JPH06334284A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH06334284A JPH06334284A JP11847893A JP11847893A JPH06334284A JP H06334284 A JPH06334284 A JP H06334284A JP 11847893 A JP11847893 A JP 11847893A JP 11847893 A JP11847893 A JP 11847893A JP H06334284 A JPH06334284 A JP H06334284A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- resin
- printed wiring
- main surface
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は印刷配線板に係り、特に
両主面側に互いに異なる性質の樹脂を含浸・被着した基
材層、この基材層面に配設された配線パターンとを具備
することを基本構成として成る印刷配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly, to a base layer in which resins having different properties are impregnated / deposited on both main surface sides, and a wiring pattern arranged on the base layer surface. The present invention relates to a printed wiring board having a basic configuration.
【０００２】[0002]
【従来の技術】異種の合成樹脂を絶縁体としてそれぞれ
用い、印刷配線板の機能を高める手段として、リジット
フレキシブル配線基板が知られている。たとえば、可繞
性樹脂を絶縁支持体とするフレキシブル配線部と、非可
繞性樹脂を絶縁支持体とするリジット配線部とを一体的
に構成し、前記フレキシブル配線部の可繞性を利用し
て、印刷配線板の折り曲げ、配線回路の立体化、もしく
は配置領域のコンパクト化ないし狭小化などを図ってい
る。2. Description of the Related Art A rigid flexible wiring board is known as a means for enhancing the function of a printed wiring board by using different kinds of synthetic resins as insulators. For example, a flexible wiring part using a flexible resin as an insulating support and a rigid wiring part using a non-flexible resin as an insulating support are integrally configured to utilize the flexibility of the flexible wiring part. As a result, the printed wiring board is bent, the wiring circuit is made three-dimensional, or the layout area is made compact or narrow.
【０００３】つまり、この種のリジットフレキシブル配
線基板は、一般的なガラスエポキシ系多層配線板の表・
裏面、あるいは内層にたとえばポリイミド樹脂を絶縁基
材（絶縁体）とするフレキシブル配線板層を、接着シー
トなどを介して張り合わせ・一体化した構成を成してい
る。そして、前記ガラスエポキシ系多層配線板（リジッ
ト配線部）と、フレキシブル配線板層（フレキシブル配
線部）との複合型配線板においては、リジット配線部に
半導体素子などの電子部品を搭載（実装）し、フレキシ
ブル配線部を他の電気部品や他回路の立体的な配線に使
い分けるなど、各絶縁材料の特長をうまく利用してい
る。That is, this kind of rigid flexible wiring board is a surface of a general glass epoxy multilayer wiring board.
A flexible wiring board layer made of, for example, a polyimide resin as an insulating base material (insulator) is attached to and integrated with a back surface or an inner layer via an adhesive sheet or the like. Then, in the composite wiring board of the glass epoxy multilayer wiring board (rigid wiring portion) and the flexible wiring board layer (flexible wiring portion), electronic components such as semiconductor elements are mounted (mounted) on the rigid wiring portion. , The flexible wiring part is properly used for three-dimensional wiring of other electric parts and other circuits, and the characteristics of each insulating material are used effectively.
【０００４】一方、配線密度を高めるため、多層型の印
刷配線板が広く実用に供されている。そして、この種の
多層型の印刷配線板は、一般的にいわゆるリジット配線
板であり、たとえばガラスエポキシ系配線板を、接着シ
ートなどを介して張り合わせ・一体化した構成を成して
いる。On the other hand, in order to increase the wiring density, a multilayer printed wiring board has been widely put into practical use. A multilayer printed wiring board of this type is generally a so-called rigid wiring board, and has a structure in which, for example, a glass epoxy wiring board is laminated and integrated with an adhesive sheet or the like.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来知
られているリジットフレキ配線基板、およびリジット配
線板においては、製造工程上および製品としての信頼性
などに不都合な問題が認められる。たとえばリジットフ
レキ配線基板の場合は、ガラスエポキシ系基板と、ポリ
イミドフィルムという異質な材料を組み合わせ・一体化
する手段には多くの困難な問題がある。すなわち、ガラ
スエポキシ系基材とポリイミドフィルムを張り合わせ・
一体化するに当たっては、接着シートないし接着剤を必
要とし、一般的に熱軟化点の低い熱可塑性ポリイミド
や、ガラスエポキシ系のプリプレグを接着シートとし、
張り合わせ・一体化している。However, in the conventionally known rigid flexible wiring board and rigid wiring board, inconvenient problems are recognized in the manufacturing process and the reliability as a product. For example, in the case of a rigid flexible wiring board, there are many difficult problems in the means of combining and integrating a glass epoxy board and a different material such as a polyimide film. That is, a glass epoxy base material and a polyimide film are laminated together.
In integrating, an adhesive sheet or an adhesive is required, and generally, a thermoplastic polyimide having a low thermal softening point or a glass epoxy prepreg is used as an adhesive sheet,
It is glued and integrated.
