charged into the furnace to lower the molten metal temperature to 1180 to 1190 ° C.
Ｃｕ−１５％Ｐを所定量るつぼへ装入し、その後硼砂
で溶湯の表面を覆う。A predetermined amount of Cu-15% P is charged into the crucible, and then the surface of the molten metal is covered with borax.
次に、Ｃｕ−５０％Ｍｇを所定定量添加し、撹拌、沈静
後金型に鋳込む。Next, Cu-50% Mg is added in a predetermined amount, stirred and settled, and then cast into a mold.
ここで金型はサイブ６０ｍｍｔ×６０ｍｍｗ×１２０ｍ
ｍＬの物を用いた。Here, the mold is a sibe 60 mmt × 60 mmw × 120 m
The thing of mL was used.
圧延は、本発明の実施例及び比較例に示す組成の合金の
鋳塊をスカルピング後、８５０〜９００℃で熱間圧延し
て、厚さ１５ｍｍとして。圧下率は７５％である。The rolling was performed by hot rolling at 850 to 900 ° C. after scalping the ingots of the alloys having the compositions shown in the examples and comparative examples of the present invention to have a thickness of 15 mm. The rolling reduction is 75%.
熱処理は、第１表に示す各合金とも熱間圧延の終了温度
７００〜７２０℃から１００℃以下まで１分以内で約１
０℃／ｓｅｃの速度で水中冷却した。その後、冷間圧延
を行ない、厚さ０．４５〜０．９０ｍｍとした後、５０
０℃２時間の焼鈍を行った。The heat treatment was carried out for each alloy shown in Table 1 from the end temperature of hot rolling 700 to 720 ° C. to 100 ° C. or less within about 1 minute within about 1 minute.
It was cooled in water at a rate of 0 ° C / sec. After that, cold rolling is performed to a thickness of 0.45 to 0.90 mm, and then 50
Annealing was performed at 0 ° C. for 2 hours.
第１表に示す組成の銅合金の機械的性質及び導電率の測
定には厚さ０．４５ｍｍの銅合金を用い、添付図に示す
軟化特性を測定した銅合金は、実施例では０．６４ｍｍ
比較例では０．９ｍｍの厚さのものを用いた。A copper alloy having a thickness of 0.45 mm was used for measuring the mechanical properties and the electrical conductivity of the copper alloy having the composition shown in Table 1, and the copper alloy for which the softening characteristics shown in the attached drawings were measured was 0.64 mm in the examples.
In the comparative example, one having a thickness of 0.9 mm was used.
第１表から本発明の実施例にかかわる銅合金の機械的性
質及び導電率を従来例であるＫＦＣと比較すると、機械
的性質については引張強さ、耐力、硬さの３項目ともＫ
ＦＣより優れていることが分る。From Table 1, comparing the mechanical properties and the electrical conductivity of the copper alloy according to the example of the present invention with that of the conventional example KFC, the mechanical properties are K, tensile strength, proof stress and hardness.
It turns out that it is superior to FC.
伸びについては、ＫＦＣの３８．５％に対し最低の伸び
がＮｏ４の実施例において３２．０％であるがこの差は
機械的性質には何ら影響を与えない程度の値である。Regarding the elongation, the lowest elongation is 32.0% in the example of No. 4 with respect to 38.5% of KFC, but this difference is a value that does not affect mechanical properties at all.
一方、導電率は％ＩＡＣＳで評価したが、ＫＦＣの９
２．０％ＩＡＣＳに対し、実施例の銅合金は８７．１〜
９０．２％ＩＡＣＳでＫＦＣより低い値となっているが
この値は導電率としてはほぼ同等であると判断できる値
である。On the other hand, the conductivity was evaluated by% IACS.
With respect to 2.0% IACS, the copper alloys of the examples are 87.1-
Although it is lower than KFC at 90.2% IACS, this value is a value that can be judged to be almost equivalent in conductivity.
次に添付図に示す軟化特性は、銅合金を２５０〜５５０
℃の間の所定の温度に５分間加熱後ビッカース硬度を荷
重０．５ｋｇとして測定し、硬度変化により軟化特性を
求めたものである。Next, the softening property shown in the attached figure is 250 to 550 for the copper alloy.
After heating for 5 minutes at a predetermined temperature between 0 ° C., Vickers hardness was measured with a load of 0.5 kg, and the softening property was determined by the change in hardness.
実施例Ｎｏ３と従来例であるＫＦＣとを比較するとＫＦ
Ｃが約４００℃で軟化し始めるのに対し、実施例Ｎｏ３
は約４５０℃から軟化が始まり、全体として硬度の低下
がＫＦＣより約５０℃高い温度であることが分る。この
結果から実施例はＫＦＣより耐熱性に優れていると判断
できる。Comparing Example No. 3 with the conventional KFC, KF
C begins to soften at about 400 ° C., while Example No. 3
It can be seen that the softening starts at about 450 ° C., and the overall decrease in hardness is about 50 ° C. higher than KFC. From this result, it can be judged that the example has better heat resistance than KFC.
［発明の効果］ 本発明により、従来から行われている安価な製造方法で
あるリン脱酸銅と同一の工程で製造でき、ＫＦＣの導電
率を殆んど低下させることなく、ＫＦＣと同等以上の機
械的性質を持ち、特に耐熱性に優れる銅合金を提供する
ことができる。[Advantages of the Invention] According to the present invention, it can be manufactured in the same process as the phosphorous-deoxidized copper, which is an inexpensive manufacturing method that has been conventionally used, and the conductivity of KFC is almost equal to or higher than that of KFC. It is possible to provide a copper alloy having the above mechanical properties and particularly excellent heat resistance.
今日のように軽薄短小の技術動向の中で、しかも電流、
容流の向上に伴ない耐熱性をより必要とする電気・電子
部品材料として本発明がその特性を発揮し得ることは明
らかである。In today's light, thin, short, and small technological trends, as well as current,
It is clear that the present invention can exhibit its characteristics as an electric / electronic component material that requires more heat resistance as the flow rate improves.
【図面の簡単な説明】 第１図は銅合金の耐熱性を示すグラフである。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a graph showing the heat resistance of copper alloys.
Claims (2)
Ｐ：０．０４〜０．０８％（但しＰ：０．０４％は含ま
ず）、Ｍｇ：０．０２〜０．１２％を含み、残部がＣｕ
及び不可避的不純物からなる銅合金中に少なくともＦｅ
２ＰとＭｇ３Ｐ２とを導電率が８５％ＩＡＣＳ以上とな
るように均一かつ微細に析出させたことを特徴とする電
気および電子部品用銅合金。1. By weight%, Fe: 0.05 to 0.15%,
P: 0.04 to 0.08% (however, P: 0.04% is not included), Mg: 0.02 to 0.12% is included, and the balance is Cu.
And at least Fe in the copper alloy consisting of unavoidable impurities
A copper alloy for electrical and electronic parts, characterized in that 2 P and Mg 3 P 2 are uniformly and finely deposited so that the electrical conductivity is 85% IACS or more.
Ｐ：０．０４〜０．０８％（但しＰ：０．０４％は含ま
ず）、Ｍｇ：０．０２〜０．１２％を含み、残部がＣｕ
及び不可避的不純物からなる銅合金を溶製し鋳塊にした
後に該銅合金を熱間加工により所定の形状にした後、６
００℃以上の温度の状態から２００℃以下まで５℃／ｓ
ｅｃ以上の速度で冷却し、その後６５％以上の圧下率で
冷間加工を行ない、その後４００〜６００℃に昇温し、
３０分以上の焼鈍を行うことにより該銅合金中にＦｅ２
ＰおよびＭｇ３Ｐ２を析出させることを特徴とする電気
および電子部品用銅合金の製造方法。2. Fe: 0.05 to 0.15% by weight,
P: 0.04 to 0.08% (however, P: 0.04% is not included), Mg: 0.02 to 0.12% is included, and the balance is Cu.
And a copper alloy consisting of unavoidable impurities is melted to form an ingot, and then the copper alloy is formed into a predetermined shape by hot working.
5 ° C / s from temperature of 00 ° C or higher to 200 ° C or lower
cooling at a rate of ec or more, then cold working at a reduction rate of 65% or more, and then raising the temperature to 400 to 600 ° C.,
Fe 2 is added to the copper alloy by annealing for 30 minutes or more.
A method for producing a copper alloy for electric and electronic parts, which comprises depositing P and Mg 3 P 2 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61259337A JPH0635633B2 (en) | 1986-10-29 | 1986-10-29 | Copper alloy for electric and electronic parts and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61259337A JPH0635633B2 (en) | 1986-10-29 | 1986-10-29 | Copper alloy for electric and electronic parts and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63111151A JPS63111151A (en) | 1988-05-16 |
| JPH0635633B2 true JPH0635633B2 (en) | 1994-05-11 |
Family
ID=17332701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61259337A Expired - Lifetime JPH0635633B2 (en) | 1986-10-29 | 1986-10-29 | Copper alloy for electric and electronic parts and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635633B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2525232B2 (en) * | 1988-11-28 | 1996-08-14 | 株式会社住友金属セラミックス | Ceramic package and method of manufacturing the same |
| KR940010455B1 (en) * | 1992-09-24 | 1994-10-22 | 김영길 | Copper alloy and making method thereof |
| JP3550233B2 (en) * | 1995-10-09 | 2004-08-04 | 同和鉱業株式会社 | Manufacturing method of high strength and high conductivity copper base alloy |
| JP4330517B2 (en) * | 2004-11-02 | 2009-09-16 | 株式会社神戸製鋼所 | Cu alloy thin film, Cu alloy sputtering target, and flat panel display |
| JP5075447B2 (en) * | 2006-03-30 | 2012-11-21 | Ｄｏｗａメタルテック株式会社 | Cu-Fe-P-Mg based copper alloy, manufacturing method, and current-carrying component |
| JP6140032B2 (en) * | 2013-08-30 | 2017-05-31 | Ｄｏｗａメタルテック株式会社 | Copper alloy sheet, method for producing the same, and current-carrying component |
| JP6031576B2 (en) * | 2015-03-23 | 2016-11-24 | 株式会社神戸製鋼所 | Copper alloy plate for heat dissipation parts |
| WO2016152648A1 (en) * | 2015-03-23 | 2016-09-29 | 株式会社神戸製鋼所 | Copper alloy sheet for heat dissipating component and heat dissipating component |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59232244A (en) * | 1983-06-16 | 1984-12-27 | Mitsui Mining & Smelting Co Ltd | Softening resistant copper alloy having high conductivity |
| JPS6075541A (en) * | 1983-09-30 | 1985-04-27 | Tatsuta Electric Wire & Cable Co Ltd | Copper alloy having superior heat resistance, mechanical characteristic and electric conductivity |
| JPS6092439A (en) * | 1983-10-25 | 1985-05-24 | Nippon Mining Co Ltd | Heat-resistant copper alloy with high strength and electric conductivity |
| JPS6152333A (en) * | 1984-08-21 | 1986-03-15 | Toshiba Corp | Bonding wire |
-
1986
- 1986-10-29 JP JP61259337A patent/JPH0635633B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63111151A (en) | 1988-05-16 |
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