【０００６】そして、前記構成においては、絶縁体とし
て使用する樹脂が３種類にも及び、たとえばドリルでの
穴明け条件およびデスミア処理の条件などを、３種の樹
脂全てにつき共通するよい条件の見出し・設定が極めて
困難であった。また、３種の樹脂の接合ないし接触界面
は、他の領域、たとえばガラスエポキシの層間などに比
べて、熱衝撃試験，プレッシャクッカー試験などの過酷
な環境試験で界面剥離を起こし易く、絶縁性能の低下を
招来するなどの不具合がある。つまり、従来のリジット
フレキ配線基板においては、その製造条件の選択・設定
などが煩雑で、量産性および歩留まりなどの点に問題が
あるばかりでなく、製品においても層間の剥離や絶縁性
能の低下などが認められ、信頼性の点に問題があり、十
分満足し得る状況にあるとはいい難い。In the above structure, the resin used as the insulator extends to three types, and for example, the finding of good conditions common to all three types of resins, such as drilling conditions and desmearing conditions.・ Setting was extremely difficult. In addition, the bonding or contact interface of the three kinds of resin is more likely to cause interface peeling in a harsh environmental test such as a thermal shock test or a pressure cooker test, compared to other regions, for example, a layer of glass epoxy, so that the insulation performance is improved. There is a problem such as a decrease. In other words, in the conventional rigid flexible wiring board, selection and setting of its manufacturing conditions are complicated, and not only there are problems in mass productivity and yield, but also in products, delamination between layers and deterioration of insulation performance, etc. Is recognized, there is a problem in reliability, and it is hard to say that we are in a satisfactory situation.
【０００７】一方、多層型のリジット配線板の場合は、
素配線板の張り合わせ・一体化においてほとんど問題な
いが、たとえば耐熱衝撃性など使用する樹脂によって左
右される。すなわち、構成材料としての樹脂が比較的硬
質の場合は、熱や機械的な応力に伴う歪みなどに起因し
て破損を起こし易いという問題があり、また構成材料と
しての樹脂が比較的軟質の場合は、機械的な強度の点か
ら、たとえば筐体の一部を兼用する使用態様を採り得な
いという不都合がある。On the other hand, in the case of a multilayer rigid wiring board,
There is almost no problem in bonding and integrating the bare wiring boards, but it depends on the resin used, such as thermal shock resistance. That is, when the resin as the constituent material is relatively hard, there is a problem that it is likely to be damaged due to strain due to heat or mechanical stress, and when the resin as the constituent material is relatively soft. However, from the viewpoint of mechanical strength, there is an inconvenience that it is not possible to adopt a usage mode that also serves as a part of the housing.
【０００８】本発明は上記事情に対処してなされたもの
で、製造ないし形成が容易で、かつ熱衝撃試験やプレッ
シャクッカー試験など、過酷な環境試験でも絶縁性の低
下など生じることなく、信頼性の高い多機能性を有する
印刷配線板の提供を目的とする。The present invention has been made in consideration of the above circumstances, and is easy to manufacture or form, and does not cause deterioration of insulation property even in a harsh environmental test such as a thermal shock test or a pressure cooker test, and has a high reliability. An object of the present invention is to provide a printed wiring board having high multifunctionality.
【０００９】[0009]
【課題を解決するための手段】本発明に係る印刷配線板
は、織布もしくは不織布を基材とし、両主面側から互い
に異種の樹脂層が含浸・被着された複合シート層と、前
記複合シート層の少なくとも一主面に配設された配線パ
ターンとを具備する構成体を基本とし、さらに要すれ
ば、前記基本構成体の少なくとも一主面に、前記複合シ
ート層面の樹脂と同種の樹脂を絶縁体とした印刷配線板
層を積層・一体化して構成されていることを特徴とす
る。A printed wiring board according to the present invention comprises a woven or non-woven fabric as a base material, and a composite sheet layer in which different types of resin layers are impregnated and adhered from both main surface sides, Based on a structure comprising a wiring pattern disposed on at least one main surface of the composite sheet layer, and further, if necessary, at least one main surface of the basic structure, the same kind of resin of the composite sheet layer surface It is characterized by being formed by laminating and integrating printed wiring board layers using a resin as an insulator.
【００１０】本発明において、複合シート層の基材を成
す織布もしくは不織布としては、たとえばガラスクロ
ス，綿布，合成樹脂繊維布，ガラスや合成樹脂のマット
類，紙類など、樹脂の浸み込が可能な微細な空間領域を
有するものならいずれも使用し得る。In the present invention, as the woven or non-woven fabric forming the base material of the composite sheet layer, for example, glass cloth, cotton cloth, synthetic resin fiber cloth, mats of glass or synthetic resin, paper, etc. can be impregnated with resin. Any one can be used as long as it has a fine spatial region.
【００１１】また、前記基材に含浸・被着して複合シー
ト層を形成する樹脂としては、熱可塑性樹脂および熱硬
化性樹脂のいずれであってもよいが、熱可塑性樹脂同士
もしくは熱硬化性樹脂同士に選択・設定するこど好まし
い。しかし、基材の表裏面側にそれぞれ含浸・被着する
樹脂は互いに異種機能性を有する関係、たとえば比較的
柔軟性を有する樹脂と、比較的硬質性の樹脂というよう
な関係に選択する必要がある。ただし、熱可塑性樹脂同
士を選択・組み合わせる場合は、熱軟化温度が近似した
ものが好ましく、たとえばポリカーボネート樹脂−ポリ
スルホン樹脂，ポリエーテルイミド樹脂−ポリフェニレ
ンサルファイド樹脂，ポリスルホン樹脂−ポリフェニレ
ンサルファイド樹脂，ポリフェニレンサルファイド樹脂
−ポリ 4フッ化エチレン 6フッ化プロピレン樹脂などの
系が挙げられる。また、熱硬化性樹脂を使用・組み合わ
せる場合は、少なくとも積層・一体化する段階までは熱
可塑化状態もしくはセミキュア状態を保持させる必要が
ある。The resin for forming the composite sheet layer by impregnating / adhering to the base material may be either a thermoplastic resin or a thermosetting resin, but the thermoplastic resins or thermosetting resins may be used. It is preferable to select and set each resin. However, the resins to be impregnated / adhered to the front and back surfaces of the base material must be selected in such a relationship that they have mutually different functions, for example, a resin that is relatively flexible and a resin that is relatively hard. is there. However, when thermoplastic resins are selected and combined, those having similar thermal softening temperatures are preferable, for example, polycarbonate resin-polysulfone resin, polyetherimide resin-polyphenylene sulfide resin, polysulfone resin-polyphenylene sulfide resin, polyphenylene sulfide resin- Examples include systems such as polytetrafluoroethylene hexafluoropropylene resin. Further, in the case of using / combining thermosetting resins, it is necessary to maintain the thermoplastic state or the semi-cured state at least until the step of stacking / integrating.
【００１２】さらに、複合シート層については、前記異
種樹脂の含浸・被着によって（樹脂の熱膨脹率差に起
因）、いわゆるカールして加工に支障を来す場合もある
ので、熱膨脹率の小さい樹脂の含浸・被着量を多めに、
熱膨脹率の大きい樹脂の含浸・被着量を少なめに選択す
ればよい。Further, the composite sheet layer may be so-called curled by impregnation / adhesion of the different resins (due to the difference in thermal expansion coefficient of the resins), which may interfere with the processing. With a large amount of impregnation / deposition
The impregnation / adhesion amount of the resin having a large coefficient of thermal expansion may be selected to be small.
【００１３】一方、本発明に係る印刷配線板において
は、異種樹脂の組み合わせに伴い反りなど発生し易い
が、複合シート層の基材に対して両主面側を、対称的な
構成にすることで回避できる。すなわち、複合シート層
（基材）を、たとえばポリフェニレンサルファイド樹脂
含浸・被着のガラスクロスで挟む形に、両側に対称的に
積層・配置することで、反りなどの発生を回避し得る。
さらに、この印刷配線板において、印刷配線板層は多層
型の配線構成を採っていてもよいし、複合シート層の表
面樹脂層上に配線パターンを印刷形成した構造、あるい
は配線パターン間をスルホール接続した構成なども適宜
採り得る。On the other hand, in the printed wiring board according to the present invention, a warp or the like is likely to occur due to the combination of different resins, but both main surface sides of the base material of the composite sheet layer should be symmetrical. You can avoid it with. That is, by arranging and arranging the composite sheet layer (base material) symmetrically on both sides in such a manner as to be sandwiched between glass cloths impregnated and adhered with polyphenylene sulfide resin, it is possible to avoid warpage and the like.
Furthermore, in this printed wiring board, the printed wiring board layer may have a multi-layered wiring structure, or a structure in which a wiring pattern is printed and formed on the surface resin layer of the composite sheet layer, or through-hole connection between the wiring patterns is performed. The configuration and the like can be appropriately adopted.
【００１４】[0014]
【作用】本発明に係る印刷配線板においては、織布もし
くは不織布を支持基材し、異種の樹脂、たとえば互いに
異なる熱可塑性樹脂を、それぞれ異なる面側から含浸・
被着させた複合絶縁シートを中間層として、この中間層
の少なくとも一主面に配線パターンを配設・具備させた
構成、もしくはこの構成体の少なくとも一主面側に、構
成体が含浸・被着するたとえば熱可塑性樹脂と同種の熱
可塑性樹脂を絶縁体とする印刷配線板層を積層・一体化
した構成を採っている。そして、このような構成では、
複合絶縁シート面に対して、それぞれ同種の樹脂から成
る印刷配線板層が対接・熱圧着される形態をとるため、
各面において樹脂同士が容易に自己融着して積層・一体
化していることになる。In the printed wiring board according to the present invention, a woven or non-woven fabric is used as a supporting substrate, and different kinds of resins, for example, different thermoplastic resins are impregnated from different surface sides.
A structure in which a wiring pattern is arranged and provided on at least one main surface of the intermediate layer using the deposited composite insulating sheet as an intermediate layer, or at least one main surface side of the structure is impregnated with the structure and covered. For example, a printed wiring board layer having a thermoplastic resin of the same kind as that of an insulating material is laminated and integrated. And in such a configuration,
Since the printed wiring board layers made of the same kind of resin are contacted and thermocompression-bonded to the surface of the composite insulating sheet,
This means that the resins are easily self-fused on each side and laminated and integrated.
【００１５】また、支持基材を成す織布もしくは不織布
に対しても、それぞれの主面側に含浸・被着させた樹脂
が、支持基材の微細な空間領域への侵入・吸い込まれな
どにより強固に被着する形態を採っているため、過酷な
環境試験でも剥離などに伴う絶縁性の低下も解消され
る。一方、前記両主面に積層・一体化された印刷配線板
層は、互いに異種の、換言すると性質の異なる樹脂を絶
縁体として形成されているため、それら樹脂の選択によ
って、たとえば耐曲げ性や耐衝撃性などを付与し得るの
で、使用形態などの幅を広げることが可能となる。Also, with respect to the woven fabric or the non-woven fabric forming the supporting base material, the resin impregnated / adhered to the main surface side of each of the supporting base material may be penetrated or sucked into a fine space area of the supporting base material. Since it is firmly adhered, the deterioration of insulation due to peeling or the like can be eliminated even in a severe environmental test. On the other hand, since the printed wiring board layers laminated / integrated on the both main surfaces are formed of different kinds of resins, that is, resins having different properties from each other as insulators, it is possible to select, for example, bending resistance or Since impact resistance and the like can be imparted, it is possible to widen the range of usage forms and the like.
【００１６】[0016]
【実施例】以下本発明に係る印刷配線板の製造手段を模
式的に示す図１〜図５を参照して本発明の実施例を説明
する。EXAMPLES Examples of the present invention will be described below with reference to FIGS. 1 to 5 which schematically show a printed wiring board manufacturing means according to the present invention.
【００１７】実施例１ 先ず、たとえば 250× 300mmの片に切断した平織りガラ
スクロス１（グラスファイバーWE05E 商品名，日東紡績
KK製）、前記ガラスクロス１と同サイズの厚さ30μm の
ポリフェニレンサルファイド樹脂フィルム２（トレリナ
3000 商品名，東レkk製）、およびガラスクロス１と同
サイズの厚さ25μm のポリエーテルイミド樹脂フィルム
３（スミライト-1400 商品名，住友ベークライトkk製）
を用意した。Example 1 First, for example, a plain weave glass cloth 1 (glass fiber WE05E, trade name, Nitto Boseki) cut into pieces of 250 × 300 mm
KK), a polyphenylene sulfide resin film 2 (Torelina) having the same size as the glass cloth 1 and a thickness of 30 μm.
3000 brand name, manufactured by Toray kk), and 25 μm thick polyetherimide resin film 3 of the same size as glass cloth 1 (Sumilite-1400 brand name, manufactured by Sumitomo Bakelite kk)
Prepared.
【００１８】次いで、図１に断面的に示すごとく、ガラ
スクロス１の一方の面側にポリフェニレンサルファイド
樹脂フィルム２、他方の面側にポリエーテルイミド樹脂
フィルム３を積層配置し、減圧下で、それぞれの樹脂が
軟化する温度まで加温してから加圧して、ガラスクロス
１中に、前記熱可塑性樹脂２，３を含浸させる一方、余
分の樹脂分で表面層を形成する。さらに具体的には、前
記積層体をポリイミド樹脂製の袋に収容し、その袋内を
減圧にしてオートクレーブ方式の熱プレスに挿入・装着
した。その後、前記袋内部を減圧し、 5 KPa以下に保っ
て 297℃まで加温し、次いで袋外部より窒素圧 400 KPa
の圧力を作用させて 1時間その状態を保持してから、前
記窒素圧を保持したまま冷却し、前記袋を解体して、図
２に要部構成を断面的に示すような、ガラスクロス１を
基材として両主面側から互いに異種の樹脂層２，３が含
浸・被着されて成る複合シート４を得た。Then, as shown in a sectional view in FIG. 1, a polyphenylene sulfide resin film 2 is laminated on one surface side of the glass cloth 1 and a polyetherimide resin film 3 is laminated on the other surface side thereof, respectively, under reduced pressure. The resin is heated to a temperature at which it softens and then pressurized to impregnate the glass cloth 1 with the thermoplastic resins 2 and 3, while forming a surface layer with an excess of resin. More specifically, the laminate was housed in a bag made of polyimide resin, the inside of the bag was depressurized, and the bag was inserted and mounted in an autoclave type heat press. After that, the inside of the bag was decompressed and kept at 5 KPa or less and heated to 297 ° C, and then the nitrogen pressure from the outside of the bag was 400 KPa.
After maintaining the state for 1 hour under the pressure of, the glass cloth 1 is cooled while keeping the nitrogen pressure, the bag is disassembled, and the glass cloth 1 shown in FIG. As a base material, a composite sheet 4 was obtained in which resin layers 2 and 3 of different kinds were impregnated and adhered from both main surface sides.
【００１９】次に、前記複合シート４の所定領域に、ド
リルなどによって穿設加工を施した後、ポリフェニレン
サルファイド樹脂層２面、およびポリエーテルイミド樹
脂層３面に、それぞれ導電ペーストの印刷・乾燥によ
り、前記穿設孔内に導電ペーストを充填する一方、所要
の配線パターン5aを形成した。その後、 150× 100mmの
寸法に切断して、図３に要部構成を断面的に示すような
印刷配線板６を得た。Next, a predetermined area of the composite sheet 4 is perforated by a drill or the like, and then a conductive paste is printed and dried on the polyphenylene sulfide resin layer 2 surface and the polyetherimide resin layer 3 surface, respectively. Thus, the wiring pattern 5a was formed while the conductive holes were filled with the conductive paste. Then, it was cut into a size of 150 × 100 mm to obtain a printed wiring board 6 having a cross-sectional view of the essential structure shown in FIG.
【００２０】上記構成の印刷配線板６を厚さ方向に切断
し、その切断面を顕微鏡で観察したところ、ガラスクロ
ス１を構成するガラス素繊維中に、樹脂２，３が全体的
に一様に、かつ緻密に充填・含浸しており両樹脂２，３
の界面に空隙部など存在せず、また強固に一体化してい
て、熱衝撃試験やプレッシャクッカー試験など、過酷な
環境試験でも絶縁性の低下など認められなかった。The printed wiring board 6 having the above structure was cut in the thickness direction, and the cut surface was observed with a microscope. As a result, the resins 2 and 3 were uniformly distributed in the glass fiber constituting the glass cloth 1. In addition, it is densely filled and impregnated with both resins 2, 3
There were no voids at the interface of and there was solid integration, and no deterioration of insulation was observed even in harsh environmental tests such as thermal shock tests and pressure cooker tests.
【００２１】実施例２ 実施例１の場合と同様のガラスクロス１に、たとえばポ
リフェニレンサルファイド樹脂を含浸・被着してなる絶
縁性シート７を用意し、この絶縁性シート７の所定位置
に穿設加工により孔明けする一方、導電ペーストを表裏
面に印刷・乾燥し、前記穿設孔内に導電ペーストを充填
するとともに、配線パターン5bをそれぞれ形成してか
ら、 150× 100mmに切断して両面型配線板８を作成し
た。Example 2 An insulating sheet 7 prepared by impregnating and adhering, for example, polyphenylene sulfide resin on a glass cloth 1 similar to that in Example 1 is prepared, and the insulating sheet 7 is perforated at a predetermined position. While forming holes by processing, print and dry the conductive paste on the front and back sides, fill the holes with the conductive paste, and form the wiring patterns 5b respectively, then cut into 150 x 100 mm and double-sided type. The wiring board 8 was created.
【００２２】また、所定の位置に孔明けしたポリエーテ
ルイミド樹脂フィルム３を用意し、このポリエーテルイ
ミド樹脂フィルム３の片面に、導電ペーストを印刷・乾
燥し、前記穿設孔内に導電ペーストを充填するととも
に、配線パターン5cを形成してから、 150× 150mmに切
断して片面型配線板９を作成した。Further, a polyetherimide resin film 3 perforated at a predetermined position is prepared, a conductive paste is printed and dried on one surface of the polyetherimide resin film 3, and the conductive paste is filled in the holes. After filling and forming the wiring pattern 5c, it was cut into 150 × 150 mm to prepare a single-sided wiring board 9.
【００２３】これら両面型配線板８，および片面型配線
板９を、実施例１の場合と同様に作成された印刷配線板
６を、図４に要部を断面的に示すごとく、印刷配線板６
のポリフェニレンサルファイド樹脂２面側に両面型配線
板８を対向させ、また印刷配線板６のポリエーテルイミ
ド樹脂３面側に片面型配線板９を対向させて積層し、こ
の構成で樹脂が流動せずに、それぞれの樹脂が自己融着
する加熱、加圧条件で一体化して、リジットフレキシブ
ル配線基板10を得た。この製造工程では、別々に張り合
わせることもでき、たとえばポリフェニレンサルファイ
ド樹脂系の両面型配線板８を張り合わせる場合は、比較
的高い温度で張り合わせ、次いでポリエーテルイミド樹
脂系の配線板を張り合わせる場合は比較的低温で張り合
わせることが望ましい。The double-sided wiring board 8 and the single-sided wiring board 9 are the printed wiring board 6 prepared in the same manner as in the first embodiment, and the printed wiring board is shown in FIG. 6
The double-sided wiring board 8 faces the second side of the polyphenylene sulfide resin, and the single-sided wiring board 9 faces the third side of the polyetherimide resin of the printed wiring board 6 so that the resin flows in this configuration. Instead, the respective resins were integrated under heating and pressurizing conditions such that the respective resins self-bond, and a rigid flexible wiring board 10 was obtained. In this manufacturing process, it is also possible to bond them separately. For example, when the polyphenylene sulfide resin-based double-sided wiring board 8 is bonded, it is bonded at a relatively high temperature, and then the polyetherimide resin-based wiring board is bonded. It is desirable to bond at a relatively low temperature.
【００２４】前記３種の配線板６，８，９の積層・一体
化について、さらに具体的に説明すると、印刷配線板６
のポリフェニレンサルファイド樹脂２側面と、両面型配
線板８とを、前記実施例１の場合と同様な方法を採用
し、 295℃、 400 KPaで圧着・張り合わせた。次いで、
得られた積層配線板のポリエーテルイミド樹脂３面と、
片面型配線板９とを対向させて、前記と同様な成形方法
で 270℃、 400 KPaで圧着・張り合わせて、図５に要部
を断面的に示すごとき構成のリジットフレキシブル配線
基板10を得た。The lamination / integration of the three types of wiring boards 6, 8 and 9 will be described more specifically. The printed wiring board 6 will be described.
The side surface of the polyphenylene sulfide resin 2 and the double-sided wiring board 8 were bonded and bonded at 295 ° C. and 400 KPa at 295 ° C. and 400 KPa by using the same method as in Example 1 above. Then
3 layers of polyetherimide resin of the obtained laminated wiring board,
The single-sided wiring board 9 was made to face and pressure-bonded and laminated at 270 ° C. and 400 KPa by the same molding method as described above to obtain a rigid flexible wiring board 10 having a structure as shown in cross section in FIG. .
【００２５】前記リジットフレキシブル配線基板10にお
いては、張り合わせ・一体化領域部の配線層が５層配線
構成のリジット部を形成しており、またポリエーテルイ
ミド樹脂を基材とする片面型配線板９単層の接続線を成
す領域が、フレキシブル部分として作用し得ることにな
り、この例においては、表面に露出している配線パター
ン5aを厚さ 6μm の銅の化学メッキ層，厚さ 1μm のニ
ッケルメッキ層，および厚さ約 0.2μm の金メッキ層で
被覆した。In the rigid flexible wiring board 10, the wiring layer in the bonded / integrated area portion forms a rigid portion having a five-layer wiring structure, and a single-sided wiring board 9 made of polyetherimide resin as a base material. The area forming the single-layer connection line can act as a flexible portion. In this example, the wiring pattern 5a exposed on the surface is formed by a chemical plating layer of copper with a thickness of 6 μm and a nickel layer with a thickness of 1 μm. It was covered with a plated layer and a gold plated layer with a thickness of about 0.2 μm.
【００２６】前記の説明でも分かるように、多層的に配
線パターン層を積層配置領域はリジット基板になるが、
単層の配線パターン形成領域ないし薄い配線パターン形
成領域、換言するとリジット部を成す積層配置領域以外
の配線部はフレキシブル配線部として機能する。そし
て、リジット基板を成す領域は、電子部品を十分に実装
・固定保持し得る硬さを有し、一方、フレキシブル配線
部は他の電気部品ないし回路との立体的な接続に機能し
得るので、絶縁体を形成する互いに異なる樹脂組成の特
長を活かすことが可能である。As can be seen from the above description, the wiring pattern layers are laminated in a multi-layer arrangement region, which is a rigid substrate.
The wiring portion other than the single-layer wiring pattern forming area or the thin wiring pattern forming area, in other words, the laminated arrangement area forming the rigid portion functions as a flexible wiring portion. And, the region forming the rigid board has a hardness sufficient to mount and fix and hold the electronic component, while the flexible wiring portion can function for three-dimensional connection with other electric components or circuits, It is possible to take advantage of the different resin compositions that form the insulator.
【００２７】上記で得たリジットフレキシブル配線基板
10につき、65℃−15分，25℃− 2分， 150℃−15分，25
℃− 2分を１サイクルとする熱衝撃試験を 500サイクル
行ったが、フクレ、デラミ現象はなく、電気接続も問題
なかった。また、 121℃， 196 KPaの水蒸気圧下のプレ
ッシャクッカー試験を 100時間行ったが、フクレ、デラ
ミ現象はなく、電気接続も問題なかった。Rigid flexible wiring board obtained above
65 ° C-15 minutes, 25 ° C-2 minutes, 150 ° C-15 minutes, 25
A thermal shock test was carried out for 500 cycles with a cycle of ℃ -2 minutes as one cycle, but there was no blistering or delamination phenomenon, and there was no problem in electrical connection. In addition, a pressure cooker test was performed under a steam pressure of 121 ° C and 196 KPa for 100 hours, but there was no blistering or delamination phenomenon, and there was no problem in electrical connection.
【００２８】なお、上記実施例では、組み合わせる異種
の樹脂として、ポリフェニレンサルファイド樹脂および
ポリエーテルイミド樹脂の共に熱可塑性樹脂の使用例を
示したが、この構成において物性的に比較的硬いものと
比較的柔らかなもの、伸び率や熱膨脹率に差のあるもの
などを組み合わせた場合は、片面側が熱的もしくは機械
的な歪みや応力など吸収し易いため、機械的な損傷防止
を図り得るばかりでなく、若干の歪みや応力がかかった
状態での使用も可能となる。そして、このようなこと
は、熱硬化性樹脂同士の組み合わせ、熱可塑性樹脂と熱
硬化性樹脂との組み合わせにおいても、物性面を考慮し
て選択することにより、それぞれの特長を活かした多機
能化を達成し得る。In the above examples, as the different kinds of resins to be combined, both the polyphenylene sulfide resin and the polyetherimide resin are used as thermoplastic resins. When a soft material, or a material with a difference in elongation or thermal expansion coefficient is combined, one side easily absorbs thermal or mechanical strain or stress, so not only can mechanical damage be prevented, It is also possible to use it with a slight strain or stress. And, in such a case, even in the combination of thermosetting resins, and also in the combination of thermoplastic resin and thermosetting resin, by selecting in consideration of physical properties, it is possible to make multi-functionalization by utilizing each feature. Can be achieved.
【００２９】[0029]
【発明の効果】本発明に係る印刷配線板においては、支
持基材に異種の樹脂を、それぞれ異なる面側から含浸・
被着させた複合絶縁シートを中間層として、この中間層
の少なくとも一主面に配線パターンを配設した構成、も
しくはこの構成体の主面側に含浸・被着されたたとえば
熱可塑性樹脂と同種の熱可塑性樹脂を絶縁体とする印刷
配線板層が積層・一体化した構成を採っている。そし
て、この構成の多層型の場合においては、複合絶縁シー
ト面にに対して、それぞれ同種の樹脂同士が容易に自己
融着して積層・一体化している。しかも、支持基材に対
してそれぞれの主面側に含浸・被着させた樹脂は、支持
基材の微細な空間領域への侵入・吸い込まれなどにより
強固に被着する形態を採っているため、過酷な環境試験
でも剥離などに伴う絶縁性の低下も解消される。また、
前記複合絶縁シートの樹脂層、もしくはこの複合絶縁シ
ート主面に積層・一体化された印刷配線板層は、互いに
性質の異なる樹脂系で形成されているため、それら樹脂
の選択によって、たとえば耐曲げ性や耐衝撃性などを付
与し得るので、使用形態などの幅を広げることが可能と
なる。In the printed wiring board according to the present invention, the support base material is impregnated with different kinds of resins from different surface sides.
A structure in which a wiring pattern is provided on at least one main surface of the intermediate layer using the adhered composite insulating sheet as an intermediate layer, or the same kind as, for example, a thermoplastic resin impregnated and adhered to the main surface side of this structure. The printed wiring board layers using the thermoplastic resin as an insulator are laminated and integrated. In the case of the multi-layer type having this structure, the same type of resin is easily self-fused and laminated and integrated on the surface of the composite insulating sheet. Moreover, since the resin impregnated / deposited on the main surface side of the supporting base material is firmly adhered to the supporting base material by invading / sucking into the minute space area of the supporting base material. Even in a harsh environmental test, the deterioration of insulation due to peeling is eliminated. Also,
The resin layer of the composite insulating sheet or the printed wiring board layer laminated / integrated on the main surface of the composite insulating sheet is formed of a resin system having different properties from each other. Since properties and impact resistance can be imparted, it is possible to broaden the range of usage forms and the like.
【図１】本発明に係る印刷配線板の製造工程例の要部を
模式的に示す断面図。FIG. 1 is a sectional view schematically showing a main part of a manufacturing process example of a printed wiring board according to the present invention.
【図２】本発明に係る印刷配線板の一部を成す複合シー
ト層の構造例を示す断面図。FIG. 2 is a cross-sectional view showing a structural example of a composite sheet layer forming a part of the printed wiring board according to the present invention.
【図３】本発明に係る印刷配線板の要部構造例を示す断
面図。FIG. 3 is a sectional view showing a structural example of a main part of a printed wiring board according to the present invention.
【図４】本発明に係る印刷配線板の他の製造工程例の要
部を模式的に示す断面図。FIG. 4 is a cross-sectional view schematically showing a main part of another example of the manufacturing process of the printed wiring board according to the present invention.
【図５】本発明に係る印刷配線板の他の要部構造例を示
す断面図。FIG. 5 is a cross-sectional view showing another structural example of the main part of the printed wiring board according to the present invention.
１…ガラスクロス（基材） ２…ポリフェニレンサル
ファイド樹脂（フィルム） ３…ポリエーテルイミド
樹脂（フィルム） ４…複合シート 5a，5b，5c，
5d…配線パターン ６…印刷配線板 ７…ポリフェ
ニレンサルファイド樹脂含浸・被着絶縁性シート ８
…両面型配線板層 ９…片面型配線板層 10…リジ
ットフレキシブル配線板1 ... Glass cloth (base material) 2 ... Polyphenylene sulfide resin (film) 3 ... Polyetherimide resin (film) 4 ... Composite sheet 5a, 5b, 5c,
5d ... Wiring pattern 6 ... Printed wiring board 7 ... Polyphenylene sulfide resin impregnated / adhered insulating sheet 8
... Double-sided wiring board layer 9 ... Single-sided wiring board layer 10 ... Rigid flexible wiring board
───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡部 富士男 神奈川県川崎市幸区小向東芝町１番地 株 式会社東芝小向工場内 (72)発明者 本村 知久 東京都府中市東芝町１番地 株式会社東芝 府中工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Fujio Watanabe No. 1 Komukai Toshiba-cho, Sachi-ku, Kawasaki-shi, Kanagawa Stock company, Toshiba Komukai Plant (72) Inventor Tomohisa Motomura No. 1 Toshiba-cho, Fuchu-shi, Tokyo Stock Company Toshiba Fuchu Factory
Claims (2)
側から互いに異種の樹脂層が含浸・被着された複合シー
ト層と、 前記複合シート層の少なくとも一主面に配設された配線
パターンとを具備して成ることを特徴とする印刷配線
板。1. A composite sheet layer comprising a woven fabric or a non-woven fabric as a base material, in which resin layers different from each other are impregnated and adhered from both main surface sides, and at least one main surface of the composite sheet layer is provided. A printed wiring board comprising a wiring pattern.
側から互いに異種の樹脂層が含浸・被着された複合シー
ト層と、 前記複合シート層の少なくとも一主面に積層・一体化さ
れた印刷配線板層とを具備して成り、 前記印刷配線板層は複合シート層面の樹脂と同種の樹脂
を絶縁体として構成されていることを特徴とする印刷配
線板。2. A composite sheet layer comprising a woven or non-woven fabric as a base material, which is impregnated and adhered with resin layers of different types from both main surface sides, and laminated and integrated on at least one main surface of the composite sheet layer. The printed wiring board layer is formed by using the same resin as the resin of the composite sheet layer surface as an insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11847893A JPH06334284A (en) | 1993-05-20 | 1993-05-20 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11847893A JPH06334284A (en) | 1993-05-20 | 1993-05-20 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06334284A true JPH06334284A (en) | 1994-12-02 |
Family
ID=14737670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11847893A Pending JPH06334284A (en) | 1993-05-20 | 1993-05-20 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06334284A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007128970A (en) * | 2005-11-01 | 2007-05-24 | Nippon Mektron Ltd | Manufacturing method of multilayer wiring board having cable section |
| JP2008263174A (en) * | 2007-03-19 | 2008-10-30 | Kyocera Corp | Wiring substrate |
| JP2010183102A (en) * | 2010-04-14 | 2010-08-19 | Nippon Mektron Ltd | Method of manufacturing multilayered wiring board having cable part |
| JPWO2012147484A1 (en) * | 2011-04-26 | 2014-07-28 | 株式会社村田製作所 | Rigid flexible substrate and manufacturing method thereof |
| WO2018088493A1 (en) * | 2016-11-09 | 2018-05-17 | 日立化成株式会社 | Printed wiring board and semiconductor package |
-
1993
- 1993-05-20 JP JP11847893A patent/JPH06334284A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007128970A (en) * | 2005-11-01 | 2007-05-24 | Nippon Mektron Ltd | Manufacturing method of multilayer wiring board having cable section |
| JP4527045B2 (en) * | 2005-11-01 | 2010-08-18 | 日本メクトロン株式会社 | Method for manufacturing multilayer wiring board having cable portion |
| JP2008263174A (en) * | 2007-03-19 | 2008-10-30 | Kyocera Corp | Wiring substrate |
| JP2010183102A (en) * | 2010-04-14 | 2010-08-19 | Nippon Mektron Ltd | Method of manufacturing multilayered wiring board having cable part |
| JPWO2012147484A1 (en) * | 2011-04-26 | 2014-07-28 | 株式会社村田製作所 | Rigid flexible substrate and manufacturing method thereof |
| WO2018088493A1 (en) * | 2016-11-09 | 2018-05-17 | 日立化成株式会社 | Printed wiring board and semiconductor package |
| KR20190082205A (en) * | 2016-11-09 | 2019-07-09 | 히타치가세이가부시끼가이샤 | Printed circuit board and semiconductor package |
| JPWO2018088493A1 (en) * | 2016-11-09 | 2019-10-03 | 日立化成株式会社 | Printed wiring board and semiconductor package |
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